Self-adaptive thermal management semiconductor multi-stage heat dissipation packaging control method and system

Abstract

The invention discloses a self-adaptive thermal management semiconductor multi-stage heat dissipation packaging control method and system, and belongs to the technical field of semiconductor heat dissipation, and the method specifically comprises the steps: monitoring the core temperature of a semiconductor device in real time through a temperature detection unit by using a thermistor, transmitting the core temperature to a control unit, comparing the core temperature with preset low-temperature, medium-temperature and high-temperature thresholds through the control unit, and outputting the core temperature of the semiconductor device; different levels of heat dissipation control signals are sent to the heat dissipation execution unit according to the result, and the heat dissipation execution unit starts the corresponding primary, intermediate, middle-high-level or high-level heat dissipation module and feeds back the operation state; during operation, the control unit continuously monitors the temperature, evaluates the heat dissipation effect and adjusts the heat dissipation level; when the semiconductor device stops or enters a low-power-consumption standby mode, the semiconductor device sends out a signal to enable the control unit to enable the heat dissipation execution unit to close the heat dissipation module. The method can adaptively regulate and control heat dissipation according to the working state of the semiconductor, guarantees the performance and stability of the device, improves the heat dissipation efficiency, and saves energy.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor heat dissipation, and in particular to a semiconductor multi-level heat dissipation packaging control method and system for adaptive thermal management. Background Art

[0002] With the continuous development of semiconductor technology, the power density of semiconductor devices continues to increase, and heat dissipation has become a key factor restricting their performance and reliability. Traditional heat dissipation packaging methods often use fixed heat dissipation structures and strategies, which are difficult to adapt to the changes in heat dissipation requirements of semiconductor devices under different working conditions. Under high-load conditions, semiconductor devices may overheat due to insufficient heat dissipation, affecting their performance and life; under low-load conditions, excessive heat dissipation may cause energy waste. Therefore, a control method that can adaptively adjust heat dissipation according to the real-time working status of semiconductor devices is needed.

[0003] For example, a Chinese patent with the authorization announcement number CN104600041B discloses a packaging structure and packaging method for a double-sided heat dissipation semiconductor, including: from bottom to top, a lead frame, a first binding material, a chip, a second binding material and a heat sink wrapped in a colloid, wherein the first binding material and the second binding material contain high-temperature resistant equal-diameter small balls. The packaging method for a double-sided heat dissipation semiconductor includes preparing a lead frame; using the first binding material to weld the chip on the chip seat; using the second binding material to weld the heat sink to the chip; directly sending the lead frame welded with the heat sink into an oven for baking; attaching a glue film on the back of the lead frame, and after molding, the bottom surface of the chip seat and the top surface of the heat sink are exposed to the colloid. The first binding material and the second binding material contain high-temperature resistant equal-diameter small balls, which accurately control the overall thickness of the lead frame, chip and heat sink before packaging.

[0004] The above existing technologies all have the following problems: the heat dissipation performance is limited; the packaging structure is complicated; and there is a lack of a dynamic temperature control mechanism. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention proposes a semiconductor multi-level heat dissipation packaging control method and system with adaptive thermal management. The temperature detection unit uses a thermistor to monitor the core temperature of the semiconductor device in real time and transmits it to the control unit. After the control unit compares the temperature with the preset low-temperature, medium-temperature and high-temperature thresholds, it sends different levels of heat dissipation control signals to the heat dissipation execution unit according to the results. The heat dissipation execution unit starts the corresponding primary, intermediate or advanced heat dissipation module and feeds back the operating status. During operation, the control unit continuously monitors the temperature to evaluate the heat dissipation effect and adjusts the heat dissipation level. When the semiconductor device stops or enters low-power standby mode, it sends a signal to the control unit to let the heat dissipation execution unit turn off the heat dissipation module. This method can adaptively control heat dissipation according to the working status of the semiconductor, ensure device performance and stability, improve heat dissipation efficiency and save energy.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A semiconductor multi-level heat dissipation packaging control method with adaptive thermal management, comprising:

[0008] Step S1: The temperature detection unit monitors the core temperature of the semiconductor device in real time through the thermistor, and transmits the real-time monitored core temperature data to the control unit;

[0009] Step S2: After receiving the core temperature data from the temperature detection unit, the control unit compares the data with a preset temperature threshold, wherein the preset temperature threshold includes a low temperature threshold, a medium temperature threshold and a high temperature threshold;

[0010] Step S3: According to the comparison result of step S2, if the core temperature is lower than the low temperature threshold, the control unit sends a first-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is between the medium temperature threshold and the low temperature threshold, the control unit sends a second-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is between the medium temperature threshold and the high temperature threshold, the control unit sends a third-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is higher than the high temperature threshold, the control unit sends a fourth-level heat dissipation control signal to the heat dissipation execution unit;

[0011] Step S4: the heat dissipation execution unit respectively starts the primary, intermediate, intermediate-advanced and advanced heat dissipation modules to dissipate heat for the semiconductor device according to the received heat dissipation control signal, and feeds back the operation status information of the heat dissipation modules to the control unit;

[0012] Step S5: while the heat dissipation module is running, the control unit monitors the real-time temperature data, and dynamically evaluates the heat dissipation effect according to the monitored real-time temperature data, and adjusts the heat dissipation strategy according to the evaluation result, wherein the heat dissipation strategy refers to the switching of the heat dissipation level;

[0013] Step S6: When the semiconductor device stops working or enters a low-power standby state, the semiconductor device itself sends a state switching signal to the control unit. After receiving the signal, the control unit sends a stop heat dissipation signal to the heat dissipation execution unit, and the heat dissipation execution unit turns off the heat dissipation module.

[0014] Specifically, the specific steps of step S2 include:

[0015] S2.1: The control unit opens the data receiving port or interrupt service routine and waits for the temperature detection unit to transmit the core temperature data , when the core temperature data arrives, the core temperature data is stored in a predefined cache area or variable;

[0016] S2.2: Read the low temperature threshold from the memory area or configuration file storing the preset threshold , Medium temperature threshold and high temperature threshold , the core temperature data Compare with preset threshold value and compare the temperature result data to identify the variable Store in the form of;

[0017] like , the core temperature of the semiconductor device is in the low temperature range, and ;

[0018] like , the core temperature of the semiconductor device is in the medium temperature range, and ;

[0019] like , the core temperature of the semiconductor device is in the medium-high temperature range, and ;

[0020] like , the core temperature of the semiconductor device is in the high temperature range, and .

[0021] Specifically, the specific steps of step S3 include:

[0022] S3.1: Obtain the temperature comparison result of step S2, according to The corresponding heat dissipation control signal is generated by the value. , then a first-level heat dissipation control signal is generated. , then generate the secondary cooling control signal, if , then generate a three-level heat dissipation control signal, if , a four-level heat dissipation control signal is generated;

[0023] S3.2: Adding a check bit to the generated heat dissipation control signal , generating a new heat dissipation control signal, where It represents a new heat dissipation control signal formed by performing zero padding with an r-1-bit polynomial on the generated heat dissipation control signal. represents the generator polynomial of the cyclic redundancy check, and r represents the number of bits of the generator polynomial;

[0024] S3.3: Sending the generated new heat dissipation control signal to the heat dissipation execution unit through the communication interface between the control unit and the heat dissipation execution unit.

[0025] Specifically, the specific steps of step S4 include:

[0026] S4.1: The heat dissipation execution unit receives a new heat dissipation control signal, and uses a signal feature recognition method to decode and perform multiple checks on the new heat dissipation control signal. The formula is: , if satisfied , it means that multiple checks have passed. According to the signal check result, combined with the real-time ambient temperature and semiconductor device workload data, the optimal heat dissipation strategy is generated. The optimal heat dissipation strategy includes the setting of the heat dissipation module startup combination and the preliminary operation parameters, wherein, Indicates multiple verification results, represents a heat dissipation control signal formed by performing zero padding of an r-1-bit polynomial on the new heat dissipation control signal;

[0027] S4.2: According to the generated cooling strategy, the cooling execution unit intelligently selects and starts the primary, intermediate, intermediate-advanced or advanced cooling module;

[0028] S4.3: During the heat dissipation process, the heat dissipation execution unit uses sensors to monitor the operating status of each level of heat dissipation modules and the temperature changes of semiconductor devices in real time. Once an abnormality or poor heat dissipation effect is found, the heat dissipation strategy is adjusted immediately, and the real-time heat dissipation effect and module operating status information are fed back to the control unit to form a closed-loop control.

[0029] Specifically, the specific steps of S4.2 include:

[0030] S4.21: If it is determined to be a normal heat dissipation instruction and corresponds to the primary heat dissipation demand, the primary heat dissipation module is started, and the status information of the primary heat dissipation module being started and the heat sink temperature distribution data during the initial operation are output;

[0031] S4.22: If the heat dissipation control signal indicates that there is an intermediate heat dissipation demand, the status information of the primary heat dissipation module being started and the temperature distribution data of the heat sink during initial operation are used as input, and the intelligent wind speed adjustment algorithm is used to comprehensively calculate the optimal fan speed curve based on the real-time temperature change rate of the semiconductor device, the ambient temperature and the current temperature distribution factors of the heat sink. Based on the calculation results, the intermediate heat dissipation module is started. At the same time, the operating status information of the intermediate heat dissipation module and the temperature data of the current overall heat dissipation system are output. If the fan operating status is found to be abnormal, an early warning message is immediately sent to the control unit and self-repair is performed. The fan speed curve formula is:

[0032] ;

[0033] in, represents the discrete fan speed curve, a and b represent the fan performance curve coefficients, represents the performance coefficient of semiconductor devices, represents the real-time temperature of the semiconductor device at time t, represents the ambient temperature at time t, Indicates the real-time temperature change rate of the semiconductor device at time t, represents the heat transfer coefficient of the heat sink, Indicates the current temperature of the heat sink at time t;

[0034] S4.23: If the signal analysis result is a medium or high-level heat dissipation demand, the operation status information of the medium-level heat dissipation module and the temperature data of the current overall heat dissipation system are used as input, the liquid cooling subsystem in the advanced heat dissipation module is partially activated, and the flow rate, pressure and heat exchange efficiency information of the liquid cooling subsystem are fed back to the control unit in real time, so as to obtain the operation status information of the overall heat dissipation system after the liquid cooling subsystem is activated;

[0035] S4.24: If the signal analysis result is a high-level heat dissipation requirement, the overall heat dissipation system operation status information after the liquid cooling subsystem is activated is used as input, all functions of the liquid cooling system are fully enabled, and the primary and intermediate heat dissipation modules are coordinated to operate at maximum power.

[0036] Specifically, the signal feature recognition method in S4.1 is to convert the received new heat dissipation control signal into sampling points according to the byte stream, and perform fast Fourier transform to obtain the spectrum information of the new heat dissipation control signal, and then analyze whether there is a specific frequency peak or frequency distribution pattern in the spectrum.

[0037] Specifically, the primary heat dissipation module is a small heat sink; the intermediate heat dissipation module is a fan heat dissipation device; the intermediate and advanced heat dissipation modules and the advanced heat dissipation module are liquid cooling systems; the heat dissipation execution unit is connected to the primary, intermediate and advanced heat dissipation modules through a power driving circuit.

[0038] A semiconductor multi-level heat dissipation packaging control system with adaptive thermal management, comprising: a temperature detection module, a control module, and a heat dissipation execution module;

[0039] The temperature detection module is used to monitor the core temperature of the semiconductor device in real time and transmit the temperature data to the control unit;

[0040] The control module is used to receive the temperature data transmitted by the temperature detection unit, and compare it with the preset temperature threshold, and send a corresponding heat dissipation control signal to the heat dissipation execution unit according to the comparison result, monitor the temperature data during the heat dissipation process to dynamically evaluate the heat dissipation effect and adjust the heat dissipation strategy, and at the same time, receive the state switching signal of the semiconductor device and send a stop heat dissipation signal to the heat dissipation execution unit;

[0041] The heat dissipation execution module is used to start the corresponding primary, intermediate, intermediate-advanced and advanced heat dissipation modules to dissipate heat for semiconductor devices according to the heat dissipation control signal sent by the control unit, and to feed back the operating status information of the heat dissipation module to the control unit, and at the same time receive the heat dissipation stop signal from the control unit and shut down the heat dissipation module.

[0042] Specifically, the control module includes: a data receiving unit, a threshold comparison unit, a strategy adjustment unit, and a signal sending unit;

[0043] The data receiving unit is used to receive the temperature data transmitted by the temperature detection unit;

[0044] The threshold comparison unit is used to compare the received temperature data with the preset low temperature threshold, medium temperature threshold and high temperature threshold to determine the temperature range, thereby determining the heat dissipation level to be adopted;

[0045] The strategy adjustment unit is used to evaluate the heat dissipation effect according to the real-time temperature data during the heat dissipation process, and determine whether the heat dissipation level needs to be switched according to the evaluation result;

[0046] The signal sending unit is used to send a heat dissipation control signal to the heat dissipation execution unit, and send a heat dissipation stop signal to the heat dissipation execution unit.

[0047] Specifically, the heat dissipation execution module includes: a signal receiving unit, a heat dissipation module driving unit, and a state feedback unit;

[0048] The signal receiving unit is used to receive the heat dissipation control signal and the heat dissipation stop signal sent by the control unit;

[0049] The heat dissipation module driving unit is used to drive the primary heat dissipation module, the intermediate heat dissipation module, the intermediate and advanced heat dissipation module and the advanced heat dissipation module to start, stop and adjust the power operation according to the received heat dissipation control signal;

[0050] The state feedback unit is used to feed back the operating state information of the heat dissipation module to the control unit.

[0051] Compared with the prior art, the present invention has the following beneficial effects:

[0052] 1. The present invention proposes a semiconductor multi-level heat dissipation packaging control method with adaptive thermal management. By real-time monitoring of the core temperature of semiconductor devices and dynamically adjusting the heat dissipation strategy according to a preset temperature threshold, precise control and efficient management of heat dissipation are achieved. Different heat dissipation levels can be flexibly switched according to the actual workload and temperature changes of the semiconductor devices, thereby maximizing the heat dissipation efficiency and reducing energy consumption while ensuring the stability of the device.

[0053] 2. The present invention proposes a semiconductor multi-level heat dissipation packaging control method with adaptive thermal management, which also has the ability of intelligent response and automatic adjustment. When the semiconductor device stops working or enters a low-power standby state, it can automatically shut down the heat dissipation module to avoid unnecessary energy waste; at the same time, during the operation of the heat dissipation module, the control unit can continuously monitor the real-time temperature data and dynamically adjust the heat dissipation strategy according to the heat dissipation effect, ensuring the stability and reliability of the heat dissipation system. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 This is a framework diagram of a semiconductor multi-level heat dissipation packaging control method for adaptive thermal management of the present invention;

[0055] Figure 2 This is a flowchart of the overall implementation of a semiconductor multi-level heat dissipation packaging control method for adaptive thermal management of the present invention;

[0056] Figure 3 This is an architecture diagram of a semiconductor multi-level heat dissipation packaging control system with adaptive thermal management according to the present invention. DETAILED DESCRIPTION

[0057] Example 1

[0058] See also Figure 1 and Figure 2 , an embodiment of the present invention provides: a semiconductor multi-level heat dissipation packaging control method with adaptive thermal management, comprising the following steps:

[0059] Step S1: The temperature detection unit monitors the core temperature of the semiconductor device in real time through the thermistor, and transmits the real-time monitored temperature data to the control unit;

[0060] Among them, the role of the thermistor is to utilize the characteristic that the resistance value of the thermistor changes with temperature to convert the temperature change into an electrical signal change, thereby realizing accurate perception and data collection of the core temperature of the semiconductor device for subsequent transmission to the control unit for processing.

[0061] Step S2: After receiving the core temperature data from the temperature detection unit, the control unit compares the data with a preset temperature threshold, wherein the preset temperature threshold includes a low temperature threshold, a medium temperature threshold and a high temperature threshold;

[0062] Step S3: According to the comparison result of step S2, if the core temperature is lower than the low temperature threshold, the control unit sends a first-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is between the medium temperature threshold and the low temperature threshold, the control unit sends a second-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is between the medium temperature threshold and the high temperature threshold, the control unit sends a third-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is higher than the high temperature threshold, the control unit sends a fourth-level heat dissipation control signal to the heat dissipation execution unit;

[0063] Step S4: the heat dissipation execution unit respectively starts the primary, intermediate, intermediate-advanced and advanced heat dissipation modules to dissipate heat for the semiconductor device according to the received heat dissipation control signal, and feeds back the operation status information of the heat dissipation modules to the control unit;

[0064] Step S5: while the heat dissipation module is running, the control unit monitors the real-time temperature data, and dynamically evaluates the heat dissipation effect according to the monitored real-time temperature data, and adjusts the heat dissipation strategy according to the evaluation result, wherein the heat dissipation strategy refers to the switching of the heat dissipation level;

[0065] Furthermore, the specific steps of step S5 include:

[0066] (1) The control unit reads the real-time temperature data of the semiconductor device at a time interval of 100 milliseconds through a communication connection with the temperature detection unit, and stores the data in an array or a buffer;

[0067] For example, assume that the array storing temperature data is The temperature value read each time is , then Deposit in sequence middle.

[0068] (2) Calculate the temperature change rate: The temperature change rate is obtained by performing differential calculation on the data in the embodiment, wherein the differential formula is the prior art content in the art and is not the inventive solution of the present application, and will not be described in detail here. At the same time, the temperature change rate reflects the control ability of the heat dissipation system on the temperature rise or fall of the semiconductor device. If the temperature change rate is close to zero or negative, it means that the heat dissipation effect is good; if the temperature change rate is large and positive, it means that the heat dissipation is insufficient;

[0069] (3) Calculate the average temperature deviation: Calculate All temperature values ​​are consistent with the ideal operating temperature of semiconductor devices The average value of the deviation of the average temperature deviation is smaller, indicating that the heat dissipation system can maintain the temperature of the semiconductor device near the ideal operating temperature, and the heat dissipation effect is better. The average calculation formula is the existing technical content in this field, which is not the inventive solution of this application and is not elaborated here;

[0070] (4) Formulate heat dissipation strategy adjustment rules based on the calculated temperature change rate and average temperature deviation. For example, if the temperature change rate is greater than a preset change rate threshold and the average temperature deviation is greater than a preset average temperature deviation threshold, it is considered that the heat dissipation effect is poor and the heat dissipation level needs to be increased; if the temperature change rate is less than zero and the average temperature deviation is less than the preset average temperature deviation threshold, consider lowering the heat dissipation level to save energy;

[0071] (5) When it is decided to adjust the heat dissipation level, the control unit generates a corresponding heat dissipation control signal, such as increasing the current level 2 heat dissipation control signal to a level 3 heat dissipation control signal or decreasing the current level 1 heat dissipation control signal to a level 1 heat dissipation control signal.

[0072] Step S6: When the semiconductor device stops working or enters a low-power standby state, the semiconductor device itself sends a state switching signal to the control unit. After receiving the signal, the control unit sends a stop heat dissipation signal to the heat dissipation execution unit, and the heat dissipation execution unit turns off the heat dissipation module.

[0073] It should be understood that when the heat dissipation execution unit turns off the heat dissipation module, in the current operation cycle of the semiconductor device, that is, from working to stopping or standby, the main control process directly related to heat dissipation has been completed, so it can be used as the end point of a relatively complete heat dissipation packaging control process. After the semiconductor device stops working or enters a low-power standby state, no heat is generated or very little heat is generated, and the heat dissipation system does not need to run continuously. At this time, turning off the heat dissipation module can save energy and avoid unnecessary equipment wear. Therefore, for the heat dissipation management control during the operation of semiconductor devices, turning off the heat dissipation module is a relatively complete end link, which covers the key processes from temperature monitoring and judgment to the implementation of heat dissipation strategies and finally stopping heat dissipation.

[0074] The specific steps of step S2 include:

[0075] S2.1: The control unit opens the data receiving port or interrupt service routine and waits for the temperature detection unit to transmit the core temperature data , when the core temperature data arrives, the core temperature data is stored in a predefined cache area or variable;

[0076] S2.2: Read the low temperature threshold from the memory area or configuration file storing the preset threshold , Medium temperature threshold and high temperature threshold , the core temperature data Compare with preset threshold value and compare the temperature result data to identify the variable Store in the form of;

[0077] like , the core temperature of the semiconductor device is in the low temperature range, and ;

[0078] like , the core temperature of the semiconductor device is in the medium temperature range, and ;

[0079] like , the core temperature of the semiconductor device is in the medium-high temperature range, and ;

[0080] like , the core temperature of the semiconductor device is in the high temperature range, and .

[0081] The specific steps of step S3 include:

[0082] S3.1: Obtain the temperature comparison result of step S2, according to The corresponding heat dissipation control signal is generated by the value. , then a first-level heat dissipation control signal is generated. , then generate the secondary cooling control signal, if , then generate a three-level heat dissipation control signal, if , a four-level heat dissipation control signal is generated;

[0083] S3.2: Adding a check bit to the generated heat dissipation control signal , generating a new heat dissipation control signal, where It represents a new heat dissipation control signal formed by performing zero padding with an r-1-bit polynomial on the generated heat dissipation control signal. represents the generator polynomial of the cyclic redundancy check, and r represents the number of bits of the generator polynomial;

[0084] S3.3: Sending the generated new heat dissipation control signal to the heat dissipation execution unit through the communication interface between the control unit and the heat dissipation execution unit.

[0085] The specific steps of step S4 include:

[0086] S4.1: The heat dissipation execution unit receives a new heat dissipation control signal, and uses a signal feature recognition method to decode and perform multiple checks on the new heat dissipation control signal. The formula is: , if satisfied , it means that multiple checks have passed. According to the signal check result, combined with the real-time ambient temperature and semiconductor device workload data, the optimal heat dissipation strategy is generated. The optimal heat dissipation strategy includes the setting of the heat dissipation module startup combination and the preliminary operation parameters, wherein, Indicates multiple verification results, represents a heat dissipation control signal formed by performing zero padding of an r-1-bit polynomial on the new heat dissipation control signal;

[0087] S4.2: According to the generated cooling strategy, the cooling execution unit intelligently selects and starts the primary, intermediate, intermediate-advanced or advanced cooling module;

[0088] S4.3: During the heat dissipation process, the heat dissipation execution unit uses sensors to monitor the operating status of each level of heat dissipation modules and the temperature changes of semiconductor devices in real time. Once an abnormality or poor heat dissipation effect is found, the heat dissipation strategy is adjusted immediately, and the real-time heat dissipation effect and module operating status information are fed back to the control unit to form a closed-loop control.

[0089] The specific steps of S4.2 include:

[0090] S4.21: If it is determined to be a normal heat dissipation instruction and corresponds to the primary heat dissipation demand, the primary heat dissipation module is started, and the status information of the primary heat dissipation module being started and the heat sink temperature distribution data during the initial operation are output;

[0091] S4.22: If the heat dissipation control signal indicates that there is an intermediate heat dissipation demand, the status information of the primary heat dissipation module being started and the temperature distribution data of the heat sink during initial operation are used as input, and the intelligent wind speed adjustment algorithm is used to comprehensively calculate the optimal fan speed curve based on the real-time temperature change rate of the semiconductor device, the ambient temperature and the current temperature distribution factors of the heat sink. Based on the calculation results, the intermediate heat dissipation module is started, and at the same time, the operation status information of the intermediate heat dissipation module is output. And the current temperature data of the overall cooling system If the fan is found to be in an abnormal operating state, an early warning message will be sent to the control unit immediately and self-repair will be performed. The fan speed curve formula is:

[0092] ;

[0093] in, represents the discrete fan speed curve, a and b represent the fan performance curve coefficients, represents the performance coefficient of semiconductor devices, represents the real-time temperature of the semiconductor device at time t, represents the ambient temperature at time t, Indicates the real-time temperature change rate of the semiconductor device at time t, represents the heat transfer coefficient of the heat sink, represents the current temperature of the heat sink at time t, Indicates the actual speed of the fan. Indicates the fan current. represents the expected heat dissipation power, Indicates the temperature of the semiconductor device, represents the temperature distribution of the heat sink, Indicates the ambient temperature;

[0094] Furthermore, the current range for normal operation of the fan is set to , the speed range is ,in, , They represent the minimum and maximum currents of the fan when it is operating normally. , They respectively represent the minimum and maximum speeds of the fan during normal operation;

[0095] like ,or , it is considered that the fan is operating abnormally;

[0096] like ,or , then the fan operation status is also considered abnormal;

[0097] When an abnormality is detected, an early warning message is sent to the control unit, wherein the early warning message is a data packet with an abnormality code, such as 1 for abnormal rotation speed and 2 for abnormal current, and is sent to the control unit through the communication interface.

[0098] Furthermore, when the fan speed is abnormal, such as too low, the fan drive voltage is adjusted. To restore the speed;

[0099] For example, it is assumed that the fan speed is related to the driving voltage ,like , the driving voltage can be increased ,in, represents the voltage-speed coefficient, Indicates the voltage after increasing the drive, Indicates the voltage adjustment increment.

[0100] S4.23: If the signal analysis result is a medium or high-level heat dissipation demand, the operation status information of the medium-level heat dissipation module and the temperature data of the current overall heat dissipation system are used as input, the liquid cooling subsystem in the advanced heat dissipation module is partially activated, and the flow rate, pressure and heat exchange efficiency information of the liquid cooling subsystem are fed back to the control unit in real time, so as to obtain the operation status information of the overall heat dissipation system after the liquid cooling subsystem is activated;

[0101] Furthermore, the specific steps of S4.23 include:

[0102] (1) Obtaining the operating status information of the intermediate cooling module And the current temperature data of the overall cooling system ;

[0103] (2) Calculate the coolant flow distribution ratio coefficient of the liquid cooling subsystem based on the operating status of the intermediate cooling module and the overall temperature data , and determine the initial pressure setting value of the liquid cooling subsystem based on the difference between the core temperature of the semiconductor device and the ambient temperature ,in, and represents the liquid cooling system coefficient, Represents the temperature difference, represents the heat sink temperature of the ith region, represents the mean value of the heat sink temperature distribution, and M represents the number of heat sink areas;

[0104] (3) Start the pump, valve and other components in the liquid cooling subsystem according to the calculated flow ratio coefficient and pressure setting value, and use the flow sensor, pressure sensor and temperature sensor installed in the liquid cooling subsystem to monitor the flow rate, pressure and inlet and outlet temperature difference of the coolant in real time;

[0105] (4) Calculate heat exchange efficiency based on coolant flow, pressure and temperature difference ,in, represents the specific heat capacity of the coolant, Indicates the coolant flow rate monitored in real time. Indicates the heat generation power of semiconductor devices;

[0106] (5) Packing the flow rate, pressure, heat exchange efficiency and sensor status information of the liquid cooling subsystem into a data frame according to a preset communication protocol format, and sending it to the control unit through the communication interface between the heat dissipation execution unit and the control unit;

[0107] (6) Integrate the operation information of the liquid cooling subsystem with the operation status information of the intermediate heat dissipation module and the overall temperature data to form the operation status information of the overall heat dissipation system after the liquid cooling subsystem is activated.

[0108] S4.24: If the signal analysis result is a high-level heat dissipation requirement, the overall heat dissipation system operation status information after the liquid cooling subsystem is activated is used as input, all functions of the liquid cooling system are fully enabled, and the primary and intermediate heat dissipation modules are coordinated to operate at maximum power.

[0109] The signal feature recognition method in S4.1 is to convert the received new heat dissipation control signal into sampling points according to the byte stream, and perform fast Fourier transform to obtain the spectrum information of the new heat dissipation control signal, and then analyze whether there is a specific frequency peak or frequency distribution pattern in the spectrum.

[0110] The primary heat dissipation module is a small heat sink; the intermediate heat dissipation module is a fan heat dissipation device; the intermediate and advanced heat dissipation modules and the advanced heat dissipation module are liquid cooling systems; the heat dissipation execution unit is connected to the primary, intermediate and advanced heat dissipation modules through a power driving circuit.

[0111] Example 2

[0112] See also Figure 3 Another embodiment provided by the present invention is a semiconductor multi-level heat dissipation packaging control system with adaptive thermal management, comprising:

[0113] Temperature detection module, control module, heat dissipation execution module;

[0114] The temperature detection module is used to monitor the core temperature of the semiconductor device in real time and transmit the temperature data to the control unit, providing key temperature information basis for the entire heat dissipation control process;

[0115] The control module is used to receive the temperature data transmitted by the temperature detection unit, compare it with the preset temperature threshold, send a corresponding heat dissipation control signal to the heat dissipation execution unit according to the comparison result, and continuously monitor the temperature data during the heat dissipation process to dynamically evaluate the heat dissipation effect and adjust the heat dissipation strategy. It is also responsible for receiving the state switching signal of the semiconductor device and sending a stop heat dissipation signal to the heat dissipation execution unit;

[0116] The heat dissipation execution module is used to start the corresponding primary, intermediate, intermediate-advanced and advanced heat dissipation modules to dissipate heat for semiconductor devices according to the heat dissipation control signal sent by the control unit, and to feed back the operating status information of the heat dissipation module to the control unit, and at the same time receive the heat dissipation stop signal from the control unit and shut down the heat dissipation module.

[0117] The control module includes: a data receiving unit, a threshold comparison unit, a strategy adjustment unit, and a signal sending unit;

[0118] A data receiving unit is used to receive the temperature data transmitted by the temperature detection unit to ensure accurate acquisition and transmission of data;

[0119] A threshold comparison unit, used to compare the received temperature data with the preset low temperature threshold, medium temperature threshold and high temperature threshold, to determine the temperature range, thereby determining the heat dissipation level to be adopted;

[0120] A strategy adjustment unit is used to evaluate the cooling effect according to the real-time temperature data during the cooling process, such as calculating indicators such as the temperature drop rate, and determine whether it is necessary to switch the cooling level according to the evaluation results, such as increasing or decreasing the operating power of the cooling module, and generate a corresponding adjustment signal;

[0121] The signal sending unit is used to send the heat dissipation control signal and the heat dissipation stop signal to the heat dissipation execution unit to achieve precise control of the heat dissipation execution unit.

[0122] The heat dissipation execution module includes: a signal receiving unit, a heat dissipation module driving unit, and a state feedback unit;

[0123] A signal receiving unit, used to receive a heat dissipation control signal and a heat dissipation stop signal sent by the control unit, so as to make a correct response action;

[0124] The heat dissipation module driving unit is used to drive the primary heat dissipation module, the intermediate heat dissipation module, the intermediate and advanced heat dissipation module and the advanced heat dissipation module to start, stop and adjust the power operation according to the received heat dissipation control signal, so as to ensure that the heat dissipation module operates as required;

[0125] The state feedback unit is used to feed back the operating status information of the heat dissipation module, such as whether the heat dissipation module is operating normally, the current operating power and other data to the control unit, so that the control unit can fully understand the operating status of the heat dissipation system and make more accurate control decisions.

[0126] It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0127] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0128] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in the field may also change, modify, replace and modify the above-mentioned embodiments without departing from the purpose and scope of protection of the present invention, and all of these are within the protection of the present invention.

Claims

1. A semiconductor multi-level heat dissipation packaging control method with adaptive thermal management, characterized in that: include: Step S1: The temperature detection unit monitors the core temperature of the semiconductor device in real time through the thermistor, and transmits the real-time monitored core temperature data to the control unit; Step S2: After receiving the core temperature data from the temperature detection unit, the control unit compares the data with a preset temperature threshold, wherein the preset temperature threshold includes a low temperature threshold, a medium temperature threshold and a high temperature threshold; Step S3: According to the comparison result of step S2, if the core temperature is lower than the low temperature threshold, the control unit sends a first-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is between the medium temperature threshold and the low temperature threshold, the control unit sends a second-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is between the medium temperature threshold and the high temperature threshold, the control unit sends a third-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is higher than the high temperature threshold, the control unit sends a fourth-level heat dissipation control signal to the heat dissipation execution unit; Step S4: the heat dissipation execution unit respectively starts the primary, intermediate, intermediate-advanced and advanced heat dissipation modules to dissipate heat for the semiconductor device according to the received heat dissipation control signal, and feeds back the operation status information of the heat dissipation modules to the control unit; Step S5: while the heat dissipation module is running, the control unit monitors the real-time temperature data, and dynamically evaluates the heat dissipation effect according to the monitored real-time temperature data, and adjusts the heat dissipation strategy according to the evaluation result, wherein the heat dissipation strategy refers to the switching of the heat dissipation level; Step S6: When the semiconductor device stops working or enters a low-power standby state, the semiconductor device itself sends a state switching signal to the control unit. After receiving the signal, the control unit sends a stop heat dissipation signal to the heat dissipation execution unit, and the heat dissipation execution unit turns off the heat dissipation module.

2. The semiconductor multi-level heat dissipation packaging control method of adaptive thermal management according to claim 1, characterized in that: The specific steps of step S2 include: S2.1: The control unit opens the data receiving port or interrupt service routine and waits for the temperature detection unit to transmit the core temperature data , when the core temperature data arrives, the core temperature data is stored in a predefined cache area or variable; S2.2: Read the low temperature threshold from the memory area or configuration file storing the preset threshold , Medium temperature threshold and high temperature threshold , the core temperature data Compare with preset threshold value and compare the temperature result data to identify the variable Store in the form of; like , the core temperature of the semiconductor device is in the low temperature range, and ; like , the core temperature of the semiconductor device is in the medium temperature range, and ; like , the core temperature of the semiconductor device is in the medium-high temperature range, and ; like , the core temperature of the semiconductor device is in the high temperature range, and .

3. The semiconductor multi-level heat dissipation packaging control method with adaptive thermal management as claimed in claim 2, characterized in that: The specific steps of step S3 include: S3.1: Obtain the temperature comparison result of step S2, according to The corresponding heat dissipation control signal is generated by the value. , then a first-level heat dissipation control signal is generated. , then generate the secondary cooling control signal, if , then generate a three-level heat dissipation control signal, if , a four-level heat dissipation control signal is generated; S3.2: Adding a check bit to the generated heat dissipation control signal , generating a new heat dissipation control signal, where It represents a new heat dissipation control signal formed by performing zero padding with an r-1-bit polynomial on the generated heat dissipation control signal. represents the generator polynomial of the cyclic redundancy check, and r represents the number of bits of the generator polynomial; S3.3: Sending the generated new heat dissipation control signal to the heat dissipation execution unit through the communication interface between the control unit and the heat dissipation execution unit.

4. The semiconductor multi-level heat dissipation packaging control method of adaptive thermal management as claimed in claim 3, characterized in that: The specific steps of step S4 include: S4.1: The heat dissipation execution unit receives a new heat dissipation control signal, and uses a signal feature recognition method to decode and perform multiple checks on the new heat dissipation control signal. The formula is: , if satisfied , it means that multiple checks have passed. According to the signal check result, combined with the real-time ambient temperature and semiconductor device workload data, the optimal heat dissipation strategy is generated. The optimal heat dissipation strategy includes the setting of the heat dissipation module startup combination and the preliminary operation parameters, wherein, Indicates multiple verification results, represents a heat dissipation control signal formed by performing zero padding of an r-1-bit polynomial on the new heat dissipation control signal; S4.2: According to the generated cooling strategy, the cooling execution unit intelligently selects and starts the primary, intermediate, intermediate-advanced or advanced cooling module; S4.3: During the heat dissipation process, the heat dissipation execution unit uses sensors to monitor the operating status of each level of heat dissipation modules and the temperature changes of semiconductor devices in real time. Once an abnormality or poor heat dissipation effect is found, the heat dissipation strategy is adjusted immediately, and the real-time heat dissipation effect and module operating status information are fed back to the control unit to form a closed-loop control.

5. The semiconductor multi-level heat dissipation packaging control method of adaptive thermal management as claimed in claim 4, characterized in that: The specific steps of S4.2 include: S4.21: If it is determined to be a normal heat dissipation instruction and corresponds to the primary heat dissipation demand, the primary heat dissipation module is started, and the status information of the primary heat dissipation module being started and the heat sink temperature distribution data during the initial operation are output; S4.22: If the heat dissipation control signal indicates that there is an intermediate heat dissipation demand, the status information of the primary heat dissipation module being started and the temperature distribution data of the heat sink during initial operation are used as input, and the intelligent wind speed adjustment algorithm is used to comprehensively calculate the optimal fan speed curve based on the real-time temperature change rate of the semiconductor device, the ambient temperature and the current temperature distribution factors of the heat sink. Based on the calculation results, the intermediate heat dissipation module is started. At the same time, the operating status information of the intermediate heat dissipation module and the temperature data of the current overall heat dissipation system are output. If the fan operating status is found to be abnormal, an early warning message is immediately sent to the control unit and self-repair is performed. The fan speed curve formula is: ； in, represents the discrete fan speed curve, a and b represent the fan performance curve coefficients, represents the performance coefficient of semiconductor devices, represents the real-time temperature of the semiconductor device at time t, represents the ambient temperature at time t, Indicates the real-time temperature change rate of the semiconductor device at time t, represents the heat transfer coefficient of the heat sink, Indicates the current temperature of the heat sink at time t; S4.23: If the signal analysis result is a medium or high-level heat dissipation demand, the operation status information of the medium-level heat dissipation module and the temperature data of the current overall heat dissipation system are used as input, the liquid cooling subsystem in the advanced heat dissipation module is partially activated, and the flow rate, pressure and heat exchange efficiency information of the liquid cooling subsystem are fed back to the control unit in real time, so as to obtain the operation status information of the overall heat dissipation system after the liquid cooling subsystem is activated; S4.24: If the signal analysis result is a high-level heat dissipation requirement, the overall heat dissipation system operation status information after the liquid cooling subsystem is activated is used as input, all functions of the liquid cooling system are fully enabled, and the primary and intermediate heat dissipation modules are coordinated to operate at maximum power.

6. The semiconductor multi-level heat dissipation packaging control method with adaptive thermal management as claimed in claim 5, characterized in that: The signal feature recognition method in S4.1 is to convert the received new heat dissipation control signal into sampling points according to the byte stream, and perform fast Fourier transform to obtain the spectrum information of the new heat dissipation control signal, and then analyze whether there is a specific frequency peak or frequency distribution pattern in the spectrum.

7. The semiconductor multi-level heat dissipation packaging control method with adaptive thermal management as claimed in claim 6, characterized in that: The primary heat dissipation module is a small heat sink; the intermediate heat dissipation module is a fan heat dissipation device; the intermediate and advanced heat dissipation modules and the advanced heat dissipation module are liquid cooling systems; the heat dissipation execution unit is connected to the primary, intermediate and advanced heat dissipation modules through a power driving circuit.

8. An adaptive thermal management semiconductor multi-stage heat dissipation package control system, which is used to implement an adaptive thermal management semiconductor multi-stage heat dissipation package control method according to any one of claims 1 to 7, characterized in that: include: Temperature detection module, control module, heat dissipation execution module; The temperature detection module is used to monitor the core temperature of the semiconductor device in real time and transmit the temperature data to the control unit; The control module is used to receive the temperature data transmitted by the temperature detection unit, and compare it with the preset temperature threshold, and send a corresponding heat dissipation control signal to the heat dissipation execution unit according to the comparison result, monitor the temperature data during the heat dissipation process to dynamically evaluate the heat dissipation effect and adjust the heat dissipation strategy, and at the same time, receive the state switching signal of the semiconductor device and send a stop heat dissipation signal to the heat dissipation execution unit; The heat dissipation execution module is used to start the corresponding primary, intermediate, intermediate-advanced and advanced heat dissipation modules to dissipate heat for semiconductor devices according to the heat dissipation control signal sent by the control unit, and to feed back the operating status information of the heat dissipation module to the control unit, and at the same time receive the heat dissipation stop signal from the control unit and shut down the heat dissipation module.

9. The semiconductor multi-level heat dissipation packaging control system with adaptive thermal management as claimed in claim 8, characterized in that: The control module includes: a data receiving unit, a threshold comparison unit, a strategy adjustment unit, and a signal sending unit; The data receiving unit is used to receive the temperature data transmitted by the temperature detection unit; The threshold comparison unit is used to compare the received temperature data with the preset low temperature threshold, medium temperature threshold and high temperature threshold to determine the temperature range, thereby determining the heat dissipation level to be adopted; The strategy adjustment unit is used to evaluate the heat dissipation effect according to the real-time temperature data during the heat dissipation process, and determine whether the heat dissipation level needs to be switched according to the evaluation result; The signal sending unit is used to send a heat dissipation control signal to the heat dissipation execution unit, and send a heat dissipation stop signal to the heat dissipation execution unit.

10. The semiconductor multi-level heat dissipation packaging control system with adaptive thermal management as claimed in claim 9, characterized in that: The heat dissipation execution module includes: a signal receiving unit, a heat dissipation module driving unit, and a state feedback unit; The signal receiving unit is used to receive the heat dissipation control signal and the heat dissipation stop signal sent by the control unit; The heat dissipation module driving unit is used to drive the primary heat dissipation module, the intermediate heat dissipation module, the intermediate and advanced heat dissipation module and the advanced heat dissipation module to start, stop and adjust the power operation according to the received heat dissipation control signal; The state feedback unit is used to feed back the operating state information of the heat dissipation module to the control unit.

Images