Preparation method of display panel, spliced display panel and display device

Abstract

The invention provides a preparation method of a display panel, a spliced display panel and a display device.The method comprises the steps that a substrate is provided, the substrate comprises a first surface, a second surface and a side end face located between the first surface and the second surface, the first surface is provided with a first connecting terminal, and the second surface is provided with a second connecting terminal; the second surface is provided with second connecting terminals corresponding to the first connecting terminals. At least forming a first protection layer on the first surface, wherein the first protection layer at least does not cover a partial structure of one side, close to the side end surface, of the first connection terminal; forming a conductive nanowire layer at least on the side end surface of the substrate, wherein the conductive nanowire layer is connected with the first connecting terminal and the second connecting terminal; using a magnetic field or an electric field to make conductive nanowires in the conductive nanowire layer form a preset chain; the nanometer wire layer is sintered; and patterning the conductive nanowire layer to form a plurality of connecting wires. The electric field or the magnetic field is utilized to enable the conductive nanowires to be overlapped in order and then sintered, and the conductivity and the adhesion performance of the conductive nanowires can be improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a preparation method thereof, and a display device. Background Art

[0002] Miniature light-emitting diodes (MiniLED or MicroLED) have the advantages of high brightness, high contrast, and long life, and are an important direction of display technology. However, limited by the transfer technology of micro-LEDs, large-sized micro-LED display panels need to be formed by splicing multiple small-sized micro-LED panels. When small-sized panels are spliced ​​into large-sized panels, excessive splicing gaps will seriously reduce the integrity of the display panel. In order to achieve seamless splicing, side silver paste pad printing technology is now used to transfer silver paste on the side of the micro-LED panel to form a wiring that is electrically connected to the front driving circuit. However, the wiring formed by the existing side transfer silver paste technology is not dense enough, which affects its conductivity and adhesion, making the reliability of the display panel low. Summary of the invention

[0003] In view of the problems in the prior art, the purpose of the present invention is to provide a display panel and a preparation method thereof, and a display device, so as to improve the overlapping density of conductive nanowires along a specific direction, improve the conductivity and adhesion of the conductive nanowires after sintering, and improve the reliability of the display panel.

[0004] An embodiment of the present invention provides a method for manufacturing a display panel, comprising:

[0005] A substrate is provided, the substrate comprising a first surface and a second surface, and a side surface located between the first surface and the second surface, the first surface is provided with a first connection terminal, and the second surface is provided with a second connection terminal corresponding to the first connection terminal;

[0006] forming a first protective layer at least on the first surface, wherein the first protective layer at least does not cover a portion of the structure of the first connecting terminal close to the side end surface;

[0007] forming a conductive nanowire layer at least on a side end surface of the substrate, wherein the conductive nanowire layer connects the first connection terminal and the second connection terminal;

[0008] Using a magnetic field or an electric field to make the conductive nanowires in the conductive nanowire layer form a preset chain shape;

[0009] sintering the conductive nanowire layer;

[0010] The conductive nanowire layer is patterned to form a plurality of connection traces, each of which is connected between a corresponding first connection terminal and a second connection terminal.

[0011] In some embodiments, the conductive nanowires in the conductive nanowire layer are loaded with magnetic field responsive particles or electric field responsive particles.

[0012] In some embodiments, the conductive nanowires in the conductive nanowire layer include magnetorheological materials or electrorheological materials.

[0013] In some embodiments, laser is used to pattern the conductive nanowire layer to form a plurality of connecting traces.

[0014] In some embodiments, forming a first protective layer at least on the first surface further comprises:

[0015] A second protective layer is formed on the second surface, wherein the second protective layer at least does not cover a portion of the structure of the second connecting terminal close to the side end surface.

[0016] In some embodiments, the material of the first protection layer and the material of the second protection layer include polyimide.

[0017] In some embodiments, the first protective layer and the second protective layer are prepared by coating or attaching.

[0018] In some embodiments, forming a conductive nanowire layer at least on the side end surface of the substrate further comprises:

[0019] A conductive nanowire layer is formed on the first connection terminal on the first surface and the second connection terminal on the second surface.

[0020] An embodiment of the present invention provides a spliced ​​display panel, comprising a first display panel and a second display panel that are spliced ​​together, wherein a second connection terminal of the first display panel is electrically connected to a driving chip; at least preparing the first display panel comprises the following steps:

[0021] A substrate is provided, the substrate comprising a first surface and a second surface, and a side surface located between the first surface and the second surface, the first surface is provided with a first connection terminal, and the second surface is provided with a second connection terminal corresponding to the first connection terminal;

[0022] forming a first protective layer at least on the first surface, wherein the first protective layer at least does not cover a portion of the structure of the first connecting terminal close to the side end surface;

[0023] forming a conductive nanowire layer at least on a side end surface of the substrate, wherein the conductive nanowire layer connects the first connection terminal and the second connection terminal;

[0024] Using a magnetic field or an electric field to make the conductive nanowires in the conductive nanowire layer form a preset chain shape;

[0025] sintering the conductive nanowire layer;

[0026] The conductive nanowire layer is patterned to form a plurality of connection traces, each of which is connected between a corresponding first connection terminal and a second connection terminal.

[0027] An embodiment of the present invention further provides a display device, comprising the spliced ​​display panel as described above.

[0028] The display panel and the manufacturing method thereof, and the display device provided by the present invention have the following advantages:

[0029] The present invention uses an electric field or a magnetic field to orderly overlap the conductive nanowires into chains along a specific direction, thereby increasing the possibility of overlapping the conductive nanowires and improving the overlapping density of the conductive nanowires, thereby improving the conductivity and adhesion of the conductive nanowires after sintering and improving the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Other features, objectives and advantages of the present invention will become more apparent from a reading of the detailed description of non-limiting embodiments made with reference to the following accompanying drawings.

[0031] Figure 1 is a flow chart of a method for preparing a display panel provided by an embodiment of the present invention;

[0032] Figure 2 is a side schematic diagram of a substrate provided by an embodiment of the present invention;

[0033] Figure 3 is a side schematic diagram of a substrate provided by another embodiment of the present invention;

[0034] Figure 4 is a front schematic diagram of a substrate provided by an embodiment of the present invention;

[0035] Figure 5 is a front view of a substrate after step S200 provided by an embodiment of the present invention;

[0036] Figure 6 is a front view of a substrate after step S300 provided by an embodiment of the present invention;

[0037] Figure 7 is a side view of a substrate after step S300 provided by an embodiment of the present invention;

[0038] Figure 8 is a schematic diagram of random connection of conductive nanowires loaded with magnetic field / electric field responsive particles;

[0039] Fig. 9is a schematic diagram of the in-situ sintering of conductive nanowires loaded with magnetic field / electric field responsive particles;

[0040] Fig.10 It is a schematic diagram of a conductive nanowire loaded with magnetic field / electric field responsive particles forming a preset chain under the action of an external magnetic field or electric field;

[0041] Fig.11 is a schematic diagram of random overlapping of conductive nanowires;

[0042] Fig.12 is a schematic diagram of the conductive nanowires after in-situ sintering;

[0043] Fig.13 It is a schematic diagram of conductive nanowires forming a preset chain under an applied magnetic field or electric field;

[0044] Fig.14 is a front view of the substrate after step S600;

[0045] Fig.15 is a side view of the substrate after step S600;

[0046] Fig.16 is a schematic diagram of a spliced ​​display panel provided by an embodiment of the present invention;

[0047] Fig.17 is a schematic diagram of a display device.

[0048] Reference numerals:

[0049] 10 substrate 41 conductive nanowire

[0050] 10A first surface 42 response particles

[0051] 10B Second surface 43 Connection wiring

[0052] 10C side surface 50 pixel unit

[0053] 21 First terminal 100 Splicing display panel

[0054] 22 second terminal 101 first sub-display panel

[0055] 30 first protective layer 102 second sub-display panel

[0056] 40 Conductive Nanowires 1000 Display Devices DETAILED DESCRIPTION

[0057] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. In the figures, the same reference numerals represent the same or similar structures, and thus their repeated description will be omitted. "or" and "or" in the specification may both mean "and" or "or".

[0058] In the representations of the present application, the representations with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics represented in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the represented specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples represented in the present application and the features of the different embodiments or examples, unless they contradict each other.

[0059] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the representation of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0060] It should be further understood that the terms "comprises" and "includes" indicate the presence of features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.

[0061] In order to solve the problems in the prior art, an embodiment of the present invention provides a method for preparing a display panel. Figure 1 As shown, the method for manufacturing a display panel includes steps S100, S200, S300, S400, S500 and S600. It should be noted that the numbers of the process steps in the embodiment are for the purpose of explaining the manufacturing process, rather than limiting the manufacturing sequence.

[0062] Specifically, step S100: provide a substrate, the substrate comprising a first surface, a second surface, and a side surface between the first surface and the second surface, the first surface is provided with a first connection terminal, and the second surface is provided with a second connection terminal corresponding to the first connection terminal.

[0063] For example, Figure 2 and Figure 3 As shown, the substrate 10 includes a first surface 10A, a second surface 10B, and a side surface 10C located between the first surface 10A and the second surface 10B. Figure 4 As shown, the first surface 10A is the front side of the substrate 10, and the first surface 10A is provided with a plurality of pixel units 50 arranged in an array, and the second surface 10B is the back side of the substrate 10, and the second surface 10B is provided with a driving chip (not shown in the figure). Figures 2 to 4 , the first surface 10A is provided with a first connection terminal 21, and the second surface 10B is provided with a second connection terminal 22. The first connection terminal 21 is connected to the pixel unit 50, and the second connection terminal 22 is used to receive the signal transmitted by the driving chip. When the first connection terminal 21 is connected to the second connection terminal 22, the signal of the driving chip can be transmitted to the pixel unit 50 through the first connection terminal 21, so that the pixel unit 50 emits light. The signal transmitted by the driving chip is, for example, a data signal, an initialization signal, a scanning signal, a cathode or anode signal, etc. The pixel unit 50 may include a plurality of color sub-pixels, for example, including a red sub-pixel, a blue sub-pixel and a green sub-pixel, and the red, green and blue sub-pixels are mixed to emit light of multiple colors. Therefore, by providing the required signal to each sub-pixel, the pixel unit 50 can be controlled to emit light of multiple colors. The color sub-pixels here may include LEDs or OLEDs, etc., which are not limited here.

[0064] Further, such as Figure 2 As shown, in one embodiment, the first connection terminal 21 and the corresponding second connection terminal 22 are not spaced apart from the side end surface 10C.

[0065] like Figure 3 As shown, in another embodiment, the first connection terminal 21 and the corresponding second connection terminal 22 are spaced apart from the side end surface 10C by a certain distance.

[0066] Step S200: forming a first protective layer at least on the first surface, wherein the first protective layer at least does not cover a portion of the structure of the first connection terminal close to the side end surface.

[0067] For example, Figure 5As shown, a first protective layer 30 is formed on the first surface 10A, and the first protective layer 30 at least does not cover a portion of the first connection terminal 21 near the side end surface 10C, that is, the first connection terminal 21 is exposed. The first protective layer 30 is used to protect other parts except the first connection terminal 21 from being affected by subsequent process steps.

[0068] Step S300: forming a conductive nanowire layer at least on a side surface of the substrate, wherein the conductive nanowire layer electrically connects the first connection terminal and the second connection terminal;

[0069] For example, Figure 6 and Figure 7 As shown, a conductive nanowire layer 40 is formed on the front surface 10A and the side end surface 10C of the substrate 10. The conductive nanowire layer 40 has excellent conductivity, bending resistance, radiation resistance and low resistivity, and the first connection terminal 21 and the second connection terminal 22 are electrically connected through the conductive nanowire layer 40. In step S200, the partial structure of the first connection terminal 21 close to the side end surface 10C is exposed to facilitate direct observation of whether the first connection terminal 21 and the second connection terminal 22 have good contact, and the first connection terminal 21 can be directly in contact with the conductive nanowire layer 40 on the front surface 10A of the substrate 10, thereby improving the reliability of the electrical connection between the first connection terminal 21 and the conductive nanowire layer 40.

[0070] Preferably, in some embodiments, the conductive nanowires in the conductive nanowire layer 40 are nanosilver wires, which are one-dimensional silver metal materials with a high aspect ratio, with a length in the micrometer size and a diameter in the nanometer size. Nanosilver wires inherit the excellent conductive properties of silver, have low resistivity, can efficiently conduct current, and have low energy loss.

[0071] Step S400: using a magnetic field or an electric field to make the conductive nanowires in the conductive nanowires form a predetermined chain shape.

[0072] like Figure 8 and Fig.11 As shown, the conductive nanowires 41 in the conductive nanowire layer 40 are usually randomly overlapped in all directions, and some conductive nanowires 41 are not overlapped with other conductive nanowires 41, so the overlap density of the randomly overlapped conductive nanowires 41 is not high. Fig. 9 and Fig.12 As shown, after the disordered overlapping conductive nanowires 41 are laser-sintered in situ, the insufficient density of the conductive nanowires 41 will affect their conductivity and adhesion. Fig.10 and Fig.13As shown, a magnetic field H or an electric field E is used to form the conductive nanowires 41 into a preset chain shape along the direction of the magnetic field H or the electric field E, so that the conductive nanowires 41 are overlapped in an orderly manner, thereby increasing the possibility of overlapping of the conductive nanowires 41 with each other and increasing the overlapping density of the conductive nanowires 41. The conductive nanowires 41 with a high overlapping density have improved conductivity and adhesion after sintering.

[0073] Specifically, the conductive nanowires in the conductive nanowire layer are formed into a preset chain shape by using a magnetic field, and the conductive nanowires in the conductive nanowire layer can be loaded with magnetic field responsive particles, or the conductive nanowire material in the conductive nanowire layer includes a magnetorheological material. The magnetic field responsive particles or the conductive nanowires with magnetorheological materials generate a magnetic dipole moment under the action of a magnetic field, and the magnetic dipole moment causes the magnetic field responsive particles or the conductive nanowires with magnetorheological materials to approach each other, forming a chain structure along the direction of the external magnetic field.

[0074] For example, Figure 8 As shown, the conductive nanowires 41 in the conductive nanowire layer 40 are loaded with response particles 42, which are magnetic field response particles. The magnetic field response particles are made of materials that have affinity for the conductive nanowires 41, and the magnetic field response particles will preferentially adhere to the conductive nanowires 41. In the absence of a magnetic field H, the magnetic field response particles are arranged in a disordered manner, and the conductive nanowires 41 are arranged in a disordered manner. Fig.10 As shown, when a magnetic field H is applied in the direction indicated by the arrow, the magnetic field responsive particles form a chain along the direction of the external magnetic field H. The adhesion between the magnetic field responsive particles and the conductive nanowires 41 is greater than the magnetic force induced by the external magnetic field H. Therefore, when the magnetic field responsive particles move into a chain, they can synchronously drive the conductive nanowires 41 to overlap each other to form a chain, thereby increasing the possibility of overlapping the conductive nanowires 41 and improving the overlapping density of the conductive nanowires.

[0075] For example, Fig.11 As shown, the conductive nanowires 41 in the conductive nanowire layer 40 include magnetorheological materials, and the conductive nanowires 41 formed of the magnetorheological materials are arranged in a disordered manner without the action of the magnetic field H. Fig.13 As shown, when a magnetic field H is applied to the conductive nanowire layer 40 in the direction indicated by the arrow, the conductive nanowires 41 overlap each other along the direction of the external magnetic field H to form a chain, which increases the possibility of overlapping the conductive nanowires 41 and improves the overlapping density of the conductive nanowires 41.

[0076] The magnetic material in the magnetic field responsive particles or the conductive nanowires 41 can be any metal material that has magnetism, such as iron, cobalt, nickel, molybdenum and the like.

[0077] Specifically, the conductive nanowires in the conductive nanowire layer are formed into a preset chain shape by using an electric field, and the conductive nanowires in the conductive nanowire layer can be loaded with electric field responsive particles, or the conductive nanowire material in the conductive nanowire layer includes an electrorheological material. The electric field responsive particles or the conductive nanowires with the electrorheological material generate an electric dipole moment under the action of the electric field, and the electric dipole moment causes the electric field responsive particles or the conductive nanowires with the electrorheological material to approach each other, forming a chain structure along the direction of the applied electric field.

[0078] For example, Figure 8 As shown, the conductive nanowires in the conductive nanowire layer 40 are loaded with response particles 42, which are electric field response particles. The electric field response particles are made of materials that have affinity for the conductive nanowires 41, and the electric field response particles will preferentially adhere to the conductive nanowires 41. In the absence of the electric field E, the electric field response particles are arranged in a disordered manner, and the conductive nanowires 41 are arranged in a disordered manner. Fig.11 As shown, when an electric field E is applied in the direction indicated by the arrow, the electric field responsive particles form a chain along the direction of the external electric field E, and the adhesion between the electric field responsive particles and the conductive nanowires is greater than the electric force induced by the external electric field, so that when the electric field responsive particles move into a chain, the conductive nanowires 41 can be synchronously driven to overlap each other to form a chain, thereby increasing the possibility of overlapping each other of the conductive nanowires 41 and improving the overlapping density of the conductive nanowires.

[0079] For example, Fig.11 As shown, the conductive nanowires 41 in the conductive nanowire layer 40 include electrorheological materials, and the conductive nanowires 41 formed by the electrorheological materials are arranged in a disordered manner without the action of the electric field E. Fig.13 As shown, when an electric field E is applied to the conductive nanowire layer 40 in the direction indicated by the arrow, the conductive nanowires 41 form chains along the direction of the applied electric field E and overlap with each other, thereby increasing the possibility of overlapping of the conductive nanowires 41 and improving the overlapping density of the nano conductive wires.

[0080] The chain structure formed by the conductive nanowires 41 can be adjusted by those skilled in the art by adjusting the intensity of the magnetic field H or the electric field E, and no specific limitation is made here.

[0081] Step S500: sintering the conductive nanowire layer.

[0082] For example, Fig.10 and Fig.13 As shown, by sintering the conductive nanowires 41 arranged in a preset chain, the contact or adhesion performance of the conductive nanowires 41 is enhanced, the conductive nanowires 41 are prevented from falling off, and the conductive nanowires 41 are sintered so that the conductive nanowires 41 that are in contact with each other and overlap are melted, thereby avoiding poor contact or insufficient contact between the conductive nanowires 41 and reducing the impedance of the conductive nanowires 41.

[0083] In some embodiments, laser is used to sinter the conductive nanowire layer 40. Laser sintering can be performed at a designated portion of the conductive nanowire layer 40 without affecting other portions, thereby avoiding damage to other portions. Specifically, laser sintering can be performed using ultraviolet laser sintering. Before welding, the conductive nanowires 41 in the conductive nanowire layer 40 overlap each other. Sintering the conductive nanowire layer 40 means that the conductive nanowires 41 in contact with each other are welded together, that is, the conductive nanowires 41 in contact with each other are melted and cooled to form a whole. By sintering and welding the conductive nanowires 41 together, the contact and adhesion performance of the conductive nanowire layer 40 with the substrate 10 can be enhanced, and the problem of insufficient contact or poor contact between the conductive nanowires 41 can be avoided, thereby reducing the impedance of the connecting traces 43.

[0084] Furthermore, sintering enhances the connection strength between the conductive nanowires 41 and the connection traces and the first connection terminals 21 and the second connection terminals 22, thereby preventing them from falling off, and also reduces the contact impedance.

[0085] Step S600: patterning the conductive nanowire layer to form a plurality of connection traces, each connection trace correspondingly connected between a first connection terminal and a second connection terminal.

[0086] For example, Fig.14 and Fig.15 As shown, the conductive nanowire layer 40 is patterned to form a plurality of connection traces 43 , and each connection trace 43 is correspondingly connected between the first connection terminal 21 and the second connection terminal 22 .

[0087] Furthermore, in some embodiments, the conductive nanowire layer 40 is patterned by laser to form a plurality of connecting wires 43. Fig.14 The conductive nanowire layer 40 is patterned by laser engraving to form a plurality of connecting wires 43. During the laser engraving process, the edges of the connecting wires 43 are sintered again, making the edges of the connecting wires 43 smooth and neat, avoiding cracks, further preventing the connecting wires 43 from falling off, and reducing impedance.

[0088] In other embodiments, the conductive nanowire layer may be patterned to form a plurality of connection lines by etching process. The etching process may be dry etching or wet etching. Those skilled in the art may use a specific etching process according to actual needs.

[0089] Furthermore, in some embodiments, forming a first protective layer at least on the first surface further comprises:

[0090] A second protective layer is formed on the second surface, and the second protective layer at least does not cover a portion of the structure of the second connecting terminal close to the side end surface.

[0091] For example, Figure 7 As shown, a second protective layer (not shown in the figure) is formed on the second surface 10B, and the second protective layer at least avoids the partial structure of the second connecting terminal 22 close to the side end surface 10C, so as to facilitate the electrical connection between the conductive nanowire layer 40 and the second connecting terminal 22, improve the connection reliability between the conductive nanowire layer 40 and the second connecting terminal 22, and protect the portion of the second surface 10B covered by the second protective layer from being affected by subsequent processes.

[0092] In some embodiments, the material of the first protection layer 30 and the material of the second protection layer include polyimide.

[0093] In some embodiments, the first protective layer 30 and the second protective layer are prepared by coating or attaching.

[0094] In some embodiments, forming a conductive nanowire layer at least on a side end of the substrate further comprises:

[0095] A conductive nanowire layer is formed on the first connection terminal on the first surface and the second connection terminal on the second surface.

[0096] For example, Fig.15 As shown, the conductive nanowire layer 40 covers a portion of the first connection terminal 21 and a portion of the second connection terminal 22, so that the conductive nanowire layer 40 is simultaneously on a portion of the first connection terminal 21 on the first surface 10A, the side end surface 10C, and a portion of the second connection terminal 22 on the second surface 10B, thereby improving the reliability of the electrical connection between the first connection terminal 21 and the second connection terminal 22.

[0097] It should be noted that the step of preparing the display panel also includes: removing the first protective layer 30 , or removing the first protective layer 30 and the second protective layer.

[0098] The preparation method of the display panel provided by the present invention enables the conductive nanowires in the conductive nanowire layer to form a chain structure for overlap along the direction of the external magnetic field or electric field, thereby increasing the possibility of overlapping of the conductive nanowires with each other and improving the overlapping density of the conductive nanowires, thereby improving the conductivity and adhesion of the conductive nanowires after sintering, thereby improving the reliability of the display panel.

[0099] An embodiment of the present invention further provides a spliced ​​display panel, the spliced ​​display panel comprising a first sub-display panel and a second sub-display panel spliced ​​together, the second connection terminal of the first sub-display panel being electrically connected to the driving chip, and at least preparing the first sub-display panel comprises the following steps:

[0100] S100: providing a substrate, the substrate comprising a first surface and a second surface, and a side surface located between the first surface and the second surface, the first surface being provided with a first connection terminal, and the second surface being provided with a second connection terminal corresponding to the first connection terminal;

[0101] S200: forming a first protective layer at least on the first surface, wherein the first protective layer at least does not cover a portion of the structure of the first connection terminal close to the side end surface;

[0102] S300: forming a conductive nanolayer on at least a side end surface of the substrate, wherein the conductive nanolayer is connected to the first connection terminal and the second connection terminal;

[0103] S400: using a magnetic field or an electric field to make the conductive nanowires in the conductive nanowire layer form a predetermined chain shape;

[0104] S500: sintering the conductive nanowire layer;

[0105] S600: patterning the conductive nanowire layer to form a plurality of connection traces, each connection trace being connected between a corresponding first connection terminal and a second connection terminal.

[0106] For example, Fig.16 As shown, an embodiment of the present invention provides a spliced ​​display panel 100, which includes a first sub-display panel 101 and a second sub-display panel 102 that are spliced ​​together. The first sub-display panel 101 is manufactured using the display panel manufacturing method described above.

[0107] The first sub-display panel 101 includes a first connecting terminal 21 (101) and a second connecting terminal 22 (101), and a connecting wire 43 electrically connects the first connecting terminal 21 (101) and the second connecting terminal 22 (101). The first surface 10A (101) is provided with a thin film transistor and a wiring, and the wiring can be a scanning line and a data line. Through the first connecting terminal 21 (101), the connecting wire 43 (101) and the second connecting terminal 22 (101), the wiring on the first surface 10A (101) of the first sub-display panel 101 is connected to the second surface 10B (101), and then the driving system such as the driving chip is electrically connected through the second connecting terminal 22 (101), which can reduce the width of the non-display area of ​​the first sub-display panel 101 at the splicing point, thereby reducing the splicing gap and even realizing seamless splicing; the conductive nanowires in the first sub-display panel 101 prepared by using the above display panel have high adhesion and conductivity, and the reliability of the first sub-display panel 101 is high.

[0108] like Fig.17As shown, an embodiment of the present invention further provides a display device 1000, including the spliced ​​display panel 100 as described above, and the display device can obtain all the technical effects of the spliced ​​display panel, realize seamless splicing and improve the reliability of the spliced ​​display panel. Specifically, the display device can be any device that displays images, whether moving (e.g., video) or fixed (e.g., still images), and whether text or images. More specifically, it is expected that the embodiments can be implemented in or associated with a variety of electronic devices. The various electronic devices are, for example (but not limited to), mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, car displays, electronic photos, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures, etc.

[0109] In summary, the display panel and the manufacturing method thereof, and the display device provided by the present invention have the following advantages:

[0110] By applying an external electric field or magnetic field, the conductive nanowires in the conductive nanolayer form a preset chain along the direction of the external electric field or magnetic field and are overlapped in an orderly manner, thereby increasing the possibility of overlapping of the conductive nanowires with each other and improving the overlapping density of the conductive nanowires. Therefore, the adhesion and conductivity of the conductive nanowires after sintering are improved, thereby improving the reliability of the display panel.

[0111] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A method for preparing a display panel, characterized in that: include: A substrate is provided, the substrate comprising a first surface and a second surface, and a side surface located between the first surface and the second surface, the first surface is provided with a first connection terminal, and the second surface is provided with a second connection terminal corresponding to the first connection terminal; forming a first protective layer at least on the first surface, wherein the first protective layer at least does not cover a portion of the structure of the first connecting terminal close to the side end surface; forming a conductive nanowire layer at least on a side end surface of the substrate, wherein the conductive nanowire layer connects the first connection terminal and the second connection terminal; Using a magnetic field or an electric field to make the conductive nanowires in the conductive nanowire layer form a preset chain shape; sintering the conductive nanowire layer; The conductive nanowire layer is patterned to form a plurality of connection traces, each of which is connected between a corresponding first connection terminal and a second connection terminal.

2. The method for preparing a display panel according to claim 1, characterized in that: The conductive nanowires in the conductive nanowire layer are loaded with magnetic field responsive particles or electric field responsive particles.

3. The method for preparing a display panel according to claim 1, characterized in that: The conductive nanowires in the conductive nanowire layer include magnetorheological material or electrorheological material.

4. The method for preparing a display panel according to claim 1, characterized in that: The conductive nanowire layer is patterned by laser to form a plurality of connecting wires.

5. The method for preparing a display panel according to claim 1, characterized in that: The forming of a first protective layer at least on the first surface further comprises: A second protective layer is formed on the second surface, wherein the second protective layer at least does not cover a portion of the structure of the second connecting terminal close to the side end surface.

6. The method for preparing a display panel according to claim 5, characterized in that: The material of the first protection layer and the material of the second protection layer include polyimide.

7. The method for preparing a display panel according to claim 6, characterized in that: The first protective layer and the second protective layer are prepared by coating or attaching.

8. The method for preparing a display panel according to claim 1, characterized in that: The forming of a conductive nanowire layer at least on the side end surface of the substrate further comprises: A conductive nanowire layer is formed on the first connection terminal on the first surface and the second connection terminal on the second surface.

9. A spliced ​​display panel, characterized in that: The device comprises a first display panel and a second display panel which are spliced ​​together, wherein the second connection terminal of the first display panel is electrically connected to the driving chip; and at least preparing the first display panel comprises the following steps: A substrate is provided, the substrate comprising a first surface and a second surface, and a side surface located between the first surface and the second surface, the first surface is provided with a first connection terminal, and the second surface is provided with a second connection terminal corresponding to the first connection terminal; forming a first protective layer at least on the first surface, wherein the first protective layer at least does not cover a portion of the structure of the first connecting terminal close to the side end surface; forming a conductive nanowire layer at least on a side end surface of the substrate, wherein the conductive nanowire layer connects the first connection terminal and the second connection terminal; Using a magnetic field or an electric field to make the conductive nanowires in the conductive nanowire layer form a preset chain shape; sintering the conductive nanowire layer; The conductive nanowire layer is patterned to form a plurality of connection traces, each of which is connected between a corresponding first connection terminal and a second connection terminal.

10. A display device, characterized in that: Comprising the spliced ​​display panel as claimed in claim 9.

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