Display panel and display device

Abstract

The invention provides a display panel and a display device.The display panel is provided with a first area and a second area arranged around the first area, the display panel comprises an array substrate, a light-emitting functional layer, a thin film packaging layer, a first conductor layer and a light shielding layer, the light-emitting functional layer is arranged on one side of the array substrate, and the thin film packaging layer is arranged on the other side of the array substrate; the light-emitting function layer comprises a light-emitting structure located in the first region, the thin film packaging layer is located on the side, away from the array substrate, of the light-emitting function layer, and the thin film packaging layer comprises an organic packaging layer and a first inorganic packaging layer located on the side, away from the light-emitting function layer, of the organic packaging layer; the first inorganic packaging layer covers at least part of the structure of the array substrate in the second region. The first conductor layer is arranged on the side, away from the light-emitting functional layer, of the first inorganic packaging layer and is attached to the first inorganic packaging layer. The shading layer is arranged on the side, away from the array substrate, of the first conductor layer, and the projection of the first conductor layer in the thickness direction of the display panel is located in the projection of the shading layer in the thickness direction.

Description

Technical Field

[0001] The present application relates to the technical field of display equipment, and in particular to a display panel and a display device. Background Art

[0002] With the continuous development of display technology, display panels are widely used in various industries, and people's requirements for display panels are becoming increasingly stringent. Display panels with touch functions have gradually become display devices that can be seen everywhere in people's lives. On this basis, how to reduce the power consumption of touch panels has become a key research direction for many manufacturers. Summary of the invention

[0003] Embodiments of the present application provide a display panel and a display device, which can reduce power consumption.

[0004] In a first aspect, an embodiment of the present application provides a display panel, wherein the display panel has a first area and a second area arranged around the first area, the display panel includes an array substrate, a light-emitting functional layer, a thin film encapsulation layer, a first conductor layer and a light-shielding layer, the light-emitting functional layer is arranged on one side of the array substrate, the light-emitting functional layer includes a light-emitting structure located in the first area, the thin film encapsulation layer is located on a side of the light-emitting functional layer away from the array substrate, the thin film encapsulation layer includes an organic encapsulation layer and a first inorganic encapsulation layer located on a side of the organic encapsulation layer away from the light-emitting functional layer, and the first inorganic encapsulation layer covers at least part of the structural arrangement of the array substrate in the second area.

[0005] The first conductor layer is arranged on a side of the first inorganic encapsulation layer away from the light-emitting functional layer, and is arranged in close contact with the first inorganic encapsulation layer. The light shielding layer is arranged on a side of the first conductor layer away from the array substrate, and the projection of the first conductor layer in the thickness direction of the display panel is located within the projection of the light shielding layer in the thickness direction.

[0006] In a second aspect, an embodiment of the present application provides a display device, which includes a display panel in any of the aforementioned embodiments.

[0007] The embodiment of the present application provides a display panel and a display device, by setting the first inorganic encapsulation layer to cover at least part of the structure of the second area of ​​the array substrate, the function of the buffer layer is integrated in the first inorganic encapsulation layer, and the preparation of the buffer layer is eliminated, which helps to reduce the overall thickness of the display panel, facilitates a lightweight design, and simplifies the difficulty of preparing the display panel. At the same time, this design can also reduce the distance between the light shielding layer and the light-emitting functional layer, thereby increasing the width size of the light shielding layer corresponding to the area between adjacent light-emitting structures, which helps to reduce the power consumption of the display panel and improve the performance of the display panel itself. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0009] Figure 1 is a schematic diagram of a top view structure of a display panel provided in an embodiment of the present application;

[0010] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure at AA in the middle;

[0011] Figure 3 yes Figure 1 Schematic diagram of the cross-sectional structure at BB in the middle;

[0012] Figure 4 is a schematic cross-sectional structure diagram of another display panel provided in an embodiment of the present application;

[0013] Figure 5 is a schematic diagram of a cross-sectional structure of another display panel at other positions provided by an embodiment of the present application;

[0014] Figure 6 is a schematic cross-sectional structure diagram of another display panel provided in an embodiment of the present application;

[0015] Figure 7 yes Figure 6 Schematic diagram of the enlarged structure at the middle area Q;

[0016] Figure 8 is a schematic cross-sectional structure diagram of another display panel provided in an embodiment of the present application;

[0017] Fig. 9 It is a structural schematic diagram of a display device provided in an embodiment of the present application.

[0018] Marking Description:

[0019] 10. Array substrate;

[0020] 20. Light-emitting functional layer; 21. Light-emitting structure;

[0021] 31, first conductor layer; 311, first conductive portion; 32, second conductor layer; 321, second conductive portion; 322, third conductive portion;

[0022] 40, light shielding layer; 41, first light shielding portion; 411, first light shielding sub-portion; 412, second light shielding sub-portion; 42, second light shielding portion;

[0023] 50, thin film encapsulation layer; 51, first inorganic encapsulation layer; 511, first inorganic part; 512, second inorganic part; 52, organic encapsulation layer; 53, second inorganic encapsulation layer;

[0024] 61, first insulating layer; 611, first sub-section; 612, second sub-section; 62, second insulating layer; 621, third sub-section; 622, fourth sub-section;

[0025] 70. filter layer; 71. filter structure;

[0026] A1, first zone; A2, second zone;

[0027] D. Dam structure;

[0028] L. Data cable;

[0029] K1, first opening;

[0030] G, first light; 40', virtual light shielding layer;

[0031] X, thickness direction. DETAILED DESCRIPTION

[0032] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0034] For a display panel with a touch function, a touch function layer and a buffer layer for supporting the touch function layer need to be integrated in the display panel, and the presence of these film layers will increase the manufacturing cost of the display panel and increase the overall thickness. In addition, these film layers are usually located on the light emitting surface side of the light emitting structure, which will also have an adverse effect on the light emitting effect and light emitting power consumption.

[0035] Regarding the above issues, please refer to Figures 1 to 3 An embodiment of the present application provides a display panel, the display panel having a first area A1 and a second area A2 arranged around the first area A1, the display panel including an array substrate 10, a light-emitting functional layer 20, a thin film encapsulation layer 50, a first conductor layer 31 and a light-shielding layer 40, the light-emitting functional layer 20 is arranged on one side of the array substrate 10, the light-emitting functional layer 20 includes a light-emitting structure 21 located in the first area A1, the thin film encapsulation layer 50 is located on a side of the light-emitting functional layer 20 away from the array substrate 10, the thin film encapsulation layer 50 includes an organic encapsulation layer 52 and a first inorganic encapsulation layer 51 located on a side of the organic encapsulation layer 52 away from the light-emitting functional layer 20, and the first inorganic encapsulation layer 51 covers at least part of the structural arrangement of the array substrate 10 in the second area A2.

[0036] The first conductor layer 31 is disposed on a side of the first inorganic encapsulation layer 51 away from the light-emitting functional layer 20, and is laminated to the first inorganic encapsulation layer 51. The light shielding layer 40 is disposed on a side of the first conductor layer 31 away from the array substrate 10, and the projection of the first conductor layer 31 in the thickness direction X of the display panel is located within the projection of the light shielding layer 40 in the thickness direction X.

[0037] The display panel has a first area A1 and a second area A2, wherein the first area A1 is an area in the display panel for realizing the light-emitting display function, and the second area A2 is an area arranged around the first area A1 and not used for light-emitting display. The first area A1 and the second area A2 may have a variety of shapes and sizes, which are not limited in the embodiment of the present application. Optionally, the shapes and sizes of the first area A1 and the second area A2 are adapted, for example, if the first area A1 is a circular structure, the second area A2 is a circular ring structure, or if the first area A1 is a square structure, the second area A2 is a square ring structure.

[0038] The array substrate 10 is a module structure in the display panel that is used to set up a circuit structure for controlling the display panel. The array substrate 10 may include a plurality of film layer structures stacked in a stacked manner. Exemplarily, the array substrate 10 may include a substrate, a semiconductor layer located on one side of the substrate, and a plurality of conductor layers, as well as an insulating layer located between adjacent different conductor layers or between adjacent conductor layers and semiconductor layers.

[0039] The light-emitting functional layer 20 is a film layer disposed on one side of the array substrate 10 and used to realize the display function. The light-emitting functional layer 20 includes a plurality of light-emitting structures 21, and the light-emitting structures 21 include but are not limited to a red light-emitting structure 21 for emitting red light, a green light-emitting structure 21 for emitting green light, and a blue light-emitting structure 21 for emitting blue light. Among them, the light-emitting structure 21 may include a stacked hole injection layer (Hole Inject Layer, HIL), a hole transport layer (Hole Transport Layer, HTL), a light-emitting layer, an electron injection layer (Electron Inject10 Layer, EIL) and an electron transport layer (Electron Transport Layer, ETL) and other film layers. In some other embodiments, the light-emitting structure 21 may include a plurality of stacked light-emitting layers, and a charge generation layer is provided between adjacent light-emitting layers.

[0040] The array substrate 10 includes a circuit structure for controlling the light-emitting structure 21. Exemplarily, the array substrate 10 includes a plurality of pixel circuits. The plurality of pixel circuits and the plurality of light-emitting structures 21 are all located in the first area A1, and the plurality of pixel circuits are electrically connected to different light-emitting structures 21, respectively, to achieve control over whether different light-emitting structures 21 emit light or not.

[0041] The thin film encapsulation layer 50 is a module structure arranged on the side of the light-emitting functional layer 20 away from the array substrate 10, that is, arranged on the side of the light-emitting surface of the light-emitting structure 21 and used to achieve the encapsulation protection effect. Among them, thin film encapsulation is a technology that reduces the influence of the environment on an object by depositing a multi-layer thin film structure on the surface of the object. In the embodiment of the present application, the thin film encapsulation layer 50 includes a first inorganic encapsulation layer 51 and an organic encapsulation layer 52. The first inorganic encapsulation layer 51 includes inorganic materials and is used to block water and oxygen. The organic encapsulation layer 52 includes organic materials and is used to relieve the stress generated when the film layer is bent. The thin film encapsulation layer 50 can reduce the risk of water and oxygen intrusion into the position of the light-emitting structure 21 while meeting the bending requirements, thereby improving the light-emitting reliability of the display panel.

[0042] In some optional embodiments, the thin film encapsulation layer 50 further includes a second inorganic encapsulation layer 53 , and the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53 are disposed on both sides of the organic encapsulation layer 52 along the thickness direction X of the display panel.

[0043] The first conductor layer 31 is a film layer used to realize the touch function in the display panel. The first conductor layer 31 is located on the side of the first inorganic encapsulation layer 51 away from the light-emitting functional layer 20 and includes a conductor material. According to different actual needs, the first conductor layer 31 may include a metal wiring structure, or the first conductor layer 31 may be provided with a conductive structure such as indium tin oxide. The specific material composition of the first conductor layer 31 is not limited in the embodiment of the present application.

[0044] It should be noted that the display panel may further be provided with another conductor layer on the side of the first conductor layer 31 away from the array substrate 10, and the touch function of the display panel is realized by means of the cooperation between the conductor layer and the first conductor layer 31. Alternatively, in other embodiments, the display panel may also realize the touch function only by means of the first conductor layer 31 and through the capacitive touch technology.

[0045] The light shielding layer 40 includes a light shielding material to reduce the risk of color mixing between different light emitting structures 21 and reduce the degree of reflection of the display panel to the ambient light. Specifically, the light shielding layer 40 is located on the side of the first conductor layer 31 away from the array substrate 10, that is, on the side of the light emitting surface of the light emitting structure 21. The light shielding layer 40 is provided with an opening structure at the position corresponding to the light emitting structure 21, and the light shielding layer 40 is provided in the area between adjacent light emitting structures 21. The existence of the light shielding layer 40 can absorb the wide viewing angle light emitted from different light emitting structures 21, thereby reducing the color mixing problem of the display panel. In addition, part of the ambient light incident into the display panel will also be blocked and absorbed by the light shielding layer 40, so that the reflection of the display panel to the ambient light can be reduced by means of the light shielding layer 40, thereby reducing the influence of the ambient light on the display effect.

[0046] In the related art, a buffer layer is provided adjacent to the side of the first conductor layer 31 facing the array substrate 10. The buffer layer can support the first conductor layer 31, and in the process of preparing the display panel, the buffer layer is formed before the first conductor layer 31. Therefore, in the process of preparing the first conductor layer 31, the presence of the buffer layer can also reduce the adverse effects of the etching process corresponding to the first conductor layer 31 on the light-emitting functional layer 20 and the film layers such as the array substrate 10, thereby improving the preparation yield.

[0047] In the embodiment of the present application, considering that both the buffer layer and the first inorganic encapsulation layer 51 include inorganic materials, the buffer layer is eliminated in the display panel, and the first conductor layer 31 is directly bonded to the first inorganic encapsulation layer 51, that is, there is no other film structure between the first conductor layer 31 and the first inorganic encapsulation layer 51. Under this design, in addition to being used to form a thin film encapsulation layer 50 to meet the encapsulation needs of the display panel, the first inorganic encapsulation layer 51 also integrates the function of the buffer layer, so that the first inorganic encapsulation layer 51 can support the first conductor layer 31.

[0048] Furthermore, in the related art, the first inorganic packaging layer 51 is usually only arranged in the first area A1, while in the embodiment of the present application, in addition to being arranged in the first area A1, the first inorganic packaging layer 51 also extends to the second area A2 and covers at least part of the structure of the array substrate 10 in the second area A2, that is, the first inorganic packaging layer 51 can be a whole-surface structure covering the first area A1 and the second area A2. In this way, during the preparation of the first conductor layer 31, the first inorganic packaging layer 51 can also protect the array substrate 10 below, reduce the risk of damage to the peripheral wiring on the array substrate 10 located in the second area A2 due to processes such as etching, and improve the preparation yield and preparation reliability of the display panel.

[0049] In addition, since the buffer layer is removed, the distance between the light shielding layer 40 and the light emitting functional layer 20 in the display panel thickness direction X is also reduced. On this basis, the width of the light shielding layer 40 between adjacent light emitting structures 21 can be increased.

[0050] Specifically, in combination with Figure 2 For example, the first light G is the maximum viewing angle light allowed to be emitted by the light emitting structure 21, and other light with an inclination angle greater than the first light G will be absorbed by the light shielding layer 40, thereby reducing the color mixing problem. The virtual light shielding layer 40' corresponds to the position of the light shielding film layer when there is a buffer layer in the display panel, that is, the approximate position of the light shielding film layer in the related art. Figure 2 In the figure, both the shading layer 40 and the virtual shading layer 40' can realize the shading and absorption function of other light rays with an inclination angle greater than that of the first light ray. However, since the shading layer 40 is arranged closer to the light-emitting function layer 20 than the virtual shading layer 40', the width dimension corresponding to the shading layer 40 located in the area between adjacent light-emitting structures 21 is greater than the width dimension corresponding to the virtual shading layer 40'.

[0051] Furthermore, since the light shielding layer 40 in the embodiment of the present application can have a larger size than the light shielding film layer in the related art, the light shielding layer 40 can absorb more ambient light and reduce the degree of reflection of the ambient light by the display panel. Generally, the stronger the degree of reflection of the ambient light by the display panel, the more power consumption the display panel needs to reduce the influence of the reflected light on the display effect. Therefore, the embodiment of the present application helps to reduce the power consumption of the display panel and improve the performance of the display panel itself by changing the position of the light shielding layer 40 and increasing the size of the light shielding layer 40.

[0052] The embodiment of the present application does not limit the distance between the light shielding layer 40 and the light emitting functional layer 20, and the width of the light shielding layer 40 in the area between adjacent light emitting structures 21. Optionally, compared with the related art, the distance between the light shielding layer 40 and the light emitting functional layer 20 can be reduced by about 2000A, and the width of the light shielding layer 40 in the area between adjacent light emitting structures 21 can be increased by about 1.3um.

[0053] In summary, in the embodiment of the present application, by setting the first inorganic encapsulation layer 51 to cover at least part of the second area A2 of the array substrate 10, the function of the buffer layer is integrated into the first inorganic encapsulation layer 51, and the preparation of the buffer layer is eliminated, which helps to reduce the overall thickness of the display panel, facilitates a lightweight design, and simplifies the difficulty of preparing the display panel. At the same time, this design can also reduce the distance between the light shielding layer 40 and the light-emitting functional layer 20, thereby increasing the width of the light shielding layer 40 located in the area between adjacent light-emitting structures 21, which helps to reduce the power consumption of the display panel and improve the performance of the display panel itself.

[0054] In some embodiments, see Figures 1 to 3 The display panel also includes a dam structure D arranged on the side of the array substrate 10 facing the thin film encapsulation layer 50 and located in the second area A2. In the direction parallel to the display panel, the organic encapsulation layer 52 is located on the side of the dam structure D facing the first area A1. The first inorganic encapsulation layer 51 includes a first inorganic portion 511 located on the side of the dam structure D facing the first area A1, and a second inorganic portion 512 located on the side of the dam structure D away from the first area A1. The second inorganic portion 512 covers part of the structural arrangement of the array substrate 10.

[0055] The dam structure D is a blocking structure used to prevent the risk of overflow of part of the film layer. Specifically, the organic encapsulation layer 52 includes organic materials. During the preparation process of the thin film encapsulation layer 50, due to the presence of the organic material, the organic encapsulation layer 52 will have a certain fluidity. On this basis, in order to prevent the organic encapsulation layer 52 from flowing to the second area A2, a dam structure D is added. The dam structure D can hinder the overflow of the organic encapsulation layer 52, and the organic encapsulation layer 52 is terminated at the side of the dam junction facing the first area A1, thereby reducing the adverse effect of the organic sealing layer on the partial structure of the array substrate 10 in the second area A2, and improving the reliability of the display panel.

[0056] In the related art, the inorganic encapsulation layer located above the organic encapsulation layer 52 ends near the location of the dam structure D, while in the embodiment of the present application, the first inorganic encapsulation layer 51 ends near the location of the dam structure D, and includes a first inorganic portion 511 located on the side of the dam structure D facing the first area A1, and a second inorganic portion 512 located on the side of the dam structure D away from the first area A1. The second inorganic portion 512 is a partial structure of the first inorganic encapsulation layer 51 used to cooperate with the second inorganic encapsulation layer 53 to limit the organic encapsulation layer 52, and the first inorganic portion 511 is used to cover and protect the partial structure of the array substrate 10 in the second area A2.

[0057] It should be noted that, according to actual needs and the influence of factors such as the preparation process, the first inorganic part 511 can be connected to the second inorganic part 512 as an integral part, or the first inorganic part 511 and the second inorganic part 512 can also be spaced apart from each other. In addition, the specific structure of the second inorganic encapsulation layer 53 is not limited in the embodiment of the present application. For example, the second inorganic encapsulation layer 53 can end near the location of the dam structure D, or the second inorganic encapsulation layer 53 can also include two inorganic parts located on both sides of the dam structure D at the same time.

[0058] In summary, in the embodiment of the present application, the structure of the first inorganic encapsulation layer 51 is adjusted so that the first inorganic encapsulation layer 51 also includes a first inorganic part 511 for limiting the organic encapsulation layer 52, and a second inorganic part 512 for shielding and protecting the partial structure of the array substrate 10 in the second area A2, thereby reducing the adverse effects of the subsequent preparation of the first conductor layer 31 on the array substrate 10 and improving the yield rate and reliability of the display panel.

[0059] In some embodiments, Figures 1 to 3 As shown, the array substrate 10 includes a data line L, and the second inorganic portion 512 covers a portion of the data line L.

[0060] The data line L is a routing structure in the array substrate 10 for providing data signals. Optionally, the display panel also includes a driving chip located in the second area A2. The data line L can be directly or indirectly connected to the driving chip and extend from the second area A2 into the first area A1 to provide data signals to the pixel circuit located in the first area A1 in the array substrate 10.

[0061] On this basis, the embodiment of the present application sets the second inorganic part 512 in the first inorganic packaging layer 51 to cover a partial structure of the data line L, so that the second inorganic part 512 can block and protect the partial structure of the data line L located in the second area A2, thereby reducing the adverse effect of the preparation process corresponding to the first conductor layer 31 on the data line L and improving the reliability of data signal transmission.

[0062] It should be noted that, in addition to the data line L, the second inorganic part 512 can also cover other wiring structures in the array substrate 10. For example, the display panel also includes a cathode layer located on the side of the light-emitting functional layer 20 away from the array substrate 10. The array substrate 10 includes a power signal line electrically connected to the cathode layer. The power signal line is arranged around the first area A1, and the second inorganic part 512 covers at least part of the structural arrangement in the power signal line.

[0063] In some embodiments, the size of the first inorganic encapsulation layer 51 in the thickness direction X of the display panel is H, and H satisfies: 0.5 μm≤H≤0.8 μm. Optionally, H is one of 0.5 μm, 0.6 μm, 0.7 μm and 0.8 μm.

[0064] H is the thickness of the first inorganic encapsulation layer 51. By setting H to be not less than 0.5 μm, the first inorganic encapsulation layer 51 can have a certain thickness, thereby improving the corresponding encapsulation effect of the first inorganic encapsulation layer 51 and its covering and protecting effect on the array substrate 10. At the same time, H is set to be not more than 0.8 μm, so that the thickness of the first inorganic encapsulation layer 51 can be the same or similar to the thickness of the inorganic encapsulation layer in the related art, that is, the embodiment of the present application does not increase the thickness of the first inorganic encapsulation layer 51, which helps to reduce the distance between the light shielding layer 40 and the light emitting functional layer 20, thereby increasing the width of the light shielding layer 40 located in the area between adjacent light emitting structures 21, thereby helping to reduce the power consumption of the display panel and improve the performance of the display panel itself.

[0065] It should be noted that the present embodiment does not limit the material composition of the first inorganic encapsulation layer 51. Optionally, the material of the first inorganic encapsulation layer 51 includes silicon nitride, that is, the first inorganic encapsulation layer 51 can be made of the same material as the inorganic encapsulation layer in the related art.

[0066] In some embodiments, see Figure 4 The display panel further includes a first insulating layer 61 disposed on the side of the first conductor layer 31 away from the array substrate 10, and the projection of the first insulating layer 61 in the thickness direction X of the display panel is located within the projection of the first conductor layer 31 in the thickness direction X of the display panel.

[0067] The first insulating layer 61 is a film structure including an insulating material and isolating the first conductor layer 31 from other conductor structures. The first insulating layer 61 can provide insulation protection for the first conductor layer 31. Generally, the first insulating layer 61 is a whole-surface structure that covers and exceeds the projection of the first conductor layer 31 in the thickness direction X of the display panel. However, in the embodiment of the present application, the first insulating layer 61 is not a whole-surface structure, but is patterned so that its projection in the thickness direction X of the display panel is located within the projection of the first conductor layer 31 in the thickness direction X of the display panel. Optionally, the projection of the first conductor layer 31 in the thickness direction X of the display panel covers and exceeds the projection of the first insulating layer 61 in the thickness direction X of the display panel.

[0068] It can be seen from the contents of the accompanying drawings that in order to reduce the influence of the first conductor layer 31 on the display effect, the first conductor layer 31 is usually arranged to avoid the light-emitting structure 21, and because the projection of the first insulating layer 61 in the thickness direction X of the display panel is located within the projection of the first conductor layer 31 in the thickness direction X of the display panel, the first insulating layer 61 will also be arranged to avoid the light-emitting structure 21, that is, the projection of the first insulating layer 61 in the thickness direction X of the display panel is located outside the projection of the light-emitting structure 21 in the thickness direction X of the display panel.

[0069] Furthermore, since the light-shielding layer 40 is formed after the first insulating layer 61, and the projection of the light-shielding layer 40 in the thickness direction X of the display panel usually covers and exceeds the projection of the first conductor layer 31 in the thickness direction X of the display panel, there will be a partial structure of the light-shielding layer 40 located on the side of the first insulating layer 61 away from the array substrate 10. At the same time, at the position of the light-emitting area corresponding to the light-emitting structure 21, since there is no first insulating layer 61, the partial structure of the light-shielding layer 40 at this position will be arranged closer to the light-emitting functional layer 20 in the thickness direction X of the display panel.

[0070] On this basis, since the partial structure of the light shielding layer 40 near the light emitting area has a smaller distance dimension from the light emitting functional layer 20, the partial structure can have a larger dimension in the direction parallel to the plane where the display panel is located, thereby absorbing more ambient light, reducing the degree of reflection of the display panel to the ambient light, and reducing the corresponding power consumption of the display panel. Optionally, this design method helps to further reduce the distance between the partial structure of the light shielding layer 40 and the light emitting functional layer 20 by about 3000A.

[0071] In summary, in the embodiment of the present application, the first insulating layer 61 is not a whole-surface structure, but is patterned so that its projection in the thickness direction X of the display panel is located within the projection of the first conductor layer 31 in the thickness direction X of the display panel, thereby reducing the distance between the partial structure in the shading layer 40 and the light-emitting functional layer 20 in the thickness direction X of the display panel, so that the partial structure has a larger size in the direction parallel to the plane where the display panel is located, thereby absorbing more ambient light, reducing reflection problems and the corresponding power consumption of the display panel.

[0072] In some embodiments, see Figure 4 and Figure 5 The display panel further includes a second conductor layer 32 disposed on the side of the first insulating layer 61 away from the first conductor layer 31. The first conductor layer 31 includes a first conductive portion 311. The second conductor layer 32 includes a second conductive portion 321 and a third conductive portion 322. The second conductive portion 321 is electrically connected to the first conductive portion 311. The first insulating layer 61 includes a first sub-portion 611 and a second sub-portion 612 that are spaced apart. The first sub-portion 611 is sandwiched between the first conductive portion 311 and the second conductive portion 321 and is provided with a via structure. The second sub-portion 612 is sandwiched between the first conductive portion 311 and the third conductive portion 322.

[0073] The first conductor layer 31 and the second conductor layer 32 are both film structures including conductor materials for meeting touch control requirements. The first conductor layer 31 is located on the side of the second conductor layer 32 close to the array substrate 10. The first conductor layer 31 includes a first conductive portion 311, and the second conductor layer 32 includes a second conductive portion 321 and a third conductive portion 322. In order to meet touch control requirements, the first conductive portion 311 needs to be electrically connected to different second conductive portions 321, and the first conductive portion 311 needs to be insulated from the third conductive portion 322. Exemplarily, the first conductive portion 311 may be a cross-bridge structure.

[0074] The first insulating layer 61 is located between the first conductor layer 31 and the second conductor layer 32. The existence of the first insulating layer 61 requires that the first conductive part 311 be separated from the second conductive part 321 and the third conductive part 322, and also needs to meet the electrical connection requirements between the first conductive part 311 and the second conductive part 321, and the insulation requirements between the first conductive part 311 and the third conductive part 322.

[0075] In combination with the above content, it can be known that the first insulating layer 61 in the embodiment of the present application is not a whole surface structure, but is patterned so that its projection in the thickness direction X of the display panel is located within the projection of the first conductor layer 31 in the thickness direction X of the display panel. On this basis, in order to meet the touch control needs, the first insulating layer 61 needs to include a first sub-section 611 and a second sub-section 612 arranged at intervals, the first sub-section 611 is a partial structure of the first insulating layer 61 located between the first conductive part 311 and the second conductive part 321, and the second sub-section 612 is a partial structure of the first insulating layer 61 located between the first conductive part 311 and the third conductive part 322. Further, in order to meet the need for electrical connection between the first conductive part 311 and the second conductive part 321, a via structure needs to be provided on the first sub-section 611, and a via structure exists on the upper part of the second sub-section 612 to meet the insulation needs between the first conductive part 311 and the third conductive part 322.

[0076] In the embodiment of the present application, the first insulating layer 61 is not a continuous whole-surface structure but includes a first sub-portion 611 and a second sub-portion 612 which are spaced apart. The first sub-portion 611 is used to separate the first conductive portion 311 from the second conductive portion 321, and the second sub-portion 612 is used to separate the first conductive portion 311 from the third conductive portion 322. In addition to the first sub-portion 611 and the second sub-portion 612, at other positions, since there is no first insulating layer 61, the distance between the light-shielding layer 40 and the light-emitting functional layer 20 can be shortened, thereby helping to reduce the power consumption of the display panel and improve the performance of the display panel.

[0077] In some embodiments, the first insulating layer 61 includes photoresist.

[0078] In the related art, the insulating layer includes inorganic materials such as silicon nitride. The presence of inorganic materials makes the preparation process of the insulating layer include at least multiple steps such as cleaning and film formation, yellow light etching and stripping. In the embodiment of the present application, the photoresist is an organic material. During the preparation process, since the first insulating layer 61 includes photoresist, it can be prepared and formed only through photolithography and curing processes, which helps to simplify the preparation process of the first insulating layer 61 and improve the preparation efficiency. At the same time, compared with silicon nitride, photoresist has better bending performance, so the first insulating layer 61 is set to include photoresist, which helps to achieve the bending needs of the display panel and improve practicality.

[0079] In some embodiments, see Figure 6The display panel also includes a second conductor layer 32 arranged on the side of the first conductor layer 31 away from the array substrate 10, and a second insulating layer 62 located on the side of the second conductor layer 32 away from the array substrate 10, and the projection of the second insulating layer 62 in the thickness direction X of the display panel is grid-shaped and covers the projection of the second conductor layer 32 in the thickness direction X of the display panel.

[0080] The second insulating layer 62 is a film structure that includes an insulating material and insulates and separates the second conductor layer 32 from other conductor structures. The second insulating layer 62 can provide insulation protection for the second conductor layer 32. Generally, the second insulating layer 62 is a whole-surface structure that covers and exceeds the projection of the second conductor layer 32 in the thickness direction X of the display panel. However, in the embodiment of the present application, the second insulating layer 62 is not a whole-surface structure. The projection of the second insulating layer 62 in the thickness direction X of the display panel is in a grid shape and covers the projection of the second conductor layer 32 in the thickness direction X of the display panel. Among them, the grid opening can correspond to the light-emitting area where the light-emitting structure 21 is located, that is, the projection of the second insulating layer 62 in the thickness direction X of the display panel is located between the projections of adjacent light-emitting structures 21 in the thickness direction X of the display panel.

[0081] Furthermore, the light-shielding layer 40 is formed after the second insulating layer 62, and the projection of the light-shielding layer 40 in the thickness direction X of the display panel will cover and exceed the projection of the second insulating layer 62 in the thickness direction X of the display panel. Therefore, there will be a partial structure of the light-shielding layer 40 located on the side of the second insulating layer 62 away from the array substrate 10. At the same time, at the position of the light-emitting area corresponding to the light-emitting structure 21, since there is no second insulating layer 62, the partial structure of the light-shielding layer 40 at this position will be arranged closer to the light-emitting functional layer 20 in the thickness direction X of the display panel.

[0082] On this basis, since the partial structure of the light shielding layer 40 near the light emitting area has a smaller distance dimension from the light emitting functional layer 20, the partial structure can have a larger dimension in the direction parallel to the plane where the display panel is located, thereby absorbing more ambient light, reducing the degree of reflection of the display panel to the ambient light, and reducing the corresponding power consumption of the display panel. Optionally, this design method helps to further reduce the distance between the partial structure of the light shielding layer 40 and the light emitting functional layer 20 by about 1500A.

[0083] It should be noted that, in the embodiment of the present application, the first insulating layer 61 may be a whole surface structure, or may be patterned as shown in the above embodiment. In other words, the display panel may only pattern the first insulating layer 61, or only pattern the second insulating layer 62 to form a grid structure, or may pattern both the first insulating layer 61 and the second insulating layer 62 at the same time, depending on actual needs.

[0084] In some embodiments, see Figure 6 and Figure 7 The second insulating layer 62 includes a third sub-portion 621 and a fourth sub-portion 622 which are connected to each other. The third sub-portion 621 is arranged to cover the second conductor layer 32 , and the fourth sub-portion 622 is arranged on the outer peripheral side of the conductor structure in the second conductor layer 32 .

[0085] The second insulating layer 62 at least includes a third sub-portion 621 and a fourth sub-portion 622, which are connected as a whole and whose projections in the thickness direction X of the display panel jointly form a grid structure. The projections of the third sub-portion 621 and the fourth sub-portion 622 in the thickness direction X of the display panel are both located between the projections of adjacent light emitting structures 21 in the thickness direction X of the display panel.

[0086] The third sub-portion 621 can cover and protect the surface of the second conductor layer 32 facing away from the array substrate 10, and the fourth sub-portion 622 can cover and protect the conductor structure in the second conductor layer 32, such as the peripheral edges of the second conductive portion 321 and the third conductive portion 322. The cooperation between the third sub-portion 621 and the fourth sub-portion 622 can further improve the insulation protection effect of the second insulating layer 62 on the second conductor layer 32, thereby reducing the adverse effects of the preparation process corresponding to other film layers of the second insulating layer 62 facing away from the array substrate 10 on the second conductor layer 32, thereby improving the reliability of the second conductor layer 32.

[0087] It should be noted that the fourth sub-portion 622 can only protect the second conductor layer 32, or optionally, the fourth sub-portion 622 can also be partially located on the outer peripheral side of the first conductive portion 311 in the first conductive layer 31, so as to simultaneously cover and protect the peripheral edge of the first conductive portion 311, thereby reducing the risk of side engraving problems between the first conductive layer 31 and the second conductive layer 32 and improving the yield rate of the display panel.

[0088] In some optional embodiments, the first insulating layer 61 includes a first sub-portion 611 and a second sub-portion 612 which are arranged at intervals, the first sub-portion 611 is sandwiched between the first conductive portion 311 and the second conductive portion 321 and is provided with a via structure, and the second sub-portion 612 is sandwiched between the first conductive portion 311 and the third conductive portion 322. The second insulating layer 62 includes a third sub-portion 621 and a fourth sub-portion 622 which are connected and arranged, the third sub-portion 621 is arranged to cover the second conductor layer 32, and the fourth sub-portion 622 is arranged on the outer peripheral side of the conductor structure in the second conductor layer 32.

[0089] In some embodiments, Figure 6 and Figure 7As shown, the display panel further includes a second conductor layer 32 disposed on the side of the first conductor layer 31 away from the array substrate 10 . The second conductor layer 32 encloses a plurality of first openings K1 , and a portion of the light shielding layer 40 is located in the first openings K1 .

[0090] The first opening K1 is enclosed by the second conductor layer 32 to form an opening structure corresponding to the light emitting structure 21, and the projection of the first opening K1 in the thickness direction X of the display panel covers and exceeds the projection of the light emitting structure 21 in the thickness direction X of the display panel. It can be understood that there is no conductor structure in the first conductor layer 31 at the position corresponding to the first opening K1, that is, the projection of the first conductive part 311 in the thickness direction X of the display panel is located outside the projection of the first opening in the thickness direction X of the display panel. This design can reduce the influence of the conductor material in the first conductor layer 31 and the second conductor layer 32 on the light emitting effect of the light emitting structure 21, improve the use experience of the display panel and reduce energy consumption.

[0091] Furthermore, part of the light-shielding layer 40 is located within the first opening K1, that is, part of the structure in the light-shielding layer 40 can be located at the same height as the second conductor layer 32 in a direction parallel to the plane where the display panel is located. Furthermore, part of the structure in the light-shielding layer 40 located within the first opening K1 can also be located at the same height as the first conductor layer 31 and the first insulating layer 61 in a direction parallel to the plane where the display panel is located.

[0092] It can be seen from the accompanying drawings that the distance between the partial structure of the light shielding layer 40 located in the first opening K1 and the light emitting functional layer 20 in the thickness direction X of the display panel is smaller than the distance between the partial structure of the light shielding layer 40 located on the side of the second conductor layer 32 away from the array substrate 10 and the light emitting functional layer 20 in the thickness direction X of the display panel. On this basis, under the premise of not affecting the light output viewing angle corresponding to the single light emitting structure 21, the embodiment of the present application can increase the projection size of the partial structure of the light shielding layer 40 located in the first opening K1 in the thickness direction X of the display panel, so as to improve the light shielding layer 40's absorption effect on ambient light and reduce the power consumption of the display panel.

[0093] In some embodiments, Figure 6 and Figure 7 As shown, the shading layer 40 includes a first shading portion 41 and a second shading portion 42 which are connected to each other. The projection of the first shading portion 41 in the thickness direction X of the display panel is located within the projection of the first opening K1 in the thickness direction X of the display panel. The second shading portion 42 covers the first conductor layer 31 and the second conductor layer 32. A portion of the first shading portion 41 is located on a side of the second shading portion 42 close to the array substrate 10.

[0094] The second light shielding portion 42 is a partial structure of the light shielding layer 40 disposed on the side of the second conductor layer 32 away from the array substrate 10, and the second light shielding portion 42 can cover and shield the first conductor layer 31 and the second conductor layer 32. Optionally, the conductor structure in the first conductor layer 31 and the second conductor layer 32 may include a metal material. In this case, the presence of the second light shielding portion 42 can reduce the reflection effect of the first conductor layer 31 and the second conductor layer 32 on the ambient light, thereby improving the display effect of the display panel.

[0095] The first light shielding portion 41 is a partial structure of the light shielding layer 40 disposed on the peripheral side of the conductor structure in the first conductor layer 31 and the second conductor layer 32. The projection of the first light shielding portion 41 in the thickness direction X of the display panel is located within the projection of the first opening K1 in the thickness direction X of the display panel. Exemplarily, the first light shielding portion 41 includes a first light shielding sub-portion 411 disposed in contact with the first inorganic encapsulation layer 51, and a second light shielding sub-portion 412 connecting the first light shielding sub-portion 411 and the second light shielding portion 42. The first light shielding sub-portion 411 is located on the side of the second light shielding portion 42 close to the array substrate 10, that is, the distance between the first light shielding sub-portion 411 and the light emitting functional layer 20 in the thickness direction X of the display panel is smaller than the distance between the second light shielding portion 42 and the light emitting functional layer 20 in the thickness direction X of the display panel.

[0096] In the embodiment of the present application, since the first light-shielding portion 41 is arranged closer to the array substrate 10 than the second light-shielding portion 42, that is, closer to the light-emitting functional layer 20, the projection size of the first light-shielding sub-portion 411 in the first light-shielding portion 41 in the thickness direction X of the display panel can be appropriately increased without affecting the corresponding light output viewing angle of the single light-emitting structure 21, thereby improving the shielding and absorption effect of the light-shielding layer 40 on ambient light, reducing the corresponding power consumption of the display panel, and improving the performance of the display panel.

[0097] In some embodiments, see Figure 8 The display panel further includes a filter layer 70 disposed on a side of the second conductor layer 32 away from the array substrate 10 . The filter layer 70 includes a plurality of filter structures 71 disposed corresponding to the plurality of light emitting structures 21 . Part of the filter structure 71 is located in the first opening K1 .

[0098] The filter layer 70 is a functional film layer for adjusting and controlling light transmission characteristics. The filter layer 70 includes a plurality of filter structures 71. The plurality of filter structures 71 are respectively arranged to overlap with the projections of the plurality of light-emitting structures 21 in the thickness direction X of the display panel. Optionally, the plurality of filter structures 71 may include a red filter structure 71, a green filter structure 71, and a blue filter structure 71. The red filter structure 71 may be arranged corresponding to the red light-emitting structure 21, the green filter structure 71 may be arranged corresponding to the green light-emitting structure 21, and the blue filter structure 71 may be arranged corresponding to the blue light-emitting structure 21.

[0099] The filter structure 71 is usually arranged in the opening structure formed by the light shielding layer 40. In combination with the above content, it can be known that due to the adjustment of the corresponding structure of the second conductor layer 32, the structure of the light shielding layer 40 at different positions will have a certain height difference in the thickness direction X of the display panel. On this basis, the embodiment of the present application also adjusts the structure of the filter structure 71, so that the filter structure 71 not only includes a partial structure at the same height size as the second light shielding portion 42, but also includes a partial structure located in the first opening K1. Specifically, the filter structure 71 includes a first part located at the same height as the second light shielding portion 42 in the thickness direction X of the display panel, and a second part located on the side of the first part 711 facing the array substrate 10, wherein the second part 712 is at least partially located in the first opening K1. Optionally, the second part can also be arranged in contact with the first inorganic encapsulation layer 51.

[0100] In the embodiment of the present application, the structure of the second conductor layer 32 is adjusted so that the light filtering structure 71 is provided with a second part in addition to the first part. The existence of the second part helps to increase the size of the light filtering structure 71 in the thickness direction X of the display panel, thereby improving the filtering effect of the light filtering structure 71 on the light emitted by the light emitting structure 21, thereby improving the display accuracy and viewing experience of the display panel.

[0101] It should be noted that, depending on actual needs and the influence of factors such as the preparation process, the filter structure 71 may only include the first part and the second part, or optionally, the filter structure 71 also includes a third part located on the side of the second shading portion 42 away from the array substrate 10.

[0102] Second, see Fig. 9 An embodiment of the present application provides a display device, which includes the display panel in any of the aforementioned embodiments.

[0103] It should be noted that the display device 300 in the embodiment of the present application can have the beneficial effects of the array substrate and the display panel in any of the aforementioned embodiments. For specific details, please refer to the aforementioned description of the beneficial effects of the array substrate and the display panel, and the embodiment of the present application will not go into details.

[0104] Although the embodiments disclosed in this application are as above, the contents described are only embodiments adopted for facilitating the understanding of this application and are not intended to limit the present invention. Any technician in the technical field to which this application belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in this application, but the scope of protection of this application shall still be subject to the scope defined in the attached claims.

[0105] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the replacement of other connection methods described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel has a first area and a second area arranged around the first area, and the display panel includes: An array substrate; A light-emitting functional layer, disposed on one side of the array substrate, wherein the light-emitting functional layer includes a light-emitting structure located in the first area; a thin film encapsulation layer, located on a side of the light-emitting functional layer away from the array substrate, the thin film encapsulation layer comprising an organic encapsulation layer and a first inorganic encapsulation layer located on a side of the organic encapsulation layer away from the light-emitting functional layer, the first inorganic encapsulation layer covering at least a portion of the structural arrangement of the array substrate in the second area; A first conductor layer is disposed on a side of the first inorganic encapsulation layer away from the light-emitting functional layer and is laminated to the first inorganic encapsulation layer; The light shielding layer is arranged on a side of the first conductor layer away from the array substrate, and a projection of the first conductor layer in a thickness direction of the display panel is located within a projection of the light shielding layer in the thickness direction.

2. The display panel according to claim 1, characterized in that: It also includes a dam structure disposed on a side of the array substrate facing the thin film encapsulation layer and located in the second area, and in a direction parallel to the display panel, the organic encapsulation layer is located on a side of the dam structure facing the first area; The first inorganic encapsulation layer includes a first inorganic portion located on a side of the dam structure facing the first region, and a second inorganic portion located on a side of the dam structure away from the first region, wherein the second inorganic portion covers a portion of the array substrate.

3. The display panel according to claim 2, characterized in that: The array substrate includes a data line, and the second inorganic part covers a portion of the data line.

4. The display panel according to claim 1, characterized in that: The size of the first inorganic encapsulation layer in the thickness direction of the display panel is H, and H satisfies: 0.5 μm≤H≤0.8 μm.

5. The display panel according to claim 1, characterized in that: It also includes a first insulating layer arranged on a side of the first conductor layer away from the array substrate, wherein a projection of the first insulating layer in the thickness direction of the display panel is located within a projection of the first conductor layer in the thickness direction of the display panel.

6. The display panel according to claim 5, characterized in that: It also includes a second conductor layer disposed on a side of the first insulating layer away from the first conductor layer, the first conductor layer includes a first conductive portion, the second conductor layer includes an insulated second conductive portion and a third conductive portion, and the second conductive portion is electrically connected to the first conductive portion; The first insulating layer includes a first sub-portion and a second sub-portion which are spaced apart from each other. The first sub-portion is sandwiched between the first conductive portion and the second conductive portion and is provided with a via structure. The second sub-portion is sandwiched between the first conductive portion and the third conductive portion.

7. The display panel according to claim 5, characterized in that: The first insulating layer includes photoresist.

8. The display panel according to claim 1, characterized in that: It also includes a second conductor layer disposed on a side of the first conductor layer away from the array substrate, and a second insulating layer located on a side of the second conductor layer away from the array substrate; The projection of the second insulating layer in the thickness direction of the display panel is a mesh structure and covers the projection of the second conductor layer in the thickness direction of the display panel.

9. The display panel according to claim 8, characterized in that: The second insulating layer includes a third sub-portion and a fourth sub-portion which are connected to each other. The third sub-portion is arranged to cover the second conductor layer, and the fourth sub-portion is arranged on the outer peripheral side of the conductor structure in the second conductor layer.

10. The display panel according to any one of claims 5 to 9, characterized in that: It also includes a second conductor layer disposed on a side of the first conductor layer away from the array substrate, the second conductor layer enclosing a plurality of first openings; The light shielding layer is partially located in the first opening.

11. The display panel according to claim 10, characterized in that: The light-shielding layer includes a first light-shielding portion and a second light-shielding portion which are connected to each other, wherein a projection of the first light-shielding portion in the thickness direction of the display panel is located within a projection of the first opening in the thickness direction of the display panel, and the second light-shielding portion covers the first conductor layer and the second conductor layer, and a portion of the first light-shielding portion is located on a side of the second light-shielding portion close to the array substrate.

12. The display panel according to claim 10, characterized in that: It also includes a filter layer disposed on a side of the second conductor layer away from the array substrate, the filter layer including a plurality of filter structures disposed corresponding to the plurality of light-emitting structures; The light filtering structure is partially located in the first opening.

13. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 12.

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