Display device and method for manufacturing display device

Abstract

A display device and a method for manufacturing the same are provided, the display device including: a second substrate corresponding to a main area, a pad area, and a bending area between the main area and the pad area; a first substrate at the main region and the pad region, and under the second substrate; and a display element layer at the main area and over the second substrate, in which the first substrate includes: a first sub-substrate overlapping the main area and including a first surface adjacent to the second substrate, a second surface opposite to the first surface, and a first side directed toward the bending area; and a second sub-substrate spaced apart from the first sub-substrate and overlapping the pad region, in which a first tilt angle formed by the second surface and the first side surface is an obtuse angle.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0104289 filed in the Korean Intellectual Property Office on August 9, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a display device and a method for manufacturing the display device. Background Art

[0003] As the information age develops, the demand for display devices for displaying images has increased in various forms. The display device may be a flat panel display device such as a liquid crystal display device, a field emission display device, and a light emitting display device.

[0004] The display device includes a display area displaying an image and a non-display area near the display area (eg, the non-display area surrounding the display area). Recently, in order to increase the immersion of the display area and enhance the aesthetics of the display device, the width of the non-display area has been gradually reduced.

[0005] Meanwhile, in the manufacturing process of the display device, the display device may be formed by cutting the mother substrate along cutting lines located at edges of the plurality of display cells DPC formed in the mother substrate. Summary of the invention

[0006] Aspects of the present disclosure provide a display device and a method for manufacturing the display device in which etching by-products and etching spread generated during etching of a substrate are reduced or minimized.

[0007] Aspects of the present disclosure are not limited to the above-mentioned aspects, and additional aspects of the present disclosure not mentioned here will be clearly understood by those skilled in the art from the following description of the present disclosure.

[0008] According to one or more disclosed embodiments, a display device includes: a second substrate corresponding to a main area, a pad area, and a curved area between the main area and the pad area; a first substrate at the main area and the pad area, and below the second substrate; and a display element layer at the main area and above the second substrate, wherein the first substrate includes: a first sub-substrate overlapping the main area and including a first surface adjacent to the second substrate, a second surface opposite to the first surface, and a first side surface pointing to the curved area; and a second sub-substrate spaced apart from the first sub-substrate and overlapping the pad area, wherein a first inclination angle formed by the second surface and the first side surface is an obtuse angle.

[0009] The second inclination angle formed by the first surface and the first side surface may be an acute angle.

[0010] The first surface and the second surface may extend from the first side.

[0011] The thickness of the first substrate may be about 200 μm.

[0012] The first substrate may not overlap the bending region.

[0013] The second sub-substrate may further include a third surface adjacent to the second substrate and a second side surface directed toward the bending region, wherein a third inclination angle formed by the third surface and the second side surface is an acute angle.

[0014] The first surface and the third surface may be spaced apart from each other by a first interval, wherein the second inclination angle increases as the first interval increases.

[0015] The second inclination angle may be about 42° or more and about 88° or less.

[0016] The first sub-substrate may include an edge surface extending from the second surface while overlapping an end portion of the first substrate, wherein an inclination angle formed by the second surface and the edge surface is an obtuse angle.

[0017] The display device may further include a second side surface connecting the first surface and the first side surface, wherein an undercut is formed between the second substrate and the second side surface.

[0018] An inclination angle formed by the first surface and the second side surface may be an obtuse angle.

[0019] The first side and the second side may extend from each other, wherein the first surface extends from the second side and the second surface extends from the first side.

[0020] An inclination angle formed by the first side surface and the second side surface may be an acute angle.

[0021] The second substrate and the second side surface may form a third inclination angle outside the first sub-substrate, wherein the third inclination angle is inside the undercut and is an acute angle.

[0022] The third inclination angle may be about 14° or more and about 31° or less.

[0023] A length of the undercut in a direction parallel to the second substrate may be greater than a height of the undercut in a direction substantially perpendicular to the second substrate.

[0024] According to one or more disclosed embodiments, a method for manufacturing a display device comprises: forming a display unit on a second mother substrate located on an upper surface of a first mother substrate; forming a cutting line on the first mother substrate and the second mother substrate by irradiating a laser along a boundary of an edge of the display unit; forming a groove on a lower surface of the first mother substrate overlapping with a curved area of ​​the second mother substrate; reducing the thickness of the first mother substrate by spraying an etchant onto the lower surface of the first mother substrate without a mask, and substantially simultaneously removing a portion of the first mother substrate overlapping with the curved area of ​​the second mother substrate along the groove; and forming a second substrate and a first substrate by cutting the first mother substrate and the second mother substrate along the cutting line, wherein the second substrate comprises a first sub-substrate and a second sub-substrate spaced apart from each other, wherein the first sub-substrate further comprises a first side surface pointing to the second sub-substrate and a first inclination angle formed by the first side surface and the first substrate, and wherein the first inclination angle corresponds to the depth of the groove.

[0025] The depth of the groove may be about 0.4 times to about 0.9 times the thickness of the first mother substrate.

[0026] The magnitude of the first inclination angle may increase as the depth of the groove increases.

[0027] The method may further include forming a second inclination angle outside the first sub-substrate through the first side surface and the first substrate, wherein a magnitude of the second inclination angle increases as a depth of the groove increases.

[0028] In the display device and the method for manufacturing the display device according to one or more embodiments, etching by-products generated during etching of a substrate may be suppressed to reduce or minimize etching spread of the substrate.

[0029] Aspects according to embodiments of the present disclosure are not limited to the above-mentioned aspects, and more various effects are included in the following description of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects of the present disclosure will become more apparent by describing in detail embodiments of the present disclosure with reference to the accompanying drawings, in which: Figure 1 is a perspective view showing a display device according to one or more embodiments; Figure 2 is a plan view showing a display panel according to one or more embodiments; Figure 3 is a perspective view showing a display device according to one or more other embodiments; Figure 4 It is shown along Figure 1 A cross-sectional view of the display device taken along line Y1-Y1'; Figure 5 It is shown Figure 4 A cross-sectional view of a state where the display device is bent; Figure 6 It is shown Figure 4 an enlarged cross-sectional view of area "A"; Figure 7 It is shown along Figure 1 Another cross-sectional view of the display device taken along line Y1-Y1'; Figure 8 It is shown Figure 7 an enlarged cross-sectional view of area "C"; Fig. 9 is a flowchart illustrating a method for manufacturing a display device according to one or more embodiments; Figures 10 to 15 is a perspective view illustrating a method for manufacturing a display device according to one or more embodiments; and Figures 16 to 28 are cross-sectional views and graphs illustrating a method for manufacturing a display device according to one or more embodiments. DETAILED DESCRIPTION

[0031] By referring to the detailed description and drawings of the embodiments, it is easier to understand the aspects of some embodiments of the present disclosure and the methods for implementing the embodiments. The described embodiments are provided as examples so that the present disclosure will be thorough and complete, and will fully convey the aspects of the present disclosure to those skilled in the art. Therefore, redundant, irrelevant or unrelated to the description of the embodiments, or processes, elements and techniques that are not necessary for a person of ordinary skill in the art to fully understand the aspects of the present disclosure can be omitted. Unless otherwise stated, throughout the drawings and written descriptions, the same reference numerals, characters or combinations thereof represent the same elements, and therefore, their repeated descriptions can be omitted.

[0032] The described embodiments may have various modifications and may be implemented in different forms, and should not be construed as being limited to the embodiments shown here. The use of "may", "can" or "may not" in describing the embodiments corresponds to one or more embodiments of the present disclosure. The present disclosure encompasses all modifications, equivalents and replacements within the spirit and scope of the present disclosure. In addition, each of the features of the various embodiments of the present disclosure may be combined with each other in part or in whole, and various interlocks and drives are technically possible. Each embodiment may be implemented independently of one another, or may be implemented together in association.

[0033] In the drawings, the relative sizes of elements, layers, and regions may be exaggerated for clarity and / or descriptive purposes. In addition, the use of cross-hatching and / or shading in the drawings is generally provided to make the boundaries between adjacent elements clear. As such, unless otherwise specified, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for a specific material, material property, size, ratio, commonality between the elements shown, and / or any other characteristic, attribute, property, etc. of an element.

[0034] Various embodiments are described herein with reference to cross-sectional views of schematic diagrams of embodiments and / or intermediate structures. Thus, variations in the shape of the diagrams caused by, for example, manufacturing techniques and / or tolerances will be expected. In addition, for the purpose of describing embodiments according to the concepts of the present disclosure, the specific structural or functional descriptions disclosed herein are merely illustrative. Therefore, the embodiments disclosed herein should not necessarily be interpreted as being limited to the shapes of the specifically illustrated elements, layers, or regions, but will include deviations in shape caused by, for example, manufacturing.

[0035] For example, an implanted region illustrated as a rectangle will, typically, have rounded or curved features and / or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place.

[0036] For ease of explanation, spatial relative terms such as "under...", "below...", "lower part", "on the lower side of...", "below...", "above...", "upper part", "on the upper side of...", etc. may be used here to describe the relationship between one element or feature and another element (or elements) or feature (or features) as shown in the drawings. It will be understood that in addition to the orientation depicted in the drawings, the spatial relative terms are also intended to include different orientations of the device in use or operation. For example, if the device in the drawings is turned over, the element described as "under", "under" or "below" other elements or features will then be positioned as "above" the other elements or features. Therefore, the example terms "under..." and "under..." can include both upper and lower orientations. The device can be oriented otherwise (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptors used here should be interpreted accordingly. Similarly, when a first component is described as being arranged "on" a second component, this means that the first component is arranged at the upper or lower side of the second component, and is not limited to the upper side of the second component based on the direction of gravity.

[0037] In addition, the phrase "in a plan view" means when viewing the object portion from above, and the phrase "in a schematic cross-sectional view" means when viewing a schematic cross-section taken by vertically cutting the object portion from the side. The term "superimposed" or "superimposed" means that the first object can be above or below or on the side of the second object, and vice versa. In addition, as will be appreciated and understood by those of ordinary skill in the art, the term "superimposed" may include stacking, facing or facing, extending on ..., covering or partially covering or any other suitable term. The expression "non-superimposed" may include the meaning of any other suitable equivalent such as "away from" or "separated" or "deviation" and those of ordinary skill in the art will appreciate and understand. The terms "facing" and "facing" may mean that the first object may be directly or indirectly opposite to the second object. In the case where the third object is between the first object and the second object, although still facing each other, the first object and the second object may be understood to be indirectly opposite to each other.

[0038] It will be understood that when an element, layer, region, or component is referred to as being "formed on," "on," "connected to," or "(operably or communicatively) coupled to" another element, layer, region, or component, the element, layer, region may be formed directly on, directly on, directly connected to, or directly coupled to the other element, layer, region, or component, or indirectly formed on, indirectly on, indirectly connected to, or indirectly coupled to the other element, layer, region, or component, such that one or more intervening elements, layers, regions, or components may be present. Additionally, this may be collectively referred to as direct or indirect coupling or connection, and integral or non-integral coupling or connection. For example, when a layer, region, or component is referred to as being "electrically connected" or "electrically coupled" to another layer, region, or component, the layer, region, or component may be directly electrically connected or coupled to the other layer, region, and / or component, or there may be one or more intervening layers, regions, or components. The one or more intervening components may include switches, resistors, capacitors, etc. When describing embodiments, unless explicitly described as being directly connected, the description of the connection indicates an electrical connection, and "directly connected / directly coupled" or "directly on..." means that one component is directly connected or coupled to another component, or is on another component, without intervening components.

[0039] In addition, in this specification, when a part of a layer, film, region, plate, etc. is formed on another part, the formation direction is not limited to the upper direction, but includes forming the part on the side surface or in the lower direction. On the contrary, when a part of a layer, film, region, plate, etc. is formed "below" another part, this includes not only the case where the part is "directly below" the other part, but also the case where there is another part between the part and the other part. At the same time, other expressions describing the relationship between components (such as "between...", "directly between..." or "adjacent to..." and "directly adjacent to...") can be similarly interpreted. It will also be understood that when an element or layer is referred to as "between" two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or intervening layers may also be present.

[0040] For the purposes of this disclosure, expressions such as "at least one of..." or "any one of..." or "one or more of...", when following a list of elements, modify the entire list of elements without modifying the individual elements in the list. For example, "at least one of X, Y, and Z" and "at least one of the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, or any variation thereof, such as XYZ, XY, YZ, and XZ as examples. Similarly, the expression "at least one of A and B" can include A, B, or A and B. As used herein, "or" generally means "and / or", and the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, the expression "A and / or B" can include A, B, or A and B. Similarly, when expressions such as “at least one of,” “a plurality of,” or “one of,” when preceding or following a list of elements, such expressions modify the entire list of elements and do not modify the individual elements of the list.

[0041] It will be understood that, although the terms "first", "second", "third", etc. can be used here to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms do not correspond to a specific order, position or superiority, and are only used to distinguish an element, member, component, region, area, layer, section or part from another element, member, component, region, area, layer, section or part. Therefore, without departing from the spirit and scope of the present disclosure, the first element, first component, first region, first layer or first part described below can be referred to as the second element, second component, second region, second layer or second part. Describing an element as a "first" element may not require or imply the presence of a second element or other elements. The terms "first", "second", etc. can also be used here to distinguish elements of different categories or groups. For simplicity, the terms "first", "second", etc. can respectively represent "first category (or first group)", "second category (or second group)", etc.

[0042] In the example, the X-axis, Y-axis and / or Z-axis are not limited to the three axes of the rectangular coordinate system, and can be interpreted in a broader sense. For example, the X-axis, Y-axis and Z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. The same description applies to the first direction, the second direction and / or the third direction.

[0043] The terms used herein are only for the purpose of describing the embodiments and are not intended to be limitations of the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular "one" and "a (kind / person)" are also intended to include plural forms. It will also be understood that when the terms "include", "have", "include" and / or its variations are used in this specification, the stated features, wholes, steps, operations, elements and / or components are indicated, but the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their groups are not excluded.

[0044] When one or more embodiments can be implemented differently, a specific process order can be performed in a different order than described. For example, two processes described in succession can be performed substantially simultaneously or in an order opposite to the described order.

[0045] As used herein, the terms "substantially", "about", "approximately", and other similar terms are used as approximate terms rather than as terms of degree, and are intended to account for the inherent deviations of measured or calculated values ​​that one of ordinary skill in the art would recognize. For example, "substantially" may include a range of + / -5% of the corresponding value. As used herein, "about" or "approximately" includes the stated value and means: within the acceptable deviation range of the specific value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value. In addition, when describing embodiments of the present disclosure, the use of "may" refers to "one or more embodiments of the present disclosure".

[0046] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It will also be understood that terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context (background) of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0047] Figure 1 is a perspective view showing a display device 10 according to one or more embodiments. Figure 2 is a plan view illustrating a display panel 100 and a display driver 200 according to one or more embodiments.

[0048] Reference Figure 1 and Figure 2 The display device 10 according to one or more embodiments is a device that displays moving images or still images, and can be used as a display screen of various products such as televisions, laptop computers, monitors, billboards, and devices for the Internet of Things (IoT), and portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), smart watches, watch phones, mobile communication terminals, electronic diaries, electronic books, portable multimedia players (PMPs), navigators, and ultra mobile PCs (UMPCs).

[0049] The display device 10 according to one or more embodiments may be a light-emitting display device (such as an organic light-emitting display device using an organic light-emitting diode, a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including an inorganic semiconductor, and a micro light-emitting display device or a nano light-emitting display device using a micro light-emitting diode or a nano light-emitting diode (micro-LED or nano-LED)). The following description will be made based on that the display device 10 is an organic light-emitting display device, but the present disclosure is not limited thereto.

[0050] The display device 10 according to one or more embodiments may include a display panel 100 , a display driver 200 , and a circuit board 300 .

[0051] The display panel 100 may be formed in a rectangular plane having a long side in a first direction (X-axis direction) and a short side in a second direction (Y-axis direction) intersecting the first direction (X-axis direction). A corner where the long side in the first direction (X-axis direction) meets the short side in the second direction (Y-axis direction) may be formed as a right angle, or may be rounded to have a curvature. The planar shape of the display panel 100 is not limited to a rectangular shape, and may be formed in other polygonal shapes, a circular shape, or an elliptical shape.

[0052] Here, the first direction (X-axis direction) and the second direction (Y-axis direction) are horizontal directions and intersect each other. For example, the first direction (X-axis direction) and the second direction (Y-axis direction) may be orthogonal to each other. In addition, the third direction (Z-axis direction) may be a vertical direction that intersects (e.g., is orthogonal to) the first direction (X-axis direction) and the second direction (Y-axis direction). In the present disclosure, the direction indicated by the arrows from the first direction to the third direction (X-axis direction, Y-axis direction, Z-axis direction) may be referred to as one side, and the opposite direction thereof may be referred to as the other side.

[0053] The display panel 100 may be formed to be flat, but is not limited thereto. For example, the display panel 100 may include curved portions formed at the left and right ends and having a constant curvature or a varying curvature. In addition, the display panel 100 may be flexibly formed to bend, bend, fold, or curl.

[0054] The display panel 100 may include a main area MA, a bending area BA, and a pad area PDA. The main area MA may include a display area DA for displaying an image and a non-display area NDA located near the display area DA.

[0055] The display area DA may occupy most of the area of ​​the display panel 100. The display area DA may be located at the center of the display panel 100. Pixels each including a plurality of light emission areas may be located in the display area DA to display an image.

[0056] The non-display area NDA may be adjacent to the display area DA. The non-display area NDA may be an outer area of ​​the display area DA. The non-display area NDA may surround the display area DA (eg, in a plan view). The non-display area NDA may be an edge area of ​​the display panel 100.

[0057] The bending area BA may be located between the main area MA and the pad area PDA in the second direction (Y-axis direction). The bending area BA may be an area bent toward the lower portion of the display panel 100. When the bending area BA is bent toward the lower portion of the display panel 100, the plurality of display drivers 200 and the circuit board 300 may be located at the lower portion of the display panel 100 in the third direction (Z-axis direction).

[0058] The pad area PDA may be a lower edge area of ​​the display panel 100. The pad area PDA may be an area in which a display pad PD connected to the circuit board 300 and connected to the display driver 200 is located. The display pad PD may be located at one side edge of the display panel 100. For example, the display pad PD may be located at the lower edge of the display panel 100.

[0059] The display driver 200 may generate a data voltage, a power voltage, a scan timing signal, etc. The display driver 200 may output a data voltage, a power voltage, a scan timing signal, etc. Each of the display drivers 200 may be attached to the non-display area NDA of the display panel 100 in a chip on glass (COG) scheme. In one or more other embodiments, each of the display drivers 200 may be attached to the circuit board 300 in a chip on plastic (COP) scheme.

[0060] The circuit board 300 may be located on the display pad PD positioned at one side edge of the display panel 100. The circuit board 300 may be attached to the display pad PD by using a conductive adhesive member such as an anisotropic conductive film and an anisotropic conductive adhesive. Thus, the circuit board 300 may be electrically connected to the signal line of the display panel 100. The circuit board 300 may be a flexible printed circuit board or a flexible film such as a chip on film.

[0061] Figure 3 is a perspective view showing a display device 11 according to one or more other embodiments.

[0062] Reference Figure 3 , refer to Figure 3 The shape of the display panel 100 described above may be the same as that of the Figure 1The shape of the display panel 100 described is different. In detail, the length of the main area MA in the first direction (X-axis direction) may be longer than the lengths of the bending area BA and the pad area PDA in the first direction (X-axis direction). The bending area BA and the pad area PDA may have a shape protruding from one side of the main area MA. The shape of the display panel 100 is not limited to Figure 1 and Figure 3 The shapes shown in , and various shapes can be applied to it.

[0063] Figure 4 It is shown along Figure 1 A cross-sectional view of the display device 10 taken along line Y1 - Y1 ′.

[0064] Reference Figure 4 The display device 10 may include a display panel 100 , a polarizing film 190 , and a cover window 500 , and the display panel 100 may include a first substrate 110 , a second substrate 112 , a display element layer 150 , a thin film encapsulation layer 170 , a touch sensor layer 180 , and a bending protection layer 450 .

[0065] The first substrate 110 may be made of a light-transmitting and rigid material. For example, the first substrate 110 may be a glass substrate or a plastic substrate. The first substrate 110 may be made of ultra-thin glass (UTG) having a thickness of about 200 μm or less.

[0066] In some embodiments, a portion of the first substrate 110 overlapping the bending area BA may be etched during the manufacturing process to ensure the formation of the bending area BA and support the second substrate 112. Therefore, the first substrate 110 may be divided into a first sub-substrate 110a and a second sub-substrate 110b. The first sub-substrate 110a and the second sub-substrate 110b may be spaced apart from each other while exposing the bending area BA. The first sub-substrate 110a may overlap the main area MA, and the second sub-substrate 110b may overlap the pad area PDA.

[0067] In some embodiments, the first substrate 110 may include end portions EG at both ends in the second direction (Y-axis direction). The first substrate 110 may include an edge surface eg1 overlapping the end portions EG and on a surface opposite to a surface directed toward the second substrate 112. In detail, the second sub-substrate 110b may include an edge surface eg1 overlapping the end portions EG on one side in the second direction (Y-axis direction), and the first sub-substrate 110a may include an edge surface eg1 overlapping the end portions EG on the other side in the second direction (Y-axis direction). The edge surface eg1 may be an inclined surface. This may be caused by the manufacturing process of the display device 10 including a laser process and an etching process, which will be described in detail later.

[0068] The second substrate 112 may be made of a polymer resin having a soft material. For example, the second substrate 112 may have a thickness of approximately 20 μm. The second substrate 112 may be formed of an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0069] The display element layer 150 may be positioned on the second substrate 112 and may overlap the display area DA of the main area MA. The display element layer 150 is a layer for displaying an image, may include a light emitting layer for emitting light, and may include a plurality of signal lines.

[0070] The thin film encapsulation layer 170 may be located on the display element layer 150. The thin film encapsulation layer 170 may reduce or prevent oxygen or moisture from penetrating into the display element layer 150. The thin film encapsulation layer 170 may include at least one inorganic film and one organic film. The organic film of the thin film encapsulation layer 170 may protect the display element layer 150 from particles such as dust.

[0071] The touch sensor layer 180 may be located on the thin film encapsulation layer 170. The touch sensor layer 180 may include sensor electrodes. The touch sensor layer 180 may sense a user's touch by using the sensor electrodes.

[0072] The polarizing film 190 may be located on the display panel 100 to reduce external light reflection. The polarizing film 190 may include a first base member, a linear polarizing plate, a phase retardation film such as a quarter wavelength (λ / 4) plate, and a second base member. The first base member, the phase retardation film, the linear polarizing plate, and the second base member of the polarizing film 190 may be sequentially stacked on the display panel 100.

[0073] The cover window 500 may be located on the polarizing film 190. The cover window 500 may be attached to the polarizing film 190 by a transparent adhesive member such as an optically clear adhesive (OCA).

[0074] The bending protection layer 450 may be positioned on the second substrate 112 by overlapping the bending area BA. When the display panel 100 is bent, the bending protection layer 450 may protect a lower structure overlapping the bending area BA.

[0075] The bending protection layer 450 may include a synthetic resin. For example, the bending protection layer 450 may include at least one of acrylonitrile butadiene styrene copolymer (ABS), urethane acrylate (UA), polyurethane (PU), polyethylene (PE), ethylene vinyl acetate (EVA), and polyvinyl chloride (PVC).

[0076] The display driver 200 and the circuit board 300 may be positioned on the second substrate 112 by overlapping with the pad area PDA. The display driver 200 may be positioned between the bending protection layer 450 and the circuit board 300. The display driver 200 may be spaced apart from the bending protection layer 450 and the circuit board 300. One side of the circuit board 300 may be positioned not to overlap with the second substrate 112, and the other side of the circuit board 300 may be positioned to contact with the second substrate 112.

[0077] Figure 5 It is shown Figure 4 A cross-sectional view of a state in which the display device 10 is bent.

[0078] Reference Figure 5 , a portion of the display device 10 may be bent through the bending area BA. When the display device 10 is bent, the pad area PDA of the display device 10 may overlap the main area MA in the third direction (Z-axis direction). In addition, when the display device 10 is bent, the first sub-substrate 110a and the second sub-substrate 110b may overlap each other in the third direction (Z-axis direction).

[0079] Figure 6 It is shown Figure 4 An enlarged cross-sectional view of area "A" is shown in FIG.

[0080] Reference Figure 6 , the first sub-substrate 110a may include an upper surface a1, a lower surface a2, and a first side surface e1. The upper surface a1 of the first sub-substrate 110a may be a surface in contact with the second substrate 112, and the lower surface a2 of the first sub-substrate 110a may be a surface opposite to the upper surface a1. The first side surface e1 of the first sub-substrate 110a may be positioned toward the bending area BA, and the upper surface a1 and the lower surface a2 may extend from the first side surface e1.

[0081] In some embodiments, the first side surface e1 included in the first sub-substrate 110a may be an inclined surface. In detail, a first inclination angle θ formed by the first side surface e1 and the upper surface a1 of the first sub-substrate 110a is e1 The second inclination angle θ formed by the first side surface e1 and the lower surface a2 of the first sub-substrate 110a may be an acute angle. e2 Can be an obtuse angle.

[0082] In some embodiments, the second sub-substrate 110b of the display device 10 may include an upper surface b1 adjacent to the second substrate 112 and a lower surface b2 opposite to the upper surface b1. The second side surface e3 of the second sub-substrate 110b may extend between the upper surface b1 and the lower surface b2 of the second sub-substrate 110b. The second side surface e3 of the second sub-substrate 110b may be an inclined surface. In detail, the first inclination angle θ formed by the second side surface e3 of the second sub-substrate 110b and the upper surface b1 is e3 The second inclination angle θ formed by the second side surface e3 and the lower surface b2 of the second sub-substrate 110b may be an acute angle. e4 Can be an obtuse angle.

[0083] In some embodiments, the first inclination angle θ formed by the first side surface e1 and the upper surface a1 of the first sub-substrate 110a may be adjusted by a groove forming process and an etching process in the manufacturing process of the display device 10. e1 and a first inclination angle θ formed by the second side surface e3 and the upper surface b1 of the second sub-substrate 110b. e3 The size of . This will be described in detail later.

[0084] Figure 7 It is shown along Figure 1 Another cross-sectional view of the display device 30 taken along line Y1 - Y1 ′. Figure 8 It is shown Figure 7 An enlarged cross-sectional view of area "C" is shown in FIG.

[0085] Reference Figure 7 and Figure 8 The first sub-substrate 110a of the display device 30 may include an upper surface a1, a lower surface a2, and a side surface a3. The side surface a3 of the first sub-substrate 110a may be positioned toward the bending area BA, and the upper surface a1 and the lower surface a2 may extend from the side surface a3 of the display device 30.

[0086] One or more embodiments described herein may differ from the above-described embodiments in that the side surface a3 of the first sub-substrate 110a includes a first inclined surface s1 connected to the upper surface a1 and a second inclined surface s2 connected to the lower surface a2. A first inclination angle θ formed by the upper surface a1 of the first sub-substrate 110a and the first inclined surface s1 is a1 and a second inclination angle θ formed by the lower surface a2 of the first sub-substrate 110a and the second inclined surface s2 a2 Can be an obtuse angle.

[0087] In addition, the first inclined surface s1 and the second inclined surface s2 may extend toward each other, and a third inclined angle θ formed by the first inclined surface s1 and the second inclined surface s2 may be equal to or greater than a third inclined angle θ. s1It can be an acute angle, but the present disclosure is not limited thereto. The third inclination angle θ s1 An obtuse angle depending on the shape of an undercut UC to be described later may be included.

[0088] In some embodiments, the second sub-substrate 110b of the display device 30 may include an upper surface b1, a lower surface b2, and a side surface b3 directed toward the bending area BA. The upper surface b1 of the second sub-substrate 110b may be a surface in contact with the second substrate 112, and the lower surface b2 of the second sub-substrate 110b may be a surface opposite to the upper surface b1. The side surface b3 of the second sub-substrate 110b may be positioned toward the bending area BA, and may be a surface connecting the upper surface b1 of the second sub-substrate 110b with the lower surface b2.

[0089] The side surface b3 of the second sub-substrate 110b may include a first inclined surface s3 connected to the upper surface b1 and a second inclined surface s4 connected to the lower surface b2. A first inclined angle θ formed by the upper surface b1 of the second sub-substrate 110b and the first inclined surface s3 is b1 and a second inclination angle θ formed by the lower surface b2 of the second sub-substrate 110b and the second inclined surface s4 b2 In addition, the first inclined surface s3 and the second inclined surface s4 may extend toward each other, and a third inclined angle θ formed by the first inclined surface s3 and the second inclined surface s4 may be s3 It can be an acute angle, but the present disclosure is not limited thereto. The third inclination angle θ s3 An obtuse angle depending on the shape of an undercut UC to be described later may be included.

[0090] like Figure 8 As shown in FIG, an undercut UC may be formed between the first inclined surface s1 of the first sub-substrate 110a and the second substrate 112 and between the first inclined surface s3 of the second sub-substrate 110b and the second substrate 112. As will be described in detail later, the shape of the undercut UC may be changed by a groove forming process and an etching process in a manufacturing process of the display device 30.

[0091] The display device 30 described here and the display device 10 included in the above one or more embodiments are the same as each other in that they can be formed by an etching process in a manufacturing process, and a portion of the first substrate 110 is etched to be removed due to overlapping with the bending area BA. However, depending on the type of etchant and variable factors of the etching process, the shapes of the first sub-substrate 110a and the second sub-substrate 110b directed to the bending area BA can be formed differently in the display device 30 included in the present embodiment and the display device 10 included in one or more embodiments.

[0092] Fig. 9is a flowchart illustrating a method for manufacturing a display device according to one or more embodiments. Figures 10 to 15 is a perspective view illustrating a method for manufacturing a display device according to one or more embodiments. Figures 16 to 28 are cross-sectional views and graphs illustrating a method for manufacturing a display device according to one or more embodiments. Fig.16 and Fig.17 It is shown along Fig.10 A cross-sectional view of the display device taken along line S1-S1'; Fig.18 It is shown along Fig.11 A cross-sectional view of the display device taken along line S3-S3'; Fig.19 It is shown along Fig.12 A cross-sectional view of the display device taken along line S4-S4'; Fig. 20 It is shown along Fig.12 A cross-sectional view of the display device taken along line Y4-Y4'; Fig.21 , Fig. 22 and Fig.25 It is shown along Fig.13 A cross-sectional view of the display device taken along line Y5-Y5'.

[0093] In a method for manufacturing a display device according to one or more embodiments, first, as Fig.10 and Fig.16 As shown in FIG. 1 , a plurality of display cells DPC ( Fig. 9 S100 ). The first thickness T0 of the first mother substrate M110 may be about 500 μm.

[0094] Reference Fig.10 and Fig.16 The mother substrate SUB may include a first surface US and a second surface BS facing the first surface US. The display unit DPC located on the first surface US of the mother substrate SUB may include a first mother substrate M110, a second mother substrate M112, a display element layer 150, a thin film encapsulation layer 170, and a touch sensor layer 180.

[0095] Second, if Fig.17 As shown in FIG. 1 , after a plurality of first protective films P1 are attached to a plurality of display units DPC, the plurality of display units DPC are tested ( Fig. 9 S200).

[0096] The first protective film layer is attached to cover the first surface US of the mother substrate SUB located between the plurality of display units DPC. Then, when the portion of the first protective film layer located on the mother substrate SUB is removed, the plurality of first protective films P1 can be located on the plurality of display units DPC, respectively. That is, Fig.17 The first protective film P1 shown in the figure may be a portion remaining after the first protective film layer is partially removed. Therefore, a plurality of first protective films P1 may be respectively located on a plurality of display units DPC. In other words, a plurality of first protective films P1 may correspond one-to-one to a plurality of display units DPC. The plurality of first protective films P1 may be a buffer film for protecting the plurality of display units DPC from external impacts. The plurality of first protective films P1 may be made of a transparent material.

[0097] Then, the plurality of display cells DPC are tested using the test device. The test method may include connecting probes to a plurality of test pads respectively provided in the plurality of display cells DPC, and then performing a lighting test for each of the plurality of display cells DPC.

[0098] As an example, in the case where a lighting test is performed after a plurality of display cells DPC are separated from a mother substrate SUB by a cutting process, an additional process of removing a plurality of test pads after the lighting test is finished is required. In contrast, in the case where a lighting test is performed on a mother substrate SUB, a plurality of test pads may be removed when a plurality of display cells DPC are subsequently separated from the mother substrate SUB by laser irradiation and etching. Therefore, when a lighting test is performed on a mother substrate SUB, a separate additional process is not required to remove a plurality of test pads.

[0099] Third, refer to Fig.11 and Fig.18 , irradiating the laser LR onto the first surface US of the mother substrate SUB to form a cutting line CL along the edges of the plurality of display units DPC ( Fig. 9 S300).

[0100] According to one or more embodiments, various lasers may be used as the laser LR. In an example of the present disclosure, the laser LR is an infrared Bessel beam having a wavelength of about 1030 nm.

[0101] like Fig.18 As shown in , laser LR may be irradiated onto the first surface US of the mother substrate SUB, but the embodiments of the present disclosure are not limited thereto. Laser LR may be irradiated onto the second surface BS of the mother substrate SUB. Cutting holes may be formed in the plurality of first laser irradiation regions CH1 irradiated with laser LR. The cutting holes may be designated as blind holes and may be formed as a plurality of cutting holes.

[0102] The cutting line CL may be defined as a virtual line connecting the plurality of first laser irradiation regions CH1. The cutting line CL may be formed by irradiating the laser LR to form the plurality of first laser irradiation regions CH1 along the edges of the plurality of display cells DPC.

[0103] The single-side tolerance SE2 of laser LR may be within about 50 μm, and the double-side tolerance of laser LR may be within about 100 μm. The single-side tolerance SE2 of laser LR may be a cutting error in one direction (eg, X-axis direction) when forming a plurality of first laser irradiation regions CH1 by laser LR.

[0104] Fourth, refer to Fig.12 , Fig.19 and Fig. 20 , attaching a second protective film P2 on the plurality of first protective films P1, and forming a groove GRV ( Fig. 9 S400).

[0105] like Fig.19 As shown in , a second protective film P2 may be attached to the plurality of first protective films P1 and the exposed mother substrate SUB not covered by the plurality of first protective films P1. Therefore, the second protective film P2 may cover the first laser irradiation area CH1. The second protective film P2 may be an acid-resistant film for protecting the plurality of display cells DPC from the etchant in the etching process of the mother substrate SUB to be performed in the next step.

[0106] Next, a groove GRV may be formed on the second surface BS of the mother substrate SUB. In detail, the groove GRV may be formed on the second surface BS of the mother substrate SUB overlapping the bending area BA by using a blade BLD. The blade BLD may advance from one side of the mother substrate SUB in the first direction (X-axis direction) to the other side of the mother substrate SUB.

[0107] Thus, a groove line GL may be formed on the second surface BS of the mother substrate SUB. The groove line GL may be formed by connecting a plurality of grooves GRV.

[0108] like Fig. 20 As shown in , the groove GRV may include a depth TGR1 and a width WGR1. For example, the depth TGR1 of the groove GRV may be about 0.4 times or more and about 0.9 times or less of the first thickness T0 of the first mother substrate M110. For example, when the first thickness T0 of the first mother substrate M110 is about 500 μm, the depth TGR1 of the groove GRV may be adjusted in the range of about 200 μm to about 450 μm. The width WGR1 of the groove GRV may be in the range of about 900 μm to about 920 μm.

[0109] The cross-sectional shape of the groove GRV is shown as a rectangle in the drawings, but is not limited thereto. For example, the cross-sectional shape of the groove GRV may be a polygon such as a triangle or a trapezoid, or may include a curve such as a "U" shape.

[0110] Fifth, refer to Fig.13 , Fig.14 , Fig.21 , Fig. 22 , Fig.23 and Fig.24 , the etchant ECH may be sprayed onto the second surface BS of the mother substrate SUB without a separate mask to reduce the thickness of the first mother substrate M110 and simultaneously remove a portion of the first mother substrate M110 overlapping the bending area BA. In addition, the mother substrate SUB may be cut along the plurality of first laser irradiation areas CH1 ( Fig. 9 S500).

[0111] like Fig.13 , Fig.21 and Fig. 22 As shown in , since the first mother substrate M110 is etched without a separate mask in the etching process, an isotropic etching process in which all regions of the second surface BS of the mother substrate SUB are substantially uniformly etched can be performed. Therefore, the mother substrate SUB can be reduced from the first thickness T0 to the second thickness T1.

[0112] However, when the etchant ECH is sprayed onto the second surface BS of the mother substrate SUB, the etching rate of the region where the first laser irradiation region CH1 is formed may be higher than the etching rate of the other first mother substrate M110 not irradiated with the laser. That is, anisotropic etching in which the etching rate in the region where the first laser irradiation region CH1 is formed is faster than the etching rate in the region where the first laser irradiation region CH1 is not formed may be performed. Therefore, when the etchant ECH penetrates into the first laser irradiation region CH1, the first mother substrate M110 may be separated along the cutting line CL, so that each of the plurality of display cells DPC may be separated from the mother substrate SUB.

[0113] Therefore, if Fig. 22 As shown in FIG. 1 , the first mother substrate M110 may be the first substrate 110 , and the second mother substrate M112 may be the second substrate 112 . That is, the first laser irradiation region CH1 may be an end portion EG of the first substrate 110 and the second substrate 112 .

[0114] The first substrate 110 separated from the first mother substrate M110 may include an edge surface eg1 overlapping the end EG of the first substrate 110. The edge surface eg1 may be a result obtained as a result of an etching rate of a portion including the first laser irradiation region CH1 being faster than an etching rate of other first mother substrates M110. In other words, it should be noted that since the edge surface eg1 is included in the end EG of the first substrate 110, the display device 10 or 30 includes the laser irradiation process described above in the manufacturing process.

[0115] An edge surface eg1 may be formed on one side of the lower surface a2 or b2 of the first substrate 110 overlapping the end EG of the first substrate 110, and an inclination angle θ formed by the lower surface a2 or b2 of the first substrate 110 and the edge surface eg1 is eg Can be an obtuse angle.

[0116] Back to Fig.13 , Fig.21 and Fig. 22 , the etching rate of the portion where the groove GRV is physically formed on the second surface BS of the mother substrate SUB may be faster than the etching rate of the second surface BS of the other mother substrate SUB where the groove GRV is not formed. In other words, anisotropic etching may be performed in which the etching rate in the region where the groove GRV is formed is faster than the etching rate in the region where the groove GRV is not formed. Therefore, the first mother substrate M110 overlapping the bent region BA of the mother substrate SUB may be etched and removed, and the first mother substrate M110 in other regions may be etched to the second thickness T1 and remain.

[0117] Therefore, if Fig. 22 As shown in , the first substrate 110 may include a first sub-substrate 110a and a second sub-substrate 110b spaced apart from each other, and the bending area BA is placed between the first sub-substrate 110a and the second sub-substrate 110b. The first sub-substrate 110a may include an upper surface a1 of the first sub-substrate 110a in a direction toward the second substrate 112, and the second sub-substrate 110b may include an upper surface b1 of the second sub-substrate 110b in a direction toward the second substrate 112. The upper surface a1 of the first sub-substrate 110a and the upper surface b1 of the second sub-substrate 110b may be spaced apart from each other by a first interval EW.

[0118] In addition, the first sub-substrate 110a and the second sub-substrate 110b may include a first side surface e1 and a second side surface e3 facing the bending area BA, respectively. The first side surface e1 and the second side surface e3 may be inclined surfaces. In detail, the second substrate 112 and the first side surface e1 of the first sub-substrate 110a may form a first inclination angle θ e1 , and the second side surfaces e3 of the second substrate 112 and the second sub-substrate 110b may form a first inclination angle θ e3 The first inclination angle θ included in the first sub-substrate 110a e1 and a first inclination angle θ included in the second sub-substrate 110b e3 Can be an acute angle.

[0119] In some embodiments, the first interval EW and the first inclination angle θ included in the first sub-substrate 110a e1and a first inclination angle θ included in the second sub-substrate 110b e3 The size of may be adjusted according to the depth TGR1 of the groove GRV during the groove forming process.

[0120] Fig.23 1 is a graph showing the first interval EW and the depth TGR1 of the groove GRV and the inclination angle θ e1 or θ e2 A graph showing the relationship between the depth TGR1 of the groove GRV.

[0121] The X-axis of the graph represents the depth TGR1 of the groove GRV. The depth TGR1 of the groove GRV shown on the X-axis is a value specified for convenience of description and is not limited thereto. That is, the depth TGR1 of the groove GRV may include a range of 200 μm to 450 μm. The Y-axis of the graph shown as “EW [μm]” may represent the first interval EW, and the Y-axis of the graph shown as “θ e1 [°]” The Y axis can represent the first tilt angle θ e1 The width WGR1 of the groove GRV may remain substantially uniform.

[0122] As shown in the graph, as the depth TGR1 of the groove GRV increases, the first interval EW and the first inclination angle θ e1 In detail, when the depth TGR1 of the groove GRV increases within the range of about 200 μm to about 450 μm, the first interval EW may increase within the range of about 1086 μm to about 1568 μm, and when the depth TGR1 of the groove GRV increases within the range of about 200 μm to about 450 μm, the first inclination angle θ e1 The increase may be in the range of about 42° to about 88°.

[0123] In some embodiments, the first interval EW and the first tilt angle θ e1 They can be factors that influence each other, rather than independent factors.

[0124] Fig.24 1 is a graph showing the first interval EW and the first inclination angle θ when the width WGR1 of the groove GRV remains substantially uniform and the depth TGR1 of the groove GRV increases within a range of about 200 μm to about 450 μm. e1 A graph showing the relationship between them.

[0125] As shown in the graph, it is noted that the first tilt angle θ e1 As the first interval EW increases, the first inclination angle θ included in the second sub-substrate 110b increases. e3 may have a smaller or larger inclination angle θ than that included in the first sub-substrate 110a.e1 range (for example, about 1°), and the first inclination angle θ e3 The depth TGR1 of the groove GRV may increase.

[0126] Therefore, even if the width WGR1 of the groove GRV has the same value during the manufacturing process of the display device 10, the first interval EW and the first inclination angle θ included in the first sub-substrate 110a may be adjusted by adjusting the depth TGR1 of the groove GRV. e1 and a first inclination angle θ included in the second sub-substrate 110b e3 That is, the shape of the first substrate 110 can be adjusted.

[0127] Reference Figure 25 to Figure 28 , the first substrate 110 of the display device 30 may form an undercut UC in a direction toward the second substrate 112. Therefore, the first sub-substrate 110a may include a first inclined surface s1 and a second inclined surface s2 toward the bending area BA, and the second sub-substrate 110b may include a first inclined surface s3 and a second inclined surface s4 toward the bending area BA. Depending on the type of etchant, etching process conditions, etc., one or more embodiments described herein may include a shape different from that of one or more embodiments.

[0128] Reference Fig.26 , a third inclination angle θ formed by the first inclined surface s1 and the second inclined surface s2 of the first sub-substrate 110a s1 The first inclination angle θ formed by the upper surface a1 of the first sub-substrate 110a and the first inclined surface s1 may be an acute angle. a1 It may be an obtuse angle. Other repeated descriptions will be omitted.

[0129] The undercut UC formed between the first sub-substrate 110a and the second sub-substrate 112 may include an undercut length L1, an undercut depth H1, and an undercut inclination angle θ us The undercut length L1, the undercut depth H1 and the undercut inclination angle θ can be adjusted according to the depth TGR1 of the groove GRV in the manufacturing process. us The undercut length L1 may be greater than the undercut depth H1.

[0130] Fig. 27 and Fig.28 is a graph showing the relationship between the depth TGR1 of the groove GRV and the shape of the undercut UC. Fig. 27 is a graph showing the correlation between the depth TGR1 of the groove GRV and the undercut length L1 and the undercut depth H1, and Fig.28 is a graph showing the relationship between the depth TGR1 of the groove GRV and the undercut inclination angle θ usA graph of the correlation between .

[0131] Reference Fig. 27 , the X-axis of the graph represents the depth TGR1 of the groove GRV. The depth TGR1 of the groove GRV shown on the X-axis is a value specified for ease of description and is not limited thereto. That is, the depth TGR1 of the groove GRV may include a range of about 200 μm to about 450 μm. The Y-axis of the graph may represent the undercut length L1 and the undercut depth H1. In the graph, the width WGR1 of the groove GRV may remain substantially uniform.

[0132] like Fig. 27 As shown in the graph of , as the value of the depth TGR1 of the groove GRV increases, the undercut length L1 and the undercut depth H1 may increase. In detail, when the depth TGR1 of the groove GRV increases in the range of about 200 μm to about 450 μm, the undercut length L1 may increase in the range of about 17 μm to about 102 μm, and the undercut depth H1 may increase in the range of about 1 μm to about 51 μm.

[0133] Reference Fig.28 , the X-axis of the graph represents the depth TGR1 of the groove GRV, and the Y-axis represents the undercut inclination angle θ us In the graph, the width WGR1 of the groove GRV may remain substantially uniform.

[0134] like Fig.28 As shown in the curve diagram, as the depth TGR1 of the groove GRV increases, the undercut inclination angle θ us In detail, when the depth TGR1 of the groove GRV increases within a range of about 200 μm to about 450 μm, the undercut inclination angle θ us The increase may be in the range of about 14° to about 31°.

[0135] Undercut length L1, undercut depth H1 and undercut inclination angle θ us can be factors that influence each other, rather than independent factors. In detail, the undercut inclination angle θ us As the undercut length L1 and the undercut depth H1 increase, the undercut length L1, the undercut depth H1 and the undercut inclination angle θ can be increased. Therefore, even if the width WGR1 of the groove GRV has the same value, the undercut length L1, the undercut depth H1 and the undercut inclination angle θ can be adjusted by adjusting the depth TGR1 of the groove GRV. us size.

[0136] For ease of description, the undercut UC formed between the second substrate 112 and the first sub-substrate 110 a is shown, but the undercut UC formed between the second substrate 112 and the second sub-substrate 110 b may also have the same shape and characteristics as those shown.

[0137] Sixth, reference Figure 4 , Figure 7 and Fig.15 After the etching process is completed, the second protective film P2 can be removed, and the display driver 200 and the circuit board 300 can be attached to each of the plurality of display units DPC. In addition, after removing the first protective film P1, the curved protective layer 450, the polarizing film 190 and the cover window 500 ( Fig. 9 S600).

[0138] As described above, a physical groove GRV is formed on the first substrate 110 overlapping the bending area BA before the etching process, thereby reducing or minimizing the etching amount of the first substrate 110, and thereby suppressing the generation of etching byproducts. Therefore, defects caused by etching byproducts can be avoided, and the etching distribution of the display device can be substantially uniform. In addition, the depth TGR1 of the above-mentioned groove GRV can be adjusted, so that the shape of the first substrate 110 can be adjusted differently, thereby improving the manufacturing process efficiency of the display device.

[0139] The features of the various disclosed embodiments may be combined in part or in whole. As will be clearly understood by those skilled in the art, various interactions and operations are technically feasible. In addition, the various embodiments may be practiced individually or in combination.

[0140] At the end of the detailed description, it will be appreciated by those skilled in the art that many changes and modifications may be made to the described embodiments without departing substantially from the aspects of the present disclosure. Therefore, the disclosed embodiments of the present disclosure are used in a general and descriptive sense, rather than for the purpose of limitation.

Claims

1. A display device, comprising: a second substrate corresponding to the main region, the pad region, and the bending region between the main region and the pad region; a first substrate at the main region and at the pad region and beneath the second substrate; as well as a display element layer at the main area and above the second substrate, The first substrate includes: a first sub-substrate overlapping the main area and including a first surface adjacent to the second substrate, a second surface opposite to the first surface, and a first side surface directed to the bending area; and a second sub-substrate spaced apart from the first sub-substrate and overlapping the pad area, Wherein, a first inclination angle formed by the second surface and the first side surface is an obtuse angle.

2. The display device according to claim 1, wherein: A second inclination angle formed by the first surface and the first side surface is an acute angle.

3. The display device according to claim 2, wherein: The first surface and the second surface extend from the first side.

4. The display device according to claim 3, wherein: The thickness of the first substrate is 200 μm.

5. The display device according to claim 4, wherein: The first substrate does not overlap the bending region.

6. The display device according to claim 2, wherein: The second sub-base further includes a third surface adjacent to the second base and a second side surface directed toward the bending area, and Wherein, a third inclination angle formed by the third surface and the second side surface is an acute angle.

7. The display device according to claim 6, wherein: The first surface and the third surface are spaced apart from each other by a first interval, and Wherein, the second inclination angle increases as the first interval increases.

8. The display device according to claim 7, wherein: The second inclination angle is 42° or more and 88° or less.

9. The display device according to claim 1, wherein: The first sub-base includes an edge surface extending from the second surface while overlapping an end portion of the first base, and Wherein, the inclination angle formed by the second surface and the edge surface is an obtuse angle.

10. The display device according to claim 1, further comprising a second side surface connecting the first surface and the first side surface, in, An undercut is formed between the second base and the second side.

11. The display device according to claim 10, wherein: An inclination angle formed by the first surface and the second side surface is an obtuse angle.

12. The display device according to claim 10, wherein: The first side and the second side extend from each other, and The first surface extends from the second side surface, and the second surface extends from the first side surface.

13. The display device according to claim 12, wherein: An inclination angle formed by the first side surface and the second side surface is an acute angle.

14. The display device according to claim 10, wherein: The second substrate and the second side surface form a third inclination angle outside the first sub-substrate, Wherein, the third inclination angle is inside the undercut and is an acute angle.

15. The display device according to claim 14, wherein: The third inclination angle is 14° or more and 31° or less.

16. The display device according to claim 10, wherein: A length of the undercut in a direction parallel to the second substrate is greater than a height of the undercut in a direction perpendicular to the second substrate.

17. A method for manufacturing a display device, the method comprising: forming a display unit on a second mother substrate located on an upper surface of the first mother substrate; forming a cutting line on the first mother substrate and the second mother substrate by irradiating a laser along a boundary of an edge of the display unit; forming a groove on a lower surface of the first mother substrate overlapping a bent region of the second mother substrate; reducing the thickness of the first mother substrate by spraying an etchant onto the lower surface of the first mother substrate without a mask, and simultaneously removing a portion of the first mother substrate overlapping the bent region of the second mother substrate along the groove; as well as forming a second substrate and a first substrate by cutting the first mother substrate and the second mother substrate along the cutting line, wherein the second substrate comprises a first sub-substrate and a second sub-substrate spaced apart from each other, The first sub-base further includes a first side surface pointing to the second sub-base and a first inclination angle formed by the first side surface and the first base, and Wherein, the first inclination angle corresponds to the depth of the groove.

18. The method according to claim 17, wherein: The depth of the groove is 0.4 to 0.9 times the thickness of the first mother substrate.

19. The method according to claim 18, wherein: The magnitude of the first inclination angle increases as the depth of the groove increases.

20. The method according to claim 18, further comprising forming a second inclination angle outside the first sub-substrate through the first side surface and the first substrate, in, The magnitude of the second inclination angle increases as the depth of the groove increases.

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