Solid electrolytic capacitor and capacitor array

Abstract

A solid electrolytic capacitor (1) is characterized by comprising: an anode plate (10) having a porous layer (12) on at least one main surface; a dielectric layer (20) provided on the surface of the porous layer (12); a solid electrolyte layer (31) provided on the surface of the dielectric layer (20); a conductor layer (32) provided on the surface of the solid electrolyte layer (31); and an insulating layer (40) provided on the surface of the dielectric layer (20), the insulating layer (40) being provided in a region surrounding the solid electrolyte layer (31) so as to cover at least a portion of an end portion of the solid electrolyte layer (31).

Description

Technical Field

[0001] The present invention relates to solid electrolytic capacitors and capacitor arrays. Background Art

[0002] Patent document 1 discloses a solid electrolytic capacitor built-in substrate, in which a sheet-shaped solid electrolytic capacitor having an anode composed of an aluminum metal layer having a porous portion and a cathode composed of a layer of silver paste is built into an insulating resin, and the surface layer and back layer of the solid electrolytic capacitor built-in substrate are composed of metal layers, the anode is connected to the metal layer of the surface layer and the metal layer of the back layer via a conductive hole, and the cathode is connected to the metal layer of the surface layer by a conductor.

[0003] For example, in Patent Document 1 Figure 1 and Figure 3 In the embodiment, a porous portion 2 made porous by a chemical solution treatment is formed on one side of an anode 1 formed of aluminum, a solid electrolyte layer 5 as a conductive polymer layer is formed in a manner covering the exposed portion of the porous portion 2, and a cathode 6 composed of a layer of silver paste is formed thereon. In the porous portion 2, a dielectric formed of aluminum oxide 16 is formed on the surface of the anode 1, and the anode 1 and the solid electrolyte layer 5 and the anode 1 and the cathode 6 are electrically insulated, forming a solid electrolytic capacitor element. The solid electrolytic capacitor is built in an insulating resin 3, and the surface layer and the back layer are composed of a metal layer 4, and the metal layer 4 is composed of a wiring pattern. The anode 1 is connected to the metal layer 4 of the surface layer and the metal layer 4 of the back layer via a via 8, and the cathode 6 is connected to the metal layer 4 using a conductor 7.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2007-251101 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] Patent document 1 discloses a technique for manufacturing a small and low-impedance electrolytic capacitor by embedding a capacitor in a core substrate. However, when a capacitor is embedded in a core substrate, there is a risk of short circuit when setting a conductive layer, and it is difficult to set a conductive path in a limited conductive layer space, and it is difficult to ensure process plausibility and achieve a fine pattern layout, which is obvious based on the results of research by the inventors of the present invention.

[0009] For example, in Patent Document 1 Figure 1 and Figure 3In the embodiment, the entire surface of the porous portion 2 is covered with a dielectric formed of aluminum oxide 16, but there may be a portion that is not covered with the dielectric due to the accuracy of the manufacturing process. In this case, if the formation range of the cathode 6 is expanded relative to the solid electrolyte layer 5 in order to expand the range in which the conductor 7 equivalent to the via conductor can be provided, there is a risk that the portion of the surface of the porous portion 2 that is not covered with the dielectric contacts the cathode 6 and causes a short circuit.

[0010] In order to reduce the risk of the above-mentioned short circuit, the cathode 6 needs to be provided in a relatively small area. However, in this case, the area where the conductor 7 can be provided is limited.

[0011] As described above, the conventional technology has room for improvement in terms of reducing the risk of short circuit occurrence and ensuring the degree of freedom in the location where the via conductor is provided.

[0012] The present invention has been made to solve the above-mentioned problems, and its object is to provide a solid electrolytic capacitor that reduces the risk of short circuit and can ensure the degree of freedom of the location where the via conductor is provided. In addition, the present invention aims to provide a capacitor array having the above-mentioned solid electrolytic capacitor.

[0013] Solutions for solving problems

[0014] The solid electrolytic capacitor of the present invention is characterized in that the solid electrolytic capacitor includes: an anode plate having a porous layer on at least one main surface; a dielectric layer disposed on the surface of the porous layer; a solid electrolyte layer disposed on the surface of the dielectric layer; a conductor layer disposed on the surface of the solid electrolyte layer; and an insulating layer disposed on the surface of the dielectric layer, wherein the insulating layer is disposed in a region surrounding the solid electrolyte layer in a manner that covers at least a portion of an end portion of the solid electrolyte layer.

[0015] The capacitor array of the present invention is characterized in that the capacitor array includes a plurality of the solid electrolytic capacitors of the present invention.

[0016] Effects of the Invention

[0017] According to the present invention, it is possible to provide a solid electrolytic capacitor that reduces the risk of short circuits and can ensure the degree of freedom of the location where via conductors are provided. In addition, according to the present invention, it is possible to provide a capacitor array having the above-mentioned solid electrolytic capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. 1 is a schematic plan view showing an example of a solid electrolytic capacitor according to Embodiment 1 of the present invention.

[0019] Figure 2 Yes means Figure 11 is a schematic cross-sectional view of an example of a cross section of the solid electrolytic capacitor along line segment A1 - A2 shown.

[0020] Figure 3 A stands for Figure 2 2 is a schematic cross-sectional view of an example of a cross section of the solid electrolytic capacitor along line segment B1 - B2 shown. Figure 3 B stands for Figure 2 2 is a schematic cross-sectional view of another example of the cross section of the solid electrolytic capacitor along the line segment B1 - B2 shown.

[0021] Figure 4 It is a schematic cross-sectional view showing an example of a solid electrolytic capacitor according to a second embodiment of the present invention.

[0022] Figure 5 It is a schematic cross-sectional view showing an example of a solid electrolytic capacitor according to a third embodiment of the present invention.

[0023] Figure 6 It is a schematic cross-sectional view showing an example of a solid electrolytic capacitor according to a fourth embodiment of the present invention.

[0024] Figure 7 It is a schematic cross-sectional view showing an example of a solid electrolytic capacitor according to a fifth embodiment of the present invention.

[0025] Figure 8 It is a schematic cross-sectional view showing an example of a solid electrolytic capacitor according to a sixth embodiment of the present invention.

[0026] Fig. 9 It is a schematic perspective view showing an example of a capacitor array according to a seventh embodiment of the present invention.

[0027] Fig.10 Yes means Fig. 9 FIG. 1 is a schematic cross-sectional view of an example of a cross section of the capacitor array along line segment C1 - C2 shown. DETAILED DESCRIPTION

[0028] The solid electrolytic capacitor of the present invention and the capacitor array of the present invention are described below. In addition, the present invention is not limited to the following structure, and can also be appropriately changed within the scope of the present invention. In addition, a structure formed by combining multiple preferred structures described below is also the present invention.

[0029] The embodiments shown below are examples, and it is self-evident that parts of the structures shown in different embodiments can be replaced or combined. In Embodiment 2 and thereafter, the description of matters common to Embodiment 1 is omitted, and the differences are mainly described. In particular, the same effects produced by the same structure are not mentioned one by one in each embodiment.

[0030] In the following description, when the embodiments are not particularly distinguished, they are simply referred to as "solid electrolytic capacitors of the present invention" and "capacitor arrays of the present invention".

[0031] The following drawings are schematic diagrams, and their dimensions, aspect ratios, etc. may differ from those of actual products. In the drawings, the same reference numerals are used for the same or equivalent parts. In addition, in each drawing, the same reference numerals are marked for the same elements and repeated descriptions are omitted.

[0032] [Implementation Method 1]

[0033] The solid electrolytic capacitor of the present invention comprises: an anode plate having a porous layer on at least one main surface; a dielectric layer disposed on the surface of the porous layer; a solid electrolyte layer disposed on the surface of the dielectric layer; a conductor layer disposed on the surface of the solid electrolyte layer; and an insulating layer disposed on the surface of the dielectric layer. In the solid electrolytic capacitor of the present invention, the insulating layer is disposed in a region surrounding the solid electrolyte layer so as to cover at least a portion of an end portion of the solid electrolyte layer.

[0034] Hereinafter, an example of the solid electrolytic capacitor of the present invention will be described as a solid electrolytic capacitor according to Embodiment 1 of the present invention.

[0035] Figure 1 FIG. 1 is a schematic plan view showing an example of a solid electrolytic capacitor according to Embodiment 1 of the present invention. Figure 2 Yes means Figure 1 1 is a schematic cross-sectional view of an example of a cross section of the solid electrolytic capacitor along line segment A1 - A2 shown.

[0036] Figure 1 and Figure 2 The solid electrolytic capacitor 1 shown includes an anode plate 10 , a dielectric layer 20 , a solid electrolyte layer 31 , a conductor layer 32 , and an insulating layer 40 .

[0037] Anode plate 10 includes core 11 and porous layer 12 .

[0038] In this specification, "plate" also includes "sheet", "foil", "film" and the like, and they are not distinguished based on thickness.

[0039] The core 11 is formed of metal, preferably a valve-acting metal. When the core 11 is formed of a valve-acting metal, the anode plate 10 is also referred to as a valve-acting metal substrate.

[0040] Examples of the valve-acting metal include simple metals such as aluminum, tantalum, niobium, titanium, and zirconium, and alloys containing at least one of these simple metals. Among them, aluminum or an aluminum alloy is preferred.

[0041] The porous layer 12 is provided on at least one main surface of the core 11. That is, the porous layer 12 may be provided on only one main surface of the core 11, or may be provided on a plurality of main surfaces of the core 11. Figure 2 As shown, the porous layer 12 is provided on both main surfaces of the core 11. In this way, the anode plate 10 has the porous layer 12 on at least one main surface. As a result, the surface area of ​​the anode plate 10 is increased, so that the capacity of the solid electrolytic capacitor 1 is easily increased.

[0042] It is preferable that the porous layer 12 is an etching layer formed by etching the surface of the anode plate 10 .

[0043] The shape of the anode plate 10 is preferably a flat plate, and more preferably a foil. As mentioned above, in this specification, "plate-like" also includes "foil-like". In addition, in this specification, "plate-like" also includes "sheet-like", "film-like", etc.

[0044] The dielectric layer 20 is provided on the surface of the porous layer 12. Although shown in simplified form in the drawings, more specifically, the dielectric layer 20 is provided along the surface (contour) of each pore present in the porous layer 12.

[0045] Preferably, the dielectric layer 20 is composed of an oxide film of the valve metal described above. For example, when the anode plate 10 is an aluminum foil, the anode plate 10 is subjected to an anodic oxidation treatment (also referred to as a chemical conversion treatment) in an aqueous solution containing ammonium adipate or the like, thereby forming an oxide film as the dielectric layer 20. The dielectric layer 20 is formed along the surface of the porous layer 12, and thus fine pores (recesses) are provided in the dielectric layer 20.

[0046] The solid electrolyte layer 31 is provided on the surface of the dielectric layer 20. The conductor layer 32 is provided on the surface of the solid electrolyte layer 31.

[0047] exist Figure 2 In the embodiment, the cathode layer 30 includes a solid electrolyte layer 31 provided on the surface of the dielectric layer 20 and a conductor layer 32 provided on the surface of the solid electrolyte layer 31. The cathode layer 30 is provided on the surface of the dielectric layer 20. More specifically, the cathode layer 30 is provided in a region surrounded by the insulating layer 40 on the surface of the dielectric layer 20.

[0048] As a constituent material of the solid electrolyte layer 31, for example, conductive polymers such as polypyrrole, polythiophene, and polyaniline can be cited. Among them, polythiophenes are preferred, and poly(3,4-ethylenedioxythiophene) (PEDOT) is particularly preferred. In addition, the conductive polymer may also contain a dopant such as polystyrene sulfonic acid (PSS).

[0049] The solid electrolyte layer 31 is formed in a predetermined area inside the dielectric layer 20 including the pores, for example, by a method of applying a dispersion of a conductive polymer such as poly(3,4-ethylenedioxythiophene) to the surface of the dielectric layer 20 and drying it, or by using a treatment solution containing a polymerizable monomer such as 3,4-ethylenedioxythiophene and forming a polymer film of poly(3,4-ethylenedioxythiophene) on the surface of the dielectric layer 20.

[0050] In the solid electrolytic capacitor of the present invention, it is preferred that the conductor layer includes a metal layer containing a metal filler.

[0051] Preferably, the conductor layer 32 includes a metal layer containing a metal filler.

[0052] Preferably, the metal filler is at least one selected from the group consisting of a copper filler, a silver filler, and a nickel filler.

[0053] The metal layer may be, for example, a metal plating film, a metal foil, etc. In this case, the metal layer is preferably formed of at least one metal selected from the group consisting of copper, silver, nickel, and an alloy containing at least one of these metals as a main component.

[0054] In this specification, the main component refers to the element component with the largest weight ratio.

[0055] It is preferable that the conductor layer 32 includes a conductive resin layer in addition to the metal layer.

[0056] Examples of the conductive resin layer include a conductive adhesive layer containing at least one conductive filler selected from the group consisting of a copper filler, a silver filler, a nickel filler, and a carbon filler.

[0057] In addition, the conductor layer 32 may include only a metal layer, only a conductive resin layer, or both a metal layer and a conductive resin layer.

[0058] exist Figure 1 and Figure 2 In the example shown, the conductor layer 32 includes a first conductor layer 32A provided on the surface of the solid electrolyte layer 31 and a second conductor layer 32B provided on the surface of the first conductor layer 32A. Preferably, the conductor layer 32 includes a plurality of conductor layers as described above.

[0059] In solid electrolytic capacitors, the thickness of the dielectric layer is small, so leakage current is prone to occur. In this regard, since the conductor layer 32 includes multiple conductor layers such as the first conductor layer 32A and the second conductor layer 32B, there are multiple body resistances and interface resistances in the cathode layer 30, so that leakage current is easily suppressed.

[0060] Preferably, the first conductive layer 32A is a conductive resin layer containing a conductive filler.

[0061] Preferably, the second conductive layer 32B is a metal layer containing a metal filler.

[0062] The conductive layer 32 may include, for example, a carbon layer as the first conductive layer 32A and a copper layer as the second conductive layer 32B.

[0063] The carbon layer is formed in a predetermined region by applying a carbon paste containing a carbon filler to the surface of the solid electrolyte layer 31 by a method such as sponge transfer, screen printing, dispenser coating, or inkjet printing.

[0064] The copper layer is formed in a predetermined region by applying a copper paste containing a copper filler to the surface of the carbon layer by a method such as sponge transfer, screen printing, spray coating, dispenser coating, or inkjet printing.

[0065] In the solid electrolytic capacitor 1 , a capacitor portion is formed by the anode plate 10 , the dielectric layer 20 , and the cathode layer 30 .

[0066] The insulating layer 40 is formed of an insulating material.

[0067] As the insulating material constituting the insulating layer 40, for example, polyphenylsulfone (PPS), polyethersulfone (PES), cyanate resin, fluororesin (tetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, etc.), a composition composed of soluble polyimide siloxane and epoxy resin, polyimide resin, polyamide-imide resin, their derivatives or precursors, etc. can be cited.

[0068] The insulating layer 40 is provided on the surface of the dielectric layer 20. The insulating layer 40 is provided in a region surrounding the solid electrolyte layer 31 so as to cover at least a portion of the end of the solid electrolyte layer 31. In addition, the insulating layer 40 is provided on the periphery of the cathode layer 30. The insulating layer 40 may be provided so as to cover at least a portion of the end of the conductor layer 32, but it is preferably provided so as not to cover the end of the conductor layer 32.

[0069] exist Figure 2In the embodiment, the insulating layer 40 includes a first insulating layer 40A provided on the surface of the dielectric layer 20 in a region surrounding the solid electrolyte layer 31 and a second insulating layer 40B provided on the surface of the first insulating layer 40A, and the second insulating layer 40B is provided in a manner covering at least a portion of the end of the solid electrolyte layer 31. In this way, by setting the structure in which the insulating layer includes the first insulating layer provided on the surface of the dielectric layer in a region surrounding the solid electrolyte layer and the second insulating layer provided on the surface of the first insulating layer, and the second insulating layer is provided in a manner covering at least a portion of the end of the solid electrolyte layer, the first insulating layer and the second insulating layer can be provided separately, and the degree of freedom of arrangement of each layer included in the solid electrolytic capacitor is further improved.

[0070] Figure 3 A stands for Figure 2 2 is a schematic cross-sectional view of an example of a cross section of the solid electrolytic capacitor along line segment B1 - B2 shown. Figure 3 B stands for Figure 2 2 is a schematic cross-sectional view of another example of the cross section of the solid electrolytic capacitor along the line segment B1 - B2 shown.

[0071] exist Figure 3 In A, the second insulating layer 40B constituting the insulating layer is provided so as to cover the entire end portion of the solid electrolyte layer 31. Figure 3 In B, the second insulating layer 40B constituting the insulating layer is provided so as to cover a part of the end portion of the solid electrolyte layer 31 .

[0072] Preferably, the insulating layer is provided in a manner that covers at least the end of the portion of the solid electrolyte layer where the length from the end of the solid electrolyte layer to the end of the conductor layer is the shortest when viewed from above in the thickness direction. The risk of a short circuit occurring at the end of the portion of the solid electrolyte layer where the length from the end of the solid electrolyte layer to the end of the conductor layer is the shortest is the highest, and therefore, by providing the insulating layer in a manner that covers at least this portion, the risk of a short circuit occurring can be further reduced.

[0073] In this specification, the end of the solid electrolyte layer refers to the outer edge when the solid electrolyte layer is viewed from the thickness direction. The same applies to the ends of other structures.

[0074] In this specification, the insulating layer covers at least a part of the end of the solid electrolyte layer means that the insulating layer is provided on the solid electrolyte layer when the solid electrolyte layer is viewed from the thickness direction. The same applies to other structures.

[0075] In this specification, the thickness direction refers to the thickness direction of the solid electrolytic capacitor. Figure 2 In the Figure 3 A and Figure 3In B, it is determined by the depth direction of the paper.

[0076] exist Figure 3 In A, the length from the end of the solid electrolyte layer 31 to the end of the conductor layer 32 is Figure 3 The lengths of A represented by d1, d2, d3 and d4. Figure 3 In A, d1 is the shortest among d1, d2, d3, and d4. Therefore, when viewed from the thickness direction, the end of the end of the solid electrolyte layer 31 having the shortest length from the end of the solid electrolyte layer 31 to the end of the conductor layer 32 is Figure 3 A is an end portion of the solid electrolyte layer 31 denoted by 31 a .

[0077] Therefore, in Figure 3 In A, it is preferable that the second insulating layer 40B is provided so as to cover at least the end portion 31 a of the solid electrolyte layer 31 .

[0078] When the top view shape of the solid electrolyte layer when viewed from the thickness direction is a quadrilateral, it is more preferable that the insulating layer is provided in a manner that covers at least the side of the solid electrolyte layer having the shortest portion from the end of the solid electrolyte layer to the end of the conductor layer when viewed from the thickness direction. The risk of short circuit occurring at the side of the solid electrolyte layer having the shortest portion from the end of the solid electrolyte layer to the end of the conductor layer has the highest risk, and therefore, by providing the insulating layer in a manner that covers at least this portion, the risk of short circuit occurring can be further reduced.

[0079] exist Figure 3 In B, the plan view shape of the solid electrolyte layer 31 when viewed from the thickness direction is a quadrilateral. Figure 3 In B, d1 and d3 are the shortest among d1, d2, d3, and d4. Therefore, when viewed from the thickness direction, the side of the solid electrolyte layer 31 having the shortest portion from the end of the solid electrolyte layer 31 to the end of the conductor layer 32 refers to Figure 3 The sides of the solid electrolyte layer 31 of B are indicated by 31b and 31c.

[0080] Therefore, in Figure 3 In B, it is preferable that the second insulating layer 40B is provided so as to cover at least the sides 31 b and 31 c of the solid electrolyte layer 31 .

[0081] exist Figure 3 In A, when viewed from the thickness direction, the second insulating layer 40B is provided so as to cover the entire end of the solid electrolyte layer 31. Figure 3As in A, when viewed from the thickness direction, an insulating layer is provided so as to cover the entire end of the solid electrolyte layer. This can further reduce the risk of short circuit.

[0082] The insulating layer 40 is formed around the solid electrolyte layer 31 to surround the formation region or formation planned region of the conductor layer 32 , for example, by applying an insulating material to the surface of the dielectric layer 20 overlapping the periphery of the solid electrolyte layer 31 .

[0083] Examples of insulating materials constituting the first insulating layer 40A and the second insulating layer 40B include polyphenylsulfone, polyethersulfone, cyanate resin, fluororesin (tetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, etc.), a composition composed of a soluble polyimide siloxane and an epoxy resin, polyimide resin, polyamide-imide resin, and derivatives or precursors thereof.

[0084] The insulating material constituting the first insulating layer 40A may be the same as or different from the insulating material constituting the second insulating layer 40B.

[0085] First insulating layer 40A may be formed of the same resin as sealing layer 50 described later. If first insulating layer 40A contains an inorganic filler different from sealing layer 50, it may adversely affect the effective portion of solid electrolytic capacitor 1. Therefore, first insulating layer 40A is preferably formed of resin alone.

[0086] The thickness of the first insulating layer 40A may be the same as the thickness of the second insulating layer 40B, may be larger than the thickness of the second insulating layer 40B, or may be smaller than the thickness of the second insulating layer 40B.

[0087] The thickness of the first insulating layer 40A may be the same as the thickness of the solid electrolyte layer 31 , may be larger than the thickness of the solid electrolyte layer 31 , or may be smaller than the thickness of the solid electrolyte layer 31 .

[0088] The thickness of the second insulating layer 40B may be the same as the thickness of the conductive layer 32 , may be larger than the thickness of the conductive layer 32 , or may be smaller than the thickness of the conductive layer 32 .

[0089] Preferably, the solid electrolytic capacitor 1 further includes a sealing layer 50 .

[0090] The sealing layer 50 includes a resin material.

[0091] Examples of the resin material contained in the sealing layer 50 include epoxy, phenol, polyimide, and the like.

[0092] The sealing layer 50 may contain an inorganic filler such as silica or alumina in addition to the resin material.

[0093] The sealing layer 50 may be composed of only one layer or may be composed of two or more layers.

[0094] The sealing layer 50 covers the conductor layer 32. Figure 2 In the illustrated example, the sealing layer 50 covers not only the conductor layer 32 but also the insulating layer 40 .

[0095] In the solid electrolytic capacitor 1, the deformation caused by external force is suppressed by providing the sealing layer 50 covering the conductive layer 32, and the occurrence of delamination is also suppressed. Since the solid electrolytic capacitor has a sealing layer containing a resin material and covering the conductive layer, the deformation caused by external force is suppressed, and the occurrence of delamination is also suppressed.

[0096] The sealing layer 50 may be provided so that a part of the anode plate 10, in particular, the end surface of the core 11 is exposed from the sealing layer 50. In this case, even if the sealing layer 50 is provided, the anode plate 10 can be connected to the outside of the sealing layer 50.

[0097] The sealing layer 50 is formed in a predetermined region by, for example, a method of attaching a resin sheet so as to cover the conductor layer 32 , a method of applying a resin paste so as to cover the conductor layer 32 , or the like.

[0098] Preferably, solid electrolytic capacitor 1 further includes via conductor 70 .

[0099] The via conductor 70 is provided in a manner extending from the surface of the sealing layer 50 to the cathode layer 30 in the thickness direction, more specifically, extending from the surface of the sealing layer 50 to the second conductive layer 32B. Thus, the cathode layer 30 is electrically led out to the outside of the sealing layer 50 through the via conductor 70, and can be electrically connected to the outside of the sealing layer 50.

[0100] The via conductor 70 is connected to a cathode wiring pattern 72 provided on the surface of the sealing layer 50 .

[0101] Examples of the constituent material of via conductor 70 include low-resistance metals such as silver, gold, and copper.

[0102] The via conductor 70 is formed, for example, as follows. First, a hole is provided in the thickness direction from the surface of the sealing layer 50 to the cathode layer 30, in this case, from the surface of the sealing layer 50 to the second conductor layer 32B, by drilling, laser processing, etc. in the sealing layer 50. Then, the via conductor 70 is formed by plating the inner wall surface of the hole provided in the sealing layer 50 or performing a heat treatment after filling with a conductive paste.

[0103] Preferably, solid electrolytic capacitor 1 further includes at least one of through-hole conductors 80A and 80B.

[0104] The via-hole conductors 80A and 80B penetrate the sealing layer 50 in the thickness direction. Figure 2 In the illustrated example, the through-hole conductors 80A and 80B penetrate the anode plate 10 (core portion 11 ), the dielectric layer 20 , and the insulating layer 40 in the thickness direction in addition to penetrating the sealing layer 50 in the thickness direction.

[0105] By providing a through-hole conductor that penetrates the sealing layer in the thickness direction, an electrical function is imparted to the sealing layer 50 .

[0106] Preferably, the through-hole conductor 80A is provided on at least the inner wall surface of a through-hole 81A that penetrates the sealing layer 50 in the thickness direction. Figure 2 In the illustrated example, the via-hole conductor 80A is provided throughout the entire interior of the through-hole 81A.

[0107] The through-hole conductor 80A is electrically insulated from the anode plate 10. Figure 2 As shown, an insulating material such as a sealing layer 50 is filled between the through-hole conductor 80A and the anode plate 10 .

[0108] The through-hole conductor 80A is connected to the cathode wiring pattern 72 provided on the surface of the sealing layer 50 . Therefore, the through-hole conductor 80A is electrically connected to the cathode layer 30 through the cathode wiring pattern 72 and the via conductor 70 .

[0109] Preferably, the through-hole conductor 80B is provided on at least the inner wall surface of a through-hole 81B that penetrates the sealing layer 50 in the thickness direction. Figure 2 In the illustrated example, the through-hole conductor 80B is provided throughout the entire interior of the through-hole 81B.

[0110] The through-hole conductor 80B is electrically connected to the anode plate 10. Figure 2 As shown, the through-hole conductor 80B is electrically connected to the anode plate 10 at the inner wall surface of the through-hole 81B. More specifically, it is preferable that the through-hole conductor 80B is electrically connected to the end surface of the anode plate 10 that is opposite to the inner wall surface of the through-hole 81B in a direction perpendicular to the thickness direction. Figure 2 In the example shown, the through-hole conductor 80B is connected to the end surface of the anode plate 10, in particular, to the end surface of the core 11. Thus, the anode plate 10 is electrically led out to the outside via the through-hole conductor 80B. In other words, the sealing layer 50 is given an electrical function of electrically leading the anode plate 10 out to the outside. In addition, the through-hole conductor 80B is connected to the anode wiring pattern 71 provided on the surface of the sealing layer 50.

[0111] Preferably, through-hole conductor 80B is electrically connected to anode plate 10 over the entire circumference of through-hole 81B when viewed in the thickness direction. This can easily reduce the connection resistance between through-hole conductor 80B and anode plate 10, and thus the equivalent series resistance of solid electrolytic capacitor 1 can be easily reduced.

[0112] The through-hole conductor 80A is formed, for example, as follows. First, a through-hole is provided that penetrates the anode plate 10 (core 11), the dielectric layer 20, and the insulating layer 40 in the thickness direction by drilling, laser processing, etc. Next, the sealing layer 50 is formed and the insulating material is filled into the above-mentioned through-hole. A through-hole 81A that penetrates the sealing layer 50 in the thickness direction is provided by drilling, laser processing, etc. on the portion filled with the insulating material. At this time, by making the diameter of the through-hole 81A smaller than the diameter of the through-hole filled with the insulating material, a state is set in which the insulating material exists between the inner wall surface of the through-hole previously formed in the surface direction and the inner wall surface of the through-hole 81A. Then, the inner wall surface of the through-hole 81A is metalized with a low-resistance metal such as copper, gold, and silver to form the through-hole conductor 80A. When forming the through-hole conductor 80A, for example, by metalizing the inner wall surface of the through-hole 81A with a non-electrolytic copper plating process, an electrolytic copper plating process, etc., the processing becomes easy. In addition, as a method of forming through-hole conductor 80A, in addition to the method of metallizing the inner wall surface of through-hole 81A, a method of filling through-hole 81A with metal, a composite material of metal and resin, or the like may be used.

[0113] The through-hole conductor 80B is formed, for example, as follows. First, a through-hole 81B is provided that penetrates the sealing layer 50, the anode plate 10 (core 11), the dielectric layer 20, and the insulating layer 40 in the thickness direction by drilling processing, laser processing, etc. Then, the through-hole conductor 80B is formed by metalizing the inner wall surface of the through-hole 81B with a low-resistance metal such as copper, gold, or silver. When forming the through-hole conductor 80B, for example, by metalizing the inner wall surface of the through-hole 81B with a non-electrolytic copper plating process, an electrolytic copper plating process, etc., the processing becomes easy. In addition, regarding the method of forming the through-hole conductor 80B, in addition to the method of metalizing the inner wall surface of the through-hole 81B, a method of filling the through-hole 81B with a metal, a composite material of a metal and a resin, etc. may also be used.

[0114] In the solid electrolytic capacitor 1, the insulating layer 40 is provided in a region surrounding the solid electrolyte layer 31 in a manner that covers at least a portion of the end of the solid electrolyte layer 31. More specifically, when viewed from the thickness direction, the insulating layer 40 is provided in a manner that covers the entire end of the solid electrolyte layer 31. As a result, it is possible to suppress the conductor layer 32 from entering between the solid electrolyte layer 31 and the insulating layer 40, and the portion of the surface of the porous layer 12 that is not covered by the dielectric layer 20 from contacting the conductor layer 32, thereby reducing the risk of a short circuit due to the conductor layer 32. In addition, the conductor layer 32 can be provided at least to the position where the insulating layer 40 is provided, and the degree of freedom of the portion where the conductor layer 32 is provided can also be ensured. As a result, the degree of freedom of the portion where the via conductor 70 is provided can also be ensured. As described above, in the solid electrolytic capacitor 1, the risk of a short circuit can be reduced and the degree of freedom of the portion where the via conductor is provided can be ensured, and it is possible to achieve the process likelihood that is difficult in the prior art and the fine pattern layout. In addition, by expanding the range in which the via conductors can be provided, it is possible to reduce the resistivity, reduce the size of the element corresponding to one channel of the capacitor array, and the like.

[0115] exist Figure 2 In the illustrated example, the insulating layer 40 includes the first insulating layer 40A and the second insulating layer 40B, but the insulating layer 40 may include another layer in addition to the first insulating layer 40A and the second insulating layer 40B.

[0116] The top view shape of the solid electrolyte layer 31 when viewed from the thickness direction is a quadrilateral (square shape), but the top view shape of the solid electrolyte layer may be a rectangular shape other than a square shape, a polygonal shape other than a quadrilateral, a circular shape, an elliptical shape, or other shapes.

[0117] exist Figure 3 A and Figure 3 In the example shown in B, the top view shape of the solid electrolyte layer 31 when observed from the thickness direction is a quadrilateral (square), but the top view shape of the solid electrolyte layer may be a rectangular shape which is a quadrilateral other than a square, or may be a polygonal shape, a circular shape, an elliptical shape, or other shapes other than a quadrilateral.

[0118] The solid electrolytic capacitor 1 is manufactured, for example, by the following method.

[0119] First, an anode plate 10 having porous layers 12 on both main surfaces of a core 11 is prepared. Then, an oxide film as a dielectric layer 20 is formed on the surface of the porous layer 12 by anodizing the anode plate 10.

[0120] Next, an insulating material is applied to the surface of the dielectric layer 20 to form the first insulating layer 40A so as to surround the region where the solid electrolyte layer 31 is to be formed.

[0121] Then, the solid electrolyte layer 31 is formed by repeatedly applying a dispersion of a conductive polymer to the surface of the dielectric layer 20 and drying the dispersion a plurality of times in the region surrounded by the first insulating layer 40A.

[0122] Next, an insulating material is applied to the surface of the first insulating layer 40A to form the second insulating layer 40B so as to cover the entire end portion or a portion of the end portion of the solid electrolyte layer 31 when viewed in a plan view from the thickness direction.

[0123] Next, a conductive paste containing a conductive filler is applied to the surface of the solid electrolyte layer 31 to form a first conductive layer 32A provided on the surface of the solid electrolyte layer 31. Thereafter, a metal paste containing a metal filler is applied to the surface of the first conductive layer 32A to form a second conductive layer 32B provided on the surface of the first conductive layer 32A. In this way, a conductive layer 32 including the first conductive layer 32A and the second conductive layer 32B is formed. By the above method, a solid electrolytic capacitor sheet is obtained.

[0124] Next, resin sheets are attached to both main surfaces of the solid electrolytic capacitor sheet to form the sealing layer 50 covering the conductor layer 32. In this way, the solid electrolytic capacitor array sheet is manufactured.

[0125] Next, a hole is formed in the sealing layer 50 from the surface of the sealing layer 50 to the second conductive layer 32B in the thickness direction by drilling, laser processing, etc. Then, a conductive paste is filled in the hole formed in the sealing layer 50 and then heat treated to form the via conductor 70 .

[0126] Via conductor 70 may be formed after the step of cutting the solid electrolytic capacitor array sheet, or may be formed before the step of cutting the solid electrolytic capacitor array sheet.

[0127] Next, by the above-described method, through-hole conductors 80A and 80B are formed.

[0128] The via-hole conductors 80A and 80B may be formed after the step of cutting the solid electrolytic capacitor array sheet, or may be formed before the step of cutting the solid electrolytic capacitor array sheet.

[0129] Thereafter, the solid electrolytic capacitor array sheet is cut into individual pieces so that each capacitor portion is independent, thereby manufacturing the solid electrolytic capacitor 1 .

[0130] [Implementation Method 2]

[0131] In the solid electrolytic capacitor according to the second embodiment of the present invention, unlike the solid electrolytic capacitor according to the first embodiment of the present invention, the conductive layer is provided so as to cover at least a part of the end portion of the insulating layer.

[0132] Figure 4 It is a schematic cross-sectional view showing an example of a solid electrolytic capacitor according to a second embodiment of the present invention.

[0133] exist Figure 2 In the solid electrolytic capacitor 1 shown in FIG. 1 , the conductive layer 32 does not cover the end of the second insulating layer 40B. Figure 4 In the solid electrolytic capacitor 2 shown, the conductor layer 32 is provided in a manner that covers at least a portion of the end of the second insulating layer 40B. By providing the conductor layer in a manner that covers at least a portion of the end of the insulating layer, the formation range of the conductor layer can be further expanded. As a result, the range in which the via conductor can be provided can be further expanded, so that the realization of a fine pattern layout becomes easier. In addition, by further expanding the range in which the via conductor can be provided, it is possible to further reduce the resistivity, further miniaturize the element size of one channel of the capacitor array, etc.

[0134] In the solid electrolytic capacitor of embodiment 2 of the present invention, the conductive layer can be arranged in a manner that covers at least a portion of the end of the insulating layer, or the conductive layer can be arranged in a manner that covers the entire end of the insulating layer. The area where the conductive layer is arranged on the surface of the insulating layer can be appropriately set according to the location where the via conductor is desired to be arranged.

[0135] The solid electrolytic capacitor 2 is manufactured, for example, by changing the region where the conductor layer 32 is formed in the above-described method of manufacturing the solid electrolytic capacitor 1 so as to cover at least a portion of the end portion of the second insulating layer 40B.

[0136] [Implementation method 3]

[0137] In the solid electrolytic capacitor according to the third embodiment of the present invention, as in the solid electrolytic capacitor according to the second embodiment of the present invention, unlike the solid electrolytic capacitor according to the first embodiment of the present invention, the conductor layer is provided so as to cover at least a portion of the end portion of the insulating layer.

[0138] Figure 5 It is a schematic cross-sectional view showing an example of a solid electrolytic capacitor according to a third embodiment of the present invention.

[0139] exist Figure 4In the solid electrolytic capacitor 2 shown in FIG. 1 , the conductor layer 32 is provided so as to cover at least a portion of the end of the second insulating layer 40B. When viewed from the thickness direction, the end 32a of the conductor layer 32 on the side opposite to the solid electrolyte layer 31 is located inwardly of the end 31a of the solid electrolyte layer 31. Figure 5 In the solid electrolytic capacitor 3 shown, when viewed from above in the thickness direction, the end 32a of the conductor layer 32 on the side opposite to the solid electrolyte layer 31 is located outside the end 31a of the solid electrolyte layer 31. When viewed from above in the thickness direction, the end of the conductor layer on the side opposite to the solid electrolyte layer is located outside the end of the solid electrolyte layer, so that the range where the conductor layer is provided on the surface of the insulating layer is further expanded, the range where the via conductor is provided can be further expanded, and the risk of short circuit due to the conductor layer 32 can be further reduced.

[0140] In the solid electrolytic capacitor of embodiment 3 of the present invention, the conductive layer can be arranged in a manner that covers at least a portion of the end of the insulating layer, or the conductive layer can be arranged in a manner that covers the entire end of the insulating layer. The area where the conductive layer is arranged on the surface of the insulating layer can be appropriately set according to the location where the via conductor is desired to be arranged.

[0141] The solid electrolytic capacitor 3 is manufactured, for example, by changing the region where the conductor layer 32 is formed in the above-described method of manufacturing the solid electrolytic capacitor 1 so as to cover at least a portion of the end portion of the second insulating layer 40B.

[0142] [Implementation Method 4]

[0143] In the solid electrolytic capacitor according to the fourth embodiment of the present invention, unlike the solid electrolytic capacitor according to the first embodiment of the present invention, the insulating layer is a single layer.

[0144] Figure 6 It is a schematic cross-sectional view showing an example of a solid electrolytic capacitor according to a fourth embodiment of the present invention.

[0145] exist Figure 2 In the solid electrolytic capacitor 1 shown in FIG. 1 , the insulating layer 40 includes a first insulating layer 40A and a second insulating layer 40B. Figure 6 In the solid electrolytic capacitor 4 shown, the insulating layer 40 is a single layer. Since the insulating layer is a single layer, there is no joint in the insulating layer, and thus the risk of short circuit due to the conductor layer can be further reduced.

[0146] The solid electrolytic capacitor 4 is manufactured, for example, by the following method.

[0147] First, an anode plate 10 having porous layers 12 on both main surfaces of a core 11 is prepared. Then, an oxide film as a dielectric layer 20 is formed on the surface of the porous layer 12 by anodizing the anode plate 10.

[0148] Next, a process of applying a conductive polymer dispersion liquid to the surface of the dielectric layer 20 and drying the dispersion liquid is repeated multiple times in the predetermined region surrounded by the insulating layer 40, thereby forming the solid electrolyte layer 31. At this time, by using a conductive polymer dispersion liquid with a high viscosity, the solid electrolyte layer 31 can be formed in the predetermined region surrounded by the insulating layer 40.

[0149] Then, an insulating material is applied to the surface of the dielectric layer 20 to form the insulating layer 40 so as to surround the cathode layer 30 and cover the entire end portion or a portion of the end portion of the solid electrolyte layer 31 when viewed in a plan view in the thickness direction.

[0150] Next, a conductive paste containing a conductive filler is applied to the surface of the solid electrolyte layer 31 to form the first conductive layer 32A provided on the surface of the solid electrolyte layer 31. Thereafter, a metal paste containing a metal filler is applied to the surface of the first conductive layer 32A to form the second conductive layer 32B provided on the surface of the first conductive layer 32A. In this way, the conductive layer 32 including the first conductive layer 32A and the second conductive layer 32B is formed.

[0151] Thereafter, solid electrolytic capacitor 4 is manufactured in the same manner as solid electrolytic capacitor 1 .

[0152] [Implementation method 5]

[0153] In the solid electrolytic capacitor according to the fifth embodiment of the present invention, unlike the solid electrolytic capacitor according to the second embodiment of the present invention, the insulating layer is a single layer.

[0154] Figure 7 It is a schematic cross-sectional view showing an example of a solid electrolytic capacitor according to a fifth embodiment of the present invention.

[0155] exist Figure 4 In the solid electrolytic capacitor 2 shown in FIG. 1 , the insulating layer 40 includes a first insulating layer 40A and a second insulating layer 40B. Figure 7 In the solid electrolytic capacitor 5 shown, the insulating layer 40 is a single layer. Since the insulating layer is a single layer, there is no joint in the insulating layer, and thus the risk of short circuit due to the conductor layer can be further reduced.

[0156] The solid electrolytic capacitor 5 is manufactured, for example, by utilizing the same method as the solid electrolytic capacitor 4 in the method of manufacturing the solid electrolytic capacitor 2 .

[0157] [Implementation Method 6]

[0158] In the solid electrolytic capacitor according to the sixth embodiment of the present invention, unlike the solid electrolytic capacitor according to the third embodiment of the present invention, the insulating layer is a single layer.

[0159] Figure 8 It is a schematic cross-sectional view showing an example of a solid electrolytic capacitor according to a sixth embodiment of the present invention.

[0160] exist Figure 5 In the solid electrolytic capacitor 3 shown in FIG. 1 , the insulating layer 40 includes a first insulating layer 40A and a second insulating layer 40B. Figure 8 In the solid electrolytic capacitor 6 shown, the insulating layer 40 is a single layer. Since the insulating layer is a single layer, there is no joint in the insulating layer, and thus the risk of short circuit due to the conductor layer can be further reduced.

[0161] The solid electrolytic capacitor 6 is manufactured, for example, by utilizing the same method as the solid electrolytic capacitor 4 in the method of manufacturing the solid electrolytic capacitor 3 .

[0162] [Implementation method 7]

[0163] The capacitor array of the present invention includes a plurality of the solid electrolytic capacitors of the present invention.

[0164] Hereinafter, an example of the capacitor array of the present invention will be described as a capacitor array according to a seventh embodiment of the present invention including a plurality of solid electrolytic capacitors according to the first embodiment of the present invention.

[0165] Fig. 9 It is a schematic perspective view showing an example of a capacitor array according to a seventh embodiment of the present invention. Fig.10 Yes means Fig. 9 FIG. 1 is a schematic cross-sectional view of an example of a cross section of the capacitor array along line segment C1 - C2 shown.

[0166] Fig. 9 and Fig.10 The capacitor array 101 shown has multiple Figure 2 The solid electrolytic capacitor 1 is shown. Fig. 9 and Fig.10 In the example shown, the capacitor array 101 has two solid electrolytic capacitors 1 .

[0167] In capacitor array 101 in which a plurality of solid electrolytic capacitors 1 are arranged in an array, deformation due to external force is suppressed and delamination between a plurality of layers of different materials, particularly delamination between porous layer 12 and solid electrolyte layer 31 , is unlikely to occur.

[0168] Furthermore, by arranging a plurality of solid electrolytic capacitors 1 in an array to form a capacitor array 101 , it is possible to provide a capacitor array having a multi-channel structure in which the capacitance and position are optimized in response to market requirements.

[0169] Furthermore, by using capacitor array 101 in which a plurality of solid electrolytic capacitors 1 are arranged in an array, a plurality of solid electrolytic capacitors 1 can be efficiently mounted on a substrate.

[0170] The plurality of solid electrolytic capacitors 1 may be arranged in a planar shape or in a linear shape.

[0171] The plurality of solid electrolytic capacitors 1 may be arranged regularly or irregularly.

[0172] The areas of the plurality of solid electrolytic capacitors 1 when viewed in the thickness direction may be the same as or different from each other, or may be partially different from each other.

[0173] The planar shapes of the plurality of solid electrolytic capacitors 1 when viewed in the thickness direction may be the same as or different from each other, or may be partially different from each other.

[0174] Preferably, the capacitor array 101 further includes an insulating portion 60 filling between the plurality of solid electrolytic capacitors 1 , and filling between two solid electrolytic capacitors 1 in this case.

[0175] Preferably, the insulating portion 60 includes a resin material.

[0176] Examples of the resin material contained in the insulating portion 60 include epoxy, phenol, polyimide, and the like.

[0177] The insulating portion 60 may contain an inorganic filler such as silica or alumina in addition to the resin material.

[0178] The resin material included in the insulating portion 60 may be the same as or different from the resin material included in the sealing layer 50 .

[0179] The constituent material of the insulating portion 60 may be the same as or different from the constituent material of the sealing layer 50 .

[0180] When the constituent material of the insulating portion 60 is the same as the constituent material of the sealing layer 50, as shown in FIG. Fig. 9 and Fig.10 As shown, the sealing layer 50 and the insulating portion 60 are integrated, and the interface between the two is often not clearly visible. Alternatively, the interface between the sealing layer 50 and the insulating portion 60 may also be clearly visible.

[0181] The insulating portion 60 may be a portion where the sealing layer 50 extends between a plurality of solid electrolytic capacitors 1 , in this case, between two solid electrolytic capacitors 1 . In other words, the insulating portion 60 may be included in the sealing layer 50 .

[0182] The insulating portion 60 is formed by, for example, filling a gap between a plurality of solid electrolytic capacitors 1 , and filling a gap between two solid electrolytic capacitors 1 in this case, by a method of crimping a resin sheet or applying a resin paste.

[0183] The capacitor array 101 is manufactured, for example, by cutting the solid electrolytic capacitor array sheet into individual pieces including a desired number of capacitor sections, here including two capacitor sections, in the manufacturing process of the solid electrolytic capacitor 1 described above.

[0184] In addition to the above-mentioned embodiment 7, the capacitor array of the present invention may also be in the form of a plurality of solid electrolytic capacitors of embodiment 2 of the present invention, a plurality of solid electrolytic capacitors of embodiment 3 of the present invention, a plurality of solid electrolytic capacitors of embodiment 4 of the present invention, a plurality of solid electrolytic capacitors of embodiment 5 of the present invention, a plurality of solid electrolytic capacitors of embodiment 6 of the present invention, or a plurality of solid electrolytic capacitors of multiple embodiments.

[0185] The solid electrolytic capacitor of the present invention is used, for example, in a composite electronic component. Such a composite electronic component, for example, comprises: the solid electrolytic capacitor of the present invention; an external electrode, which is provided on the outside of the solid electrolytic capacitor of the present invention and is electrically connected to the anode plate and the cathode layer, respectively; and an electronic component, which is electrically connected to the external electrode.

[0186] In the composite electronic component, the electronic component electrically connected to the external electrode may be a passive element, an active element, both a passive element and an active element, or a composite of a passive element and an active element.

[0187] As a passive element, an inductor etc. can be mentioned, for example.

[0188] Examples of active elements include a memory, a GPU (Graphical Processing Unit), a CPU (Central Processing Unit), an MPU (Micro Processing Unit), and a PMIC (Power Management IC).

[0189] In the case where the solid electrolytic capacitor of the present invention is used for a composite electronic component, the solid electrolytic capacitor of the present invention is used as a substrate for mounting the electronic component, for example, as described above. Therefore, by making the solid electrolytic capacitor of the present invention as a sheet as a whole, and making the electronic component mounted on the solid electrolytic capacitor of the present invention as a sheet, the solid electrolytic capacitor of the present invention can be electrically connected to the electronic component in the thickness direction via a through-hole conductor that penetrates the electronic component in the thickness direction. As a result, the passive components and active components as electronic components can be configured as a combined module.

[0190] For example, a switching regulator can be formed by electrically connecting the solid electrolytic capacitor of the present invention between a voltage regulator including a semiconductor active element and a load to which the converted DC voltage is supplied.

[0191] In the composite electronic component, a circuit layer may be formed on one main surface of a solid electrolytic capacitor sheet having a plurality of solid electrolytic capacitors of the present invention arranged thereon, and the circuit layer may be electrically connected to a passive element or an active element as the electronic component.

[0192] Alternatively, the solid electrolytic capacitor of the present invention may be placed in a cavity previously provided in a substrate, embedded in a resin, and then a circuit layer may be formed on the resin. Alternatively, passive or active elements as other electronic components may be mounted in other cavities of the substrate.

[0193] Alternatively, the solid electrolytic capacitor of the present invention may be mounted on a smooth carrier such as a wafer or glass, and a circuit layer may be formed after forming an outer layer of resin, and then the circuit layer may be electrically connected to a passive element or an active element as an electronic component.

[0194] The following contents are disclosed in this specification.

[0195] <1>

[0196] A solid electrolytic capacitor, characterized in that:

[0197] The solid electrolytic capacitor includes:

[0198] an anode plate having a porous layer on at least one major surface;

[0199] a dielectric layer disposed on the surface of the porous layer;

[0200] A solid electrolyte layer disposed on the surface of the dielectric layer;

[0201] a conductor layer provided on a surface of the solid electrolyte layer; and

[0202] an insulating layer disposed on the surface of the dielectric layer,

[0203] The insulating layer is provided in a region surrounding the solid electrolyte layer so as to cover at least a portion of an end portion of the solid electrolyte layer.

[0204] <2>

[0205] A solid electrolytic capacitor according to <1>, wherein:

[0206] The insulating layer is provided so as to cover at least an end portion of the end portion of the solid electrolyte layer where the length from the end portion of the solid electrolyte layer to the end portion of the conductor layer is the shortest when viewed in plan from the thickness direction.

[0207] <3>

[0208] The solid electrolytic capacitor according to <1> or <2>, wherein:

[0209] The solid electrolyte layer is quadrilateral in plan view when viewed from the thickness direction.

[0210] The insulating layer is provided so as to cover at least a side of the side of the solid electrolyte layer having a portion having the shortest length from an end of the solid electrolyte layer to an end of the conductor layer when viewed in plan from the thickness direction.

[0211] <4>

[0212] The solid electrolytic capacitor according to any one of <1> to <3>, wherein

[0213] The insulating layer is provided so as to cover the entire end portion of the solid electrolyte layer when viewed in plan from the thickness direction.

[0214] <5>

[0215] The solid electrolytic capacitor according to any one of <1> to <4>, wherein

[0216] The conductive layer is provided so as to cover at least a portion of the end portion of the insulating layer.

[0217] <6>

[0218] A solid electrolytic capacitor according to <5>, wherein:

[0219] When viewed in plan from the thickness direction, an end portion of the conductor layer on the side opposite to the solid electrolyte layer is located outside an end portion of the solid electrolyte layer.

[0220] <7>

[0221] The solid electrolytic capacitor according to any one of <1> to <6>, wherein

[0222] The insulating layer includes: a first insulating layer provided on the surface of the dielectric layer in a region surrounding the solid electrolyte layer; and a second insulating layer provided on the surface of the first insulating layer.

[0223] The second insulating layer is provided so as to cover at least a portion of an end portion of the solid electrolyte layer.

[0224] <8>

[0225] The solid electrolytic capacitor according to any one of <1> to <7>, wherein

[0226] The solid electrolytic capacitor further includes a sealing layer covering the conductive layer.

[0227] <9>

[0228] A solid electrolytic capacitor according to <8>, wherein:

[0229] The solid electrolytic capacitor further includes a through-hole conductor penetrating the sealing layer in the thickness direction.

[0230] <10>

[0231] A capacitor array, characterized in that:

[0232] The capacitor array includes a plurality of solid electrolytic capacitors according to any one of <1> to <9>.

[0233] Description of Reference Numerals

[0234] 1, 2, 3, 4, 5, 6, solid electrolytic capacitor; 10, anode plate; 11, core; 12, porous layer; 20, dielectric layer; 30, cathode layer; 31, solid electrolyte layer; 31a, end of solid electrolyte layer; 31b, side of solid electrolyte layer; 31c, side of solid electrolyte layer; 32, conductor layer; 32A, first conductor layer; 32B, second conductor layer; 32a, end of conductor layer on the opposite side to solid electrolyte layer; 40, insulating layer; 40A, first insulating layer; 40B, second insulating layer; 50, sealing layer; 60, insulating portion; 70, via conductor; 71, anode wiring pattern; 72, cathode wiring pattern; 80A, 80B, through-hole conductor; 81A, 81B, through-hole; 101, capacitor array.

Claims

1. A solid electrolytic capacitor, characterized in that: The solid electrolytic capacitor includes: an anode plate having a porous layer on at least one major surface; a dielectric layer disposed on a surface of the porous layer; a solid electrolyte layer disposed on a surface of the dielectric layer; a conductor layer provided on a surface of the solid electrolyte layer; and an insulating layer disposed on a surface of the dielectric layer, The insulating layer is provided in a region surrounding the solid electrolyte layer so as to cover at least a portion of an end portion of the solid electrolyte layer.

2. The solid electrolytic capacitor according to claim 1, wherein: The insulating layer is provided so as to cover at least an end portion of a portion of the end portion of the solid electrolyte layer where the length from the end portion of the solid electrolyte layer to the end portion of the conductor layer is the shortest when viewed in plan from the thickness direction.

3. The solid electrolytic capacitor according to claim 1 or 2, wherein: The solid electrolyte layer has a quadrilateral shape when viewed from the thickness direction. The insulating layer is provided so as to cover at least a side of the side of the solid electrolyte layer having a portion having the shortest length from an end of the solid electrolyte layer to an end of the conductor layer when viewed in plan from the thickness direction.

4. The solid electrolytic capacitor according to any one of claims 1 to 3, wherein The insulating layer is provided so as to cover the entire end portion of the solid electrolyte layer when viewed in plan from the thickness direction.

5. The solid electrolytic capacitor according to any one of claims 1 to 4, wherein The conductive layer is provided so as to cover at least a portion of the end portion of the insulating layer.

6. The solid electrolytic capacitor according to claim 5, wherein: When viewed in plan from the thickness direction, an end portion of the conductor layer on the side opposite to the solid electrolyte layer is located outside an end portion of the solid electrolyte layer.

7. The solid electrolytic capacitor according to any one of claims 1 to 6, wherein: The insulating layer includes: a first insulating layer provided on a surface of the dielectric layer in a region surrounding the solid electrolyte layer; and a second insulating layer provided on a surface of the first insulating layer. The second insulating layer is provided so as to cover at least a portion of an end portion of the solid electrolyte layer.

8. The solid electrolytic capacitor according to any one of claims 1 to 7, wherein The solid electrolytic capacitor further includes a sealing layer covering the conductor layer.

9. The solid electrolytic capacitor according to claim 8, wherein: The solid electrolytic capacitor further includes a through-hole conductor penetrating the sealing layer in a thickness direction.

10. A capacitor array, characterized in that: The capacitor array comprises a plurality of solid electrolytic capacitors according to any one of claims 1 to 9.

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