Package with vertical electronic components held together by clips

Abstract

The invention relates to a package with vertical electronic components held together by clips. A package (100) includes a vertically extending first electronic component (102) having at least one exposed electrically conductive first terminal (104-106), a vertically extending second electronic component (108) having at least one exposed electrically conductive second terminal (110-112), and a clip (114) having a containment volume (116) in which the first electronic component (102) and the second electronic component (108) are coupled to each other. The first electronic component (102) and the second electronic component (108) are housed and held together with the at least one first terminal (104-106) and the at least one second terminal (110-112) being electrically accessible at the bottom of the clip (114).

Description

Technical Field

[0001] Various embodiments generally relate to packages and methods of manufacturing packages. Background Art

[0002] Conventional packages may include electronic components mounted on a chip carrier, may be electrically connected via bond wires extending from the chip to the chip carrier or leads, and may be molded using a molding compound as an encapsulant.

[0003] Space consumption in traditional packaging can be an issue. Summary of the invention

[0004] There may be a need for a compact package with high reliability and reasonable or low manufacturing effort.

[0005] According to an exemplary embodiment, a package is provided, comprising a vertically extending first electronic component having at least one exposed conductive first terminal, a vertically extending second electronic component having at least one exposed conductive second terminal, and a clip having a receiving volume, in which the first electronic component and the second electronic component are received and held together, wherein at least one first terminal and at least one second terminal are electrically accessible at a bottom of the clip.

[0006] According to another exemplary embodiment, a method of manufacturing a package is provided, the method comprising inserting a vertically extending first electronic component having at least one exposed conductive first terminal into a receiving volume of a clip, inserting a vertically extending second electronic component having at least one exposed conductive second terminal into the receiving volume of the clip, holding the first electronic component and the second electronic component in the receiving volume together by the clip, and configuring the first electronic component, the second electronic component and the clip so that at least one first terminal and at least one second terminal are electrically accessible at a bottom of the clip.

[0007] According to an exemplary embodiment, the package includes at least two vertically extending electronic components, each of which has one or more exposed terminals. Advantageously, the clip accommodates and holds two electronic components in its vertical orientation in its accommodating volume. The design of the package can make the terminals of the electronic components electrically accessible on the bottom side of the clip. Such a package design has the following beneficial effects: due to the vertical arrangement of the electronic components, the package footprint and therefore the spatial size of the package can be very small. Therefore, a high integration density can be achieved using the described packaging concept. At the same time, the clip not only realizes a mechanical protection function by accommodating and at least partially surrounding the electronic components therein, but also contributes to the electronic function of the package by enabling the terminals of the components to be touched at the bottom of the clip. In order to manufacture the package, inserting the vertically oriented electronic components into the accommodating volume can be an easy task, which can simplify manufacturability compared with conventional methods. Therefore, the package according to the exemplary embodiment can be compact, can have high reliability, and can be produced in a simple manner.

[0008] Description of Further Exemplary Embodiments

[0009] In the following, further exemplary embodiments of the package and the method will be explained.

[0010] In the context of the present application, the term "package" may particularly denote an electronic device that may include electrically connected electronic components. The components of the package may optionally be encapsulated by a sealant. In addition, optionally, one or more conductive interconnect bodies (such as metal pillars, pumps, bonding wires, conductive plates and / or clips) may be implemented in the package, for example for electrical coupling and / or mechanical support of the electronic components. It is also possible that one or more carriers form part of the package, for example a metal carrier that contributes to the electronic function.

[0011] In the context of the present application, the term "electronic component" may include in particular semiconductor chips (in particular power semiconductor chips), active electronic devices (such as transistors), passive electronic devices (such as capacitors or inductors or ohmic resistors), sensors (such as microphones, light sensors or gas sensors), actuators (such as loudspeakers), and micro-electromechanical systems (MEMS). However, in other embodiments, the electronic components may also be of different types, such as mechanical electronic components, in particular mechanical switches, etc. In particular, the electronic component may include a semiconductor chip having at least one integrated circuit element (such as a diode or transistor in its surface portion). The electronic component may be a bare die, or may be encapsulated or packaged. The semiconductor chip implemented according to the exemplary embodiment may be formed, for example, with silicon technology, gallium nitride technology, silicon carbide technology, etc.

[0012] In the context of the present application, the term "vertically extending electronic component" may particularly refer to an electronic component that is arranged so that its thickness direction extends horizontally and / or its main surface extends vertically. The main surfaces may be two opposing surfaces of the electronic component with the largest area. When the specified electronic component is inserted into the accommodating volume of the clip and when the bottom of the clip is located on the horizontal surface, the active area of ​​the semiconductor chip-type electronic component may extend in a vertical plane. In a scenario where the vertically extending electronic component has a rectangular parallelepiped shape or a substantially rectangular parallelepiped shape, the minimum size of the electronic component may extend horizontally. At the vertically extending electronic component, its terminals may have a vertically exposed surface area.

[0013] In the context of the present application, the term "clip" may particularly refer to a physical structure that defines a housing volume therein and is configured to apply a retaining force (such as a clamping force and / or a connecting force applied by a connecting medium such as solder) when two (or more) vertically oriented electronic components are inserted into the housing volume of the clip as a stack or sandwich. More specifically, the clip of a preferred embodiment may be: a clip designed to bundle or compress or press two or more parts (including at least two vertically extending electronic components) together so as to hold them firmly. For example, a clamping type clip may apply an elastic force (such as a spring force) to the vertically extending electronic components to hold them tightly together.

[0014] In the context of the present application, the term "terminal" may particularly denote: a conductive interface element (such as a metal pad) of an electronic component, which is accessible and used to conduct electrical signals or power toward and / or away from the electronic component. In particular, the corresponding electronic component may be a chip with an integrated transistor. Such a transistor may be a field effect transistor chip with a source terminal (or pad), a drain terminal (or pad) and a gate terminal (or pad). Alternatively, the corresponding chip with an integrated transistor may be a bipolar transistor chip with an emitter terminal (or pad), a collector terminal (or pad) and a base terminal (or pad). A diode-type electronic component may have a cathode terminal and an anode terminal.

[0015] In the context of the present application, the term "terminals electrically accessible at the bottom of the clip" may particularly denote that a conductive structure is exposed at the bottom side of the clip, which can be contacted for establishing an electrically conductive connection with a corresponding terminal of the electronic component. For example, when the clip is made of an at least partially conductive material and when a retaining force is exerted on the terminals of one of the electronic components, this can be achieved by the clip itself, so that contacting the bottom side of the clip allows an electrical connection to or access to the terminal. It is also possible that one of the terminals itself is directly accessible at the bottom of the clip. In a further embodiment, the terminals of one of the electronic components may be accessible at the bottom of the clip via a further conductive element (such as a metal carrier), which in turn is electrically coupled to the corresponding terminal.

[0016] In an embodiment, at least one of the first electronic component and the second electronic component is a bare die, a die encapsulated by a sealant, a plurality of dies encapsulated by a sealant, a bare die mounted on a conductive element (such as a carrier), or a bare die connected between two conductive elements. In the context of the present application, the term "bare die" may be a non-packaged semiconductor chip. In the context of the present application, the term "sealant" may particularly refer to: a substantially electrically insulating material that surrounds the die to provide mechanical protection, electrical insulation, and optionally facilitate heat removal during operation. In particular, the sealant may be a molding compound. The molding compound may include a matrix of flowable and hardenable material and filler particles embedded therein. As an alternative to a molding compound (e.g., based on epoxy resin), the sealant may also be a potting compound (e.g., based on silicone). In the context of the present application, the term "conductive element" may particularly refer to an at least partially conductive carrier or support structure (such as a metal plate) that serves as a mechanical support for the (one or more) electronic components mounted thereon, and may also facilitate electrical interconnection between the (one or more) electronic components and the periphery of the package. In other words, the carrier can realize the mechanical support function and the electrical connection function. The carrier may include or consist of a single part, a plurality of parts connected via a package or other package components, or a subassembly of the carrier. When the carrier forms a part of the lead frame, it may be or may include a die pad. For example, such a carrier may be a lead frame structure (e.g., made of copper), a DAB (direct aluminum bonding) substrate, a DCB (direct copper bonding) substrate, etc. In addition, the carrier may also be configured as an active metal brazing (AMB) substrate.

[0017] In particular, the package can be configured according to the following three embodiments: In a first embodiment, the clip is a clip that clamps the first vertically extending component and the second vertically extending electronic component together. In a second embodiment, the clip is attached to the first vertically extending electronic component and / or the second vertically extending electronic component via a clip connecting medium (such as glue or solder). In a third embodiment, the retention achieved by clamping according to the first embodiment and the retention achieved by the connecting medium according to the second embodiment can be combined.

[0018] In an embodiment, the clip is configured to clamp the first electronic component and the second electronic component in the receiving volume together by a clamping force. For example, the clamping force applied by the clip to the electronic component can be the only connection force used to connect the electronic components. This can lead to a very simple design. Alternatively, the clamping force applied by the clamp-type clip can be supplemented by a connection medium (such as solder or glue) that connects the clip to (one or more) electronic components and / or connects the electronic components to each other.

[0019] In an embodiment, the clip is electrically conductive. Preferably, a conductive connection is established between the clip and at least one of the at least one first terminal and the at least one second terminal by holding (e.g., clamping). For example, an electrical signal or power can flow from a terminal of the electronic component to the conductive clip, or vice versa. It is also possible that the electrical signal or power can flow from a first terminal of the first electronic component to a second terminal of the second electronic component via the conductive clip, or vice versa. Advantageously, the clip can then contribute to the electrical function of the package. For example, the clip can be directly clamped or integrally connected (e.g., welded) to a conductive terminal of at least one of the electronic components by direct physical contact, so that in addition to providing a mechanical connection and protection function, the clip can also conduct electrical signals or power to or from the terminal.

[0020] In an embodiment, by holding, a conductive connection is established between at least one of the at least one first terminal and at least one of the at least one second terminal (e.g., by direct physical contact or by a connecting medium therebetween). Thus, an electrical signal or power can flow from the first terminal of the first electronic component directly or only via the connecting medium therebetween to the second terminal of the second electronic component, or vice versa. The clip can then achieve a dual function, namely a mechanical holding function and an electrical connection function.

[0021] In an embodiment, the package includes a component connection medium, such as glue or solder, which connects the first electronic component in the containment volume to the second electronic component. By integrally connecting the first electronic component and the second electronic component to each other by the component connection medium, the reliability of the package can be further improved. As an alternative or in addition to clamping, a permanent connection can be established between two (or more) electronic components by gluing, welding, sintering, etc. For example, one main surface of the electronic component can be connected to the clip, and the relative main surfaces of the electronic component can be connected to each other by the component connection medium. For example, in addition to clamping, solder attachment (or attachment using another component connection medium) can be performed between the electronic components. In another embodiment, solder attachment (or attachment using another component connection medium) can be performed between the electronic components as an alternative to clamping.

[0022] In an embodiment, the component connection medium connects at least one of the at least one first terminal and at least one of the at least one second terminal to each other. In such a scenario, it may be advantageous that the component connection medium is conductive. The component connection medium can reliably connect the electronic components to each other and can also produce a conductive connection between them, for example for transmitting power or electrical signals.

[0023] In an embodiment, the package includes a clip connection medium, such as glue or solder, which connects the clip to at least one of the first electronic component and the second electronic component in the accommodating volume. Such a configuration can ensure the mechanical and / or electrical reliability of the electronic device. For example, the clamping connection between the clip and the (one or more) electronic components can be enhanced by an additional permanent connection established by the clip connection medium. Alternatively, the permanent connection established by the clip connection medium can be the only connection between the clip and the (one or more) electronic components. When the clip connection medium is conductive, it can also promote the electrical coupling between the terminals of the corresponding electronic components and the conductive clip. For example, in addition to clamping, solder attachment (or attachment using another clip connection medium) can be performed between the clip and the (one or more) electronic components. In another embodiment, solder attachment (or attachment using another clip connection medium) can be performed between the clip and the (one or more) electronic components as an alternative to clamping.

[0024] In an embodiment, the clip has a lateral extension at its bottom. For example, the lateral extension may extend laterally or radially outward in a horizontal direction from a central entry opening of the clip. The clip may have a retaining portion in which a retaining force may be applied to the electronic component, wherein the lateral extension may extend laterally from such a retaining portion. The lateral extension may facilitate assembly of the package on a mounting base (such as a printed circuit board) by increasing the available connection area. For example, the lateral extension may include two separate opposing lateral extension elements, or may have an annular shape.

[0025] In an embodiment, the package includes a mounting base, which is electrically and mechanically connected to the first electronic component, the second electronic component and the clip at its bottom. For example, such a mounting base can be a printed circuit board (PCB). The package can be surface mounted on the mounting base. Since all the terminals of the electronic component can be accessible at the bottom of the clip, connecting the clip to the mounting base through a conductive connecting medium (such as solder or sintered material) can establish a mechanical and electrical connection between the electronic component and the mounting base.

[0026] In an embodiment, the clip has a head (which may be facing away from the bottom) which is connected to a lateral holding portion, thereby defining the boundaries of the accommodation volume and leading to an external access opening on the end side. Advantageously but not necessarily, the head can be a closed head. A lateral holding portion, such as two lateral holding legs, can extend downward from the head and can apply an actual holding (e.g. clamping) force to the electronic component. The head can protect the electronic component in the accommodation volume.

[0027] In an embodiment, the clip has two spaced legs connected by a head. Such a clip can apply a retaining (particularly clamping) force to connect electronic components. This type of clip can have two separated legs that apply a clamping force. Alternatively, the clip can be a cap having a head connected to a circumferentially closed retaining sleeve (e.g., a sleeve limited in the center). The cap-type clip can be annularly closed to provide full peripheral protection and retaining (particularly clamping) performance. Advantageously, but not necessarily, the head can be a closed head.

[0028] In an embodiment, a vertical extension of the first electronic component and / or the second electronic component along the insertion direction into the accommodation volume is greater than another extension of the first electronic component and / or the second electronic component perpendicular to the insertion direction or along the clamping force direction. In particular, the maximum spatial extension of the first electronic component and / or the second electronic component may be in the vertical direction, i.e. along the insertion direction of the respective electronic component into the accommodation volume. The described configuration may result in a highly compact design.

[0029] In an embodiment, each of the at least one first terminal and the at least one second terminal has an outer plane arranged vertically or perpendicular to the clamping force direction. Such a terminal can be electrically and mechanically connected to the inner surface area of ​​the clip, and / or can be mechanically connected to the facing terminal of the corresponding other electronic component.

[0030] In an embodiment, the package includes a thermal interface body having a recess for receiving at least a portion of the clip. The thermal interface body may include a thermal interface material (TIM). Such a thermal interface material may be, for example, a thermal paste that provides thermal coupling with a heat sink with a low thermal resistance therebetween. The thermal interface body may help remove heat generated by the electronic component during operation of the package.

[0031] In an embodiment, the package includes a heat sink attached to the exterior of the thermal interface body. A suitable heat sink may be a heat dissipation body, which may be made of a highly thermally conductive material such as copper or aluminum. For example, such a heat sink may have a base facing the thermal interface body, and may have a plurality of cooling fins extending from the base and parallel to each other so as to remove heat toward the environment.

[0032] In an embodiment, the thermal interface body tapers from the heat sink towards the clip. Such an embodiment is for example Figure 7 . The described configuration allows the use of an enlarged heat sink in combination with a compact package. Furthermore, the design can result in efficient heat spreading. Thus, size reduction can be combined with excellent thermal performance.

[0033] In an embodiment, at least one of the at least one first terminal and the at least one second terminal is electrically accessible at the bottom of the clip by being electrically coupled to the clip comprising a conductive material. In other words, the electrical accessibility of the corresponding terminal can be indirectly achieved by the at least partially conductive clip, which allows the terminal to be electrically accessible at its bottom side and can be electrically connected to the terminal to be accessible.

[0034] In an embodiment, at least one of the at least one first terminal and the at least one second terminal is directly electrically accessible at an exposed bottom of the first electronic component and / or at an exposed bottom of the second electronic component. The clip may have an open bottom at which at least a portion of the terminals of the electronic component inserted into the receiving volume of the clip may be directly accessible. Thus, mounting only the bottom of the package (including the bottom of the clip) on the mounting base may be sufficient to directly access one, some or all of the terminals of the two electronic components.

[0035] In an embodiment, the center portion of the clip is connected (e.g., in direct contact) with the first electronic component and the second electronic component, wherein the bottom of the clip is laterally spaced apart by a gap relative to the first electronic component and the second electronic component. In other words, a gap can be formed between the bottom of the clip and the bottom of the electronic component held (e.g., clamped) by the clip, so that the electronic component and the center portion of the clip can be held (preferably clamped) together. In addition, an additional gap can be optionally formed between the top of the clip and the top of the electronic component. This can increase the mounting surface on the bottom side and the cooling surface on the top side while concentrating the clamping force in the center portion. In addition, such a design can result in a large creepage distance at the bottom of the clip.

[0036] In an embodiment, at least one of the first electronic component and the second electronic component comprises a transistor chip, i.e. a chip with an integrated transistor. This may particularly mean a chip, such as a semiconductor chip, in which at least a transistor may be integrated (particularly monolithically integrated). In particular, the corresponding chip with an integrated transistor may be a field effect transistor chip with a source terminal (or pad), a drain terminal (or pad) and a gate terminal (or pad). Alternatively, the corresponding chip with an integrated transistor may be a bipolar transistor chip with an emitter terminal (or pad), a collector terminal (or pad) and a base terminal (or pad). Specific examples of transistor chips are metal oxide semiconductor field effect transistors (MOSFETs) and insulated gate bipolar transistors (IGBTs).

[0037] In an embodiment, the package comprises at least one further first electronic component, at least one further second electronic component and at least one further clip having the above features, wherein a common mounting base is connected to the clip, the first electronic component, the second electronic component, the at least one further clip, the at least one further first electronic component and the at least one further second electronic component. Such an embodiment Figure 8 . A plurality of clips with inserted electronic components can be surface mounted on the same mounting base. This can allow even complex electronic functions to be realized in a compact manner and can allow efficient warpage management to be performed.

[0038] In an embodiment, the package comprises at least one further first electronic component having the above features, at least one further second electronic component and at least one further clip, wherein the common thermal interface body has a recess for receiving at least a portion of the clip and at least a portion of the at least one further clip. For such an embodiment, again refer to Figure 8 Various clips with inserted electronic components can share not only a common mounting base, but also a common interface body and heat sink. This can contribute to the compactness and excellent thermal performance of the package.

[0039] In an embodiment, the bottom of the first electronic component and the bottom of the second electronic component are exposed at an access opening to the receiving volume at the bottom of the clip. This can provide convenient electrical access to the terminals on the bottom side of the electronic components.

[0040] In an embodiment, the bottom of the clip, the bottom of the first electronic component and the bottom of the second electronic component are at the same vertical level. Therefore, the bottom of the clip and the electronic component can be flush with each other. This can simplify the electrical and mechanical connection to the mounting base, for example by providing a common soldering or sintering plane.

[0041] In an embodiment, at least one exposed conductive first terminal includes at least two (e.g., three) first terminals and / or at least one exposed conductive second terminal includes at least two (e.g., three) second terminals. The two-terminal electronic component may be a diode chip. The three-terminal electronic component may be a transistor chip. However, any other number of terminals of the electronic component is also possible.

[0042] In an embodiment, the method comprises manufacturing the first electronic component and the second electronic component as parts of a common packaged multi-component body, separating the first electronic component and the second electronic component from the multi-component body, inserting the separated first electronic component and the second electronic component into clips of a common multi-clip body, and subsequently separating the common multi-clip body into individual clips, thereby obtaining a plurality of separate packages. It is also possible to provide separate multi-component bodies for forming the first electronic component and for forming the second electronic component. With particular reference to Fig. 9 , batch manufacturing of packages can allow high throughput to be achieved on an industrial scale. The electronic components for the packages can be manufactured based on a common package multi-component body, which can be provided at low cost and can then be separated, for example, by mechanical cutting or laser cutting. The clips of the different packages can also initially form part of a common multi-clip body, which can be manufactured with a low workload. By inserting the separated electronic components into separate clip parts of the common multi-clip body and by subsequently separating the common multi-clip body into separate clips, multiple packages can be manufactured in a fast and efficient manner.

[0043] In an embodiment, the package is configured as a power package. A power package may be a package that includes at least one power chip as (one or more) electronic components. Thus, the package may be configured as a power module, such as a molded power module, such as a semiconductor power package. For example, an exemplary embodiment of the package may be an intelligent power module (IPM). Another exemplary embodiment of the package is a dual in-line package (DIP).

[0044] Accordingly, the electronic component can be configured as a power semiconductor chip. Therefore, the electronic component (such as a semiconductor chip) can be used for power applications in, for example, the automotive field, and can, for example, have at least one integrated insulated gate bipolar transistor (IGBT) and / or at least one other type of transistor (such as MOSFET, JFET, HEMT, etc.) and / or at least one integrated diode. Such an integrated circuit element can be manufactured, for example, with silicon technology or based on wide bandgap semiconductors (such as silicon carbide, gallium nitride). The semiconductor power chip can include one or more field effect transistors, diodes, inverter circuits, half bridges, full bridges, drivers, logic circuits, other devices, etc. The advantages of the exemplary embodiment related to isolation are particularly significant for power tube cores.

[0045] As a substrate or wafer forming the basis for the electronic component(s), a semiconductor substrate, in particular a silicon substrate, may be used. Alternatively, a silicon oxide or another insulator substrate may be provided. It is also possible to implement a germanium substrate or a III-V semiconductor material. For example, exemplary embodiments may be implemented in GaN or SiC technology.

[0046] The above and other objects, features and advantages will become apparent from the following description and appended claims taken in conjunction with the accompanying drawings in which like parts or elements are represented by like reference numerals. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The accompanying drawings are included to provide a further understanding of exemplary embodiments and constitute a part of this specification, and illustrate exemplary embodiments.

[0048] In the attached picture:

[0049] Figure 1 A cross-sectional view of a package according to an exemplary embodiment is illustrated.

[0050] Figure 2 Illustrated based on Figure 1 Side view of the package.

[0051] Figure 3 Illustrated based on Figure 1 Bottom view of the package.

[0052] Figure 4 A side view of a package according to an exemplary embodiment is illustrated.

[0053] Figure 5 Illustrated based on Figure 4 A 3D view of the package.

[0054] Figure 6 Illustrated is a cross-sectional view of a structure obtained during the manufacture of a package according to an exemplary embodiment.

[0055] Figure 7 A cross-sectional view of a package according to an exemplary embodiment is illustrated.

[0056] Figure 8 A cross-sectional view of a package according to another exemplary embodiment is illustrated.

[0057] Fig. 9 Different views of the structure obtained during the manufacture of a package according to an exemplary embodiment are illustrated.

[0058] Fig.10 A cross-sectional view of a package according to another exemplary embodiment is illustrated.

[0059] Fig.11 A cross-sectional view of a package according to yet another exemplary embodiment is illustrated.

[0060] Fig.12 A cross-sectional view of a package according to another exemplary embodiment is illustrated.

[0061] Fig.13 Illustrated based on Fig.12 Side view of the package.

[0062] Fig.14 Illustrated based on Fig.12 Bottom view of the package.

[0063] Fig.15 A flow chart of a method of manufacturing a package according to an exemplary embodiment is illustrated. DETAILED DESCRIPTION

[0064] The illustrations in the drawings are schematic and not drawn to scale.

[0065] Before describing the exemplary embodiments in more detail with reference to the accompanying drawings, some general considerations based on which the exemplary embodiments have been developed will be summarized.

[0066] There is a continuous trend towards miniaturization in the packaging of semiconductor dies. However, traditional packaging designs are increasingly subject to technological limitations.

[0067] According to an exemplary embodiment, the vertical package is provided with two or more vertically extending electronic components. The vertical component may have exposed terminals. The clip accommodates the electronic components inside it and holds the electronic components (e.g., clamped and / or integrally connected by a connecting medium such as solder) together for mechanically connecting them, and preferably for simultaneously establishing electrical coupling between them. Advantageously, the terminals of at least two held electronic components are electrically accessible at the bottom of the clip, such as indirectly electrically accessible by the clip, and / or directly electrically accessible by the accessible end of the electronic component at the bottom of the accommodating volume, or indirectly electrically accessible by one or more other conductive elements. Advantageously, the vertical orientation of the electronic components in their assembled state in the clip can lead to a compact package with high electrical and mechanical reliability. The corresponding manufacturing process is very simple, and only the vertical electronic components need to be inserted into the accommodating volume, in which the vertical electronic components can be automatically clamped and connected, and / or integrally connected by connecting materials or media. As a result, a package can be obtained, which is compact in size, can show excellent reliability and can be manufactured in a simple manner.

[0068] With regard to the dimensioning of SMD (surface mount device) packages, vertical packaging can provide a compact footprint design with a dual-side cooling option. A large chip package contact area can also be achieved with vertical packaging. This can result in low package resistance (e.g., reducing the Rdson value by about 60% for a dual-chip configuration). In addition, vertical packaging provides the possibility of reverse current flow in the package, which can result in low radiated emissions. In addition, improved temperature cycle on board (TCoB) characteristics can be achieved by the package according to the exemplary embodiment. In addition, the package design according to the exemplary embodiment can provide a high creepage distance. In addition to this, according to the exemplary embodiment, the potential separation of two (or more) electronic components during processes such as reflow can be reliably prevented.

[0069] Advantageously, exemplary embodiments may create a flat package to package stack. A clip, for example embodied as a U-shaped clip (e.g. in the form of a frame), may be provided to clamp from the top side and / or center side to stabilize the structure and make the electrical contacts accessible on the bottom side. In addition or as an alternative to clamping, the clip may also form an integral connection structure with the electronic component. Advantageously, such a manufacturing concept may be generally applicable to very different package types, and in particular to all double-sided cooled packages. The package according to the exemplary embodiment may be configured as a vertical package with low Rdson package DC-DC characteristics, excellent power regulation and high power efficiency.

[0070] In various embodiments, a vertical package configured with a single-die or dual-die design may be provided.

[0071] Thus, the exemplary embodiments provide a way to achieve compact package design in a vertical package configuration. At the same time, the exemplary embodiments can address challenges of vertical packaging regarding TCoB, creepage distance, risk of package separation during processes such as reflow, and heat dissipation.

[0072] Figure 1 A cross-sectional view of a package 100 is illustrated according to an exemplary embodiment. Figure 2 Illustrated based on Figure 1 1 is a side view of package 100 . Figure 3 Illustrated based on Figure 1 and Figure 2 1 is a bottom view of a package 100. The illustrated package 100 is a vertical power semiconductor package.

[0073] The vertically extending first electronic component 102 includes a semiconductor chip (e.g., a bare die, not shown) encapsulated by an encapsulant 164 (e.g., a mold compound). Although not shown, a chip carrier (e.g., a lead frame structure carrying a semiconductor chip) can be arranged inside the encapsulant 164 of the first electronic component 102. In the illustrated embodiment, the semiconductor chip provides a transistor function, such as a field effect transistor function. The vertically extending first electronic component 102 includes three exposed conductive first terminals 104-106. The first terminal 104 is a source terminal. The second terminal 105 is a drain terminal. The third terminal 106 is a gate terminal. The first electronic component 102 extends vertically in the illustrated assembled state so that its first terminals 104-106 are exposed at the vertical sidewalls of the first electronic component 102.

[0074] In addition, the second electronic component 108 extending vertically includes a semiconductor chip (e.g., a bare die, not shown) encapsulated by an encapsulant 164 (e.g., a mold compound). Although not shown, a chip carrier (e.g., a lead frame structure carrying a semiconductor chip) can be arranged inside the second electronic component 108. In the illustrated embodiment, the semiconductor chip provides a transistor function, such as a field effect transistor function. The second electronic component 108 extending vertically includes three exposed conductive second terminals 110-112. The first terminal 110 is a source terminal. The second terminal 111 is a drain terminal. The third terminal 112 is a gate terminal. The second electronic component 108 extends vertically so that its second terminals 110-112 are exposed at the vertical sidewalls of the second electronic component 108.

[0075] In the illustrated embodiment, the two transistor chips of the electronic components 102, 108 form two switches for enhancing the switching current. However, other embodiments may involve another electronic function, such as a diode function, a half-bridge function, etc. The electronic components 102, 108 may have the same chip type, or may be chips of different types. In addition, according to Figure 1The terminal arrangement of the source, drain and gate terminals can be changed, for example, Figures 1 to 3 Another configuration arrangement than that shown in . A greater or lesser number of terminals is also possible.

[0076] The clip 114 (which may be, for example, substantially U-shaped) defines a housing volume 116 within it. In the illustrated embodiment, the clip 114 is made of a conductive material such as metal so that the clip 114 may also contribute to the electrical function of the package 100, as will be described below. As shown, both the first electronic component 102 and the second electronic component 108 are housed in the housing volume 116 in a horizontally stacked vertical configuration and are held together by clamping forces applied to the stacked electronic components 102, 108 by the clip 114. More specifically, the clip 114 generates a substantially horizontal clamping force that clamps the electronic components 102, 108 to each other and to the clip 114 and the electronic components 102, 108 together. Due to the clamping force, the clip 114 and the electronic components 102, 108 form a firmly connected body that can be handled as a whole. When the electronic components 102 , 108 are inserted into the receiving volume 116 of the clip 114 in a vertical orientation, the electronic components 102 , 108 are clamped and connected to the clip 114 and to each other by the clamping force generated by the clip 114 .

[0077] Still refer to Figure 1 , the vertical center portion of the clip 114 directly contacts the first electronic component 102 and the second electronic component 108 (including their terminals 105, 111). In contrast, the bottom of the clip 114 is laterally spaced apart from the first electronic component 102 and the second electronic component 108 at the access opening 128. The bottom of the first electronic component 102 and the bottom of the second electronic component 108 are exposed at the access opening 128 to the receiving volume 116 at the bottom of the clip 114.

[0078] Considering the vertical arrangement or orientation of the electronic components 102, 108, the vertical extension of the first electronic component 102 and the second electronic component 108 along the insertion direction 142 into the receiving volume 116 is greater than the horizontal extension of the first electronic component 102 and the second electronic component 108 along the clamping force direction 144, along which the clamp 114 applies the clamping force. Accordingly, each of the first terminals 104-106 and the second terminals 110-112 has an outer plane arranged perpendicular to the clamping force direction 144 (i.e., vertically).

[0079] The electronic components 102, 108 are inserted into the receiving volume 116 of the clip 114 from the bottom side of the clip 114, so that the first terminals 104-106 and the second terminals 110-112 are electrically accessible from the outside of the package 100 at the bottom of the clip 114. Figure 1 and Figure 3 As best seen in the drawings, the terminals 104, 106, 110 and 112 are directly electrically accessible to the exposed portions of the electronic components 102, 108 on the bottom side of the clip 114. In addition, the terminals 105, 111, which are in direct physical contact with the wall portions of the clip 114, are electrically accessible on the bottom side of the clip 114 via the lateral extensions 120 of the clip 114. The lateral extensions 120 can result in a large soldering area. The gull-wing design of the clip 114 ensures favorable TCoB characteristics and allows for proper management of creepage distances. Advantageously, the electrical accessibility of all terminals 104-106, 110-112 at the bottom of the clip 114 allows the package 100 to be simply assembled on a mounting base 122 (such as a printed circuit board) by merely soldering the package 100 to the mounting base 122, see Figure 6 This may be sufficient to establish electrical connections between all of the terminals 104-106, 110-112 of the package 100 and the mounting base 122. Since the bottom of the clip 114, the bottom of the first electronic component 102, and the bottom of the second electronic component 108 are at the same vertical level (see Figure 1 ), thus further facilitating the assembly of the package 100 on the mounting base 122. Since the clip 114 is conductive, a conductive connection can be established between the clip 114 and the terminals 105, 111 by clamping. In addition, the clamping force holds the electronic components 102, 108 together, which is used to facilitate the electrical connection between the terminals 105, 111, between the terminals 104 and 110, and optionally between the terminals 112 and 106. The terminals 105, 111 are indirectly electrically accessible at the bottom of the clip 114 by being electrically coupled to the clip 114 made of conductive material. In addition, the terminals 104, 106, 110, 112 are directly electrically accessible at the exposed bottoms of the first electronic component 102 and the second electronic component 108, respectively. In short, the clamping function of the clip 114 may facilitate a mechanical connection between the electronic components 102 , 108 and the clip 114 , and may also establish an electrical connection between the electronic components 102 , 108 and the clip 114 .

[0080] like Figure 1 and Figure 3 As best seen in FIG. 1 , package 100 further includes an optional component connection medium 118, such as solder, that connects first electronic component 102 in receiving volume 116 with second electronic component 108. More specifically, connection medium 118 may connect terminals 104, 110, and may connect terminals 105, 111 by soldering. As an alternative to solder, connection medium 118 may also be a conductive glue or a sintered material.

[0081] In the illustrated embodiment, the clamp 114 has a horizontally extending closed head 124 connected to a vertically extending transverse clamping portion 126, thereby defining the boundaries of the receiving volume 116 and leading to an external access opening 128 on the end side. More specifically, Figures 1 to 3 The clip 114 is a clip having two legs 130, 132 connected by a closed head 124. This configuration protects the electronic components 102, 108 received by the clip 114, provides a clamping function, and also facilitates electrical function. In addition, the clip 114 has a lateral extension portion 120 extending horizontally from the lateral clamping portion 126 at its bottom. This can increase the connection area available for assembling the package 100 on the mounting base 122 (see Figure 6 ).

[0082] Figure 4 A side view of package 100 is illustrated according to an exemplary embodiment. Figure 5 Illustrated based on Figure 4 A three-dimensional view of package 100 is shown.

[0083] In accordance with Figure 4 and Figure 5 In the embodiment of FIG. 1 , the vertical sidewalls of the package 100 are formed in part by the lateral clamping portions 126 of the clip 114, by the exposed major surfaces of the encapsulant 164 of the electronic components 102, 108, and by the connecting bars 170 through which the individual packages 100 are separated. Figure 5 As best seen in FIG. 1 , the terminals 104 - 106 , 111 are exposed directly at the bottom of the connected electronic components 102 , 108 (at Figure 4 and Figure 5 not separately indicated).

[0084] use Figure 4 and Figure 5 With the clip type clamping arrangement of FIG. 1 , the top surface of the package 100 becomes flat at the head 124. This is highly advantageous in terms of easy component picking, especially when assembling larger electronic devices.

[0085] Also regarding creepage distance, Figure 4 and Figure 5 The package 100 provides the advantage of enhancing the creepage characteristics from 'limited by package thickness' to 'limited by package surface'. Due to the clearance at the access opening 128, the creepage distance L can be increased compared to the conventional method. Figure 4 and Figure 5 The design of, for example, when assembling the illustrated package 100 on the mounting base 122, can have a positive impact on board-level assembly.

[0086] Figure 6A cross-sectional view of a structure obtained during the manufacture of package 100 according to an exemplary embodiment is illustrated.

[0087] exist Figure 6 The left hand side shows the Figure 1 The package is mounted on Figure 6 The mounting base 122 on the right hand side of the mounting base 122 can be, for example, a lead frame or a printed circuit board. For this assembly, the conductive structures 174 (such as pads) on the surface of the mounting base 122 can be connected to the lateral extension 120 and to the exposed terminals 104, 106, 110, 112 (at the right hand side of the mounting base 122) with the mounting base connection medium 117 therebetween. Figure 6 The mounting base 122 is connected to the first electronic component 102, the second electronic component 108 and the clip 114 (only partially visible in the figure). This can be achieved by a mounting base connection medium 117 embodied as solder, sinter or conductive glue. The electrical accessibility of all terminals 104-106, 110-112 of the clamped connected electronic components 102, 108 at the bottom of the clip 114 can achieve a simple and planar assembly of the package 100 on the mounting base 122. Therefore, during the assembly process, the mounting base 122 can be electrically and mechanically connected to the first electronic component 102, the second electronic component 108 and the clip 114 at its bottom.

[0088] Further advantageously, the bottom of the legs 130, 132 tapers towards the head 124, so that the access opening 128 forms a gap between the electronic components 102, 108 on the one hand and the laterally extending portion 120 on the other hand. This creates a large creepage distance.

[0089] Optionally, the source / gate pads can be closed with glue at the illustrated sandwich structure. A connecting structure (such as solder) can close the gap and can also increase the soldering area for better TCoB or low-ohmic contact.

[0090] Figure 7 A cross-sectional view of a package 100 is illustrated according to an exemplary embodiment.

[0091] like Figure 7 As shown, package 100 may include a thermal interface (TIM) body 148 having a recessed portion that receives an upper portion of clip 114. In addition, heat sink 152 (in Figure 714) can be attached to the exterior of the thermal interface body 148. Advantageously, the thermal interface body 148 can be tapered from the heat sink 152 toward the clip 114. The thermal interface body 148 can be made of a material with appropriate thermal conductivity, for example, it can include thermal conductive paste or thermal conductive grease, etc. Therefore, the thermal interface body 148 can reduce the thermal barrier between the clip 114 and the heat sink 152, which can be made of a high thermal conductivity material such as aluminum or copper. The illustrated arrangement provides a very high contact area and therefore a very low contact thermal resistance between the clip 114 and the heat sink 152. Therefore, the heat generated by the electronic components 102, 108 during operation of the package 100 can be removed very efficiently to the heat sink 152 via the thermal interface body 148, and can be dissipated from here toward the environment. The tapered configuration of the thermal interface body 148 can spread the heat toward a larger area of ​​the heat sink 152, which can make the heat removal very efficient.

[0092] Thus, package 100 may have thermal contact with the TIM and heat sink 152. In this context, the U-shaped clip structure of clip 114 may provide a large contact area. This may result in package 100 having excellent thermal performance.

[0093] Figure 8 A cross-sectional view of a package 100 according to yet another exemplary embodiment is illustrated. Figure 8 Examples and Figure 7 The embodiments of the invention differ in particular in that: Figure 8 , a plurality of clips 114, in which the electronic components 102, 108 are clamped, are connected to the same thermal interface body 148 and the same heat sink 152. This can make the thermal dissipation of heat even more efficient.

[0094] More specifically, according to Figure 8 The package 100 additionally comprises: two further first electronic components 102', 102", two further second electronic components 108', 108", and two further clips 114', 114", having the same configuration as described with reference to Figures 1 to 3 Features described for the first electronic component 102, the second electronic component 108, and the clip 114. A common mounting base 122 (such as a PCB) is connected to the clip 114, the first electronic component 102, the second electronic component 108, the other two clips 114', 114", the other two first electronic components 102', 102" and the other two second electronic components 108', 108". In addition, the common thermal interface body 148 has: three recesses that accommodate the tops of the clip 114 and the other two clips 114', 114". This configuration simplifies the assembly of components, thereby providing even complex electrical functions with low space consumption and efficient heat removal and heat dissipation. In addition, Figure 8 The illustrated arrangement provides improved warpage management.

[0095] Thus, utilizing the small footprint of package 100 (where electronic components can be placed close together on a PCB) and the large contact area with the TIM, the impact of thermal resistance variations or bottlenecks on applications can be reduced or even minimized.

[0096] Fig. 9 Different views of the structure obtained during the manufacture of package 100 according to an exemplary embodiment are illustrated. The batch manufacturing process shown is very efficient and allows the package 100 to be manufactured with high throughput on an industrial scale.

[0097] Referring to reference numeral 180, the first electronic component 102 and the second electronic component 108 are manufactured as part of a common packaged multi-component body 156. Alternatively, the first electronic component 102 is manufactured as part of a common packaged multi-component body 156, and the second electronic component 108 is manufactured as part of another common packaged multi-component body 156. The terminals 104-106, 110-112 of the electronic components 102, 108 can be exposed outside the sealant 164, which can be a molding compound. According to reference numeral 180, the terminals 104-106, 110-112 or pads can be tin-plated.

[0098] Referring to reference numeral 182, the multi-component body 156 is shown after forming a connection medium 118 on the exposed terminals 104-106, 110-112. For example, the connection medium 118 can be formed by printing a conductive paste. This process can be optional, for example, when the corresponding pads or terminals can form a non-reflow sensitive interconnection.

[0099] With reference to reference numeral 184 , the obtained structure can be subjected to a singulation process (and an optional glue curing process). By taking this measure, the first electronic component 102 and the second electronic component 108 are separated from one or different multi-component bodies 156 .

[0100] Reference numeral 186 shows a mirrored singulated package structure that may undergo a pick and place process.

[0101] Optionally, the respective first electronic component 102 and the respective second electronic component 108 may be stacked, optionally with a connecting medium 118 therebetween (see reference numeral 188 ).

[0102] The stacked pair of separated first electronic components 102 and separated second electronic components 108 are inserted into the clips 114 of the common multi-clip body 158 in a vertical orientation, see reference numeral 190. Thus, a sandwich of electronic components 102, 108 can be inserted into a U-shaped clip frame. The common multi-clip body 158 includes a plurality of integrally formed clips 114 (see reference numeral 194; the incoming U-shaped clip frame can be plated, such as tinned, or pre-treated in another manner, for example). More specifically, a vertically extending first electronic component 102 having at least one exposed conductive first terminal 104-106 is inserted into the receiving volume 116 of the clip 114 together with a vertically extending second electronic component 108 having at least one exposed conductive second terminal 110-112. The first electronic component 102 and the second electronic component 108 are clamped together in the receiving volume 116 by the clamping force generated by the clip 114. Advantageously, the first electronic component 102 , the second electronic component 108 , and the clip 114 are configured such that the at least one first terminal 104 - 106 and the at least one second terminal 110 - 112 are electrically accessible at the bottom of the clip 114 .

[0103] In addition or as an alternative to clamping the electronic components 102, 108 together by means of a clamping-type clip 114, it is also possible to hold the electronic components 102, 108 together by means of a clip 114 which is connected to the electronic components 102, 108 by means of a connecting medium (see e.g. Fig.12 Reference numerals 118, 119 in FIG.

[0104] Referring now to reference numeral 192 , the common multi-clip body 156 with inserted electronic components 102 , 108 is separated (eg, by stamping singulation) into individual clips 114 , each clip 114 having a pair of inserted, clip-connected electronic components 102 , 108 , thereby obtaining a plurality of separate packages 100 .

[0105] One or more additional processes may be performed at the end of fabrication, such as electroplating, laser marking, clamp-to-TSC melt annealing, and press singulation.

[0106] Fig.10 A cross-sectional view of a package 100 according to another exemplary embodiment is illustrated.

[0107] exist Fig.10104, the electronic components 102, 108 each include a bare die connected to a pair of parallel conductive elements 160, 162 via a connecting medium 118. For example, such conductive elements 160, 162 may include a chip carrier (such as a lead frame structure or a metal plate, or any other connector), a metal clip, etc. It is also possible that only one conductive element 160, 162 is provided for each electronic component 102, 108. In the embodiment shown, the conductive elements 160, 162 are exposed outside the corresponding encapsulant 164 and are accessible on the bottom side of the clip 114 for providing electrical access to the designated terminals 104, 105, 110, 111. Therefore, the conductive elements 160, 162 interconnect the corresponding semiconductor chips of the electronic components 102, 108 to the bottom side of the package 100. The terminals 104 , 105 , 110 , 111 are thus electrically accessible at the bottom of the clip 114 by being electrically coupled to the conductive elements 160 , 162 extending vertically in the receiving volume 116 up to the bottom of the clip 114 .

[0108] exist Fig.10 In an embodiment of the present invention, it is possible, for example, that the clamp 114 is a cap having a closed head 124 connected to a circumferentially closed clamping sleeve 138. In short, Fig.10 Embodiments may rely on a four-sided or circumferentially closed cover or cap, rather than a two-sided or two-legged clamp (such as, for example Figure 1 Therefore, Fig.10 As an alternative to using a U-shaped clip, the cover can be used as the clip 114. Fig.10 , the sleeve 138 is embodied as a centrally constrained sleeve, which may further enhance the clamping performance of the clip 114 .

[0109] according to Fig.10 , the clamp 114 only provides a mechanical clamping force (applied in the clamping force direction 144) and is not electrically conductive. Fig.10 The clip 114 may also be made of an electrically insulating material such as plastic. Fig.10 In FIG. 1 , the clip 114 also has an electronic function in that it presses the metallic conductive elements 162 , 162 of the electronic components 102 , 108 together, thereby creating a conductive coupling between them.

[0110] Fig.11 A cross-sectional view of a package 100 according to yet another exemplary embodiment is illustrated.

[0111] Fig.11 Examples and Fig.10 The embodiments of the invention differ in particular in that: Fig.11, the sealant 164 is omitted in both electronic components 102, 108, so that when the clamping force is applied, the clip 114 acts directly on the conductive element 160 of the electronic components 102, 108. When the clip 114 is made of a metal material, it can also electrically couple the terminals 104 and 111 to each other via the conductive element 160 and the clip 114 itself. Alternatively, the clip 114 can also be made of Fig.11 Made of electrical insulating materials. Fig.11 The package 100 is a non-molded package.

[0112] Fig.12 A cross-sectional view of a package 100 according to another exemplary embodiment is illustrated. Fig.13 Illustrated based on Fig.12 1 is a side view of package 100 . Fig.14 Illustrated based on Fig.12 1 is a bottom view of package 100 .

[0113] and Figures 1 to 3 In contrast to the embodiment, Figure 12 to Figure 14 The embodiment of the present invention comprises a clip connection medium 119 (e.g., glue or solder) which integrally connects the clip 114 to the first electronic component 102 and the second electronic component 108 in the receiving volume 116. Therefore, by combining the clamping connection formed by the clip 114 with the permanent material connection formed by the clip connection medium 119, the embodiment according to the present invention can be further improved. Figure 12 to Figure 14 As shown, a spatially confined central portion of the clip 114 may contact the first electronic component 102 and the second electronic component 108 via the clip connection medium 119 (and / or with direct physical contact).

[0114] Reference Fig.12 , each leg 130, 132 is constrained in a central portion where the clip 114 is clamped onto the electronic component 102, 108. In addition, each leg 130, 132 tapers from the bottom of the clip 114 and from the head 124 of the clip 114 toward the central portion. On the top side, this results in an enlarged top surface area, thereby achieving improved heat removal. On the bottom side, this results in a higher creepage distance.

[0115] therefore, Figure 12 to Figure 14 The embodiment has Figures 1 to 3 Embodiments of different U-shaped clip contact profiles. A point contact clamping profile is provided for realizing additional soldering points of the package top pad to the clip. With this embodiment, an increased top cooling area can also be realized. In particular, the main cooling surface there can lead to a smaller TIM thickness to the heat sink.

[0116] It will be appreciated that the U-clip lead foot shape is also not limited to a gull-wing feature, but may also be embodied in another manner. The size of the U-clip is also not limited, and may be, for example, larger or smaller than the plastic package, or may be of the same size.

[0117] also, Figure 12 to Figure 14 Embodiments of the present invention may also be adapted with a clip 114 that does not apply a clamping force to the vertical electronic components 102, 108 for holding them together. In such an embodiment, it is possible that the clip connecting medium 119 alone provides a holding force or a connecting force, thereby holding the clip 114 on the one hand and the electronic components 102, 108 on the other hand together (i.e., without clamping). The corresponding overall connection that holds the components of the package 100 according to such an embodiment together can be further enhanced by the component connecting medium 118 that holds the electronic components 102, 108 together. In such an embodiment, the clip 114 acts as a protective structure that defines and provides a housing volume 116, in which the electronic components 102, 108 can be accommodated and connected to each other and to the clip 114 by connecting media 118, 119 (such as solder, sintering paste, glue, etc.).

[0118] Fig.15 A flow chart 200 is illustrated of a method of manufacturing a package 100 according to an exemplary embodiment. Reference numerals used in the following description of the manufacturing method refer to Figure 1 Embodiment of the invention.

[0119] Referring to block 202 , the method includes inserting a vertically extending first electronic component 102 having at least one exposed electrically conductive first terminal 104 - 106 into a receiving volume 116 of a clip 114 .

[0120] Referring to block 204 , the method includes inserting a vertically extending second electronic component 108 having at least one exposed conductive second terminal 110 - 112 into the receiving volume 116 of the clip 114 .

[0121] Referring to block 206 , the method includes holding (eg, clamping) the first electronic component 102 and the second electronic component 108 together in the receiving volume 116 via the clamp 114 (and optionally additionally via the connecting medium 118 and / or 119 ).

[0122] Referring to block 208 , the method includes configuring the first electronic component 102 , the second electronic component 108 , and the clip 114 such that at least one first terminal 104 - 106 and at least one second terminal 110 - 112 are electrically accessible at a bottom of the clip 114 .

[0123] As a result, a package 100 can be obtained, which includes a vertically extending first electronic component 102 having at least one exposed conductive first terminal 104-106, a vertically extending second electronic component 108 having at least one exposed conductive second terminal 110-112, and a clip 114 having a receiving volume 116, in which the first electronic component 102 and the second electronic component 108 are received and held (e.g., clamped) together, wherein the at least one first terminal 104-106 and the at least one second terminal 110-112 are electrically accessible at the bottom of the clip 114.

[0124] It should be understood that each of the above-described embodiments in which the electronic components 102, 108 are held together only by the clamping clip 114 can also be modified to a non-clamping clip 114 in combination with a clip connection medium 119 and / or a component connection medium 118, or to a clamping clip 114 in combination with a clip connection medium 119 and / or a component connection medium 118. Accordingly, each of the above-described embodiments in which the electronic components 102, 108 are held together by a non-clamping clip 114 in combination with a clip connection medium 119 and / or a component connection medium 118 can also be modified to a clamping clip 114 with or without a clip connection medium 118 and / or a component connection medium 118.

[0125] It should be noted that the term "comprising" does not exclude other elements or features, and "a" or "an" does not exclude a plurality. Elements described in association with different embodiments may also be combined. It should also be noted that reference signs should not be interpreted as limiting the scope of the claims. In addition, the scope of the present application is not intended to be limited to the specific embodiments of the processes, machines, manufactures, material compositions, devices, methods and steps described in the specification. Therefore, the appended claims are intended to include such processes, machines, manufactures, material compositions, devices, methods or steps within their scope.

Claims

1. A package (100), comprising: A vertically extending first electronic component (102) having at least one exposed conductive first terminal (104-106); a vertically extending second electronic component (108) having at least one exposed electrically conductive second terminal (110-112); and a clip (114) having a receiving volume (116) in which the first electronic component (102) and the second electronic component (108) are received and held together; • wherein the at least one first terminal (104-106) and the at least one second terminal (110-112) are electrically accessible at the bottom of the clip (114).

2. The package (100) according to claim 1, comprising: A component connecting medium (118), such as glue or solder, connects the first electronic component (102) and the second electronic component (108) in the receiving volume (116).

3. The package (100) according to claim 2, wherein: The component connection medium (118) connects at least one of the at least one first terminal (104-106) and at least one of the at least one second terminal (110-112) to each other.

4. The package (100) according to any one of claims 1 to 3, comprising: A clip connecting medium (119), such as glue or solder, connects the clip (114) to at least one of the first electronic component (102) and the second electronic component (108) in the receiving volume (116).

5. The package (100) according to any one of claims 1 to 4, wherein: The clamp (114) is configured to clamp the first electronic component (102) and the second electronic component (108) together in the receiving volume (116) through a clamping force.

6. The package (100) according to any one of claims 1 to 5, wherein: At least one of the first electronic component (102) and the second electronic component (108) is a bare die, a die encapsulated by an encapsulant (164), a plurality of dies encapsulated by an encapsulant (164), a bare die mounted on a conductive element (160, 162), or a bare die connected between two conductive elements (160, 162).

7. The package (100) according to any one of claims 1 to 6, wherein: The clip (114) is electrically conductive.

8. The package (100) according to claim 7, wherein: By means of the holding, an electrically conductive connection is established between the clip (114) and at least one of the at least one first terminal (104-106) and the at least one second terminal (110-112).

9. The package (100) according to any one of claims 1 to 8, wherein: By means of the holding, an electrically conductive connection is established between at least one of the at least one first terminal (104-106) and at least one of the at least one second terminal (110-112).

10. The package (100) according to any one of claims 1 to 9, wherein: The clip (114) has a transverse extension (120) at its bottom.

11. The package (100) according to any one of claims 1 to 10, comprising a mounting base (122) which is electrically and mechanically connected to the first electronic component (102), the second electronic component (108) and the clip (114) at its bottom.

12. The package (100) according to any one of claims 1 to 11, wherein: The clip (114) has a head (124) which is connected to a lateral retaining portion (126) so as to define the boundaries of the receiving volume (116) and lead to an external access opening (128) on the end side.

13. The package (100) according to any one of claims 1 to 12, wherein: The clip (114) has two spaced-apart legs (130, 132) connected by a head (124), or is a cap having a head (124) connected to a circumferentially closed retaining sleeve (138), such as a centrally confined sleeve.

14. The package (100) according to any one of claims 1 to 13, wherein: A vertical extension of the first electronic component (102) and / or the second electronic component (108) into the accommodation volume (116) along the insertion direction (142) is greater than another extension of the first electronic component (102) and / or the second electronic component (108) perpendicular to the insertion direction (142).

15. The package (100) according to any one of claims 1 to 14, comprising: The thermal interface body (148) has a recessed portion for accommodating at least a portion of the clip (114).

16. The package (100) of claim 15, comprising a heat sink (152) attached to an exterior of the thermal interface body (148).

17. The package (100) of claim 16, wherein: The thermal interface body (148) tapers from the heat sink (152) toward the clip (114).

18. The package (100) according to any one of claims 1 to 17, comprising at least one of the following features: in, Each of the at least one first terminal (104-106) and the at least one second terminal (110-112) has an outer plane arranged vertically; wherein at least one of the at least one first terminal (104-106) and the at least one second terminal (110-112) is electrically accessible at a bottom of the clip (114) by being electrically coupled to the clip (114) comprising a conductive material; wherein at least one of the at least one first terminal (104-106) and the at least one second terminal (110-112) is directly electrically accessible at an exposed bottom of the first electronic component (102) and / or at an exposed bottom of the second electronic component (108); wherein at least one of the at least one first terminal (104-106) and the at least one second terminal (110-112) is electrically coupled to a conductive element (160, 162) extending vertically in the receiving volume (116) to the bottom of the clip (114), and is electrically accessible at the bottom of the clip (114); wherein a spatially confined central portion of the clip (114) contacts the first electronic component (102) and the second electronic component (108) directly or via a clip connection medium (119); wherein a central portion of the clip (114) is connected to the first electronic component (102) and the second electronic component (108), and wherein a bottom portion of the clip (114) is laterally spaced apart from the first electronic component (102) and the second electronic component (108); wherein at least one of the first electronic component (102) and the second electronic component (108) comprises a transistor chip; Wherein, at least one of the first electronic component (102) and the second electronic component (108) comprises a semiconductor power chip; comprising at least one further first electronic component (102', 102"), at least one further second electronic component (108', 108") and at least one further clip (114', 114") according to any one of claims 1 to 17, wherein a common mounting base (122) is connected to the clip (114), the first electronic component (102), the second electronic component (108), the at least one further clip (114', 114"), the at least one further first electronic component (102', 102") and the at least one further second electronic component (108', 108"); comprising at least one further first electronic component (102', 102"), at least one further second electronic component (108', 108") and at least one further clip (114', 114") according to any one of claims 1 to 17, wherein the common thermal interface body (148) has a recess for receiving at least a portion of the clip (114) and at least a portion of the at least one further clip (114', 114"); wherein the bottom of the first electronic component (102) and the bottom of the second electronic component (108) are exposed at an access opening (128) to the receiving volume (116) at the bottom of the clip (114); wherein the bottom of the clip (114), the bottom of the first electronic component (102) and the bottom of the second electronic component (108) are at the same vertical level; The at least one exposed conductive first terminal (104-106) includes at least two, for example three, first terminals (104-106), and / or the at least one exposed conductive second terminal (110-112) includes at least two, for example three, second terminals (110-112).

19. A method of manufacturing a package (100), the method comprising: Inserting a vertically extending first electronic component (102) having at least one exposed conductive first terminal (104-106) into a receiving volume (116) of a clip (114); Inserting a vertically extending second electronic component (108) having at least one exposed conductive second terminal (110-112) into the receiving volume (116) of the clip (114); The first electronic component (102) and the second electronic component (108) are held together in the receiving volume (116) by the clip (114); and · Configuring the first electronic component (102), the second electronic component (108) and the clip (114) such that the at least one first terminal (104-106) and the at least one second terminal (110-112) are electrically accessible at the bottom of the clip (114).

20. The method according to claim 19, wherein: The method comprises: manufacturing the first electronic component (102) and the second electronic component (108) as parts of a common packaged multi-component body (156); separating the first electronic component (102) and the second electronic component (108) from the multi-component body (156); inserting the separated first electronic component (102) and the second electronic component (108) into the clips (114) of the common multi-clip body (158); and The common multi-clip body (156) is then separated into individual clips (114) to obtain a plurality of separate packages (100).

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