Electronic equipment and middle frame assembly

Abstract

The embodiment of the invention provides electronic equipment and a middle frame assembly. Relates to the technical field of electronics. The electronic equipment can reduce thermal resistance and improve the heat dissipation effect. The middle frame assembly comprises a middle frame and a cover plate, a heat source of the electronic equipment is arranged on one side of the middle frame, and the cover plate is arranged on the side, away from the heat source, of the middle frame; the cover plate is fixedly connected with the middle frame, a cavity is defined by the cover plate and the middle frame, cooling liquid is contained in the cavity, and a capillary structure is arranged on the wall face, used for defining the cavity, of the middle frame. The structure comprising the middle frame, the cover plate, the cooling liquid and the capillary structure can be understood as a vapor chamber structure, and the middle frame not only serves as a bearing part of a heat source, but also directly serves as a cover plate structure of the vapor chamber, so that the thermal resistance between the vapor chamber and the heat source is reduced, and the heat dissipation effect can be improved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an electronic device capable of dissipating heat from electronic devices, and also to a middle frame assembly that can be used in the electronic device. Background Art

[0002] Mobile phones, tablets, wearable devices and other electronic devices have become essential products for people's life, study and entertainment. With the improvement of device performance, the power consumption requirements of electronic components such as chips are getting higher and higher, which in turn leads to a surge in the demand for heat dissipation of the whole machine. A design solution with higher heat dissipation efficiency is needed to reduce the temperature of the whole machine and improve the user experience in high-heat scenarios such as video, game, and photo taking.

[0003] In some existing heat dissipation methods, the heat dissipation capacity is subject to some limitations. For example, they have a large thermal resistance, which makes it difficult to meet the heat dissipation requirements of electronic devices with higher power consumption. Summary of the invention

[0004] The present application provides an electronic device, which can be applied to a middle frame assembly in the electronic device, with the purpose of reducing thermal resistance and improving heat dissipation effect.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0006] On the one hand, the present application provides a middle frame assembly, which is used to be set in an electronic device, for example, it can be used in mobile terminals such as mobile phones and tablet computers.

[0007] The middle frame assembly includes a middle frame and a cover plate. The heat source of the electronic device is arranged on one side of the middle frame, and the cover plate is arranged on the side of the middle frame away from the heat source. It can be understood that the heat source and the cover plate are relatively arranged on two sides of the middle frame. For example, the heat source can be a circuit board integrated with various functional chips; the cover plate is fixedly connected to the middle frame, and the cover plate and the middle frame form a chamber, in which there is a coolant, and a first capillary structure is arranged on the wall surface of the middle frame used to form the chamber.

[0008] In the middle frame assembly provided in the present application, since there is a coolant in the chamber surrounded by the middle frame and the cover plate, a capillary structure is provided on the wall of the middle frame used to form the chamber, so that the structure including the cover plate, the middle frame, the coolant and the capillary structure can form a vapor chamber (VC), which can be used to dissipate the heat diffused by the heat source (such as a circuit board) so that the chip integrated on the circuit board maintains a normal operating temperature. In addition, in the present application, the middle frame directly serves as a cover plate of the vapor chamber, the cover plate of the middle frame can be called a lower cover plate, and the cover plate fixedly connected to the middle frame can be called an upper cover plate. Compared with the method of separately providing a lower cover plate in some technologies and then fixing the lower cover plate to the middle frame through a connecting structure (for example, bonding or screw fixing), the present application can reduce the interface thermal resistance between the vapor chamber and the heat source, shorten the heat dissipation path, and improve the heat dissipation effect.

[0009] In a possible implementation, a plurality of flow channels are provided on a wall surface of the middle frame for enclosing the chamber.

[0010] The flow channel can be used for the flow of coolant, accelerate the flow of coolant, and make the condensed coolant flow quickly from the cold end where the cover plate is located to the hot end where the heat source is located, thereby improving the heat dissipation efficiency.

[0011] In a possible implementation, the plurality of flow channels may be arranged along the length direction of the electronic device, or the plurality of flow channels may be arranged along the width direction of the electronic device.

[0012] In a possible implementation, the density of the flow channels in the area of ​​the middle frame corresponding to the heat source is greater than the density of the flow channels in the remaining areas.

[0013] In this way, the flow rate of the coolant in the area corresponding to the heat source can be accelerated, further improving the heat dissipation efficiency of the heat source.

[0014] In a possible implementation, the depth of the flow channel in the area of ​​the middle frame corresponding to the heat source is greater than the depth of the flow channel in the remaining areas.

[0015] This allows the flow channel in the area of ​​the middle frame corresponding to the heat source to accommodate more coolant, further improving the heat dissipation effect.

[0016] In a possible implementation manner, a second capillary structure is provided on the wall surface of the flow channel.

[0017] When the gaseous cooling medium contacts the relatively cold cover plate, condensation will occur, and the heat accumulated during evaporation will be released through the condensation phenomenon. Since a capillary structure is provided on the wall of the flow channel, the condensed coolant will quickly flow back to the heat source with the help of the capillary structure on the wall of the flow channel, thereby accelerating the reflux of the coolant and improving the heat dissipation efficiency.

[0018] In a possible implementation, a plurality of protrusions arranged at intervals are provided on a wall surface of the middle frame for enclosing the chamber, a flow channel is formed between two adjacent protrusions, and the plurality of protrusions and the middle frame are an integral structure.

[0019] For example, chemical etching or laser etching may be used to form a protrusion, thereby forming a flow channel.

[0020] In a possible implementation manner, the end surface of the protrusion facing the cover plate is in contact with the cover plate.

[0021] Since the protrusion is in contact with the cover plate, the condensed coolant at the cold end cover plate will quickly flow into the flow channel and absorb the heat at the hot end heat source.

[0022] In one possible implementation, the plurality of flow channels include a first flow channel, a second flow channel, and a third flow channel arranged in sequence, each of the first flow channel, the second flow channel, and the third flow channel having a first end and a second end relative to each other, the first end of the first flow channel, the first end of the second flow channel, and the first end of the third flow channel are located on the same side, the second end of the first flow channel, the second end of the second flow channel, and the second end of the third flow channel are located on the same side, the first end of the second flow channel is connected to the first end of the first flow channel, and the second end of the second flow channel is connected to the second end of the third flow channel.

[0023] This can form a serpentine flow channel.

[0024] In a possible implementation, the middle frame assembly further includes a pump disposed on the middle frame, the pump having a liquid outlet and a liquid return port for the coolant to flow, and both the liquid outlet and the liquid return port are connected to the flow channel.

[0025] This example also includes a pump. The pressurizing effect of the pump is used to make the flow rate of the coolant at the outlet of the pump greater than the flow rate of the coolant at the return port, which can increase the flow rate of the coolant in the chamber, improve the heat exchange efficiency, and further improve the heat dissipation efficiency.

[0026] In a possible implementation, a one-way valve is provided in the pump, and the one-way valve can control the flow direction of the coolant so that the pressurized coolant flows out from the liquid outlet and flows in from the liquid return port.

[0027] In one possible implementation, the pump and the heat source are located on the same side of the middle frame.

[0028] In a possible implementation, on the wall surface of the middle frame for enclosing the chamber, the density of the first capillary structure in the area corresponding to the heat source is greater than the density of the first capillary structure in the remaining area.

[0029] Since the density of the capillary structure at the position corresponding to the heat source is greater than the density of the capillary structure in other areas, the capillary suction force of the capillary structure at the position corresponding to the heat source can be improved, so that the coolant can quickly flow back to the position and quickly absorb the heat at the position.

[0030] In a possible implementation manner, the first capillary structure and the middle frame are an integrated structure.

[0031] For example, the capillary structure may be formed by chemical etching or laser etching.

[0032] Since the first capillary structure and the middle frame are an integrated structure, the interface thermal resistance can be further reduced and the heat dissipation effect can be improved.

[0033] In one possible implementation, the orthographic projection of the heat source on the reference plane is within the boundary of the orthographic projection of the chamber on the reference plane; the reference plane is parallel to the surface of the middle frame for arranging the heat source.

[0034] The use of a larger capacity chamber can hold more coolant and improve the heat dissipation effect.

[0035] In one possible implementation, the middle frame includes a first side surface and a second side surface that are opposite to each other, the heat source is arranged on the first side surface, the cover plate is arranged on the second side surface, and the second side surface has a concave cavity recessed toward the heat source at a position opposite to the heat source, and the concave cavity forms at least a part of the chamber.

[0036] The cavity is provided to increase the volume of the chamber, increase the capacity of the coolant, and improve the heat dissipation effect.

[0037] In a possible implementation, a coolant injection hole communicating with the chamber is provided on the middle frame, and a sealing structure is provided at the opening of the coolant injection hole.

[0038] The coolant injection hole can be used to inject coolant into the chamber.

[0039] In one possible implementation, the middle frame includes a first side surface and a second side surface that are opposite to each other, the cover plate is arranged on the second side surface, the coolant injection hole passes through the first side surface and the second side surface and is connected to the chamber, and a sealing structure is arranged in the coolant injection hole; or, the middle frame assembly also includes a plastic frame, the plastic frame is arranged around the edge of the middle frame, the coolant injection hole is opened on the outer edge of the middle frame facing the plastic frame, is connected to the chamber, and the plastic frame blocks the opening of the coolant injection hole.

[0040] The present application gives two examples. The coolant injection port can be set on the heat source-bearing part of the middle frame, or the coolant injection port can be set on the outer edge of the middle frame.

[0041] In a possible implementation manner, a third capillary structure is provided on a wall surface of the cover plate that is used to enclose the chamber.

[0042] The capillary structure can also provide capillary suction to increase the flow rate of the coolant.

[0043] In a possible implementation manner, the capillary structure may be formed by etching on the wall surface of the cover plate, or a structural member having the capillary structure may be disposed on the cover plate.

[0044] In a possible implementation, the middle frame and the cover plate are both made of metal materials, and the middle frame and the cover plate serve as ground terminals of the antenna in the electronic device.

[0045] In some existing heat dissipation structures, the heat dissipation device is connected to the middle frame through an adhesive layer. In this case, in order to prevent the heat dissipation device from affecting the antenna clearance, an electrical connection structure is required to ground the heat dissipation device. However, in this application, the metal middle frame and cover plate can be directly used as the grounding terminal of the antenna, and there is no need to separately set up an electrical connection structure connected to the grounding terminal, which not only simplifies the structure, but also simplifies the assembly process.

[0046] In a possible implementation, a plurality of support columns arranged at intervals are disposed in the chamber, and the plurality of support columns are arranged at intervals in the flow channel.

[0047] By using support columns arranged at intervals in the flow channel, the flow direction of the coolant can be changed, the flow speed can be increased, and the heat dissipation efficiency can be improved.

[0048] In one possible implementation, the plurality of support columns and the middle frame are an integrated structure.

[0049] In some examples, the end of the support column can be in contact with the cover plate. The support column can not only absorb the coolant, but also increase the strength of the middle frame.

[0050] On the other hand, the present application also provides an electronic device, such as a mobile phone, a tablet computer, a wearable device, etc.

[0051] The electronic device comprises a heat source and a middle frame assembly of any one of the above implementations, wherein the heat source is arranged on a side of the middle frame away from the cover plate.

[0052] The electronic device provided in the present application includes a temperature equalizing plate structure that can dissipate heat from a heat source, and a middle frame is directly used as one of the cover plates of the temperature equalizing plate, and a capillary structure is directly arranged on the wall surface of the middle frame. In this way, the heat conduction path can be shortened and the heat dissipation efficiency of the heat source can be improved.

[0053] In one possible implementation, the electronic device also includes a display screen and a back cover; the display screen and the back cover are arranged on opposite sides of the middle frame; the heat source is arranged in the space surrounded by the middle frame and the back cover; and the cover plate is arranged in the space surrounded by the middle frame and the display screen.

[0054] In a possible implementation, the electronic device further includes a first device; the first device and the heat source are arranged on the same side of the middle frame; the area of ​​the middle frame corresponding to the heat source is protruding compared to the area corresponding to the first device, and the depth dimension of the area of ​​the chamber corresponding to the heat source is greater than the depth dimension of the area corresponding to the first device. In this way, the volume of the area of ​​the chamber 4 corresponding to the heat source 1 can be increased, more coolant can be accommodated, and the heat exchange efficiency can be improved.

[0055] In one possible implementation, the heat source includes a circuit board, and the first component includes a battery.

[0056] For example, the surface of the circuit board away from the middle frame may be flush with the surface of the battery away from the middle frame.

[0057] On the other hand, the present application also provides a method for manufacturing a middle frame assembly, the manufacturing method comprising:

[0058] A capillary structure is arranged on the first side surface of the middle frame;

[0059] A cover plate is installed on the first side surface of the middle frame, the cover plate is fixedly connected to the middle frame, and the cover plate and the middle frame form a chamber;

[0060] Fill the chamber with coolant.

[0061] When the middle frame assembly is prepared by the method provided in the present application, a capillary structure is provided on the wall surface of the middle frame opposite to the heat source, and the cover plate is directly fixedly connected to the middle frame. In this way, the heat dissipated by the heat source will diffuse to the middle frame and the cavity surrounded by the middle frame and the cover plate through a shorter propagation path, and the heat will be diffused out by the coolant.

[0062] In a possible implementation manner, providing a first capillary structure on a first side surface of the middle frame includes: etching the first capillary structure on the first side surface of the middle frame.

[0063] For example, chemical etching or laser etching may be used.

[0064] In a possible implementation, the manufacturing method further includes: etching a plurality of protrusions on the first side surface of the middle frame, and forming a flow channel between two adjacent protrusions.

[0065] The protrusions are made by etching, and the flow channels between the protrusions can increase the flow rate of the coolant and improve the heat conduction efficiency.

[0066] In a possible implementation, after etching a plurality of protrusions on the first side surface of the middle frame, the manufacturing method further includes: etching the wall surfaces of the protrusions to obtain a second capillary structure.

[0067] By utilizing the capillary force of the second capillary structure, the flow path of the condensed coolant can be further shortened, thereby improving the heat dissipation efficiency.

[0068] In a possible implementation, the manufacturing method further includes: disposing a pump on the middle frame so that the pump is in communication with the flow channel.

[0069] The pump increases the flow rate of the coolant and improves the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] Figure 1 An exploded schematic diagram of an electronic device provided in an embodiment of the present application;

[0071] Figure 2 A structural diagram of a circuit board provided in an embodiment of the present application;

[0072] Figure 3 An exploded schematic diagram of an electronic device provided in an embodiment of the present application;

[0073] Figure 4 A schematic diagram of a structure of a heat dissipation structure included in an electronic device provided in an embodiment of the present application;

[0074] Figure 5 An exploded schematic diagram of an electronic device including a heat dissipation structure provided in an embodiment of the present application;

[0075] Figure 6 A schematic diagram of a structure of an electronic device including a heat dissipation structure in the prior art;

[0076] Figure 7 A schematic diagram of a capillary structure provided in an embodiment of the present application;

[0077] Figure 8 A schematic diagram of a capillary structure provided in an embodiment of the present application;

[0078] Fig. 9 A schematic diagram of a structure of an electronic device including a heat dissipation structure provided in an embodiment of the present application;

[0079] Fig.10 A schematic diagram of the structure of a flow channel on a middle frame provided in an embodiment of the present application;

[0080] Fig.11 A schematic diagram of the structure of a flow channel on a middle frame provided in an embodiment of the present application;

[0081] Fig.12A schematic diagram of the structure of a flow channel on a middle frame provided in an embodiment of the present application;

[0082] Fig.13 A schematic diagram of the structure of a flow channel on a middle frame provided in an embodiment of the present application;

[0083] Fig.14 A schematic diagram of a structure of an electronic device including a heat dissipation structure provided in an embodiment of the present application;

[0084] Fig.15 An exploded schematic diagram of an electronic device including a heat dissipation structure provided in an embodiment of the present application;

[0085] Fig.16 An exploded schematic diagram of a middle frame, a heat source, and a pressure pump in an electronic device provided in an embodiment of the present application;

[0086] Fig.17 A schematic diagram of the structure of a middle frame in an electronic device provided in an embodiment of the present application;

[0087] Fig.18 A schematic diagram of the structure of a middle frame in an electronic device provided in an embodiment of the present application;

[0088] Fig.19 A schematic diagram of a structure of an electronic device including a heat dissipation structure provided in an embodiment of the present application;

[0089] Fig. 20 A structural diagram of a middle frame provided in an embodiment of the present application;

[0090] Fig.21 A structural diagram of a middle frame provided in an embodiment of the present application;

[0091] Fig. 22 A structural diagram of a middle frame provided in an embodiment of the present application;

[0092] Fig.23 An exploded schematic diagram of a middle frame and a plastic frame provided in an embodiment of the present application;

[0093] Fig.24 A schematic diagram of a structure for reflecting a coolant injection hole provided in an embodiment of the present application;

[0094] Fig.25 A schematic diagram of a structure for reflecting a coolant injection hole provided in an embodiment of the present application;

[0095] Fig.26 A flowchart of a method for manufacturing a middle frame assembly provided in an embodiment of the present application.

[0096] Reference numerals:

[0097] 100-middle frame; 100A-first middle frame; 100B-second middle frame; 1001-first installation cavity; 1002-second installation cavity;

[0098] 200-back cover; 300-display screen; 400-plastic frame; 500-battery; 600-circuit board; 601-substrate; 602-electronic device;

[0099] 700-shaft mechanism; 800-temperature balancing board; 900-adhesive backing;

[0100] 1-heat source; 2-cover plate; 31, 32-capillary structure; 4-chamber; 5-protrusion; 6-flow channel; 7-grid member; 8-pump; 91, 92-cooling liquid injection hole; 10-support column; 11-convex hull; 12-channel; 13-first device. DETAILED DESCRIPTION

[0101] The present application provides an electronic device, for example, an electronic device with a display function. The electronic device may include but is not limited to a mobile phone, a tablet computer, a laptop computer, an e-book reader, a camera, a wearable device, a router, a base station, etc. For ease of understanding, in each embodiment of the present application, the electronic device is described by taking a mobile phone as an example.

[0102] like Figure 1 , Figure 1 The structure of a mobile phone is exemplarily shown, and the mobile phone may include a middle frame 100, a back cover 200 and a display screen 300, wherein the back cover 200 and the display screen 300 are arranged on opposite sides of the middle frame 100. In some examples, the electronic device further includes a plastic frame 400, and the plastic frame 400 is arranged around the edge of the middle frame 100.

[0103] An installation space is formed between the middle frame 100 and the back cover 200, and the installation space is used to install electronic components such as circuit boards, batteries, receivers, speakers, cameras, etc. in the electronic device. Figure 1 Schematic diagram of the present invention shows a circuit board 600 and a battery 500 disposed on the middle frame 100 .

[0104] Figure 2 The structure of a circuit board 600 is exemplarily shown. The circuit board 600 may include: a substrate 601 and a plurality of electronic devices 602 integrated on the substrate 601. The electronic devices may include a controller, a storage unit, an antenna module, a power management module, etc. of the electronic device. The battery may power the display screen 300, the circuit board 600, a receiver, a speaker, a camera, and other electronic devices.

[0105] When electronic devices are in use, they will emit a lot of heat. For example, when watching videos, playing games, taking photos, etc., these are high-heat usage scenarios for electronic devices. In order to improve the working performance of electronic devices, it is necessary to set up a heat dissipation structure in the electronic devices to dissipate the heat, reduce the temperature of the electronic devices, and maintain the stable working performance of the electronic devices.

[0106] Figure 1 In other examples, such as Figure 3 The electronic device may be a foldable electronic device, which may include a first middle frame 100A and a second middle frame 100B. The first middle frame 100A and the second middle frame 100B are arranged on opposite sides of the hinge mechanism 700 and are respectively connected to the hinge mechanism 700. The hinge mechanism 700 can move to make the first middle frame 100A and the second middle frame 100B relatively folded or relatively unfolded. When the first middle frame 100A and the second middle frame 100B are folded, the foldable electronic device can be in a closed state. When the first middle frame 100A and the second middle frame 100B are unfolded, the foldable electronic device can be in a flattened state.

[0107] A heat source such as a circuit board 600 may be disposed on at least one of the first middle frame 100A and the second middle frame 100B. Figure 3 In the exemplary foldable electronic device, a heat dissipation structure for driving heat from a heat source also needs to be provided.

[0108] Figure 4 It is a structure for dissipating heat from a heat source provided in an embodiment of the present application. Figure 5 1 is an exploded view of a three-dimensional view of the middle frame 100, the heat source 1 and the cover plate 2 according to an embodiment of the present application. The heat source 1 is arranged on a side of the middle frame 100, and the side where the heat source 1 is located can be Figure 1 and Figure 5 The first side surface is shown, which can be used to assemble the back cover 200 , and the heat source 1 is arranged in the space surrounded by the middle frame 100 and the back cover 200 .

[0109] In some examples, heat source 1 may be Figure 1 and Figure 2 An exemplary circuit board 600. In some other examples, the heat source 1 may also be other structures that can generate heat.

[0110] like Figure 4 , further comprising a cover plate 2, which is arranged on a side of the middle frame 100 away from the heat source 1. For example, the cover plate 2 can be arranged Figure 1 and Figure 5 The second side surface of the middle frame 100 can be used to assemble the display screen 300, and the cover plate 2 is arranged in the space surrounded by the middle frame 100 and the display screen 300.

[0111] It can be understood that the heat source 1 and the cover plate 2 are arranged on two opposite sides of the middle frame 100 .

[0112] The cover plate 2 is fixedly connected to the middle frame 100. For example, the cover plate 2 and the middle frame 100 may be fixed by welding, such as but not limited to laser welding and diffusion welding.

[0113] The cover plate 2 is buckled with the middle frame 100, as shown in FIG. Figure 4 A chamber 4 is formed between the cover plate 2 and the middle frame 100, and a coolant is contained in the chamber 4. The coolant may include at least one of water, methanol, alcohol, and acetone.

[0114] For example Figure 4 As shown, a capillary structure 31 is provided on the wall surface M of the middle frame 100 for enclosing the chamber 4. The capillary structure 31 may also be referred to as a liquid wick structure or a microstructure.

[0115] like Figure 4 The middle frame 100 has a wall surface M that encloses a chamber 4. The orthographic projection of the heat source 1 on the wall surface M can be located within the boundary of the wall surface M. On the wall surface M, a capillary structure 31 can be set in the orthographic projection area of ​​the heat source 1, or a capillary structure 31 can be set on the entire wall surface M.

[0116] When heat is conducted from the heat source 1 to the middle frame 100, the coolant in the vacuum chamber 4 is heated and vaporized. At this time, it absorbs heat energy and expands in volume. The gas phase coolant fills the entire chamber 4. When the gas phase cooling medium contacts the relatively cold cover plate 2, condensation occurs, and the heat accumulated during evaporation is released through condensation. The condensed coolant will return to the evaporation heat source 1 through the capillary structure 31. This operation will be repeated in the chamber 4 to achieve cooling of the heat source 1.

[0117] like Figure 4 In the example given in this application, the heat dissipation structure including the middle frame 100, the cover plate 2, the chamber 4, the capillary structure 31 and the coolant can be understood as a vapor chamber (VC) structure.

[0118] Continue reading Figure 4 The side of the middle frame 100 used for setting the heat source 1 is also used for setting the first device 13 in the electronic device. For example, the first device 13 can be a battery.

[0119] The depth dimension H1 of the area of ​​the chamber 4 opposite to the heat source 1 is greater than the depth dimension H2 of the area opposite to the first device 13. In this way, the volume of the area of ​​the chamber 4 opposite to the heat source 1 can be increased to accommodate more coolant and improve the heat exchange efficiency.

[0120] In addition, when the first device 13 is a battery, the chamber 4 extends to the bottom of the battery, which can also dissipate the heat emitted by the battery.

[0121] In some examples, such as Figure 4 The area of ​​the middle frame 100 corresponding to the heat source 1 protrudes further toward the heat source 1 than the area corresponding to the first device 13, so that the depth dimension H1 of the area of ​​the chamber 4 opposite to the heat source 1 is greater than the depth dimension H2 of the area opposite to the first device 13.

[0122] In some scenarios, the heat source 1 may be a circuit board. When the first device 13 is a battery, the height of the battery is greater than the height of the circuit board. Figure 4 As shown, the area of ​​the middle frame 100 corresponding to the circuit board is more protruded toward the circuit board than the area corresponding to the battery, so that the surface of the circuit board is basically flush with the surface of the battery. In this way, not only can the heat of the circuit board and the battery be driven away, but also the space can be fully utilized to improve the heat dissipation effect on them.

[0123] Figure 4 The depth dimensions H1 and H2 in the figure can be understood as the dimensions of the cavity 4 along the thickness direction of the electronic device.

[0124] like Figure 6 , Figure 6 It is a heat dissipation structure in the prior art, and the temperature plate 800 is bonded to the middle frame 100 through the adhesive 900. The heat generated by the heat source 1 needs to pass through the adhesive 900 with a large thermal resistance before it can be diffused by the temperature plate 800.

[0125] This application Figure 4 and Figure 5 Example heat dissipation structure, with Figure 6 In contrast, the middle frame 100 is directly used as one of the cover structures of the temperature equalizer. The middle frame 100 not only serves as a carrier of the heat source 1, but also serves as a structure of the temperature equalizer and a carrier of the capillary structure 31. The heat emitted by the heat source 1 will be quickly transferred to the middle frame 100 and diffused by the coolant in the chamber 4. Figure 4 and Figure 5 The example structure can reduce the interface thermal resistance, shorten the heat conduction path, and improve the thermal conductivity efficiency, thereby improving the heat dissipation effect of the heat source 1.

[0126] The following table 1 shows the example of this application. Figure 4 and Figure 5 , prior art Figure 6 , and the heat dissipation capacity of the entire device when a temperature equalizer is not installed in the electronic device.

[0127] plan Heat dissipation capacity of the whole machine Figure 4 and Figure 5 Example 64mA / ℃ Figure 6 Example 63mA / ℃ No temperature plate is set 52mA / ℃

[0128] Table 1

[0129] In Table 1, 64mA / ℃ means that for every 1℃ rise, the heat source consumes 64mA of power, or it can be understood that for every 1℃ drop, the heat source saves 64mA of power. Similarly, 63mA / ℃ means that for every 1℃ rise, the heat source consumes 63mA of power, or it can be understood that for every 1℃ drop, the heat source saves 63mA of power. 52mA / ℃ means that for every 1℃ rise, the heat source consumes 52mA of power, or it can be understood that for every 1℃ drop, the heat source saves 52mA of power.

[0130] This application provides Figure 4 and Figure 5 Example, Figure 6 Compared with the case without a temperature equalization plate, when both temperatures drop by 1°C, Figure 4 The example saves the most power. It can also be understood as: Figure 4 For example, the heat source has high power consumption, but the temperature rises slowly. Figure 4 For example, the heat dissipation effect can be significantly improved.

[0131] In the example of the present application, since the middle frame 100 serves as one of the cover structures of the temperature equalizing plate, the area of ​​the middle frame can be fully utilized. Compared with another cover that is separately designed and fixed to the cover 2, the present application can maximize the heat dissipation area.

[0132] For example, according to Newton's heat dissipation formula Q=hAΔT, the heat transfer coefficient h and the temperature change value ΔT can be set constant, that is, the larger the heat dissipation area A is, the greater the heat dissipation amount is. The advantage of the present invention is that it can make full use of the area of ​​the middle frame and maximize the heat dissipation area.

[0133] Based on fully utilizing the structure of the middle frame 100 , the present application can maximize the volume of the chamber containing the coolant to accommodate more coolant, absorb more heat, and improve the heat dissipation efficiency.

[0134] In some examples, the middle frame 100 is made of metal material. The cover plate 2 is made of metal material, for example, at least one of aluminum alloy, copper, stainless steel, titanium, titanium alloy, magnesium alloy, etc. may be used.

[0135] In electronic devices, antennas are also included. Figure 4 When the middle frame 100 and the cover plate 2 of the example are both made of metal materials, the middle frame 100 and the cover plate 2 that are fixedly connected can serve as the ground terminal of the antenna.

[0136] And in Figure 6In the embodiment, since the metal heat spreader 800 is connected to the metal middle frame 100 through the non-conductive adhesive 900, in order to prevent the heat spreader 800 from affecting the clearance of the antenna, the "floating metal" heat spreader 800 needs to be provided with an electrical connection structure for grounding. Figure 4 In the embodiment, since the middle frame 100 is directly used as the structure of the temperature plate, there is no need to set up an additional electrical connection structure for grounding. In this way, the structure of the whole machine can be simplified, and the assembly process can also be simplified.

[0137] In some other examples, the cover plate 2 may also be made of non-metallic materials, such as plastic materials such as polyimide (PI). When the cover plate 2 is made of non-metallic materials, the metal middle frame 100 is used as the grounding terminal of the antenna, and there is no need to use an electrical connection structure to ground the non-metallic cover plate 2.

[0138] Continue reading Figure 4 and Figure 5 Since the middle frame 100 is directly used as a heat spreader, the thickness of the whole device can be reduced. For example, it can be reduced by at least 0.2 mm.

[0139] In some technologies, in order to reduce the thickness of the whole machine, the middle frame is designed as a hollow structure, and the temperature plate is set in the hollow area, which will seriously reduce the strength of the middle frame. However, in this application, on the basis of reducing thermal resistance and improving heat dissipation effect, the strength of the middle frame can be guaranteed, and then the strength of the whole machine can be guaranteed.

[0140] The following table 2 shows the example of this application. Figure 4 and Figure 5 , and the existing technology, the bending ability of the whole machine.

[0141] plan Bending strength of the whole machine Figure 4 and Figure 5 Example 194.51MPa Prior art 175.71MPa

[0142] Table 2

[0143] The prior art in Table 2 above can be understood as: Figure 6 The structure shown in the figure, or an example of connecting the temperature homogenizing plate 800 and the middle frame 100 with screws.

[0144] Based on the data in Table 2, it can be learned that when the heat dissipation structure of the example in this application is adopted, the bending strength of the whole machine is 194.51 MPa, which is higher than the bending strength of the whole machine of the prior art of 175.71 MPa. Therefore, the heat dissipation structure of the example in this application not only has a higher heat dissipation capacity as shown in Table 1, but also does not affect the bending strength of the whole machine.

[0145] The capillary structure 31 disposed on the wall surface of the middle frame 100 can be realized in many ways.

[0146] In one example, an etching process may be used to etch a texture pattern on the wall surface of the middle frame 100, for example, see Figure 7 As shown, a plurality of grooves 311 can be etched on the wall surface of the middle frame 100, and the plurality of grooves 311 are arranged in an intersecting manner to form the capillary structure 31. For example, chemical etching or laser etching can be used. In this example, the capillary structure 31 and the middle frame 100 are an integrated structure, which can also reduce the interface thermal resistance, and the heat conducted into the middle frame can be quickly absorbed by the coolant in the capillary structure 31 and conducted out.

[0147] In another example, a mesh member having a capillary structure may be used and fixed on the wall surface of the middle frame 100. For example, the mesh member may be a metal wire mesh, a fiber wire, or the like.

[0148] like Figure 7 In some examples, the depth of the groove 311 may be 0.01 mm to 0.2 mm, and the width of the groove 311 may be 10 μm to 100 μm. The plurality of grooves 311 form a capillary structure 31 with capillary characteristics to accelerate the flow of the coolant in the chamber.

[0149] In order to further improve the heat dissipation effect, such as Figure 8 , the wall of the middle frame 100 is used to enclose the chamber, and the area corresponding to the heat source (such as Figure 8 The density of the capillary structure 31 in the first area (of the first region) is greater than the density of the capillary structure 31 in the remaining areas.

[0150] The density of the capillary structure 31 can be understood as the sparseness of the capillary structure 31. It can also be understood as that in the first area, the distance between two adjacent grooves 311 is smaller than the distance between two adjacent grooves 311 in the remaining areas.

[0151] When the density of the capillary structure 31 in the first region is greater than that in other regions, the capillary suction force of the first region on the coolant can be increased, so that the condensed coolant flows to the heat source as quickly as possible, thereby improving the heat absorption efficiency.

[0152] like Figure 8 , the area of ​​the middle frame 100 corresponding to the heat source (such as Figure 8 The first area), which can be understood as: the orthographic projection of the heat source on the first area is located within the boundary of the first area, or the orthographic projection of the heat source on the first area overlaps with the boundary of the first area.

[0153] In order to increase the flow rate of the coolant, the coolant can quickly flow back to the heat source where the heat source 1 is located to improve the heat dissipation efficiency. Fig. 9A plurality of flow channels 6 are arranged on the wall surface of the middle frame 100 for enclosing the chamber 4 , that is, a plurality of flow channels 6 are arranged on the wall surface of the middle frame 100 on which the capillary structure 31 is arranged.

[0154] When the gas phase cooling medium contacts the relatively cold cover plate 2, condensation will occur, and the heat accumulated during evaporation will be released through the condensation phenomenon. The condensed coolant will return to the wall surface of the middle frame 100 through the capillary structure 31, and the coolant will be guided to the heat source 1 by these multiple flow channels 6. The flow channels 6 can accelerate the flow speed of the coolant, so that the coolant can quickly conduct heat to the cover plate 2 as the cold end.

[0155] The multiple flow channels 6 can be arranged in various directions. Fig.10 and Fig.11 Two examples are shown. Fig.10 and Fig.11 , the dashed line with arrows indicates the flow direction of the coolant. Fig.10 In the embodiment, a plurality of flow channels 6 are arranged at intervals along the width direction of the electronic device. Fig.11 In the embodiment, the plurality of flow channels 6 are arranged at intervals along the length direction of the electronic device. In other examples, the plurality of flow channels 6 can also be arranged at intervals along other directions.

[0156] In some structures, such as Fig.10 and Fig.11 , multiple flow channels 6 are arranged in a serpentine structure. For example, the multiple flow channels include a first flow channel, a second flow channel and a third flow channel arranged in sequence, each of the first flow channel, the second flow channel and the third flow channel has a first end and a second end opposite to each other, the first end of the first flow channel, the first end of the second flow channel and the first end of the third flow channel are located on the same side, the second end of the first flow channel, the second end of the second flow channel and the second end of the third flow channel are located on the same side, the first end of the second flow channel is connected to the first end of the first flow channel, and the second end of the second flow channel is connected to the second end of the third flow channel.

[0157] In this application example, Fig. 9 A plurality of strip-shaped protrusions 5 arranged at intervals may be provided on the wall surface of the middle frame 100 , and a flow channel 6 may be formed between two adjacent protrusions 5 .

[0158] The protrusion 5 can be realized in many ways.

[0159] For example, Fig. 9 , etching can be performed on the wall surface of the middle frame 100 for connecting the cover plate 2 to form a protrusion 5 between two adjacent grooves. That is, the protrusion 5 and the middle frame 100 are an integral structure.

[0160] As another example, the independent structural member protrusion 5 may be fixed to the middle frame 100 , for example, by welding to fix the protrusion 5 and the middle frame 100 .

[0161] As another example, the protrusion 5 can be manufactured by injection molding or machining.

[0162] Fig. 9 The protrusion 5 integrated with the middle frame 100 can not only form a flow channel to increase the flow rate of the coolant, but also improve the strength of the entire machine.

[0163] In order to further improve the heat dissipation effect on the heat source, some examples are given below for the arrangement of the flow channel 6.

[0164] like Fig.12 and Fig.13 In both examples, the area of ​​the middle frame 100 corresponding to the heat source (such as Fig.12 and Fig.13 The density of the flow channel 6 in the first area) is greater than the density of the flow channel 6 in the remaining areas.

[0165] In some examples, the density of the flow channel 6 can be understood as: the area ratio of the flow channel 6 per unit area of ​​the middle frame 100. Alternatively, it can also be understood as: in the first area, the spacing between two adjacent flow channels 6 is smaller than the spacing between two adjacent flow channels 6 in other areas, so that the density of the flow channels 6 in the first area is greater than that in other areas.

[0166] like Fig.12 and Fig.13 When the density of the flow channel 6 in the first area is relatively large, the flow rate of the coolant can be accelerated. The coolant with a higher flow rate can absorb heat quickly, thereby improving the heat dissipation efficiency of the heat source 1.

[0167] In some examples, the area of ​​the middle frame 100 corresponding to the heat source (eg Fig.12 and Fig.13 The first area), which can be understood as: the orthographic projection of the heat source on the first area is located within the boundary of the first area, or the orthographic projection of the heat source on the first area overlaps with the boundary of the first area.

[0168] like Fig.12 In some examples, the arrangement direction of the multiple flow channels 6 in the first area may be different from the arrangement direction of the multiple flow channels 6 in other areas. For example, in the first area, the multiple flow channels 6 are arranged along the length direction of the electronic device, and in other areas, the multiple flow channels 6 are arranged along the length direction of the electronic device.

[0169] like Fig.13In some other examples, the arrangement direction of the multiple flow channels 6 in the first area may be consistent with the arrangement direction of the multiple flow channels 6 in other areas, for example, they may all be arranged along the width direction of the electronic device.

[0170] In some achievable structures, in order to improve the heat dissipation effect on the heat source, the area of ​​the middle frame 100 corresponding to the heat source 1 (such as Fig.12 and Fig.13 The depth of the flow channel 6 in the first area) is greater than the depth of the flow channel 6 in the remaining areas.

[0171] For example, the depth of the flow channel 6 in the first area may be 2 to 3 times the depth of the flow channel 6 in the remaining areas.

[0172] When the depth of the flow channel 6 in the first area is greater than the depth of the flow channel 6 in other areas, more coolant can be accommodated in the flow channel 6 in the first area, and a larger volume of coolant will carry away more heat, thereby improving the heat dissipation efficiency and quickly cooling the heat source.

[0173] Fig.14 3 is another structural diagram including a heat dissipation structure provided in an embodiment of the present application. A capillary structure 32 may be provided on the wall surface of the flow channel 6. For example, a capillary structure 32 may be provided on the surface of the protrusion 5.

[0174] The coolant condensed on the cover plate 2 can be adsorbed onto the middle frame 100 under the capillary force of the capillary structure 32 on the protrusion 5, and then absorbs the heat accumulated on the middle frame 100. The flow path of the coolant is shortened, the flow efficiency of the coolant is improved, and the heat removal efficiency is improved.

[0175] In one embodiment, the protrusion 5 can be made by etching the center frame 100, and the capillary structure 31 on the center frame 100 and the capillary structure 32 on the protrusion 5 can also be made by etching. In this way, the protrusion 5, the capillary structure 31 and the capillary structure 32, and the center frame 100 are an integrated structure, which simplifies the manufacturing process and also simplifies the assembly process.

[0176] For example Fig.14 As shown, the end surface of the protrusion 5 facing the cover plate 2 can be in contact with the cover plate 2. This can not only improve the strength of the heat dissipation structure, but also allow the coolant condensed on the cover plate 2 to be quickly absorbed by the capillary structure 32 on the protrusion 5, shortening the path from the coolant to the heat source and improving the heat dissipation efficiency.

[0177] In some examples, a capillary structure may also be formed on the end surface of the protrusion 5 facing the cover plate 2 .

[0178] When the wall surface of the protrusion 5 has a capillary structure 32, as shown in FIG. Fig.12 and Fig.13The density of the capillary structure on the protrusion 5 in the first area may be greater than the density of the capillary structure on the protrusion 5 in the remaining areas.

[0179] Fig.15 is another structural diagram including a heat dissipation structure provided in this application. Fig.16 1 is an exploded view of a three-dimensional view of the middle frame 100, the heat source 1, the pump 8 and the cover plate 2 according to an embodiment of the present application. Fig.15 and Fig.16 In this example, a pump 8 is further provided in the electronic device. The pump 8 can be provided on the middle frame 100 , and the pump 8 is connected to the chamber 4 .

[0180] For example, the pump 8 has a liquid outlet and a liquid return port, and both the liquid outlet and the liquid return port are connected to the flow channel 6 in the chamber 4.

[0181] The flow rate of the coolant at the liquid outlet of the pump 8 is greater than the flow rate of the coolant at the liquid return port. The coolant in the chamber 4 flows into the pump 8 through the liquid return port, and the pump 8 compresses the coolant to increase the flow rate. The coolant with a larger flow rate is discharged into the flow channel 6 of the chamber 4 through the liquid outlet. The fast-flowing coolant can quickly conduct the heat away, thereby improving the heat dissipation efficiency.

[0182] The pump 8 of the example of the present application may include but is not limited to a piezoelectric pump, a mechanical pump, and the like.

[0183] In some examples, such as Fig.15 The pump 8 and the heat source 1 can be arranged on the same side of the middle frame 100. For example, they can be arranged on the first side for connecting with the back cover 200.

[0184] like Fig.17 A first installation cavity 1001 may be provided on the middle frame 100, and the pump 8 may be provided in the first installation cavity 1001. A second installation cavity 1002 may also be provided on the middle frame 100, and the heat source 1 may be provided in the second installation cavity 1002.

[0185] The pump 8 needs to be connected to the chamber 4 containing the coolant. Fig.18 A first hole A and a second hole B that pass through the chamber 4 can be opened on the middle frame 100 , the first hole A can be connected to the liquid outlet of the pump 8 , and the second hole B can be connected to the liquid return port of the pump 8 .

[0186] In some examples, such as Fig.18 The first hole A and the second hole B shown can be opened close to the heat source 1, so that the coolant with a larger flow rate can quickly absorb the heat at the heat source 1 and conduct it out at a faster speed. For example, the first hole A connected to the liquid outlet of the pump 8 can be within 10 mm from the heat source 1, or closer.

[0187] In order to control the flow direction of the coolant, in some implementations, a one-way valve can be set in the pump 8, and the one-way valve is used to make the coolant with a larger flow rate flow out from the liquid outlet, and the coolant with a smaller flow rate flow in from the liquid return port.

[0188] Fig.19 It is another structural diagram including a heat dissipation structure provided in an embodiment of the present application. A capillary structure is provided on the wall surface of the cover plate 2 facing the middle frame 100 .

[0189] In one example, an etching process may be used to etch a texture pattern on the wall surface of the cover plate 2, for example, etching micro grooves, for example, chemical etching or laser etching may be used.

[0190] In another example, Fig.19 , a mesh member 7 having a capillary structure may be used. For example, the mesh member 7 may be a metal wire mesh (copper mesh), fiber wire, or the like.

[0191] When the examples given in this application also include Fig.19 When the mesh member 7 is shown, the end of the protrusion 5 can abut against the mesh member 7.

[0192] Fig. 20 1 is another structural diagram of a middle frame according to an embodiment of the present application. A plurality of support columns 10 arranged at intervals may be provided on the wall surface of the middle frame 100 connected to the cover plate.

[0193] The support column 10 and the middle frame 100 may be an integrally formed structure. For example, the support column 10 may be formed on the middle frame 100 by using an etching process or a machining process.

[0194] In some examples, the end of the support column 10 close to the cover plate 2 may be in contact with the cover plate 2 , so that the condensed coolant on the cover plate 2 can quickly flow back to the middle frame 100 under the adsorption effect of the support column 10 .

[0195] In addition, multiple support columns 10 can also increase the rigidity of the middle frame 100 and improve the strength of the entire device.

[0196] The shape of the support column 10 is not limited, for example, it can be cylindrical, spherical or other shapes.

[0197] In some possible structures, such as Fig.21 A plurality of flow channels 6 may be provided on the wall surface of the middle frame 100 connected to the cover plate 2 , and a plurality of support columns 10 may also be provided. The plurality of support columns 10 are provided in the flow channels 6 , and the plurality of support columns 10 may be arranged at intervals along the extension direction of the flow channels 6 .

[0198] When a support column 10 is provided in the flow channel 6, the flow direction of the coolant in the flow channel 6 can be changed. For example, when the flow channel 6 extends along the length direction of the electronic device, the coolant will flow along the length direction. The support column 10 can make the coolant flow along a direction intersecting with the length direction to change the flow direction of the coolant and increase the flow speed of the coolant.

[0199] In some examples, the width of the flow channel 6 in the first area of ​​the middle frame 100 opposite to the heat source is smaller than the width of the flow channel 6 in the remaining areas. In one example, the radial dimension of the support column 10 located in the first area can be smaller than the radial dimension of the support column in the remaining areas.

[0200] In the electronic device, since the middle frame 100 is not only provided with a heat source 1 such as a circuit board, but also with a battery or other structural parts, in this way, in the case of limited installation space, some areas of the middle frame 100 are thicker and some areas are thinner. For example, at the location of the middle frame 100 where the heat source 1 is provided, some areas are thicker and some areas are thinner. In this scenario, the cover plate 2 can also be designed as a structure of unequal thickness, so that after the cover plate 2 is fixed on the middle frame 100, the side of the middle frame 100 with the cover plate 2 is relatively flat.

[0201] In the example of the present application, a coolant is contained in the chamber 4. In an achievable process, after the cover plate 2 is fixedly connected to the middle frame 100, the coolant can be injected into the chamber 4 through the coolant injection hole.

[0202] like Fig. 22 and Fig.23 , showing two implementation structures of the coolant injection hole. Fig.23 yes Fig. 22 An exploded diagram of Fig.24 and Fig.25 A cross-sectional view including a coolant injection hole, a middle frame and a cover plate is shown.

[0203] In one example, Fig. 22 , Fig.23 and Fig.24 The coolant injection hole 91 passes through the first side surface and the second side surface of the middle frame 100 and is connected to the chamber 4. Since the second side surface of the middle frame 100 for forming the chamber 4 has a capillary structure 31, the coolant injection hole 91 can pass through the middle frame 100 and the capillary structure 31 to the chamber 4.

[0204] After the coolant is injected into the chamber 4 through the coolant injection hole 91 , the coolant injection hole 91 can be sealed with a sealing structure, for example, the coolant injection hole 91 can be sealed with an adhesive, and then the back cover of the electronic device is assembled.

[0205] In another example, Fig. 22 and Fig.23 A plastic frame 400 is disposed on the periphery of the middle frame 100, and the plastic frame 400 surrounds the periphery of the metal middle frame 100, such as Fig.23 and Fig.25 The coolant injection hole 92 can be opened on the outer edge of the middle frame 100 facing the plastic frame 400 and communicated with the chamber 4, and the plastic frame 400 blocks the opening of the coolant injection hole 92. After the coolant is injected into the chamber 4 through the coolant injection hole 92, the opening of the coolant injection hole 92 can be blocked by a sealing structure, and then injection molded into the plastic frame 400, and then the coolant injection hole 92 is blocked by the plastic frame 400.

[0206] When the coolant injection hole 92 is opened on the outer edge of the middle frame 100 facing the plastic frame 400, the coolant injection hole 92 can be as follows: Fig.25 As shown, the coolant injection hole 92 is opened on the side of the middle frame 100 away from the cover plate 2. In other examples, the coolant injection hole 92 can also be opened on the side of the middle frame 100 where the cover plate 2 is arranged.

[0207] If the coolant is injected into the hole 92 as Fig.25 As shown, when the opening is on the side of the middle frame 100 away from the cover plate 2, in some examples, such as Fig.23 and Fig.25 A convex 12 may be formed on the surface of the middle frame 100 facing away from the cover plate 2 , and a channel 13 is formed in the convex 12 . The channel 13 is connected to the coolant injection hole 92 , passes through the middle frame 100 , and is connected to the chamber 4 .

[0208] The above exemplary embodiments provide two different implementation structures of the coolant injection hole. Of course, the coolant injection hole may also exist in other structures and positions.

[0209] In some electronic devices, one of the cooling liquid injection hole 91 and the cooling liquid injection hole 92 in the above examples may be included, or both the cooling liquid injection hole 91 and the cooling liquid injection hole 92 may be included.

[0210] The present application also provides a method for manufacturing a middle frame assembly, such as Fig.26 , Fig.26 The flowchart of the manufacturing method of the middle frame assembly is shown, wherein the manufacturing method comprises:

[0211] S1: Disposing a first capillary structure on a first side surface of the middle frame.

[0212] For example, a texture pattern may be formed on the surface of the middle frame by an etching process, such as chemical etching or laser etching.

[0213] A structural member having a capillary structure, such as a metal mesh, may also be fixed on the surface of the middle frame, and the metal mesh may be fixed on the surface of the middle frame.

[0214] Before the first capillary structure is provided on the middle frame, an etching process may be used to etch a plurality of protrusions on the surface of the middle frame, so that a flow channel is formed between two adjacent protrusions, and the flow channel can allow the coolant to flow.

[0215] In some process steps, when etching the first capillary structure, the second capillary structure may also be etched on the wall surface of the protrusion.

[0216] S2: Install a cover plate on the first side of the middle frame, the cover plate is fixedly connected to the middle frame, and the cover plate and the middle frame form a chamber. For example, the cover plate and the middle frame can be fixedly connected by welding.

[0217] The first capillary structure is located in a cavity surrounded by the cover plate and the middle frame.

[0218] S3: Inject coolant into the chamber.

[0219] Before injecting coolant into the chamber, other structures on the middle frame may also be installed, such as a heat source, a battery, an antenna, etc.

[0220] In addition, a pump may be arranged on the middle frame so that the liquid outlet and liquid return port of the pump are both connected to the chamber.

[0221] When installing heat sources, batteries and other structures on the middle frame, a pump can be installed.

[0222] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0223] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A middle frame assembly, the middle frame assembly being used to be arranged in an electronic device, characterized in that: The middle frame assembly includes: A middle frame, one side of which is used to set a heat source for the electronic device; A cover plate, arranged on a side of the middle frame away from the heat source, the cover plate being fixedly connected to the middle frame; The cover plate and the middle frame form a chamber, and the chamber contains a cooling liquid; A first capillary structure is arranged on the wall surface of the middle frame for surrounding the chamber.

2. The middle frame assembly according to claim 1, characterized in that: A plurality of flow channels are arranged on the wall surface of the middle frame for enclosing the chamber.

3. The middle frame assembly according to claim 2, characterized in that: The density of the flow channels in the area of ​​the middle frame corresponding to the heat source is greater than the density of the flow channels in other areas, and / or; The depth of the flow channel in the area of ​​the middle frame corresponding to the heat source is greater than the depth of the flow channel in the remaining areas.

4. The middle frame assembly according to claim 2 or 3, characterized in that: A second capillary structure is arranged on the wall surface of the flow channel.

5. The middle frame assembly according to any one of claims 2 to 4, characterized in that: A plurality of protrusions arranged at intervals are arranged on the wall surface of the middle frame for enclosing the chamber, the flow channel is formed between two adjacent protrusions, and the plurality of protrusions and the middle frame are an integral structure.

6. The middle frame assembly according to claim 5, characterized in that: An end surface of the protrusion facing the cover plate is in contact with the cover plate.

7. The middle frame assembly according to any one of claims 2 to 6, characterized in that: The plurality of flow channels include a first flow channel, a second flow channel, and a third flow channel arranged in sequence, each of the first flow channel, the second flow channel, and the third flow channel has a first end and a second end opposite to each other, the first end of the first flow channel, the first end of the second flow channel, and the first end of the third flow channel are located on the same side, and the second end of the first flow channel, the second end of the second flow channel, and the second end of the third flow channel are located on the same side; The first end of the second flow channel is connected to the first end of the first flow channel, and the second end of the second flow channel is connected to the second end of the third flow channel.

8. The middle frame assembly according to any one of claims 2 to 7, characterized in that: A plurality of support columns are arranged in the flow channel, and the plurality of support columns are arranged at intervals along the extension direction of the flow channel.

9. The middle frame assembly according to any one of claims 2 to 8, characterized in that: The middle frame assembly further includes a pump disposed on the middle frame, wherein the pump has a liquid outlet and a liquid return port for the coolant to flow, and the liquid outlet and the liquid return port are both communicated with the flow channel.

10. The middle frame assembly according to any one of claims 1 to 9, characterized in that: On the wall surface of the middle frame for enclosing the chamber, the density of the first capillary structure in the area corresponding to the heat source is greater than the density of the first capillary structure in the remaining area.

11. The middle frame assembly according to any one of claims 1 to 10, characterized in that: The first capillary structure and the middle frame are an integrated structure.

12. The middle frame assembly according to any one of claims 1 to 11, characterized in that: The side of the middle frame used for setting the heat source is also used for setting the first component of the electronic device; The depth dimension of the area of ​​the chamber opposite to the heat source is greater than the depth dimension of the area opposite to the first device.

13. The middle frame assembly according to any one of claims 1 to 12, characterized in that: A third capillary structure is arranged on the wall surface of the cover plate which is used to enclose the chamber.

14. The middle frame assembly according to any one of claims 1 to 13, characterized in that: The middle frame is provided with a coolant injection hole; The middle frame includes a first side surface and a second side surface opposite to each other, the cover plate is arranged on the second side surface, the coolant injection hole passes through the first side surface and the second side surface and is connected with the chamber, and a sealing structure is arranged in the coolant injection hole; or The middle frame assembly also includes a plastic frame, which is arranged around the edge of the middle frame. The coolant injection hole is opened on the outer edge of the middle frame facing the plastic frame and is connected to the cavity. The plastic frame blocks the opening of the coolant injection hole.

15. The middle frame assembly according to any one of claims 1 to 14, characterized in that: The middle frame and the cover plate are both made of metal materials, and the middle frame and the cover plate serve as grounding terminals of the antenna in the electronic device.

16. An electronic device, characterized in that: include: The middle frame assembly according to any one of claims 1 to 15; The heat source is arranged on a side of the middle frame away from the cover plate.

17. The electronic device according to claim 16, characterized in that: The electronic device further includes a first device; The first device and the heat source are arranged on the same side of the middle frame; The area of ​​the middle frame corresponding to the heat source protrudes more than the area corresponding to the first device, and the depth dimension of the area of ​​the chamber opposite to the heat source is greater than the depth dimension of the area opposite to the first device.

18. The electronic device according to claim 17, characterized in that: The heat source includes a circuit board, and the first component includes a battery.

19. The electronic device according to any one of claims 16 to 18, characterized in that: The electronic device also includes a display screen and a back cover; The display screen and the back cover are arranged on two opposite sides of the middle frame; The heat source is arranged in the space enclosed by the middle frame and the rear cover; The cover plate is arranged in a space enclosed by the middle frame and the display screen.

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