Base station and cleaning system

Abstract

The invention discloses a base station and a cleaning system, and the base station comprises a cleaning tank which comprises a water inlet; the water supply unit is connected with the water inlet and used for supplying water to the cleaning tank through the water inlet, and water entering the cleaning tank from the water inlet flows through an object to be cleaned; the flow acquisition unit is used for acquiring the flow of water entering the cleaning tank through the water inlet; the water level monitoring unit is used for monitoring the water level in the cleaning tank; the controller is connected with the water supply unit, the flow obtaining unit and the water level monitoring unit and used for controlling water supply of the water supply unit according to the flow and the water level. According to the base station and the cleaning system, the water level in the cleaning tank can be accurately controlled, and water in the cleaning tank is prevented from overflowing.

Description

Technical Field

[0001] The present application relates to the technical field of smart home appliances, and more specifically to a base station and a cleaning system. Background Art

[0002] At present, the base station is usually provided with a cleaning tank for cleaning the mop of the cleaning equipment (such as a sweeping robot, a sweeping and mopping robot, etc.). The cleaning tank is usually provided with a sensor for directly monitoring the water level. The base station controls the water inlet and outlet of the cleaning tank only according to the monitoring result of the sensor. However, the water film, dirt and bubbles in the cleaning tank may affect the monitoring result of the sensor, making its monitoring result inaccurate, and the occurrence of the base station tilting, the cleaning tank damage, etc. may also cause inaccurate monitoring results. Inaccurate monitoring results of the sensor are likely to cause a large amount of water to overflow from the cleaning tank, causing water intrusion and damage to other components in the base station.

[0003] Therefore, improvements are needed to at least partially solve the above problems. Summary of the invention

[0004] A series of simplified concepts are introduced in the Summary of the Invention, which will be further described in detail in the Detailed Description of the Invention. The Summary of the Invention does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the scope of protection of the claimed technical solution.

[0005] The embodiments of the present application provide a base station and a cleaning system, which can accurately control the water level in a cleaning tank to prevent water in the cleaning tank from overflowing.

[0006] In a first aspect, an embodiment of the present application provides a base station, comprising:

[0007] a cleaning tank, the cleaning tank comprising a water inlet;

[0008] a water supply unit, the water supply unit being connected to the water inlet and being used to supply water to the cleaning tank through the water inlet, wherein the water entering the cleaning tank from the water inlet flows through the objects to be cleaned;

[0009] A flow acquisition unit, the flow acquisition unit is used to acquire the flow of water entering the cleaning tank through the water inlet;

[0010] A water level monitoring unit, the water level monitoring unit is used to monitor the water level in the cleaning tank;

[0011] A controller is connected to the water supply unit, the flow acquisition unit and the water level monitoring unit, and is used for controlling the water supply of the water supply unit according to the flow and the water level.

[0012] In a second aspect, an embodiment of the present application provides a cleaning system, comprising:

[0013] A base station as described above;

[0014] A cleaning device, comprising a mop, wherein when the cleaning device is in a preset position in the base station, water entering the cleaning tank from the water inlet flows through the mop.

[0015] According to the base station and cleaning system of the present invention, the water supply of the water supply unit can be controlled jointly according to the flow rate and the water level. Such a control method is not affected by the water film, dirt and bubbles in the cleaning tank, and can effectively control the water level when the base station is tilted or the cleaning tank is damaged, thereby avoiding a large amount of water overflowing from the cleaning tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The following drawings of the present application are hereby used as part of the present application for understanding the present application. The drawings show the embodiments of the present application and their descriptions, and are used to explain the device and principle of the present application. In the drawings,

[0017] Figure 1 FIG. 4 is a schematic diagram of a partial structure of a base station according to an embodiment of the present application.

[0018] Description of reference numerals:

[0019] 100-cleaning tank, 110-water inlet, 120-water pumping port, 200-water supply unit, 300-water pumping unit, 400-flow acquisition unit, 500-water level monitoring unit. DETAILED DESCRIPTION

[0020] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it is apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described.

[0021] It should be understood that the present application can be implemented in different forms and should not be construed as being limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present application to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0022] It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as a second element, component, region, layer or part.

[0023] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used herein for convenience of description to describe the relationship of one element or feature to other elements or features shown in the figures. It should be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation shown in the figures.

[0024] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0025] See attached Figure 1 An exemplary description is given of a base station according to an embodiment of the present application. The base station is a base station that cooperates with cleaning equipment such as a sweeping robot and a mopping robot. The base station can clean objects to be cleaned such as a mop on the cleaning equipment when the cleaning equipment is in a preset position in the base station. The base station includes a cleaning tank 100, a water supply unit 200, a pumping unit 300, a flow acquisition unit 400, a water level monitoring unit 500 and a controller.

[0026] The cleaning tank 100 includes a water inlet 110 and a water outlet. The object to be cleaned on the cleaning device is located at the water inlet 110. The water entering the cleaning tank 100 from the water inlet 110 flows through the object to be cleaned to wet and clean the object to be cleaned, and then leaves the object to be cleaned together with the dirt on the object to be cleaned and enters the cleaning tank 100. It should be noted that the water mentioned here can refer to clean water or a mixture of clean water and detergent. The water outlet is located at the bottom of the cleaning tank 100, and the water in the cleaning tank 100 can leave the cleaning tank 100 through the water outlet. The object to be cleaned can be a mop on the drum of the cleaning device or a flat mop on the rotating bracket. When the object to be cleaned is cleaned by the cleaning tank 100, the mop rotates and contacts with the scraper on the cleaning device or the base station. After the water entering the cleaning tank 100 from the water inlet 110 wets the mop, it is connected to the dirt on the mop and is scraped out by the scraper and enters the cleaning tank 100, thereby cleaning the mop.

[0027] The water supply unit 200 is connected to the water inlet 110, and is used to supply water to the cleaning tank 100 through the water inlet 110. In the embodiment of the present application, the water supply unit 200 includes a clean water tank and a first pump, the first pump can be a water pump, the water inlet of the first pump is connected to the clean water tank, the water outlet of the first pump is connected to the water inlet 110 of the cleaning tank 100, and the first pump can pump the clean water in the clean water tank to the water inlet 110 of the cleaning tank 100 when it is working. In some embodiments, the first pump can be an air pump, the air outlet of the first pump is connected to the clean water tank, the water outlet of the clean water tank is connected to the water inlet 110 of the cleaning tank 100, and the first pump can generate positive pressure in the clean water tank when it is working to press the clean water in the clean water tank to the water inlet 110 of the cleaning tank 100. By controlling the first pump to work or stop working, water can be supplied to the cleaning tank 100 through the water inlet 110 or stop supplying water. In some embodiments, the water supply unit 200 may include a switch valve, the water inlet of the open-tube valve is connected to an external water supply structure such as a faucet, and the water outlet of the open-tube valve is connected to the water inlet 110 of the cleaning tank 100. By controlling the opening and closing of the switch valve, water can be supplied or stopped to the cleaning tank 100 through the water inlet 110.

[0028] The pumping unit 300 is connected to the water pumping port 120, and is used to pump out the water in the washing tank 100 through the water pumping port 120. In the embodiment of the present application, the pumping unit 300 includes a sewage tank and a second pump, the second pump can be a water pump, the water inlet of the second pump is connected to the water pumping port 120, the water outlet of the second pump is connected to the water inlet of the sewage tank, and the second pump can pump the sewage in the washing tank 100 into the sewage tank when it is working. In some embodiments, the second pump can be an air pump, the air inlet of the second pump is connected to the sewage tank, the water inlet of the sewage tank is connected to the water pumping port 120 of the washing tank 100, and the second pump can generate negative pressure in the sewage tank when it is working to absorb the sewage in the washing tank 100 into the sewage tank. In some embodiments, the pumping unit 300 can only include the second pump, the second pump is a water pump, the water inlet of the second pump is connected to the water pumping port 120, and the water outlet of the second pump is connected to an external area such as a floor drain that can be pumped. By controlling the second pump to start or stop working, water can be pumped or stopped through the water pumping port 120.

[0029] The flow acquisition unit 400 is used to obtain the flow rate of water entering the cleaning tank 100 through the water inlet 110 of the cleaning tank 100. In an embodiment of the present application, the flow acquisition unit 400 includes a flow meter. Specifically, the flow meter can be arranged at the water outlet of the first pump, or in the pipeline between the water outlet of the first pump and the water inlet 110 of the cleaning tank 100, which can obtain the flow rate of clean water flowing to the cleaning tank 100 through the first pump, that is, the flow rate of clean water entering the cleaning tank 100. The flow meter can be an electromagnetic flow meter, an ultrasonic flow meter or other flow meter capable of measuring liquid flow. In some embodiments, when the first pump is an air pump, the flow meter can be arranged in the pipeline between the water outlet of the clean water tank and the water inlet 110 of the cleaning tank 100.

[0030] The water level monitoring unit 500 is used to monitor the water level in the cleaning tank 100, that is, to monitor whether the water level in the cleaning tank 100 reaches a preset height. In the embodiment of the present application, the water level monitoring unit 500 is configured to be triggered when the water level in the cleaning tank 100 reaches a preset height. The preset height can be a height close to the highest water level of the cleaning tank 100. When the water level in the cleaning tank 100 reaches the preset height, it means that the water in the cleaning tank 100 is about to overflow and the water intake needs to be stopped immediately. In the embodiment of the present application, the water level monitoring unit 500 includes two electrode sheets arranged at intervals, the two electrode sheets are located in the cleaning tank 100 and at a preset height, and the two electrode sheets are arranged in a power supply circuit. When the water level in the cleaning tank 100 does not reach the preset height, the power supply circuit is disconnected at the two electrode sheets, and the power supply circuit is not turned on; when the water level in the cleaning tank 100 reaches the preset height, the water in the cleaning tank 100 contacts the two electrode sheets at the same time, and the two electrode sheets form a conductive connection through water, and the power supply circuit is turned on to generate an electrical signal. In some other embodiments, the water level monitoring unit 500 may also be a sensor triggered when the water level in the cleaning tank 100 reaches a preset height, such as an infrared liquid level sensor, a float liquid level sensor, a capacitive liquid level sensor, etc.

[0031] The controller is connected to the water supply unit 200, the pumping unit 300, the flow acquisition unit 400 and the water level monitoring unit 500. The controller is used to control the water supply of the water supply unit 200 according to the flow acquired by the flow acquisition unit 400 and the water level monitored by the water level monitoring unit 500. Specifically, the controller is used to determine the water level or water volume in the washing tank 100 according to the flow acquired by the flow acquisition unit 400 and the water supply time of the water supply unit 200, and control the water supply unit 200 to stop working when the water level or water volume in the washing tank 100 meets the preset conditions. The controller can be a single-chip microcomputer or other control device with computing and processing capabilities, which can count when the water supply unit 200 is working to obtain the water supply time, and then integrate the flow acquired by the flow acquisition unit 400 and the water supply time to obtain the amount of water entering the washing tank 100. The controller can also further determine the water level in the washing tank 100 according to the water volume and the structural size of the washing tank 100 (such as the bottom area of ​​the washing tank 100). When the amount of water in the washing tank 100 reaches a preset water amount threshold or the water level in the washing tank 100 reaches a first preset height, the water supply unit 200 is controlled to stop working, that is, to stop supplying water to the washing tank 100 through the water inlet 110, thereby effectively preventing the water level in the washing tank 100 from further rising. In the embodiment of the present application, the controller can also control the pumping unit 300 to work when the water supply unit 200 is controlled to stop working, so as to pump water from the washing tank 100, so as to further reduce the height of the water level in the washing tank 100 and prevent the sewage in the washing tank 100 from overflowing. Among them, the height of the water level corresponding to the preset water amount threshold can be a first preset height, and the water level monitoring unit 500 is configured to be triggered when the water level in the washing tank 100 reaches a second preset height, and the first preset height is less than the second preset height. Thus, according to the base station of the present application, the water level in the cleaning tank 100 can be controlled within any height (not exceeding the height) according to demand, thereby effectively avoiding the overflow of sewage in the cleaning tank 100, and the method of controlling the water level according to the water inlet flow rate and the water supply time is highly robust and will not be affected by the water film, dirt and bubbles in the cleaning tank 100. The water output can also be controlled within a reasonable range when the machine is aging, the base station is tilted, the cleaning tank is damaged, etc.

[0032] In the embodiment of the present application, the controller is also used to control the water supply unit 200 to stop working and control the pumping unit 300 to work when the water level monitoring unit 500 is triggered. Specifically, when the water level in the cleaning tank 100 reaches the second preset height, the power supply circuit where the two electrode sheets are located is turned on to generate an electrical signal to provide to the controller. When the controller receives the electrical signal, it controls the water supply unit 200 to stop supplying water and controls the pumping unit 300 to start pumping water. Therefore, when the flow acquisition unit 400 fails and the water level in the cleaning tank 100 exceeds the first preset height and rises to the second preset height, the water supply can be stopped in time and pumping can be performed to lower the water level to prevent the sewage in the cleaning tank 100 from overflowing. In the base station of the embodiment of the present application, in most cases (when there is no failure in the flow acquisition unit 400), the water level monitoring unit 500 will not be triggered, that is, the water in the cleaning tank 100 will not contact the electrode sheet, thereby effectively avoiding electrolysis caused by long-term contact between the electrode sheet and water, thereby extending the service life of the electrode sheet, and the electrode sheet is not easily affected by the water film, dirt and bubbles in the cleaning tank 100, which may cause the water level monitoring unit 500 to be falsely triggered.

[0033] In the embodiment of the present application, the controller is also used to control the pumping unit 300 to work for a preset time before the water supply unit 200 starts to supply water, so as to discharge the sewage in the washing tank 100. The preset time may be, for example, the time required for the pumping unit 300 to completely discharge the sewage in the washing tank 100 when the water level in the washing tank 100 is at the first preset height or the second preset height. The controller controls the pumping unit 300 to work for a preset time before the water supply unit 200 starts to supply water, which can effectively avoid residual sewage in the washing tank 100 when the water supply unit 200 supplies water, so that the controller can more accurately determine the water level or water volume in the washing tank 100.

[0034] In the embodiment of the present application, the controller is also used to control the water supply unit 200 to stop working and control the pumping unit 300 to work when the continuous working time of the water supply unit 200 exceeds the first time threshold. The first time threshold may be, for example, greater than the time for the object to be cleaned to complete the normal cleaning. When the continuous working time of the water supply unit 200 exceeds the first time threshold, the water level corresponding to the amount of water supplied by the water supply unit 200 to the washing tank 100 through the water inlet 110 is greater than the second preset height or the first preset height. The flow acquisition unit 400 and the water level monitoring unit 500 may fail at the same time, causing the controller to fail to control the water supply unit 200 to stop working in time, causing the continuous working time of the water supply unit 200 to exceed the first time threshold. At this time, the controller controls the water supply unit 200 to stop working and controls the pumping unit 300 to work to prevent the sewage in the washing tank 100 from further leaking.

[0035] In some embodiments, the controller is also used to control the pumping unit 300 to work to pump out the sewage in the cleaning tank 100 when the continuous working time of the water supply unit 200 exceeds the second time threshold, wherein the second time threshold is less than the first time threshold, that is, after the water supply unit 200 supplies water for a period of time, the pumping unit 300 is controlled to work to pump water, and at this time, the cleaning tank 100 supplies water while pumping water, thereby effectively lowering the water level in the cleaning tank 100, preventing the water level in the cleaning tank 100 from further rising, or slowly raising the water level in the cleaning tank 100. In this embodiment, the controller is also used to control the water supply unit 200 to stop working when the continuous working time of the water supply unit 200 exceeds the first time threshold.

[0036] In some embodiments, the base station further includes an alarm unit, and the controller is connected to the alarm unit, and is used to control the alarm unit to alarm when the duration of the water level monitoring unit 500 being triggered exceeds a preset time threshold (e.g., 5 seconds, 10 seconds, or other suitable time threshold). The duration of the water level monitoring unit 500 being triggered exceeding the preset time threshold indicates that the pumping unit 300 has failed to effectively pump water to lower the water level. At this time, there is a greater probability that sewage will overflow from the cleaning tank 100. At this time, the controller controls the alarm unit to alarm to remind the user so that the user can handle it in time. The alarm unit may include an indicator light and / or a speaker, which is used to send out light alarm information and / or sound alarm information.

[0037] In some embodiments, a pumping port may not be provided on the cleaning tank 100, and a pumping unit 300 may not be provided on the base station. The controller may be configured to send a reminder message through an indicator light and / or a speaker when the water level in the cleaning tank 100 reaches a first preset height or a second preset height, so as to remind the user to manually pour out the sewage in the cleaning tank 100.

[0038] The present application also provides a cleaning system, which includes the above-mentioned base station and a cleaning device, and the cleaning device can be a sweeping robot, a mopping robot, etc. The cleaning device includes a mop, which can be a mop on a drum of the cleaning device or a flat mop on a rotating bracket. When the cleaning device is in a preset position in the base station, water entering the cleaning tank 100 from the water inlet 110 flows through the mop. The cleaning device can control the rotation of the drum or the rotating bracket to rotate the mop and contact the scraper on the cleaning device or the base station. The water entering the cleaning tank 100 from the water inlet 110 wets the mop and then connects to the dirt on the mop and is scraped out by the scraper into the cleaning tank 100, thereby achieving cleaning of the mop.

[0039] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application to this. Those of ordinary skill in the art may make various changes and modifications therein without departing from the scope and spirit of the present application. All these changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0040] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0041] Similarly, it should be understood that in order to streamline the present application and help understand one or more of the various inventive aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the method of the present application should not be interpreted as reflecting the following intention: the claimed application requires more features than the features clearly stated in each claim. More specifically, as reflected in the corresponding claims, the inventive point is that the corresponding technical problem can be solved with features less than all the features of a single disclosed embodiment. Therefore, the claims following the specific embodiment are hereby explicitly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present application.

[0042] It will be understood by those skilled in the art that, except for mutually exclusive features, all features disclosed in this specification (including the accompanying claims, abstracts and drawings) and all processes or units of any method or device disclosed in this specification may be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstracts and drawings) may be replaced by an alternative feature that provides the same, equivalent or similar purpose.

[0043] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0044] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.

Claims

1. A base station, characterized in that: include: a cleaning tank, the cleaning tank comprising a water inlet; a water supply unit, the water supply unit being connected to the water inlet and being used to supply water to the cleaning tank through the water inlet, wherein the water entering the cleaning tank from the water inlet flows through the objects to be cleaned; A flow acquisition unit, the flow acquisition unit is used to acquire the flow of water entering the cleaning tank through the water inlet; A water level monitoring unit, the water level monitoring unit is used to monitor the water level in the cleaning tank; A controller is connected to the water supply unit, the flow acquisition unit and the water level monitoring unit, and is used for controlling the water supply of the water supply unit according to the flow and the water level.

2. The base station according to claim 1, characterized in that The controller is used to determine the water level or water volume in the cleaning tank based on the flow rate obtained by the flow acquisition unit and the water supply time of the water supply unit, and control the water supply unit to stop working when the water level in the cleaning tank reaches a first preset height or the water volume reaches a preset water volume.

3. The base station according to claim 2, characterized in that The water level monitoring unit is configured to be triggered when the water level in the cleaning tank reaches a second preset height; The controller is used to control the water supply unit to stop working when the water level monitoring unit is triggered.

4. The base station according to claim 3, characterized in that The first preset height is less than the second preset height; The water level corresponding to the preset water volume is lower than the second preset height.

5. The base station according to claim 3, characterized in that: The base station also includes an alarm unit; The controller is connected to the alarm unit, and is used to control the alarm unit to sound an alarm when the duration of the water level monitoring unit being triggered exceeds a preset time threshold.

6. The base station according to claim 3, characterized in that The water level monitoring unit includes electrode sheets arranged at intervals, two of the electrode sheets are located in the cleaning tank and at the second preset height, and when the water level in the cleaning tank reaches the first preset height, the two electrode sheets form a conductive connection through the water in the cleaning tank.

7. The base station according to any one of claims 2 to 6, characterized in that: The cleaning tank also includes a water extraction port; The base station further comprises a pumping unit, which is connected to the pumping port and is used to pump out water in the cleaning tank through the pumping port; The controller is connected to the pumping unit and is used to control the pumping unit to work when the water supply unit is controlled to stop working.

8. The base station according to claim 7, characterized in that: The controller is also used to control the pumping unit to work for a preset time before the water supply unit starts working.

9. The base station according to claim 7, characterized in that: The controller is further configured to control the water supply unit to stop working and control the pumping unit to work when the continuous working time of the water supply unit exceeds a first time threshold; and / or, The controller is also used to control the pumping unit to work when the continuous working time of the water supply unit exceeds a second time threshold; The second time threshold is smaller than the first time threshold.

10. A cleaning system, characterized in that: include: A base station as claimed in any one of claims 1 to 9; A cleaning device, comprising a mop, wherein when the cleaning device is in a preset position in the base station, water entering the cleaning tank from the water inlet flows through the mop.

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