Dispensing production line for producing and processing electronic components
By designing an automated dispensing production line, the automatic loading, dispensing, buckle and unloading of electronic components is realized, and the dispensing quality is detected through image recognition, which solves the inefficiency problem caused by manual intervention in the existing technology, and improves production efficiency and product quality.
Patent Information
- Application Number
- CN202411799211.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-02-25
AI Technical Summary
During the production process of existing electronic components, dispensing operations require manual intervention, resulting in low efficiency. The components are small in size and need to be adjusted multiple times during manual placement to further reduce production efficiency.
Design an automated dispensing production line, including loading module, mobile module, dispensing module, detection module, cover buckle module and cut-off module, to realize automatic loading, dispensing, cover buckle and cut-off of electronic components, and to detect the dispensing quality through image recognition.
It improves the efficiency and accuracy of electronic components production, reduces manual intervention, reduces product failure rate, and realizes automatic production of components.
Smart Images
Figure CN119500483A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of automatic production equipment for electronic components, and in particular to a glue dispensing production line used for the production and processing of electronic components. Background Art
[0002] In the production process of electronic components, the components need to be assembled, welded, glued, tested, packaged, and other operations. In the prior art, these operations require human intervention. For example, when dispensing glue, there are certain requirements for the glue position and glue area, so as to achieve the purpose of wrapping the specified structure with glue without overflowing the glue. Therefore, after completing the welding, it is necessary to manually place the components on the discharge tray, fix the components, and then place the discharge tray in the glue dispensing position, and automatically dispense glue through a robotic arm or other equipment, so as to achieve precise positioning during glue dispensing and improve the quality of glue dispensing. However, the manual placement of components is inefficient, and the components are small in size. When placed manually, multiple adjustments often occur, further reducing production efficiency. Therefore, there is an urgent need for an automated glue dispensing production line that can automatically load, dispense, cover, unload, and perform image recognition on the quality of glue dispensing. Summary of the invention
[0003] The present invention aims to provide a dispensing production line for the production and processing of electronic components, which can automatically load, dispense, cover, and unload materials, and perform image recognition on the dispensing quality to improve production efficiency.
[0004] The present invention provides the following basic scheme: Glue dispensing production line for the production and processing of electronic components, including: The loading module is used to transport electronic components to the loading position and the upper cover to the waiting position. A moving module is used to move the electronic components from the loading position to the dispensing position, and is also used to move the electronic components after dispensing to the detection position, and is also used to move the electronic components after image acquisition to the capping position, and is also used to move the electronic components after capping to the unloading position; Glue dispensing module, used for dispensing glue to the electronic components on the glue dispensing position; The detection module is used to collect images of electronic components at the detection position, analyze the dispensing conditions of the electronic components according to the image collection results, and generate detection results; A cover-locking module is used to move the upper cover at the waiting position to the cover-locking position, and to lock the upper cover onto the electronic components at the cover-locking position; The unloading module is used to unload the electronic components on the unloading position.
[0005] Furthermore, the loading module includes a loading tray and a loading drive. The loading tray is used to place electronic components to be glued. The loading drive can be against the electronic components and push the electronic components to move on the loading tray.
[0006] Further, the mobile module includes a first mobile fixture, a second mobile fixture, a third mobile fixture, and a transfer tooling located below the dispensing module and the detection module. The first mobile fixture is used to move the electronic components from the loading position to the transfer fixture. The second movable fixture and the third movable fixture are used to change the position of the electronic components on the transfer fixture. The transfer tooling can move along the distribution direction of the first mobile fixture, the second mobile fixture, and the third mobile fixture. The transfer tooling is used to fix electronic components and move the electronic components to the dispensing position. It is also used to cooperate with the second mobile fixture and the third mobile fixture to move the electronic components to the detection position, the capping position, and the unloading position, respectively.
[0007] Further, the moving module includes a first moving fixture and a conveying member located below the dispensing module and the detection module; The first moving fixture is used to move the electronic components from the loading position to the conveyor; The conveyor is used to move the electronic components to the dispensing position, the inspection position, the capping position and the unloading position in sequence.
[0008] Furthermore, the detection module includes a ring light source and an image collector. The ring light source is located above the detection position, and the image collector is located above the ring light source. The image collector is used to capture images of electronic components on the detection position, and the ring light source is used to supplement the light source when the image collector is capturing images.
[0009] Furthermore, the loading module also includes a rotating loading tray, which is used to sort the upper covers and transport them to the waiting position; The cover snapping module comprises an adsorbing member, which is used to adsorb the upper cover on the waiting position, move the upper cover to the cover snapping position, and snap the upper cover onto the electronic components located at the cover snapping position.
[0010] Furthermore, the unloading module includes an unloading fixture, an unloading drive and an unloading tray. The unloading fixture is used to move the electronic components at the unloading position to the unloading tray. The unloading tray is used to place the electronic components. The unloading drive can resist the electronic components and push the electronic components to move on the unloading tray.
[0011] Furthermore, a plurality of material slots for moving electronic components are provided on the unloading tray, and the unloading driving member includes a push rod that can move along the length direction of the material slot, and one end of the push rod can abut against the electronic components in the material slot; One end of the material trough has a placement position, and the unloading fixture is used to move the electronic components at the unloading position to the placement position. One end of the push rod can overlap with the placement position, and the overlapping length of the push rod and the placement position is greater than the length of the electronic components.
[0012] Further, the second movable clamp and the third movable clamp each include a trigger and a clamp, The trigger is used to contact the transfer tooling; The transfer fixture is also used to release the electronic components when the trigger contacts the transfer fixture; The gripper is used to grip and move electronic components after the transfer tooling releases the electronic components.
[0013] Implementation process and beneficial effects of the basic plan: When in use, the electronic components are located in the loading tray. At this time, the electronic components lack the upper cover. The loading drive pushes the electronic components to move so that the electronic components are located at the loading position. Taking the clamp as an example, the mobile module clamps and moves the electronic components so that the electronic components are located at the dispensing position. At this time, the dispensing module dispenses glue on the electronic components. After dispensing, the mobile module clamps and moves the electronic components again so that the electronic components are located at the detection position. At this time, the detection module collects the image of the dispensing side of the electronic components and identifies and analyzes based on the image. After collecting the image, the mobile module clamps and moves the electronic components again so that the electronic components are located at the buckle cover position. Prior to this, the rotating loading tray has sorted the upper cover and transported it to the waiting position. The adsorption part adsorbs and moves the upper cover on the waiting position, moves the upper cover to the buckle cover position, and buckles the upper cover on the electronic components located at the buckle cover position to complete the packaging of the electronic components. After the cover is buckled, the moving module moves the electronic components so that the electronic components are located at the unloading position. At this time, the unloading fixture clamps and moves the electronic components so that the electronic components are located at the specified position (i.e., the placement position) on the unloading tray, and the unloading drive pushes the electronic components to move on the material trough.
[0014] In this solution, the setting of the loading tray and the unloading tray can transport multiple electronic components at a time, improving production efficiency. The setting of the loading drive can realize the automatic loading of electronic components in the loading tray, reducing labor input, and the automatic loading effectively improves production efficiency.
[0015] When the mobile module is equipped with a fixture and a transfer fixture, the transfer fixture moves back and forth at the specified position, so that the electronic components can be accurately positioned at the dispensing position and the cover position, thereby improving the production accuracy. At the same time, the dispensing situation is analyzed in combination with the detection module to reduce the unqualified rate of electronic component products and improve the production quality. The setting of the trigger, during the production process, by contacting the transfer fixture and applying force, the transfer fixture can release the electronic components, and the second mobile fixture or the third mobile fixture can realize the rapid clamping and movement of the electronic components, thereby realizing the automatic production of electronic components and improving production efficiency. When the mobile module adopts a conveyor, it reduces the tooling and equipment required for production and reduces the overall finished product of the production equipment.
[0016] The setting of the ring light source, when the image collector collects images, firstly, provides light source to increase the brightness, so as to facilitate the capture of clear glue images; secondly, in this scheme, fluorescent components are added to the glue, and the fluorescent reaction is triggered by the ring light source to further enhance the clarity of the glue image, thereby improving the accuracy of image detection.
[0017] The cover snap-on module uses adsorption parts instead of clamps, which can reduce the difficulty of snapping together and avoid collisions with electronic components caused by the clamping parts of the clamps when snapping the cover, thereby improving the qualified rate of product production.
[0018] The push rod is set to push the electronic components at the placement position to provide a pick-up and placement space for the next electronic component. Compared with the existing mechanical claw swing plate, the tolerance of electronic component placement is increased, the precision requirements for the mechanical claw to place electronic components are reduced, and the production cost is reduced in disguise, and the production efficiency is improved. At the same time, the unloading fixture only needs to reciprocate between the unloading position and the placement position, which reduces the precision requirements for the movement and positioning of the mechanical claw, and also reduces the computing space occupied by the system control.
[0019] By adopting this solution, the dispensing process and the capping process of electronic components are integrated, which can realize the automatic loading, dispensing, capping and unloading of electronic components, and realize the automated production of electronic components. At the same time, during the production process, the dispensing quality is image recognized, which improves the production efficiency and the qualified rate of the products. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a structural schematic diagram of an embodiment of a dispensing production line for the production and processing of electronic components of the present invention; Figure 2 It is a structural schematic diagram of a feeding module of an embodiment of a dispensing production line for the production and processing of electronic components of the present invention; Figure 3 It is a schematic structural diagram of the second movable fixture and the third movable fixture of the dispensing production line for the production and processing of electronic components of the present invention; Figure 4It is a structural schematic diagram of a detection module of an embodiment of a dispensing production line for the production and processing of electronic components of the present invention; Figure 5 It is a structural schematic diagram of a blanking module of an embodiment of a dispensing production line for the production and processing of electronic components of the present invention. DETAILED DESCRIPTION
[0021] The following is further described in detail through specific implementation methods: The figure marks in the drawings of the specification include: loading module 1, loading tray 101, loading drive 102, loading channel 103, loading tray guide rail 104, block 105, moving module 2, first moving fixture 201, cylinder assembly 202, trigger 203, clamp 204, trigger rod 205, tooling 206, dispensing module 3, detection module 4, annular light source 401, image collector 402, vertical mounting rod 403, unloading module 5, unloading fixture 501, unloading tray 502, unloading tray guide rail 503, unloading drive 504, push rod 505.
[0022] Example Glue dispensing production line for electronic components production and processing, such as the attached Figure 1 As shown, including: The loading module 1 is used to transport the electronic components to the loading position and to transport the upper cover to the waiting position; the moving module 2 is used to move the electronic components from the loading position to the dispensing position, and is also used to move the electronic components after dispensing to the detection position, and is also used to move the electronic components after image collection to the cover-fastening position, and is also used to move the electronic components after the cover-fastening to the unloading position; the dispensing module 3 is used to dispense glue to the electronic components at the dispensing position; the detection module 4 is used to capture images of the electronic components at the detection position, analyze the dispensing conditions of the electronic components according to the image collection results, and generate detection results; the cover-fastening module is used to move the upper cover at the waiting position to the cover-fastening position, and fasten the upper cover on the electronic components at the cover-fastening position; the unloading module 5 is used to unload the electronic components at the unloading position.
[0023] The loading module 1 includes a loading tray 101 and a loading drive 102. Figure 2 As shown, the loading tray 101 and the loading drive 102 are used for automatic loading of electronic components, and the electronic components at this time lack a cover. The loading tray 101 is used to place electronic components to be dispensed, and multiple electronic components are placed side by side. There are multiple rows of electronic components on the loading tray 101.
[0024] The loading drive member 102 can abut against the electronic components and push the electronic components to move on the loading tray 101. Specifically: the loading drive member 102 adopts a linear slide rail, and a slider is slidably connected to the linear slide rail. The slider is located above the loading tray 101. The slider is provided with a driving rod facing the loading tray 101. The driving rod moves under the drive of the linear slide rail and contacts the electronic components on the loading tray 101 to push the electronic components to move.
[0025] In order to facilitate the mobile module 2 to clamp and move the electronic components, the loading module 1 also includes a loading channel 103, a loading conveyor belt and a loading tray guide rail 104. The loading tray 101 is provided with a plurality of strip grooves for placing and moving the electronic components. One side of the strip groove is connected to the side wall of the loading tray 101. The loading channel 103 is directly opposite to a strip groove of the loading tray 101, and the loading channel 103 and the strip groove are connected. The loading conveyor belt is located below the loading channel 103, and a stopper 105 is provided at one end of the loading channel 103 away from the loading tray 101. The electronic components of the loading tray 101 enter the loading channel 103 under the push of the driving rod, and move toward the stopper 105 under the drive of the loading conveyor belt until they are blocked by the stopper 105. At this time, the electronic components are arranged on the loading channel 103. The position where the electronic components are in contact with the stopper 105 is the loading position. The loading tray guide rail 104 is located below the loading tray 101 and is slidably connected to the loading tray 101. When all the electronic components on a strip groove enter the loading channel 103, the loading tray 101 moves so that the next strip groove faces the loading channel 103, and the electronic components are automatically loaded again. The setting of the loading channel 103 turns batches of electronic components into individual independent ones, which is easy to clamp and move by the mobile module 2.
[0026] The feeding module 1 also includes a rotating feeding tray, which is used to sort the upper covers and transport them to the waiting position; the rotating feeding tray is used for automatic feeding of the upper covers. Specifically: the rotating feeding tray adopts an existing component vibration tray, the discharge port of the component vibration tray is connected to the feeding channel, and the end of the feeding channel is the waiting position.
[0027] The setting of the mobile module 2 includes multiple schemes. The first scheme is that the mobile module 2 includes a first mobile fixture 201, a second mobile fixture, a third mobile fixture, and a transfer tool located below the dispensing module 3 and the detection module 4. The first mobile fixture 201 is used to move electronic components from the loading position to the transfer tool, the second mobile fixture and the third mobile fixture are used to change the position of the electronic components on the transfer tool, and the transfer tool can move along the distribution direction of the first mobile fixture 201, the second mobile fixture, and the third mobile fixture. The transfer tool is used to fix the electronic components and move the electronic components to the dispensing position. It is also used to cooperate with the second mobile fixture and the third mobile fixture to move the electronic components to the detection position, the cover position and the unloading position respectively. Specifically: The transfer tooling includes a transfer rail, a mounting plate, and a tooling 206 disposed on the mounting plate. The mounting plate is slidably connected to the transfer rail. Under the action of the transfer rail, the mounting plate moves linearly along the transfer rail. In this embodiment, there are three processes of dispensing, testing, and capping. In combination with the processes, the number of tooling 206 on the transfer tooling is three, and the three toolings 206 are respectively opposite to the dispensing module 3, the testing module 4, and the capping module.
[0028] The first mobile fixture 201 includes a first slide rail and a pneumatic finger. The first slide rail is a linear slide rail. The first slide rail is slidably connected to a slider. The slider is connected to a first cylinder. The piston rod of the first cylinder is connected to the pneumatic finger. Under the action of the first slide rail, the pneumatic finger moves toward the transfer tooling, and under the action of the first cylinder, moves toward the tooling 206 on the transfer tooling. The electronic components are clamped and released by controlling the pneumatic fingers, so as to move the electronic components from the loading position to the transfer tooling.
[0029] The second mobile fixture and the third mobile fixture each include a cylinder assembly 202, a trigger 203 and a clamp 204, as shown in the attached Figure 3 As shown, the trigger 203 is used to contact the transfer tooling, and the transfer tooling is also used to release the electronic components when the trigger 203 contacts the transfer tooling, and the clamp 204 is used to clamp and move the electronic components after the transfer tooling releases the electronic components. Specifically: The cylinder assembly 202 includes a second cylinder and a third cylinder in parallel. The piston rods of the second cylinder and the third cylinder are respectively equipped with a trigger 203 and a clamp 204. The trigger 203 includes a trigger rod 205 for contacting a tool 206. The clamp 204 includes two clamping fingers that can be opened and closed. The two clamping fingers are arranged opposite to each other. The clamp 204 adopts an existing pneumatic finger. The two clamping fingers are arranged opposite to each other. In order to facilitate the clamping of electronic components, external arms are installed on the two clamping fingers by screws. The external arms contact and clamp the electronic components. By adjusting the thickness and position of the external arms, it is suitable for clamping electronic components of more sizes. The end of the trigger rod 205 can be against the tool 206 of the electronic component. The end of the trigger rod 205 is provided with a contact portion. The cross-sectional area of the contact portion is greater than the cross-sectional area of the trigger rod 205, that is, the end of the trigger rod 205 extends circumferentially to form a contact portion.
[0030] The second mobile fixture and the third mobile fixture are used in conjunction with the transfer fixture. The fixture 206 on the transfer fixture is used to fix a single electronic component. The installation plate is moved by controlling the transfer guide rail to drive the fixture 206 to move. The fixture 206 includes a base, a hinge column, and a fixed plate and a movable plate arranged on the base. The fixed plate is fixedly connected to the base, and the movable plate is hinged to the base through the hinge column. Specifically, two hinge seats are integrally formed on the base, and the two ends of the hinge column are respectively rotatably connected to the two hinge seats. A through hole is opened at the bottom of the movable plate, and the hinge column passes through the through hole. The ends of the fixed plate and the movable plate away from the base are both provided with a positioning part for fixing the electronic components. The two positioning parts are arranged relative to each other. The movable plate drives one positioning part to move, and the distance between the two positioning parts is increased, so that the electronic components clamped by the fixture 206 can be released. A pressing plate is provided on the movable plate, and the pressing plate is located on the side of the movable plate away from the fixed plate. The angle between the movable plate and the pressing plate is less than 90 degrees. Specifically, the angle between the movable plate and the pressing plate is 60 degrees.
[0031] A torsion spring is sleeved on the hinge column, and the two ends of the torsion spring are in contact with the base and the side of the pressing plate away from the moving plate. Specifically, in order to install the torsion spring, a through groove is also provided at the bottom of the moving plate, the groove direction of the through groove is perpendicular to the hole direction of the through hole, and the groove wall is connected to the hole wall. The hinge column passes through the through hole, the through groove, and the torsion spring, and the two ends of the torsion spring are in contact with the side of the pressing plate away from the moving plate and the base, and apply a force. In other embodiments, the two ends of the torsion spring are in contact with the side of the moving plate away from the fixed plate and the base, and apply a force. At the same time, the two ends of the torsion spring can also be set to be embedded in the pressing plate and the base.
[0032] The end of the pressing plate is provided with a pressing portion for contacting the trigger rod 205. When the movable plate is arranged vertically, the pressing portion is arranged horizontally, that is, when the tooling 206 fixes the electronic components, the pressing portion is arranged horizontally, and the force acting on the torsion spring is relatively small. When the trigger rod 205 contacts the pressing portion and applies a force, the pressing plate drives the movable plate to move, and the force acting on the torsion spring increases. When the trigger rod 205 leaves the pressing portion, the pressing plate and the movable plate are reset under the force of the torsion spring.
[0033] The connection direction between the fixed plate and the movable plate is perpendicular to the connection direction between the two clamping fingers. For example, the electronic component includes four side surfaces, front, back, left, and right, as well as a top surface and a bottom surface. When the electronic component is placed on the tooling 206, the two positioning parts contact the left and right side surfaces of the electronic component respectively, thereby fixing and positioning the electronic component. When the clamp 204 clamps the electronic component, the two clamping fingers contact the front and rear side surfaces of the electronic component respectively, thereby grasping the electronic component. With this arrangement, in the process of grasping and placing the electronic component, interference between the clamping fingers and the tooling 206 is avoided, thereby ensuring the smooth progress of the automatic production process of the electronic component. In other embodiments, the tooling 206 can adopt the existing quick-release tooling 206, and be used in conjunction with the second movable fixture and the third movable fixture.
[0034] When in use, the tooling 206 is located below the clamp 204, and the cylinder group controls the trigger 203 and the clamp 204 to descend successively. When clamping electronic components, the clamp 204 first descends and clamps the electronic components, and the trigger 203 descends later, and contacts the tooling 206 so that the tooling 206 releases the electronic components, and the clamp 204 and the trigger 203 rise and reset successively. At this time, the electronic components rise with the clamp 204 and leave the transfer tooling; when placing electronic components, the trigger 203 first descends, contacts the tooling 206 so that the tooling 206 is opened, and the clamp 204 descends later and releases the electronic components, and the trigger 203 and the clamp 204 rise and reset successively. The electronic components are switched to different tooling 206 of the transfer tooling by the second mobile fixture and the second mobile fixture, and the position of the electronic components is changed in combination with the movement of the transfer tooling, so that the electronic components are moved to the detection position, the cover position and the unloading position respectively.
[0035] The second solution is that the moving module 2 includes a first moving fixture 201 and a conveying member located below the dispensing module 3 and the detection module 4. The first moving fixture 201 is used to move the electronic components from the loading position to the conveying member. The first moving fixture 201 has the same structure as the first moving fixture 201 in the first solution, so it will not be repeated.
[0036] The conveyor is used to move the electronic components to the dispensing position, the testing position, the capping position and the unloading position in sequence. Specifically: the conveyor includes a conveying channel and a moving conveyor belt. The moving conveyor belt is located below the conveying channel. The moving conveyor belt drives the electronic components to move to the dispensing position, the testing position, the capping position and the unloading position respectively. The setting of the conveying channel is used to limit the moving direction and position of the electronic components.
[0037] In this embodiment, the mobile module 2 is configured using the second solution. In other embodiments, the mobile module 2 is configured using the first solution.
[0038] The dispensing module 3 includes a dispensing cylinder and a dispensing machine. The dispensing machine is installed on the piston rod of the dispensing cylinder. The dispensing machine is selected to match the electronic components. For example, if the electronic components produced have two dispensing points, a dispensing machine with two dispensing outlets is selected. The dispensing position is located below the dispensing module 3. When the electronic components are located at the dispensing position, the dispensing outlet of the dispensing machine faces the dispensing point of the electronic components. When the electronic components are located at the dispensing position, the dispensing cylinder controls the dispensing machine to descend, and the dispensing machine dispenses glue. Then the dispensing cylinder causes the dispensing machine to rise and reset to complete the dispensing.
[0039] Below the detection module 4 is the detection position, and the detection module 4 includes a ring light source 401 and an image collector 402. Figure 4 As shown, the annular light source 401 is located above the detection position, and the image collector 402 is located above the annular light source 401. The image collector 402 is used to collect images of electronic components on the detection position, and the annular light source 401 is used to supplement the light source when the image collector 402 collects images. The annular light source 401 adopts a two-color light source. In this embodiment, the two-color light sources are blue and yellow, respectively, and the blue light source is located below the yellow light source. The setting of the two-color light source is to provide a light source, increase the brightness, and facilitate the capture of a clear glue image; second, in this solution, the glue is added with a fluorescent component, and the fluorescent reaction is triggered by the annular light source 401, which further improves the clarity of the glue image, so as to improve the accuracy of image detection. The detection module 4 also includes a vertical mounting rod 403, and the annular light source 401 and the image collector 402 are both installed on the vertical mounting rod 403. Since the middle part of the annular light source 401 is hollowed out, when the electronic components are located at the detection position, the middle part is directly facing the hollowing out, and the image collector 402 located above collects the image of the electronic components through the hollowing out of the middle part.
[0040] The detection module 4 also includes a processor for image analysis, which is used to analyze the glue dispensing conditions of the electronic components according to the image acquisition results and generate detection results. The glue dispensing conditions include the glue shape and glue area on the electronic components. The image analysis is used to determine whether the glue dispensing is qualified. Therefore, the detection results include qualified glue dispensing and unqualified glue dispensing. For products with unqualified glue dispensing, they can be removed by setting up a mechanical claw or manually. Electronic components with qualified glue dispensing enter the next capping process.
[0041] The cover snapping module includes a cover snapping guide and a suction piece. The cover snapping guide adopts a linear guide, a slider is installed on the linear guide, a suction cylinder is installed on the slider, the suction piece is installed on the piston rod of the suction cylinder, and the suction piece adopts an existing vacuum suction nozzle. The suction piece is used to adsorb the upper cover on the waiting position, and move the upper cover to the cover snapping position, and snap the upper cover onto the electronic components located at the cover snapping position. Before the electronic components reach the cover snapping position, the suction piece adsorbs the electronic components located at the waiting position and moves them above the cover snapping position. When the electronic components reach the cover snapping position, the suction cylinder controls the suction piece to descend and offset against the electronic components. Since the upper covers of the electronic components are mostly snap-fitting settings, the suction piece descends and applies a certain force to the electronic components to achieve the snapping of the electronic components.
[0042] The unloading module 5 includes an unloading fixture 501, an unloading driving member 504, an unloading tray 502 and an unloading tray guide rail 503, as shown in the attached Figure 5 As shown, the unloading fixture 501 has the same structure as the first moving fixture 201, so it is not repeated here. The unloading fixture 501 is used to move the electronic components at the unloading position to the unloading tray 502. The unloading tray 502 is used to place electronic components. Specifically, the unloading tray 502 is provided with a plurality of material slots for the electronic components to move, and one end of the material slot has a placement position. The unloading fixture 501 is used to move the electronic components at the unloading position to the placement position.
[0043] The unloading drive 504 can abut against the electronic components and push the electronic components to move on the unloading tray 502. Specifically: the unloading drive 504 includes an unloading cylinder, a fixed seat and a push rod 505 that can move along the length direction of the material slot. The fixed seat is connected to the piston rod of the unloading cylinder. The unloading rod is installed on the fixed seat, and the push rod 505 faces the unloading tray 502, and the push rod 505 is directly opposite the material slot. One end of the push rod 505 can abut against the electronic components in the material slot, and one end of the push rod 505 can overlap with the placement position. The length of the push rod 505 overlapping with the placement position is greater than the length of the electronic components. In the initial state, one end of the push rod 505 partially overlaps with the placement position. At this time, along the moving direction of the push rod 505, the overlapping length of the push rod 505 and the placement position is the smallest. One end of the push rod 505 can abut against the electronic components in the material slot. Under the force of the push rod 505, the electronic components move along the length direction of the material slot on the material slot, that is, the electronic components move along the length direction of the push rod 505. When one end of the push rod 505 completely overlaps with the placement position, at this time, along the moving direction of the push rod 505, the overlap length of the push rod 505 and the placement position is the largest, and the overlap length of the push rod 505 and the placement position is greater than the length of the electronic components. With this arrangement, a reserved space is provided at the placement position for placing electronic components, increasing the tolerance for placing electronic components and reducing the precision requirements for placing electronic components on the blanking fixture 501.
[0044] The unloading tray guide rail 503 is located below the unloading tray 502 and is slidably connected to the unloading tray 502. When the electronic components on a material slot are full, the unloading tray 502 moves so that the next material slot faces the push rod 505, and the electronic components are automatically unloaded again.
[0045] The specific implementation process is as follows: When in use, the electronic components are located in the loading tray 101. At this time, the electronic components lack the upper cover. The loading drive 102 pushes the electronic components to move so that the electronic components are located at the loading position. Taking the clamp as an example, the mobile module 2 clamps and moves the electronic components so that the electronic components are located at the dispensing position. At this time, the dispensing module 3 dispenses glue on the electronic components. After dispensing, the mobile module 2 clamps and moves the electronic components again so that the electronic components are located at the detection position. At this time, the detection module 4 collects the image of the dispensing side of the electronic components and identifies and analyzes based on the image. After collecting the image, the mobile module 2 clamps and moves the electronic components again so that the electronic components are located at the buckle cover position. Prior to this, the rotating loading tray has sorted the upper cover and transported it to the waiting position. The adsorption component adsorbs and moves the upper cover on the waiting position, moves the upper cover to the buckle cover position, and buckles the upper cover on the electronic components located at the buckle cover position to complete the packaging of the electronic components. After the cover is buckled, the moving module 2 moves the electronic components so that the electronic components are located at the unloading position. At this time, the unloading fixture 501 clamps and moves the electronic components so that the electronic components are located at the specified position (i.e., the placement position) on the unloading tray 502, and the unloading drive 504 pushes the electronic components to move on the material slot.
[0046] By adopting this solution, the dispensing process and the capping process of electronic components are integrated, which can realize the automatic loading, dispensing, capping and unloading of electronic components, and realize the automated production of electronic components. At the same time, during the production process, the dispensing quality is image recognized, which improves the production efficiency and the qualified rate of the products.
[0047] The above is only an embodiment of the present invention. The common sense such as the known specific structure and characteristics in the scheme is not described in detail here. The ordinary technicians in the relevant field know all the common technical knowledge in the technical field of the invention before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply the conventional experimental means before that date. The ordinary technicians in the relevant field can improve and implement this scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for ordinary technicians in the relevant field to implement this application. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention, several deformations and improvements can be made, which should also be regarded as the protection scope of the present invention, which will not affect the effect of the implementation of the present invention and the practicality of the patent. The protection scope required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.
Claims
1. A dispensing production line for the production and processing of electronic components, characterized in that: include: The loading module is used to transport electronic components to the loading position and the upper cover to the waiting position. A moving module is used to move the electronic components from the loading position to the dispensing position, and is also used to move the electronic components after dispensing to the detection position, and is also used to move the electronic components after image acquisition to the capping position, and is also used to move the electronic components after capping to the unloading position; Glue dispensing module, used for dispensing glue to the electronic components on the glue dispensing position; The detection module is used to collect images of electronic components at the detection position, analyze the dispensing conditions of the electronic components according to the image collection results, and generate detection results; A cover-locking module is used to move the upper cover at the waiting position to the cover-locking position, and to lock the upper cover onto the electronic components at the cover-locking position; The unloading module is used to unload the electronic components on the unloading position.
2. The dispensing production line for electronic component production and processing according to claim 1 is characterized in that: The loading module includes a loading tray and a loading drive. The loading tray is used to place the electronic components to be dispensed. The loading drive can be against the electronic components and push the electronic components to move on the loading tray.
3. The dispensing production line for the production and processing of electronic components according to claim 2 is characterized in that: The mobile module includes a first mobile fixture, a second mobile fixture, a third mobile fixture, which are arranged in sequence, and a transfer tooling located below the dispensing module and the detection module; The first mobile fixture is used to move the electronic components from the loading position to the transfer fixture. The second movable fixture and the third movable fixture are used to change the position of the electronic components on the transfer fixture. The transfer tooling can move along the distribution direction of the first mobile fixture, the second mobile fixture, and the third mobile fixture. The transfer tooling is used to fix electronic components and move the electronic components to the dispensing position. It is also used to cooperate with the second mobile fixture and the third mobile fixture to move the electronic components to the detection position, the capping position, and the unloading position, respectively.
4. The dispensing production line for electronic component production and processing according to claim 2 is characterized in that: The moving module includes a first moving fixture and a conveying member located below the dispensing module and the detection module; The first moving fixture is used to move the electronic components from the loading position to the conveyor; The conveyor is used to move the electronic components to the dispensing position, the inspection position, the capping position and the unloading position in sequence.
5. The dispensing production line for electronic component production and processing according to claim 4 or 5, characterized in that: The detection module includes an annular light source and an image collector. The annular light source is located above the detection position. The image collector is located above the annular light source. The image collector is used to capture images of electronic components on the detection position. The annular light source is used to supplement the light source when the image collector is capturing images.
6. The dispensing production line for electronic component production and processing according to claim 5 is characterized in that: The loading module also includes a rotating loading tray, which is used to sort the upper covers and transport them to the waiting position; The cover snapping module comprises an adsorbing member, which is used to adsorb the upper cover on the waiting position, move the upper cover to the cover snapping position, and snap the upper cover onto the electronic components located at the cover snapping position.
7. The dispensing production line for electronic component production and processing according to claim 6 is characterized in that: The unloading module includes an unloading fixture, an unloading drive and an unloading tray. The unloading fixture is used to move the electronic components at the unloading position to the unloading tray. The unloading tray is used to place the electronic components. The unloading drive can be against the electronic components and push the electronic components to move on the unloading tray.
8. The dispensing production line for electronic component production and processing according to claim 7, characterized in that: The unloading tray is provided with a plurality of material slots for electronic components to move, and the unloading driving member includes a push rod that can move along the length direction of the material slot, and one end of the push rod can be against the electronic components in the material slot; One end of the material trough has a placement position, and the unloading fixture is used to move the electronic components at the unloading position to the placement position. One end of the push rod can overlap with the placement position, and the overlapping length of the push rod and the placement position is greater than the length of the electronic components.
9. The dispensing production line for electronic component production and processing according to claim 3 is characterized in that: The second movable clamp and the third movable clamp each include a trigger and a clamp, The trigger is used to contact the transfer tooling; The transfer fixture is also used to release the electronic components when the trigger contacts the transfer fixture; The gripper is used to grip and move electronic components after the transfer tooling releases the electronic components.