A self-correcting semiconductor wafer aligning machine and its control method

Abstract

The present invention relates to the field of equipment for processing semiconductors specifically, and is a self-correcting semiconductor wafer aligning machine and its control method. Structurally, it includes a machine body, a loading component and a cloth-feeding component provided on the machine body. The number of wafers transferred by the cloth-feeding component at one time is more than one. The loading component includes a feeding area, a discharging area, a wafer-splitting area and a wafer-aligning area, and is also respectively provided with a pusher component, a wafer-splitting component and a wafer-aligning component. In the wafer-splitting area of the present invention, the wafer-splitting component is used to unfold a number of closely arranged semiconductor wafers, and in the wafer-aligning area, the wafer-aligning component is used to receive and place a number of unfolded semiconductor wafers arranged regularly, so as to provide sufficient incoming material supplement for the cloth-feeding component mechanism, provide a number of semiconductor wafers for the cloth-feeding component mechanism before each cloth-feeding operation, and enable the cloth-feeding component mechanism to simultaneously pick up a number of semiconductor wafers, so that on the basis of filling the same or more semiconductor wafers per unit time, the running intensity of the cloth-feeding component mechanism can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of equipment for processing special semiconductors, and specifically to a self-correcting semiconductor wafer taping machine and its control method. Background Art

[0002] In semiconductor processing, it is necessary to perform taping and filling operations on semiconductors, filling semiconductor wafers into a carrier tape. Inside the carrier tape, there are slots provided for the semiconductor wafers to automatically correct their positions. At the same time, the subsequent film laminating operation will also play a role in correcting the positions of the semiconductor wafers. After film lamination, a carrier tape with semiconductor wafers is formed, so that in the production of electronic component circuits, the carrier tape can directly supply semiconductor wafers to the circuits.

[0003] The traditional taping and taping machine is a way to immediately cooperate the conveying operation and the transfer operation with the filling requirement, that is, to sequentially perform the operations of single feeding, single picking and transferring, and single alignment and placement. The speed of the process and the filling amount per unit time are achieved by compressing the time of the above three operations. This makes the picking and transferring mechanism in the process often in a state of high-speed operation and is more likely to be damaged during long-term use. Summary of the Invention

[0004] In view of the above problems, the present invention provides a self-correcting semiconductor wafer taping machine and its control method. The structure of the self-correcting semiconductor wafer taping machine includes a body installed at the rear stage of the semiconductor wafer feeding device. The front and rear of the body are respectively provided with an upper pulley and a take-up reel. The upper pulley is equipped with a roll of carrier tape, and the carrier tape is wound around the middle of the body and taken up on the take-up reel. The body is provided with a loading component for receiving semiconductor wafers provided by the semiconductor wafer feeding device, and the body is also provided with a cloth feeding component for transferring the semiconductor wafers on the loading component to the carrier tape; the number of semiconductor wafers transferred from the loading component by the cloth feeding component at one time is greater than one, and the semiconductor wafers have downward pins on both sides; the loading component includes a base, and an inlet area, a discharging area, a material separating area and a material positioning area are respectively provided on the base. A pushing component is provided in the discharging area for sending a plurality of semiconductor wafers to the material separating area. A material separating component is provided in the material separating area for driving a plurality of semiconductor wafers to unfold and be arranged at intervals. A material positioning component is provided in the material positioning area for receiving the semiconductor wafers arranged at intervals; the cloth feeding component includes a transposition mechanism and a suction cup arm driven by the transposition mechanism to reciprocate between the carrier tape and the loading mechanism. A connecting seat is installed at the end of the transposition mechanism, and a transposition arm is installed on the connecting seat. A plurality of suction cup arms are provided and arranged at intervals on the transposition arm for adsorbing the semiconductor wafers on the material positioning area; the inlet area and the discharging area are in an inclined state, the material separating area and the material positioning area are horizontally arranged starting from the discharging area, and the pins of the semiconductor wafers arranged at intervals on the material positioning area are located in the arrangement direction of the semiconductor wafers.

[0005] Further, the pusher assembly includes a push plate and a pusher actuator for driving the push plate to move. The pusher actuator is installed on the base. The push plate is arranged downward along the edge of the feeding area to form the side wall structure of the discharging area, and moves towards the material separating area under the drive of the pusher actuator. An isolation area assembly is further provided between the feeding area and the discharging area for isolating the semiconductor wafers in the feeding area from the discharging area during the process of the pusher assembly driving the semiconductor wafers in the discharging area to move towards the material separating area.

[0006] Further, the material separating assembly includes a plurality of transfer blocks. A placement surface is provided on the transfer block for placing the semiconductor wafers sent from the discharging area. The material separating assembly further includes a moving frame and a transverse rail beam. The transfer blocks are slidably installed on the transverse rail beam. The states of the transfer blocks on the transverse rail beam include a tightened state and an unfolded state. A first material separating actuator is provided on the moving frame for driving the transfer blocks to switch between the tightened state and the unfolded state. The transfer blocks in the tightened state are close to the discharging area for receiving semiconductor wafers, and the unfolded state drives a plurality of semiconductor wafers to be unfolded and arranged at regular intervals. An installation frame is installed at the bottom end of the base. The moving frame is slidably installed on the installation frame. A second material separating actuator is provided on the installation frame for driving the moving frame to move towards the material positioning area.

[0007] Further, a protruding spacer convex part is provided on one side of a single transfer block close to the next transfer block. The transfer blocks in the tightened state are abutted against the next transfer block through the spacer convex part. A gap is formed above the spacer convex part between the transfer blocks. The gap is the interval space between two adjacent transfer blocks. The distance of the gap is greater than the sum of the thicknesses of two pins and less than the distance between two suction cup arms.

[0008] Further, a connecting member is provided between the transfer blocks. The first material separating actuator is connected to one end transfer block. The first material separating actuator drives the transfer block at one end to move, and the transfer blocks are driven to move through the connecting member between the transfer blocks. The connecting member keeps the same distance between the unfolded transfer blocks. The connecting member includes a connecting cable or a connecting pin.

[0009] Further, the material positioning assembly includes a connecting plate and a plurality of bearing seats. The connecting plate is provided with reference grooves arranged at intervals. The bearing seats are installed in the reference grooves. The connecting plate is slidably installed on the mounting frame. The states of the bearing seats in the mounting frame include a low position state where the distance from the bottom of the mounting frame is closer than that of the adjacent transfer blocks, and a high position state where the distance from the bottom of the mounting frame is farther than that of the adjacent transfer blocks. The transfer blocks in the unfolded state are inserted into the bearing seats arranged at intervals, and the semiconductor wafers are received and transferred onto the bearing seats by the bearing seats rising from the low position state to the high position state. A material positioning actuator is arranged in the mounting frame and connected to the connecting plate, and is used to drive the bearing seats to switch between the low position state and the high position state. The distance between the reference grooves is equal to the distance between the suction cup arms.

[0010] Further, two adjacent bearing seats are used to carry a semiconductor wafer. A recess is provided near the edge of the top of the bearing seat for the pins of the semiconductor wafer to be embedded. One side of the top of the bearing seat close to the semiconductor wafer is a cutting edge or a thin edge. The top of the cutting edge is sharp and the thickness of the thin edge is less than the thickness of the pins.

[0011] Further, the transposition arm is rotatably connected to the connecting seat. A rotation actuator is arranged on the connecting seat and is used to drive the transposition arm to rotate. During the process of the transposition mechanism driving the connecting seat to move towards the feeding assembly, the transposition arm is driven by the rotation actuator to rotate so that the length direction of the transposition arm is parallel to the arrangement direction of the semiconductor wafers.

[0012] Further, the partition component includes a vertical frame, a swing arm and a separating plate. The vertical frame is installed at the end of the feeding area. The swing arm and the separating plate are swingably installed on the vertical frame. An elastic member is arranged between the swing arm and the vertical frame to provide an upward swing elastic force for the swing arm. The separating plate extends downward and is located above the semiconductor wafers at the end of the feeding area. A pressing frame is arranged on the pushing plate. The pressing frame is provided with an inclined pressing section and a horizontal stabilizing section. The inclined pressing section is used to abut against the swing arm and drive the swing arm to swing downward during the process of the pushing plate moving towards the material separating area, and the separating plate swings accordingly and pushes the semiconductor wafers in the feeding area upward.

[0013] A control method for a self-correcting semiconductor wafer aligning machine includes the following steps:

[0014] In the first step, the feeding area supplies semiconductor wafers to the discharging area, and the pushing component in the discharging area pushes the semiconductor wafers onto the material separating component in the material separating area.

[0015] In the second step, the semiconductor wafers are correspondingly placed on the material separating component. The material separating component moves towards the material positioning area, so that the semiconductor wafers on the material separating component are unfolded into a regularly fixed interval arrangement before reaching the material positioning area.

[0016] In the third step, the semiconductor wafers on the material distribution component are unfolded and arranged at regular fixed intervals before reaching the fixed material area. The unfolded material distribution component is inserted into the regularly arranged fixed material components. The fixed material components rise to lift the semiconductor wafers on the material distribution component, receive and transfer the semiconductor wafers to the fixed material components, and then the material distribution component returns to its original position.

[0017] In the fourth step, the transposition mechanism drives the adsorption of the semiconductor wafers on the fixed material components through the suction cup arms. Then, the transposition arm drives a row of suction cup arms, and the suction cup arms drive the semiconductor wafers to come above the carrier tape, place the semiconductor wafers in the carrier tape, and the carrier tape is wound after being coated with film in the direction of the winding wheel.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The present invention provides a number of semiconductor wafers for the cloth feeding component mechanism each time before cloth feeding, and enables the cloth feeding component mechanism to simultaneously pick up a number of semiconductor wafers, so as to slow down the running intensity of the cloth feeding component mechanism on the basis of filling the same or more semiconductor wafers per unit time.

[0020] The present invention is provided with a feeding area, a discharging area, a material distribution area and a fixed material area on the feeding component respectively, and a material distribution component is arranged in the material distribution area to unfold a number of closely arranged semiconductor wafers, and a fixed material component is arranged in the fixed material area to receive and place a number of unfolded semiconductor wafers arranged regularly, so as to provide sufficient incoming material supplement for the cloth feeding component mechanism, enable the cloth feeding component mechanism to pick up a larger number of semiconductor wafers at one time, and slow down the running intensity of the cloth feeding component mechanism. Description of the Drawings

[0021] Figure 1 It is a schematic diagram of the overall structure of a self-correcting semiconductor wafer aligning machine of the present invention.

[0022] Figure 2 It is a three-dimensional structure diagram of the feeding component and the cloth feeding component of the present invention.

[0023] Figure 3 It is a top view structure diagram and area division diagram of the feeding component of the present invention.

[0024] Figure 4 It is a three-dimensional structure diagram of the pusher component and the material distribution component of the present invention and a three-dimensional diagram of a partial partition component.

[0025] Figure 5 It is a state conversion diagram of the partition component of the present invention.

[0026] Figure 6 It is a three-dimensional structure diagram of the material distribution component and the fixed material component of the present invention.

[0027] Figure 7A three-dimensional structure diagram of two embodiments of the connecting member on the transfer block of the present invention.

[0028] Figure 8 A state conversion diagram of the material fixing component of the present invention for receiving a semiconductor wafer from the material distributing component.

[0029] Figure 9 A three-dimensional structure diagram of two embodiments of the carrier seat of the present invention and partial diagrams of the two embodiments.

[0030] Figure 10 A state conversion diagram of the fabric component of the present invention for picking and placing materials from the feeding component.

[0031] In the figure: A, semiconductor wafer; 1, body; 2, upper pulley; 3, winding wheel; 4, carrier tape; 5, feeding component; 6, fabric component;

[0032] 5a, feeding area; 5b, discharging area; 5c, material distributing area; 5d, material fixing area; 51, base; 52, partition; 53, pushing component; 54, material distributing component; 55, material fixing component; 56, mounting frame; 57, partition component; 61, transposition mechanism; 62, connecting seat; 63, suction cup arm; 64, transposition arm; 65, rotation actuator;

[0033] 531, pushing plate; 532, pushing actuator; 533, guiding column; 534, guiding seat; 535, pressing frame; 541, transfer block; 542, moving frame; 543, cross rail beam; 544, first material distributing actuator; 545, second material distributing actuator; 551, carrier seat; 552, connecting plate; 553, material fixing actuator; 571, vertical frame; 572, swing arm; 573, separating plate; 574, elastic member;

[0034] 535a, inclined pressing section; 535b, stable position section; 541a, placing surface; 541b, gap; 541c, separating convex part; 541d, connecting cable; 541e, connecting pin; 551a, cutting edge; 551b, thin edge; 552a, reference groove. Detailed implementation manners

[0035] Next, the technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0036] Embodiment, as Figures 1 - 10As shown: The present invention provides a self-correcting semiconductor wafer aligning machine and its control method. The structure of the self-correcting semiconductor wafer A aligning machine includes a body 1 installed at the rear stage of the semiconductor wafer A feeding device. A upper pulley 2 and a winding wheel 3 are respectively arranged at the front and rear of the body 1. The upper pulley 2 is equipped with a coiled carrier tape 4, and the carrier tape 4 is wound around the middle of the body 1 and then wound onto the winding wheel 3. The middle part of the body 1 is the working loading area. After the working loading area and before the winding wheel 3, there is also a film covering mechanism. As is well known, the film covering mechanism is used to cover the carrier tape 4 to retain the semiconductor wafer A in the carrier tape 4. In the area in the middle of the body 1, there is a loading component 5 for receiving the semiconductor wafer A provided by the semiconductor wafer A feeding device. The semiconductor wafer A feeding device can be a vibrating feeding table and its horizontal height is slightly higher than that of the loading component 5. And it can be known that the semiconductor wafer A provided by the feeding device to the loading component 5 has a certain initial velocity. The body 1 is also provided with a distributing component 6 for transferring the semiconductor wafer A on the loading component 5 to the carrier tape 4;

[0037] Among them, the number of semiconductor wafers A transferred by the distributing component 6 from the loading component 5 at one time is more than one. In this embodiment, the number is twelve. Those skilled in the art can set the number according to actual needs, as long as the amount of semiconductor wafer A transferred per unit time at one time is greater than that of the prior art. In this embodiment, the semiconductor wafers A targeted by the dedicated semiconductor processing equipment have downward pins on both sides. Therefore, settings are made for both the loading component 5 and the distributing component 6;

[0038] For the loading component 5, the loading component 5 includes a base 51, and an inlet area 5a, a discharging area 5b, a separating area 5c and a positioning area 5d are respectively arranged on the base 51. A pushing component 53 is arranged in the discharging area 5b for sending several semiconductor wafers A to the separating area 5c. The separating area 5c is provided with a separating component 54 for driving several semiconductor wafers A to unfold and be arranged at intervals. The positioning area 5d is provided with a positioning component 55 for receiving the semiconductor wafers A arranged at intervals. It should be noted that the inlet area 5a and the discharging area 5b are in an inclined state, the separating area 5c and the positioning area 5d are arranged horizontally starting from the discharging area 5b, and the pins of the semiconductor wafers A arranged at intervals on the positioning area 5d are located in the arrangement direction of the semiconductor wafers A;

[0039] Inlet area 5a part: Several partition plates 52 are arranged on the base 51. The gaps between the partition plates 52 on the base 51 form the channel structure of the inlet area 5a. The length of the inlet area 5a is not greater than twice the length of the discharging area 5b.

[0040] Discharging area 5b part: The pusher assembly 53 includes a push plate 531 and a pusher actuator 532 that drives the push plate 531 to move. The pusher actuator 532 is installed on the base 51. The push plate 531 is arranged downward along the edge on one side of the feeding area 5a to form the side wall structure of the discharging area 5b, and moves in the direction of the material distribution area 5c under the drive of the pusher actuator 532. There are also two guide posts 533 parallel to the moving direction of the push plate 531 at the rear end of the push plate 531, and a guide seat 534 is provided on the base 51 to slidably cooperate with the guide posts 533. When the push plate 531 has a longer length, the movement can be more stable.

[0041] It should be noted that a partition assembly 57 is also provided between the feeding area 5a and the discharging area 5b, which is used to separate the semiconductor wafers A in the feeding area 5a from the discharging area 5b during the process of the pusher assembly 53 driving the semiconductor wafers A in the discharging area 5b to move towards the material distribution area 5c. For this purpose, the partition assembly 57 includes a vertical frame 571, a swing arm 572 and a partition plate 573. The vertical frame 571 is installed at the end of the feeding area 5a. The swing arm 572 and the partition plate 573 are swingably installed on the vertical frame 571. An elastic member 574 is provided between the swing arm 572 and the vertical frame 571 to provide an upward swinging elastic force for the swing arm 572. The partition plate 573 extends downward and is located above the semiconductor wafers A at the end of the feeding area 5a. At the same time, a pressing frame 535 is provided on the push plate 531. The pressing frame 535 is provided with an inclined pressing section 535a and a horizontal stabilizing section 535b. The inclined pressing section 535a is used to abut against the swing arm 572 and drive the swing arm 572 to swing downward during the movement of the push plate 531 towards the material distribution area 5c. The partition plate 573 swings accordingly and pushes the semiconductor wafers A in the feeding area 5a upward. A cotton pad is also provided on the side of the partition plate 573 close to the semiconductor wafers A, which is used to squeeze the nearest semiconductor wafer A towards the base 51 during the pushing process to reduce the situation of its warping.

[0042] Material distribution area 5c part: The material distribution assembly 54 includes a number of transfer blocks 541. The transfer blocks 541 are provided with a placement surface 541a for placing the semiconductor wafers A sent from the discharging area 5b. In this embodiment, the placement surface 541a adopts a soft particle surface structure, such as a rubber particle surface, to appropriately increase the stability of the semiconductor wafers A; the material distribution assembly 54 here needs to perform two functions, namely moving towards the material fixing area 5d and expanding the transfer blocks 541;

[0043] In performing the function of moving towards the material fixing area 5d, the material distribution assembly 54 further includes a moving frame 542 and a cross rail beam 543. The cross rail beam 543 is installed on the moving frame 542. The transfer blocks 541 are slidably installed on the cross rail beam 543. An installation frame 56 is installed at the bottom end of the base 51. The moving frame 542 is slidably installed on the installation frame 56 through a slide rail. A second material distribution actuator 545 is provided on the installation frame 56 to drive the moving frame 542 to move towards the material fixing area 5d;

[0044] In the execution of the function of expanding the transfer block 541, the states of the transfer block 541 on the horizontal rail beam 543 include a tightened state and an expanded state. A first material distributing actuator 544 is provided on the moving frame 542 to drive the transfer block 541 to switch between the tightened state and the expanded state. The transfer block 541 in the tightened state is close to the discharging area 5b for receiving the semiconductor wafer A. For this purpose, a protruding partition convex part 541c is provided on one side of a single transfer block 541 close to the next transfer block 541. The transfer block 541 in the tightened state abuts against the next transfer block 541 through the partition convex part 541c. A partition gap 541b is formed above the partition convex part 541c between the transfer blocks 541. The partition gap 541b is the interval space between two adjacent transfer blocks 541. The distance of the partition gap 541b is greater than the sum of the thicknesses of two pins and less than the distance between two suction cup arms 63. Thus, when receiving the semiconductor wafer A in the discharging area 5b, the main body of the semiconductor wafer A can enter the placing surface 541a, and the pins can enter the partition gap 541b.

[0045] The transfer block 541 in the expanded state drives a plurality of semiconductor wafers A to be expanded and arranged at regular intervals. For this purpose, a connecting member is provided between the transfer blocks 541. The first material distributing actuator 544 is connected to one end transfer block 541. The connecting member keeps the same distance between the expanded transfer blocks 541. The connecting member can adopt a connecting cable 541d or a connecting pin 541e. Both ends of the connecting cable 541d are installed on the transfer block 541 through bolts. After a hole is dug in the middle of the transfer block 541 and a lateral slot is opened, the connecting pin 541e can be installed. Subsequently, when the first material distributing actuator 544 drives the transfer block 541 at one end to move, the remaining transfer blocks 541 are driven to move through the connecting member, so as to be expanded and arranged at a regular fixed interval.

[0046] Fixed material area 5d part: The fixed material assembly 55 includes a connecting plate 552 and a plurality of bearing seats 551. The connecting plate 552 is provided with regularly arranged reference slots 552a. The bearing seats 551 are installed in the reference slots 552a. It should be noted that the distance between the reference slots 552a is equal to the distance between the suction cup arms 63 or equal to the distance between the slots of each semiconductor wafer A on the carrier tape 4. The reference slots 552a are used to position the front and rear semiconductor wafers A, be compatible with the next-level suction cup arms 63 and the carrier tape 4, and enable the upper-level pushing assembly 53 and the material distributing assembly 54 to be adaptively assembled for this purpose.

[0047] The connecting plate 552 is slidably installed on the mounting frame 56. A material positioning actuator 553 is provided inside the mounting frame 56 and connected to the connecting plate 552. Taking the bottom of the mounting frame 56 as a reference, the state of the carrier seat 551 inside the mounting frame 56 includes a low position state where the distance from the bottom of the mounting frame 56 is closer than that of the adjacent transfer block 541, and a high position state where the distance from the bottom of the mounting frame 56 is farther than that of the adjacent transfer block 541. Specifically, since the transfer block 541 has no lifting function, after the transfer block 541 moves to the position of the carrier seat 551, the initial position of the carrier seat 551, that is, the low position state, is lower than the transfer block 541. Subsequently, the unfolded transfer block 541 is inserted into the carrier seats 551 arranged at intervals, and the semiconductor wafer A is received and transferred onto the carrier seat 551 by the carrier seat 551 rising from the low position state to the high position state. The material positioning actuator 553 is used to drive the carrier seat 551 to switch between the low position state and the high position state;

[0048] Two adjacent carrier seats 551 are used to carry a semiconductor wafer A. A recess is provided near the edge at the top of the carrier seat 551 for the pins of the semiconductor wafer A to be embedded. For this reason, one side of the top of the carrier seat 551 close to the semiconductor wafer A is a cutting edge 551a or a thin edge 551b. The top of the cutting edge 551a is sharp, and the thickness of the thin edge 551b is less than the thickness of the pins. More specifically, the surface of the cutting edge 551a close to the recess is inclined, and the thin edge 551b is slightly inclined outwards, so as to be more suitable for the pins of the semiconductor wafer A to be embedded.

[0049] For the cloth feeding assembly 6, the cloth feeding assembly 6 includes a commutation mechanism 61 and a suction cup arm 63 driven by the commutation mechanism 61 to reciprocate between the carrier tape 4 and the feeding mechanism. The commutation mechanism 61 is a reciprocating structure known to those skilled in the art. Specifically, it includes a turntable, a slider that can rotate independently outside the turntable, and a connecting rod that is slidably matched with the slider and eccentrically hinged to the turntable. When the turntable rotates, it will drive the connecting rod to first contract towards the slider side. After crossing the line connecting the center of the turntable and the center of the slider, the rotation of the turntable will drive the connecting rod to be withdrawn from the slider. Only by setting the working positions at these two positions where the contraction starts and the extraction ends can the purpose of taking and placing materials be achieved. A connecting seat 62 is installed at the end of the commutation mechanism 61, and a commutation arm 64 is installed on the connecting seat 62. A plurality of suction cup arms 63 are provided and arranged at intervals on the commutation arm 64 for adsorbing the semiconductor wafer A on the material positioning area 5d. The commutation arm 64 is rotatably connected to the connecting seat 62, and a rotation actuator 65 is provided on the connecting seat 62 for driving the commutation arm 64 to rotate.

[0050] It should be noted that in this embodiment, the rotation actuator 65 uses a motor, while the pushing actuator 532, the first material distribution actuator 544, the second material distribution actuator 545, the material positioning actuator 553, etc. use cylinders.

[0051] In specific implementation, it is divided into two parts: backup feeding and filling, and final filling. The backup feeding and filling provides a certain number of semiconductor wafers A for the final filling to directly use, and the control method includes the following;

[0052] First step, the feeding area 5a supplies the semiconductor wafers A to the discharging area 5b. The semiconductor wafers A in the feeding area 5a slide down and accumulate in the discharging area 5b to the required quantity, that is, twelve. The length of the push plate 531 provided in the pusher assembly 53 in the discharging area 5b is slightly greater than the sum of the widths of the required semiconductor wafers A. In the discharging area 5b, the push plate 531 is driven by the pusher actuator 532 to push out, and twelve semiconductor wafers A are pushed onto the dividing component 54 in the dividing area 5c;

[0053] Second step, twelve semiconductor wafers A are respectively placed on twelve transfer blocks 541. The main body of the semiconductor wafer A enters the placement surface 541a, and the pins enter the gap 541b. Subsequently, the push plate 531 retracts, and the feeding area 5a continues to supply the semiconductor wafers A to the discharging area 5b. Then the second dividing actuator 545 starts to drive the moving frame 542 to move from the discharging area 5b to the positioning area 5d. During the movement, the first dividing actuator 544 drives the transfer block 541 at one end to move, and the remaining transfer blocks 541 are driven to move through the connecting piece, so that the transfer blocks 541 are arranged in a regular fixed interval before reaching the positioning area 5d;

[0054] Third step, the transfer blocks 541 are arranged in a regular fixed interval before reaching the positioning area 5d, and the second dividing actuator 545 continues to drive. The unfolded transfer blocks 541 are inserted into the spaced-apart carrier seats 551. The positioning actuator 553 drives the carrier seats 551 to move from the low position to the high position, that is, to lift up the semiconductor wafers A on the transfer blocks 541, and receive and transfer the semiconductor wafers A to the carrier seats 551. Two adjacent carrier seats 551 are used to carry one semiconductor wafer A. The pins of the semiconductor wafer A enter the grooves of the carrier seats 551 along the cutting edge 551a or the thin edge 551b and are properly stabilized on the carrier seats 551. Subsequently, the dividing component 54 returns to its original position;

[0055] In the fourth step, the transposition mechanism 61 drives the connecting seat 62 to move towards the feeding component 5. During this process, the transposition arm 64 is driven by the rotation actuator 65 to rotate, so that the length direction of the transposition arm 64 is parallel to the arrangement direction of the semiconductor wafers A, and approaches the carrier seat 551. The semiconductor wafers A are adsorbed by the suction cup arm 63. Subsequently, the transposition mechanism 61 moves in the reverse direction and the rotation actuator 65 rotates in the reverse direction, so that the transposition arm 64 drives a row of suction cup arms 63, and the suction cup arms 63 drive the semiconductor wafers A to come above the carrier tape 4, and place the semiconductor wafers A into the carrier tape 4. The carrier tape 4 is wound towards the winding wheel 3 after film covering. Inside the carrier tape 4, the slots provided for supporting the semiconductor wafers A can automatically correct the positions of the falling semiconductor wafers A. At the same time, the subsequent film covering operation will also play a role in correcting the positions of the semiconductor wafers A.

[0056] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

Claims

1. A self-correcting semiconductor wafer arrangement machine, comprising a machine body installed at the rear stage of a semiconductor wafer feeding device, wherein an upper belt wheel and a winding wheel are respectively provided at the front and rear of the machine body, wherein the upper belt wheel is provided with a rolled carrier tape and the carrier tape is wound around the middle of the machine body and wound onto the winding wheel, wherein: The machine body is provided with a loading assembly for receiving semiconductor tablets provided by a semiconductor tablet feeding device, and the machine body is also provided with a distribution assembly for transferring the semiconductor tablets on the loading assembly to the carrier tape; The number of semiconductor chips transferred by the material distribution component from the material loading component at a time is greater than one, and the semiconductor chip has downward pins on both sides; The loading assembly includes a base and is respectively provided with a feeding area, a discharging area, a dividing area and a fixing area. The discharging area is provided with a pushing assembly for sending a plurality of semiconductor tablets to the dividing area. The dividing area is provided with a dividing assembly for driving a plurality of semiconductor tablets to be spread out and arranged at intervals. The fixing area is provided with a fixing assembly for receiving the semiconductor tablets arranged at intervals. The material distribution assembly includes a transposition mechanism and a suction cup arm driven by the transposition mechanism to reciprocate between the carrier belt and the feeding mechanism, a connecting seat is installed at the end of the transposition mechanism and a transposition arm is installed on the connecting seat, and a plurality of suction cup arms are arranged at intervals on the transposition arm for adsorbing semiconductor material sheets on the fixed material area; The feeding area and the discharging area are in an inclined state, the dividing area and the metering area are arranged transversely from the discharging area, and the pins of the semiconductor tablets arranged at intervals on the metering area are located in the arrangement direction of the semiconductor tablets.

2. A self-correcting semiconductor wafer arrangement machine according to claim 1, characterized in that: The pusher assembly includes a pusher plate and a pusher actuator for driving the pusher plate to move, the pusher actuator is installed on the base, the pusher plate is arranged downward along the edge of the feeding area to form a side wall structure of the discharge area, and moves toward the distributing area under the drive of the pusher actuator; A partitioning assembly is also provided between the feed area and the discharge area, for separating the semiconductor tablets in the feed area from the discharge area when the pushing assembly drives the semiconductor tablets in the discharge area to move toward the dividing area.

3. A self-correcting semiconductor wafer arrangement machine according to claim 2, characterized in that: The material distribution assembly includes a plurality of transfer blocks, each of which is provided with a placement surface for placing semiconductor chips sent from the discharge area. The material distribution assembly also includes a moving frame and a cross rail beam, and the transfer block is slidably mounted on the cross rail beam; The states of the transfer block on the cross rail beam include a tightened state and an expanded state. The mobile frame is provided with a first material distribution actuator for driving the transfer block to switch between the tightened state and the expanded state. The transfer block in the tightened state is close to the discharge area for receiving semiconductor sheets. The expanded state drives a plurality of semiconductor sheets to be expanded and arranged at regular intervals. A mounting frame is installed at the bottom end of the base, and the movable frame is slidably installed on the mounting frame. A second material distribution actuator is provided on the mounting frame to drive the movable frame to move toward the material setting area.

4. The self-correcting semiconductor wafer arrangement machine according to claim 3, characterized in that: A raised spacing convex portion is provided on one side of a single transfer block close to the next transfer block, and the transfer block in the tightened state abuts against the next transfer block through the spacing convex portion, and a gap is formed between the transfer blocks above the spacing convex portion, and the gap is the spacing space between two adjacent transfer blocks; The spacing of the gap is greater than the sum of the thicknesses of the two pins and less than the spacing between the two suction cup arms.

5. The self-correcting semiconductor wafer arrangement machine according to claim 3, characterized in that: A connecting piece is provided between the transfer blocks, the first material distribution actuator is connected to the transfer block at one end, the first material distribution actuator drives the transfer block at one end to move, and the transfer blocks are driven to move by the connecting piece, and the connecting piece keeps the same distance between the unfolded transfer blocks; The connecting member includes a connecting rope or a connecting pin.

6. The self-correcting semiconductor wafer arrangement machine according to claim 3, characterized in that: The material-fixing assembly includes a connecting plate and a plurality of bearing seats, the connecting plate is provided with reference grooves arranged at intervals, the bearing seats are installed in the reference grooves, the connecting plate is slidably installed on the mounting frame, and the states of the bearing seats in the mounting frame include a low position state in which the distance to the bottom of the mounting frame is closer than the adjacent transfer block, and a high position state in which the distance to the bottom of the mounting frame is farther than the adjacent transfer block; The transfer block in the unfolded state is inserted into the spaced-apart supporting seats, and the semiconductor material sheets are received and transferred to the supporting seats by the supporting seats rising from the low position to the high position; a material-fixing actuator is provided in the mounting frame and connected to the connecting plate, which is used to drive the supporting seats to switch between the low position and the high position; The spacing of the reference grooves is equal to the spacing of the suction cup arms.

7. The self-correcting semiconductor wafer arrangement machine according to claim 6, characterized in that: Two adjacent support seats are used to support a semiconductor tablet, and a recess is provided near the edge of the top of the support seat for the pins of the semiconductor tablet to be embedded; One side of the top of the support seat close to the semiconductor sheet is a cutting edge or a thin edge, the top of the cutting edge is sharp and the thickness of the thin edge is less than the thickness of the pin.

8. A self-correcting semiconductor wafer arrangement machine according to claim 1 or 6, characterized in that: The transposition arm is rotatably connected to the connecting seat, and a rotary actuator is provided on the connecting seat to drive the transposition arm to rotate; When the transposition mechanism drives the connecting seat to move toward the upper material assembly, the transposition arm is driven by the rotary actuator to rotate so that the length direction of the transposition arm is parallel to the arrangement direction of the semiconductor tablets.

9. The self-correcting semiconductor wafer arrangement machine according to claim 2, characterized in that: The partition assembly comprises a stand, a swing arm and a partition plate, the stand is mounted at the end of the feed zone, the swing arm and the partition plate are swingably mounted on the stand, an elastic member is provided between the swing arm and the stand to provide an elastic force for the swing arm to swing upward, and the partition plate extends downward and is located above the semiconductor sheet at the end of the feed zone; The push plate is provided with a pressure frame, which is provided with an inclined oblique pressure section and a horizontal stabilizing section. The inclined oblique pressure section is used to resist the swing arm and drive the swing arm to swing downward when the push plate moves to the material distribution area. The partition plate follows the swing and pushes the semiconductor sheet in the feeding area upward.

10. A control method for a self-correcting semiconductor wafer arrangement machine, characterized in that: The method is carried out by using any one of claims 1 to 9 of the self-correcting semiconductor wafer arrangement machine, comprising the following steps: In the first step, the feeding area supplies semiconductor chips to the discharging area, and the pushing component in the discharging area pushes the semiconductor chips to the distributing component in the distributing area; In the second step, the semiconductor sheets are placed on the material distribution assembly accordingly, and the material distribution assembly moves toward the material setting area, so that the semiconductor sheets on the material distribution assembly are spread out and arranged at regular fixed intervals before reaching the material setting area; In the third step, the semiconductor sheets on the material distribution component are unfolded and arranged at regular fixed intervals before reaching the material fixing area, and the unfolded material distribution component is inserted into the spaced fixing component, and the fixing component rises to lift the semiconductor sheets on the material distribution component, and the semiconductor sheets are received and transferred to the fixing component, and then the material distribution component returns to its original position; In the fourth step, the position change mechanism drives the suction cup arm to adsorb the semiconductor material on the fixed material component, and then the position change arm brings a row of suction cup arms and the suction cup arms bring the semiconductor material to the top of the carrier, places the semiconductor material in the carrier, and the carrier is rolled up towards the winding wheel after coating.

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