Error measurement method, device and equipment for circuit splice board and storage medium

Abstract

The invention discloses an error measurement method, device and equipment for a circuit splice plate and a storage medium. The error measurement method for the circuit splice plate comprises the steps of obtaining a theoretical image and an actual image of the circuit splice plate; the circuit splice board comprises at least two splice sub-boards, the splice sub-board in the theoretical image is a theoretical splice sub-board, and the splice sub-board in the actual image is an actual splice sub-board; according to the theoretical image and the actual image, selecting at least two points located in the theoretical splicing daughter board in the theoretical image as theoretical mark points, and selecting at least two points corresponding to the theoretical mark points in the actual splicing daughter board in the actual image as actual mark points; placing the theoretical image and the actual image in the same measurement coordinate system; and determining error parameters of the circuit splice board according to the position coordinates of each theoretical mark point and each actual mark point in the measurement coordinate system. According to the technical scheme of the invention, the splicing error precision of the circuit splice plate can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to an error measurement method, device, equipment and storage medium for a circuit splicing board. Background Art

[0002] In the field of printed circuit board processing, the circuit board will expand and deform due to the influence of the environment. When a part of the circuit board expands and deforms, it will affect the working state of the entire circuit board. In order to avoid the above problems, the existing technology will divide the original complete circuit board into multiple sub-boards, and after testing each sub-board separately, use a board implanter to splice each sub-board to form a complete circuit board.

[0003] In actual operation, due to the precision errors of the motion control system in the X and Y directions and the calibration errors of the position relationship of each component of the equipment, there is an error between the position of the spliced ​​sub-board and the theoretical position. This error causes problems such as mounting errors when mounting components on the surface of the sub-board according to the theoretical position of each sub-board, affecting the preparation quality of the circuit board. Therefore, how to detect the splicing errors of each sub-board in the circuit board produced by the board implanter and improve the preparation quality of the circuit board has become a technical problem that needs to be solved urgently. Summary of the invention

[0004] The present invention provides a circuit splicing board error measurement method, device, equipment and storage medium, which can improve the accuracy of measuring the splicing error of the circuit splicing board.

[0005] In a first aspect, the present invention provides a method for measuring an error of a circuit splicing board, comprising:

[0006] Acquire a theoretical image and an actual image of the circuit splicing board; the circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is a theoretical splicing sub-board, and the splicing sub-board located in the actual image is an actual splicing sub-board;

[0007] According to the theoretical image and the actual image, at least two points in the theoretical image located in the theoretical splicing sub-plate are selected as theoretical marking points, and at least two points in the actual image located in the actual splicing sub-plate corresponding to the theoretical marking points are selected as actual marking points;

[0008] Placing the theoretical image and the actual image in the same measurement coordinate system;

[0009] According to the position coordinates of each theoretical marking point and each actual marking point in the measurement coordinate system, the error parameters of the circuit splicing board are determined; the error parameters at least include distance error and angle error.

[0010] Optionally, according to the theoretical image and the actual image, selecting at least two points in the theoretical image located in the theoretical splicing sub-plate as theoretical marking points, and selecting at least two points in the actual image located in the actual splicing sub-plate corresponding to the theoretical marking points as actual marking points, comprises:

[0011] According to the theoretical image, at least two points located in the theoretical splicing sub-plate are selected as theoretical marking points;

[0012] According to the position parameters of the theoretical marking point in the area where the theoretical splicing sub-board is located, at least two points in the actual image corresponding to the theoretical marking point and located in the actual splicing sub-board are selected as actual marking points; the position parameters include at least distance parameters and orientation parameters.

[0013] Optionally, according to the position parameter of the theoretical marking point in the area where the theoretical splicing sub-plate is located, selecting at least two points in the actual image and located in the actual splicing sub-plate and corresponding to the theoretical marking point as actual marking points includes:

[0014] Determine the area to be marked of the actual splicing sub-board according to the orientation parameters of the theoretical marking point in the area where the theoretical splicing sub-board is located;

[0015] The actual marking point in the area to be marked is determined according to the distance parameter of the theoretical marking point in the area where the theoretical splicing sub-plate is located.

[0016] Optionally, determining the error parameters of the circuit splicing board according to the position coordinates of each of the theoretical marking points and each of the actual marking points in the measurement coordinate system includes:

[0017] Determine the theoretical center point of the theoretical image and the actual center point of the actual image according to the position coordinates of each theoretical marking point in the measurement coordinate system and the original position coordinates of each actual marking point in the measurement coordinate system; the theoretical center point is the geometric center of the theoretical image; the actual center point is the geometric center of the actual image;

[0018] Determining a first adjustment parameter of the actual image according to the position coordinates of the theoretical center point and the position coordinates of the actual center point; the first adjustment parameter includes an adjustment distance;

[0019] According to the first adjustment parameter, adjusting the position of the actual image in the measurement coordinate system so that the geometric centers of the actual image and the theoretical image overlap and align;

[0020] The error parameters of the circuit splicing board are determined according to the position coordinates of each theoretical marking point in the measurement coordinate system and the first adjusted position coordinates of each actual marking point in the measurement coordinate system.

[0021] Optionally, determining the theoretical center point of the theoretical image and the actual center point of the actual image according to the position coordinates of each theoretical marking point in the measurement coordinate system and the original position coordinates of each actual marking point in the measurement coordinate system includes:

[0022] Determining the theoretical center point of the theoretical image by calculation based on a segmentation method according to the position coordinates of each theoretical marking point in the measurement coordinate system;

[0023] According to the original position coordinates of each actual marking point in the measurement coordinate system, the actual center point of the actual image is determined by calculation based on a segmentation method.

[0024] Optionally, determining the error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point in the measurement coordinate system and the first adjusted position coordinates of each actual marking point in the measurement coordinate system includes:

[0025] Determine the second adjustment parameter of the actual image based on the least squares method according to the position coordinates of each theoretical marking point in the measurement coordinate system and the first adjusted position coordinates of each actual marking point in the measurement coordinate system; the second adjustment parameter at least includes a rotation angle;

[0026] According to the second adjustment parameter, adjusting the position of the actual image in the measurement coordinate system so that the actual image is aligned with the theoretical image;

[0027] The error parameters of the circuit splicing board are determined according to the position coordinates of each theoretical marking point in the measurement coordinate system and the second adjusted position coordinates of each actual marking point in the measurement coordinate system.

[0028] Optionally, determining the error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point in the measurement coordinate system and the second adjusted position coordinates of each actual marking point in the measurement coordinate system includes:

[0029] The actual spliced ​​sub-board to be measured is used as the actual sub-board to be measured, and the theoretical spliced ​​sub-board corresponding to the actual sub-board to be measured is used as the theoretical sub-board to be calibrated;

[0030] Determine the lateral distance error between each of the actual marking points and each of the theoretical marking points according to the lateral position coordinates of each of the theoretical marking points in the theoretical sub-plate to be calibrated in the measurement coordinate system and the second adjusted lateral position coordinates of each of the actual marking points corresponding to each of the theoretical marking points in the measurement coordinate system;

[0031] Determine the longitudinal distance error between each of the actual marking points and each of the theoretical marking points according to the longitudinal position coordinates of each of the theoretical marking points in the theoretical sub-plate to be calibrated in the measurement coordinate system and the second adjusted longitudinal position coordinates of each of the actual marking points corresponding to each of the theoretical marking points in the measurement coordinate system;

[0032] Determining the theoretical angle of the theoretical sub-plate to be calibrated according to the position coordinates of each theoretical marking point in the theoretical sub-plate to be calibrated in the measurement coordinate system;

[0033] Determine the actual angle of the actual sub-board to be measured according to the position coordinates of each of the actual marking points in the actual sub-board to be measured in the measurement coordinate system;

[0034] Determining the angle error according to the theoretical angle and the actual angle;

[0035] The next actual spliced ​​sub-board to be measured is taken as the actual sub-board to be measured, and the theoretical spliced ​​sub-board corresponding to the actual sub-board to be measured is taken as the theoretical sub-board to be calibrated, and the steps of determining the longitudinal distance error between each actual mark and each theoretical mark point according to the transverse position coordinates of each theoretical mark point in the theoretical sub-board to be calibrated in the measurement coordinate system are returned to, until the error parameters of each actual spliced ​​sub-board are measured; the distance error includes a transverse distance error and a longitudinal distance error.

[0036] In a second aspect, the present invention provides an error measurement device for a circuit splicing board, comprising:

[0037] An image acquisition module, used to acquire a theoretical image and an actual image of the circuit splicing board; the circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is a theoretical splicing sub-board, and the splicing sub-board located in the actual image is an actual splicing sub-board;

[0038] A marking point selection module is used to select, according to the theoretical image and the actual image, at least two points in the theoretical image located in the theoretical splicing sub-plate as theoretical marking points, and select at least two points in the actual image located in the actual splicing sub-plate corresponding to the theoretical marking points as actual marking points;

[0039] An image processing and measurement module, used for placing the theoretical image and the actual image in the same measurement coordinate system;

[0040] The error determination module is used to determine the error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point and each actual marking point in the measurement coordinate system; the error parameters include at least distance error and angle error.

[0041] In a third aspect, the present invention provides an electronic device, the electronic device comprising:

[0042] at least one processor; and

[0043] a memory communicatively connected to the at least one processor; wherein,

[0044] The memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the error measurement method of the circuit splicing board described in the first aspect.

[0045] In a fourth aspect, the present invention provides a computer-readable storage medium storing computer instructions, wherein the computer instructions are used to implement the error measurement method for the circuit splicing board described in the first aspect when executed by a processor.

[0046] The technical solution provided by the present invention selects at least two points located in a theoretical splicing sub-board as theoretical marking points in the theoretical image of the circuit splicing board, and selects at least two points located in the actual splicing sub-board corresponding to the theoretical marking points in the actual image of the circuit splicing board as actual marking points, so that when the theoretical image and the actual image are placed in the same measurement coordinate system, the error parameters of each splicing sub-board in the circuit splicing board can be determined according to the position coordinates of the at least two theoretical marking points located in the theoretical splicing sub-board and the at least two actual marking points located in the actual splicing sub-board, thereby improving the accuracy of error measurement, so that when electrical components are subsequently mounted on each splicing sub-board of the circuit splicing board, the mounting accuracy and mounting reliability of the electrical components can be improved according to the error parameters. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 A flow chart of a method for measuring an error of a circuit splicing board provided by an embodiment of the present invention;

[0048] Figure 2 A schematic diagram of a theoretical image of a circuit splicing board provided by an embodiment of the present invention;

[0049] Figure 3 An actual image schematic diagram of a circuit splicing board provided by an embodiment of the present invention;

[0050] Figure 4 A flow chart of another circuit splicing board error measurement method provided by an embodiment of the present invention;

[0051] Figure 5 A flow chart of another circuit splicing board error measurement method provided by an embodiment of the present invention;

[0052] Figure 6 A schematic diagram of a placement structure of an actual image and a theoretical image provided by an embodiment of the present invention;

[0053] Figure 7 A flow chart of another circuit splicing board error measurement method provided by an embodiment of the present invention;

[0054] Figure 8 Another schematic diagram of the placement structure of actual images and theoretical images provided by an embodiment of the present invention;

[0055] Fig. 9 A schematic diagram of another placement structure of actual images and theoretical images provided by an embodiment of the present invention;

[0056] Fig.10 A schematic structural diagram of an error measurement device for a circuit splicing board provided by an embodiment of the present invention;

[0057] Fig.11 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0058] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0059] Figure 1 The flowchart of a circuit splicing board error measurement method provided by an embodiment of the present invention is applicable to the case of measuring the splicing error of a circuit splicing board. The method can be performed by the circuit splicing board error measurement device provided by an embodiment of the present invention. The circuit splicing board error measurement device can be implemented in the form of hardware and / or software. Figure 1 As shown, the error measurement method of the circuit board splicing board includes:

[0060] S101, obtaining a theoretical image and an actual image of a circuit splicing board.

[0061] The circuit splicing board includes at least two splicing sub-boards, the splicing sub-board in the theoretical image is the theoretical splicing sub-board, and the splicing sub-board in the actual image is the actual splicing sub-board. The circuit splicing board is formed by splicing at least two splicing sub-boards. Figure 2 A schematic diagram of a theoretical image of a circuit splicing board provided by an embodiment of the present invention, such as Figure 2 As shown, the circuit splicing board in the theoretical image includes a plurality of theoretical splicing sub-boards 10, and each theoretical splicing sub-board 10 is arranged in an array. Figure 3 A schematic diagram of an actual image of a circuit splicing board provided by an embodiment of the present invention, such as Figure 3 As shown, the circuit splicing board in the actual image includes a plurality of actual splicing sub-boards 20, and each theoretical splicing sub-board is arranged in an array.

[0062] Specifically, the theoretical image of the circuit splicing board can be obtained through the arrangement setting device of the circuit splicing board. For example, the user can design the placement position of each splicing sub-board in the circuit splicing board through the computer aided design (CAD) equipment to form the theoretical image of the circuit splicing board. The actual splicing sub-boards can be spliced ​​by the splicing equipment such as the board implanting machine to form the circuit splicing board, and then the actual image of the circuit splicing board after the splicing equipment such as the board implanting machine is obtained through the charge coupled device (CCD). So that the error parameters of the circuit splicing board can be measured based on the actual image and the theoretical image.

[0063] Understandably, Figure 2 and Figure 3 It is only exemplified that the circuit splicing board includes 16 splicing sub-boards, each of which is a square structure with the same size. The shapes of each splicing sub-board can be the same or different, and can be set according to actual needs. For example, the circuit splicing board includes 2 splicing sub-boards, one of which is circular in shape and the other is rectangular in shape. Under the premise that the circuit splicing board includes at least two splicing sub-boards, the number of splicing sub-boards in the circuit splicing board and the shape of each splicing sub-board can be set according to actual needs, and no specific limitation is made here.

[0064] S102. According to the theoretical image and the actual image, at least two points in the theoretical image located in the theoretical splicing sub-plate are selected as theoretical marking points, and at least two points in the actual image located in the actual splicing sub-plate corresponding to the theoretical marking points are selected as actual marking points.

[0065] Among them, reference Figure 2, each theoretical splicing sub-board 10 has two theoretical marking points, one of which is located at the upper right corner of the theoretical splicing sub-board, and the other is located at the lower left corner of the theoretical splicing sub-board. The position and number of the theoretical marking points can be set according to actual needs and are not specifically limited here.

[0066] Specifically, if only one theoretical marking point is set in the theoretical splicing sub-board, and only one actual marking point corresponding to the theoretical marking point is set in the actual splicing sub-board, when it is detected that the theoretical marking point coincides with the actual marking point, it can only be explained that the positions of the theoretical marking point and the actual marking point coincide, and the actual splicing sub-board where the actual marking point is located may partially or completely coincide with the theoretical splicing sub-board where the theoretical marking point is located. At this time, the relative position relationship between the actual splicing sub-board and the theoretical splicing sub-board cannot be further determined based on the theoretical marking point and the actual marking point, resulting in the inability to accurately measure the error parameters of each actual splicing sub-board in the circuit splicing board. Therefore, according to parameters such as the shape of each theoretical splicing sub-board in the theoretical image, at least two points located in the theoretical splicing sub-board can be selected as theoretical marking points, and according to parameters such as the shape of each actual splicing sub-board in the actual image, at least two points located in the actual splicing sub-board in the actual image corresponding to the theoretical marking points can be selected as actual marking points, so that the splicing errors of each actual splicing sub-board in the circuit splicing board can be determined according to the relative positions of the actual marking points and the theoretical marking points, thereby improving the error measurement accuracy.

[0067] S103, placing the theoretical image and the actual image in the same measurement coordinate system.

[0068] The measurement coordinate system includes a two-dimensional coordinate system or a three-dimensional coordinate system, which can be set according to actual needs. For ease of description, the following embodiments are described by taking the measurement coordinate system as a two-dimensional coordinate system as an example.

[0069] Specifically, in order to facilitate the measurement of the stitching error between the actual image and the theoretical image, the actual image and the theoretical image can be placed in the same plane of the measurement coordinate system to determine the error parameters according to the coordinates of the actual marking points and the theoretical marking points in the measurement coordinate system.

[0070] S104, determining error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point and each actual marking point in the measurement coordinate system.

[0071] The error parameters include at least distance error and angle error.

[0072] Specifically, after placing the theoretical image and the actual image in the same measurement coordinate system, each actual marking point and each theoretical marking point will have corresponding position coordinates in the measurement coordinate system. According to the position coordinates of the theoretical marking point and the actual marking point, the actual image or the theoretical image can be translated and / or rotated to make the actual image and the theoretical image aligned as a whole. On this basis, the distance between the current actual marking point and the theoretical marking point is taken as the distance error. Exemplarily, for the same splicing sub-board in the circuit splicing board, when the distances between each theoretical marking point and each actual marking point in the splicing sub-board are all zero, it means that the distance error of the splicing sub-board is zero, and the splicing sub-board does not generate a splicing error during the board implantation process. Connect two theoretical marking points in the theoretical splicing sub-board in the theoretical image, and take the angle between the straight line formed by connecting the two theoretical marking points and the horizontal axis or vertical axis in the measurement coordinate system as the theoretical angle. Connect two actual marking points in the actual splicing sub-board in the actual image, and take the angle between the straight line formed by connecting the two actual marking points and the horizontal axis or vertical axis in the measurement coordinate system as the actual angle. The difference between the actual angle and the theoretical angle is taken as the angle error. If the difference between the actual angle and the theoretical angle is zero, it means that there is no angle error in the actual splicing of the sub-boards.

[0073] The technical solution of the embodiment of the present invention is to select at least two points located in a theoretical splicing sub-board as theoretical marking points in the theoretical image of the circuit splicing board, and select at least two points located in the actual splicing sub-board corresponding to the theoretical marking points in the actual image of the circuit splicing board as actual marking points, so that when the theoretical image and the actual image are placed in the same measurement coordinate system, the error parameters of each splicing sub-board in the circuit splicing board can be determined according to the position coordinates of the at least two theoretical marking points located in the theoretical splicing sub-board and the at least two actual marking points located in the actual splicing sub-board, thereby improving the accuracy of error measurement, so that when electrical components are subsequently mounted on each splicing sub-board of the circuit splicing board, the mounting accuracy and mounting reliability of the electrical components can be improved according to the error parameters.

[0074] Based on the above embodiments, the embodiments of the present invention illustrate the situation in which, based on the theoretical image and the actual image, at least two points in the theoretical image located in the theoretical splicing sub-plate are selected as theoretical marking points, and at least two points in the actual image located in the actual splicing sub-plate corresponding to the theoretical marking points are selected as actual marking points. Figure 4 A flowchart of another error measurement method for a circuit splicing board provided by an embodiment of the present invention, such as Figure 4 As shown, the error measurement method includes:

[0075] S201, obtaining a theoretical image and an actual image of a circuit splicing board.

[0076] The circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is a theoretical splicing sub-board, and the splicing sub-board located in the actual image is an actual splicing sub-board.

[0077] S202. According to the theoretical image, at least two points located in the theoretical splicing sub-plate are selected as theoretical marking points.

[0078] Specifically, at least two points located in the theoretical splicing sub-plates may be selected as theoretical marking points according to parameters such as the shape of each theoretical splicing sub-plate in the theoretical image. Figure 2 , the shape of each theoretical splicing sub-board is a square, and two points can be selected on the diagonal of the theoretical splicing board as theoretical marking points, or two points can be selected on the central axis of the theoretical splicing board as theoretical marking points. The selection position of the theoretical marking point can also be other, which can be set according to actual needs and is not specifically limited here.

[0079] S203 . According to the position parameters of the theoretical marking points in the area where the theoretical splicing sub-board is located, at least two points in the actual image that are located in the actual splicing sub-board and correspond to the theoretical marking points are selected as actual marking points.

[0080] The location parameters include at least a distance parameter and an orientation parameter.

[0081] Specifically, after the theoretical marking point is determined, the position parameters of the theoretical marking point in the area where the theoretical splicing sub-board is located can be obtained. According to the position parameters, marking points consistent with the position parameters are selected in the actual splicing sub-board of the actual image as actual marking points to improve the correspondence between the actual marking points and the theoretical marking points, thereby improving the accuracy of determining the error parameters according to the position coordinates of the theoretical marking points and the actual marking points.

[0082] Optionally, based on the position parameters of the theoretical marking points in the area where the theoretical splicing sub-plate is located, at least two points in the actual image that correspond to the theoretical marking points and are located in the actual splicing sub-plate are selected as actual marking points, including determining the area to be marked of the actual splicing sub-plate based on the orientation parameters of the theoretical marking points in the area where the theoretical splicing sub-plate is located; and determining the actual marking points in the area to be marked based on the distance parameters of the theoretical marking points in the area where the theoretical splicing sub-plate is located.

[0083] The orientation parameter indicates the direction of the theoretical marking point relative to the center of the theoretical splicing sub-board. The distance parameter indicates the distance between the theoretical marking point and a fixed point or a fixed line in the theoretical splicing sub-board.

[0084] Specifically, refer to Figure 2 and Figure 3, taking the theoretical splicing sub-board 11 and the actual splicing sub-board 21 as examples for explanation. If two theoretical marking points are selected in the theoretical splicing sub-board 11, the theoretical marking points include a first theoretical marking point 31 and a second theoretical marking point 32 located on the diagonal line of the theoretical splicing sub-board 11. The first theoretical marking point 31 is located at the upper right corner of the theoretical splicing sub-board 11, and the second theoretical marking point 32 is located at the lower left corner of the theoretical splicing sub-board 11, wherein the upper right corner and the lower left corner are both orientation parameters. There is a first spacing between the first theoretical marking point 31 and the first theoretical edge 111, a second spacing between the first theoretical mark 31 and the second theoretical edge 112, a third spacing between the second theoretical marking point 32 and the third theoretical edge 113, and a fourth spacing between the second theoretical mark 32 and the fourth theoretical edge 114, wherein the first spacing, the second spacing, the third spacing, and the fourth spacing are all distance parameters. According to the orientation parameters, the first area to be marked of the actual splicing sub-board 21 is determined to be the upper right area of ​​the actual splicing sub-board 21. The second area to be marked is the lower left area of ​​the actual splicing sub-board 21. Then, according to the first spacing and the second spacing in the distance parameter, the point in the first area to be marked whose distance to the first actual edge 211 is the first spacing and whose distance to the second actual edge 212 is the second spacing is taken as the first actual marking point. According to the third spacing and the fourth spacing in the distance parameter, the point in the second area to be marked whose distance to the third actual edge 213 is the third spacing and whose distance to the fourth actual edge 214 is the fourth spacing is taken as the second actual marking point 42. In this way, the position correspondence accuracy between the actual marking point and the theoretical marking point can be improved, thereby improving the accuracy of subsequent error measurement and improving the reliability of error measurement.

[0085] Understandably, Figure 2 and Figure 3 It is only shown that the first theoretical mark point and the first actual mark point are both located at the upper right of the splicing sub-board, and the second theoretical mark point and the second actual mark point are both located at the lower left of the splicing sub-board, and the number and position of the mark points in each splicing sub-board are the same. In other optional embodiments, the number and position of the mark points in each splicing sub-board may be different. For example, refer to Figure 2 and Figure 3 , the number of marking points in the theoretical splicing sub-board 11 and the actual splicing sub-board 21 is two, and they are located at the upper right corner and the lower left corner respectively, the number of marking points in the theoretical splicing sub-board 12 and the actual splicing sub-board 22 can also be two, and they are located at the upper left corner and the lower right corner respectively, the number of marking points in the theoretical splicing sub-board 13 and the actual splicing sub-board 23 can be three, and they are located at the geometric center, the upper right corner and the lower left corner of the splicing sub-board respectively. That is, under the premise of ensuring that the positions and numbers of the marking points in the actual splicing sub-board and the theoretical splicing sub-board that are set one-to-one in the actual image and the theoretical image are consistent, the marking points in each splicing sub-board can be set according to actual needs, and no specific limitation is made here.

[0086] S204, placing the theoretical image and the actual image in the same measurement coordinate system.

[0087] S205. Determine error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point and each actual marking point in the measurement coordinate system.

[0088] The error parameters include at least distance error and angle error.

[0089] The technical solution of the embodiment of the present invention selects at least two points located in the theoretical splicing sub-plate as theoretical marking points, and then selects at least two points located in the actual splicing sub-plate in the actual image corresponding to the theoretical marking points according to the position parameters of the theoretical marking points in the area where the theoretical splicing sub-plate is located as actual marking points, so as to improve the accuracy of the correspondence between the actual marking points and the theoretical marking points, and improve the accuracy and reliability of the subsequent error parameters measured according to the position coordinates of the actual marking points and the theoretical marking points.

[0090] On the basis of the above-mentioned embodiments, the embodiments of the present invention illustrate the situation of determining the error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point and each actual marking point in the measurement coordinate system. Figure 5 A flowchart of another circuit splicing board error measurement method provided by an embodiment of the present invention, such as Figure 5 As shown, the error measurement method includes:

[0091] S301, obtaining a theoretical image and an actual image of a circuit splicing board.

[0092] The circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is a theoretical splicing sub-board, and the splicing sub-board located in the actual image is an actual splicing sub-board.

[0093] S302. According to the theoretical image and the actual image, at least two points in the theoretical image located in the theoretical splicing sub-plate are selected as theoretical marking points, and at least two points in the actual image located in the actual splicing sub-plate corresponding to the theoretical marking points are selected as actual marking points.

[0094] S303, placing the theoretical image and the actual image in the same measurement coordinate system.

[0095] S304 , determining a theoretical center point of the theoretical image and an actual center point of the actual image according to the position coordinates of each theoretical marking point in the measurement coordinate system and the original position coordinates of each actual marking point in the measurement coordinate system.

[0096] The theoretical center point is the geometric center of the theoretical image, and the actual center point is the geometric center of the actual image. The geometric center of the image is the most central position of the image.

[0097] Specifically, according to the position coordinates of each theoretical mark point in the measurement coordinate system, the theoretical center point of the theoretical image is determined by the calculation principle of the geometric center. According to the original position coordinates of each actual mark point in the measurement coordinate system, the actual center point of the actual image is determined theoretically by the calculation principle of the geometric center. In order to adjust the actual center point to the same position as the theoretical center point according to the position difference between the theoretical center point and the actual center point, it is convenient for the subsequent measurement of the error parameters. Figure 6 A schematic diagram of the placement structure of an actual image and a theoretical image provided by an embodiment of the present invention, referring to Figure 6 According to the position coordinates of each theoretical marking point in the measurement coordinate system, the theoretical center point of the theoretical image is determined as O1, and according to the position coordinates of each actual marking point in the measurement coordinate system, the actual center point of the actual image is determined as O2.

[0098] Optionally, the theoretical center point of the theoretical image and the actual center point of the actual image are determined based on the position coordinates of each theoretical marking point in the measurement coordinate system and the original position coordinates of each actual marking point in the measurement coordinate system, including determining the theoretical center point of the theoretical image based on the segmentation method according to the position coordinates of each theoretical marking point in the measurement coordinate system; and determining the actual center point of the actual image based on the segmentation method according to the original position coordinates of each actual marking point in the measurement coordinate system.

[0099] Specifically, each theoretical marking point can be connected by lines, and the theoretical image can be divided into a plurality of first geometric figures through each theoretical marking point, and the geometric center of each first geometric figure can be determined according to the coordinates of the theoretical marking points constituting the first geometric figures. Then, each geometric center is connected, and the theoretical image can be divided into a plurality of second geometric figures through each geometric center, and the geometric center of each geometric figure can be determined according to the coordinates of the theoretical marking points constituting the second geometric figures. The above process is continued until only one geometric figure is formed after the geometric centers are connected, and the geometric center of the geometric figure is used as the theoretical center point of the theoretical image.

[0100] It should be noted that the above description is only based on the example of determining the theoretical center point of a theoretical image. The principle of determining the actual center point in an actual image is similar to the principle of calculating the theoretical center point. Please refer to the above description and will not be repeated here.

[0101] S305 . Determine a first adjustment parameter of the actual image according to the position coordinates of the theoretical center point and the position coordinates of the actual center point.

[0102] The first adjustment parameter includes an adjustment distance. The adjustment distance may be a vector, that is, it includes a direction and a value. The measurement coordinate system includes an X-axis and a Y-axis, and the adjustment distance includes an adjustment distance in the X-axis direction and / or an adjustment distance in the Y-axis direction.

[0103] Specifically, the difference between the ordinate of the actual center point and the ordinate of the theoretical center point can be calculated, and the difference can be used as the adjustment distance in the Y-axis direction. The difference between the abscissa of the actual center point and the abscissa of the theoretical center point can be calculated, and the difference can be used as the adjustment distance in the X-axis direction.

[0104] S306: Adjust the position of the actual image in the measurement coordinate system according to the first adjustment parameter, so that the geometric centers of the actual image and the theoretical image overlap and align.

[0105] Specifically, according to the adjustment distance in the X-axis direction in the first adjustment parameter, the actual image is moved by the adjustment distance in the X-axis direction. According to the adjustment distance in the Y-axis direction in the second adjustment parameter, the actual image is moved by the adjustment distance in the Y-axis direction. In this way, after the above adjustment is performed on the actual image, the actual center point coincides with the theoretical center point, that is, the geometric center of the actual image overlaps and aligns with the geometric center of the theoretical image. Before the actual image is adjusted, the position coordinates of the theoretical center point are (x1, y1), and the position coordinates of the actual center point are (x2, y2). In the X-axis direction, the adjustment distance between the actual center point and the theoretical center point is x2-x1. If the adjustment distance in the X-axis direction is a positive number, the actual image is subsequently controlled to move by the adjustment distance in the negative direction of the X-axis. If the adjustment distance in the X-axis direction is a negative number, the actual image is subsequently controlled to move by the adjustment distance in the positive direction of the X-axis. Correspondingly, in the Y-axis direction, the adjustment distance between the actual center point and the theoretical center point is y2-y1. If the adjustment distance y2-y1 in the Y-axis direction is a positive number, the actual image is subsequently controlled to move the adjustment distance along the negative direction of the Y-axis. If the adjustment distance in the Y-axis direction is a negative number, the actual image is subsequently controlled to move the adjustment distance along the positive direction of the Y-axis.

[0106] For example, x1, y1 and y2 are all 4, x2 is 5, that is, the position coordinates of the theoretical center point are (4, 4), and the position coordinates of the actual center point are (5, 4). Then the difference between x2 and x1 is 1, and the difference between y2 and y1 is 0. Therefore, it is only necessary to control the theoretical image to move an adjustment distance of (x2-x1) in the negative direction of the X-axis to make the geometric center of the theoretical image coincide with the theoretical center of the actual image.

[0107] S307, determining error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point in the measurement coordinate system and the first adjusted position coordinates of each actual marking point in the measurement coordinate system.

[0108] The position of the theoretical image in the coordinate system will affect the position coordinates of the actual marking point. For easy distinction, the first adjusted position coordinates represent the current position coordinates of the actual marking point after the position of the geometric center of the theoretical image is adjusted.

[0109] Specifically, after the geometric center of the actual image overlaps with the geometric center of the theoretical image, the position of the actual image can be adjusted according to the positional relationship between each actual marking point and each theoretical marking point relative to the actual center point, so that the actual image is flush with the theoretical image. On this basis, the distance between each actual marking point and each theoretical marking point, as well as the coordinate difference between each actual marking point and each theoretical marking point along the X-axis direction and the coordinate difference along the Y-axis direction are used as error parameters of the circuit splicing board. In this way, the position of the theoretical image is adjusted to improve the accuracy of the error parameter.

[0110] The technical solution of the embodiment of the present invention determines the theoretical center point of the theoretical image and the actual center point of the actual image according to the position coordinates of each theoretical mark point in the measurement coordinate system and the original position coordinates of each actual mark point in the measurement coordinate system, so as to determine the first adjustment parameter that needs to be adjusted for the actual image in order to make the geometric center of the actual image overlap with the geometric center of the theoretical image according to the position coordinates of the theoretical center point and the position coordinates of the actual center point, so as to adjust the position of the actual image in the measurement coordinate system according to the first adjustment parameter so that the geometric centers of the actual image and the theoretical image overlap. On the basis of the overlap of the geometric centers of the actual image and the theoretical image, the error parameters of the circuit splicing board are determined according to the position coordinates of each theoretical mark point in the measurement coordinate system and the first adjusted position coordinates of each actual mark point in the measurement coordinate system, so as to improve the accuracy and reliability of the determination of the error parameters.

[0111] On the basis of the above-mentioned embodiments, the embodiments of the present invention illustrate the situation of determining the error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point and each actual marking point in the measurement coordinate system. Figure 7 A flowchart of another circuit splicing board error measurement method provided by an embodiment of the present invention, such as Figure 7 As shown, the error measurement method includes:

[0112] S401, obtaining a theoretical image and an actual image of a circuit splicing board.

[0113] The circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is a theoretical splicing sub-board, and the splicing sub-board located in the actual image is an actual splicing sub-board.

[0114] S402. According to the theoretical image and the actual image, at least two points in the theoretical image located in the theoretical splicing sub-plate are selected as theoretical marking points, and at least two points in the actual image located in the actual splicing sub-plate corresponding to the theoretical marking points are selected as actual marking points.

[0115] S403, placing the theoretical image and the actual image in the same measurement coordinate system.

[0116] S404: Determine the theoretical center point of the theoretical image and the actual center point of the actual image according to the position coordinates of each theoretical marking point in the measurement coordinate system and the original position coordinates of each actual marking point in the measurement coordinate system.

[0117] Among them, the theoretical center point is the geometric center of the theoretical image, and the actual center point is the geometric center of the actual image.

[0118] S405 . Determine a first adjustment parameter of the actual image according to the position coordinates of the theoretical center point and the position coordinates of the actual center point.

[0119] The first adjustment parameter includes an adjustment distance.

[0120] S406: Adjust the position of the actual image in the measurement coordinate system according to the first adjustment parameter so that the geometric centers of the actual image and the theoretical image overlap.

[0121] S407 . Determine a second adjustment parameter of the actual image based on least squares calculation according to the position coordinates of each theoretical marking point in the measurement coordinate system and the first adjusted position coordinates of each actual marking point in the measurement coordinate system.

[0122] The second adjustment parameter at least includes a rotation angle.

[0123] Specifically, Figure 8 Another schematic diagram of the placement structure of the actual image and the theoretical image provided by the embodiment of the present invention is as follows: Figure 8 As shown, the actual center point O2 of the actual image overlaps with the theoretical center point O1 of the theoretical image, that is, the geometric centers of the actual image and the theoretical image overlap. On this basis, the first adjusted position coordinates of each actual marking point at the current position can be obtained. For the actual marking points and theoretical marking points located in the same area in the same splicing sub-plate, the theoretical marking points, the actual marking points corresponding to the theoretical marking points, and the theoretical center point can be connected to form a triangle, and then the angle between the actual marking points and the theoretical marking points is determined according to the position coordinates of the theoretical marking points in the triangle, the first adjusted position coordinates of the actual marking points corresponding to the theoretical marking points, and the position coordinates of the theoretical center point, and the angle is the first rotation angle. The first rotation angle of each actual marking point can be determined by the above principle, and then the first rotation angle corresponding to each actual marking point is calculated based on the least squares method to determine the rotation angle of the actual image. In this way, the rotation angle required for the actual image to be flush with the theoretical image is determined by the least squares method to improve the overlap between the actual image and the theoretical image, thereby improving the measurement accuracy of the subsequent error parameters.

[0124] S408. Adjust the position of the actual image in the measurement coordinate system according to the second adjustment parameter, so that the actual image and the theoretical image are aligned.

[0125] Specifically, the rotation angle can be a vector, that is, the rotation angle includes the rotation direction, and the rotation direction includes counterclockwise and clockwise, etc. When the rotation angle is a positive number, it means that the actual image needs to be controlled to rotate clockwise, and when the rotation angle is a negative number, it means that the actual image needs to be controlled to rotate counterclockwise. The correspondence between positive and negative numbers and the rotation direction can be set according to actual needs, and is not specifically limited here. Exemplarily, the second adjustment parameter is -10°, then the actual image is controlled to rotate 10° counterclockwise with the theoretical center point as the center, so that the actual image is aligned with the theoretical image as a whole. Fig. 9 A schematic diagram of another placement structure of actual images and theoretical images provided by an embodiment of the present invention, referring to Figure 8 and Fig. 9 After the actual image is adjusted according to the second adjustment parameter, the actual image is aligned with the theoretical image as a whole.

[0126] S409, determining error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point in the measurement coordinate system and the second adjusted position coordinates of each actual marking point in the measurement coordinate system.

[0127] The position of the theoretical image in the coordinate system will affect the position coordinates of the actual marking point. For easy distinction, the second adjusted position coordinates represent the current position coordinates of the actual marking point after the angle of the theoretical image is adjusted.

[0128] Specifically, the difference coordinates between the second adjusted position coordinates of the actual marking point in the coordinate system and the position coordinates of the theoretical marking point can be used as the error parameters of each spliced ​​sub-board. By setting at least two marking points on each spliced ​​sub-board, the accuracy of the error parameter determination of the entire spliced ​​sub-board can be improved, thereby improving the accuracy of the error parameter determination of the circuit spliced ​​board.

[0129] Optionally, the error parameters of the circuit splicing board are determined according to the position coordinates of each theoretical marking point in the measurement coordinate system and the second adjusted position coordinates of each actual marking point in the measurement coordinate system, including: taking the actual splicing sub-board to be measured as the actual sub-board to be measured, and the theoretical splicing sub-board corresponding to the actual sub-board to be measured as the theoretical sub-board to be calibrated; determining the lateral distance error between each actual mark and each theoretical marking point according to the lateral position coordinates of each theoretical marking point in the theoretical sub-board to be calibrated in the measurement coordinate system, and the second adjusted lateral position coordinates of each actual marking point in the measurement coordinate system corresponding to each theoretical marking point; determining the longitudinal position coordinates of each theoretical marking point in the theoretical sub-board to be calibrated in the measurement coordinate system, and the second adjusted longitudinal position coordinates of each actual marking point in the measurement coordinate system corresponding to each theoretical marking point. The longitudinal distance error between the actual marking point and each theoretical marking point; determine the theoretical angle of the theoretical sub-plate to be calibrated according to the position coordinates of each theoretical marking point in the theoretical sub-plate to be calibrated in the measurement coordinate system; determine the actual angle of the actual sub-plate to be measured according to the position coordinates of each actual marking point in the actual sub-plate to be measured in the measurement coordinate system; determine the angle error according to the theoretical angle and the actual angle; take the next actual spliced ​​sub-plate to be measured as the actual sub-plate to be measured, and the theoretical spliced ​​sub-plate corresponding to the actual sub-plate to be measured as the theoretical sub-plate to be calibrated, and return to execute each step from the lateral position coordinates of each theoretical marking point in the theoretical sub-plate to be calibrated in the measurement coordinate system to determining the longitudinal distance error between each actual marking point and each theoretical marking point, until the error parameters of each actual spliced ​​sub-plate are measured; the distance error includes the lateral distance error and the longitudinal distance error.

[0130] Specifically, since the circuit splicing board includes multiple splicing sub-boards, the splicing error parameters of each splicing sub-board can be determined in sequence. The actual splicing sub-board to be measured is taken as the actual sub-board to be measured, and the theoretical splicing sub-board corresponding to the actual sub-board to be measured is taken as the theoretical sub-board to be calibrated. Then, according to the lateral position coordinates of each theoretical marking point in the theoretical sub-board to be calibrated in the measurement coordinate system, and the second adjusted lateral position coordinates of each actual marking point corresponding to each theoretical marking point in the measurement coordinate system, the lateral distance error between each actual marking point and each theoretical marking point is determined. The lateral distance error can be the lateral coordinate difference between the actual marking point and the theoretical marking point. Exemplarily, the horizontal coordinate of the actual marking point is 5, and the horizontal coordinate of the theoretical marking point corresponding to the actual marking point is 4.4, then the lateral distance error is 0.6. Then, according to the longitudinal position coordinates of each theoretical marking point in the theoretical sub-board to be calibrated in the measurement coordinate system, and the second adjusted longitudinal position coordinates of each actual marking point corresponding to each theoretical marking point in the measurement coordinate system, the longitudinal distance error between each actual marking point and each theoretical marking point is determined. The longitudinal distance error may be the difference between the longitudinal coordinates of the actual marking point and the theoretical marking point. For example, if the longitudinal coordinate of the actual marking point is 4 and the longitudinal coordinate of the theoretical marking point corresponding to the actual marking point is 3.4, the longitudinal distance error is 0.6.

[0131] Accordingly, reference Figure 2 , Figure 3 and Fig. 9 , taking the theoretical splicing sub-board 11 and the actual splicing sub-board 21 as examples for explanation. The theoretical marking points in the theoretical splicing sub-board 11 include the first theoretical marking point 31 and the second theoretical marking point 32 located on the diagonal line, and the actual marking points in the actual splicing sub-board 21 include the first actual marking point 41 and the second actual marking point 42 located at the upper right corner of the actual splicing sub-board 21. The first theoretical marking point 31, the second theoretical marking point 32, the first actual marking point 41 and the second actual marking point 42 have corresponding position coordinates, illustratively, the coordinates of the first theoretical marking point 31 are (x11, y11), the coordinates of the second theoretical marking point 32 are (x12, y12), the coordinates of the first actual marking point 41 are (x21, y21), and the coordinates of the second actual marking point 42 are (x22, y22). The angle θ1 between the connecting line connecting the first theoretical marking point 31 and the second theoretical marking point 32 and the horizontal axis X, and the angle θ2 between the connecting line connecting the first actual marking point 41 and the second actual marking point 42 and the horizontal axis X can be determined according to the angle calculation formula, and the difference between θ2 and θ1 is taken as the angle error. Among them, arctanθ1=(y12-y11) / (x12-x11), arctanθ2=(y22-y21) / (x22-x21).

[0132] In an optional embodiment, the error parameters also include expansion and contraction errors. According to the position coordinates of each theoretical marking point in the measurement coordinate system and the second adjusted position coordinates of each actual marking point in the measurement coordinate system, the error parameters of the circuit splicing board are determined, including: connecting any two theoretical marking points in the theoretical sub-board to be calibrated, and determining the first distance between the two theoretical marking points according to the position coordinates of the two theoretical marking points in the measurement coordinate system. Connecting the actual sub-board to be measured and the corresponding two actual marking points in the theoretical sub-board to be calibrated, and determining the second distance between the two actual marking points according to the second adjusted position coordinates of the two actual marking points in the measurement coordinate system. The difference between the second distance and the first distance is taken as the expansion and contraction error.

[0133] Specifically, refer to Figure 2 , Figure 3 and Fig. 9 , taking the theoretical splicing sub-plate 11 and the actual splicing sub-plate 21 as examples for explanation. In the measurement coordinate system, the first theoretical marking point 31 and the second theoretical marking point 32 in the theoretical splicing sub-plate 11 are connected, and the first actual marking point 41 and the second actual marking point 42 in the actual splicing sub-plate 21 are connected. The coordinates of the first theoretical marking point 31 are (x11, y11), the coordinates of the second theoretical marking point 32 are (x12, y12), the coordinates of the first actual marking point 41 are (x21, y21), and the coordinates of the second actual marking point 42 are (x22, y22). The first distance L1 between the first theoretical marking point 31 and the second theoretical marking point 32, and the second distance L2 between the first actual marking point 41 and the second actual marking point 42 can be determined according to the distance calculation formula. Among them, If the difference between the second distance and the first distance is greater than zero, it means that the size of the actual sub-board to be measured has expanded. If the difference between the second distance and the first distance is less than zero, it means that the size of the actual sub-board to be measured has shrunk.

[0134] After calculating and determining the distance error and angle error of each mark point in the actual sub-board to be measured according to the above-mentioned distance error determination method, the next actual spliced ​​sub-board to be measured can be used as the actual sub-board to be measured, and the theoretical spliced ​​sub-board corresponding to the actual sub-board to be measured can be used as the theoretical sub-board to be calibrated, and the execution is returned to determine the longitudinal distance error between each actual mark and each theoretical mark point according to the lateral position coordinates of each theoretical mark point in the theoretical sub-board to be calibrated in the measurement coordinate system, and then the next actual spliced ​​sub-board to be measured is used as the actual sub-board to be measured in order, and the error parameters of the measured actual sub-board are determined according to the above steps, and the above steps are executed repeatedly until the error parameters of each actual spliced ​​sub-board are measured. By setting at least two mark points on each spliced ​​sub-board, and taking the lateral distance error and longitudinal distance error of each mark point as error parameters, the overall splicing error determination accuracy of the spliced ​​sub-board can be improved.

[0135] The technical solution of the embodiment of the present invention is to adjust the position of the actual image according to the position coordinates of each theoretical marking point in the measurement coordinate system and the original position coordinates of each actual marking point in the measurement coordinate system so that the geometric centers of the actual image and the theoretical image overlap, and then determine the second adjustment parameter of the actual image based on the least squares method according to the position coordinates of each theoretical marking point in the measurement coordinate system and the first adjusted position coordinates of each actual marking point in the measurement coordinate system, so as to rotate the actual image according to the second adjustment parameter, thereby making the actual image and the theoretical image aligned. On the basis that the geometric centers of the actual image and the theoretical image overlap and are aligned as a whole, the measurement accuracy of the error parameters between the actual marking points and the theoretical marking points can be improved, thereby improving the measurement accuracy and reliability of the error parameters of the circuit splicing board determined according to the position coordinates of each theoretical marking point in the measurement coordinate system and the second adjusted position coordinates of each actual marking point in the measurement coordinate system.

[0136] The embodiment of the present invention further provides an error measurement device for a circuit splicing board. Fig.10 A schematic diagram of a circuit splicing board error measurement device provided by an embodiment of the present invention is shown in FIG. Fig.10 As shown, the error measuring device of the circuit splicing board includes:

[0137] The image acquisition module 10 is used to acquire a theoretical image and an actual image of a circuit splicing board; the circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is a theoretical splicing sub-board, and the splicing sub-board located in the actual image is an actual splicing sub-board;

[0138] The marking point selection module 20 is used to select at least two points in the theoretical image located in the theoretical splicing sub-plate as theoretical marking points, and select at least two points in the actual image located in the actual splicing sub-plate corresponding to the theoretical marking points as actual marking points according to the theoretical image and the actual image;

[0139] An image processing and measurement module 30, used to place the theoretical image and the actual image in the same measurement coordinate system;

[0140] The error determination module 40 is used to determine the error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point and each actual marking point in the measurement coordinate system; the error parameters include distance error.

[0141] The error measuring device for a circuit splicing board provided in an embodiment of the present invention can execute the error measuring method for a circuit splicing board provided in any embodiment of the present invention, and has functional modules and beneficial effects corresponding to the execution method. The similarities can be referred to the above description.

[0142] Fig.11A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention is shown in FIG. Fig.11 As shown, electronic devices are intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. Electronic devices can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or claimed herein.

[0143] like Fig.11 As shown, the electronic device 50 includes at least one processor 51, and a memory connected to the at least one processor 51, such as a read-only memory (ROM) 52, a random access memory (RAM) 53, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 51 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 52 or the computer program loaded from the storage unit 58 to the random access memory (RAM) 53. In the RAM 53, various programs and data required for the operation of the electronic device 50 can also be stored. The processor 51, ROM 52 and RAM 53 are connected to each other through a bus 54. An input / output (I / O) interface 55 is also connected to the bus 54.

[0144] A number of components in the electronic device are connected to the I / O interface 55, including: an input unit 56, such as a keyboard, a mouse, etc.; an output unit 57, such as various types of displays, speakers, etc.; a storage unit 58, such as a disk, an optical disk, etc.; and a communication unit 59, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 59 allows the electronic device to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0145] The processor 51 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 51 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 51 executes the various methods and processes described above, such as the error measurement method of the circuit splicing board.

[0146] In some embodiments, the error measurement method of the circuit splicing board can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 58. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device via ROM52 and / or communication unit 59. When the computer program is loaded into RAM53 and executed by processor 51, one or more steps of the error measurement method of the circuit splicing board described above can be performed. Alternatively, in other embodiments, processor 51 can be configured to execute the error measurement method of the circuit splicing board by any other appropriate means (for example, by means of firmware).

[0147] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0148] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0149] An embodiment of the present invention also provides a computer-readable storage medium, which stores computer instructions. The computer instructions are used to enable a processor to implement the error measurement method for the circuit splicing board provided in the embodiment of the present invention when executed. The method has corresponding functional modules and beneficial effects, which will not be repeated here.

[0150] Computer readable storage medium can be a tangible medium that can contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. Computer readable storage medium can include but is not limited to electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the above. Alternatively, computer readable storage medium can be a machine readable signal medium. More specific examples of machine readable storage medium can include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above.

[0151] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method for measuring the error of a circuit splicing board, characterized in that: include: Acquire a theoretical image and an actual image of the circuit splicing board; the circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is a theoretical splicing sub-board, and the splicing sub-board located in the actual image is an actual splicing sub-board; According to the theoretical image and the actual image, at least two points in the theoretical image located in the theoretical splicing sub-plate are selected as theoretical marking points, and at least two points in the actual image located in the actual splicing sub-plate corresponding to the theoretical marking points are selected as actual marking points; Placing the theoretical image and the actual image in the same measurement coordinate system; According to the position coordinates of each theoretical marking point and each actual marking point in the measurement coordinate system, the error parameters of the circuit splicing board are determined; the error parameters at least include distance error and angle error.

2. The error measurement method according to claim 1, characterized in that: According to the theoretical image and the actual image, selecting at least two points in the theoretical image located in the theoretical splicing sub-plate as theoretical marking points, and selecting at least two points in the actual image located in the actual splicing sub-plate corresponding to the theoretical marking points as actual marking points, including: According to the theoretical image, at least two points located in the theoretical splicing sub-plate are selected as theoretical marking points; According to the position parameters of the theoretical marking point in the area where the theoretical splicing sub-board is located, at least two points in the actual image corresponding to the theoretical marking point and located in the actual splicing sub-board are selected as actual marking points; the position parameters include at least distance parameters and orientation parameters.

3. The error measurement method according to claim 2, characterized in that: According to the position parameters of the theoretical marking point in the area where the theoretical splicing sub-plate is located, selecting at least two points in the actual image and located in the actual splicing sub-plate and corresponding to the theoretical marking point as actual marking points, including: Determine the area to be marked of the actual spliced ​​sub-board according to the orientation parameters of the theoretical marking point in the area where the theoretical spliced ​​sub-board is located; The actual marking point in the area to be marked is determined according to the distance parameter of the theoretical marking point in the area where the theoretical splicing sub-plate is located.

4. The error measurement method according to claim 1, characterized in that: Determining the error parameters of the circuit splicing board according to the position coordinates of each of the theoretical marking points and each of the actual marking points in the measurement coordinate system includes: Determine the theoretical center point of the theoretical image and the actual center point of the actual image according to the position coordinates of each theoretical marking point in the measurement coordinate system and the original position coordinates of each actual marking point in the measurement coordinate system; the theoretical center point is the geometric center of the theoretical image; the actual center point is the geometric center of the actual image; Determining a first adjustment parameter of the actual image according to the position coordinates of the theoretical center point and the position coordinates of the actual center point; the first adjustment parameter includes an adjustment distance; According to the first adjustment parameter, adjusting the position of the actual image in the measurement coordinate system so that the geometric centers of the actual image and the theoretical image overlap and align; The error parameters of the circuit splicing board are determined according to the position coordinates of each theoretical marking point in the measurement coordinate system and the first adjusted position coordinates of each actual marking point in the measurement coordinate system.

5. The error measurement method according to claim 4, characterized in that: Determining the theoretical center point of the theoretical image and the actual center point of the actual image according to the position coordinates of each theoretical marking point in the measurement coordinate system and the original position coordinates of each actual marking point in the measurement coordinate system includes: Determining the theoretical center point of the theoretical image by calculation based on a segmentation method according to the position coordinates of each theoretical marking point in the measurement coordinate system; According to the original position coordinates of each actual marking point in the measurement coordinate system, the actual center point of the actual image is determined by calculation based on a segmentation method.

6. The error measurement method according to claim 4, characterized in that: Determining the error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point in the measurement coordinate system and the first adjusted position coordinates of each actual marking point in the measurement coordinate system includes: Determine the second adjustment parameter of the actual image based on the least squares method according to the position coordinates of each theoretical marking point in the measurement coordinate system and the first adjusted position coordinates of each actual marking point in the measurement coordinate system; the second adjustment parameter at least includes a rotation angle; According to the second adjustment parameter, adjusting the position of the actual image in the measurement coordinate system so that the actual image is aligned with the theoretical image; The error parameters of the circuit splicing board are determined according to the position coordinates of each theoretical marking point in the measurement coordinate system and the second adjusted position coordinates of each actual marking point in the measurement coordinate system.

7. The error measurement method according to claim 6, determining the error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point in the measurement coordinate system and the second adjusted position coordinates of each actual marking point in the measurement coordinate system, comprising: The actual spliced ​​sub-board to be measured is used as the actual sub-board to be measured, and the theoretical spliced ​​sub-board corresponding to the actual sub-board to be measured is used as the theoretical sub-board to be calibrated; Determine the lateral distance error between each of the actual marking points and each of the theoretical marking points according to the lateral position coordinates of each of the theoretical marking points in the theoretical sub-plate to be calibrated in the measurement coordinate system and the second adjusted lateral position coordinates of each of the actual marking points corresponding to each of the theoretical marking points in the measurement coordinate system; Determine the longitudinal distance error between each of the actual marking points and each of the theoretical marking points according to the longitudinal position coordinates of each of the theoretical marking points in the theoretical sub-plate to be calibrated in the measurement coordinate system and the second adjusted longitudinal position coordinates of each of the actual marking points corresponding to each of the theoretical marking points in the measurement coordinate system; Determining the theoretical angle of the theoretical sub-plate to be calibrated according to the position coordinates of each theoretical marking point in the theoretical sub-plate to be calibrated in the measurement coordinate system; Determine the actual angle of the actual sub-board to be measured according to the position coordinates of each of the actual marking points in the actual sub-board to be measured in the measurement coordinate system; Determining the angle error according to the theoretical angle and the actual angle; The next actual spliced ​​sub-board to be measured is taken as the actual sub-board to be measured, and the theoretical spliced ​​sub-board corresponding to the actual sub-board to be measured is taken as the theoretical sub-board to be calibrated, and the steps of determining the longitudinal distance error between each actual mark and each theoretical mark point according to the transverse position coordinates of each theoretical mark point in the theoretical sub-board to be calibrated in the measurement coordinate system are returned to, until the error parameters of each actual spliced ​​sub-board are measured; the distance error includes a transverse distance error and a longitudinal distance error.

8. An error measuring device for a circuit splicing board, characterized in that: include: An image acquisition module, used to acquire a theoretical image and an actual image of the circuit splicing board; the circuit splicing board includes at least two splicing sub-boards, the splicing sub-board located in the theoretical image is a theoretical splicing sub-board, and the splicing sub-board located in the actual image is an actual splicing sub-board; A marking point selection module is used to select, according to the theoretical image and the actual image, at least two points in the theoretical image located in the theoretical splicing sub-plate as theoretical marking points, and select at least two points in the actual image located in the actual splicing sub-plate corresponding to the theoretical marking points as actual marking points; An image processing and measurement module, used for placing the theoretical image and the actual image in the same measurement coordinate system; The error determination module is used to determine the error parameters of the circuit splicing board according to the position coordinates of each theoretical marking point and each actual marking point in the measurement coordinate system; the error parameters include at least distance error and angle error.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the error measurement method for the circuit splicing board described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the error measurement method for a circuit splicing board according to any one of claims 1 to 7 when executed.

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