Method for measuring and calculating temperature of superconducting quantum chip

Abstract

The invention relates to a method for measuring and calculating the temperature of a superconducting quantum chip, and the method comprises the steps: S1, obtaining a first temperature of a measurement position near the superconducting quantum chip in a non-working state of the superconducting quantum chip; s2, in a working state of the superconducting quantum chip, acquiring a second temperature of the measurement position; s3, establishing a digital twinborn model of the superconducting quantum chip and related parts thereof, and a measurement position; temperature boundary conditions are added, so that the measurement position gradually reaches the second temperature from the first temperature; and S4, obtaining a temperature gradient field of the superconducting quantum chip and a superconducting quantum chip environment, thereby obtaining a temperature value of the superconducting quantum chip. According to the temperature measurement and calculation method, non-contact temperature measurement is realized, the problem that the working temperature of the superconducting quantum chip cannot be detected is solved, the problem that the working temperature of the superconducting quantum chip is not accurately measured by a complex system and external interference can be avoided, the accuracy of a temperature measurement result is greatly improved, and test resources and test cost are greatly saved.

Description

Technical Field

[0001] The present invention relates to the technical field of superconducting quantum chips, and in particular to a method for measuring the temperature of a superconducting quantum chip. Background Art

[0002] As the performance of superconducting quantum computers continues to improve, the number of bits in superconducting quantum chips also increases. Although the superconducting quantum chip itself does not generate any power consumption, the increase in the control circuits of the PCB circuit board connected to it will increase the internal temperature of the chip. Once the internal temperature of the chip exceeds 20mK, the quantum chip is like soaking in a hot water bath, which will inevitably affect the chip's working efficiency and stability. Therefore, in order to improve the working stability and reliability of the superconducting quantum chip, the working temperature of the superconducting quantum chip must be controlled within 20mK. The first step to achieve precise temperature control is to clarify the actual working temperature of the superconducting quantum chip, but the internal temperature of the superconducting quantum chip cannot be read directly, and forced reading will destroy the stability of the quantum chip.

[0003] Current chip temperature measurement methods mostly use direct temperature measurement, which directly connects the temperature measurement chip to the temperature sensor. This temperature measurement method is suitable for conventional chip temperature measurement needs, but it is not applicable in the field of superconducting quantum computers. This is because when the quantum chip is running, the chip is in a superconducting state and the power is 0. Direct connection of the external leads to the temperature sensor will generate power consumption, introduce noise, and destroy the quantum characteristics.

[0004] The current non-contact temperature measurement method obtains the radiation intensity of the object being measured, and then obtains the temperature of the object being measured based on the corresponding curve between radiation intensity and temperature. However, the energy of the superconducting quantum chip is extremely weak, and there is currently no sensor that can capture the radiation intensity of the superconducting quantum chip. In addition, the superconducting quantum chip is wrapped in a metal packaging box, which will also bring great interference to the measurement of radiation intensity. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a method for measuring the temperature of a superconducting quantum chip, which can accurately measure the temperature of the superconducting quantum chip, realize non-contact measurement, and avoid external interference affecting the measurement result.

[0006] The technical solution adopted by the present invention to solve the technical problem is: a method for measuring the temperature of a superconducting quantum chip, the steps of the method are:

[0007] S1. When the superconducting quantum chip is not in operation, obtaining a first temperature at a measurement position near the superconducting quantum chip;

[0008] S2. When the superconducting quantum chip is in working state, obtaining a second temperature at the measurement position;

[0009] S3. Use simulation software to establish a digital twin model of the superconducting quantum chip and its related components and the measurement location; and add temperature boundary conditions so that the measurement location gradually reaches the second temperature from the first temperature;

[0010] S4. According to the results of the finite element simulation of the digital twin model, the temperature gradient field of the superconducting quantum chip and the superconducting quantum chip environment is obtained, so as to obtain the temperature value of the superconducting quantum chip.

[0011] More specifically, the superconducting quantum chip is fixedly mounted by a mounting bracket and a chip packaging box, and the measurement position is located on the mounting bracket and / or the chip packaging box.

[0012] More specifically, the second temperature is the temperature of the measurement position after the superconducting quantum chip is working stably.

[0013] More specifically, the method of digital twin modeling and adding temperature boundary conditions in step S3 is:

[0014] S31. Perform 3D modeling based on superconducting quantum chips and related components;

[0015] S32, performing finite element meshing on the 3D model;

[0016] S33. Add temperature boundary conditions in the 3D model using finite element software, and gradually add micro-nano energy starting from the first temperature as the starting temperature of the superconducting quantum chip, so that the measurement position gradually reaches the second temperature from the first temperature.

[0017] More specifically, in step S32, hexahedral mesh division is adopted, and the number of mesh layers on each edge of the hexahedron is greater than 3.

[0018] More specifically, the number of grid layers on each edge of the hexahedron is 6.

[0019] More specifically, in step S4, the step increment of gradually adding micro-nano energy is 0.05-0.3nw.

[0020] More specifically, the step increment of adding micro-nano energy is 0.1nw.

[0021] More specifically, there are at least two measuring positions, at least one of which is located on the mounting bracket and at least one is located on the chip packaging box, and each of the measuring positions obtains a different first temperature and second temperature.

[0022] The beneficial effects of the present invention are:

[0023] 1. The present invention measures the temperature of the superconducting quantum chip in two states, constructs a 3D model through digital twins, and gradually adds micro-nano energy to make the temperature at the temperature measurement position rise from the first temperature to the second temperature, thereby obtaining a temperature gradient field and obtaining the working temperature of the superconducting quantum chip. This innovative temperature measurement method realizes non-contact temperature measurement and solves the problem that the working temperature of the superconducting quantum chip cannot be detected.

[0024] 2. The temperature measurement system of the present invention is relatively simple and easy to implement. It belongs to indirect measurement and can avoid the problem of inaccurate measurement of the working temperature of the superconducting quantum chip caused by complex systems and external interference. The accuracy of the temperature measurement results is greatly improved.

[0025] 3. Use digital twins to reconstruct the temperature field and simulate it within the software, greatly saving test resources and testing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the installation structure of the superconducting quantum chip;

[0027] Figure 2 It is a flow chart of the calculation method of the present invention.

[0028] In the figure: 1. Superconducting quantum chip; 2. Mounting bracket; 3. Chip packaging box; 4. Temperature sensor. DETAILED DESCRIPTION

[0029] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0032] The present invention is a measurement method designed mainly for the temperature measurement of superconducting quantum chips in quantum computers. The main idea of ​​this measurement method is to measure two or more temperature values ​​at different times at a certain position around the superconducting quantum chip, and based on digital twin modeling and simulation, make the position in the software reach the corresponding measured temperature value according to the corresponding position at different times, thereby obtaining the temperature gradient around the superconducting quantum chip, and thus obtaining the temperature of the superconducting quantum chip.

[0033] The purpose of this application is to quickly and accurately measure the corresponding temperature value, so the components that are directly in contact with the superconducting quantum chip, such as the mounting bracket and the chip packaging box, can be measured. Figure 1 As shown, the superconducting quantum chip 1 is placed in a chip packaging box 3, and the chip packaging box 3 is fixed on the mounting bracket 2. At the same time, the superconducting quantum chip 1 is closely attached to the mounting bracket 2. Both the mounting bracket 2 and the chip packaging box 3 can quickly transfer the heat emitted by the superconducting quantum chip 1.

[0034] like Figure 2 A method for measuring the temperature of a superconducting quantum chip is shown, and the steps of the method are as follows:

[0035] S1. When the superconducting quantum chip 1 is not in operation, that is, the quantum computer is not working and is in a shutdown state, a first temperature of a measurement position near the superconducting quantum chip 1 is obtained; the measurement position here can be set on the mounting bracket 2 or the chip packaging box 3, or both the mounting bracket 2 and the chip packaging box 3, and a corresponding temperature signal is obtained through the temperature sensor 4 at the measurement position, that is, the first temperature is measured by the temperature sensor 4.

[0036] Furthermore, according to the second law of thermodynamics, there are at least two measuring positions to facilitate more accurate temperature acquisition; considering the portability of installation and the accuracy of measurement, at least one is located on the mounting bracket 2, and at least one is located on the chip packaging box 3, and each of the measuring positions obtains a different first temperature and second temperature; in the present application, there are two measuring positions, the one located on the mounting bracket 2 is measurement position A, and the one located on the chip packaging box 3 is measurement position B, that is, the first temperature A and the second temperature A of the position are measured at measurement position A, and the first temperature B and the second temperature B of the position are obtained at measurement position B.

[0037] S2. Turn on the quantum computer until the internal ambient temperature of the quantum computer drops to 10 mK. When the superconducting quantum chip 1 is in working state, obtain the second temperature at the measurement position. Here, the second temperature is preferably measured after the superconducting quantum chip 1 is working stably. The two measurement positions in this application obtain the second temperature A and the second temperature B.

[0038] S3. Using simulation software, establish a digital twin model of the superconducting quantum chip 1 and its related components and measurement positions and add temperature boundary conditions; the related components here are components that can quickly transfer heat from the superconducting quantum chip 1, which may be a mounting bracket 2 and a chip packaging box 3;

[0039] The method to build a digital twin model and add temperature boundary conditions is:

[0040] S31. Perform 3D modeling based on the superconducting quantum chip 1, the mounting bracket 2, the chip packaging box 3 and their parameters to form a 3D model; wherein the parameters include size, shape, position and thermal conductivity of the preparation material, etc. Parameters that affect thermal conduction need to be formed in the 3D model during modeling.

[0041] S32. Based on the finite element analysis principle, the 3D model is meshed by finite element so as to better obtain the temperature gradient. In order to improve the quality of meshing, hexahedral meshing is adopted here, and the number of mesh layers on each edge of the hexahedron needs to be greater than 3. In this application, the preferred number of mesh layers is 6.

[0042] S33. Use ANSYS or COMSOL commercial finite element software to add temperature boundary conditions in the 3D model, add a heat source to the superconducting quantum chip 1 according to its heating condition so as to simulate the heating state of the actual superconducting quantum chip 1, add a starting temperature in the superconducting quantum chip 1, the measurement position A and the measurement position B, the starting temperature is the first temperature in step S1, because the superconducting quantum chip 1 has not yet worked, the first temperatures of the superconducting quantum chip 1, the measurement position A and the measurement position B are the same; gradually add micro-nano energy at the position of the superconducting quantum chip 1, so that the measurement position A gradually reaches the second temperature A from the first temperature A, and the measurement position B gradually reaches the second temperature B from the first temperature B; wherein, the micro-nano energy increases from 0, and the step increment of the micro-nano energy is 0.05-0.3nw, and the step increment is preferably 0.1nw in the present application.

[0043] S4. According to the results of the finite element simulation of the digital twin model, the temperature gradient field of the superconducting quantum chip 1 and the environment of the superconducting quantum chip 1 is obtained, so as to obtain the temperature value of the superconducting quantum chip 1.

[0044] In summary, the present invention measures the temperature of the superconducting quantum chip 1 in two states, constructs a 3D model through digital twins, and gradually adds micro-nano energy through software simulation to make the temperature at the temperature measurement position rise from the first temperature to the second temperature, thereby obtaining a temperature gradient field and obtaining the operating temperature of the superconducting quantum chip 1. Non-contact temperature measurement is realized, and measurement is performed at multiple measurement positions. The accuracy of the temperature measurement results is greatly improved, and simulation is performed in the software, which greatly saves test resources and test costs.

[0045] It should be emphasized that the above are only preferred embodiments of the present invention and do not limit the present invention in any form. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A method for measuring the temperature of a superconducting quantum chip, characterized in that: The steps of this calculation method are: S1. When the superconducting quantum chip (1) is in a non-operating state, obtaining a first temperature at a measurement position near the superconducting quantum chip (1); S2. When the superconducting quantum chip (1) is in a working state, obtaining a second temperature at a measurement position; S3. Using simulation software, establish a digital twin model of the superconducting quantum chip (1) and its related components and the measurement position; and add temperature boundary conditions so that the measurement position gradually reaches the second temperature from the first temperature; S4. According to the result of the finite element simulation of the digital twin model, the temperature gradient field of the superconducting quantum chip (1) and the environment of the superconducting quantum chip (1) is obtained, thereby obtaining the temperature value of the superconducting quantum chip (1).

2. The method for measuring the temperature of a superconducting quantum chip according to claim 1, characterized in that: The superconducting quantum chip (1) is fixedly mounted via a mounting bracket (2) and a chip packaging box (3), and the measurement position is located on the mounting bracket (2) and / or the chip packaging box (3).

3. The method for measuring the temperature of a superconducting quantum chip according to claim 1, characterized in that: The second temperature is the temperature of a measurement position after the superconducting quantum chip (1) operates stably.

4. The method for measuring the temperature of a superconducting quantum chip according to claim 1, characterized in that: The method for digital twin modeling and adding temperature boundary conditions in step S3 is: S31, performing 3D modeling based on the superconducting quantum chip (1) and related components; S32, performing finite element meshing on the 3D model; S33, using finite element software to add temperature boundary conditions in the 3D model, starting with the first temperature as the starting temperature of the superconducting quantum chip (1) and gradually adding micro-nano energy, so that the measurement position gradually reaches the second temperature from the first temperature.

5. The method for measuring the temperature of a superconducting quantum chip according to claim 4, characterized in that: In step S32, hexahedral mesh division is adopted, and the number of mesh layers on each edge of the hexahedron is greater than 3.

6. The method for measuring the temperature of a superconducting quantum chip according to claim 5, characterized in that: The number of mesh layers on each edge of the hexahedron is 6.

7. The method for measuring the temperature of a superconducting quantum chip according to claim 1, characterized in that: In step S4, the step increment of gradually adding micro-nano energy is 0.05-0.3nw.

8. The method for measuring the temperature of a superconducting quantum chip according to claim 7, characterized in that: The step increment of adding micro-nano energy is 0.1nw.

9. The method for measuring the temperature of a superconducting quantum chip according to claim 2, characterized in that: There are at least two measuring positions, at least one of which is located on the mounting bracket (2) and at least one of which is located on the chip packaging box (3), and each of the measuring positions obtains a different first temperature and second temperature.

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