Device for detecting packaging quality of semiconductor laser stack array

Abstract

A device for detecting the packaging quality of a semiconductor laser stack array comprises a light source module, a computer control module and an imaging and detecting module, the light source module emits laser through the computer control module, the laser is incident to the surface of a detected device chip placed on a detected device tool at a certain angle, and the imaging and detecting module is used for detecting the packaging quality of the semiconductor laser stack array. The surface of the tested device chip reflects the test laser beam, the reflected light receives an image through the imaging and detection module, and the image is collected and stored by the computer control module. The device is suitable for packaging quality detection of linear arrays or stacked arrays of conduction cooling semiconductor lasers, vertical linear arrays or stacked arrays of micro-channel semiconductor lasers and the like, and has the advantages of being simple in structure, convenient to operate, free of damage to detected devices and the like.

Description

Technical Field

[0001] The invention relates to photoelectric device detection, in particular to a device for detecting the quality of semiconductor laser stack array packaging. Background Art

[0002] Semiconductor lasers have the advantages of small size, light weight, high efficiency, and long life, and have been widely used in various fields. Semiconductor laser arrays can output higher power and are widely used in material processing, pumping solid laser media, material surface treatment, etc. However, because the beam quality of semiconductor laser arrays is relatively poor, it is usually necessary to shape the fast-axis divergence angle and slow-axis divergence angle of the beam during use. In the process of making the array, the chips (bars) that constitute the array are not parallel or bent, which will seriously affect the beam shaping effect, thereby affecting its use. The chip bending caused by welding stress will also seriously affect the reliability and life of the semiconductor laser array.

[0003] At present, stress testing methods for semiconductor laser stacked arrays mainly rely on testing the "Smile" phenomenon and polarization contrast, etc., but these methods not only require the stacked array to be powered on, but also require the configuration of a complex optical system. Patent CN217276810U proposes a multi-bar stacked array laser spot quality test system. When the stacked array is powered on, the laser spot emitted by itself is amplified through a lens component and imaged onto the receiving screen, thereby identifying the spot quality of multiple bars. Patent CN117288440A proposes a laser linear array detection device for measuring the power and wavelength and spectral width of the laser linear array. Patent CN116889981A invented a semiconductor laser chip detection system for detecting whether the appearance of the chip to be tested is qualified. Patent CN117007524A invented a visual inspection device, namely a semiconductor laser AOI inspection system, which detects chips on a wafer through a video recording component. Patent CN117825012A discloses a semiconductor laser chip sintering firmness measurement system and method, which can accurately measure the sintering firmness and is a destructive testing method. In the existing patent technology, it is impossible to detect the bending of the chip (bar) without powering on the device under test, and it is impossible to detect the parallelism of the length direction of more than two chips (bars), the relative parallelism of the light-emitting cavity surface, etc., which affect the packaging quality of subsequent fast axis alignment, fiber coupling and other applications. Summary of the invention

[0004] The purpose of the present invention is to overcome the above-mentioned shortcomings in the existing semiconductor laser array packaging detection, and to provide a method and device for detecting the quality of semiconductor laser array packaging. The method does not require powering on the semiconductor laser array, is a simple non-destructive detection method, and has the advantages of simple structure and convenient operation.

[0005] The technical solution of the present invention is as follows:

[0006] A semiconductor laser array packaging quality detection device, which is characterized by comprising:

[0007] A light source module is used to output a laser beam with a specific divergence angle under the control of a computer control module to illuminate the semiconductor laser array to be tested;

[0008] An imaging and detection module, used to receive the laser beam reflected from the surface of the semiconductor laser stack array to be tested and generate image data;

[0009] A computer control module, used to control the working state of the light source module, and receive and process image data from the imaging and detection modules;

[0010] The semiconductor laser stack comprises at least one chip and is a conduction cooling package or a microchannel vertical stack package. The laser beam emitted by the light source module is fan-shaped and has divergence angles in two different directions, one with a larger divergence angle and the other with a smaller divergence angle, so as to facilitate observation and avoid mutual interference between reflected beams of adjacent chips.

[0011] The light source module includes a light source with angle control for the light source and a light source capable of emitting fan-shaped laser. The laser emitted by the laser light source is fan-shaped. The laser light source has a larger divergence angle in one direction and a smaller divergence angle in another direction. The laser emitted by the laser light source can be red light, blue light, green light, etc.

[0012] Preferably, the divergence angles are 60° and 1° respectively.

[0013] The device under test may be a semiconductor laser stack, including one chip (bar) or multiple chips (bars); the device under test may be in a conduction cooling package or in a microchannel vertical stack package.

[0014] The imaging and detection module collects and images the light beam reflected by the surface of the chip of the device under test, and can image it to a CCD camera through a receiving screen or an optical system, and is collected and stored by a computer control module and control software.

[0015] Compared with the prior art, the present invention has the following advantages:

[0016] 1. The light source module of the present invention adopts a unique laser beam design, that is, the emitted laser beam is fan-shaped and has divergence angles in two different directions. The divergence angle in one direction is relatively large (such as 60° full angle), so that the laser beam can be widened when irradiating the surface of the device to be tested, thereby facilitating the observation of the packaging quality of the entire chip (bar). The divergence angle in the other direction is relatively small (such as 1° full angle), which ensures that the reflected light beams of adjacent chips will not interfere with each other, thereby improving the accuracy and reliability of the detection.

[0017] 2. The present invention does not need to power on the device under test, which greatly reduces the possibility of device damage. At the same time, the test structure is very simple and easy to operate. It can not only detect the bending of the chip (bar) caused by the packaging process, but also detect the parallelism of multiple chips (bars), detect chip surface damage or the presence of large contaminants, etc.

[0018] 3. It can be applied to semiconductor laser arrays in conduction cooling packaging and microchannel vertical stacking packaging. These two packaging forms are widely used in the field of semiconductor lasers, but their packaging structures and characteristics are different, and the requirements for detection devices are also different. The detection device of the present invention can achieve accurate and reliable detection of semiconductor laser arrays in these two packaging forms by flexibly adjusting the working parameters of the light source module and the imaging and detection module. This wide applicability makes the detection device of the present invention have higher practical value in the field of semiconductor laser manufacturing and quality control. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments or technical solutions of the present invention, the following is a brief introduction to the drawings required for use in the embodiments or technical descriptions. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other similar drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a structural block diagram of a device for detecting the quality of semiconductor laser stack array packaging according to an embodiment of the present invention;

[0021] Figure 2 is a schematic diagram of a laser beam emitted by a laser light source in a light source module according to an embodiment of the present invention;

[0022] Figure 3 This is a detection schematic diagram of Example 2 of the present invention;

[0023] Figure 4 The test results of Example 2 of the present invention (4 chips);

[0024] Figure 5 This is a schematic diagram of placement of the device under test according to Embodiment 3 of the present invention;

[0025] Figure 6 The test results of Example 3 of the present invention (6 chips). DETAILED DESCRIPTION

[0026] The present invention will be further described below in conjunction with the embodiments and drawings, but this should not be used to limit the protection of the present invention.

[0027] Please refer to Figure 1 , Figure 1 This is a structural block diagram of a semiconductor laser stack array packaging quality detection device according to an embodiment of the present invention. As shown in the figure, a semiconductor laser stack array packaging quality detection device includes a light source module 12, a computer control module 13, and an imaging and detection module 14.

[0028] The light source module 12 outputs a laser beam with a certain divergence angle (such as Figure 2 ), irradiating the device under test 11. The surface of the device under test 11 reflects the laser beam, and the reflected beam is received by the imaging and detection module 14, and the computer control module 13 collects and analyzes the image.

[0029] The device under test 11 is a semiconductor laser stack, which may include one or more chips (bars), and may be a conduction cooling package or a microchannel vertical stack package.

[0030] Figure 2 FIG. 1 is a schematic diagram of a laser beam emitted by a laser light source in a light source module according to an embodiment of the present invention, showing the divergence angles of the laser beam in two different directions. Figure 2 As shown, the laser beam emitted by the light source module 12 is fan-shaped, with a larger divergence angle in one direction (such as 60° full angle) and a smaller divergence angle in the other direction (such as 1° full angle). This design allows the laser beam to be broadened after being reflected from the chip surface for easy observation, while not causing interference between the reflected beams of adjacent chips.

[0031] Figure 2 This is a schematic diagram of the laser light beam emitted by the laser light source in the test light source module of Example 1 of the present invention. The laser light beam has a larger divergence angle in one direction, such as 60° (full angle), so that the image is widened after being reflected by the chip of the device under test, which is convenient for observation; the light beam divergence angle in another direction is smaller, such as 1° (full angle), so that the image is widened to a certain extent after being reflected by the chip of the device under test, and the reflected light beams of two adjacent chips will not interfere with each other.

[0032] Figure 3 is a detection schematic diagram of Example 2 of the present invention, Figure 3 (A) is a top view of the device under test 31. Figure 3(B) is the front view of the device under test 31. The device under test 31 includes four chips (bars) 31-1. The light source module 32 emits a fan-shaped laser beam 32-1 with a certain divergence angle under the control of the computer control module. The fan-shaped laser beam 32-1 is reflected by the surface of the chip (bar) 31-1 of the device under test 31. The reflected beam 34-1 is then imaged and data collected by the imaging and detection module 34. Since the reflectivity of the other areas on the upper surface of the device under test 31 except for the chip 31-1 (bar) is very low, this area cannot be imaged by the imaging and detection module 34. The test results are shown in Figure 3. Figure 4 shown.

[0033] Figure 5 This is a detection schematic diagram of Example 3 of the present invention, Figure 5 (A) is a top view of the device under test 51. Figure 5 (B) is the main view of the device under test 51. The device under test 51 includes 6 chips (bars) 51-1. The light source module 52 emits a fan-shaped laser beam 52-1 with a certain divergence angle under the control of the computer control module and the control software. The fan-shaped laser beam 52-1 is reflected by the surface of the chip (bar) 51-1 of the device under test 51. The reflection area of ​​the laser beam 52-1 on the device under test is the virtual frame position 51-2. The reflected beam 54-1 is then imaged and data collected by the imaging and detection module 54. Since the reflectivity of the other areas on the upper surface of the device under test 51 except the chip (bar) 51-1 is very low, this area cannot be imaged by the imaging and detection module 54. The test results are as follows: Figure 6 shown.

[0034] The present invention realizes non-destructive testing of the packaging quality of semiconductor laser arrays by irradiating the semiconductor laser array under test with a laser beam of a specific divergence angle and collecting and analyzing the image data of the reflected beam. This method is not only simple and fast, but also can accurately evaluate the packaging quality of the device under test, which is of great significance for improving the performance and reliability of semiconductor laser arrays.

Claims

1. A device for detecting the quality of semiconductor laser array packaging, characterized in that: include: A light source module (12) is used to output a laser beam with a specific divergence angle under the control of a computer control module (13) to illuminate the semiconductor laser array to be tested; An imaging and detection module (14) is used to receive the laser beam reflected by the surface of the semiconductor laser array to be tested and generate image data; A computer control module (13) for controlling the working state of the light source module (12) and receiving and processing image data from the imaging and detection module (14); The semiconductor laser stack comprises at least one chip and is in a conduction cooling package or a microchannel vertical stack package. The laser beam emitted by the light source module (12) is fan-shaped and has divergence angles in two different directions, one direction having a larger divergence angle and the other direction having a smaller divergence angle, so as to facilitate observation and avoid mutual interference between reflected beams of adjacent chips.

2. The semiconductor laser array packaging quality detection device according to claim 1, characterized in that: The color of the laser light beam emitted by the light source module (12) is red light, blue light or green light.

3. The semiconductor laser array packaging quality detection device according to claim 1, characterized in that: The divergence angles are 60° and 1° respectively.

4. The semiconductor laser array packaging quality detection device according to claim 1, characterized in that: The imaging and detection module (14) comprises a receiving screen or an optical system and a CCD camera, and is used for imaging the received reflected light beam and converting it into image data.

5. The device for detecting the quality of semiconductor laser array packaging according to any one of claims 1 to 4, characterized in that: The computer control module (13) comprises control software and a data processing unit, and is used to control the on and off of the light source module (12), adjust the divergence angle of the laser beam, and collect, store and analyze image data generated by the imaging and detection module (14).

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