Monocrystalline silicon wafer sample preparation process and sample preparation equipment

Abstract

The invention relates to the technical field of monocrystalline silicon wafer sample preparation, in particular to a monocrystalline silicon wafer sample preparation process and sample preparation device.The monocrystalline silicon wafer sample preparation process comprises the following steps that S1, feeding is conducted, specifically, an original monocrystalline silicon wafer is fed to a designated position manually or through a feeding mechanical arm; s2, identification: identifying bar code information of the original monocrystalline silicon wafer through a visual identification system; s3, cutting and marking: cutting the raw monocrystalline silicon wafer into a coarse sample with a set size through a cutting device, and then assigning a code to the coarse sample through a marking device; s4, grinding: conveying the coarse sample to a grinding device, and grinding the two surfaces of the coarse sample by the grinding device to prepare a sample sheet; and S5, collecting: collecting the manufactured sample wafers in a unified manner. The invention provides an innovative sample preparation process which can replace an acid pickling process, so that the labor is reduced, the cost is reduced, and the production efficiency and the productivity are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of single crystal silicon wafer sample preparation, and in particular to a single crystal silicon wafer sample preparation process and sample preparation equipment. Background Art

[0002] In the prior art, the preparation of silicon wafer oxygen carbon wafer samples mainly relies on manual operation, using a diamond pen to knock the wafer to prepare the sample, and using a manual diamond pen to carve the sample number, and finally the sample is manually pickled.

[0003] The shortcomings of the prior art are as follows:

[0004] 1. Manual sampling is time-consuming, usually taking about 1.5 hours, resulting in low work efficiency.

[0005] 2. The samples need to be manually transported to the processing site for processing, which increases additional labor costs and management difficulties.

[0006] 3. Due to the existence of a large number of work-in-progress, the production capacity of the machining site has dropped significantly, with the capacity loss reaching 50%.

[0007] 4. The pickling process relies on manual handling, which not only increases the pickling cost, but also causes a waste of man-hours.

[0008] In summary, the existing silicon wafer oxygen carbon wafer sample preparation method has many shortcomings and urgently needs to be improved to improve production efficiency and reduce costs. Summary of the invention

[0009] The purpose of the present invention is to provide a single crystal silicon wafer sample preparation process, which proposes an innovative sample preparation process that can replace the pickling process, reduce labor, reduce costs, and improve production efficiency and capacity.

[0010] Another object of the present invention is to provide a sample preparation device, which can replace the pickling process, reduce labor, reduce costs, and improve production efficiency and capacity.

[0011] The technical solution of the present invention is achieved in this way:

[0012] A single crystal silicon wafer sample preparation process comprises the following steps:

[0013] S1. Loading: Load the original single crystal silicon wafer to the designated position manually or by a loading robot;

[0014] S2, identification: identifying the barcode information of the original single crystal silicon wafer through the visual recognition system;

[0015] S3, cutting and marking: the single crystal silicon wafer is cut into a rough sample of a set size by a cutting device, and then the rough sample is coded by a marking device; or, the marking device is used to code a designated position on the single crystal silicon wafer, and then the cutting device is used to cut a rough sample of a set size according to the coded area on the single crystal silicon wafer;

[0016] S4, grinding: the rough sample is conveyed to the grinding device, and the grinding device grinds both sides of the rough sample to make a sample sheet;

[0017] S5. Collection: Collect the prepared samples together.

[0018] Furthermore, in the step S3, the set size is 50 mm×50 mm.

[0019] A sample preparation device applied to the single crystal silicon wafer sample preparation process, comprising:

[0020] The frame, serving as the supporting body;

[0021] A positioning frame, arranged on the frame, the positioning frame having a positioning storage position for placing the single crystal silicon wafer;

[0022] A first conveying mechanism is arranged on the frame;

[0023] A material taking mechanism, arranged on the first conveying mechanism, the material taking mechanism can move in the X direction, the Y direction and the Z direction through the first conveying mechanism, and the material taking mechanism is used to suck or clamp the single crystal silicon wafer;

[0024] A visual recognition system, arranged on the material taking mechanism, for identifying the barcode information of the single crystal silicon wafer placed on the positioning frame;

[0025] A second conveying mechanism is arranged on the frame;

[0026] A cutting and marking suction cup is arranged on the second conveying mechanism, the cutting and marking suction cup is used to absorb the single crystal silicon wafer placed on the top thereof, and the second conveying mechanism can drive the cutting and marking suction cup to translate in the X direction and the Y direction;

[0027] A cutting device, arranged on the frame, for cutting the single crystal silicon wafer placed on the cutting and marking suction cup;

[0028] A marking device, arranged on the frame, for performing a coding operation on the single crystal silicon wafer placed on the cutting and marking suction cup;

[0029] The coarse sample unloading rack is arranged on the frame, and the coarse sample unloading rack has a coarse sample storage position for placing the coarse sample.

[0030] Further, the first conveying mechanism includes a first X-direction linear module, a first Y-direction linear module and a first Z-direction linear module;

[0031] The first Y-direction linear module is installed on the frame, the first X-direction linear module is installed on the first Y-direction linear module, the first Z-direction linear module is arranged on the first X-direction linear module, the first Y-direction linear module is used to drive the first X-direction linear module to translate along the Y-direction, and the first X-direction linear module is used to drive the first Z-direction linear module to translate along the X-direction;

[0032] Alternatively, the first X-direction linear module is installed on the frame, the first Y-direction linear module is installed on the first X-direction linear module, the first Z-direction linear module is arranged on the first Y-direction linear module, the first X-direction linear module is used to drive the first Y-direction linear module to translate along the X-direction, and the first Y-direction linear module is used to drive the first Z-direction linear module to translate along the Y-direction.

[0033] Further, the second conveying mechanism includes a second X-axis linear module and a second Y-axis linear module;

[0034] The second X-direction linear module is installed on the frame, the second Y-direction linear module is installed on the second X-direction linear module, and the cutting and marking suction cup is installed on the second Y-direction linear module;

[0035] Alternatively, the second Y-direction linear module is installed on the frame, the second X-direction linear module is installed on the second Y-direction linear module, and the cutting and marking suction cup is installed on the second X-direction linear module.

[0036] Furthermore, the cutting device includes a laser cutter and a second Z-direction linear module, the laser cutter is mounted on the frame via the second Z-direction linear module, and the second Z-direction linear module can drive the laser cutter to rise and fall in the Z direction.

[0037] Furthermore, the marking device includes a laser marker and a third Z-direction linear module, the laser marker is installed on the frame through the third Z-direction linear module, and the third Z-direction linear module can drive the laser marker to rise and fall in the Z direction.

[0038] Furthermore, it also includes a residual material unloading rack, which is arranged on the frame, and the residual material unloading rack has a residual material storage position for placing residual materials.

[0039] Furthermore, it also includes a loading rack, which is arranged on the frame, and the loading rack has a loading storage position for placing single crystal silicon wafers.

[0040] Furthermore, it also includes a grinding device and a grinding frame arranged on the frame, the grinding frame has a grinding station for placing the rough sample to be ground, the grinding head at the output end of the grinding device is arranged corresponding to the grinding station, and the grinding device is used to grind the rough sample to make a sample.

[0041] Compared with the prior art, the present invention has the following beneficial effects:

[0042] The present application proposes an innovative solution, which utilizes a visual recognition system to identify the barcode information of the original single crystal silicon wafer, and then uses a cutting device and a marking device to cut and code it to make a rough sample (rough sample), and then uses a grinding device to grind both sides of the rough sample to make a final sample. This innovative process uses water washing, grinding and polishing to replace the acid washing process. Not only is the mean difference of the oxygen and carbon content detection data within ±5%, which can meet the quality inspection requirements, but it also reduces labor, reduces costs, and can improve production efficiency and capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0044] Figure 1 This is a flow chart of the single crystal silicon wafer sample preparation process of the present invention;

[0045] Figure 2 It is a structural schematic diagram of the sample preparation device of the present invention;

[0046] Figure 3 It is a structural schematic diagram of another viewing angle of the sample preparation device of the present invention;

[0047] Figure 4 This is a schematic diagram of the front view structure of the sample preparation device of the present invention;

[0048] Figure 5 It is a schematic structural diagram of the cutting and marking suction cup of the present invention.

[0049] In the figure:

[0050] 1-frame; 2-loading rack; 3-positioning rack; 4-first conveying mechanism;

[0051] 401-first Y-direction linear module; 402-first X-direction linear module; 403-first Z-direction linear module;

[0052] 5-feeding mechanism; 501-mounting frame; 502-vacuum suction head;

[0053] 6-CCD camera;

[0054] 7-second conveying mechanism; 701-second Y-direction linear module; 702-second X-direction linear module;

[0055] 8-cutting and marking suction cup; 801-slit groove; 802-air suction hole;

[0056] 9-cutting device; 901-laser cutter; 902-second Z-direction linear module;

[0057] 10- marking device; 1001- laser marker; 1002- third Z-direction linear module;

[0058] 11-rough sample unloading rack; 12-residue material unloading rack; 13-I-beam frame; 14-electric control cabinet. DETAILED DESCRIPTION

[0059] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0060] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0061] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0062] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0063] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0064] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0065] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0066] Example 1

[0067] Reference Figure 1 This embodiment provides a single crystal silicon wafer sample preparation process, comprising the following steps:

[0068] S1. Loading: Load the original single crystal silicon wafer to the designated position manually or by a loading robot;

[0069] S2, identification: identifying the barcode information of the original single crystal silicon wafer through the visual recognition system;

[0070] S3, cutting and marking: the single crystal silicon wafer original piece is cut into a rough sample of a set size by the cutting device 9, and then the rough sample is coded by the marking device 10; or, the marking device 10 codes a designated position on the single crystal silicon wafer original piece, and then the cutting device 9 cuts a rough sample of a set size according to the coded area on the single crystal silicon wafer original piece;

[0071] S4, grinding: the rough sample is conveyed to the grinding device, and the grinding device grinds both sides of the rough sample to make a sample sheet;

[0072] S5. Collection: Collect the prepared samples together.

[0073] Since there are many types of single crystal silicon wafers, each single crystal silicon wafer has barcode information on it. The visual recognition system can identify it by scanning the barcode information on it, for example, its diameter, thickness, etc.

[0074] The visual recognition system, cutting device 9, marking device 10 and grinding device are electrically connected to the main electric control system, and the main electric control system electrically controls them to improve the degree of automation. Multiple sets of operating programs can be programmed into the main electric control system, and these multiple sets of operating programs can be switched according to different types of single crystal silicon wafers identified by the visual recognition system. Each type of single crystal silicon wafer can correspond to an operating program to run different cutting schemes, marking schemes and grinding schemes.

[0075] In general, this process can be compatible with the sampling of various types of single-crystal silicon wafers. The barcode information of the original single-crystal silicon wafer is identified by a visual recognition system, and then the cutting device 9 and the marking device 10 are used to cut and code it to make a rough sample (rough sample), and then the rough sample is ground on both sides by a grinding device to make a final sample. This innovative process uses water washing, grinding and polishing to replace the acid washing process. Not only is the mean difference of the oxygen and carbon content detection data within ±5%, which can meet the quality inspection requirements, but it also reduces labor, reduces costs, and can improve production efficiency and capacity.

[0076] In this embodiment, the sample produced is a square sample with a side length of 50 mm, that is, in the step S3, the set size is 50 mm×50 mm.

[0077] It should be noted that the above-mentioned multiple operating programs are completed by programming on the main electronic control system, and the programmed computer programs are diverse. In short, it is possible to encode multiple operating programs on the main electronic control system, but computer programs do not fall within the scope of protection of this application and will not be described in detail.

[0078] Example 2

[0079] like Figure 2-Figure 5 This embodiment provides a sample preparation device applied to the above-mentioned single crystal silicon wafer sample preparation process, including:

[0080] Frame 1, serving as a supporting body;

[0081] A loading rack 2 is arranged on the frame 1, and the loading rack 2 has a loading storage position for placing single crystal silicon wafers;

[0082] A positioning frame 3 is arranged on the frame 1, and the positioning frame 3 has a positioning storage position for placing a single crystal silicon wafer;

[0083] A first conveying mechanism 4 is arranged on the frame 1;

[0084] A material taking mechanism 5, which is arranged on the first conveying mechanism 4, and the material taking mechanism 5 can move in the X direction, the Y direction and the Z direction through the first conveying mechanism 4, and the material taking mechanism 5 is used to suck or clamp the single crystal silicon wafer;

[0085] A visual recognition system, arranged on the material taking mechanism 5, for identifying the barcode information of the single crystal silicon wafer placed on the positioning frame 3;

[0086] A second conveying mechanism 7 is arranged on the frame 1;

[0087] A cutting and marking suction cup 8 is arranged on the second conveying mechanism 7. The cutting and marking suction cup 8 is used to absorb the single crystal silicon wafer placed on the top thereof. The second conveying mechanism 7 can drive the cutting and marking suction cup 8 to move in the X direction and the Y direction.

[0088] A cutting device 9, arranged on the frame 1, for cutting the single crystal silicon wafer placed on the cutting and marking suction cup 8;

[0089] The marking device 10 is arranged on the frame 1 and is used for performing a coding operation on the single crystal silicon wafer placed on the cutting and marking suction cup 8;

[0090] A rough sample unloading rack 11 is arranged on the frame 1, and the rough sample unloading rack 11 has a rough sample storage position for placing the rough sample;

[0091] The residual material unloading rack 12 is arranged on the frame 1, and the residual material unloading rack 12 has a residual material storage position for placing residual materials.

[0092] The following is a detailed description of the above structure:

[0093] First, the original monocrystalline silicon wafer is placed in the loading storage position of the loading rack 2 by manual loading or automatic loading by a robot for initial positioning, that is, the monocrystalline silicon wafer is originally placed uniformly in the original wafer storage position, and the operation of taking the monocrystalline silicon wafer from the original wafer storage position to the loading rack 2 can be completed by manual picking or automatic picking by a robot. The original monocrystalline silicon wafer is placed in the designated position of the loading storage position, and the top surface of the loading rack 2 is marked with a positioning center point. When loading, the center point of the monocrystalline silicon wafer is aligned with the positioning point on the loading rack 2 for initial positioning.

[0094] After the loading is completed, since the material picking mechanism 5 can move freely in the X, Y and Z directions through the first conveying mechanism 4, the first conveying mechanism 4 drives the material picking mechanism 5 to move to the top of the loading storage position to perform the material picking action. The material picking mechanism 5 can adopt a vacuum suction structure, which includes a mounting frame 501 and a vacuum suction head 502. A plurality of vacuum suction heads 502 are evenly installed at the bottom of the mounting frame 501. The mounting frame 501 is connected and fixed with the slider on the first Z-direction linear module 403 through a plurality of bolts. The suction end of the bottom end of the vacuum suction head 502 is set downward, and the other end of the vacuum suction head 502 is connected to the negative pressure device, and the negative pressure device provides negative pressure. The material picking mechanism 5 absorbs and fixes the suction ends of the plurality of vacuum suction heads 502 by placing them flat on the upper surface of the single crystal silicon wafer. Then, the material picking mechanism 5 absorbs the single crystal silicon wafer located at the loading storage position and places it on the positioning storage position on the positioning frame 3. The positioning frame 3 also has a positioning point. After the single crystal silicon wafer is placed in the positioning storage position, the center point of the single crystal silicon wafer is aligned with the positioning point of the positioning frame 3 to achieve secondary positioning.

[0095] After the single crystal silicon wafer is positioned twice at the positioning storage position, it is identified by a visual recognition system, which includes a CCD camera 6, which is mounted on the mounting frame 501 of the material taking mechanism 5, and the camera of the CCD camera 6 is facing directly downward. During identification, the first conveying mechanism 4 drives the CCD camera 6 so that the camera of the CCD camera 6 is located directly above the single crystal silicon wafer in the positioning storage position, and the CCD camera 6 scans the barcode on the single crystal silicon wafer to identify the information of the single crystal silicon wafer. A rangefinder is also provided on the mounting frame 501, which is driven by the first conveying mechanism 4 to make the rangefinder mark the position of the positioning point of the positioning frame 3 (the movement of the rangefinder in this step is pre-set by the program, and the distance between the rangefinder and the top surface of the positioning member is fixed and known), and then the distance to the surface of the single crystal silicon wafer is measured by the rangefinder, so that the thickness of the single crystal silicon wafer can be indirectly measured.

[0096] The structure of the first conveying mechanism 4 is as follows:

[0097] The first conveying mechanism 4 includes a first X-direction linear module 402, a first Y-direction linear module 401 and a first Z-direction linear module 403;

[0098] The first Y-direction linear module 401 is installed on the frame 1, the first X-direction linear module 402 is installed on the first Y-direction linear module 401, and the first Z-direction linear module 403 is arranged on the first X-direction linear module 402. The first Y-direction linear module 401 is used to drive the first X-direction linear module 402 to translate along the Y-direction, and the first X-direction linear module 402 is used to drive the first Z-direction linear module 403 to translate along the X-direction.

[0099] Alternatively, the first X-direction linear module 402 is installed on the frame 1, the first Y-direction linear module 401 is installed on the first X-direction linear module 402, and the first Z-direction linear module 403 is arranged on the first Y-direction linear module 401. The first X-direction linear module 402 is used to drive the first Y-direction linear module 401 to translate along the X-direction, and the first Y-direction linear module 401 is used to drive the first Z-direction linear module 403 to translate along the Y-direction.

[0100] A preferred implementation in this embodiment is as follows: the first Y-axis linear module 401 is set as two and the two first Y-axis linear modules 401 are respectively installed in parallel on the frame 1 through the I-beam 13, the two ends of the first X-axis linear module 402 are respectively installed on the sliders on the two first Y-axis linear modules 401, the two first Y-axis linear modules 401 operate synchronously to drive the first X-axis linear module 402 to translate in the Y direction, the first Z-axis linear module 403 is installed on the slider of the first X-axis linear module 402, the first X-axis linear module 402 operates to drive the first Z-axis linear module 403 and the material picking mechanism 5 to translate in the X direction, the mounting frame 501 of the material picking mechanism 5 is installed on the slider of the first Z-axis linear module 403, and the first Z-axis linear module 403 operates to drive the material picking mechanism 5 to move up and down in the Z direction.

[0101] As described in Example 1, according to the information or model of the single crystal silicon wafer identified by the visual recognition system, the main electronic control system will switch to the corresponding operating program. Then, the first conveying mechanism 4 sucks the single crystal silicon wafer on the positioning frame 3 and places it on the cutting and marking suction cup 8. The cutting and marking suction cup 8 has an air cavity. The top of the cutting and marking suction cup 8 is a planar structure and has a plurality of suction holes 802 connected to the air cavity. The side or bottom of the cutting and marking suction cup 8 is provided with a suction port connected to the air cavity. The suction port is sealed and connected to the negative pressure device. The negative pressure device is used to evacuate air and generate negative pressure in the air cavity and at the suction hole 802. When the single crystal silicon wafer is placed on the cutting and marking suction cup 8, it is adsorbed and fixed by the negative pressure of the suction hole 802.

[0102] It should be noted that the sample to be produced in this embodiment is a square sample, and a square rough sample needs to be cut out from the single crystal silicon wafer. Therefore, a square gap groove 801 (such as Figure 5 ), so that the cutting device 9 does not destroy or damage the cutting and marking suction cup 8 during cutting.

[0103] The second conveying mechanism 7 can drive the cutting and marking suction cup 8 to move horizontally in the X direction and the Y direction. When a cutting operation is required, the second conveying mechanism 7 translates the single crystal silicon wafer placed on the cutting and marking suction cup 8 to directly below the cutting device 9 for cutting operation; when a marking operation is required, the second conveying mechanism 7 translates the single crystal silicon wafer placed on the cutting and marking suction cup 8 to directly below the marking device 10 for marking operation.

[0104] The structure of the second conveying mechanism 7 is as follows:

[0105] The second conveying mechanism 7 includes a second X-axis linear module 702 and a second Y-axis linear module 701;

[0106] The second X-direction linear module 702 is installed on the frame 1 , the second Y-direction linear module 701 is installed on the second X-direction linear module 702 , and the cutting and marking suction cup 8 is installed on the second Y-direction linear module 701 ;

[0107] Alternatively, the second Y-direction linear module 701 is installed on the frame 1 , the second X-direction linear module 702 is installed on the second Y-direction linear module 701 , and the cutting and marking suction cup 8 is installed on the second X-direction linear module 702 .

[0108] A preferred implementation method in this embodiment is: the second Y-direction linear module 701 is installed on the frame 1, the second X-direction linear module 702 is installed on the slider of the second Y-direction linear module 701, the second Y-direction linear module 701 runs to drive the second X-direction linear module 702 and the cutting and marking suction cup 8 to translate in the Y direction, the cutting and marking suction cup 8 is installed on the slider of the second X-direction linear module 702, and the second X-direction linear module 702 runs to drive the cutting and marking suction cup 8 to translate in the X direction.

[0109] The cutting device 9 includes a laser cutter 901 and a second Z-direction linear module 902 . The laser cutter 901 is installed on the frame 1 through the second Z-direction linear module 902 , and the second Z-direction linear module 902 can drive the laser cutter 901 to rise and fall in the Z direction.

[0110] The marking device 10 includes a laser marker 1001 and a third Z-direction linear module 1002 . The laser marker 1001 is installed on the frame 1 through the third Z-direction linear module 1002 , and the third Z-direction linear module 1002 can drive the laser marker 1001 to rise and fall in the Z direction.

[0111] In this embodiment, the first X-axis linear module 402, the first Y-axis linear module 401, the first Z-axis linear module 403, the second X-axis linear module 702, the second Y-axis linear module 701, the second Z-axis linear module 902 and the third Z-axis linear module 1002 are all linear module structures. The linear modules are existing technologies and their specific structures are not described herein.

[0112] In this embodiment, the single crystal silicon wafer adsorbed on the cutting and marking suction cup 8 can be cut first and then marked, specifically as follows: the single crystal silicon wafer placed on the cutting and marking suction cup 8 is translated to the bottom of the laser cutter 901 by the second conveying mechanism 7 to perform a cutting operation to form a rough sample (the cutting action is performed according to the program set in the main electronic control system). After the cutting is completed, the second conveying mechanism 7 translates the rough sample placed on the cutting and marking suction cup 8 to the bottom of the laser marker 1001 to perform a marking operation to complete the coding of the rough sample (the marking action is performed according to the program set in the main electronic control system). After the cutting and marking are completed, the second conveying mechanism 7 returns to its original position, and then the first conveying mechanism 4 respectively sucks the rough sample and places it in the rough sample storage position of the rough sample unloading rack 11, and sucks the cut residual material and places it in the residual material storage position of the residual material unloading rack 12.

[0113] An electric control cabinet 14 is also provided on the frame 1. The main electric control system is arranged in the electric control cabinet 14, which can detect the voltage, current, temperature parameters of the equipment, etc., and can also control the original parts through switches, buttons and display screens to realize the start, stop, speed regulation, and automatic control of the equipment.

[0114] In this embodiment, the sample preparation equipment is suitable for circular single crystal silicon wafers, the diameter of the cut single crystal silicon wafers ranges from 240 mm to 320 mm, and the thickness ranges from 1 mm to 2.5 mm. The size of the sample produced is a square sample of 50 mm×50 mm.

[0115] In summary, the sample preparation process of the sample preparation equipment is:

[0116] S1, loading: manually or by a loading robot, the original single crystal silicon wafer is loaded to the loading storage position for initial positioning (the center point of the single crystal silicon wafer is aligned with the positioning point of the loading rack 2), and then the first conveying mechanism 4 sucks the single crystal silicon wafer from the loading storage position and places it in the positioning storage position for secondary positioning (the center point of the single crystal silicon wafer is aligned with the positioning point of the positioning rack 3);

[0117] S2, identification: the barcode information of the original single crystal silicon wafer is identified by the visual recognition system, the thickness of the single crystal silicon wafer is measured by the distance meter, and the main electric control system switches to the corresponding operation program according to the information of the single crystal silicon wafer identified by the system;

[0118] S3, cutting and marking: the single crystal silicon wafer is cut into rough samples of set sizes by the cutting device 9, and then the rough samples are coded by the marking device 10.

[0119] The sample preparation equipment provided in this embodiment can only complete steps S1 to S3 of the single crystal silicon wafer sample preparation process in Example 1. As for steps S4 and S5, additional transfer robots and grinding devices are required. The transfer robots transfer the rough sample from the rough sample storage position to the grinding platform of the grinding device, and then the grinding device grinds both sides of the rough sample to finally make a sample. It should be noted that in this embodiment, grinding the rough sample belongs to the next process of the sample preparation equipment, which is used as a supplementary explanation and is not included in the scope of protection.

[0120] Example 3

[0121] This embodiment provides a sample preparation device, which is based on the embodiment 2 and adds a grinding device. The grinding device is arranged on the frame 1, and the grinding device includes an electric grinding head and a fourth Z-direction linear module. The fourth Z-direction linear module is installed on the frame 1, and the electric grinding head is installed on the slider of the fourth Z-direction linear module, and the fourth Z-direction linear module is driven to move up and down in the Z direction. It should be noted that: in this embodiment, the rough sample storage position of the rough sample unloading rack 11 is not used to place the rough sample, but to place the sample after the rough sample is polished. Therefore, after the cutting and marking operations, the second conveying mechanism 7 drives the rough sample on the cutting and marking suction cup 8 to move horizontally to the bottom of the electric grinding head, and then the fourth Z-axis linear module drives the electric grinding head to descend to a suitable position to grind the rough sample. After one side of the rough sample is polished, the rough sample can be turned over manually to polish the other side. After both sides of the rough sample are polished, a sample piece is made, and then the second conveying mechanism 7 returns to its original position, and then the first conveying mechanism 4 sucks the sample on the cutting and marking suction cup 8 and places it in the rough sample storage position for unified collection, and places the residual material in the residual material storage position for unified collection, thereby completing the sample preparation.

[0122] It should be noted that a turning robot can also be arranged on the frame 1 to replace manual turning over of the rough sample. After one side of the rough sample is polished, the turning robot turns over the rough sample (as a supplementary explanation).

[0123] In this embodiment, by adding a grinding device on the basis of the technical solution of Embodiment 2, all steps of the single crystal silicon wafer sample preparation process in Embodiment 1 (ie, step S1 to step S5) can be completed at one time.

[0124] The beneficial effects of the technical solution of the present invention are:

[0125] The present application proposes an innovative solution, which utilizes a visual recognition system to identify the barcode information of the original single crystal silicon wafer, and then uses a cutting device 9 and a marking device 10 to cut and code it to make a rough sample (rough sample), so as to replace the manual knocking and manual engraving methods in the prior art, and then uses a grinding device to grind both sides of the rough sample to make a final sample. This innovative process uses water washing, grinding and polishing to replace the acid washing process. Not only is the mean difference of the oxygen and carbon content detection data within ±5%, which can meet the quality inspection requirements, but it also reduces labor, reduces costs, and can improve production efficiency and capacity.

[0126] 1. Benefits of staff reduction: Enhance the degree of automation, eliminate manual knocking, manual sample number engraving, and manual pickling, and achieve manpower reduction and labor reduction;

[0127] 2. Cost saving: The single crystal silicon wafer sample preparation process of the present application replaces the pickling process of the prior art, saving about RMB 93,000 per year;

[0128] 3. Reduction in in-process and improvement in production capacity: The in-process turnover is accelerated, reducing the waiting time for carbon and oxygen testing in the round bar warehouse by 2 hours.

[0129] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

[0130] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A single crystal silicon wafer sample preparation process, characterized in that: The following steps are involved: S1. Loading: Load the original single crystal silicon wafer to the designated position manually or by a loading robot; S2, identification: identifying the barcode information of the original single crystal silicon wafer through the visual recognition system; S3, cutting and marking: the single crystal silicon wafer original piece is cut into a rough sample of a set size by a cutting device (9), and then the rough sample is coded by a marking device (10); or, the marking device (10) codes a designated position on the single crystal silicon wafer original piece, and then the cutting device (9) cuts out a rough sample of a set size based on the coded area on the single crystal silicon wafer original piece; S4, grinding: the rough sample is conveyed to the grinding device, and the grinding device grinds both sides of the rough sample to make a sample sheet; S5. Collection: Collect the prepared samples together.

2. The single crystal silicon wafer sample preparation process according to claim 1, characterized in that: In step S3, the set size is 50 mm×50 mm.

3. A sample preparation device, applied to the single crystal silicon wafer sample preparation process according to any one of claims 1-2, characterized in that: include: A frame (1) serving as a supporting body; A positioning frame (3) is arranged on the frame (1), and the positioning frame (3) has a positioning storage position for placing the single crystal silicon wafer; A first conveying mechanism (4) is arranged on the frame (1); A material taking mechanism (5) is arranged on the first conveying mechanism (4), and the material taking mechanism (5) can move in the X direction, the Y direction and the Z direction through the first conveying mechanism (4), and the material taking mechanism (5) is used to suck or clamp the single crystal silicon wafer; A visual recognition system, arranged on the material taking mechanism (5), for identifying the barcode information of the single crystal silicon wafer placed on the positioning frame (3); A second conveying mechanism (7) is arranged on the frame (1); A cutting and marking suction cup (8) is arranged on the second conveying mechanism (7), the cutting and marking suction cup (8) is used to absorb the single crystal silicon wafer placed on the top thereof, and the second conveying mechanism (7) can drive the cutting and marking suction cup (8) to move in the X direction and the Y direction; A cutting device (9), arranged on the frame (1), for cutting the single crystal silicon wafer placed on the cutting and marking suction cup (8); A marking device (10), arranged on the frame (1), for performing a coding operation on the single crystal silicon wafer placed on the cutting and marking suction cup (8); A coarse sample unloading rack (11) is arranged on the frame (1), and the coarse sample unloading rack (11) has a coarse sample storage position for placing the coarse sample.

4. The sample preparation device according to claim 3, characterized in that: The first conveying mechanism (4) comprises a first X-direction linear module (402), a first Y-direction linear module (401) and a first Z-direction linear module (403); The first Y-direction linear module (401) is installed on the frame (1), the first X-direction linear module (402) is installed on the first Y-direction linear module (401), the first Z-direction linear module (403) is arranged on the first X-direction linear module (402), the first Y-direction linear module (401) is used to drive the first X-direction linear module (402) to translate along the Y-direction, and the first X-direction linear module (402) is used to drive the first Z-direction linear module (403) to translate along the X-direction; Alternatively, the first X-direction linear module (402) is mounted on the frame (1), the first Y-direction linear module (401) is mounted on the first X-direction linear module (402), the first Z-direction linear module (403) is arranged on the first Y-direction linear module (401), the first X-direction linear module (402) is used to drive the first Y-direction linear module (401) to translate along the X-direction, and the first Y-direction linear module (401) is used to drive the first Z-direction linear module (403) to translate along the Y-direction.

5. The sample preparation device according to claim 3, characterized in that: The second conveying mechanism (7) comprises a second X-direction linear module (702) and a second Y-direction linear module (701); The second X-direction linear module (702) is installed on the frame (1), the second Y-direction linear module (701) is installed on the second X-direction linear module (702), and the cutting and marking suction cup (8) is installed on the second Y-direction linear module (701); Alternatively, the second Y-direction linear module (701) is mounted on the frame (1), the second X-direction linear module (702) is mounted on the second Y-direction linear module (701), and the cutting and marking suction cup (8) is mounted on the second X-direction linear module (702).

6. The sample preparation device according to claim 3, characterized in that: The cutting device (9) comprises a laser cutter (901) and a second Z-direction linear module (902); the laser cutter (901) is mounted on the frame (1) via the second Z-direction linear module (902), and the second Z-direction linear module (902) can drive the laser cutter (901) to rise and fall in the Z direction.

7. The sample preparation device according to claim 3, characterized in that: The marking device (10) comprises a laser marker (1001) and a third Z-direction linear module (1002); the laser marker (1001) is mounted on the frame (1) via the third Z-direction linear module (1002), and the third Z-direction linear module (1002) can drive the laser marker (1001) to rise and fall in the Z direction.

8. The sample preparation device according to claim 3, characterized in that: It also comprises a residual material unloading rack (12) which is arranged on the frame (1), and the residual material unloading rack (12) has a residual material storage position for placing residual materials.

9. The sample preparation device according to claim 3, characterized in that: It also comprises a loading rack (2) which is arranged on the frame (1), and the loading rack (2) has a loading storage position for placing single crystal silicon wafers.

10. The sample preparation device according to claim 3, characterized in that: It also includes a grinding device and a grinding frame arranged on the frame (1), the grinding frame having a grinding station for placing a rough sample to be ground, the grinding head at the output end of the grinding device is arranged corresponding to the grinding station, and the grinding device is used to grind the rough sample to make a sample.

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