High and low temperature test equipment for semiconductor chip

Abstract

The invention discloses high and low temperature testing equipment for a semiconductor chip, relates to the field of semiconductor chip testing, and solves the problem that an existing high and low temperature testing device is low in chip heating speed, the high and low temperature testing equipment comprises an equipment shell and two temperature controllers symmetrically and fixedly installed on the inner wall of the bottom of the equipment shell, and a rotary drum is rotatably installed on the inner side of the equipment shell; three mounting plates distributed in a central symmetry mode are arranged on the outer side of the rotary drum, two clamping plates distributed in a symmetrical mode are arranged on the sides, away from the rotary drum, of the mounting plates, and a feeding opening is formed in the outer side of the equipment shell. The conveying mechanism is used for enabling the mounting plate to rotationally convey the semiconductor chips, and the conveying mechanism is mounted on the inner side of the rotary drum; through the material conveying mechanism, the semiconductor chip can be conveyed to the position above the two temperature controllers, the semiconductor chip is heated and cooled, and the semiconductor chip is rotated in the moving process of the semiconductor chip, so that the uniform heating and cooling effects are achieved.

Description

Technical Field

[0001] The invention relates to the field of semiconductor chip testing, in particular to a high and low temperature testing device for semiconductor chips. Background Art

[0002] ‌Semiconductor chip high and low temperature testing‌ is an environmental simulation test used to evaluate the performance and reliability of semiconductor chips under extreme temperature conditions. This test simulates high and low temperature environments to detect chemical changes or physical damage that may occur in the chip during thermal expansion and contraction, ensuring that the chip can work normally in harsh environments and meet the functions and performance indicators specified in the design specifications. It can determine whether the chip can operate stably in high or low temperature environments, thereby ensuring the quality and reliability of the product‌.

[0003] When testing semiconductors at high and low temperatures, it is necessary to place the semiconductor in a heating box to increase the temperature of the semiconductor, and then place it in a freezer for rapid cooling, so as to facilitate observation of the thermal expansion and contraction process of the chip. The existing Chinese patent document: CN118409188B discloses a high-temperature test platform for semiconductor chips, wherein a rotating plate is driven into the heating box by an annular slide plate, and a ceramic heating plate inside the heating box heats the semiconductor chip on the placement plate to ensure that the semiconductor maintains the required temperature during the test, so that the semiconductor chip is automatically fed and heated, and a temperature detector measures and monitors the temperature change of the semiconductor, senses and converts the temperature signal in real time to provide accurate temperature data, facilitates test automation and ensures the correctness of the test results, is easy to operate, reduces the operation process, and improves production efficiency. Although the semiconductor chip can be transported, the semiconductor chip is fixed by the placement plate and the clamping plate, and the placement plate will block the bottom of the semiconductor chip, and under the movement of the rotating plate, the heating box can only heat the top of the semiconductor chip, and the heating surface of the semiconductor chip is small, and the heating speed will be slow. Since multiple semiconductor chips need to be tested, the test efficiency of the semiconductor chip will be reduced. Summary of the invention

[0004] The object of the present invention is to provide a high and low temperature testing device for semiconductor chips to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions: A high and low temperature testing device for semiconductor chips comprises: a device housing and two temperature controllers symmetrically fixedly mounted on the inner wall at the bottom of the device housing, a rotating drum rotatably mounted on the inner side of the device housing, three mounting plates symmetrically distributed in a central direction are arranged on the outer side of the rotating drum, two symmetrically distributed clamping plates are arranged on the side of the mounting plate away from the rotating drum, the two clamping plates provide clamping and positioning for the semiconductor chip, a loading port is provided on the outer side of the device housing, and the semiconductor chip is conveniently loaded into the device housing; it also comprises: a feeding mechanism for rotating and conveying the semiconductor chip by the mounting plate, the feeding mechanism is mounted on the inner side of the rotating drum; a fixing mechanism for stably fixing the semiconductor chip by the two clamping plates, the fixing mechanism is mounted on the outer side of the mounting plate; a discharging mechanism for safely discharging the semiconductor chip between the two clamping plates, the discharging mechanism is mounted on the outer side of the mounting plate.

[0006] Preferably, the feeding mechanism includes a positioning cylinder fixedly mounted on the inner wall of the bottom of the equipment housing, the outer side of the positioning cylinder contacts the outer side of the rotating cylinder, a driving motor is fixedly mounted on the inner side of the positioning cylinder, a turntable located above the positioning cylinder is fixedly mounted on the output end of the driving motor, the outer side of the turntable is fixedly connected to the inner side of the rotating cylinder, the driving motor can drive the rotating cylinder to rotate intermittently through the turntable, a mounting rod sliding through the rotating cylinder is fixedly mounted on the side of the mounting plate away from the clamping plate, a conical wheel is fixedly mounted on the end of the mounting rod away from the mounting plate, and an annular groove for sliding of the conical wheel is provided on the outer side of the positioning cylinder Two arc-shaped racks symmetrically distributed and matched with the conical wheel are fixedly installed on the inner side of the annular groove, and the two arc-shaped racks are respectively located above the two temperature controllers, so that when the conical wheel contacts the arc-shaped racks, the conical wheel can drive the mounting rod to rotate, and a sleeve is provided on the outer side of the mounting rod, and the sleeve is fixedly installed in the interior of the rotating drum, and one end of the sleeve away from the mounting plate contacts the outer side of the conical wheel, and three partition frames symmetrically distributed in the center are fixedly installed on the outer side of the rotating drum, which divide the equipment housing and the rotating drum into three installation spaces, and a locking assembly for providing rotational positioning for the mounting rod is also provided on the outer side of the sleeve.

[0007] Preferably, the material fixing mechanism includes two slide plates symmetrically arranged on the side of the mounting plate away from the clamping plate, two symmetrically distributed fixing plates are fixedly installed on the side of the mounting plate close to the slide plate, a spring is fixedly installed between the fixing plate and the slide plate to provide reset for the movement of the slide plate, three symmetrically distributed sliding rods are fixedly installed on the side of the slide plate close to the mounting plate, a positioning plate in contact with the outer side of the mounting plate is fixedly installed between the three sliding rods, a long strip groove for the sliding rod to limit the sliding movement is opened on the outer side of the mounting plate, and the positioning plate is away from the sliding rod A mounting plate is fixedly installed on one side, and a sleeve plate is rotatably installed on the outer side of the mounting plate. The clamping plate is fixedly installed on the outer side of the sleeve plate to provide support for the clamping plate. Two symmetrically distributed support rods are fixedly installed on the inner side of the sleeve plate. An arc groove is opened on the outer side of the mounting plate for the support rod to limit the sliding of the support rod. An arc rod that slides through the support rod is fixedly installed on the inner side of the arc groove. An arc spring is arranged on the outer side of the arc rod. The arc spring is fixedly installed between the support rod and the inner side of the arc groove. The elasticity of the arc spring can be used to enable the support rod to move and reset along the arc groove.

[0008] Preferably, the discharging mechanism includes a connecting rod rotatably mounted on a side of the slide away from the spring, a top block is rotatably mounted between the two connecting rods, the top block is located on the outside of the mounting rod, a guide rod sliding through the mounting rod is fixedly mounted on the top of the top block to provide a guide for the movement of the top block, a U-shaped frame is rotatably mounted on the inner side of the discharging port of the equipment housing, a plurality of sliding rollers rotatably mounted on the inner side of the U-shaped frame to catch the semiconductor chips after the test is completed, the outer diameter of the sliding roller is smaller than the thickness of the equipment housing to prevent the partition frame from colliding with the sliding roller, a top plate is fixedly mounted on the side of the U-shaped frame away from the discharging port, the top plate is located directly below the top block, so that the top plate can push the top block to move upward, a U-shaped handle is fixedly mounted on one end of the U-shaped frame away from the top plate, the U-shaped handle is located below the U-shaped frame, so as to facilitate pulling the U-shaped frame to swing upward, and a groove is provided on the bottom inner wall of the equipment housing for the limited sliding of the U-shaped frame, so as to facilitate the downward swing of the U-shaped frame into the groove of the equipment housing.

[0009] Preferably, the clamping plate has an arc-shaped structure, and a plurality of anti-slip grooves distributed at equal distances are provided in the concave surface of the clamping plate to facilitate fixing of the semiconductor chip.

[0010] Preferably, the locking assembly includes a positioning ring fixedly mounted on the outer side of the mounting rod, the outer side of the positioning ring contacts the side of the sleeve away from the conical wheel, a plurality of plug posts symmetrically distributed in the center are slidably mounted on the side of the sleeve away from the conical wheel, a sliding cavity for limiting the sliding of the plug posts is provided on the inner side of the sleeve, a spring 2 is fixedly mounted between the sliding cavity and the plug posts, the end of the plug post away from the spring 2 is an arc-shaped structure, a plurality of slots for limiting the insertion of the plug posts are provided on the outer side of the positioning ring, and the elasticity of the spring 2 can be utilized to enable the plug posts to provide locking for the mounting rod through the positioning ring.

[0011] Preferably, a balance bar is fixedly mounted on the outer side of the skateboard and slides through the fixed plate to improve the stability of the movement of the skateboard.

[0012] Preferably, a protective pad is fixedly mounted on one side of the mounting plate close to the clamping plate to provide protection for the semiconductor chip inserted between the two clamping plates.

[0013] Preferably, two symmetrically distributed sliding balls are fixedly mounted on the inner side of the sleeve plate, and a sliding groove for limiting the sliding of the sliding balls is provided on the outer side of the mounting plate, so that the sleeve plate can be rotated along the outer side of the mounting plate.

[0014] Preferably, the top plate is in a stepped structure, and an arc-shaped pad is provided at the bottom of the top block to facilitate the top plate to push the top block to move upward.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention can install the semiconductor chip to be tested between two clamping plates through the feeding mechanism, and transport the semiconductor chip to the top of two temperature controllers through the intermittent rotation of the rotating drum, so that the temperature controller can heat and cool the semiconductor chip. In the process of moving the semiconductor chip, the semiconductor chip is rotated to achieve comprehensive heating and cooling of the semiconductor chip, thereby achieving uniform heating and cooling effects and improving the testing efficiency of the semiconductor chip.

[0016] 2. The present invention can insert the semiconductor chip between the two clamps through the material fixing mechanism, and utilize the elasticity of the spring to facilitate the elastic clamping of the semiconductor chip by the clamp. When the semiconductor chip is aligned with the ends of the two clamps, the clamp can be pushed to swing upward, so that the semiconductor chip can be inserted between the two clamps at an angle, thereby improving the convenience of semiconductor chip installation.

[0017] 3. The present invention can swing the U-shaped frame upward through the discharge mechanism after the semiconductor chip test is completed, so that the U-shaped frame pushes the top block upward through the top plate, and the two clamping plates can be away from the semiconductor chip, so that the semiconductor chip falls on the inclined sliding roller, which is convenient for separating the semiconductor chip from the clamping plates and preventing the staff from directly contacting the semiconductor chip with a lower temperature, thereby achieving the effect of safe material removal. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structure of the rotating drum and the partition frame in the present invention; Figure 3 It is a schematic diagram of the mounting plate and the clamping plate structure in the present invention; Figure 4 It is a schematic diagram of the positioning cylinder and the arc-shaped rack structure in the present invention; Figure 5 It is a schematic diagram of the structure of the sleeve and the mounting rod in the present invention; Figure 6 It is a schematic diagram of the positioning plate and the sliding rod structure in the present invention; Figure 7 It is a schematic diagram of the structure of the mounting plate and the sleeve plate in the present invention; Figure 8 It is a schematic diagram of the U-shaped frame and top block structure in the present invention.

[0019] In the figure: 1. Equipment housing; 2. Temperature controller; 3. Rotating drum; 4. Mounting plate; 5. Clamping plate; 6. Positioning cylinder; 7. Driving motor; 8. Turntable; 9. Mounting rod; 10. Conical wheel; 11. Arc rack; 12. Sleeve; 13. Slide plate; 14. Fixed plate; 15. Spring 1; 16. Slide rod; 17. Positioning plate; 18. Mounting plate; 19. Sleeve plate; 20. Support rod; 21. Arc rod; 22. Arc spring; 23. Connecting rod; 24. Top block; 25. Guide rod; 26. U-shaped frame; 27. Slide roller; 28. Partition frame; 29. ​​Top plate; 30. U-shaped handle; 31. Positioning ring; 32. Insert column; 33. Spring 2; 34. Balance rod; 35. Protective pad; 36. Sliding ball. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figure 1-Figure 8The high and low temperature testing equipment of a semiconductor chip shown in the figure comprises an equipment housing 1 and two temperature controllers 2 symmetrically fixedly mounted on the inner wall at the bottom of the equipment housing 1, the two temperature controllers 2 are respectively used for heating and cooling the semiconductor chip, a rotating drum 3 is rotatably mounted on the inner side of the equipment housing 1, three mounting plates 4 symmetrically distributed in the center are arranged on the outer side of the rotating drum 3, two symmetrically distributed clamping plates 5 are arranged on the side of the mounting plate 4 away from the rotating drum 3, the two clamping plates 5 are provided with clamping and positioning for the semiconductor chip, a loading port is provided on the outer side of the equipment housing 1, and the semiconductor chip is conveniently loaded into the equipment housing 1; it also comprises: a feeding mechanism, which is used to rotate and transport the mounting plate 4 to the semiconductor chip, and the feeding mechanism is installed on the inner side of the rotating drum 3; a fixing mechanism, which is used to fix the two clamping plates 5 to the semiconductor chip stably, and the fixing mechanism is installed on the outer side of the mounting plate 4; a discharging mechanism, which is used to safely discharge the semiconductor chip between the two clamping plates 5, and the discharging mechanism is installed on the outer side of the mounting plate 4.

[0022] The feeding mechanism includes a positioning cylinder 6 fixedly mounted on the inner wall of the bottom of the equipment housing 1, the outer side of the positioning cylinder 6 is in contact with the outer side of the rotating drum 3, a driving motor 7 is fixedly mounted on the inner side of the positioning cylinder 6, a turntable 8 located above the positioning cylinder 6 is fixedly mounted on the output end of the driving motor 7, the outer side of the turntable 8 is fixedly connected to the inner side of the rotating drum 3, the driving motor 7 can drive the rotating drum 3 to rotate intermittently through the turntable 8, a mounting rod 9 sliding through the rotating drum 3 is fixedly mounted on the side of the mounting plate 4 away from the clamping plate 5, a conical wheel 10 is fixedly mounted on the end of the mounting rod 9 away from the mounting plate 4, an annular groove for the sliding of the conical wheel 10 is opened on the outer side of the positioning cylinder 6, and a fixed mounting plate 9 is provided on the inner side of the annular groove. Two arc-shaped racks 11 symmetrically distributed and matched with the conical wheel 10 are installed. The two arc-shaped racks 11 are respectively located above the two temperature controllers 2, so that when the conical wheel 10 contacts the arc-shaped racks 11, the conical wheel 10 can drive the mounting rod 9 to rotate. A sleeve 12 is arranged on the outside of the mounting rod 9. The sleeve 12 is fixedly installed inside the rotating drum 3. One end of the sleeve 12 away from the mounting plate 4 contacts the outside of the conical wheel 10. Three partition frames 28 symmetrically distributed in the center are fixedly installed on the outside of the rotating drum 3, which divide the equipment housing 1 and the rotating drum 3 into three installation spaces. A locking assembly for providing rotational positioning for the mounting rod 9 is also arranged on the outside of the sleeve 12; The staff can insert the semiconductor chip between the two clamping plates 5 on the outside of the mounting plate 4 through the discharge port on the equipment housing 1. The driving motor 7 can drive the rotating drum 3 to rotate through the turntable 8, so that the rotating drum 3 drives the partition frame 28 and the mounting rod 9 to move. The mounting rod 9 drives the semiconductor chip to move to the top of the temperature controller 2 through the mounting plate 4. The temperature controller 2 heats the semiconductor chip by shielding it with the partition frame 28. At the same time, the mounting rod 9 can drive the conical wheel 10 to contact the arc-shaped rack 11 on the positioning cylinder 6, so that the mounting rod 9 is in a rotating state during the movement, so that when the temperature controller 2 heats the semiconductor chip, the semiconductor chip can rotate one circle. As the driving motor 7 rotates the rotating drum 3, the heated semiconductor chip can move to the top of another temperature controller 2, so that the temperature controller 2 cools the semiconductor chip, thereby achieving comprehensive heating and cooling of the semiconductor chip, thereby achieving uniform heating and cooling effects.

[0023] The locking assembly includes a positioning ring 31 fixedly mounted on the outer side of the mounting rod 9, the outer side of the positioning ring 31 is in contact with the side of the sleeve 12 away from the conical wheel 10, and a plurality of plug posts 32 symmetrically distributed in the center are slidably mounted on the side of the sleeve 12 away from the conical wheel 10, a sliding cavity for limiting the sliding of the plug posts 32 is provided on the inner side of the sleeve 12, a spring 2 33 is fixedly mounted between the sliding cavity and the plug posts 32, and one end of the plug posts 32 away from the spring 2 33 is an arc-shaped structure, and a plurality of slots for limiting the insertion of the plug posts 32 are provided on the outer side of the positioning ring 31, and the elasticity of the spring 2 33 can be utilized to enable the plug posts 32 to provide locking for the mounting rod 9 through the positioning ring 31; When the mounting rod 9 rotates, it can drive the positioning ring 31 to rotate along the outer side of the sleeve 12, so that the plane of the positioning ring 31 pushes the arc-shaped end of the plug post 32 to move, and the plug post 32 can move along the sliding cavity of the sleeve 12 and compress the spring 2 33, and the mounting rod 9 stops rotating, so that the plug post 32 can be inserted into the slot at the current corresponding position on the positioning ring 31, which can prevent the mounting rod 9 from rotating, improve the stability of the mounting rod 9 when performing circular motion, and facilitate the smooth transportation of semiconductor chips.

[0024] Working principle: First, the staff inserts the semiconductor chip between the two clamping plates 5 located on the discharge port of the equipment housing 1, and starts the driving motor 7. The output end of the driving motor 7 drives the turntable 8 to rotate, so that the turntable 8 drives the rotating drum 3 to rotate, and the rotating drum 3 drives the partition frame 28 and the mounting rod 9 to move in a circle with the positioning cylinder 6 as the center. The mounting rod 9 drives the mounting plate 4 to move synchronously, so that the mounting plate 4 drives the semiconductor chip between the two clamping plates 5 to move above the first temperature controller 2. The temperature controller 2 quickly heats the semiconductor chip by using the shielding of the partition frame 28. At this time, the staff inserts the next semiconductor chip to be tested between the two clamping plates 5 located at the discharge port of the equipment housing 1. At this time, the driving motor 7 runs again, so that the mounting rod 9 drives the conical wheel 10 to contact the arc-shaped rack 11 on the positioning cylinder 6. As the mounting rod 9 moves, the arc-shaped rack 11 can drive the mounting rod 9 to rotate through the conical wheel 10, so that the mounting rod 9 drives the semiconductor chip to rotate one circle through the mounting plate 4. At the same time, the mounting rod 9 can drive the positioning ring 31 to rotate synchronously along the outer side of the sleeve 12. The plane of the positioning ring 31 pushes the arc-shaped end of the plug post 32 to move, so that the plug post 32 is received in the sliding cavity of the sleeve 12 and the spring 2 33 is compressed. When the conical wheel 10 is away from the arc-shaped rack 11, the mounting rod 9 stops rotating, and the plug post 32 can be inserted into the slot at the current corresponding position on the positioning ring 31 to provide positioning for the mounting rod 9. The first temperature controller 2 can cool the bottom of the semiconductor chip, and then move the heated semiconductor chip to the top of the second temperature controller 2. The second temperature controller 2 cools the semiconductor chip. The conical wheel 10 contacts the arc-shaped rack 11 located above the second temperature controller 2, so that the second temperature controller 2 can fully cool the semiconductor chip, and the next semiconductor chip can be moved to the top of the first temperature controller 2. Finally, the rotating drum 3 moves the tested semiconductor chip to the discharge port of the equipment housing 1, and the staff can take the tested semiconductor chip, thereby achieving uniform heating and cooling effects, and multiple semiconductor chips can be loaded in sequence for testing in turn, thereby improving the testing efficiency of semiconductor chips.

[0025] Example 2: Please refer to Figure 5-Figure 7, this embodiment further explains the first embodiment. The material fixing mechanism shown in the figure includes two slide plates 13 symmetrically arranged on the side of the mounting plate 4 away from the clamping plate 5. Two symmetrically distributed fixing plates 14 are fixedly installed on the side of the mounting plate 4 close to the slide plate 13. A spring 15 is fixedly installed between the fixing plate 14 and the slide plate 13 to provide reset for the movement of the slide plate 13. Three symmetrically distributed sliding rods 16 are fixedly installed on the side of the slide plate 13 close to the mounting plate 4. A positioning plate 17 in contact with the outer side of the mounting plate 4 is fixedly installed between the three sliding rods 16. A long strip groove for limiting the sliding movement of the sliding rod 16 is opened on the outer side of the mounting plate 4. A mounting plate 18 is fixedly installed on the side of the positioning plate 17 away from the sliding rod 16. A sleeve plate 19 is rotatably mounted on the outer side of the disk 18, and a clamping plate 5 is fixedly mounted on the outer side of the sleeve plate 19 to provide support for the clamping plate 5. Two symmetrically distributed support rods 20 are fixedly mounted on the inner side of the sleeve plate 19. An arc groove for limiting the sliding of the support rod 20 is provided on the outer side of the mounting disk 18. An arc rod 21 sliding through the support rod 20 is fixedly mounted on the inner side of the arc groove. An arc spring 22 is arranged on the outer side of the arc rod 21. The arc spring 22 is fixedly mounted between the support rod 20 and the inner side of the arc groove. The elasticity of the arc spring 22 can enable the support rod 20 to move and reset along the arc groove. The clamping plate 5 has an arc-shaped structure, and a plurality of equidistantly distributed anti-slip grooves are provided in the concave surface of the clamping plate 5 to facilitate the fixing of semiconductor chips.

[0026] In this embodiment: when the staff inserts the semiconductor chip into the end position of the two clamps 5, the semiconductor chip can be pushed to swing upward, so that the semiconductor chip drives the two clamps 5 to swing upward, and the clamps 5 drive the sleeve plate 19 to rotate along the outer side of the mounting disk 18, so that the sleeve plate 19 drives the two support rods 20 to move along the inner side of the arc groove on the mounting disk 18 and the outer side of the arc rod 21, so that the support rod 20 compresses the arc spring 22, and the staff can tilt the semiconductor chip between the two clamps 5. At the same time, the positioning plate 17 drives the slide bar 16 to move along the slide groove on the mounting plate 4, so that the slide bar 16 drives the slide plate 13 to compress the spring 15, and the elasticity of the spring 15 is used to make the clamp 5 elastic to the outer side of the semiconductor chip, thereby improving the convenience of semiconductor chip installation.

[0027] Example 3: Please refer to Figure 1 , Figure 6 and Figure 8, this embodiment further explains other embodiments, the discharging mechanism in the figure includes a connecting rod 23 rotatably mounted on the side of the slide plate 13 away from the spring 15, a top block 24 is rotatably mounted between the two connecting rods 23, the top block 24 is located on the outside of the mounting rod 9, a guide rod 25 that slides through the mounting rod 9 is fixedly mounted on the top of the top block 24 to provide guidance for the movement of the top block 24, a U-shaped frame 26 is rotatably mounted on the inner side of the discharging port of the equipment housing 1, and a plurality of sliding rollers 27 equidistantly distributed are rotatably mounted on the inner side of the U-shaped frame 26 to receive the semiconductor chips after the test is completed, and the sliding rollers 27 are used to receive the semiconductor chips after the test is completed. The outer diameter of 7 is smaller than the thickness of the equipment housing 1 to prevent the partition frame 28 from colliding with the sliding roller 27. A top plate 29 is fixedly installed on the side of the U-shaped frame 26 away from the discharge port. The top plate 29 is located directly below the top block 24, so that the top plate 29 can push the top block 24 to move upward. A U-shaped handle 30 is fixedly installed on the end of the U-shaped frame 26 away from the top plate 29. The U-shaped handle 30 is located below the U-shaped frame 26 to facilitate pulling the U-shaped frame 26 to swing upward. A groove for limiting the sliding of the U-shaped frame 26 is provided on the bottom inner wall of the equipment housing 1, so that the U-shaped frame 26 can swing downward and be collected in the groove of the equipment housing 1.

[0028] In this embodiment: when the semiconductor chip test is completed, the semiconductor chip moves to the discharge port of the equipment housing 1, and the staff can pull the U-shaped handle 30 to move downward, so that the U-shaped handle 30 drives the U-shaped frame 26 to swing upward, so that the U-shaped frame 26 drives the top plate 29 to contact the bottom of the top block 24, and the top block 24 drives the guide rod 25 to move along the inner side of the mounting rod 9, and pushes the slide plate 13 along the slide groove on the mounting plate 4 toward the direction of the fixed plate 14 through the two connecting rods 23, so that the clamping plate 5 can be moved away from the semiconductor chip, and the semiconductor chip can fall on the sliding roller 27 of the U-shaped frame 26, so as to catch the tested semiconductor chip, prevent direct contact with the semiconductor chip, and improve the safety of semiconductor chip discharge.

[0029] Example 4: Please refer to Figure 6-Figure 8 This embodiment further illustrates other embodiments. The outer side of the slide plate 13 in the figure is fixedly installed with a balance rod 34 that slides through the fixed plate 14 to improve the stability of the movement of the slide plate 13. A protective pad 35 is fixedly installed on the side of the mounting plate 4 close to the clamping plate 5 to provide protection for the semiconductor chip inserted between the two clamping plates 5. Two symmetrically distributed sliding balls 36 are fixedly installed on the inner side of the sleeve plate 19. A sliding groove for limiting the sliding of the sliding balls 36 is provided on the outer side of the mounting plate 18 to facilitate the sleeve plate 19 to rotate along the outer side of the mounting plate 18. The top plate 29 is a stepped structure, and an arc-shaped pad is provided at the bottom of the top block 24.

[0030] In this embodiment: when the slide plate 13 moves, it can drive the balance bar 34 to move along the inner side of the fixed plate 14, provide auxiliary support for the movement of the slide plate 13, and prevent the slide plate 13 from bending when compressing the fixed plate 14. When the staff inserts the semiconductor chip between the two clamping plates 5, the protective pad 35 on the mounting plate 4 can prevent the semiconductor chip from directly colliding with the mounting plate 4, thereby improving the safety of the semiconductor chip during installation. The sleeve plate 19 can drive the sliding ball 36 to move along the sliding groove on the mounting disk 18, thereby improving the smoothness of the rotation of the sleeve plate 19. The top plate 29 of the stepped structure can contact the arc-shaped pad at the bottom of the top block 24, thereby increasing the contact surface between the top plate 29 and the arc-shaped pad, making it easier for the top plate 29 to push the top block 24 to move upward.

[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high and low temperature testing device for semiconductor chips, characterized in that: include: The device housing (1) and two temperature controllers (2) are symmetrically fixedly mounted on the inner wall of the bottom of the device housing (1); a rotating drum (3) is rotatably mounted on the inner side of the device housing (1); three mounting plates (4) are symmetrically distributed on the outer side of the rotating drum (3); two symmetrically distributed clamping plates (5) are arranged on the side of the mounting plate (4) away from the rotating drum (3); and a loading port is opened on the outer side of the device housing (1); Also includes: A feeding mechanism, used to enable the mounting plate (4) to rotate and feed the semiconductor chips, the feeding mechanism being mounted on the inner side of the rotating drum (3); A material fixing mechanism, used to enable the two clamping plates (5) to stably fix the semiconductor chip, the material fixing mechanism being installed on the outer side of the mounting plate (4); A discharge mechanism is used for safely discharging the semiconductor chip between the two clamping plates (5), and the discharge mechanism is mounted on the outside of the mounting plate (4).

2. The high and low temperature testing equipment for semiconductor chips according to claim 1, characterized in that: The feeding mechanism comprises a positioning cylinder (6) fixedly mounted on the inner wall of the bottom of the equipment housing (1), the outer side of the positioning cylinder (6) contacts the outer side of the rotating cylinder (3), a driving motor (7) is fixedly mounted on the inner side of the positioning cylinder (6), a rotating disk (8) located above the positioning cylinder (6) is fixedly mounted on the output end of the driving motor (7), the outer side of the rotating disk (8) is fixedly connected to the inner side of the rotating cylinder (3), a mounting rod (9) slidingly penetrating the rotating cylinder (3) is fixedly mounted on the side of the mounting plate (4) away from the clamping plate (5), and a conical wheel (10) is fixedly mounted on the end of the mounting rod (9) away from the mounting plate (4). The outer side of the positioning cylinder (6) is provided with an annular groove for the conical wheel (10) to slide, and the inner side of the annular groove is fixedly installed with two arc-shaped racks (11) that are symmetrically distributed and matched with the conical wheel (10). The outer side of the mounting rod (9) is provided with a sleeve (12), and the sleeve (12) is fixedly installed inside the rotating cylinder (3). The end of the sleeve (12) away from the mounting plate (4) contacts the outer side of the conical wheel (10). The outer side of the rotating cylinder (3) is fixedly installed with three partition frames (28) that are symmetrically distributed in the center, and the outer side of the sleeve (12) is also provided with a locking assembly for providing rotational positioning for the mounting rod (9).

3. The high and low temperature testing equipment for semiconductor chips according to claim 2, characterized in that: The material fixing mechanism comprises two slide plates (13) symmetrically arranged on a side of the mounting plate (4) away from the clamping plate (5); two symmetrically distributed fixing plates (14) are fixedly installed on a side of the mounting plate (4) close to the slide plates (13); a spring (15) is fixedly installed between the fixing plates (14) and the slide plates (13); three symmetrically distributed sliding rods (16) are fixedly installed on a side of the sliding plate (13) close to the mounting plate (4); a positioning plate (17) in contact with the outer side of the mounting plate (4) is fixedly installed between the three sliding rods (16); a long groove for limiting the sliding of the sliding rods (16) is provided on the outer side of the mounting plate (4); and the positioning plate (17) is fixedly installed between the three sliding rods (16). A mounting plate (18) is fixedly mounted on one side of the plate (17) away from the slide rod (16); a sleeve plate (19) is rotatably mounted on the outer side of the mounting plate (18); the clamping plate (5) is fixedly mounted on the outer side of the sleeve plate (19); two symmetrically distributed support rods (20) are fixedly mounted on the inner side of the sleeve plate (19); an arc groove for limiting the sliding of the support rod (20) is provided on the outer side of the mounting plate (18); an arc rod (21) slidingly penetrating the support rod (20) is fixedly mounted on the inner side of the arc groove; an arc spring (22) is arranged on the outer side of the arc rod (21); and the arc spring (22) is fixedly mounted between the support rod (20) and the inner side of the arc groove.

4. The high and low temperature testing equipment for semiconductor chips according to claim 3, characterized in that: The discharging mechanism comprises a connecting rod (23) rotatably mounted on a side of the slide plate (13) away from the spring (15); a top block (24) is rotatably mounted between the two connecting rods (23); the top block (24) is located on the outside of the mounting rod (9); a guide rod (25) is fixedly mounted on the top of the top block (24) and slides through the mounting rod (9); a U-shaped frame (26) is rotatably mounted on the inner side of the discharging port of the device housing (1); a plurality of sliding rollers rotatably mounted on the inner side of the U-shaped frame (26) and distributed at equal intervals (27), the outer diameter of the sliding roller (27) is smaller than the thickness of the equipment housing (1), a top plate (29) is fixedly installed on the side of the U-shaped frame (26) away from the discharge port, and the top plate (29) is located directly below the top block (24), and a U-shaped handle (30) is fixedly installed on the end of the U-shaped frame (26) away from the top plate (29), and the U-shaped handle (30) is located below the U-shaped frame (26), and the bottom inner wall of the equipment housing (1) is provided with a groove for limiting the sliding of the U-shaped frame (26).

5. The high and low temperature testing equipment for semiconductor chips according to claim 1, characterized in that: The clamping plate (5) has an arc-shaped structure, and a plurality of anti-slip grooves distributed at equal distances are provided in the concave surface of the clamping plate (5).

6. The high and low temperature testing equipment for semiconductor chips according to claim 2, characterized in that: The locking assembly comprises a positioning ring (31) fixedly mounted on the outer side of the mounting rod (9), the outer side of the positioning ring (31) contacts the side of the sleeve (12) away from the conical wheel (10), a plurality of plug posts (32) slidably mounted on the side of the sleeve (12) away from the conical wheel (10) and distributed symmetrically with respect to the center, a sliding cavity for limiting the sliding of the plug posts (32) is provided on the inner side of the sleeve (12), a spring 2 (33) is fixedly mounted between the sliding cavity and the plug posts (32), the end of the plug posts (32) away from the spring 2 (33) is an arc-shaped structure, and a plurality of slots for limiting the insertion of the plug posts (32) are provided on the outer side of the positioning ring (31).

7. The high and low temperature testing equipment for semiconductor chips according to claim 3, characterized in that: A balancing rod (34) is fixedly mounted on the outer side of the slide plate (13) and slides through the fixing plate (14).

8. The high and low temperature testing equipment for semiconductor chips according to claim 3, characterized in that: A protective pad (35) is fixedly mounted on one side of the mounting plate (4) close to the clamping plate (5).

9. The high and low temperature testing equipment for semiconductor chips according to claim 3, characterized in that: Two symmetrically distributed sliding balls (36) are fixedly mounted on the inner side of the sleeve plate (19), and a sliding groove for limiting the sliding of the sliding balls (36) is provided on the outer side of the mounting plate (18).

10. The high and low temperature testing equipment for semiconductor chips according to claim 4, characterized in that: The top plate (29) has a stepped structure, and an arc-shaped cushion block is provided at the bottom of the top block (24).

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