Test fixture

Abstract

The invention relates to the technical field of testing, and discloses a testing jig which is used for testing an open accelerator module. The test fixture comprises a fixture substrate, a first connector, a second connector, a first expansion assembly and a second expansion assembly. The clamp substrate is located between the universal substrate and the open accelerator module and comprises a first surface and a second surface; the first connector is fixed on the first surface and is connected with the open accelerator module; the second connector is fixed on the second surface and is connected with the universal substrate; the second connector is electrically connected with the first connector; the first expansion assembly is fixedly connected with the clamp substrate, is electrically connected with the first connector, and is suitable for being connected with the first interface of the adapter plate; the second expansion assembly is fixedly connected with the clamp substrate, electrically connected with the second connector and suitable for being connected with the second interface of the adapter plate, and on the basis that normal connection of the open accelerator module and the universal substrate is ensured, connection between the open accelerator module and the adapter plate is achieved through the synergistic effect of the test jig.

Description

Technical Field

[0001] The present invention relates to the field of testing technology, and in particular to a testing fixture. Background Art

[0002] With the rapid advancement of artificial intelligence technology, the demand for new hardware accelerators required in the fields of machine learning, deep learning, and high-performance computing has surged, showing an explosive growth trend. In order to shorten the development cycle of solutions and accelerate the launch of products, the industry has introduced the concept of open accelerator modules (OAMs), which use standardized interfaces and forms to encapsulate graphics processing units (GPUs) as standard units. These modules are connected to the universal baseboard (UBB) through the mirror mezzanine connector located at the bottom of the open accelerator module, which not only realizes the interconnection between multiple OAMs, but also ensures smooth external communication.

[0003] In the development and actual deployment of OAM products, debugging of high-speed signals such as PCIe has become a crucial link. In order to accurately locate and solve possible problems in the PCIe link, it is usually necessary to rely on a high-precision protocol analyzer for in-depth analysis. Currently, the protocol analyzer needs to be connected to the tested structure through an adapter board for diagnosis. However, since the OAM module adopts a standardized interface design, in the process of integrating OAM and UBB, the traditional adapter board is difficult to adapt to the connection requirements of OAM, which brings great challenges and inconvenience to the OAM testing work. Summary of the invention

[0004] In view of this, the present invention provides a test fixture to solve the problem that the traditional adapter board is difficult to adapt to the connection requirements of OAM during the integrated use of OAM and UBB.

[0005] The present invention provides a test fixture for testing an open accelerator module; the open accelerator module is spaced apart from a universal substrate; the test fixture comprises a fixture substrate, a first connector, a second connector, a first extension component and a second extension component; the fixture substrate is located between the universal substrate and the open accelerator module, and comprises a first surface and a second surface, the first surface is arranged adjacent to the universal substrate, and the second surface is arranged adjacent to the open accelerator module; the first connector is fixed on the first surface and connected to the open accelerator module; the second connector is fixed on the second surface and connected to the universal substrate; and the second connector is electrically connected to the first connector; the first extension component is fixedly connected to the fixture substrate, electrically connected to the first connector, and is suitable for connecting to the first interface of an adapter board; the second extension component is fixedly connected to the fixture substrate, electrically connected to the second connector, and is suitable for connecting to the second interface of an adapter board.

[0006] By setting up the fixture substrate, not only reliable physical support and fixation are provided for the first connector and the second connector, but also electrical connection between the two is realized, thereby realizing the normal connection between the open accelerator module and the universal substrate; and since the first extension component and the second extension component are both connected to the fixture substrate, and an electrical connection path is established with the first connector and the second connector by means of the fixture substrate, it is ensured that the signal of the open accelerator module can be transmitted to the adapter board, thereby realizing further testing and processing of the signal; on the basis of ensuring that the open accelerator module and the universal substrate can be connected normally, the connection between the open accelerator module and the adapter board is realized through the synergistic effect of the test fixture.

[0007] In an optional embodiment, on a side close to the fixture substrate, the first connector is provided with a first signal pin and a second signal pin, and the second connector is provided with a third signal pin and a fourth signal pin; the first signal pin is electrically connected to the first extension component, and the third signal pin is electrically connected to the second extension component; the second signal pin is electrically connected to the fourth signal pin.

[0008] By electrically connecting the first signal pin to the first extension component, signal transmission between the first connector and the first extension component is achieved; by electrically connecting the third signal pin to the second extension component, signal transmission between the second connector and the second extension component is achieved; by electrically connecting the second signal pin to the fourth signal pin, signal transmission between the first connector and the second connector is achieved; this not only ensures efficient transmission of signals between the first connector, the second connector and the adapter board, but also ensures that during this transmission process, other signal transmission paths between the first connector and the second connector will not be interfered with or affected in any way, thereby ensuring the integrity and stability of signal transmission between the open accelerator module and the universal substrate.

[0009] In an optional embodiment, the first extension component includes a first cable and a first extension card; one end of the first cable is fixed to the fixture substrate and connected to the first signal pin; the first extension card is connected to the other end of the first cable and connected to the first interface of the adapter board.

[0010] By setting the first cable, a flexible connection between the adapter board and the first connector can be achieved, so that the adapter board can be spaced apart from the open accelerator module and the universal substrate, avoiding interference between the adapter board and the open accelerator module and the universal substrate, thereby ensuring the structural integrity and operational stability of the entire system; by setting the first expansion card, an adaptive connection with the first interface of the adapter board can be achieved, ensuring that the PCIe signal of the first connector can be transmitted to the adapter board.

[0011] In an optional implementation, the first expansion card includes a first pad and a gold finger, the first cable is connected to the first pad, the first pad is connected to the gold finger through a circuit trace, and the gold finger is suitable for connecting to the first interface of the adapter board.

[0012] By setting a first solder pad on the first expansion card, a stable and reliable fixed connection is achieved between the first expansion card and the first cable. Since the first solder pad and the gold finger are electrically connected through circuit routing, and the gold finger is connected to the first interface of the adapter board, an efficient signal transmission channel from the first cable to the first interface of the adapter board is constructed, ensuring that the signal carried by the first cable can be transmitted to the first interface of the adapter board through the first solder pad and the gold finger.

[0013] In an optional embodiment, the second extension component includes a second cable and a second extension card; one end of the second cable is fixed to the fixture substrate and connected to the third signal pin, and the second extension card is connected to the other end of the second cable and connected to the second interface of the adapter board.

[0014] By setting the second cable, a flexible connection between the adapter board and the second connector can be achieved, so that the adapter board can be spaced apart from the open accelerator module and the universal substrate, avoiding interference between the adapter board and the open accelerator module and the universal substrate, thereby ensuring the structural integrity and operating stability of the entire system; by setting the second expansion card, an adaptive connection with the second interface of the adapter board can be achieved, ensuring signal interconnection between the second connector and the adapter board.

[0015] In an optional embodiment, the second expansion card includes a second solder pad and a third connector, the second solder pad and the third connector are respectively arranged on both sides of the second expansion card, the second cable is connected to the second solder pad, the second solder pad is connected to the third connector through a via, and the third connector is suitable for connecting to the second interface of the adapter board.

[0016] By setting a second soldering pad on the second expansion card, a stable and reliable fixed connection is achieved between the second expansion card and the second cable. Since the second soldering pad is electrically connected to the third connector through a via, and the third connector is connected to the second interface of the adapter board, an efficient signal transmission channel is constructed from the second cable to the second interface of the adapter board, thereby achieving signal interconnection between the second cable and the adapter board.

[0017] In an optional embodiment, it also includes a third solder pad and a fourth solder pad; the third solder pad is arranged on the first surface and is electrically connected to the first signal pin, and the first extension component is connected to the third solder pad; the fourth solder pad is arranged on the second surface and is electrically connected to the third signal pin, and the second extension component is connected to the fourth solder pad.

[0018] By setting the third solder pad and the fourth solder pad, the stability of the connection between the first extension component and the second extension component and the fixture substrate is enhanced; and because the third solder pad is electrically connected to the first signal pin, the electrical interconnection between the first extension component and the first signal pin is achieved; and because the fourth solder pad is electrically connected to the third signal pin, the electrical interconnection between the second extension component and the third signal pin is achieved.

[0019] In an optional embodiment, a through hole is provided on the fixture substrate, and the test fixture further includes a first connecting wire, one end of the first connecting wire is connected to the second signal pin, and the other end passes through the through hole and is connected to the fourth signal pin.

[0020] A through hole is provided on the fixture substrate, and the first connecting line directly passes through the through hole to realize the electrical connection between the second signal pin and the fourth signal pin. The through hole is used as a physical channel for the first connecting line, which effectively protects the first connecting line from damage by the external environment, ensures the stability and long-term reliability of the connection between the first connecting line and the second signal pin and the fourth signal pin, and optimizes the wiring path of the first connecting line, effectively avoiding unnecessary extension of the length of the first connecting line, which not only reduces the use of materials and reduces costs, but also further improves the efficiency and response speed of signal transmission, thereby realizing efficient utilization of resources and optimization of spatial layout.

[0021] In an optional embodiment, the fixture substrate further includes a first blind hole, a second blind hole, a first connecting hole, a third blind hole, a fourth blind hole, and a second connecting hole; the first blind hole is arranged on the side where the first surface is located, corresponding to the position where the first signal pin is located; the second blind hole is arranged on the side where the first surface is located, spaced from the first blind hole, and corresponding to the position where the third pad is located; the first connecting hole is arranged between the first surface and the second surface, and the two ends are respectively connected to the first blind hole and the second blind hole; the third blind hole is arranged on the side where the second surface is located, corresponding to the position where the third signal pin is located; the fourth blind hole is arranged on the second surface One side is located, which is spaced apart from the third blind hole and corresponds to the position of the fourth pad; a second connecting hole is arranged between the first surface and the second surface, which is spaced apart from the first connecting hole, and both ends are respectively connected with the third blind hole and the fourth blind hole; the test fixture also includes a second connecting wire and a third connecting wire; one end of the second connecting wire is connected to the first signal pin, and the other end passes through the first blind hole, the first connecting hole and the second blind hole in sequence to be connected to the third pad; one end of the third connecting wire is connected to the third signal pin, and the other end passes through the third blind hole, the second connecting hole and the fourth blind hole in sequence to be connected to the fourth pad.

[0022] By setting a first blind hole, a first connecting hole and a second blind hole on the fixture substrate, a physical channel is constructed for the second connecting line, which effectively protects the second connecting line from damage by the external environment, and ensures the stability and long-term reliability of the connection between the second connecting line and the first signal pin and the third pad; by setting a third blind hole, a second connecting hole and a fourth blind hole on the fixture substrate, a physical channel is constructed for the third connecting line, which effectively protects the third connecting line from damage by the external environment, and ensures the stability and long-term reliability of the connection between the third connecting line and the third signal pin and the fourth pad.

[0023] In an optional embodiment, the third solder pad is arranged adjacent to the first connector, and the first connecting hole is arranged on a side close to the first surface; the fourth solder pad is arranged adjacent to the second connector, and the second connecting hole is arranged on a side close to the second surface.

[0024] By arranging the first connecting hole on the side close to the first surface, the lengths of the first blind hole and the second blind hole can be reduced, and by arranging the second connecting hole on the side close to the second surface, the lengths of the third blind hole and the fourth blind hole can be reduced; the wiring paths of the second connecting wire and the third connecting wire are optimized, effectively avoiding unnecessary extension of the lengths of the second connecting wire and the third connecting wire, which not only reduces the use of materials and reduces costs, but also further improves the efficiency and response speed of signal transmission, thereby achieving efficient utilization of resources and optimization of spatial layout. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the related technologies, the drawings required for use in the specific embodiments or the related technical descriptions will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 is a schematic diagram of the structure of a universal substrate;

[0027] Figure 2 It is a schematic diagram of the connection structure between the adapter board and the protocol analyzer in the related technology;

[0028] Figure 3 A schematic diagram of the connection structure of a test fixture according to an embodiment of the present invention;

[0029] Figure 4 A schematic structural diagram of the connection between a fixture substrate, a first connector and a second connector according to an embodiment of the present invention;

[0030] Figure 5 A schematic diagram of the structure of one side of a first expansion card according to an embodiment of the present invention;

[0031] Figure 6 A schematic diagram of the structure of the other side of the first expansion card according to an embodiment of the present invention;

[0032] Figure 7 is a schematic structural diagram of a second pad on a second expansion card according to an embodiment of the present invention;

[0033] Figure 8 is a schematic structural diagram of a third connector on a second expansion card according to an embodiment of the present invention;

[0034] Fig. 9 is a schematic structural diagram of a first surface of a fixture substrate according to an embodiment of the present invention;

[0035] Fig.10 is a schematic structural diagram of the second surface of the fixture substrate according to an embodiment of the present invention;

[0036] Fig.11 It is a structural schematic diagram of the connection between the first cable and the third pad according to an embodiment of the present invention.

[0037] Fig.12 The figure is a schematic diagram of a specific implementation structure of a test fixture according to an embodiment of the present invention.

[0038] Description of reference numerals:

[0039] 1. Open accelerator module; 2. Universal substrate; 201. Mounting groove; 3. Fixture substrate; 301. First surface; 302. Second surface; 303. Third pad; 304. Fourth pad; 305. Through hole; 306. First blind hole; 307. Second blind hole; 308. First connecting hole; 309. Third blind hole; 310. Fourth blind hole; 311. Second connecting hole; 4. First connector; 401. First signal pin; 402. Second signal pin; 5. Second connector; 501. Third signal pin; 502, fourth signal pin; 601, first cable; 6011, cable ground wire; 6012, cable signal wire; 602, first expansion card; 6021, first solder pad; 6022, gold finger; 701, second cable; 702, second expansion card; 7021, second solder pad; 7022, third connector; 8, adapter board; 801, first interface; 802, second interface; 9, protocol analyzer; 10, host; 11, terminal; 12, control center; 13, Pcie switch; 14, fourth connecting wire. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0041] In related technologies, such as Figure 1 As shown, the universal substrate 2 is provided with a plurality of mounting slots 201, and each mounting slot 201 can be correspondingly installed with an open accelerator module 1, so as to realize the interconnection and external communication capability between the plurality of open accelerator modules 1. Figure 2As shown, the first interface 801 and the second interface 802 are respectively provided on opposite sides of the adapter board 8 to connect the host 10 (Host) and the terminal 11 (Endpoint), and then the adapter board 8 is connected to the protocol analyzer 9, and the trace data (Trace) of the PCIE link between them is captured through the protocol analyzer 9, and finally the protocol analyzer 9 is connected to the control center 12 such as a computer; however, since the adapter board 8 only has standard CEM, U.2 and other interface types, and the open accelerator module 1 is a mirror-type mezzanine connector and cannot be connected to the CEM, U.2 and other interfaces, it is impossible to achieve a direct connection between the adapter board 8 and the open accelerator module 1.

[0042] Combine the following Figures 3 to 12 , describing an embodiment of the present invention.

[0043] According to an embodiment of the present invention, on the one hand, a test fixture is provided for testing an open accelerator module 1; the open accelerator module 1 is spaced apart from the universal substrate 2; the test fixture includes a fixture substrate 3, a first connector 4, a second connector 5, a first extension component and a second extension component; the fixture substrate 3 is located between the universal substrate 2 and the open accelerator module 1, and includes a first surface 301 and a second surface 302, the first surface 301 is adjacent to the universal substrate 2, and the second surface 302 is adjacent to the open accelerator module 1; the first connector 4 is fixed on the first surface 301 and connected to the open accelerator module 1; the second connector 5 is fixed on the second surface 302 and connected to the universal substrate 2; and the second connector 5 is electrically connected to the first connector 4; the first extension component is fixedly connected to the fixture substrate 3, electrically connected to the first connector 4, and is suitable for connecting to the first interface 801 of the adapter board 8; the second extension component is fixedly connected to the fixture substrate 3, electrically connected to the second connector 5, and is suitable for connecting to the second interface 802 of the adapter board 8.

[0044] By setting the fixture substrate 3, not only reliable physical support and fixation are provided for the first connector 4 and the second connector 5, but also electrical connection between the two is realized, thereby realizing the normal connection between the open accelerator module 1 and the universal substrate 2; and because the first extension component and the second extension component are both connected to the fixture substrate 3, and an electrical connection path is established with the first connector 4 and the second connector 5 by means of the fixture substrate 3, it is ensured that the signal of the open accelerator module 1 can be transmitted to the adapter board 8, thereby realizing further testing and processing of the signal; on the basis of ensuring that the open accelerator module 1 and the universal substrate 2 can be connected normally, the connection between the open accelerator module 1 and the adapter board 8 is realized through the synergistic effect of the test fixture.

[0045] In a specific implementation, the first connector 4 is connected to the first interface 801 of the adapter board 8 via the first extension component, and the second connector 5 is also connected to the second interface 802 of the adapter board 8 via the second extension component. This connection method ensures that the interconnection between the adapter board 8 and the open accelerator module 1 and the universal substrate 2 is not limited by the difference in interface types, thereby achieving flexible and convenient connection between the open accelerator module 1, the universal substrate 2 and the adapter board 8, greatly improving the compatibility and ease of use of the system.

[0046] In a specific embodiment, since the fixture substrate 3 can be installed in the installation slot 201 of the universal substrate 2 to realize the connection with the open accelerator module 1, it will not interfere with the connection of the open accelerator modules 1 in other installation slots 201, not only allowing the universal substrate 2 to simultaneously connect multiple open accelerator modules 1, but also further realizing the interconnection between the open accelerator module 1, the universal substrate 2 and the adapter plate 8. At the same time, due to the small size of the fixture substrate 3, not only the manufacturing cost is reduced, but also batch production and application are convenient, and the flexibility and economy of the overall system are improved.

[0047] In one embodiment, on the side close to the fixture substrate 3, the first connector 4 is provided with a first signal pin 401 and a second signal pin 402, and the second connector 5 is provided with a third signal pin 501 and a fourth signal pin 502; the first signal pin 401 is electrically connected to the first extension component, and the third signal pin 501 is electrically connected to the second extension component; the second signal pin 402 is electrically connected to the fourth signal pin 502.

[0048] By electrically connecting the first signal pin 401 to the first extension component, signal transmission between the first connector 4 and the first extension component is achieved; by electrically connecting the third signal pin 501 to the second extension component, signal transmission between the second connector 5 and the second extension component is achieved; by electrically connecting the second signal pin 402 to the fourth signal pin 502, signal transmission between the first connector 4 and the second connector 5 is achieved; not only is the efficient transmission of signals between the first connector 4, the second connector 5 and the adapter board 8 guaranteed, but also it is ensured that during this transmission process, other signal transmission paths between the first connector 4 and the second connector 5 will not be interfered with or affected in any way, thereby ensuring the integrity and stability of signal transmission between the open accelerator module 1 and the universal substrate 2.

[0049] In a specific embodiment, the first connector 4 includes a first connection unit and a second connection unit, the first connection unit and the second connection unit are respectively connected to the two interfaces of the open accelerator module 1, the first connection unit is provided with a first signal pin 401 and a plurality of second signal pins 402, and the second connection unit is provided with a plurality of second signal pins 402; the second connector 5 includes a third connection unit and a fourth connection unit, the third connection unit and the fourth connection unit are respectively connected to the two interfaces in the mounting groove 201 of the universal substrate 2, the first connection unit is provided with a third signal pin 501 and a plurality of fourth signal pins 502, and the second connection unit is provided with a plurality of fourth signal pins 502;

[0050] Specifically, the first connection unit, the second connection unit, the third connection unit and the fourth connection unit are all mirror-type mezzanine connectors.

[0051] Specifically, the first signal pin 401 and the third signal pin 501 are used to transmit the Pcie signal; the second signal pin 402 and the fourth signal pin 502 are used to transmit other signals.

[0052] In one embodiment, the first extension component includes a first cable 601 and a first extension card 602; one end of the first cable 601 is fixed on the fixture substrate 3 and connected to the first signal pin 401; the first extension card 602 is connected to the other end of the first cable 601 and connected to the first interface 801 of the adapter board 8.

[0053] By setting the first cable 601, a flexible connection between the adapter board 8 and the first connector 4 can be achieved, so that the adapter board 8 can be spaced apart from the open accelerator module 1 and the universal substrate 2, avoiding interference between the adapter board 8 and the open accelerator module 1 and the universal substrate 2, thereby ensuring the structural integrity and operating stability of the entire system; by setting the first expansion card 602, an adaptive connection with the first interface 801 of the adapter board 8 can be achieved, ensuring that the PCIe signal of the first connector 4 can be transmitted to the adapter board 8.

[0054] In one embodiment, the first expansion card 602 includes a first solder pad 6021 and a gold finger 6022 , the first cable 601 is connected to the first solder pad 6021 , the first solder pad 6021 is connected to the gold finger 6022 via a circuit trace, and the gold finger 6022 is suitable for connecting to the first interface 801 of the adapter board 8 .

[0055] By setting a first solder pad 6021 on the first expansion card 602, a stable and reliable fixed connection is achieved between the first expansion card 602 and the first cable 601. Since the first solder pad 6021 and the gold finger 6022 are electrically connected through circuit routing, and the gold finger 6022 is connected to the first interface 801 of the adapter board 8, an efficient signal transmission channel from the first cable 601 to the first interface 801 of the adapter board 8 is constructed, ensuring that the signal carried by the first cable 601 can be transmitted to the first interface 801 of the adapter board 8 through the first solder pad 6021 and the gold finger 6022.

[0056] In one embodiment, the second extension component includes a second cable 701 and a second extension card 702; one end of the second cable 701 is fixed on the fixture substrate 3 and connected to the third signal pin 501, and the second extension card 702 is connected to the other end of the second cable 701 and connected to the second interface 802 of the adapter board 8.

[0057] By setting the second cable 701, a flexible connection between the adapter board 8 and the second connector 5 can be achieved, so that the adapter board 8 can be spaced apart from the open accelerator module 1 and the universal substrate 2, avoiding interference between the adapter board 8 and the open accelerator module 1 and the universal substrate 2, thereby ensuring the structural integrity and operating stability of the entire system; by setting the second expansion card 702, an adaptive connection with the second interface 802 of the adapter board 8 can be achieved, ensuring the signal interconnection between the second connector 5 and the adapter board 8.

[0058] In one embodiment, the second expansion card 702 includes a second solder pad 7021 and a third connector 7022, the second solder pad 7021 and the third connector 7022 are respectively arranged on both sides of the second expansion card 702, the second cable 701 is connected to the second solder pad 7021, the second solder pad 7021 is connected to the third connector 7022 through a via, and the third connector 7022 is suitable for connecting to the second interface 802 of the adapter board 8.

[0059] By setting a second solder pad 7021 on the second expansion card 702, a stable and reliable fixed connection is achieved between the second expansion card 702 and the second cable 701. Since the second solder pad 7021 and the third connector 7022 are electrically connected through a via, and the third connector 7022 is connected to the second interface 802 of the adapter board 8, an efficient signal transmission channel is constructed from the second cable 701 to the second interface 802 of the adapter board 8, thereby achieving signal interconnection between the second cable 701 and the adapter board 8.

[0060] In a specific embodiment, the third connector 7022 is a CEM connector.

[0061] In one embodiment, it also includes a third solder pad 303 and a fourth solder pad 304; the third solder pad 303 is arranged on the first surface 301 and is electrically connected to the first signal pin 401, and the first extension component is connected to the third solder pad 303; the fourth solder pad 304 is arranged on the second surface 302 and is electrically connected to the third signal pin 501, and the second extension component is connected to the fourth solder pad 304.

[0062] By setting the third solder pad 303 and the fourth solder pad 304, the stability of the connection between the first extension component, the second extension component and the fixture substrate 3 is enhanced; and because the third solder pad 303 is electrically connected to the first signal pin 401, the electrical interconnection between the first extension component and the first signal pin 401 is achieved; and because the fourth solder pad 304 is electrically connected to the third signal pin 501, the electrical interconnection between the second extension component and the third signal pin 501 is achieved.

[0063] In a specific implementation, two ends of the first cable 601 are respectively connected to the first soldering pad 6021 and the third soldering pad 303 by welding.

[0064] In a specific implementation, the first cable 601 is a high-speed differential cable, and the first cable 601 includes four conductors, which are two cable ground wires 6011 and two cable signal wires 6012 , and the two cable ground wires 6011 and the two cable signal wires 6012 are both welded to the first pad 6021 and the third pad 303 .

[0065] In a specific implementation, two ends of the second cable 701 are respectively connected to the second soldering pad 7021 and the fourth soldering pad 304 by welding.

[0066] In a specific implementation, the second cable 701 is a high-speed differential cable, and the second cable 701 includes four conductors, which are two cable ground wires 6011 and two cable signal wires 6012 , and the two cable ground wires 6011 and the two cable signal wires 6012 are both welded to the second pad 7021 and the fourth pad 304 .

[0067] In one embodiment, a through hole 305 is provided on the fixture substrate 3 , and the test fixture further includes a first connecting wire, one end of which is connected to the second signal pin 402 , and the other end of which passes through the through hole 305 and is connected to the fourth signal pin 502 .

[0068] By setting a through hole 305 on the fixture substrate 3, and the first connecting line directly passing through the through hole 305 to realize the electrical connection between the second signal pin 402 and the fourth signal pin 502, and using the through hole 305 as a physical channel for the first connecting line, the first connecting line is effectively protected from damage by the external environment, ensuring the stability and long-term reliability of the connection between the first connecting line and the second signal pin 402 and the fourth signal pin 502, and optimizing the wiring path of the first connecting line, effectively avoiding unnecessary extension of the length of the first connecting line, which not only reduces the use of materials and reduces costs, but also further improves the efficiency and response speed of signal transmission, and realizes efficient use of resources and optimization of spatial layout.

[0069] In one embodiment, the fixture substrate 3 further includes a first blind hole 306, a second blind hole 307, a first connecting hole 308, a third blind hole 309, a fourth blind hole 310 and a second connecting hole 311; the first blind hole 306 is arranged on the side where the first surface 301 is located, corresponding to the position where the first signal pin 401 is located; the second blind hole 307 is arranged on the side where the first surface 301 is located, and is spaced from the first blind hole 306, and corresponds to the position where the third pad 303 is located; the first connecting hole 308 is arranged between the first surface 301 and the second surface 302, and the two ends are connected to the first blind hole 306 and the second blind hole 307 respectively; the third blind hole 309 is arranged on the side where the second surface 302 is located, corresponding to the position where the third signal pin 501 is located; the fourth blind hole 310 is arranged on the second surface 302 The side where the second surface 302 is located is spaced apart from the third blind hole 309 and corresponds to the position where the fourth pad 304 is located; the second connecting hole 311 is arranged between the first surface 301 and the second surface 302, spaced apart from the first connecting hole 308, and the two ends are respectively connected to the third blind hole 309 and the fourth blind hole 310; the test fixture also includes a second connecting wire and a third connecting wire; one end of the second connecting wire is connected to the first signal pin 401, and the other end passes through the first blind hole 306, the first connecting hole 308 and the second blind hole 307 in sequence to be connected to the third pad 303; one end of the third connecting wire is connected to the third signal pin 501, and the other end passes through the third blind hole 309, the second connecting hole 311 and the fourth blind hole 310 in sequence to be connected to the fourth pad 304.

[0070] By setting the first blind hole 306, the first connecting hole 308 and the second blind hole 307 on the fixture substrate 3, a physical channel is constructed for the second connecting line, which effectively protects the second connecting line from damage by the external environment, and ensures the stability and long-term reliability of the connection between the second connecting line and the first signal pin 401 and the third soldering pad 303; by setting the third blind hole 309, the second connecting hole 311 and the fourth blind hole 310 on the fixture substrate 3, a physical channel is constructed for the third connecting line, which effectively protects the third connecting line from damage by the external environment, and ensures the stability and long-term reliability of the connection between the third connecting line and the third signal pin 501 and the fourth soldering pad 304.

[0071] Preferably, the length of the first connecting hole 308 is greater than the distance between the first blind hole 306 and the second blind hole 307, providing redundant space for the second connecting line; the length of the second connecting hole 311 is greater than the distance between the third blind hole 309 and the fourth blind hole 310, providing redundant space for the third connecting line; when a part of the second connecting line or the third connecting line ages due to long-term use or environmental factors, the transmission performance of this part may decline, which is specifically manifested in signal attenuation, increased transmission delay or noise interference. However, thanks to the design of the redundant part, if the aging is not serious enough to make the entire connecting line completely ineffective, the redundant part will be able to continue to undertake the transmission task, and the signal can still be smoothly transmitted from one end to the other; ensuring that even in the face of aging of part of the line, the reliability of the entire connection can still be effectively guaranteed.

[0072] In one embodiment, the third solder pad 303 is arranged adjacent to the first connector 4, and the first connecting hole 308 is arranged on a side close to the first surface 301; the fourth solder pad 304 is arranged adjacent to the second connector 5, and the second connecting hole 311 is arranged on a side close to the second surface 302.

[0073] By setting the first connecting hole 308 on the side close to the first surface 301, the length of the first blind hole 306 and the second blind hole 307 can be reduced. By setting the second connecting hole 311 on the side close to the second surface 302, the length of the third blind hole 309 and the fourth blind hole 310 can be reduced. The wiring paths of the second connecting wire and the third connecting wire are optimized, which effectively avoids unnecessary extension of the length of the second connecting wire and the third connecting wire, which not only reduces the use of materials and reduces costs, but also further improves the efficiency and response speed of signal transmission, thereby achieving efficient use of resources and optimization of spatial layout.

[0074] In a specific embodiment, the fixture substrate 3 is formed by stacking multiple layers of materials, and the first connecting hole 308 is arranged in the material layer adjacent to the first surface 301 ; the second connecting hole 311 is arranged in the material layer adjacent to the second surface 302 .

[0075] In a specific embodiment, Fig.12 As shown, a Pcie switch 13 is provided on the universal substrate 2, and the Pcie switch 13 is electrically connected to the second connector 5. Specifically, a mounting hole is provided on the universal substrate 2, one end of the fourth connecting line 14 is connected to the Pcie switch 13, and the other end passes through the mounting hole and is electrically connected to the second connector 5.

[0076] In a specific embodiment, Fig.12 As shown, the test fixture of the present application is installed in a mounting slot 201 of a universal substrate 2, the second surface 302 of the fixture substrate 3 faces the mounting slot 201, and is connected to the universal substrate 2 through the second connector 5; the first surface 301 of the fixture substrate 3 is located on the side away from the mounting slot 201, and then the open accelerator module 1 is installed on the fixture and connected to the open accelerator module 1 through the first connector 4; then the first expansion card 602 is connected to the first interface 801 of the adapter board 8, the second expansion card 702 is connected to the second interface 802 of the adapter board 8, and then the adapter board 8 is connected to the protocol analyzer 9, and the protocol analyzer 9 is connected to a control center 12 such as a computer.

[0077] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A test fixture for testing an open accelerator module (1); characterized in that: The open accelerator module (1) and the universal substrate (2) are arranged at intervals; the test fixture comprises: A fixture substrate (3), located between the universal substrate (2) and the open accelerator module (1), comprising a first surface (301) and a second surface (302), wherein the first surface (301) is disposed adjacent to the universal substrate (2), and the second surface (302) is disposed adjacent to the open accelerator module (1); A first connector (4) fixed on the first surface (301) and connected to the open accelerator module (1); A second connector (5) is fixed on the second surface (302) and connected to the universal substrate (2); and the second connector (5) is electrically connected to the first connector (4); A first extension component, fixedly connected to the fixture base plate (3), electrically connected to the first connector (4), and suitable for connecting to a first interface (801) of the adapter plate (8); The second extension component is fixedly connected to the fixture base plate (3), electrically connected to the second connector (5), and is suitable for connecting to the second interface (802) of the adapter board (8).

2. The test fixture according to claim 1, characterized in that: On a side close to the fixture substrate (3), the first connector (4) is provided with a first signal pin (401) and a second signal pin (402), and the second connector (5) is provided with a third signal pin (501) and a fourth signal pin (502); The first signal pin (401) is electrically connected to the first extension component, the third signal pin (501) is electrically connected to the second extension component; and the second signal pin (402) is electrically connected to the fourth signal pin (502).

3. The test fixture according to claim 2, characterized in that: The first extension component includes: A first cable (601), one end of which is fixed on the fixture substrate (3) and connected to the first signal pin (401); The first expansion card (602) is connected to the other end of the first cable (601) and is connected to the first interface (801) of the adapter board (8).

4. The test fixture according to claim 3, characterized in that: The first expansion card (602) comprises a first solder pad (6021) and a gold finger (6022); the first cable (601) is connected to the first solder pad (6021); the first solder pad (6021) is connected to the gold finger (6022) via a circuit trace; and the gold finger (6022) is suitable for connecting to the first interface (801) of the adapter board (8).

5. The test fixture according to claim 2, characterized in that: The second expansion component includes: A second cable (701) has one end fixed on the fixture substrate (3) and connected to the third signal pin (501). The second expansion card (702) is connected to the other end of the second cable (701) and is connected to the second interface (802) of the adapter board (8).

6. The test fixture according to claim 5, characterized in that: The second expansion card (702) comprises a second solder pad (7021) and a third connector (7022), wherein the second solder pad (7021) and the third connector (7022) are respectively arranged on two sides of the second expansion card (702), the second cable (701) is connected to the second solder pad (7021), the second solder pad (7021) is connected to the third connector (7022) through a via, and the third connector (7022) is suitable for connecting to the second interface (802) of the adapter board (8).

7. The test fixture according to any one of claims 2 to 6, characterized in that: Also includes: A third pad (303) is disposed on the first surface (301) and is electrically connected to the first signal pin (401), and the first extension component is connected to the third pad (303); A fourth solder pad (304) is disposed on the second surface (302) and is electrically connected to the third signal pin (501), and the second extension component is connected to the fourth solder pad (304).

8. The test fixture according to claim 7, characterized in that: The fixture substrate (3) is provided with a through hole (305), and the test fixture further comprises a first connecting wire, one end of which is connected to the second signal pin (402), and the other end of which passes through the through hole (305) and is connected to the fourth signal pin (502).

9. The test fixture according to claim 7, characterized in that: The fixture substrate (3) also includes: A first blind hole (306) is arranged on the side where the first surface (301) is located, corresponding to the position where the first signal pin (401) is located; A second blind hole (307) is arranged on the side where the first surface (301) is located, is spaced apart from the first blind hole (306), and corresponds to the position where the third pad (303) is located; A first communicating hole (308), arranged between the first surface (301) and the second surface (302), and having two ends respectively communicating with the first blind hole (306) and the second blind hole (307); A third blind hole (309) is arranged on the side where the second surface (302) is located, corresponding to the position where the third signal pin (501) is located; a fourth blind hole (310), arranged on the side where the second surface (302) is located, spaced apart from the third blind hole (309), and corresponding to the position where the fourth pad (304) is located; A second communicating hole (311), arranged between the first surface (301) and the second surface (302), spaced apart from the first communicating hole (308), and having two ends respectively connected to the third blind hole (309) and the fourth blind hole (310); The test fixture further comprises a second connecting wire and a third connecting wire; one end of the second connecting wire is connected to the first signal pin (401), and the other end sequentially passes through the first blind hole (306), the first connecting hole (308) and the second blind hole (307) to be connected to the third soldering pad (303); one end of the third connecting wire is connected to the third signal pin (501), and the other end sequentially passes through the third blind hole (309), the second connecting hole (311) and the fourth blind hole (310) to be connected to the fourth soldering pad (304).

10. The test fixture according to claim 9, characterized in that: The third solder pad (303) is arranged adjacent to the first connector (4), and the first connecting hole (308) is arranged on a side close to the first surface (301); The fourth solder pad (304) is arranged adjacent to the second connector (5), and the second connecting hole (311) is arranged on a side close to the second surface (302).

Images