Power supply network, system and server

Abstract

The invention discloses a power supply network, a system and a server, relates to the field of power supply, and is used for solving the problem of high loss when the existing server works. According to the power supply network, the power supply wires are distributed on the printed circuit boards in the multiple areas, the resistance value of the power supply wires is smaller than that of the power lines in the main board, the design intention is to reduce loss in the power transmission process and improve the power supply efficiency, adjustment is carried out in the voltage management module, power transmission is more efficient, loss is lower, and the power supply efficiency is improved. According to the invention, the heat loss and energy waste of the server in the power transmission process are reduced, and the power supply efficiency of the server is improved, so that the total energy consumption of the data center where the server is located during high-load operation is reduced, and the pressure of the power infrastructure is relieved.

Description

Technical Field

[0001] The present invention relates to the field of power supply, and in particular to a power supply network, system and server. Background Art

[0002] As the demand for data centers grows, the amount of electricity they consume is also increasing. Some data centers even consume more energy than the current renewable energy supply when running at full capacity. The rapid development of technology will bring huge challenges to the current power infrastructure. Therefore, many cloud service providers and component suppliers are studying how to reduce power consumption in order to obtain higher efficiency from chips and servers.

[0003] It can be seen that providing a power supply network to reduce the power loss of the server is a technical problem that the technical personnel in this field urgently need to solve. Summary of the invention

[0004] The purpose of the present invention is to provide a power supply network, system and server, which makes power transmission more efficient and has lower losses, reduces heat loss and energy waste of the server during power transmission, improves the power supply efficiency of the server, thereby reducing the overall energy consumption of the data center when operating at high load, and helps to alleviate the pressure on the power infrastructure.

[0005] In a first aspect, the present application provides a power supply network applied to a server, wherein the server includes a mainboard, a voltage management module, and a module to be powered, and the power supply network includes:

[0006] A first power supply wire is provided in the first printed circuit board and is used to connect the power supply and the voltage management module;

[0007] and / or, a second power supply wire, provided in a second printed circuit board, for connecting the voltage management module, a third power supply wire or a power line on the mainboard, the voltage management module being mounted on the second printed circuit board;

[0008] And / or, the third power wire is arranged in a third printed circuit board, and is used to connect the power wire on the mainboard or the second power wire, and the module to be powered, and the module to be powered is installed on the third printed circuit board or the upper layer of the mainboard;

[0009] All power wires and / or the power wires in the mainboard and the voltage management module work together to transfer the power provided by the power supply to the module to be powered; the resistance of each power wire is smaller than the resistance of the power wire in the mainboard.

[0010] The i-th printed circuit board is installed on the upper layer or the lower layer of the main board, and i is one, two or three;

[0011] And when i is three, if the third printed circuit board is installed on the upper layer of the mainboard, the module to be powered is installed on the third printed circuit board; if the third printed circuit board is installed on the lower layer of the mainboard, the module to be powered is installed on the mainboard, and the distance between the module to be powered and the heat dissipation module is greater than the distance between the third printed circuit board and the heat dissipation module.

[0012] Wherein, if the power supply network includes a jth power supply wire and a j+1th power supply wire, and the jth printed circuit board is adjacent to the j+1th printed circuit board, j is one or two;

[0013] The jth printed circuit board and the j+1th printed circuit board are integrally formed into a first total printed circuit board, and the first total printed circuit board is installed on the upper layer or the lower layer of the main board;

[0014] The module to be powered is installed on the first main printed circuit board;

[0015] When j is 2, the module to be powered is installed on the upper layer of the first main printed circuit board or the main board.

[0016] Wherein, if the power supply network includes three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order;

[0017] The first printed circuit board, the second printed circuit board and the third printed circuit board are integrally formed into a second total printed circuit board, and the second total printed circuit board is installed on the upper layer or the lower layer of the main board;

[0018] The module to be powered is installed on the second main printed circuit board, and the module to be powered is installed on the second main printed circuit board or the upper layer of the main board.

[0019] Wherein, the upper layer or the lower layer of the main board is provided with an i-th groove;

[0020] The size of the i-th groove is the same as the size of the i-th printed circuit board, and the i-th printed circuit board is installed in the i-th groove.

[0021] Wherein, if the power supply network includes a jth power supply wire and a j+1th power supply wire, and the jth printed circuit board is adjacent to the j+1th printed circuit board, j is one or two;

[0022] The jth printed circuit board and the j+1th printed circuit board are integrally formed into a first total printed circuit board, and the first total printed circuit board is installed on the upper layer or lower layer of the main board; the module to be powered is installed on the first total printed circuit board; when j is 2, the module to be powered is installed on the first total printed circuit board or the upper layer of the main board. ;

[0023] The jth groove and the j+1th groove are integrally formed into a first general groove, and the first general printed circuit board is installed in the first general groove.

[0024] Wherein, if the power supply network includes three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order;

[0025] The first printed circuit board, the second printed circuit board and the third printed circuit board are integrally formed into a second total printed circuit board, and the second total printed circuit board is installed on the upper layer or lower layer of the main board; the module to be powered is installed on the second total printed circuit board, and the module to be powered is installed on the second total printed circuit board or the upper layer of the main board.

[0026] The first groove, the second groove, and the third groove are integrally formed into a second total groove, and the second total printed circuit board is installed in the second total groove.

[0027] Wherein, when the power supply network includes an i-th power wire, the i-th power wire replaces a portion of the power wires of the mainboard corresponding to the i-th power wire.

[0028] Wherein, the thickness of each of the power wires is greater than the thickness of the power wire of the mainboard, so that the resistance value of each of the power wires is smaller than the resistance value of the power wire of the mainboard.

[0029] Among them, the material of each of the power wires is a preset material or a preset composite material, the thickness of the power wire is not less than the thickness of the power wire of the mainboard, and the resistance of the power wire of the first size composed of the preset material or the preset composite material is less than the resistance of the power wire of the mainboard of the first size.

[0030] Wherein, when the power supply network includes all the power supply wires and the power supply wires of the mainboard, the power supply network also includes:

[0031] A switching device, a first end of which is connected to the power supply, a second end of which is connected to the input end of the first power wire, and a third end of which is connected to the power line of the mainboard;

[0032] The switching device is used to select, according to the control instruction, to conduct the first path between its first end and the second end so that the power supply provides power to the module to be powered through the first path, or to conduct the second path between its first end and the third end so that the power supply provides power to the module to be powered through the second path;

[0033] The control instruction is determined according to the acquired target power supply and the power consumption of the server.

[0034] Wherein, the power supply network also includes:

[0035] A prediction module, whose output end is connected to the switching device, is used to obtain the historical power consumption data of the server in a historical preset time period and the target task of the server in a future preset time period, predict the expected power consumption of the server in the future preset time period based on the target task and the historical power consumption data, and generate the control instruction based on the expected power consumption and the acquired target power supply in the future preset time period.

[0036] The prediction module is specifically used to generate a first control instruction when the difference between the target power supply and the expected power consumption is greater than a preset threshold, and to generate a second control instruction when the difference between the target power supply and the expected power consumption is not greater than the preset threshold;

[0037] The switching device is specifically used to open a first path between its first end and the second end according to the first control instruction so that the power supply provides power to the module to be powered through the first path, and to open a second path between its first end and the third end according to the second control instruction so that the power supply provides power to the module to be powered through the second path.

[0038] In a second aspect, the present application provides a power supply system, which is applied to a server, wherein the server includes a mainboard, a voltage management module and a module to be powered, including:

[0039] The power supply is a power supply network such as the one described above, wherein the input end of the power supply network is connected to the power supply, and the output end of the power supply network is connected to the power supply end of the module to be powered.

[0040] In a third aspect, the present application provides a server, comprising the power supply system as described above.

[0041] The present invention provides a power supply network, system and server, which are used to solve the problem of high loss when the server is working. The power supply network distributes power wires on printed circuit boards in multiple areas, and the resistance of the power wires is less than the resistance of the power wires in the mainboard. This design intention is to reduce the loss during power transmission and improve the power supply efficiency. The voltage management module is adjusted to make power transmission more efficient and less loss, reduce the heat loss and energy waste of the server during power transmission, improve the power supply efficiency of the server, thereby reducing the overall energy consumption of the data center where the server is located when running under high load, and help alleviate the pressure on the power infrastructure. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0043] Figure 1 A structural block diagram of a power supply network provided by the present invention;

[0044] Figure 2 A schematic diagram of a first embodiment of a power supply network provided by the present invention;

[0045] Figure 3 A schematic diagram of a second embodiment of a power supply network provided by the present invention;

[0046] Figure 4 A schematic diagram of a third embodiment of a power supply network provided by the present invention;

[0047] Figure 5 A schematic diagram of a fourth embodiment of a power supply network provided by the present invention;

[0048] Figure 6 A schematic diagram of a fifth embodiment of a power supply network provided by the present invention;

[0049] Figure 7 A schematic diagram of a sixth embodiment of a power supply network provided by the present invention;

[0050] Figure 8 A schematic diagram of a seventh embodiment of a power supply network provided by the present invention;

[0051] Fig. 9 A schematic diagram of an eighth embodiment of a power supply network provided by the present invention;

[0052] Fig.10 A schematic diagram of a ninth embodiment of a power supply network provided by the present invention;

[0053] Fig.11 A schematic diagram of a tenth embodiment of a power supply network provided by the present invention;

[0054] Fig.12 A schematic diagram of an eleventh embodiment of a power supply network provided by the present invention;

[0055] Fig.13 This is a schematic diagram of a twelfth embodiment of a power supply network provided by the present invention. DETAILED DESCRIPTION

[0056] The core of the present invention is to provide a power supply network, system and server, which makes power transmission more efficient and has lower losses, reduces the heat loss and energy waste of the server during power transmission, improves the power supply efficiency of the server, thereby reducing the overall energy consumption of the data center when running at high load, and helps to alleviate the pressure on the power infrastructure.

[0057] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0058] First, as Figure 1 As shown, Figure 1 The direction indicated by the dotted arrow is the flow direction of the power supply. The present application provides a power supply network, which is applied to a server. The server includes a mainboard 31, a voltage management module 33 and a module to be powered 34. The power supply network includes:

[0059] A first power supply wire 11 is disposed in the first printed circuit board 21 and is used to connect the power supply 32 and the voltage management module 33;

[0060] and / or, the second power conductor 12 is disposed in the second printed circuit board 22 and is used to connect the voltage management module 33, the third power conductor 13 or the power line on the main board 31, and the voltage management module 33 is mounted on the second printed circuit board 22;

[0061] And / or, a third power conductor 13 is provided in the third printed circuit board 23, and is used to connect the power line on the mainboard or the second power conductor 12, and the module to be powered 34, and the module to be powered 34 is installed on the upper layer of the third printed circuit board 23 or the mainboard 31;

[0062] All power wires and / or the power wires in the mainboard 31 and the voltage management module 33 work together to transfer the power provided by the power supply 32 to the module to be powered 34; the resistance of each power wire is smaller than the resistance of the power wire in the mainboard 31.

[0063] In this embodiment, the power supply network is designed for the server system to improve power transmission efficiency and reduce energy loss. There are multiple components in the server that require power support: a motherboard 31, a voltage management module 33 (responsible for adjusting voltage) and various modules to be powered 34 (specific components, such as CPU, GPU, processor or storage unit, etc.). The power supply network transmits power through multiple wire systems to ensure that each component obtains the required stable power supply.

[0064] Specifically, the power enters the voltage management module through the first power conductor 11, where the voltage is adjusted. The first power conductor 11 is located in the circuit layer of the first printed circuit board 21 to ensure that the power can be transmitted efficiently. The power adjusted by the voltage management module 33 can be further transmitted through the second power conductor 12 and / or the third power conductor 13. The second power conductor 12 and / or the third power conductor 13 are respectively arranged in the second and third printed circuit boards 23 to further transmit the power to the required modules, such as the CPU or GPU. The resistance of each power conductor (i.e., the "resistance" of the conductor to the flow of current) is designed to be lower than that of the ordinary power line on the motherboard 31, thereby reducing the loss of power during transmission and ensuring that the power is stably and efficiently transmitted to the final target module.

[0065] In summary, the power supply network provided in this embodiment makes power transmission more efficient and has lower losses, reduces heat loss and energy waste of the server during power transmission, improves the power supply efficiency of the server, thereby reducing the overall energy consumption of the data center when operating at high load, and helps to alleviate the pressure on the power infrastructure.

[0066] Based on the above embodiments:

[0067] As an optional embodiment, the i-th printed circuit board is mounted on the upper layer or the lower layer of the main board 31, and i is one, two or three;

[0068] And when i is three, if the third printed circuit board 23 is installed on the upper layer of the mainboard 31, the module to be powered 34 is installed on the third printed circuit board 23; if the third printed circuit board 23 is installed on the lower layer of the mainboard 31, the module to be powered 34 is installed on the mainboard 31, and the distance between the module to be powered 34 and the heat dissipation module is greater than the distance between the third printed circuit board 23 and the heat dissipation module.

[0069] In this embodiment, the i-th printed circuit board (i is one, two or three) can be flexibly installed on the upper or lower layer of the mainboard 31, thereby providing design flexibility and adaptability. Specifically, installing the i-th printed circuit board on the lower layer of the mainboard 31 can effectively reduce the occupation of the upper space of the mainboard 31, thereby providing more possibilities for arranging other functional modules on the upper layer of the mainboard 31. This design principle is based on the need for space optimization. In many servers and electronic devices, the upper layer of the mainboard 31 is usually the priority area for arranging key functional modules, such as processors, memory and other high-performance components. By placing certain auxiliary modules (such as the i-th printed circuit board) on the lower layer, the space on the upper layer can be freed up to enable it to carry more important components or functional modules, thereby improving the functional density of the overall system. This layout not only improves the integration between components, but also may improve the efficiency of signal transmission, because short-distance connections can reduce signal attenuation and interference. In addition, increasing the flexibility of the upper space enables designers to flexibly configure various functional modules according to specific needs and application scenarios, and optimize system performance and functional scalability.

[0070] When i is three, the installation position of the third printed circuit board 23 directly affects the placement of the module to be powered 34. If the third printed circuit board 23 is located on the upper layer of the mainboard 31, the module to be powered 34 is installed on the third printed circuit board 23. Such a layout helps to shorten the connection path between the power supply module and the power wire, thereby optimizing the efficiency of power transmission. Conversely, if the third printed circuit board 23 is located on the lower layer of the mainboard 31, the module to be powered 34 is directly installed on the mainboard 31. This design is intended to provide a better heat dissipation solution for the module to be powered 34. Specifically, the distance between the module to be powered 34 and the heat dissipation module is greater than the distance between the third printed circuit board 23 and the heat dissipation module. The need for thermal management is taken into account to ensure that the module to be powered 34 can dissipate heat in a relatively loose space, reduce the potential impact of high temperature on power components, and improve the stability and reliability of the module.

[0071] In general, this flexible printed circuit board mounting solution not only improves the efficiency of power transmission, but also provides a better solution for heat dissipation management, which helps optimize the overall system performance.

[0072] As an optional embodiment, if the power supply network includes a jth power supply wire and a j+1th power supply wire, and the jth printed circuit board is adjacent to the j+1th printed circuit board, and j is one or two;

[0073] The jth printed circuit board and the j+1th printed circuit board are integrally formed into a first total printed circuit board 41, and the first total printed circuit board 41 is installed on the upper layer or the lower layer of the main board 31;

[0074] The module to be powered 34 is mounted on the first main printed circuit board 41;

[0075] When j is 2, the module to be powered 34 is installed on the upper layer of the first main printed circuit board 41 or the main board 31 .

[0076] First, if the jth printed circuit board and the j+1th printed circuit board are not integrally formed but are separate designs, this will greatly enhance the flexibility and adjustability of the power supply network. Through the separate design, designers can more easily adjust the position and angle of the two printed circuit boards independently according to actual needs and space constraints, thereby optimizing the overall layout. This flexibility means that when faced with different application scenarios or equipment structures, specific installation requirements can be easily adapted. If a printed circuit board fails or needs to be replaced, technicians can operate independently of other boards without disassembling the entire circuit module, thus saving time and reducing maintenance difficulties. This modular construction method also provides more possibilities for future system expansion. Users can flexibly add or replace circuit boards according to needs, thereby improving the functionality and performance of the system.

[0077] In this embodiment, if the power supply network design introduces the jth power supply wire and the j+1th power supply wire, the jth printed circuit board where these two wires are located is adjacent to the j+1th printed circuit board. In specific cases (j is one or two), these two printed circuit boards can be integrally formed into a first total printed circuit board 41. This integrated design not only simplifies the connection and wiring of the circuit, reduces the impedance at the connection, reduces the number of connectors and the corresponding space occupation, but also reduces the power transmission efficiency problem caused by poor contact or connector loss. The first total printed circuit board 41 can be flexibly installed on the upper or lower layer of the mainboard 31, thereby providing greater flexibility in design and being able to adapt to different space requirements and heat dissipation requirements.

[0078] In addition, the module to be powered 34 is installed on the first main printed circuit board 41 to ensure that the module to be powered 34 can obtain a stable and appropriate voltage. This design effectively integrates the power management function into the printed circuit board, simplifies the structure of the entire power supply network, and improves the reliability and maintainability of the system. When j is two, the module to be powered 34 can be installed on the upper layer of the first main printed circuit board 41 or the main board 31 (specifically, the distance between the module to be powered 34 and the heat dissipation module is greater than the distance between the third printed circuit board 23 and the heat dissipation module). This flexible installation option allows designers to reasonably arrange the position of the module to be powered 34 according to specific space and functional requirements, further improving the overall performance and functional expansion capabilities of the circuit.

[0079] In summary, this embodiment optimizes the layout of the power supply network and improves the power transmission efficiency through an integrated design and flexible installation method, while enhancing system integration and functional scalability, which helps to meet the requirements of modern servers for high performance and high-density integration.

[0080] As an optional embodiment, if the power supply network includes three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order;

[0081] The first printed circuit board 21, the second printed circuit board 22 and the third printed circuit board 23 are integrally formed into a second total printed circuit board 51, and the second total printed circuit board 51 is installed on the upper layer or the lower layer of the main board 31;

[0082] The module to be powered 34 is mounted on the second main printed circuit board 51 , and the module to be powered 34 is mounted on the upper layer of the second main printed circuit board 51 or the main board 31 .

[0083] In this embodiment, the power supply network uses three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order to achieve more efficient power management and transmission. The three printed circuit boards, the first printed circuit board 21, the second printed circuit board 22, and the third printed circuit board 23, are integrally formed into a second total printed circuit board 51. This design simplifies the overall circuit structure, reduces the connection points, and reduces the impedance of the connection, thereby reducing the loss and potential failure points during the power transmission process. At the same time, the second total printed circuit board 51 can be flexibly installed on the upper or lower layer of the main board 31, providing greater spatial adaptability for the design.

[0084] In this embodiment, the module to be powered is mounted on the second main printed circuit board 51 to ensure that the required power can be obtained stably and effectively. This integrated design not only helps to simplify the process of power management, but also improves the overall reliability of the system.

[0085] The module to be powered 34 can be installed on the upper layer of the second main printed circuit board 51 or the main board 31 according to specific needs, but the distance between the module to be powered 34 and the heat dissipation module must be considered during design to ensure that the distance is greater than the distance between the third printed circuit board 23 and the heat dissipation module. This design consideration is mainly to optimize the heat dissipation effect and avoid the adverse effects of high temperature on the module to be powered 34. By maintaining a suitable spatial distance, the temperature of the module can be effectively reduced, and its working stability and service life can be improved.

[0086] In summary, this design not only improves the efficiency of power transmission but also optimizes thermal management through an integrated overall printed circuit board structure and flexible module installation methods, meeting the requirements of modern electronic devices for high efficiency, high integration and good heat dissipation performance.

[0087] As an optional embodiment, the upper layer or the lower layer of the main board 31 is provided with an i-th groove;

[0088] The size of the i-th groove is the same as the size of the i-th printed circuit board, and the i-th printed circuit board is installed in the i-th groove.

[0089] In this embodiment, the upper layer or the lower layer of the main board 31 is provided with an i-th groove, the size of which is exactly the same as the size of the i-th printed circuit board, in order to provide a precisely matched installation position for the circuit board. This design not only improves the convenience and accuracy of installation, but also enhances the structural stability of the entire system. By installing the i-th printed circuit board in the corresponding groove, the firmness of the circuit board during use can be ensured, and displacement or damage caused by vibration or other external forces can be reduced, thereby improving the reliability of the system.

[0090] In addition, this groove design helps to optimize the use of space and ensure that the printed circuit board can be effectively fixed on the mainboard 31, thereby avoiding the use of unnecessary connectors or support structures and simplifying the layout of the circuit. At the same time, the presence of the groove also helps to improve the heat dissipation performance. Because the groove can serve as a natural heat dissipation channel, the heat can be more effectively transferred to the surface of the mainboard 31, thereby improving the overall thermal management efficiency.

[0091] In terms of design, this method can provide better wiring space, facilitate the reasonable arrangement of wires and power transmission, and reduce the risk of signal interference. In addition, the precise matching of the groove size with the circuit board also facilitates subsequent maintenance and replacement work, and technicians can disassemble and assemble more conveniently, improving the maintainability of the system.

[0092] As an optional embodiment, if the power supply network includes a jth power supply wire and a j+1th power supply wire, and the jth printed circuit board is adjacent to the j+1th printed circuit board, and j is one or two;

[0093] The jth printed circuit board and the j+1th printed circuit board are integrally formed into a first total printed circuit board 41, and the first total printed circuit board 41 is installed on the upper layer or lower layer of the main board 31; the module to be powered is installed on the first total printed circuit board 41; when j is 2, the module to be powered 34 is installed on the upper layer of the first total printed circuit board 41 or the main board 31.;

[0094] The jth groove and the j+1th groove are integrally formed into a first main groove, and the first main printed circuit board 41 is installed in the first main groove.

[0095] In this embodiment, the first total groove is formed by integrally forming the jth groove and the j+1th groove. This integrated design greatly enhances the stability of the installation and the integrity of the overall structure. By merging two adjacent grooves into one total groove, it is possible to ensure that the first total printed circuit board 41 obtains a stable and accurate positioning during the installation process. This groove design not only provides a suitable space to accommodate the circuit board, but also optimizes the fit between the circuit board and the main board 31, avoiding poor contact and functional failure due to mismatch or deviation. In addition, the presence of the first total groove also provides better conditions for heat dissipation, because the integrated design reduces the obstruction of air flow, helps to improve the efficiency of heat conduction, and ensures the safe and stable operation of the system.

[0096] As an optional embodiment, if the power supply network includes three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order;

[0097] The first printed circuit board 21, the second printed circuit board 22 and the third printed circuit board 23 are integrally formed into a second main printed circuit board 51, and the second main printed circuit board 51 is installed on the upper layer or lower layer of the main board 31; the power supply module 34 is installed on the second main printed circuit board 51 or the upper layer of the main board 31.

[0098] The first groove, the second groove and the third groove are integrally formed into a second main groove, and the second main printed circuit board 51 is installed in the second main groove.

[0099] In this embodiment, the second total groove is formed by integrally forming the first groove, the second groove and the third groove, and is intended to provide a precise fixed position for the second total printed circuit board 51. Such a design not only simplifies the installation process, so that multiple circuit boards can be placed firmly in one groove at the same time, but also further enhances the structural integrity and stability of the system. By integrating multiple grooves into one total groove, the overall poor installation caused by the displacement or damage of a single groove can be effectively reduced, ensuring good electrical connection between the power wire and the circuit board, thereby improving the reliability and efficiency of the power supply network. In addition, the design of the second total groove can also optimize the heat dissipation performance, avoid the heat dissipation affected by the air isolation between multiple independent grooves, and thereby improve the working stability of the entire device. In short, the design concepts of these two total grooves are aimed at optimizing the performance of the overall circuit by improving the stability and heat dissipation performance of the components, laying the foundation for high efficiency and reliability.

[0100] As an optional embodiment, when the power supply network includes the i-th power wire, the i-th power wire replaces the power wires of the mainboard 31 that correspond to the i-th power wire.

[0101] In this embodiment, when the power supply network includes the i-th power wire, the i-th power wire is chosen to directly replace the portion of the power wire of the mainboard 31 corresponding to the i-th power wire. The core of this design strategy is to simplify the power transmission path by removing the corresponding power wire in the mainboard 31 and using the i-th power wire to form a power path alone.

[0102] This replacement design can reduce the complexity and number of components on the circuit board by eliminating the power line in the mainboard 31, thereby reducing manufacturing and maintenance costs. At the same time, the simplified power path helps to reduce interference between power wires and improve the clarity and stability of signal transmission. This design with fewer connection points can reduce losses during power transmission, improve energy efficiency, and thus optimize the overall performance of the server. This design helps to save space in the mainboard 31, especially in high-density circuit board layouts. Using the i-th power line to replace the power line of the mainboard 31 can free up valuable space for other functional modules or heat dissipation components, thereby improving the functional integration of the system. At the same time, this flexible power management method also makes it more convenient for the device to be upgraded or expanded in the future. Users can easily adjust the configuration of the power line according to their needs without considering the limitations of the power line of the mainboard 31.

[0103] As an optional embodiment, the thickness of each power wire is greater than the thickness of the power wire of the mainboard 31 , so that the resistance of each power wire is smaller than the resistance of the power wire of the mainboard 31 .

[0104] In this embodiment, the thickness of each power conductor is greater than the thickness of the power line of the mainboard 31. The core goal of this design choice is to reduce the impedance of the power conductor, thereby achieving more efficient power transmission. Since the resistance of the power conductor is inversely proportional to its cross-sectional area, increasing the thickness of the conductor can effectively increase the cross-sectional area of ​​the conductor, thereby reducing its resistance. This design not only helps to reduce the energy loss of electricity during transmission and improve the overall power efficiency, but also reduces the heat accumulation caused by high current, reduces the risk of heating of the equipment, and thus improves the heat dissipation performance of the system. In addition, the larger wire thickness improves the mechanical strength of the power conductor to a certain extent, enhances the reliability of the system, and ensures stable power supply under high load conditions.

[0105] As an optional embodiment, the material of each power wire is a preset material or a preset composite material, the thickness of the power wire is not less than the thickness of the power wire of the mainboard 31, and the resistance of the power wire of the first size composed of the preset material or the preset composite material is less than the resistance of the power wire of the mainboard 31 of the first size.

[0106] In this embodiment, the material of the power wire is selected as a preset material or a preset composite material, and its thickness is not less than the thickness of the power wire of the mainboard 31, ensuring that the resistance of the power wire composed of these materials is less than the resistance of the power wire of the mainboard 31. By adopting high-conductivity materials or optimized composite materials, the conductivity of the power wire can be effectively improved, and even under the same thickness, the impedance of the wire is still lower than the power wire of the mainboard 31. This design ensures that under the same space and design constraints, the power wire can achieve better power transmission efficiency and reduce power consumption. For example, when the power wire of the mainboard 31 is a copper wire, the preset material or preset composite material of the power wire can be aluminum alloy, silver or highly conductive carbon nanomaterials. These materials have higher conductivity and can provide a lower resistance value than copper wire under the same conditions. At the same time, they may have lighter weight or better corrosion resistance, improving the adaptability of the system in various working environments.

[0107] Specifically, Figures 2 to 4 As shown, this embodiment discloses three technical solutions for reducing the resistance of the power layer wire in the printed circuit board from the outlet of the power supply 32 to the inlet of the voltage management module 33.

[0108] in, Figure 2 The solution of using a low-resistance first printed circuit board 21 is shown. The first printed circuit board 21 is located above the mainboard 31 and connects the power supply 32 with the voltage management module 33. The voltage management module 33 can be a single-stage conversion (such as 12V-1 V conversion) or a two-stage conversion (such as 48 / 54 Vx-1 V conversion). The voltage management module 33 is installed on the mainboard 31 and connected to the module to be powered 34, forming a power supply path of "power supply 32 → first printed circuit board 21 → voltage management module 33 → module to be powered 34".

[0109] Figure 3 The solution of using a low-resistance first printed circuit board 21 is shown. The first printed circuit board 21 replaces a part of the mainboard 31 structure, is embedded in the mainboard 31, connects the power supply 32 and the voltage management module 33, and the voltage management module 33 is installed on the mainboard 31 and connected to the module to be powered 34, forming a power supply path of "power supply 32 → first printed circuit board 21 → voltage management module 33 → module to be powered 34".

[0110] Figure 4The solution of using a low-resistance first printed circuit board 21 is shown. The first printed circuit board 21 is located below the main board 31, connecting the power supply 32 and the voltage management module 33. The voltage management module 33 is installed on the main board 31 and connected to the module to be powered 34, forming a power supply path of "power supply 32 → first printed circuit board 21 → voltage management module 33 → module to be powered 34". All three solutions can reduce the wire resistance of the power layer in the first printed circuit board 21 from the outlet of the power supply 32 to the inlet of the voltage management module 33.

[0111] like Figures 5 to 7 As shown, this embodiment discloses three technical solutions for reducing the resistance of the power layer conductor in the printed circuit board in the voltage management module 33 area, wherein: Figure 5 The solution of using the first and second low-resistance printed circuit boards 22 is shown. The second printed circuit board 22 replaces a part of the main board 31 structure, is embedded in the main board 31, and connects the first low-resistance printed circuit board 21 with the voltage management module 33. The voltage management module 33 is mounted on the second low-resistance printed circuit board 22 and is connected to the module to be powered 34, forming a power supply path of "power supply 32 → first low-resistance printed circuit board 21 → second low-resistance printed circuit board 22 → voltage management module 33 → module to be powered 34".

[0112] Figure 6 The solution of using the first and second low-resistance printed circuit boards 22 is shown. The second printed circuit board 22 replaces a part of the main board 31 structure and is embedded in the main board 31. The second printed circuit board 22 connects the first printed circuit board 21 and the voltage management module 33. The voltage management module 33 is mounted on the second printed circuit board 22 and is connected to the module to be powered 34. The first printed circuit board 21 replaces a part of the main board 31 structure and is embedded in the main board 31, forming a power supply path of "power supply 32 → low-resistance first printed circuit board 21 → low-resistance second printed circuit board 22 → voltage management module 33 → module to be powered 34".

[0113] Figure 7 The solution of using low-resistance first and second printed circuit boards 22 is shown. The second printed circuit board 22 replaces a part of the main board 31 structure, is embedded in the main board 31, connects the low-resistance first printed circuit board 21 and the voltage management module 33, the voltage management module 33 is installed on the low-resistance second printed circuit board 22, and is connected to the module to be powered 34. The low-resistance first printed circuit board 21 is located on the back of the main board 31, forming a power supply path of "power supply 32 → low-resistance first printed circuit board 21 → low-resistance second printed circuit board 22 → voltage management module 33 → module to be powered 34". All three solutions can reduce the resistance of the power layer wire in the printed circuit board in the area of ​​the voltage management module 33.

[0114] like Figures 8 to 10 As shown, this embodiment discloses three technical solutions for reducing the resistance of the power layer conductor in the printed circuit board in the voltage management module 33 area.

[0115] in, Figure 8 The solution of using a low-resistance printed circuit board is shown. The first main printed circuit board 41 is located above the main board 31, connecting the power supply 32 and the module to be powered 34. The voltage management module 33 is installed on the low-resistance first main printed circuit board 41, forming a power supply path of "power supply 32 → first main printed circuit board 41 → voltage management module 33 → module to be powered 34".

[0116] Fig. 9 The solution of using a low-resistance printed circuit board is shown. The first main printed circuit board 41 replaces a part of the main board 31 structure, is embedded in the main board 31, connects the power supply 32 and the module to be powered 34, and the voltage management module 33 is installed on the first main printed circuit board 41, forming a power supply path of "power supply 32 → first main printed circuit board 41 → voltage management module 33 → module to be powered 34";

[0117] Fig.10 The solution of using a low-resistance printed circuit board is shown. The printed circuit board is located on the back of the main board 31, connecting the power supply 32 and the module to be powered 34. The voltage management module 33 is installed on the first main printed circuit board 41, forming a power supply path of "power supply 32 → first main printed circuit board 41 → voltage management module 33 → module to be powered 34". All three solutions can reduce the resistance of the power layer wire in the printed circuit board in the area of ​​the voltage management module 33.

[0118] like Figures 11 to 13 As shown, this embodiment discloses three technical solutions for reducing the resistance of the power layer conductor in the printed circuit board directly below the module to be powered 34.

[0119] in, Fig.11 The solution of using a second main printed circuit board 51 with a low resistance is shown. The second main printed circuit board 51 is located above the main board 31, connecting the power supply 32 and the module to be powered 34. The voltage management module 33 is installed on the second main printed circuit board 51, and the module to be powered 34 is installed on the second main printed circuit board 51, forming a power supply path of "power supply 32 → second main printed circuit board 51 + voltage management module 33 → module to be powered 34";

[0120] Fig.12The solution of using a second main printed circuit board 51 with a low resistance is shown. The second main printed circuit board 51 replaces a part of the main board 31 structure, is embedded in the main board 31, connects the power supply 32 and the module to be powered 34, the voltage management module 33 is installed on the second main printed circuit board 51, and the module to be powered 34 is installed on the second main printed circuit board 51, forming a power supply path of "power supply 32 → second main printed circuit board 51 + voltage management module 33 → module to be powered 34";

[0121] Fig.13 The solution of using a low-resistance second main printed circuit board 51 is shown. The second main printed circuit board 51 is located on the back of the main board 31. The second main printed circuit board 51 replaces a part of the main board 31 structure, is embedded in the main board 31, and connects the power supply 32 and the module to be powered 34. The voltage management module 33 is installed on the second main printed circuit board 51, and the module to be powered 34 is installed on the main board 31, forming a power supply path of "power supply 32 → second main printed circuit board 51 + voltage management module 33 → module to be powered 34". All three solutions can reduce the resistance of the power layer wire in the printed circuit board directly below the module to be powered 34.

[0122] It should be understood that this application only lists Figure 2-Figure 13 These 12 embodiments do not list all the embodiments of the present application.

[0123] The technical solution of the present invention can effectively reduce the resistance of the power layer wire in the printed circuit board from the power bus outlet of the power supply 32 to the entrance of the voltage management module 33, and / or reduce the resistance of the power layer wire in the printed circuit board directly below the voltage management module 33, or reduce the resistance of the power layer wire in the printed circuit board in the integrated module of the voltage management module 33, and / or reduce the resistance of the power layer wire in the printed circuit board directly below the module to be powered 34, thereby helping to reduce the power loss during long-distance transmission in the path, reducing the power loss on the server motherboard 31, and improving energy efficiency.

[0124] As an optional embodiment, when the power supply network includes all power supply wires and the power supply wires of the mainboard 31, the power supply network also includes:

[0125] A switching device, a first end of which is connected to the power supply 32, a second end of which is connected to the input end of the first power wire 11, and a third end of which is connected to the power line of the mainboard 31;

[0126] The switching device is used to conduct the second path between the first end and the third end according to the control instruction so that the power supply 32 provides power to the module to be powered 34 through the second path;

[0127] The switching device receives a control instruction when a first path between the first end and the second end of the switching device fails.

[0128] In this embodiment, the design of the power supply network takes into account the reliability and flexibility of the power supply, and ensures that the sudden fault situation can be dealt with during the power transmission process through the coordinated work of the switching device and the fault detection module. Specifically, the first end of the switching device is connected to the power supply 32, the second end is connected to the input end of the first power wire 11, and the third end is connected to the power line of the mainboard 31. This layout allows the switching device to flexibly switch between different power wires, thereby ensuring that the module to be powered 34 can always obtain the required power.

[0129] When the switching device is in normal working state, it will conduct the first path between the first end and the second end according to the control instruction, so that the power supply 32 provides power to the module to be powered 34 through the path. However, in order to enhance the fault tolerance of the system, the switching device also has the function of automatically switching when a fault occurs in the first path. When the fault detection module detects an abnormality or fault in the first path, it will immediately send a control instruction to the switching device, instructing the switching device to conduct the second path between the first end and the third end. In this way, the power supply 32 can continue to provide power to the module to be powered 34 through the power line of the mainboard 31, ensuring the normal operation of the system.

[0130] Through this mechanism, the power supply network can quickly respond to faults, which not only improves the stability of power supply, but also reduces the risk of power outages caused by single path failures. Overall, this design concept not only optimizes the flexibility of the power supply system, but also improves the safety and reliability of power supply during server operation, allowing it to respond more calmly to various workloads and environmental changes.

[0131] As an optional embodiment, when the power supply network includes all power supply wires and the power supply wires of the mainboard 31, the power supply network also includes:

[0132] A switching device, a first end of which is connected to the power supply 32, a second end of which is connected to the input end of the first power wire 11, and a third end of which is connected to the power line of the mainboard 31;

[0133] A switching device, configured to select, according to a control instruction, to conduct a first path between its first end and the second end so that the power supply 32 provides power to the module to be powered 34 through the first path, or to conduct a second path between its first end and the third end so that the power supply 32 provides power to the module to be powered 34 through the second path;

[0134] The control instruction is determined according to the acquired target power supply and the power consumption of the server.

[0135] In this embodiment, a switching device is designed to switch between different power supply paths according to control instructions, considering that flexibility and redundancy in specific scenarios are very important. First, the load of the server may change over time. For example, during peak usage, the power consumption of the server may increase significantly, while it will decrease when it is under low load or idle. In this case, the ability to switch the power supply path enables the system to flexibly adjust the source of the power supply according to the difference between the real-time power consumption and the target power supply to ensure that the power demand of the system operation is always met, thereby avoiding failures or performance degradation caused by insufficient power supply.

[0136] In addition, although the power lines of the motherboard 31 may have a high resistance, their existence is still necessary because the power lines of the motherboard 31 may assume other important functions, such as providing stable power to different modules and components. Directly abandoning the power lines of the motherboard 31 will affect the stability and reliability of the overall system, while using power lines with lower resistance can ensure stable power transmission while maintaining support for the motherboard 31. Therefore, through the design of the switching device, it is possible to dynamically select between different power lines, maximize the low resistance characteristics of the lines, and at the same time not affect the basic functions of the power lines of the motherboard 31, thereby achieving efficient, safe and reliable power supply management.

[0137] As an optional embodiment, the power supply network also includes: a prediction module, whose output end is connected to the switching device, and is used to obtain the historical power consumption data of the server in the historical preset time period, the target task of the server in the future preset time period, and predict the expected power consumption of the server in the future preset time period according to the target task and the historical power consumption data, and generate a control instruction according to the expected power consumption and the obtained target power supply in the future preset time period. As an optional embodiment, the prediction module is specifically used to generate a first control instruction when the difference between the target power supply and the expected power consumption is greater than a preset threshold, and to generate a second control instruction when the difference between the target power supply and the expected power consumption is not greater than the preset threshold; the switching device is specifically used to conduct the first path between its first end and the second end according to the first control instruction so that the power supply 32 provides power to the module to be powered 34 through the first path, and to conduct the second path between its first end and the third end according to the second control instruction so that the power supply 32 provides power to the module to be powered 34 through the second path.

[0138] In this embodiment, the power supply network introduces a prediction module, which aims to improve the energy efficiency and power supply reliability of the server through intelligent power management. The main function of the prediction module is to analyze the power consumption data of the server in the historical preset time period, and at the same time, combine the target tasks of the server in the future preset time period to conduct comprehensive evaluation and prediction. This prediction process involves the identification of past power consumption patterns and the prediction of future task requirements, so as to calculate the expected power consumption of the server in the future preset time period.

[0139] Based on the evaluation of the expected power consumption, the prediction module further compares it with the target power supply and generates corresponding control instructions. When the difference between the target power supply and the expected power consumption is greater than the preset threshold, the prediction module generates a first control instruction to instruct the switching device to give priority to the power supply wire with a lower resistance to ensure efficient power supply to cope with possible high load conditions; and when the difference between the target power supply and the expected power consumption is not greater than the preset threshold, a second control instruction is generated to allow the switching device to continue to use the power line of the mainboard 31 to achieve stable power supply. According to these control instructions, the switching device flexibly conducts its own path, so that the power supply 32 can effectively provide the required power to the module to be powered 34 through the first path or the second path.

[0140] This design not only optimizes the efficiency of power transmission, but also enhances the power supply system's ability to respond to changing load conditions, so that servers can get the required power support under different working conditions. Through the mechanism of intelligent prediction and dynamic switching, the power supply network can better adapt to the complex needs of power management in modern data centers, thereby achieving a good balance between energy saving and safety.

[0141] In a second aspect, the present application provides a power supply system, which is applied to a server, wherein the server includes a mainboard 31, a voltage management module 33 and a module to be powered 34, including:

[0142] The power supply 32 is a power supply network such as the above, the input end of the power supply network is connected to the power supply 32, and the output end of the power supply network is connected to the power supply end of the module to be powered 34. For other introductions to the power supply network, please refer to the above embodiments, and this application will not repeat them here.

[0143] In a third aspect, the present application provides a server, comprising the power supply system as described above.

[0144] For other introductions to the server, please refer to the above embodiments, and this application will not go into details here.

[0145] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0146] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power supply network, characterized in that: Applied to a server, the server includes a mainboard, a voltage management module and a module to be powered, and the power supply network includes: A first power supply wire is provided in the first printed circuit board and is used to connect the power supply and the voltage management module; and / or, a second power supply wire, provided in a second printed circuit board, for connecting the voltage management module, a third power supply wire or a power line on the mainboard, the voltage management module being mounted on the second printed circuit board; And / or, the third power wire is arranged in the third printed circuit board, and is used to connect the power wire on the mainboard or the second power wire, and the module to be powered, and the module to be powered is installed on the upper layer of the third printed circuit board or the mainboard; All power wires and / or the power wires in the mainboard and the voltage management module work together to transfer the power provided by the power supply to the module to be powered; the resistance of each power wire is smaller than the resistance of the power wire in the mainboard.

2. The power supply network according to claim 1, characterized in that The i-th printed circuit board is mounted on the upper layer or the lower layer of the main board, and i is one, two or three; And when i is three, if the third printed circuit board is installed on the upper layer of the mainboard, the module to be powered is installed on the third printed circuit board; if the third printed circuit board is installed on the lower layer of the mainboard, the module to be powered is installed on the mainboard, and the distance between the module to be powered and the heat dissipation module is greater than the distance between the third printed circuit board and the heat dissipation module.

3. The power supply network according to claim 2, characterized in that: If the power supply network includes a jth power supply wire and a j+1th power supply wire, and the jth printed circuit board is adjacent to the j+1th printed circuit board, and j is one or two; The jth printed circuit board and the j+1th printed circuit board are integrally formed into a first total printed circuit board, and the first total printed circuit board is installed on the upper layer or the lower layer of the main board; The module to be powered is installed on the first main printed circuit board; When j is 2, the module to be powered is installed on the upper layer of the first main printed circuit board or the main board.

4. The power supply network according to claim 2, characterized in that: If the power supply network includes three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order; The first printed circuit board, the second printed circuit board and the third printed circuit board are integrally formed into a second total printed circuit board, and the second total printed circuit board is installed on the upper layer or the lower layer of the main board; The module to be powered is installed on the second main printed circuit board, and the module to be powered is installed on the second main printed circuit board or the upper layer of the main board.

5. The power supply network according to claim 2, characterized in that: The upper layer or the lower layer of the main board is provided with an i-th groove; The size of the i-th groove is the same as the size of the i-th printed circuit board, and the i-th printed circuit board is installed in the i-th groove.

6. The power supply network according to claim 5, characterized in that: If the power supply network includes a jth power supply wire and a j+1th power supply wire, and the jth printed circuit board is adjacent to the j+1th printed circuit board, and j is one or two; The jth printed circuit board and the j+1th printed circuit board are integrally formed into a first total printed circuit board, and the first total printed circuit board is installed on the upper layer or the lower layer of the main board; the module to be powered is installed on the first total printed circuit board; when j is 2, the module to be powered is installed on the first total printed circuit board or the upper layer of the main board; The jth groove and the j+1th groove are integrally formed into a first general groove, and the first general printed circuit board is installed in the first general groove.

7. The power supply network according to claim 5, characterized in that: If the power supply network includes three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order; The first printed circuit board, the second printed circuit board and the third printed circuit board are integrally formed into a second total printed circuit board, and the second total printed circuit board is installed on the upper layer or the lower layer of the main board; the module to be powered is installed on the second total printed circuit board, and the module to be powered is installed on the upper layer of the second total printed circuit board or the main board; The first groove, the second groove and the third groove are integrally formed into a second total groove, and the second total printed circuit board is installed in the second total groove.

8. The power supply network according to claim 1, characterized in that: When the power supply network includes an i-th power wire, the i-th power wire replaces a portion of power wires of the mainboard corresponding to the i-th power wire, and i is one, two, or three.

9. The power supply network according to claim 1, characterized in that: The thickness of each of the power wires is greater than the thickness of the power wire of the mainboard, so that the resistance of each of the power wires is less than the resistance of the power wire of the mainboard.

10. The power supply network according to claim 1, characterized in that: The material of each of the power wires is a preset material or a preset composite material, the thickness of the power wire is not less than the thickness of the power wire of the mainboard, and the resistance of the power wire of a first size made of the preset material or the preset composite material is less than the resistance of the power wire of the mainboard of the first size.

11. The power supply network according to any one of claims 1 to 10, characterized in that: When the power supply network includes all the power supply wires and the power supply wires of the mainboard, the power supply network also includes: A switching device, a first end of which is connected to the power supply, a second end of which is connected to the input end of the first power wire, and a third end of which is connected to the power line of the mainboard; The switching device is used to select, according to the control instruction, to conduct the first path between its first end and the second end so that the power supply provides power to the module to be powered through the first path, or to conduct the second path between its first end and the third end so that the power supply provides power to the module to be powered through the second path; The control instruction is determined according to the acquired target power supply and the power consumption of the server.

12. The power supply network according to claim 11, characterized in that The power supply network also includes: A prediction module, whose output end is connected to the switching device, is used to obtain the historical power consumption data of the server in a historical preset time period and the target task of the server in a future preset time period, predict the expected power consumption of the server in the future preset time period based on the target task and the historical power consumption data, and generate the control instruction based on the expected power consumption and the acquired target power supply in the future preset time period.

13. The power supply network according to claim 12, characterized in that The prediction module is specifically used to generate a first control instruction when the difference between the target power supply and the expected power consumption is greater than a preset threshold, and to generate a second control instruction when the difference between the target power supply and the expected power consumption is not greater than the preset threshold; The switching device is specifically used to open a first path between its first end and the second end according to the first control instruction so that the power supply provides power to the module to be powered through the first path, and to open a second path between its first end and the third end according to the second control instruction so that the power supply provides power to the module to be powered through the second path.

14. A power supply system, characterized in that: Applied to a server, the server includes a mainboard, a voltage management module and a module to be powered, including: A power supply, a power supply network as described in any one of claims 1 to 13, wherein the input end of the power supply network is connected to the power supply, and the output end of the power supply network is connected to the power supply end of the module to be powered.

15. A server, characterized in that: Comprising the power supply system as claimed in claim 14.

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