Fingerprint identification correction method and apparatus, and fingerprint identification device

Abstract

The invention relates to a fingerprint identification correction method and apparatus, and a fingerprint identification device. The fingerprint identification correction method is used for fingerprint identification correction of the fingerprint identification equipment, a fingerprint identification surface is a non-planar surface, the fingerprint identification equipment comprises a capacitive sensing layer, the capacitive sensing layer corresponds to a plurality of fingerprint identification point positions, and the fingerprint identification correction method comprises the following steps: before a flexible conductor layer is attached to the fingerprint identification surface, the flexible conductor layer is attached to the fingerprint identification surface; acquiring a plurality of first sensing values of the capacitive sensing layer, wherein the first sensing values correspond to the fingerprint identification point locations; after a flexible conductor layer is attached to the fingerprint identification surface, a plurality of second induction values of the capacitive induction layer are obtained, and the second induction values correspond to the fingerprint identification point positions; setting at least one preset target induction value; and obtaining a plurality of gain values according to the plurality of first induction values, the plurality of second induction values and the target induction value, the gain values corresponding to the fingerprint identification point locations, and at least part of the gain values being different. According to the invention, the fingerprint identification accuracy can be improved.

Description

Technical Field

[0001] The present application relates to the field of fingerprint recognition technology, and in particular to a fingerprint recognition correction method and device, and a fingerprint recognition device. Background Art

[0002] In order to improve security and user convenience, fingerprint recognition technology has been widely used in various fields, such as airport security, mobile communication devices, portable tablets and other electronic devices, and more and more biometric systems are being adopted. In particular, capacitive fingerprint recognition technology is increasingly being widely promoted due to its small structure and good stability.

[0003] However, in a fingerprint recognition device having a non-planar fingerprint recognition surface, there is a problem of poor fingerprint recognition accuracy. Summary of the invention

[0004] Based on this, it is necessary to provide a fingerprint recognition correction method and device, and a fingerprint recognition device to address the problem of poor fingerprint recognition accuracy in a fingerprint recognition device with a non-planar fingerprint recognition surface.

[0005] According to a first aspect of the present application, a fingerprint recognition correction method is provided, which is used for fingerprint recognition correction of a fingerprint recognition device, wherein the fingerprint recognition device includes a fingerprint recognition surface, the fingerprint recognition surface is non-planar, the fingerprint recognition device includes a capacitive sensing layer, and the capacitive sensing layer corresponds to a plurality of fingerprint recognition points. The fingerprint recognition correction method includes:

[0006] Before placing a flexible conductive layer on the fingerprint recognition surface, obtaining a plurality of first sensing values ​​of the capacitive sensing layer, wherein the first sensing values ​​correspond to fingerprint recognition points;

[0007] After placing the flexible conductive layer on the fingerprint recognition surface, obtaining a plurality of second sensing values ​​of the capacitive sensing layer, wherein the second sensing values ​​correspond to fingerprint recognition points;

[0008] Setting at least one preset target sensing value;

[0009] A plurality of gain values ​​are obtained according to the plurality of the first sensing values, the plurality of the second sensing values ​​and the target sensing value, the gain values ​​corresponding to the fingerprint recognition points, and at least some of the gain values ​​are different.

[0010] In some embodiments, the step of obtaining a plurality of gain values ​​according to a plurality of the first sensing values, a plurality of the second sensing values, and the target sensing value comprises obtaining the gain values ​​according to the following formula:

[0011] Ga=ST / (S2-S1), Ga represents a gain value, ST represents the target sensing value, S2 represents the second sensing value, and S1 represents the first sensing value.

[0012] In some embodiments, after the step of obtaining a plurality of gain values ​​according to a plurality of the first sensing values, a plurality of the second sensing values ​​and the target sensing value, the method further includes:

[0013] The fingerprint recognition sensing values ​​of the corresponding fingerprint recognition points are corrected according to the plurality of gain values.

[0014] In some embodiments, the step of setting at least one preset target sensing value includes:

[0015] At least one of the target sensing values ​​is set according to the thickness and material of the flexible conductor layer.

[0016] In some embodiments, the fingerprint recognition surface includes a curved portion;

[0017] The capacitive sensing layer includes a plurality of sensing electrodes, and the plurality of sensing electrodes are arranged in an array along a first direction and a second direction, wherein the first direction is a bending direction of the curved surface portion, and the second direction is a direction perpendicular to the first direction, and the fingerprint recognition points correspond to the sensing electrodes;

[0018] The sensing electrodes are arranged into sensing electrode rows along the second direction, one sensing electrode row corresponds to at least two fingerprint recognition points, and a plurality of sensing electrode rows are arranged in sequence in the first direction;

[0019] In the second direction, at least two of the fingerprint recognition points corresponding to the sensing electrode array are arranged into a fingerprint recognition point array;

[0020] The gain values ​​of different fingerprint recognition points in the same fingerprint recognition point array are the same.

[0021] In some implementations, at the curved surface, the gain values ​​corresponding to two adjacent fingerprint recognition point arrays are different.

[0022] According to a second aspect of the present application, a fingerprint recognition correction device is provided, which is used for fingerprint recognition correction of a fingerprint recognition device, wherein the fingerprint recognition device includes a fingerprint recognition surface, the fingerprint recognition surface is non-planar, the fingerprint recognition device includes a capacitive sensing layer, the capacitive sensing layer corresponds to a plurality of fingerprint recognition points, and the fingerprint recognition correction device includes:

[0023] A flexible conductive layer;

[0024] an acquisition module, used for acquiring a plurality of first sensing values ​​of the capacitive sensing layer before placing a flexible conductive layer on the fingerprint recognition surface, wherein the first sensing values ​​correspond to fingerprint recognition points; and the acquisition module further acquires a plurality of second sensing values ​​of the capacitive sensing layer after placing the flexible conductive layer on the fingerprint recognition surface, wherein the second sensing values ​​correspond to fingerprint recognition points;

[0025] A setting module, used for setting at least one preset target sensing value;

[0026] The calculation module is used to obtain multiple gain values ​​according to multiple first sensing values, multiple second sensing values ​​and the target sensing value, wherein the gain values ​​correspond to fingerprint recognition points, and at least some of the gain values ​​are different.

[0027] In some embodiments, it further comprises:

[0028] The correction module is used to correct the fingerprint recognition sensing values ​​of the corresponding fingerprint recognition points according to the multiple gain values.

[0029] In some embodiments, the fingerprint recognition surface includes a curved portion;

[0030] The capacitive sensing layer includes a plurality of sensing electrodes, and the plurality of sensing electrodes are arranged in an array along a first direction and a second direction, wherein the first direction is a bending direction of the curved surface portion, and the second direction is a direction perpendicular to the first direction, and the fingerprint recognition points correspond to the sensing electrodes;

[0031] The sensing electrodes are arranged into sensing electrode rows along the second direction, one sensing electrode row corresponds to at least two fingerprint recognition points, and a plurality of sensing electrode rows are arranged in sequence in the first direction;

[0032] In the second direction, at least two of the fingerprint recognition points corresponding to the sensing electrode array are arranged into a fingerprint recognition point array;

[0033] The gain values ​​of different fingerprint recognition points in the same fingerprint recognition point array are the same;

[0034] The gain values ​​of different fingerprint recognition points in the same fingerprint recognition point array are the same.

[0035] In some implementations, at the curved surface, the gain values ​​corresponding to two adjacent fingerprint recognition point arrays are different.

[0036] According to a third aspect of the present application, a fingerprint recognition device is provided, including a fingerprint recognition surface, the fingerprint recognition surface is non-planar, the fingerprint recognition device includes a capacitive sensing layer, the capacitive sensing layer corresponds to a plurality of fingerprint recognition points, and the fingerprint recognition device further includes:

[0037] The memory stores gain values ​​corresponding to a plurality of fingerprint recognition points, at least some of the gain values ​​are different.

[0038] In some embodiments, the fingerprint recognition surface includes a curved portion;

[0039] The capacitive sensing layer includes a plurality of sensing electrodes, and the plurality of sensing electrodes are arranged in an array along a first direction and a second direction, wherein the first direction is a bending direction of the curved surface portion, and the second direction is a direction perpendicular to the first direction, and the fingerprint recognition points correspond to the sensing electrodes;

[0040] The sensing electrodes are arranged into sensing electrode rows along the second direction, one sensing electrode row corresponds to at least two fingerprint recognition points, and a plurality of sensing electrode rows are arranged in sequence in the first direction;

[0041] In the second direction, at least two of the fingerprint recognition points corresponding to the sensing electrode array are arranged into a fingerprint recognition point array;

[0042] The gain values ​​of different fingerprint recognition points in the same fingerprint recognition point array are the same.

[0043] In some implementations, at the curved surface, the gain values ​​corresponding to two adjacent fingerprint recognition point arrays are different.

[0044] In some embodiments, at least some of the sensing electrode columns have the same gain value;

[0045] The number of the plurality of gain values ​​stored in the memory is smaller than the number of the sensing electrode columns.

[0046] In the embodiment of the present application, on the one hand, through the fingerprint recognition correction method, the flexible conductive layer can be deformed. After the flexible conductive layer is placed according to the shape of the fingerprint recognition surface, the flexible conductive layer simulates the actual situation of the finger performing fingerprint recognition. The sensing electrodes in the non-planar part (curved part) have different distances from the flexible conductive layer. According to multiple first sensing values, multiple second sensing values ​​and target sensing values, multiple gain values ​​are obtained. The gain values ​​correspond to the fingerprint recognition points. Different sensing electrodes have the same target sensing value. After obtaining the gain values ​​of different sensing electrodes under the same target sensing value, the gain values ​​are used to correct the fingerprint recognition signal, thereby eliminating the influence of the curved fingerprint recognition surface on the fingerprint recognition process, thereby improving the fingerprint recognition accuracy. On the other hand, when the various steps of the fingerprint recognition correction method are performed after the cover plate is bonded, even if the fingerprint recognition device is affected by the bonding offset tolerance, resulting in different fingerprint recognition devices having different thickness changes, further aggravating the inconsistency of the distances of the sensing electrodes with different fingerprint distances, through the fingerprint recognition correction method of the present application, after obtaining the gain values ​​of different sensing electrodes under the same target sensing value, the gain value is used to correct the fingerprint recognition signal, and the inconsistency of the distance caused by the bonding offset tolerance is also eliminated, thereby improving the accuracy of fingerprint recognition. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings required for use in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0048] Figure 1 A schematic diagram of the fingerprint recognition process performed by a fingerprint recognition device provided in some embodiments of the present application.

[0049] Figure 2 A schematic diagram of the structure of a fingerprint recognition device provided in some embodiments of the present application.

[0050] Figure 3 A schematic diagram of the structure of a capacitive sensing layer of a fingerprint recognition device provided in some embodiments of the present application.

[0051] Figure 4 A schematic diagram of the first process step structure of a fingerprint recognition correction method provided in some embodiments of the present application.

[0052] Figure 5 A schematic diagram of the second process step structure of a fingerprint recognition and correction method provided in some embodiments of the present application.

[0053] Figure 6 A schematic diagram of a first intermediate process of a fingerprint recognition correction method provided in some embodiments of the present application.

[0054] Figure 7 A schematic diagram of a second intermediate process of a fingerprint recognition correction method provided in some embodiments of the present application.

[0055] Figure 8 A schematic diagram of a third intermediate process of a fingerprint recognition correction method provided in some embodiments of the present application.

[0056] Fig. 9 A fingerprint recognition correction device is provided for some embodiments of the present application. DETAILED DESCRIPTION

[0057] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0058] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0059] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0060] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0061] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0062] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0063] See also Figure 1 , Figure 1 A schematic diagram of the fingerprint recognition process performed by a fingerprint recognition device provided in some embodiments of the present application.

[0064] In the related art, in a fingerprint recognition device having a non-planar fingerprint recognition surface, there is a problem of poor fingerprint recognition accuracy. The inventors have found that, on the one hand, Figure 1As shown, the fingerprint recognition surface 101 is not a planar shape, and the distances of the fingerprint 70 from different sensing electrodes will be inconsistent. Because the capacitive fingerprint recognition technology senses the change in capacitance value, and the capacitance value is inversely proportional to the distance, the non-planar fingerprint recognition surface 101 (such as a curved fingerprint recognition surface) will lead to inconsistent sensing values, reducing the accuracy of fingerprint recognition; on the other hand, during the bonding process of the cover plate 30 (protective glass, Coverglass) and the fingerprint sensor, due to the influence of the bonding offset tolerance, different fingerprint recognition devices have different thickness changes, which further aggravates the inconsistency of the distances of the fingerprint from different sensing electrodes, and further reduces the accuracy of fingerprint recognition.

[0065] See also Figures 2 to 8 , Figure 2 A schematic diagram of the structure of a fingerprint recognition device provided in some embodiments of the present application; Figure 3 A schematic diagram of the structure of a capacitive sensing layer of a fingerprint recognition device provided in some embodiments of the present application; Figure 4 A schematic diagram of the first process step structure of a fingerprint recognition correction method provided in some embodiments of the present application; Figure 5 A schematic diagram of a second process step structure of a fingerprint recognition correction method provided in some embodiments of the present application; Figure 6 A schematic diagram of a first intermediate process of a fingerprint recognition correction method provided in some embodiments of the present application; Figure 7 A schematic diagram of a second intermediate process of a fingerprint recognition correction method provided in some embodiments of the present application; Figure 8 A schematic diagram of a third intermediate process of a fingerprint recognition correction method provided in some embodiments of the present application.

[0066] First, see Figure 3 The present application provides a fingerprint recognition correction method, including step S100, step S200, step S300 and step S400.

[0067] The fingerprint recognition correction method provided in the present application is used for fingerprint recognition correction of a fingerprint recognition device 100. The fingerprint recognition device 100 includes a fingerprint recognition surface 101, and the fingerprint recognition surface 101 is non-planar. The fingerprint recognition device 100 includes a capacitive sensing layer 10, and the capacitive sensing layer 10 corresponds to multiple fingerprint recognition points 12.

[0068] Examples, such as Figure 2 As shown, the fingerprint recognition device 100 includes a capacitive sensing layer 10, and the capacitive sensing layer 10 can be arranged on a substrate 20. The substrate 20 can be a thin film transistor substrate, a flexible substrate, a silicon-based substrate, or a display substrate, which is not limited here.

[0069] Examples, such as Figure 2 As shown, the fingerprint recognition device 100 may be a fingerprint recognition sensor, and the fingerprint recognition device 100 may be a device with a fingerprint recognition function, such as a mobile phone, a tablet computer, etc., which is not limited here.

[0070] Examples, such as Figure 2 As shown, the capacitive sensing layer 10 is disposed on one side of the substrate 20 , and the cover plate 30 (protective glass, Coverglass) is disposed on the side of the capacitive sensing layer 10 away from the substrate 20 . The cover plate 30 can protect the capacitive sensing layer 10 , and the cover plate 30 can form a fingerprint recognition surface 101 .

[0071] Examples, such as Figure 2 As shown, the capacitive sensing layer 10 corresponds to a plurality of fingerprint recognition points 12 , and the fingerprint recognition points 12 are coordinate points for fingerprint recognition.

[0072] Examples, such as Figure 2 As shown, the capacitive sensing layer 10 includes a plurality of sensing electrodes 11 .

[0073] Examples, such as Figure 2 As shown, in some embodiments, one sensing electrode 11 is one fingerprint recognition point 12, or one sensing electrode 11 corresponds to one fingerprint recognition point 12. However, it is not limited thereto. For example, in some embodiments, two or more sensing electrodes 11 correspond to one fingerprint recognition point 12.

[0074] Examples, such as Figure 2 As shown, the sensing electrode 11 can form an inductive capacitor with a conductive body such as a finger, thereby generating a fingerprint recognition signal.

[0075] In step S100 , before placing a flexible conductive layer 80 on the fingerprint recognition surface 101 , a plurality of first sensing values ​​of the capacitive sensing layer 10 are obtained, wherein the first sensing values ​​correspond to the fingerprint recognition points 12 .

[0076] For example, before step S100, Figure 6 As shown, a fingerprint recognition device 100 may be provided.

[0077] For example, before step S100, Figure 7 As shown, a flexible conductive layer 80 can be provided. For example, the flexible conductive layer 80 can be a flexible conductive foam. For example, the flexible conductive layer 80 can be attached to the fingerprint recognition surface 101 by an attaching device such as a pressing head 90. The flexible conductive layer 80 can be detachably attached to the fingerprint recognition surface 101.

[0078] For example, in some embodiments, the flexible conductive layer 80 can be attached to the fingerprint recognition surface 101 by electrostatic adsorption; in some embodiments, the flexible conductive layer 80 can be fixedly attached to the fingerprint recognition surface 101 by an attachment device such as a pressure head 90 for calibration testing.

[0079] For example, in some implementations, a plurality of first sensing values ​​of the capacitive sensing layer 10 are obtained, each first sensing value corresponds to a sensing electrode 11 , or each sensing electrode 11 has one first sensing value.

[0080] For example, in some embodiments, Figure 3 As shown, the capacitive sensing layer 10 may include a plurality of driving electrodes Tx and a plurality of sensing electrodes 11 , where the sensing electrodes 11 are sensing electrodes Rx.

[0081] For example, in some embodiments, the capacitive sensing layer 10 may include a plurality of sensing electrodes 11 , and the plurality of sensing electrodes 11 may be multiplexed as the driving electrodes Tx in a time-division multiplexing manner.

[0082] For example, in some embodiments, Figure 5 As shown, before step S100, the fingerprint recognition device 100 is connected to the processor or chip and the power supply. Before step S100, step S000 may also be included, in which the power supply is turned on.

[0083] For example, in some embodiments, Figure 5 As shown, during the calibration process, a processor or chip is electrically connected to the fingerprint recognition device 100, and the processor or chip can send multiple driving signals to the capacitive sensing layer 10 to the corresponding driving electrodes Tx, and the processor or chip can receive multiple sensing signals ( Figure 3 It illustrates that a plurality of sensing electrodes 11 are multiplexed as driving electrodes Tx), and a processor or chip etc. can receive sensing signals transmitted back by the plurality of sensing electrodes 11 as sensing values.

[0084] For example, before a flexible conductive layer 80 is attached to the fingerprint recognition surface 101, there is capacitance between the sensing electrode 11 and the driving electrode Tx, or there is capacitance between adjacent sensing electrodes 11, and the sensing signal (fingerprint recognition signal) transmitted back by the sensing electrode 11 to the processor or chip is a first sensing value.

[0085] For example, the sensing signal (fingerprint recognition signal) may be a voltage change or a current change in the sensing electrode 11 , or the sensing signal (fingerprint recognition signal) may be a capacitance change corresponding to the sensing electrode 11 .

[0086] For example, the sensing signal (fingerprint recognition signal) can be calculated or converted by the formula I=C*(dV / dT), where I represents the current in the sensing electrode 11, C represents the capacitance corresponding to the sensing electrode 11, dV represents the voltage change of the sensing electrode 11, and dT represents the time change.

[0087] Step S200, as Figure 4 , Figure 5 , Figure 7 and Figure 8 As shown, after a flexible conductive layer 80 is placed on the fingerprint recognition surface 101 , a plurality of second sensing values ​​of the capacitive sensing layer 10 are obtained, and the second sensing values ​​correspond to the fingerprint recognition points 12 .

[0088] For example, Figure 5 As shown, in step S120 , a flexible conductive layer 80 is placed on the fingerprint recognition surface 101 .

[0089] For example, in some implementations, a plurality of second sensing values ​​of the capacitive sensing layer 10 are obtained, each second sensing value corresponds to a sensing electrode 11 , or each sensing electrode 11 has one second sensing value.

[0090] For example, after a flexible conductive layer 80 is placed on the fingerprint recognition surface 101 , the sensing signal (fingerprint recognition signal) transmitted back by the sensing electrode 11 to the processor or chip is the second sensing value.

[0091] For example, in some embodiments, the flexible conductor layer 80 may be conductive foam.

[0092] For example, the flexible conductive layer 80 has a certain deformation ability, and can fit well with the non-planar fingerprint recognition surface to avoid damaging the fingerprint recognition surface. At the same time, it can simulate the scene of finger touch, or can simulate the fingerprint recognition surface 101 after the cover is attached.

[0093] For example, after a flexible conductive layer 80 is placed on the fingerprint recognition surface 101 , the capacitance between the sensing electrode 11 and the driving electrode Tx changes, and the sensing signal (fingerprint recognition signal) transmitted back by the sensing electrode 11 to the processor or chip is a second sensing value.

[0094] Step S300, setting at least one preset target sensing value.

[0095] For example, the sensing signal (fingerprint recognition signal) required or expected to be obtained at each part of the fingerprint recognition surface 101 is set as the target sensing value.

[0096] For example, the target sensing value may be one, or the target sensing value may be more than one, and one target sensing value corresponds to a group of subsequent gain values.

[0097] For example, when a target sensing value is set, the target sensing values ​​of each part of the fingerprint recognition surface 101 or each sensing electrode 11 are the same.

[0098] Step S400, obtaining a plurality of gain values ​​according to a plurality of first sensing values, a plurality of second sensing values ​​and a target sensing value, wherein the gain values ​​correspond to the fingerprint recognition points 12, and at least some of the gain values ​​are different.

[0099] For example, since the fingerprint recognition surface 101 is non-planar, the multiple second sensing values ​​obtained from the multiple sensing electrodes 11 are at least partially different. The gain value of each sensing electrode 11 can be obtained according to the multiple first sensing values, the multiple second sensing values ​​and the same target sensing value, and the gain values ​​of the sensing electrodes 11 with different second sensing values ​​are also different.

[0100] For example, the capacitance value of the sensing electrode 11 is inversely proportional to the distance from the finger. When fingerprint recognition is performed on a non-planar fingerprint recognition surface 101, the sensing electrode 11 at the curved surface has different distances from the finger. The capacitance value of the sensing electrode 11 is inversely proportional to the distances between various parts of the finger. The sensing signal (fingerprint recognition signal) of the sensing electrode 11 at the curved surface is affected by the shape of the curved surface, thereby reducing the accuracy of fingerprint recognition.

[0101] In the embodiment of the present application, on the one hand, through the fingerprint recognition correction method, the flexible conductive layer 80 can be deformed. After the flexible conductive layer 80 is placed in the shape of the fingerprint recognition surface 101, the flexible conductive layer 80 simulates the actual situation of fingerprint recognition of the finger. The sensing electrodes 11 in the non-planar part (curved part) have different distances from the flexible conductive layer 80. According to the multiple first sensing values, the multiple second sensing values ​​and the target sensing values, the gain values ​​are obtained. The gain values ​​correspond to the fingerprint recognition points 12. Different sensing electrodes 11 have the same target sensing value. After obtaining the gain values ​​of different sensing electrodes 11 under the same target sensing value, the gain values ​​are used to correct the fingerprint recognition signal, thereby eliminating the influence of the curved fingerprint recognition surface 101 on the fingerprint recognition process, thereby improving the fingerprint recognition accuracy. On the other hand, when the various steps of the fingerprint recognition correction method are performed after the cover plate 30 is bonded, even if the fingerprint recognition device is affected by the bonding offset tolerance, resulting in different fingerprint recognition devices having different thickness changes, further aggravating the inconsistency of the distances of the sensing electrodes with different fingerprint distances, through the fingerprint recognition correction method of the present application, after obtaining the gain values ​​of different sensing electrodes 11 under the same target sensing value, the gain value is used to correct the fingerprint recognition signal, and the inconsistency of the distance caused by the bonding offset tolerance is also eliminated, thereby improving the accuracy of fingerprint recognition.

[0102] In some implementations, the gain value is obtained according to the following formula:

[0103] Ga=ST / (S2-S1), Ga represents the gain value, ST represents the target sensing value, S2 represents the second sensing value, and S1 represents the first sensing value.

[0104] △S=S2-S1, △S represents the difference between the second induction value and the first induction value, Ga=ST / △S.

[0105] For example, since the fingerprint recognition surface is non-planar, the multiple second sensing values ​​obtained from the multiple sensing electrodes 11 are at least partially different, and the difference between the second sensing value and the first sensing value is also at least partially different. The gain values ​​required for different sensing electrodes 11 can be calculated by the formula Ga=ST / △S.

[0106] In some embodiments, Figure 5 As shown, the fingerprint recognition correction method further includes step S500.

[0107] Step S500: Correcting the fingerprint recognition sensing values ​​of the corresponding fingerprint recognition points according to the multiple gain values.

[0108] For example, in some embodiments, after calibration, the gain value is the coefficient that the sensing signal of the corresponding sensing electrode 11 needs to be amplified or reduced. For example, the sensing signal of the sensing electrode 11 is multiplied by the corresponding gain value, so that different sensing electrodes 11 have the same target sensing value, eliminating the difference in sensing signals caused by the non-planar fingerprint recognition surface. After calibration, the difference in sensing signals of different sensing electrodes 11 is the difference between different parts of the fingerprint or different fingerprints, thereby improving the accuracy of fingerprint recognition.

[0109] For example, in some embodiments, after correction and setting of the gain value, the voltage or current of the driving signal of the corresponding driving electrode Tx can be amplified according to the gain value, the voltage or current of the sensing signal of the corresponding sensing electrode 11 can be amplified according to the gain value, and the capacitance value of the sensing signal of the corresponding sensing electrode 11 can be amplified according to the gain value.

[0110] In some embodiments, setting the preset at least one target sensing value (step 300 ) includes: setting the at least one target sensing value according to the thickness and material of the flexible conductive layer 80 .

[0111] For example, at least one target sensing value can be set according to flexible conductor layers 80 of different materials, at least one target sensing value can be set according to flexible conductor layers 80 of different thicknesses, and at least one target sensing value can be set according to flexible conductor layers 80 of different materials and different thicknesses, so that the target sensing value matches the material and thickness of the flexible conductor layer 80.

[0112] For example, an appropriate flexible conductive layer 80 can be selected according to the material and thickness of the cover plate 30 (protective glass, Cover glass), and an appropriate target sensing value can be set according to the material and thickness of the cover plate 30 (protective glass, Cover glass), so that the calibration process is as close as possible to the fingerprint recognition process of the actual product or actual finger, thereby improving the accuracy of fingerprint recognition calibration.

[0113] For example, the target induction value set according to the thickness and material of the flexible conductor layer 80 may be an optimal target value.

[0114] In some embodiments, Figure 2 and Figure 3 As shown, the fingerprint recognition surface 101 includes a curved surface portion; the capacitive sensing layer 10 includes a plurality of sensing electrodes 11, and the plurality of sensing electrodes 11 are arranged in an array along a first direction X and a second direction Y, the first direction X is the bending direction of the curved surface portion, and the second direction Y is a direction perpendicular to the first direction X, and the fingerprint recognition points 12 correspond to the sensing electrodes 11. The sensing electrodes 11 are arranged into sensing electrode columns 111 along the second direction Y, and the same sensing electrode column 111 corresponds to at least two fingerprint recognition points 12, and the plurality of sensing electrode columns 111 are arranged in sequence in the first direction X; in the second direction Y, the at least two fingerprint recognition points 12 corresponding to the sensing electrode column 111 are arranged into a fingerprint recognition point column 120; the gain values ​​of different fingerprint recognition points in the same fingerprint recognition point column 120 are the same.

[0115] For example, Figure 2 and Figure 3 As shown, the fingerprint recognition surface 101 is illustrated as a curved surface.

[0116] For example, Figure 2 and Figure 3 As shown, a plurality of sensing electrodes 11 are arranged in an array along a first direction X and a second direction Y. The first direction X is the bending direction of the curved portion, and the first direction X is the bending direction of the curved portion or the curved surface.

[0117] For example, Figure 2 and Figure 3 As shown, it is illustrated by way of example that the curved surface portion is only curved in the first direction X, but it is not limited thereto.

[0118] For example, Figure 2 and Figure 3 As shown, in the second direction Y, the same sensing electrode column 111 includes at least two or more sensing electrodes 11 . Therefore, the same sensing electrode column 111 corresponds to at least two or more fingerprint identification points 12 .

[0119] For example, Figure 2 and Figure 3 As shown, in the second direction Y, the curved surface portion is not bent, and among the multiple sensing electrodes 11 included in the same sensing electrode column 111, when a finger touches, the distance between different sensing electrodes 11 in the same sensing electrode column 111 and the finger is only determined by the shape of the finger (the ridges and valleys of the fingerprint of the finger), and the distance between different sensing electrodes 11 in the same sensing electrode column 111 and the flexible conductive layer 80 is the same, so the gain values ​​of different fingerprint recognition points in the same fingerprint recognition point column 120 are the same.

[0120] In some embodiments, Figure 2 and Figure 3 As shown, at the curved surface, at least some of the gain values ​​corresponding to two adjacent fingerprint identification point arrays 120 are different.

[0121] For example, Figure 2 and Figure 3 As shown, in the first direction X, the curved portion is bent, and the capacitance value of the sensing electrode 11 is inversely proportional to the distance from the flexible conductive layer 80. Therefore, two adjacent sensing electrode columns 111 have different distances from the finger or the flexible conductive layer 80, so that the two adjacent sensing electrode columns 111 have different gain values. For example, the sensing electrode column 111 at the edge of the curved portion and the sensing electrode column 111 in the middle of the curved portion have different gain values, so that the gain values ​​corresponding to the two adjacent fingerprint identification point columns 120 are different.

[0122] For example, when some parts of the curved surface are less curved, at least some adjacent two fingerprint identification point arrays 120 may have the same gain value, and when some parts of the curved surface are more curved, at least some adjacent two fingerprint identification point arrays 120 may have different gain values.

[0123] For example, Figure 2 and Figure 3 As shown, in the first direction X, the curved surface is bent. When a finger touches, the distance between the sensing electrode 11 in the sensing electrode column 111 of the adjacent column in the same row and the finger is affected by the curved fingerprint recognition surface 101. The aforementioned fingerprint recognition correction method can eliminate the influence of the curved fingerprint recognition surface 101, thereby improving the fingerprint recognition accuracy.

[0124] For example, in some embodiments, after calibration and setting of the gain value, the voltage or current of the driving signal of the corresponding sensing electrode column 111 can be amplified according to the gain value, the voltage or current of the sensing signal of the corresponding sensing electrode column 111 can be amplified according to the gain value, and the capacitance value of the sensing signal of the corresponding sensing electrode column 111 can be amplified according to the gain value.

[0125] It should be noted that Figure 3 The figure shows that the first sensing electrode row G1 , the second sensing electrode row G2 , the third sensing electrode row G3 , the fourth sensing electrode row G4 , and the nth sensing electrode row Gn are sequentially arranged along the first direction X, and each sensing electrode row 111 has the same sensing signal (fingerprint recognition signal).

[0126] It should be noted that Figure 3 It is illustrated in the figure that the fingerprint recognition device 100 may also include structural components such as a housing 40, which is not limited here.

[0127] Second, see Fig. 9 Some embodiments of the present application provide a fingerprint recognition correction device 200, which is used for fingerprint recognition correction of a fingerprint recognition device 100. The fingerprint recognition device 100 includes a fingerprint recognition surface 101, which is non-planar. The fingerprint recognition device 100 includes a capacitive sensing layer 10, which corresponds to multiple fingerprint recognition points 12. The fingerprint recognition correction device 200 includes a flexible conductive layer 80, an acquisition module 201, a setting module 202 and a calculation module 203.

[0128] The acquisition module 201 is used to acquire multiple first sensing values ​​of the capacitive sensing layer 10 before placing a flexible conductive layer 80 on the fingerprint recognition surface 101, and the first sensing values ​​correspond to the fingerprint recognition points 12; the acquisition module 201 also acquires multiple second sensing values ​​of the capacitive sensing layer 10 after placing a flexible conductive layer 80 on the fingerprint recognition surface 101, and the second sensing values ​​correspond to the fingerprint recognition points 12.

[0129] The setting module 202 is used to set at least one preset target sensing value. The calculation module 203 is used to obtain multiple gain values ​​according to multiple first sensing values, multiple second sensing values ​​and target sensing values, and the gain values ​​correspond to the fingerprint recognition points 12, and at least some of the gain values ​​are different.

[0130] In some implementations, the fingerprint recognition calibration device 200 further includes a calibration module 204, and the calibration module 204 is used to calibrate the fingerprint recognition sensing value of the corresponding fingerprint recognition point 12 according to a plurality of gain values.

[0131] In some embodiments, the fingerprint recognition surface 101 includes a curved surface portion; the capacitive sensing layer 10 includes a plurality of sensing electrodes 11, the plurality of sensing electrodes 11 are arranged in an array along a first direction X and a second direction Y, the first direction X is a bending direction of the curved surface portion, the second direction Y is a direction perpendicular to the first direction X, and the fingerprint recognition point 12 corresponds to the sensing electrode 11; the sensing electrodes 11 are arranged into a sensing electrode column 111 along the second direction Y, the same sensing electrode column 111 corresponds to at least two fingerprint recognition points 12, and the plurality of sensing electrode columns 111 are arranged in sequence in the first direction X; in the second direction Y, at least two fingerprint recognition points 12 corresponding to the sensing electrode column 111 are arranged into a fingerprint recognition point column 111; the gain values ​​of different fingerprint recognition points 12 in the same fingerprint recognition point column 111 are the same; the gain values ​​of different fingerprint recognition points 12 in the same fingerprint recognition point column 111 are the same.

[0132] In some implementations, at the curved surface, the gain values ​​corresponding to two adjacent fingerprint identification point arrays 111 are different.

[0133] It should be noted that the above-mentioned fingerprint recognition correction device 200 can execute any fingerprint recognition correction method in the present application, and the above-mentioned fingerprint recognition correction device 200 can execute any fingerprint recognition correction method combining several features in the present application.

[0134] It should be noted that the fingerprint recognition device calibrated by the fingerprint recognition correction device 200 has the same structure as the fingerprint recognition device calibrated by the fingerprint recognition correction method, and the structure and other features of the fingerprint recognition device calibrated by the fingerprint recognition correction device 200 are not described in detail here. The fingerprint recognition correction device 200 has the same effect as the fingerprint recognition correction method, and the effect of the fingerprint recognition correction device 200 is not described in detail here.

[0135] Third, see Figure 2 or Figure 3 Some embodiments of the present application provide a fingerprint recognition device 100, including a fingerprint recognition surface 101, the fingerprint recognition surface 101 is non-planar, the fingerprint recognition device 100 includes a capacitive sensing layer 10, the capacitive sensing layer 10 corresponds to a plurality of fingerprint recognition points 12, the fingerprint recognition device 100 also includes a memory, the memory stores gain values ​​corresponding to the plurality of fingerprint recognition points 12, at least some of the gain values ​​are different.

[0136] In some embodiments, the fingerprint recognition surface 101 includes a curved surface portion; the capacitive sensing layer 10 includes a plurality of sensing electrodes 11, the plurality of sensing electrodes 11 are arranged in an array along a first direction X and a second direction Y, the first direction X is a bending direction of the curved surface portion, the second direction Y is a direction perpendicular to the first direction X, and the fingerprint recognition point 12 corresponds to the sensing electrode 11; the sensing electrodes 11 are arranged into a sensing electrode column 111 along the second direction Y, the same sensing electrode column 111 corresponds to at least two fingerprint recognition points 12, and the plurality of sensing electrode columns 111 are arranged in sequence in the first direction X; in the second direction Y, at least two fingerprint recognition points 12 corresponding to the sensing electrode column 111 are arranged into a fingerprint recognition point column 111; the gain values ​​of different fingerprint recognition points 12 in the same fingerprint recognition point column 111 are the same.

[0137] In some implementations, at the curved surface, the gain values ​​corresponding to two adjacent fingerprint identification point arrays 111 are different.

[0138] In some embodiments, at least some of the sensing electrode columns 111 have the same gain value; the number of the multiple gain values ​​stored in the memory is less than the number of the sensing electrode columns 111 .

[0139] For example, different sensing electrode columns 111 having the same gain value may store only one gain value in the memory, which can reduce the storage space occupied by the memory and the data volume of the gain value.

[0140] For example, in some embodiments, the fingerprint recognition surface 101 is a curved surface, the curved surface portion is a symmetrical shape of the bending axis, and the two sensing electrode columns 111 symmetrical about the bending axis have the same gain value; the number of multiple gain values ​​stored in the memory is less than the number of sensing electrode columns. For example, the two sensing electrode columns 111 symmetrical about the bending axis have the same gain value, and the number of multiple gain values ​​stored in the memory is half of the number of sensing electrode columns 111.

[0141] For example, in some embodiments, the gain values ​​of the symmetrical shape of the curved surface portion with the bending axis are as follows: (251, 180, 20, 180, 251); 251, 180, 20 all represent example gain values, and at this time, only one gain value of the two symmetrical sensing electrode columns 111 with a gain value of 251 can be stored.

[0142] For example, in some embodiments, a data amount of gain values ​​of gradient numbers from 0 to 255 is obtained through the fingerprint recognition correction method. Before reducing the stored data, 8 bits of gradient number or memory space is required; after reducing the stored data, the two sensing electrode columns 111 symmetrical about the bending axis have the same gain value, and only one gain value of the two symmetrical sensing electrode columns 111 needs to be stored, and only the gradient number of gain values ​​of gradient numbers from 0 to 123 needs to be stored, which requires only 7 bits of gradient number or memory space.

[0143] For example, in some other embodiments, a data volume of gain values ​​of gradient numbers ranging from 0 to 255 is obtained through the fingerprint recognition correction method. Before reducing the stored data, 8 bits of gradient numbers or memory space are required; after reducing the stored data, some areas of the curved surface have a smaller degree of curvature, or the gain values ​​of some sensing electrode columns 111 are relatively close or the same, and only a smaller number of gradient numbers need to be stored, for example, only 4 bits of gradient numbers or memory space need to be stored.

[0144] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0145] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A fingerprint recognition correction method, characterized in that: Used for fingerprint recognition correction of a fingerprint recognition device, the fingerprint recognition device includes a fingerprint recognition surface, the fingerprint recognition surface is non-planar, the fingerprint recognition device includes a capacitive sensing layer, the capacitive sensing layer corresponds to a plurality of fingerprint recognition points, the fingerprint recognition correction method includes: Before placing a flexible conductive layer on the fingerprint recognition surface, obtaining a plurality of first sensing values ​​of the capacitive sensing layer, wherein the first sensing values ​​correspond to fingerprint recognition points; After placing the flexible conductive layer on the fingerprint recognition surface, obtaining a plurality of second sensing values ​​of the capacitive sensing layer, wherein the second sensing values ​​correspond to fingerprint recognition points; Setting at least one preset target sensing value; A plurality of gain values ​​are obtained according to the plurality of the first sensing values, the plurality of the second sensing values ​​and the target sensing value, the gain values ​​corresponding to the fingerprint recognition points, and at least some of the gain values ​​are different.

2. The fingerprint recognition correction method according to claim 1, characterized in that: The step of obtaining a plurality of gain values ​​according to a plurality of the first sensing values, a plurality of the second sensing values ​​and the target sensing value comprises obtaining the gain values ​​according to the following formula: Ga=ST / (S2-S1), Ga represents a gain value, ST represents the target sensing value, S2 represents the second sensing value, and S1 represents the first sensing value.

3. The fingerprint recognition correction method according to claim 1, characterized in that: After the step of obtaining a plurality of gain values ​​according to the plurality of first sensing values, the plurality of second sensing values ​​and the target sensing value, the method further includes: The fingerprint recognition sensing values ​​of the corresponding fingerprint recognition points are corrected according to the plurality of gain values.

4. The fingerprint recognition correction method according to claim 1, characterized in that: The step of setting at least one preset target sensing value comprises: At least one of the target sensing values ​​is set according to the thickness and material of the flexible conductor layer.

5. The fingerprint recognition correction method according to claim 1, characterized in that: The fingerprint recognition surface includes a curved surface portion; The capacitive sensing layer includes a plurality of sensing electrodes, and the plurality of sensing electrodes are arranged in an array along a first direction and a second direction, wherein the first direction is a bending direction of the curved surface portion, and the second direction is a direction perpendicular to the first direction, and the fingerprint recognition points correspond to the sensing electrodes; The sensing electrodes are arranged into sensing electrode rows along the second direction, one sensing electrode row corresponds to at least two fingerprint recognition points, and a plurality of sensing electrode rows are arranged in sequence in the first direction; In the second direction, at least two of the fingerprint recognition points corresponding to the sensing electrode array are arranged into a fingerprint recognition point array; The gain values ​​of different fingerprint recognition points in the same fingerprint recognition point array are the same.

6. The fingerprint recognition correction method according to claim 5, characterized in that: At the curved surface, the gain values ​​corresponding to two adjacent fingerprint recognition point arrays are different.

7. A fingerprint recognition and correction device, characterized in that: Used for fingerprint recognition correction of a fingerprint recognition device, the fingerprint recognition device includes a fingerprint recognition surface, the fingerprint recognition surface is non-planar, the fingerprint recognition device includes a capacitive sensing layer, the capacitive sensing layer corresponds to a plurality of fingerprint recognition points, the fingerprint recognition correction device includes: A flexible conductive layer; an acquisition module, used for acquiring a plurality of first sensing values ​​of the capacitive sensing layer before placing a flexible conductive layer on the fingerprint recognition surface, wherein the first sensing values ​​correspond to fingerprint recognition points; and the acquisition module further acquires a plurality of second sensing values ​​of the capacitive sensing layer after placing the flexible conductive layer on the fingerprint recognition surface, wherein the second sensing values ​​correspond to fingerprint recognition points; A setting module, used for setting at least one preset target sensing value; The calculation module is used to obtain multiple gain values ​​according to multiple first sensing values, multiple second sensing values ​​and the target sensing value, wherein the gain values ​​correspond to fingerprint recognition points, and at least some of the gain values ​​are different.

8. The fingerprint recognition and correction device according to claim 7, characterized in that: Also includes: The correction module is used to correct the fingerprint recognition sensing values ​​of the corresponding fingerprint recognition points according to the multiple gain values.

9. The fingerprint recognition and correction device according to claim 7, characterized in that: The fingerprint recognition surface includes a curved surface portion; The capacitive sensing layer includes a plurality of sensing electrodes, and the plurality of sensing electrodes are arranged in an array along a first direction and a second direction, wherein the first direction is a bending direction of the curved surface portion, and the second direction is a direction perpendicular to the first direction, and the fingerprint recognition points correspond to the sensing electrodes; The sensing electrodes are arranged into sensing electrode rows along the second direction, one sensing electrode row corresponds to at least two fingerprint recognition points, and a plurality of sensing electrode rows are arranged in sequence in the first direction; In the second direction, at least two of the fingerprint recognition points corresponding to the sensing electrode array are arranged into a fingerprint recognition point array; The gain values ​​of different fingerprint recognition points in the same fingerprint recognition point array are the same; The gain values ​​of different fingerprint recognition points in the same fingerprint recognition point array are the same.

10. The fingerprint recognition and correction device according to claim 9, characterized in that: At the curved surface, the gain values ​​corresponding to two adjacent fingerprint recognition point arrays are different.

11. A fingerprint recognition device, characterized in that: The fingerprint recognition device includes a fingerprint recognition surface, the fingerprint recognition surface is non-planar, the fingerprint recognition device includes a capacitive sensing layer, the capacitive sensing layer corresponds to a plurality of fingerprint recognition points, and the fingerprint recognition device further includes: The memory stores gain values ​​corresponding to a plurality of fingerprint recognition points, at least some of the gain values ​​are different.

12. The fingerprint recognition device according to claim 11, characterized in that: The fingerprint recognition surface includes a curved surface portion; The capacitive sensing layer includes a plurality of sensing electrodes, and the plurality of sensing electrodes are arranged in an array along a first direction and a second direction, wherein the first direction is a bending direction of the curved surface portion, and the second direction is a direction perpendicular to the first direction, and the fingerprint recognition points correspond to the sensing electrodes; The sensing electrodes are arranged into sensing electrode rows along the second direction, one sensing electrode row corresponds to at least two fingerprint recognition points, and a plurality of sensing electrode rows are arranged in sequence in the first direction; In the second direction, at least two of the fingerprint recognition points corresponding to the sensing electrode array are arranged into a fingerprint recognition point array; The gain values ​​of different fingerprint recognition points in the same fingerprint recognition point array are the same.

13. The fingerprint recognition device according to claim 12, characterized in that: At the curved surface, the gain values ​​corresponding to two adjacent fingerprint recognition point arrays are different.

14. The fingerprint recognition device according to claim 12, characterized in that: At least part of the sensing electrode columns have the same gain value; The number of the plurality of gain values ​​stored in the memory is smaller than the number of the sensing electrode columns.

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