Electronic component

Abstract

An electronic component includes an element body and an external electrode disposed on the element body, the external electrode including a conductive resin layer. The conductive resin layer contains silver. The electronic component includes an oxide disposed before an edge of the conductive resin layer. The oxide is in contact with the element body.

Description

Technical Field

[0001] The present invention relates to electronic components. Background Art

[0002] A known electronic component includes an element body and external electrodes disposed on the element body (see, for example, Japanese Patent Application Laid-Open No. 5-144665). The external electrodes include, for example, a conductive resin layer and a metal plating layer located outside the conductive resin layer. Summary of the invention

[0003] The conductive resin layer includes, for example, a plurality of silver particles and a resin. In a structure in which the external electrode includes a conductive resin layer, silver migration may occur in the external electrode. Silver migration is considered to occur due to, for example, the following factors.

[0004] The silver particles contained in the conductive resin layer are ionized by the electric field or heat. The silver particles contained in the conductive resin layer are sometimes ionized by the influence of oxygen. The generated silver ions are attracted by the electric field generated between the external electrodes and move from the conductive resin layer. The electric field acting on the silver particles includes, for example, an electric field generated between the external electrodes, or an electric field generated between the external electrode and the internal conductor arranged in the element body. The silver ions moving from the conductive resin layer react with, for example, electrons supplied from the internal conductor or the external electrode, and are precipitated as silver on the surface of the element body.

[0005] An object of one embodiment of the present invention is to provide an electronic component in which growth of migration of silver is suppressed.

[0006] An electronic component according to one embodiment of the present invention includes: a body, and an external electrode arranged on the body. The external electrode includes: a conductive resin layer including a plurality of silver particles, and a metal plating layer arranged outside the conductive resin layer with a gap between the body and the metal plating layer. The electronic component according to the above embodiment includes: an oxide of a metal component contained in the metal plating layer. The oxide is arranged in contact with the metal plating layer and the body in the gap between the metal plating layer and the body.

[0007] In the above embodiment, the oxide is arranged in contact with the metal plating layer and the element body in the gap between the metal plating layer and the element body. Therefore, even if silver migration occurs in the conductive resin layer, the growth of silver migration is suppressed. In the above embodiment, the growth of silver migration on the element body is suppressed.

[0008] The oxide disposed in the gap between the metal plating layer and the element body in contact with the metal plating layer and the element body includes an oxide of a metal component contained in the metal plating layer. Therefore, in the above-mentioned one embodiment, the oxide is reliably disposed in the gap between the metal plating layer and the element body.

[0009] The above-mentioned one aspect may also include the following structure. In this structure, for example, the metal plating layer includes a copper plating layer, and the oxide includes an oxide of copper contained in the copper plating layer.

[0010] In a structure in which the oxide includes an oxide of copper contained in the copper plating layer, for example, the oxide can be formed by heat-treating the copper plating layer. Therefore, the oxide can be easily arranged.

[0011] The above-mentioned one aspect may include the following structure. In this structure, for example, the metal plating layer includes another metal plating layer different from the copper plating layer, and the other metal plating layer is arranged outside the copper plating layer with a gap between the other metal plating layer and the element body.

[0012] In the structure where the metal plating layer includes the above-mentioned other metal plating layer, there is a gap between the other metal plating layer and the element body. For example, when the copper plating layer is heat-treated, the heat easily passes through the gap between the other metal plating layer and the element body and acts on the copper plating layer. Therefore, the structure where the metal plating layer includes the above-mentioned other metal plating layer can also easily and reliably configure the oxide.

[0013] The above-mentioned one aspect may also include the following structure. In this structure, for example, the other metal plating layer includes a nickel plating layer.

[0014] The structure of other metal plating including the above-mentioned nickel plating can prevent solder corrosion during solder mounting.

[0015] The above-mentioned one aspect may include the following structure. In this structure, for example, the other metal plating layer includes a solder plating layer arranged outside the nickel plating layer.

[0016] The structure in which the other metal plating layer includes the above-mentioned solder plating layer can improve soldering mountability.

[0017] The above-mentioned one aspect may include the following structure. In this structure, for example, the solder plating layer has a gap between itself and the element body.

[0018] In a structure where there is a gap between the solder plating layer and the element body, for example, when the copper plating layer is heat-treated, heat easily passes through the gap between the solder plating layer and the element body and acts on the copper plating layer. Therefore, the structure where the metal plating layer includes the solder plating layer can also easily and reliably configure the oxide.

[0019] The above-mentioned one aspect may also include the following structure. In this structure, for example, the oxide extends along the edge of the conductive resin layer.

[0020] The structure in which the oxide extends along the edge of the conductive resin layer can reliably suppress the growth of silver migration.

[0021] The present invention will be more fully understood through the following detailed description and accompanying drawings, which are given by way of illustration only and thus should not be regarded as limiting the present invention.

[0022] The further scope of application of the present invention will become clear through the following detailed description. However, since it is obvious to those skilled in the art that various changes and modifications can be made within the spirit and scope of the present invention, it should be understood that when describing embodiments of the present invention, the detailed description and specific examples are given only by way of illustration. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a perspective view of a multilayer capacitor according to one embodiment.

[0024] Figure 2 It is a diagram showing a cross-sectional structure of a multilayer capacitor according to the present embodiment.

[0025] Figure 3 It is a diagram showing a cross-sectional structure of a multilayer capacitor according to the present embodiment.

[0026] Figure 4 It is a diagram showing a cross-sectional structure of an external electrode.

[0027] Figure 5 It is a diagram showing a cross-sectional structure of an external electrode.

[0028] Figure 6 is a top view showing the second electrode layer and the oxide.

[0029] Figure 7 is a top view showing the second electrode layer and the oxide.

[0030] Figure 8 It is a diagram showing a cross-sectional structure of an external electrode.

[0031] Fig. 9 It is a diagram showing a cross-sectional structure of an external electrode. DETAILED DESCRIPTION

[0032] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same elements or elements having the same functions are denoted by the same reference numerals, and repeated descriptions are omitted.

[0033] Reference Figure 1 to Figure 7 , the structure of the multilayer capacitor C1 according to the present embodiment will be described. Figure 1 It is a perspective view of the multilayer capacitor according to the present embodiment. Figure 2 and Figure 3 It is a diagram showing a cross-sectional structure of a multilayer capacitor according to the present embodiment. Figure 4 and Figure 5 It is a diagram showing a cross-sectional structure of an external electrode. Figure 6 and Figure 7 is a top view showing the second electrode layer and the oxide.

[0034] The electronic component includes, for example, a multilayer capacitor C1.

[0035] like Figure 1 As shown, the multilayer capacitor C1 includes a rectangular parallelepiped element body 3 and a plurality of external electrodes 5. The multilayer capacitor C1 includes, for example, a pair of external electrodes 5. The pair of external electrodes 5 are arranged on the outer surface of the element body 3. The pair of external electrodes 5 are separated from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges or a rectangular parallelepiped shape with rounded corners and edges.

[0036] The element body 3 has a pair of side faces 3a opposite to each other, a pair of side faces 3c opposite to each other, and a pair of end faces 3e opposite to each other. The pair of side faces 3a, the pair of side faces 3c, and the pair of end faces 3e are, for example, rectangular in shape. The direction in which the pair of side faces 3a are opposite to each other includes a direction D2. The direction in which the pair of side faces 3c are opposite to each other includes a direction D3. The direction in which the pair of end faces 3e are opposite to each other includes a direction D1.

[0037] The multilayer capacitor C1 is mounted on an electronic device, for example, by soldering. The electronic device includes, for example, a circuit substrate or other electronic components. In the multilayer capacitor C1, one of the four side surfaces 3a and 3c is opposite to the electronic device. One of the four side surfaces 3a and 3c is configured to constitute a mounting surface. One of the four side surfaces 3a and 3c includes a mounting surface. For example, the side surface 3a includes a mounting surface.

[0038] Direction D2 includes directions orthogonal to each side surface 3a, and is orthogonal to direction D3. Direction D1 includes directions parallel to each side surface 3a and each side surface 3c, and is orthogonal to direction D2 and direction D3. Direction D3 includes directions orthogonal to each side surface 3c, and direction D1 includes directions orthogonal to each end surface 3e. The length of the element body 3 in direction D1 is, for example, greater than the length of the element body 3 in direction D2, and is greater than the length of the element body 3 in direction D3. Direction D1 includes the long side direction of the element body 3. The length of the element body 3 in direction D2 and the length of the element body 3 in direction D3 may also be equal to each other. The length of the element body 3 in direction D2 and the length of the element body 3 in direction D3 may also be different from each other.

[0039] The length of the element body 3 in the direction D2 specifies, for example, the height of the element body 3. The length of the element body 3 in the direction D3 specifies, for example, the width of the element body 3. The length of the element body 3 in the direction D1 specifies, for example, the length of the element body 3. For example, the height of the element body 3 is 0.1 to 3.2 mm, the width of the element body 3 is 0.1 to 6.3 mm, and the length of the element body 3 is 0.2 to 7.5 mm. For example, the height of the element body 3 is 2.5 mm, the width of the element body 3 is 2.5 mm, and the length of the element body 3 is 3.2 mm.

[0040] The pair of side surfaces 3a extend in the direction D3 so as to connect the pair of side surfaces 3c. The pair of side surfaces 3a also extend in the direction D1. The pair of side surfaces 3c extend in the direction D2 so as to connect the pair of side surfaces 3a. The pair of side surfaces 3c also extend in the direction D1. The pair of end surfaces 3e extend in the direction D2 so as to connect the pair of side surfaces 3a. The pair of end surfaces 3e extend in the direction D3 so as to connect the pair of side surfaces 3c.

[0041] The element body 3 includes an edge portion between the end face 3e and the side face 3a, an edge portion between the end face 3e and the side face 3c, and an edge portion between the side face 3a and the side face 3c. For example, each edge portion is rounded in a curved manner. For example, the element body 3 is subjected to a so-called R chamfering process. The end face 3e and the side face 3a are indirectly adjacent to each other via the edge portion between the end face 3e and the side face 3a. The end face 3e and the side face 3c are indirectly adjacent to each other via the edge portion between the end face 3e and the side face 3c. The side face 3a and the side face 3c are indirectly adjacent to each other via the edge portion between the side face 3a and the side face 3c.

[0042] The element body 3 is composed of a plurality of dielectric layers stacked in the direction D2. The element body 3 includes a plurality of dielectric layers stacked. In the element body 3, the stacking direction of the plurality of dielectric layers is consistent with the direction D2. Each dielectric layer is composed of, for example, a sintered body of a ceramic green sheet including a dielectric material. The dielectric material includes, for example, dielectric ceramics. The dielectric ceramics include, for example, BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based dielectric ceramics. In the actual element body 3, the dielectric layers are integrated to the extent that the boundaries between the dielectric layers cannot be identified.

[0043] like Figure 2 and Figure 3 As shown, the multilayer capacitor C1 includes a plurality of internal electrodes 7. Each internal electrode 7 is included in an internal conductor arranged in the element body 3. Each internal electrode 7 is formed of a conductive material generally used as an internal conductor of a multilayer electronic component. The conductive material contains, for example, a base metal. The conductive material contains, for example, nickel (Ni) or copper (Cu). The internal electrode 7 is formed as a sintered body of a conductive paste containing the above conductive material. For example, the internal electrode 7 contains nickel.

[0044] The plurality of internal electrodes 7 are arranged at different positions (layers) in the direction D2. The plurality of internal electrodes 7 are arranged in the element body 3 so as to face each other with a gap in the direction D2. The internal electrodes 7 adjacent to each other in the direction D2 have different polarities. One end of the internal electrode 7 is exposed at the corresponding end face 3e of the pair of end faces 3e. The internal electrode 7 includes one end exposed at the corresponding end face 3e. The plurality of internal electrodes 7 include: an internal electrode 7 exposed at one end face 3e of the pair of end faces 3e, and an internal electrode 7 exposed at the other end face 3e of the pair of end faces 3e. The internal electrode 7 exposed at one end face 3e and the internal electrode 7 exposed at the other end face 3e are arranged alternately in the direction D2. The plurality of internal electrodes 7 are arranged in the element body 3 so as to be arranged in the direction D2. The internal electrodes 7 are located in a plane substantially parallel to the side face 3a. The direction (direction D2) in which the internal electrodes 7 face each other is orthogonal to the direction (direction D3 and direction D1) parallel to the side face 3a.

[0045] In a structure in which the stacking direction of the plurality of dielectric layers includes the direction D3, the plurality of internal electrodes 7 are arranged at different positions (layers) in the direction D3. In a structure in which the stacking direction of the plurality of dielectric layers includes the direction D3, the internal electrodes 7 exposed at one end face 3e and the internal electrodes 7 exposed at the other end face 3e are alternately arranged in the direction D3. The internal electrodes 7 are located in a plane substantially parallel to the side face 3c. The internal electrodes 7 are opposite to each other in the direction D3.

[0046] like Figure 1 As shown in FIG. 1 , the external electrodes 5 are arranged at both ends of the element body 3 in the direction D1. Each external electrode 5 is arranged on the side of the corresponding end face 3e of the pair of end faces 3e of the element body 3. For example, each external electrode 5 is arranged on a pair of side faces 3a, a pair of side faces 3c and an end face 3e. Figure 2 and Figure 3 As shown, the external electrode 5 includes a plurality of electrode portions 5a, 5c, and 5e. The electrode portion 5a is located on the side surface 3a and on the ridge between the side surface 3a and the end surface 3e. The electrode portion 5c is located on the side surface 3c and on the ridge between the side surface 3c and the end surface 3e. The electrode portion 5e is located on the end surface 3e. The external electrode 5 also includes an electrode portion located on the ridge between the side surface 3a and the side surface 3c.

[0047] The external electrode 5 is formed on five surfaces of four side surfaces 3a, 3c and one end surface 3e, and the above-mentioned ridge. The electrode portions 5a, 5c, and 5e adjacent to each other are physically connected and electrically connected. The electrode portion 5e completely covers one end of the corresponding internal electrode 7 among the plurality of internal electrodes 7. The electrode portion 5e is directly connected to the corresponding internal electrode 7. The external electrode 5 is electrically connected to the corresponding internal electrode 7.

[0048] External electrode 5 such as Figure 2 to Figure 5As also shown, it includes a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, a fourth electrode layer E4 and a fifth electrode layer E5. The fifth electrode layer E5 includes the outermost layer of the external electrode 5. Each electrode portion 5a, 5c, 5e includes the first electrode layer E1, the second electrode layer E2, the third electrode layer E3, the fourth electrode layer E4 and the fifth electrode layer E5.

[0049] The first electrode layer E1 of the electrode portion 5a is arranged on the ridge between the side surface 3a and the end surface 3e, and is not arranged on the side surface 3a. The first electrode layer E1 of the electrode portion 5a covers the entire ridge between the side surface 3a and the end surface 3e. The first electrode layer E1 of the electrode portion 5a does not cover the side surface 3a. The first electrode layer E1 of the electrode portion 5a is in contact with the ridge between the side surface 3a and the end surface 3e. The side surface 3a is exposed from the first electrode layer E1. The first electrode layer E1 of the electrode portion 5a may also be arranged on the side surface 3a. In this case, the first electrode layer E1 of the electrode portion 5a covers a partial area of ​​the side surface 3a and the entire ridge between the side surface 3a and the end surface 3e. The first electrode layer E1 of the electrode portion 5a is in contact with the above-mentioned partial area of ​​the side surface 3a. The above-mentioned partial area covered by the first electrode layer E1 of the electrode portion 5a is located near the end surface 3e.

[0050] The second electrode layer E2 of the electrode portion 5a is arranged on the first electrode layer E1 and on the side surface 3a. In the electrode portion 5a, the second electrode layer E2 covers the entire first electrode layer E1 and covers a portion of the side surface 3a. The second electrode layer E2 of the electrode portion 5a indirectly covers the edge between the side surface 3a and the end surface 3e in such a way that the first electrode layer E1 is located between the second electrode layer E2 and the element body 3. In the electrode portion 5a, the second electrode layer E2 is directly in contact with the first electrode layer E1. The above-mentioned portion covered by the second electrode layer E2 of the electrode portion 5a is located near the end surface 3e. The side surface 3a is exposed from the second electrode layer E2 in the remaining portion except for the above-mentioned portion covered by the second electrode layer E2. In the electrode portion 5a, the second electrode layer E2 is directly in contact with the side surface 3a. In the electrode portion 5a, the second electrode layer E2 directly covers the side surface 3a. The second electrode layer E2 of the electrode portion 5a is located on the side surface 3a and on the edge between the side surface 3a and the end surface 3e.

[0051] The third electrode layer E3 of the electrode portion 5a is arranged on the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 is in contact with the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2.

[0052] The fourth electrode layer E4 of the electrode portion 5a is arranged on the third electrode layer E3. In the electrode portion 5a, the fourth electrode layer E4 covers the third electrode layer E3. In the electrode portion 5a, the fourth electrode layer E4 is in contact with the third electrode layer E3. In the electrode portion 5a, the fourth electrode layer E4 is in direct contact with the third electrode layer E3.

[0053] The fifth electrode layer E5 of the electrode portion 5a is arranged on the fourth electrode layer E4. In the electrode portion 5a, the fifth electrode layer E5 covers the fourth electrode layer E4. In the electrode portion 5a, the fifth electrode layer E5 is in contact with the fourth electrode layer E4. In the electrode portion 5a, the fifth electrode layer E5 is in direct contact with the fourth electrode layer E4.

[0054] In the electrode portion 5a, the third electrode layer E3, the fourth electrode layer E4, and the fifth electrode layer E5 are not in contact with the side surface 3a. In the electrode portion 5a, the third electrode layer E3, the fourth electrode layer E4, and the fifth electrode layer E5 are arranged on the outside of the second electrode layer E2 with a gap between them and the side surface 3a. That is, the third electrode layer E3, the fourth electrode layer E4, and the fifth electrode layer E5 are separated from the side surface 3a (element body 3). The fourth electrode layer E4 of the electrode portion 5a is arranged on the outside of the third electrode layer E3 of the electrode portion 5a. The fifth electrode layer E5 of the electrode portion 5a is arranged on the outside of the fourth electrode layer E4 of the electrode portion 5a. The third electrode layer E3, the fourth electrode layer E4, and the fifth electrode layer E5 of the electrode portion 5a are located on the side surface 3a.

[0055] The first electrode layer E1 of the electrode portion 5c is arranged on the ridge between the side surface 3c and the end surface 3e, and is not arranged on the side surface 3c. The first electrode layer E1 of the electrode portion 5c covers the entire ridge between the side surface 3c and the end surface 3e. The first electrode layer E1 does not cover the side surface 3c. The first electrode layer E1 of the electrode portion 5c is in contact with the ridge between the side surface 3c and the end surface 3e. The side surface 3c is exposed from the first electrode layer E1. The first electrode layer E1 of the electrode portion 5c may also be arranged on the side surface 3c. In this case, the first electrode layer E1 of the electrode portion 5c covers a partial area of ​​the side surface 3c and the entire ridge between the side surface 3c and the end surface 3e. The first electrode layer E1 of the electrode portion 5c is in contact with the above-mentioned partial area of ​​the side surface 3c. The above-mentioned partial area covered by the first electrode layer E1 of the electrode portion 5c is located near the end surface 3e.

[0056] The second electrode layer E2 of the electrode portion 5c is arranged on the first electrode layer E1 and on the side surface 3c. In the electrode portion 5c, the second electrode layer E2 covers the entire first electrode layer E1 and covers a portion of the side surface 3c. The second electrode layer E2 of the electrode portion 5c indirectly covers the edge between the side surface 3c and the end surface 3e in such a way that the first electrode layer E1 is located between the second electrode layer E2 and the element body 3. In the electrode portion 5c, the second electrode layer E2 is directly in contact with the first electrode layer E1. The above-mentioned portion of the area covered by the second electrode layer E2 of the electrode portion 5c is located near the end surface 3e. The side surface 3c is exposed from the second electrode layer E2 at the rest of the area except for the above-mentioned portion of the area covered by the second electrode layer E2. In the electrode portion 5c, the second electrode layer E2 is directly in contact with the side surface 3c. In the electrode portion 5c, the second electrode layer E2 directly covers the side surface 3c. The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c and on the edge between the side surface 3c and the end surface 3e.

[0057] The third electrode layer E3 of the electrode portion 5c is arranged on the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in contact with the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in direct contact with the second electrode layer E2.

[0058] The fourth electrode layer E4 of the electrode portion 5c is arranged on the third electrode layer E3. In the electrode portion 5c, the fourth electrode layer E4 covers the third electrode layer E3. In the electrode portion 5c, the fourth electrode layer E4 is in contact with the third electrode layer E3. In the electrode portion 5c, the fourth electrode layer E4 is in direct contact with the third electrode layer E3.

[0059] The fifth electrode layer E5 of the electrode portion 5c is arranged on the fourth electrode layer E4. In the electrode portion 5c, the fifth electrode layer E5 covers the fourth electrode layer E4. In the electrode portion 5c, the fifth electrode layer E5 is in contact with the fourth electrode layer E4. In the electrode portion 5c, the fifth electrode layer E5 is in direct contact with the fourth electrode layer E4.

[0060] In the electrode portion 5c, the third electrode layer E3, the fourth electrode layer E4, and the fifth electrode layer E5 are not in contact with the side surface 3c. In the electrode portion 5c, the third electrode layer E3, the fourth electrode layer E4, and the fifth electrode layer E5 are arranged on the outside of the second electrode layer E2 with a gap between them and the side surface 3c. That is, the third electrode layer E3, the fourth electrode layer E4, and the fifth electrode layer E5 are separated from the side surface 3c (element body 3). The fourth electrode layer E4 of the electrode portion 5c is arranged on the outside of the third electrode layer E3 of the electrode portion 5c. The fifth electrode layer E5 of the electrode portion 5c is arranged on the outside of the fourth electrode layer E4 of the electrode portion 5c. The third electrode layer E3, the fourth electrode layer E4, and the fifth electrode layer E5 of the electrode portion 5c are located on the side surface 3c.

[0061] The second electrode layer E2 of the electrode portion 5c may also cover only a portion of the ridge between the side surface 3c and the end surface 3e and only a portion of the side surface 3c. The above-mentioned portion of the ridge between the side surface 3c and the end surface 3e is, for example, located near the side surface 3a. The above-mentioned portion of the side surface 3c is, for example, located near the corner between the side surface 3a and the end surface 3e. In this case, the electrode portion 5c may also have the following structure. The second electrode layer E2 of the electrode portion 5c indirectly covers the above-mentioned portion of the ridge between the side surface 3c and the end surface 3e in such a way that the first electrode layer E1 is located between the second electrode layer E2 and the ridge between the side surface 3c and the end surface 3e. The second electrode layer E2 of the electrode portion 5c directly covers the above-mentioned portion of the side surface 3c. The second electrode layer E2 of the electrode portion 5c directly covers a portion of the first electrode layer E1 located on the ridge between the side surface 3c and the end surface 3e. The electrode portion 5c includes: an area where the first electrode layer E1 is exposed from the second electrode layer E2, and an area where the first electrode layer E1 is covered by the second electrode layer E2.

[0062] The first electrode layer E1 of the electrode portion 5e is disposed on the end surface 3e. The first electrode layer E1 of the electrode portion 5e covers the entire end surface 3e. The first electrode layer E1 of the electrode portion 5e is in contact with the entire end surface 3e. In the electrode portion 5e, the first electrode layer E1 is in direct contact with the end surface 3e.

[0063] The second electrode layer E2 of the electrode portion 5e is arranged on the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 covers the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is directly in contact with the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 indirectly covers the end surface 3e in such a way that the first electrode layer E1 is located between the second electrode layer E2 and the end surface 3e. The second electrode layer E2 of the electrode portion 5e is located on the end surface 3e.

[0064] The third electrode layer E3 of the electrode portion 5e is arranged on the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 is in contact with the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 is not in direct contact with the first electrode layer E1.

[0065] The fourth electrode layer E4 of the electrode portion 5e is arranged on the third electrode layer E3. In the electrode portion 5e, the fourth electrode layer E4 covers the third electrode layer E3. In the electrode portion 5e, the fourth electrode layer E4 is in contact with the third electrode layer E3. In the electrode portion 5e, the fourth electrode layer E4 is in direct contact with the third electrode layer E3.

[0066] The fifth electrode layer E5 of the electrode portion 5e is arranged on the fourth electrode layer E4. In the electrode portion 5e, the fifth electrode layer E5 covers the fourth electrode layer E4. In the electrode portion 5e, the fifth electrode layer E5 is in contact with the fourth electrode layer E4. In the electrode portion 5e, the fifth electrode layer E5 is in direct contact with the fourth electrode layer E4.

[0067] In the electrode portion 5e, the third electrode layer E3, the fourth electrode layer E4 and the fifth electrode layer E5 are arranged outside the second electrode layer E2. The fourth electrode layer E4 of the electrode portion 5e is arranged outside the third electrode layer E3 of the electrode portion 5e. The fifth electrode layer E5 of the electrode portion 5e is arranged outside the fourth electrode layer E4 of the electrode portion 5e. The third electrode layer E3, the fourth electrode layer E4 and the fifth electrode layer E5 of the electrode portion 5e are located on the end surface 3e.

[0068] The second electrode layer E2 of the electrode portion 5e may also cover only a portion of the end face 3e. The above-mentioned portion of the end face 3e is located, for example, close to the side surface 3a. In this case, the electrode portion 5e may also have the following structure. The second electrode layer E2 of the electrode portion 5e indirectly covers the above-mentioned portion of the end face 3e in a manner that the first electrode layer E1 is located between the second electrode layer E2 and the end face 3e. The second electrode layer E2 of the electrode portion 5e directly covers only a portion of the portion of the first electrode layer E1 located on the end face 3e. The electrode portion 5e includes: an area where the first electrode layer E1 is exposed from the second electrode layer E2, and an area where the first electrode layer E1 is covered by the second electrode layer E2.

[0069] The first electrode layer E1 is formed by sintering the conductive paste applied to the surface of the element body 3. The conductive paste is applied to one end face 3e, the edge between the side face 3a and the end face 3e, and the edge between the side face 3c and the end face 3e. The first electrode layer E1 is formed in a manner that covers one end face 3e, the edge between the side face 3a and the end face 3e, and the edge between the side face 3c and the end face 3e. The first electrode layer E1 is formed by sintering the metal component (metal powder) contained in the conductive paste. The first electrode layer E1 includes a sintered metal layer. The first electrode layer E1 includes a sintered metal layer formed on the element body 3. In the multilayer capacitor C1, the first electrode layer E1 includes a sintered metal layer formed of copper. The first electrode layer E1 may also include a sintered metal layer composed of nickel. The first electrode layer E1 contains a base metal. The conductive paste includes, for example: a powder composed of copper or nickel, a glass component, an organic binder, and an organic solvent. The first electrode layers E1 included in the electrode portions 5a, 5c, and 5e are formed integrally with each other.

[0070] The second electrode layer E2 is formed by curing the conductive resin paste applied to the first electrode layer E1. The conductive resin paste is applied to the first electrode layer E1 and a portion of the side 3a, 3c. The second electrode layer E2 is formed over the first electrode layer E1 and the element body 3. The conductive resin paste includes, for example, a plurality of silver particles, a resin, and an organic solvent. The resin includes, for example, a thermosetting resin. Thermosetting resins include, for example, phenolic resins, acrylic resins, silicone resins, epoxy resins, or polyimide resins. The second electrode layer E2 is in contact with a portion of the ridge between the side 3a and the side 3c. The second electrode layer E2 possessed by each electrode portion 5a, 5c, 5e is formed integrally.

[0071] The second electrode layer E2 includes a conductive resin layer covering the first electrode layer E1. Figure 4 and Figure 5 As shown, the second electrode layer E2 includes a resin 11 and a plurality of silver particles 13. The plurality of silver particles 13 form a conductive path in the second electrode layer E2. Figure 4 and Figure 5 , a cross-sectional structure of the external electrode 5 is schematically shown. Figure 4 and Figure 5 The shading representing the cross sections is omitted. Figure 4 and Figure 5 The shape and size of the silver particles 13 shown in the figure are different from the shape and size of actual silver particles.

[0072] The third electrode layer E3 is formed on the second electrode layer E2 by plating. In the multilayer capacitor C1, the third electrode layer E3 is formed on the second electrode layer E2 by copper plating. The third electrode layer E3 includes a copper plating layer. The third electrode layer E3 contains copper. The third electrode layer E3 is not limited to copper, and may also contain a metal that expands in volume due to oxidation. The third electrode layer E3 covers the second electrode layer E2.

[0073] The fourth electrode layer E4 is formed on the third electrode layer E3 by plating. In the multilayer capacitor C1, the fourth electrode layer E4 is formed on the third electrode layer E3 by nickel plating. The fourth electrode layer E4 includes a nickel plating layer. The fourth electrode layer E4 contains nickel. The nickel plating layer is superior in solder corrosion resistance compared to the silver particles 13 contained in the second electrode layer E2. The fourth electrode layer E4 covers the third electrode layer E3. The fourth electrode layer E4 includes another metal plating layer different from the third electrode layer E3.

[0074] The fifth electrode layer E5 is formed on the fourth electrode layer E4 by plating. The fifth electrode layer E5 includes a solder plating layer. In the multilayer capacitor C1, the fifth electrode layer E5 is formed on the fourth electrode layer E4 by tin plating. The fifth electrode layer E5 includes a tin plating layer. The fifth electrode layer E5 contains tin (Sn). The fifth electrode layer E5 may also include a Sn-Ag alloy plating layer, a Sn-Bi alloy plating layer, or a Sn-Cu alloy plating layer. The fifth electrode layer E5 covers the fourth electrode layer E4. The fifth electrode layer E5 includes other metal plating layers different from the third electrode layer E3.

[0075] The third electrode layer E3, the fourth electrode layer E4 and the fifth electrode layer E5 constitute a metal plating layer PL formed on the second electrode layer E2. That is, the external electrode 5 includes a metal plating layer PL, and the metal plating layer PL includes the third electrode layer E3, the fourth electrode layer E4 and the fifth electrode layer E5. The metal plating layer PL covers the second electrode layer E2. The third electrode layer E3 included in each electrode portion 5a, 5c, 5e is formed integrally. The fourth electrode layer E4 included in each electrode portion 5a, 5c, 5e is formed integrally. The fifth electrode layer E5 included in each electrode portion 5a, 5c, 5e is formed integrally.

[0076] Although the metal plating layer PL covering the second electrode layer E2 is easy to be in close contact with the second electrode layer E2, it is not easy to be in close contact with the element body 3. Therefore, the above-mentioned gap exists between the ends of the third electrode layer E3, the fourth electrode layer E4 and the fifth electrode layer E5 and the side surfaces 3a and 3c. There is also a gap between the ends of the third electrode layer E3, the fourth electrode layer E4 and the fifth electrode layer E5 and the edge between the side surface 3a and the side surface 3c. The distance between the ends of the third electrode layer E3, the fourth electrode layer E4 and the fifth electrode layer E5 and the side surfaces 3a and 3c, that is, the width of the above-mentioned gap, is, for example, greater than 0 and less than 3μm. The width of the gap between the ends of the third electrode layer E3, the fourth electrode layer E4 and the fifth electrode layer E5 and the edge between the side surface 3a and the side surface 3c is, for example, greater than 0 and less than 3μm. The width of the gap may be different for each third electrode layer E3, fourth electrode layer E4 and fifth electrode layer E5, and may be different for each side surface 3a, side surface 3c, and edge portion between side surfaces 3a and 3c.

[0077] like Figure 4 and Figure 5As shown, the multilayer capacitor C1 includes an oxide 15. The oxide 15 is arranged in the gap between the third electrode layer E3 and the element body 3. That is, the oxide 15 is arranged before the edge of the second electrode layer E2. The oxide 15 is in contact with the end of the third electrode layer E3 and the element body 3. For example, the oxide 15 blocks the gap between the third electrode layer E3 and the element body 3. The thickness of the oxide 15 is equal to the gap between the third electrode layer E3 and the element body 3. The width of the oxide 15 is, for example, equal to the thickness of the third electrode layer E3. The oxide 15 includes a portion 15a and a portion 15c. The oxide 15 may also constitute an insulating layer, for example.

[0078] The portion 15a is located on the side surface 3a. The portion 15a is in contact with the third electrode layer E3 and the side surface 3a and is disposed in the gap between the end of the third electrode layer E3 and the side surface 3a. For example, the portion 15a blocks the gap between the end of the third electrode layer E3 and the side surface 3a.

[0079] The portion 15c is located on the side surface 3c. The portion 15c is in contact with the end of the third electrode layer E3 and the side surface 3c and is arranged in the gap between the end of the third electrode layer E3 and the side surface 3c. For example, the portion 15c blocks the gap between the end of the third electrode layer E3 and the side surface 3c.

[0080] The oxide 15 includes a portion located on the edge between the side surface 3a and the side surface 3c. The portion is in contact with the end of the third electrode layer E3 and the edge between the side surface 3a and the side surface 3c and is arranged in the gap between the end of the third electrode layer E3 and the edge between the side surface 3a and the side surface 3c. For example, the above-mentioned portion located on the edge between the side surface 3a and the side surface 3c blocks the gap between the end of the third electrode layer E3 and the edge between the side surface 3a and the side surface 3c.

[0081] The portion 15a, the portion 15c, and the portion located on the edge between the side surface 3a and the side surface 3c are formed continuously and integrally. The oxide 15 is arranged over the pair of side surfaces 3a and the pair of side surfaces 3c.

[0082] like Figure 6 As shown, the portion 15a extends along the edge of the second electrode layer E2 of the electrode portion 5a. For example, the portion 15a extends continuously along the edge of the second electrode layer E2 of the electrode portion 5a. The portion 15a may also be connected to the second electrode layer E2 of the electrode portion 5a, or may be separated from the second electrode layer E2 of the electrode portion 5a.

[0083] like Figure 7As shown, the portion 15c extends along the edge of the second electrode layer E2 of the electrode portion 5c. For example, the portion 15c extends continuously along the edge of the second electrode layer E2 of the electrode portion 5c. The portion 15c may also be connected to the second electrode layer E2 of the electrode portion 5c, or may be separated from the second electrode layer E2 of the electrode portion 5c.

[0084] The above-mentioned portion located on the edge between the side surface 3a and the side surface 3c extends along the edge of the second electrode layer E2 included in the electrode portion located on the edge between the side surface 3a and the side surface 3c. For example, the above-mentioned portion located on the edge between the side surface 3a and the side surface 3c extends continuously along the edge of the second electrode layer E2 included in the electrode portion located on the edge between the side surface 3a and the side surface 3c. The above-mentioned portion located on the edge between the side surface 3a and the side surface 3c may be in contact with the second electrode layer E2 included in the electrode portion located on the edge between the side surface 3a and the side surface 3c, or may be separated from the second electrode layer E2 included in the electrode portion located on the edge between the side surface 3a and the side surface 3c.

[0085] Figure 6 and Figure 7 is a top view showing the second electrode layer and the oxide.

[0086] The oxide 15 includes an oxide of a metal component included in the metal plating layer PL. In the multilayer capacitor C1, the oxide 15 includes an oxide of copper included in the third electrode layer E3. For example, the oxide 15 includes an oxide of copper.

[0087] The oxide 15 is formed, for example, by heat treatment of the third electrode layer E3. In the heat treatment of the third electrode layer E3, for example, the following process is performed.

[0088] The copper oxide contained in the third electrode layer E3 is generated on the surface of the end of the third electrode layer E3. The copper oxide generated on the surface of the end of the third electrode layer E3 faces the element body 3 and grows in the gap between the end of the third electrode layer E3 and the element body 3. The copper oxide grown in the gap between the end of the third electrode layer E3 and the element body 3 grows until it is in contact with the element body 3. The conditions in the heat treatment of the third electrode layer E3 include, for example, the heating temperature and the heating time.

[0089] The heat treatment of the third electrode layer E3 may also be performed after forming the fourth electrode layer E4 and before forming the fifth electrode layer E5. In this case, the nickel oxide contained in the fourth electrode layer E4 may also be generated on the surface of the end of the fourth electrode layer E4. Nickel oxide has a tendency to form a passivation film and is less likely to grow than copper oxide. Therefore, there is a tendency for a gap to exist between the fourth electrode layer E4 and the element body 3.

[0090] The heat treatment of the third electrode layer E3 may also be performed after the fifth electrode layer E5 is formed. In this case, the metal oxide contained in the fifth electrode layer E5, such as tin oxide, may also be generated on the surface of the end of the fifth electrode layer E5. Tin oxide has a tendency to form a passivation film and is less likely to grow than copper oxide. Therefore, there is a tendency for a gap to exist between the fifth electrode layer E5 and the element body 3.

[0091] In the multilayer capacitor C1, the oxide 15 is disposed in the gap between the metal plating layer PL and the element body 3 so as to be in contact with the end of the metal plating layer PL and the element body 3. Therefore, even when migration of silver (Ag) occurs in the second electrode layer E2, the growth of the migration of silver can be suppressed. The multilayer capacitor C1 suppresses the growth of the migration of silver on the element body 3.

[0092] The oxide 15 includes an oxide of a metal component contained in the metal plating layer PL. Therefore, in the multilayer capacitor C1, the oxide 15 is reliably arranged in the gap between the metal plating layer PL and the element body 3.

[0093] In the multilayer capacitor C1, the metal plating layer PL includes the third electrode layer E3. The oxide 15 includes an oxide of copper contained in the third electrode layer E3.

[0094] In the multilayer capacitor C1, for example, the oxide 15 can be formed by heat treating the third electrode layer E3. Therefore, the oxide 15 can be easily arranged.

[0095] In the multilayer capacitor C1, the metal plating layer PL includes a fourth electrode layer E4. The fourth electrode layer E4 includes a metal plating layer different from that of the third electrode layer E3.

[0096] The fourth electrode layer E4 has a gap between it and the element body 3. For example, when the third electrode layer E3 is subjected to a heat treatment, the heat easily passes through the gap between the fourth electrode layer E4 and the element body 3 and acts on the third electrode layer E3. Therefore, the structure in which the metal plating layer PL includes the fourth electrode layer E4 can also easily and reliably configure the oxide 15.

[0097] In the multilayer capacitor C1, the metal plating layer PL includes a fourth electrode layer E4. The fourth electrode layer E4 prevents solder corrosion during solder mounting.

[0098] In the multilayer capacitor C1, the metal plating layer PL includes a fifth electrode layer E5. The fifth electrode layer E5 improves the soldering mountability of the multilayer capacitor C1.

[0099] In the multilayer capacitor C1, the metal plating layer PL includes a fifth electrode layer E5. The fifth electrode layer E5 includes a metal plating layer different from that of the third electrode layer E3.

[0100] The fifth electrode layer E5 has a gap between itself and the element body 3. For example, when the third electrode layer E3 is heat-treated, heat easily passes through the gap between the fifth electrode layer E5 and the element body 3 and acts on the third electrode layer E3. Therefore, the structure in which the metal plating layer PL includes the fifth electrode layer E5 can also easily and reliably configure the oxide 15.

[0101] In the multilayer capacitor C1, the oxide 15 extends along the edge of the second electrode layer E2. Therefore, the multilayer capacitor C1 reliably suppresses the growth of silver migration.

[0102] In this specification, when a certain element is described as being disposed on other elements, the certain element may be disposed on the other elements directly or indirectly. When a certain element is disposed on other elements indirectly, an intervening element exists between the certain element and the other elements. When a certain element is disposed on other elements directly, an intervening element does not exist between the certain element and the other elements.

[0103] In this specification, when a certain element is described as being located on other elements, the certain element may be directly located on the other elements or indirectly located on the other elements. When a certain element is indirectly located on other elements, an intervening element exists between the certain element and the other elements. When a certain element is directly located on other elements, an intervening element does not exist between the certain element and the other elements.

[0104] In this specification, when a certain element is described as covering other elements, the certain element may directly cover other elements or indirectly cover other elements. When a certain element indirectly covers other elements, the intervening element exists between the certain element and the other elements. When a certain element directly covers other elements, the intervening element does not exist between the certain element and the other elements.

[0105] It should be understood that all aspects, advantages and features described herein may not necessarily be achieved by any one specific example, nor may they be included in any one specific example. In fact, various examples are described and illustrated in this article, and it should be clear that other examples may also be modified in layout and details.

[0106] like Figure 8 and Fig. 9 As shown, the metal plating layer PL may also include a sixth electrode layer E6 located between the second electrode layer E2 and the third electrode layer E3. That is, the electrode portions 5a, 5c, and the electrode portion located on the edge between the side surface 3a and the side surface 3c may also include the sixth electrode layer E6. Figure 8 and Fig. 9 is a diagram showing a cross-sectional structure of an external electrode. Figure 8 and Fig. 9 , a cross-sectional structure of the external electrode 5 is schematically shown. Figure 8 and Fig. 9 The shading representing the cross sections is omitted. Figure 8 and Fig. 9 The shape and size of the silver particles 13 shown in the figure are different from the shape and size of actual silver particles.

[0107] In the structure where the metal plating layer PL includes the sixth electrode layer E6, the sixth electrode layer E6 is disposed on the second electrode layer E2. The sixth electrode layer E6 covers the second electrode layer E2. The sixth electrode layer E6 is in contact with the second electrode layer E2. The sixth electrode layer E6 is in direct contact with the second electrode layer E2.

[0108] The third electrode layer E3 is arranged on the sixth electrode layer E6. The third electrode layer E3 is arranged outside the second electrode layer E2. The third electrode layer E3 covers the sixth electrode layer E6. The third electrode layer E3 is in contact with the sixth electrode layer E6. The third electrode layer E3 is directly in contact with the sixth electrode layer E6. The third electrode layer E3 is formed on the sixth electrode layer E6 by plating.

[0109] The sixth electrode layer E6 is formed on the second electrode layer E2 by plating. The sixth electrode layer E6 is formed on the second electrode layer E2 by, for example, nickel plating. The sixth electrode layer E6 includes a nickel plated layer. The sixth electrode layer E6 contains nickel.

[0110] There is a gap between the end of the sixth electrode layer E6 and the element body 3, similarly to the ends of the third electrode layer E3, the fourth electrode layer E4, and the fifth electrode layer E5 and the element body 3. That is, there is a gap between the end of the sixth electrode layer E6 and the side surfaces 3a and 3c, and between the end of the sixth electrode layer E6 and the edge between the side surfaces 3a and 3c. The distance between the end of the sixth electrode layer E6 and the side surfaces 3a and 3c, that is, the width of the above-mentioned gap, is, for example, greater than 0 and less than 3 μm. The width of the gap between the end of the sixth electrode layer E6 and the edge between the side surfaces 3a and 3c is, for example, greater than 0 and less than 3 μm.

[0111] The width of the gap between the end of the sixth electrode layer E6 and the element body 3 may be the same as or different from the width of the gap between the end of each of the third electrode layer E3, the fourth electrode layer E4, and the fifth electrode layer E5 and the element body 3. The width of the gap between the end of the sixth electrode layer E6 and the side surface 3a, the width of the gap between the end of the sixth electrode layer E6 and the side surface 3c, and the width of the gap between the end of the sixth electrode layer E6 and the edge between the side surface 3a and the side surface 3c may be the same as or different from each other.

[0112] In the present embodiment and the modified example, a multilayer capacitor is used as an example of an electronic component, but the applicable electronic components are not limited to multilayer capacitors. The applicable electronic components include, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, multilayer solid battery components, or multilayer composite components, or electronic components other than multilayer electronic components.

Claims

1. An electronic component, in, include: body; an external electrode disposed on the element body, comprising: a conductive resin layer including a plurality of silver particles, and a metal plating layer disposed outside the conductive resin layer with a gap between the conductive resin layer and the element body; and The oxide of the metal component contained in the metal plating layer is arranged in the gap between the metal plating layer and the element body in contact with the metal plating layer and the element body.

2. The electronic component according to claim 1, wherein The metal plating layer comprises a copper plating layer, The oxide includes: the copper oxide contained in the copper plating layer.

3. The electronic component according to claim 2, wherein: The metal plating layer includes: other metal plating layers different from the copper plating layer, The other metal plating layer is arranged outside the copper plating layer with a gap between the other metal plating layer and the element body.

4. The electronic component according to claim 3, wherein The other metal plating layer includes a nickel plating layer.

5. The electronic component according to claim 4, wherein The other metal plating layer includes a solder plating layer arranged outside the nickel plating layer.

6. The electronic component according to claim 5, wherein The solder plating layer has a gap between itself and the element body.

7. The electronic component according to any one of claims 1 to 6, wherein The oxide extends along an edge of the conductive resin layer.

8. An electronic component, in, include: body; an external electrode including a conductive resin layer containing silver and disposed on the element body; and The oxide is arranged in front of the edge of the conductive resin layer and is in contact with the element body.

9. The electronic component according to claim 8, wherein The oxide extends along the edge of the conductive resin layer.

10. The electronic component according to claim 8 or 9, wherein: The external electrode further includes: a metal plating layer disposed outside the conductive resin layer, The oxide includes: an oxide of a metal component contained in the metal plating layer.

11. The electronic component according to claim 10, wherein The metal plating layer comprises a copper plating layer, The oxide includes: the copper oxide contained in the copper plating layer.

12. The electronic component according to claim 11, wherein The metal plating layer includes: another metal plating layer arranged outside the copper plating layer.

13. The electronic component according to claim 12, wherein: The other metal plating layer includes a nickel plating layer.

14. The electronic component according to claim 13, wherein The other metal plating layer includes a solder plating layer arranged outside the nickel plating layer.

15. The electronic component according to any one of claims 10 to 14, wherein The metal plating layer is separated from the element body, The oxide is disposed between the metal plating layer and the element body.

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