Multilayer ceramic electronic component

Abstract

Disclosed is a multilayer ceramic electronic component including: a stack including a plurality of dielectric layers stacked in a first direction and a plurality of internal electrodes stacked in the first direction; and a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode disposed outside the stack. The plurality of internal electrodes includes a plurality of first internal electrodes connected to the first and second external electrodes and a plurality of second internal electrodes connected to the third and fourth external electrodes, and an edge of a cross-section of the stack intersecting the first direction is a curve.

Description

Technical Field

[0001] The present disclosure relates to a multilayer ceramic electronic component. Background Art

[0002] Electronic components using ceramic materials include capacitors, inductors, piezoelectric elements, varistors, thermistors, etc. Multilayer ceramic capacitors (MLCCs) among ceramic electronic components can be used in various electronic devices due to their advantages of small size, high capacity, and easy installation.

[0003] For example, multilayer ceramic capacitors can be mounted on substrates of various electronic products (such as imaging devices (such as liquid crystal display devices (LCDs), plasma display device panels (PDPs), organic light emitting diodes (OLEDs), etc.), computers, personal portable terminals, and smart phones), so that the multilayer ceramic capacitors are used as chip capacitors that function to charge or discharge therefrom.

[0004] The multilayer ceramic capacitor may generally have a rectangular parallelepiped shape, and the structure may include portions (corners, vertices, etc.) that are less resistant to external impact, so that there is a problem of cracks occurring in the structure or structural breakage. Summary of the invention

[0005] An aspect of the present disclosure is to provide a multilayer ceramic electronic component resistant to external impact.

[0006] However, the problems to be solved by the embodiments of the present disclosure are not limited to the above-mentioned problems, and various extensions can be made within the scope of the technical concept included in the present disclosure.

[0007] A multilayer ceramic electronic component according to an embodiment of the present disclosure includes: a stacked body including a plurality of dielectric layers stacked in a first direction and a plurality of internal electrodes stacked in the first direction; and a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode disposed outside the stacked body. The plurality of internal electrodes include a plurality of first internal electrodes connected to the first external electrode and the second external electrode and a plurality of second internal electrodes connected to the third external electrode and the fourth external electrode, and an edge of a cross section of the stacked body intersecting the first direction is a curve.

[0008] The stacked body may include a first surface and a second surface opposite to each other in the first direction and a third surface connecting the first surface and the second surface, and the third surface may be a curved surface.

[0009] At least one of a boundary between the first surface and the third surface and a boundary between the second surface and the third surface may be a rounded shape.

[0010] The stacked body may have a cylindrical shape or an elliptical cylindrical shape.

[0011] The first, second, third, and fourth external electrodes may be disposed on the third surface of the stacked body.

[0012] At least one of the first, second, third, and fourth external electrodes may extend onto a portion of at least one of the first and second surfaces of the stacked body.

[0013] The first external electrode, the second external electrode, the third external electrode, and the fourth external electrode may be disposed at equal intervals.

[0014] The stacked body may include a structure in which the plurality of first internal electrodes and the plurality of second internal electrodes are alternately stacked with respective dielectric layers interposed between the plurality of first internal electrodes and the plurality of second internal electrodes.

[0015] At least one first inner electrode among the plurality of first inner electrodes may include a first electrode body and first and second lead portions that are arranged at edges of the first electrode body and spaced apart from each other, and at least one second inner electrode among the plurality of second inner electrodes may include a second electrode body and third and fourth lead portions that are arranged at edges of the second electrode body and spaced apart from each other.

[0016] The first lead out portion may be connected to the first external electrode, the second lead out portion may be connected to the second external electrode, the third lead out portion may be connected to the third external electrode, and the fourth lead out portion may be connected to the fourth external electrode.

[0017] The first lead portion and the second lead portion may extend from the first electrode body in directions opposite to each other.

[0018] The third lead-out portion and the fourth lead-out portion may extend from the second electrode body in directions opposite to each other.

[0019] The multilayer ceramic electronic component may further include a fifth external electrode and a sixth external electrode, wherein the at least one first internal electrode among the plurality of first internal electrodes may further include a fifth lead portion and a sixth lead portion arranged at an edge of the first electrode body and spaced apart from the first lead portion and the second lead portion, and the fifth lead portion is connected to the fifth external electrode, and the sixth lead portion is connected to the sixth external electrode.

[0020] When the first electrode body and the second electrode body are viewed from the first direction, the first electrode body and the second electrode body may have a circular shape or an elliptical shape.

[0021] Each of the first external electrode, the second external electrode, the third external electrode and the fourth external electrode may include a first metal layer, a second metal layer covering the first metal layer and a third metal layer covering the second metal layer, and the first metal layer of each of the first external electrode and the second external electrode is connected to the plurality of first internal electrodes, and the first metal layer of each of the third external electrode and the fourth external electrode is connected to the plurality of second internal electrodes.

[0022] The first metal layer may include copper (Cu), the second metal layer may include nickel (Ni), and the third metal layer may include tin (Sn).

[0023] A multilayer ceramic electronic component according to another embodiment of the present disclosure includes: a stacked body having a cylindrical shape or an elliptical cylindrical shape and including a plurality of dielectric layers stacked in a first direction and a plurality of internal electrodes stacked in the first direction; and a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode disposed outside the stacked body. The plurality of internal electrodes include a plurality of first internal electrodes connected to the first external electrode and the second external electrode, and a plurality of second internal electrodes connected to the third external electrode and the fourth external electrode.

[0024] At least one first internal electrode among the plurality of first internal electrodes includes a first electrode body and first and second lead portions that are arranged at the edge of the first electrode body and spaced apart from each other, and at least one second internal electrode among the plurality of second internal electrodes includes a second electrode body and third and fourth lead portions that are arranged at the edge of the second electrode body and spaced apart from each other.

[0025] The first lead portion is connected to the first external electrode, the second lead portion is connected to the second external electrode, the third lead portion is connected to the third external electrode, and the fourth lead portion is connected to the fourth external electrode.

[0026] The multilayer ceramic electronic component may further include a fifth external electrode and a sixth external electrode spaced apart from each of the first external electrode, the second external electrode, the third external electrode, and the fourth external electrode. The at least one first internal electrode of the plurality of first internal electrodes further includes a fifth lead portion and a sixth lead portion disposed at an edge of the first electrode body and spaced apart from the first lead portion and the second lead portion, and the fifth lead portion is connected to the fifth external electrode, and the sixth lead portion is connected to the sixth external electrode.

[0027] The stacked body of the multilayer ceramic electronic component according to the present disclosure may be resistant to external impact. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a perspective view schematically showing a multilayer ceramic electronic component according to an embodiment.

[0029] Figure 2 is along Figure 1 A cross-sectional view taken along line II-II'.

[0030] Figure 3 is along Figure 1 A cross-sectional view taken along line III-III'.

[0031] Figure 4 is along Figure 2 A cross-sectional view taken along line IV-IV'.

[0032] Figure 5 is along Figure 2 A cross-sectional view taken along line V-V'.

[0033] Figure 6 It is schematically shown Figure 1 An exploded perspective view of the stacked structure of a multilayer ceramic electronic component.

[0034] Figure 7 is a perspective view schematically showing a multilayer ceramic electronic component according to a comparative example.

[0035] Figure 8 is a perspective view schematically showing a multilayer ceramic electronic component according to another embodiment.

[0036] Fig. 9 It is schematically shown Figure 8 sectional view of a first inner electrode of a multilayer ceramic electronic component.

[0037] Fig.10 It is schematically shown Figure 8 sectional view of a second inner electrode of a multilayer ceramic electronic component. DETAILED DESCRIPTION

[0038] Hereinafter, various embodiments of the present disclosure will be described in detail so that a person skilled in the art of the present disclosure can easily implement the present disclosure with reference to the accompanying drawings. In order to clearly describe the present disclosure, parts or portions not related to the description are omitted in the accompanying drawings, and the same or similar constituent elements are represented by the same or similar reference numerals throughout the specification. In addition, some constituent elements in the accompanying drawings are enlarged, omitted or schematically shown, and the size of each constituent element does not fully reflect the actual size.

[0039] The accompanying drawings are provided only to facilitate understanding of the embodiments disclosed in this specification and should not be interpreted as limiting the spirit of the present disclosure. It should be understood that the present disclosure includes all modifications, equivalents, and alternatives without departing from the scope and spirit of the present disclosure.

[0040] Terms including ordinal numbers such as first, second, etc. will only be used to describe various components and should not be construed as limiting these components. These terms are only used to distinguish one component from other components.

[0041] It should be understood that when an element such as a layer, film, region, area, or substrate is referred to as being "on" or "above" another element, the element may be directly on the other element, or there may be intervening elements. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements. In addition, in the specification, the words "on..." or "above..." mean being disposed on or below a target portion, and do not necessarily mean being disposed on the upper side of the target portion based on the direction of gravity.

[0042] It will be further understood that the terms "include", "comprising" or "having" used throughout the specification list the existence of stated features, numbers, steps, operations, components, parts or combinations thereof, but do not exclude the existence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof. Therefore, unless explicitly described to the contrary, the words "include", "comprising" or "having" will be understood to imply the inclusion of the stated elements without excluding any other elements.

[0043] Furthermore, throughout the specification, the phrase “in a plan view” or “on a plane” means observing a target portion from the top, and the phrase “in a cross-sectional view” or “on a cross section” means observing a cross section formed by vertically cutting the target portion from the side.

[0044] Furthermore, throughout the specification, “connected” means not only that two or more elements are directly connected but also that two or more elements are indirectly connected through other elements and that they are physically or electrically connected, or may be represented by different names according to position or function, for example, two or more elements are linked to each other.

[0045] Figure 1 is a perspective view schematically showing a multilayer ceramic electronic component according to an embodiment, Figure 2 is along Figure 1 A cross-sectional view taken along line II-II', Figure 3 is along Figure 1 A cross-sectional view taken along line III-III', Figure 4 is along Figure 2 A cross-sectional view taken along line IV-IV' of Figure 5 is along Figure 2 A cross-sectional view taken along line V-V' of Figure 6 It is schematically shown Figure 1 An exploded perspective view of the stacked structure of a multilayer ceramic electronic component.

[0046] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 , a multilayer ceramic electronic component 1000 according to the present embodiment includes a stacked body (or a multilayer body) 100 and an external electrode 200 .

[0047] The stacked body 100 includes a first surface S1 , a second surface S2 , and a third surface S3 .

[0048] The first surface S1 and the second surface S2 are opposite to each other in the stacking direction (z-axis direction), and the third surface S3 is a curved surface connecting the first surface S1 and the second surface S2. Since the third surface S3 is a curved surface, the edge of the cross section of the stacked body 100 intersecting the stacking direction (z-axis direction) can be formed into a curve.

[0049] For example, when the first surface S1 and the second surface S2 are observed from the stacking direction (z-axis direction), the first surface S1 and the second surface S2 may have a circular shape or an elliptical shape. In this case, the stacked body 100 may have a cylindrical shape or an elliptical cylindrical shape. The boundary between the first surface S1 and the third surface S3 may be clearly distinguished, and if the edge of the first surface S1 and the edge of the third surface S3 are formed as curved surfaces, the boundary may not be clearly distinguished. For example, referring to Figure 2 , the cross section of the stacked body 100 has a rectangular shape, but its corners are rounded so that the boundary between the first surface S1 and the third surface S3 cannot be clearly distinguished. This can also be applied to the boundary between the second surface S2 and the third surface S3. For example, the above rounded shape can be formed by polishing the boundary between the first surface S1 and the third surface S3 and the boundary between the second surface S2 and the third surface S3.

[0050] The stacked body 100 may include a plurality of dielectric layers 110 stacked in a stacking direction (z-axis direction). The boundaries between the dielectric layers 110 may be unclear. For example, the plurality of dielectric layers 110 may be integrated so that the boundaries between the dielectric layers 110 are difficult to identify without using a scanning electron microscope (SEM).

[0051] The dielectric layer 110 may include a ceramic material having a high dielectric constant. For example, the ceramic material may include a dielectric ceramic including a component such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, etc. The component may also include auxiliary components such as manganese (Mn) compounds, iron (Fe) compounds, chromium (Cr) compounds, cobalt (Co) compounds, nickel (Ni) compounds, etc. For example, the dielectric layer includes a BaTiO3 in which calcium (Ca), zirconium (Zr), etc. are partially dissolved in the BaTiO3. 1-x Ca x )TiO3、Ba(Ti 1-y Ca y )O3、(Ba 1-x Ca x )(Ti 1-y Zr y )O3、Ba(Ti 1-y Zr y )O3, etc., but the present disclosure is not limited thereto. As another example, the dielectric layer may include TiO2, HfO2, Al2O3, AlN, AlScN, ZrO2, SiO2, MgO, Si3N4, etc.

[0052] In addition, the dielectric layer 110 may further include one or more of a ceramic additive, an organic solvent, a plasticizer, a binder, and a dispersant. For example, the ceramic additive may be a transition metal oxide or transition metal carbide, a rare earth element, magnesium (Mg), aluminum (Al), and the like.

[0053] As an example, the average thickness of the dielectric layer 110 may be 0.1 μm to 10 μm, but the present disclosure is not limited thereto.

[0054] The stacked body 100 may include a plurality of internal electrodes 300 stacked in a stacking direction (z-axis direction). The plurality of internal electrodes 300 may include a plurality of first internal electrodes 310 and a plurality of second internal electrodes 320. The first internal electrodes 310 and the second internal electrodes 320 may be alternately stacked with the dielectric layer 110 interposed between the first internal electrodes 310 and the second internal electrodes 320. This stacking structure may be repeated within the stacked body 100, and the internal electrode closest to the first surface S1 and the second surface S2 of the stacked body 100 may be the first internal electrode 310 or the second internal electrode 320.

[0055] The first and second internal electrodes 310 and 320 may have different polarities and may be electrically insulated from each other by the dielectric layer 110 disposed therebetween.

[0056] The first internal electrode 310 may include a first electrode body 311 , a first lead-out portion 313 , and a second lead-out portion 315 .

[0057] The first electrode body 311 is disposed on a surface of the dielectric layer 110 and is spaced apart from an edge of the dielectric layer 110 .

[0058] When the first electrode body 311 is viewed from the stacking direction (z-axis direction), the edge of the first electrode body 311 may include a curve and may have a circular shape or an elliptical shape, but the present disclosure is not limited thereto.

[0059] The first lead-out portion 313 is disposed at an edge of the first electrode body 311 and contacts an edge of the dielectric layer 110. That is, the first lead-out portion 313 is a portion extending from the first electrode body 311 to contact an edge of the dielectric layer 110. The portion where the first lead-out portion 313 contacts the edge of the dielectric layer 110 includes the third surface S3 of the stacked body 100.

[0060] The second lead portion 315 is disposed at an edge of the first electrode body 311 and contacts an edge of the dielectric layer 110. That is, the second lead portion 315 is a portion extending from the first electrode body 311 to contact an edge of the dielectric layer 110. The portion where the second lead portion 315 contacts the edge of the dielectric layer 110 includes the third surface S3 of the stacked body 100.

[0061] The second lead portion 315 is spaced apart from the first lead portion 313. The first lead portion 313 and the second lead portion 315 may be arranged at equal intervals. The first lead portion 313 and the second lead portion 315 may extend from the first electrode body 311 in opposite directions to each other. For example, if the first electrode body 311 has a circular shape, the line segment connecting the first lead portion 313 and the second lead portion 315 may be the diameter of the circle. As another example, if the first electrode body 311 has an elliptical shape, the line segment connecting the first lead portion 313 and the second lead portion 315 may be the major axis or the minor axis of the ellipse.

[0062] The first lead portion 313 is electrically connected to the first external electrode 210 , and the second lead portion 315 is electrically connected to the second external electrode 220 .

[0063] On the other hand, if necessary, one or more pairs of lead portions may be added to the first internal electrode 310 , and a corresponding number of external electrodes may be additionally disposed on the third surface S3 of the stacked body 100 .

[0064] The second internal electrode 320 may include a second electrode body 321 , a third lead-out portion 323 , and a fourth lead-out portion 325 .

[0065] The second electrode body 321 is disposed on a surface of the dielectric layer 110 and is spaced apart from an edge of the dielectric layer 110 .

[0066] When the second electrode body 321 is viewed from the stacking direction (z-axis direction), the edge of the second electrode body 321 may include a curve and may have a circular shape or an elliptical shape, but the present disclosure is not limited thereto.

[0067] The third lead-out portion 323 is disposed at an edge of the second electrode body 321 and contacts an edge of the dielectric layer 110. That is, the third lead-out portion 323 is a portion extending from the second electrode body 321 to contact an edge of the dielectric layer 110. The portion where the third lead-out portion 323 contacts the edge of the dielectric layer 110 includes the third surface S3 of the stacked body 100.

[0068] The fourth lead portion 325 is disposed at an edge of the second electrode body 321 and contacts an edge of the dielectric layer 110. That is, the fourth lead portion 325 is a portion extending from the second electrode body 321 to contact an edge of the dielectric layer 110. The portion where the fourth lead portion 325 contacts the edge of the dielectric layer 110 includes the third surface S3 of the stacked body 100.

[0069] The fourth lead portion 325 is spaced apart from the third lead portion 323. The third lead portion 323 and the fourth lead portion 325 may be arranged at equal intervals. The third lead portion 323 and the fourth lead portion 325 may extend from the second electrode body 321 in opposite directions to each other. For example, if the second electrode body 321 has a circular shape, the line segment connecting the third lead portion 323 and the fourth lead portion 325 may be the diameter of the circle. As another example, if the second electrode body 321 has an elliptical shape, the line segment connecting the third lead portion 323 and the fourth lead portion 325 may be the major axis or the minor axis of the ellipse.

[0070] The third lead portion 323 is electrically connected to the third external electrode 230 , and the fourth lead portion 325 is electrically connected to the fourth external electrode 240 .

[0071] On the other hand, if necessary, one or more pairs of lead portions may be added to the second internal electrode 320 , and a corresponding number of external electrodes may be additionally disposed on the third surface S3 of the stacked body 100 .

[0072] The internal electrode 300 may be formed by printing a conductive paste including a conductive metal on the surface of the dielectric layer 110. For example, a conductive paste including nickel (Ni) or a nickel (Ni) alloy may be printed on the surface of the dielectric layer using screen printing or gravure printing to form the internal electrode. However, the present disclosure is not limited thereto.

[0073] For example, the average thickness of the internal electrode 300 may be in the range of approximately several nm to several μm.

[0074] If a voltage is applied to the first external electrode 210, the second external electrode 220, the third external electrode 230, and the fourth external electrode 240, charges are accumulated between the first internal electrode 310 and the second internal electrode 320 which are opposite to each other through the above configuration. That is, capacitance may be obtained between the first internal electrode 310 electrically connected to the first external electrode 210 and the second external electrode 220 and the second internal electrode 320 electrically connected to the third external electrode 230 and the fourth external electrode 240. The capacitance of the multilayer ceramic electronic component 1000 is proportional to the overlapping area of ​​the first internal electrode 310 and the second internal electrode 320 which overlap each other in the stacking direction (z-axis direction).

[0075] A region where the first internal electrode 310 and the second internal electrode 320 overlap in the stacking direction (z-axis direction) may be referred to as an active region, and the capping layer 120 may be disposed outside the active region.

[0076] The cover layer 120 may include a first cover layer 121 and a second cover layer 123 .

[0077] The first cover layer 121 is disposed between the first surface S1 of the stacked body 100 and the internal electrode 300 closest to the first surface S1. The second cover layer 123 is disposed between the second surface S2 of the stacked body 100 and the internal electrode 300 closest to the second surface S2.

[0078] The first capping layer 121 and the second capping layer 123 may have the same composition as that of the dielectric layer 110. The capping layers may be formed by stacking one or more dielectric layers on the outer surface of the uppermost inner electrode and the outer surface of the lowermost inner electrode.

[0079] The first capping layer 121 and the second capping layer 123 may serve to prevent the internal electrode 300 from being damaged due to physical stress or chemical stress.

[0080] The external electrode 200 is disposed outside the stacked body 100 .

[0081] The external electrode 200 may include a first external electrode 210 , a second external electrode 220 , a third external electrode 230 , and a fourth external electrode 240 .

[0082] The first external electrode 210, the second external electrode 220, the third external electrode 230, and the fourth external electrode 240 may be disposed on the third surface S3 of the stacked body 100 to be spaced apart from each other. For example, the first external electrode 210, the second external electrode 220, the third external electrode 230, and the fourth external electrode 240 may be disposed on the third surface S3 at equal intervals.

[0083] At least one of the first external electrode 210, the second external electrode 220, the third external electrode 230, and the fourth external electrode 240 may extend onto a portion of at least one of the first surface S1 and the second surface S2 of the stacked body 100. That is, the external electrode 200 may extend onto a portion of the first surface S1 of the stacked body 100 and a portion of the second surface S2 of the stacked body 100, may extend onto only a portion of the first surface S1, or may extend onto only a portion of the second surface S2.

[0084] The first external electrode 210 may include a first metal layer 211, a second metal layer 213, and a third metal layer 215. The first metal layer 211 may be connected to the first internal electrode 310, the second metal layer 213 may cover the first metal layer 211, and the third metal layer 215 may cover the second metal layer 213. The first metal layer 211 may include copper (Cu), the second metal layer 213 may include nickel (Ni), and the third metal layer 215 may include tin (Sn). However, the present disclosure is not limited thereto. In addition, the second external electrode 220 may have the same structure and composition as the structure and composition of the above-mentioned first external electrode 210. In addition, the third external electrode 230 and the fourth external electrode 240 may have a structure and composition similar to the structure and composition of the above-mentioned first external electrode 210. For example, each of the third external electrode 230 and the fourth external electrode 240 may include a first metal layer connected to the second internal electrode 320, a second metal layer covering the first metal layer, and a third metal layer covering the second metal layer.

[0085] Figure 7 is a perspective view schematically showing a multilayer ceramic electronic component according to a comparative example.

[0086] Reference Figure 7 The multilayer ceramic electronic component 10 according to the comparative example includes a stacked body 20 and an external electrode 30. The stacked body 20 has a rectangular parallelepiped shape, and the external electrode 30 includes a first external electrode 31, a second external electrode 32, a third external electrode 33, and a fourth external electrode 34. The stacked body 20 has a rectangular parallelepiped shape so that it has eight vertices and twelve edges. Since the vertices and edges have very small areas, they are easily broken when external pressure is applied.

[0087] However, the stack 100 of the multilayer ceramic electronic component 1000 according to the present embodiment may have a cylindrical shape or an elliptical cylindrical shape. The structure does not have a portion corresponding to the vertex of the rectangular parallelepiped and has fewer edges. Therefore, even if an external impact is applied to the multilayer ceramic electronic component according to the present embodiment, the risk of cracking is not high. In addition, if the edge of the stack is polished into a rounded shape, the risk of cracking can be reduced.

[0088] Figure 8is a perspective view schematically showing a multilayer ceramic electronic component according to another embodiment, Fig. 9 It is schematically shown Figure 8 A cross-sectional view of a first inner electrode of a multilayer ceramic electronic component, and Fig.10 It is schematically shown Figure 8 sectional view of a second inner electrode of a multilayer ceramic electronic component.

[0089] Reference Figure 8 , Fig. 9 and Fig.10 , the multilayer ceramic electronic component 2000 may include a stacked body 2100 and an external electrode 2200 .

[0090] The first internal electrode 2300 may include a first electrode body 2310 , a first lead-out portion 2311 , a second lead-out portion 2312 , a fifth lead-out portion 2315 , and a sixth lead-out portion 2316 .

[0091] The first lead portion 2311 is electrically connected to the first external electrode 2210 , and the second lead portion 2312 is electrically connected to the second external electrode 2220 . In addition, the fifth lead portion 2315 is electrically connected to the fifth external electrode 2250 , and the sixth lead portion 2316 is electrically connected to the sixth external electrode 2260 .

[0092] On the other hand, if necessary, one or more pairs of lead-out portions may be added to the first internal electrode 2300, and a corresponding number of external electrodes may be additionally provided.

[0093] The second internal electrode 2400 may include a second electrode body 2410, a third lead-out portion 2413, and a fourth lead-out portion 2414. That is, the number of lead-out portions included in the first internal electrode 2300 and the number of lead-out portions included in the second internal electrode 2400 may be different from each other.

[0094] The third lead portion 2413 is electrically connected to the third external electrode 2230 , and the fourth lead portion 2414 is electrically connected to the fourth external electrode 2240 .

[0095] On the other hand, if necessary, one or more pairs of lead-out portions may be added to the second internal electrode 2400 , and a corresponding number of external electrodes may be additionally provided.

[0096] The remaining components except the above components are Figure 1 Components of the illustrated multilayer ceramic electronic component are the same, and thus, repeated descriptions thereof will be omitted.

[0097] While the present disclosure has been described in conjunction with the embodiments, it should be understood that the present disclosure is not limited to the disclosed embodiments, but is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A multilayer ceramic electronic component comprising: a stacked body comprising a plurality of dielectric layers stacked in a first direction and a plurality of internal electrodes stacked in the first direction; as well as The first external electrode, the second external electrode, the third external electrode and the fourth external electrode are arranged outside the stack, The multiple inner electrodes include multiple first inner electrodes connected to the first outer electrode and the second outer electrode and multiple second inner electrodes connected to the third outer electrode and the fourth outer electrode, and the edge of the cross section of the stacked body intersecting the first direction is a curve.

2. The multilayer ceramic electronic component according to claim 1, wherein: The stacked body includes a first surface and a second surface opposite to each other in the first direction and a third surface connecting the first surface and the second surface, and the third surface is a curved surface.

3. The multilayer ceramic electronic component according to claim 2, wherein: At least one of a boundary between the first surface and the third surface and a boundary between the second surface and the third surface is a rounded shape.

4. The multilayer ceramic electronic component according to claim 2, wherein: The stacked body has a cylindrical shape or an elliptical cylindrical shape.

5. The multilayer ceramic electronic component according to claim 2, wherein: The first external electrode, the second external electrode, the third external electrode, and the fourth external electrode are disposed on the third surface of the stacked body.

6. The multilayer ceramic electronic component according to claim 5, wherein: At least one of the first external electrode, the second external electrode, the third external electrode, and the fourth external electrode extends onto a portion of at least one of the first surface and the second surface of the stacked body.

7. The multilayer ceramic electronic component according to claim 5, wherein: The first external electrode, the second external electrode, the third external electrode, and the fourth external electrode are disposed at equal intervals.

8. The multilayer ceramic electronic component according to claim 1, wherein: The stacked body includes a structure in which the plurality of first internal electrodes and the plurality of second internal electrodes are alternately stacked with respective dielectric layers interposed between the plurality of first internal electrodes and the plurality of second internal electrodes.

9. The multilayer ceramic electronic component according to claim 1, wherein: At least one first internal electrode among the plurality of first internal electrodes includes a first electrode body and first and second lead portions that are arranged at the edge of the first electrode body and spaced apart from each other, and at least one second internal electrode among the plurality of second internal electrodes includes a second electrode body and third and fourth lead portions that are arranged at the edge of the second electrode body and spaced apart from each other.

10. The multilayer ceramic electronic component according to claim 9, wherein: The first lead portion is connected to the first external electrode, the second lead portion is connected to the second external electrode, the third lead portion is connected to the third external electrode, and the fourth lead portion is connected to the fourth external electrode.

11. The multilayer ceramic electronic component according to claim 9, wherein: The first lead portion and the second lead portion extend from the first electrode body in directions opposite to each other.

12. The multilayer ceramic electronic component according to claim 11, wherein: The third lead portion and the fourth lead portion extend from the second electrode body in directions opposite to each other.

13. The multilayer ceramic electronic component according to claim 10, further comprising a fifth external electrode and a sixth external electrode, in, The at least one first internal electrode of the plurality of first internal electrodes further includes fifth and sixth lead portions disposed at an edge of the first electrode body and spaced apart from the first and second lead portions, and The fifth lead-out portion is connected to the fifth external electrode, and the sixth lead-out portion is connected to the sixth external electrode.

14. The multilayer ceramic electronic component according to claim 9, wherein: When the first electrode body and the second electrode body are viewed from the first direction, the first electrode body and the second electrode body have a circular shape or an elliptical shape.

15. The multilayer ceramic electronic component according to claim 1, wherein: Each of the first external electrode, the second external electrode, the third external electrode and the fourth external electrode includes a first metal layer, a second metal layer covering the first metal layer and a third metal layer covering the second metal layer, and the first metal layer of each of the first external electrode and the second external electrode is connected to the multiple first internal electrodes, and the first metal layer of each of the third external electrode and the fourth external electrode is connected to the multiple second internal electrodes.

16. The multilayer ceramic electronic component according to claim 15, wherein: The first metal layer includes copper, the second metal layer includes nickel, and the third metal layer includes tin.

17. A multilayer ceramic electronic component comprising: a stacked body having a cylindrical shape or an elliptical cylindrical shape and including a plurality of dielectric layers stacked in a first direction and a plurality of inner electrodes stacked in the first direction; as well as The first external electrode, the second external electrode, the third external electrode and the fourth external electrode are arranged outside the stack, The plurality of inner electrodes include a plurality of first inner electrodes connected to the first outer electrode and the second outer electrode and a plurality of second inner electrodes connected to the third outer electrode and the fourth outer electrode.

18. The multilayer ceramic electronic component according to claim 17, wherein: At least one first internal electrode among the plurality of first internal electrodes includes a first electrode body and first and second lead portions that are arranged at the edge of the first electrode body and spaced apart from each other, and at least one second internal electrode among the plurality of second internal electrodes includes a second electrode body and third and fourth lead portions that are arranged at the edge of the second electrode body and spaced apart from each other.

19. The multilayer ceramic electronic component according to claim 18, wherein: The first lead portion is connected to the first external electrode, the second lead portion is connected to the second external electrode, the third lead portion is connected to the third external electrode, and the fourth lead portion is connected to the fourth external electrode.

20. The multilayer ceramic electronic component of claim 19, further comprising fifth and sixth external electrodes spaced apart from each of the first, second, third, and fourth external electrodes, in, The at least one first internal electrode of the plurality of first internal electrodes further includes fifth and sixth lead portions disposed at an edge of the first electrode body and spaced apart from the first and second lead portions, and The fifth lead-out portion is connected to the fifth external electrode, and the sixth lead-out portion is connected to the sixth external electrode.

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