Packaging substrate capable of being traced in whole process and preparation method thereof

Abstract

The invention provides a packaging substrate capable of being traced in a whole process and a preparation method thereof, and the preparation method comprises the steps: providing a bearing plate comprising a core layer, a first copper foil layer and an adhesion layer, forming a first composite layer on one surface, far away from the core layer, of the first copper foil layer, and obtaining a primary lamination structure, laser-engraving a first traceability code on the top surface and the bottom surface of the primary lamination structure to form a first electroplated layer, forming a second composite layer covering the first electroplated layer, and obtaining a secondary lamination structure, laser-engraving a second traceability code on the top surface and the bottom surface of the secondary lamination structure, stripping the adhesion layer to remove the core layer, and obtaining the coreless packaging substrate, a traceability general code is laser-engraved in the coreless package substrate. According to the preparation method of the package substrate capable of being traced in the whole process, the problem that traceability codes are damaged in the splitting operation of the coreless package substrate can be avoided, stable traceability of the coreless package substrate in the whole process is achieved, and the requirements of customers are met.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor integrated circuit manufacturing, and relates to a packaging substrate with full-process traceability and a preparation method thereof. Background Art

[0002] With the increasing demand for industrial intelligence, the future development trend of the IC packaging substrate industry will focus on intelligence, high performance, green environmental protection and digital transformation. The full-process traceability of the packaging substrate is a quality monitoring and process traceability system derived from information technology. Through the equipment equipped with a code reader, the production board identification code is identified and compared and verified to confirm whether the processing parameters and materials are correct to ensure normal production. In addition, through the packaging substrate process traceability system, real-time collection and aggregation of information is achieved, which plays an important role in quality improvement.

[0003] However, in actual operation, the coreless package substrate needs to be split into two parts at a certain layer due to its special manufacturing process. The through hole of the traceability QR code usually extends to the core layer. After electroplating, the through hole will be connected to the adhesion layer on the core layer. During the splitting operation, the stress on the adhesion layer will often pull the through hole, resulting in damage to the traceability QR code used to distinguish the surfaces of the two boards before disassembly and exposed substrate, thereby affecting the material layer and the traceability process of the product.

[0004] Therefore, how to provide a packaging substrate and a preparation method thereof that can be traced throughout the entire process to avoid the problem of damage to the traceability code of the coreless packaging substrate during the splitting operation, improve product quality and meet customer needs has become an important issue that needs to be urgently solved by technical personnel in this field.

[0005] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of the present application. Summary of the invention

[0006] In view of the shortcomings of the prior art described above, an object of the present invention is to provide a packaging substrate and a preparation method thereof that can be traced throughout the entire process, so as to solve the problems in the prior art of damage to the traceability code, exposure of the substrate, and impact on material layer and product traceability during the disassembly operation of the coreless packaging substrate.

[0007] To achieve the above-mentioned object and other related objects, the present invention provides a method for preparing a packaging substrate with full process traceability, comprising the following steps:

[0008] A carrier board is provided, the carrier board comprising a core layer, a first copper foil layer is disposed on the top and bottom surfaces of the core layer, and an adhesive layer is disposed between the first copper foil layer and the core layer;

[0009] forming a first composite layer on a side of the first copper foil layer away from the core layer to obtain a primary lamination structure;

[0010] Laser engraving a first traceability code on the top surface and the bottom surface of the one-time pressing structure, wherein the first traceability code includes a plurality of blind holes that do not completely penetrate the first copper foil layer;

[0011] Performing a first electroplating to form a first electroplating layer on a side of the first composite layer away from the core layer;

[0012] forming a second composite layer covering the first electroplating layer, wherein the first traceability code is covered by the second composite layer, thereby obtaining a secondary lamination structure;

[0013] Laser engraving a second traceability code on the top surface and the bottom surface of the secondary lamination structure, wherein the second traceability code includes a plurality of blind holes that do not completely penetrate the first copper foil layer;

[0014] Peeling the first copper foil layer off the adhesive layer to obtain two coreless packaging substrates;

[0015] A traceability code is laser engraved in the coreless package substrate, wherein the traceability code includes a plurality of through holes penetrating the coreless package substrate.

[0016] Optionally, the first composite layer includes a first semi-cured layer and a second copper foil layer, and the step of forming the first composite layer includes:

[0017] placing a first semi-cured layer on a side of the first copper foil layer away from the core layer;

[0018] placing a second copper foil layer on a side of the first semi-cured layer away from the core layer;

[0019] Press fit.

[0020] Optionally, the second composite layer includes a second semi-cured layer and a third copper foil layer, and the step of forming the second composite layer includes:

[0021] placing a second semi-cured layer on a side of the first electroplated layer away from the core layer;

[0022] placing a third copper foil layer on a side of the second semi-cured layer away from the core layer;

[0023] Press fit.

[0024] Optionally, before peeling the first copper foil layer from the adhesive layer, a first opening is opened in the second copper foil layer located on the top surface side of the carrier board and the first electroplating layer located on the top surface side of the carrier board, and a second opening is opened in the second copper foil layer located on the bottom surface side of the carrier board and the first electroplating layer located on the bottom surface side of the carrier board, the projection of the first opening in the vertical direction is located within the projection of the first traceability code on the top surface side of the carrier board in the vertical direction, and the projection of the second opening in the vertical direction is located within the projection of the first traceability code on the bottom surface side of the carrier board.

[0025] Optionally, after peeling off the first copper foil layer located on the top side of the carrier board from the adhesive layer, a first coreless packaging substrate is obtained, and after peeling off the first copper foil layer located on the bottom side of the carrier board from the adhesive layer, a second coreless packaging substrate is obtained, the traceability code of the first coreless packaging substrate runs through the first opening, and the traceability code of the second coreless packaging substrate runs through the second opening.

[0026] Optionally, the diameter of the blind hole is not less than 180 μm, and the depth of the blind hole is in the range of 20 to 50 μm.

[0027] Optionally, before peeling the first copper foil layer from the adhesive layer, the method further includes forming a second electroplated layer on a side of the second composite layer away from the core layer.

[0028] Optionally, the step of laser engraving the second traceability code includes:

[0029] irradiating the first traceability code with X-rays to obtain an X-ray image of the first traceability code;

[0030] Reading information of the first traceability code based on the X-ray image;

[0031] Laser engraving is performed to transcribe the information of the first traceability code into the second traceability code.

[0032] Optionally, the distances between the outermost boundaries of the first traceability code, the second traceability code and the traceability code projected in the vertical direction and the center line of the coreless packaging substrate are not more than 150 mm, and the distances between the outermost boundaries of the first traceability code, the second traceability code and the traceability code projected in the vertical direction and any side of the coreless packaging substrate are not less than 0.65 mm.

[0033] Optionally, the first traceability code is located in a peripheral area of ​​the first composite layer, the second traceability code is located in a peripheral area of ​​the second composite layer, the traceability pass code is located in a peripheral area of ​​the coreless packaging substrate, and the projections of the first traceability code, the second traceability code and the traceability pass code in the vertical direction do not overlap with each other.

[0034] Optionally, before peeling the first copper foil layer from the adhesion layer, the step of forming a third composite layer covering the second electroplated layer is also included, and a third traceability code is provided in the peripheral area of ​​the third composite layer, and the spacing between the first traceability code and the second traceability code is not less than 0.8 mm, the spacing between the second traceability code and the third traceability code is not less than 0.8 mm, and the spacing between the first traceability code and the third traceability code is not less than 0.1 mm.

[0035] The present invention also provides a packaging substrate capable of full-process traceability, comprising:

[0036] First copper foil layer;

[0037] A first composite layer, located on one side of the first copper foil layer;

[0038] A first traceability code is located in the first composite layer, wherein the first traceability code includes a plurality of blind holes that do not completely penetrate the first copper foil layer;

[0039] A first electroplating layer is located on a side of the first composite layer away from the first copper foil layer;

[0040] a second composite layer, located on a side of the first electroplated layer away from the first composite layer;

[0041] A second traceability code is located at least in the second composite layer, and the second traceability code includes a plurality of blind holes that do not completely penetrate the first copper foil layer;

[0042] The traceability through code includes a plurality of through holes penetrating the first copper foil layer, the first composite layer, the first electroplating layer and the second composite layer.

[0043] Among them, the preparation process of the packaging substrate that can be traced throughout the entire process adopts any of the above-mentioned methods for preparing the packaging substrate that can be traced throughout the entire process.

[0044] As described above, the preparation method of a fully traceable packaging substrate of the present invention includes: providing a carrier board including a core layer and two first copper foil layers and an adhesive layer, forming a first composite layer on a side of the first copper foil layer away from the core layer to obtain a primary lamination structure, laser engraving a first traceability code on the top and bottom surfaces of the primary lamination structure, forming a first electroplating layer, forming a second composite layer covering the first electroplating layer to obtain a secondary lamination structure, laser engraving a second traceability code on the top and bottom surfaces of the secondary lamination structure, peeling the first copper foil from the adhesive layer, removing the core layer to obtain a coreless packaging substrate, laser engraving a traceability code in the coreless packaging substrate, wherein the first copper foil layer is located on the top and bottom surfaces of the core layer, the adhesive layer is located between the first copper foil layer and the core layer, the first traceability code and the second traceability code include multiple blind holes that do not completely penetrate the first copper foil layer, and the traceability code includes multiple through holes. The preparation method of the packaging substrate with full-process traceability of the present invention can avoid the problems of damage to the traceability code of the coreless packaging substrate, exposure of the substrate, and influence on the material layer and product traceability during the splitting operation, thereby achieving stable traceability of the whole process of the coreless packaging substrate, improving product quality and meeting customer needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 Shown is a process flow chart of a method for preparing a packaging substrate with full process traceability according to the present invention.

[0046] Figure 2 Shown is a schematic structural diagram of a carrier plate provided in the method for preparing a packaging substrate with full-process traceability of the present invention.

[0047] Figure 3 It is a schematic diagram showing a single-pressed structure obtained after forming a first composite layer in the method for preparing a packaging substrate with full process traceability of the present invention.

[0048] Figure 4 It is a schematic diagram showing the structure obtained after forming the first traceability code in the method for preparing a packaging substrate with full-process traceability of the present invention.

[0049] Figure 5 Shown is a schematic diagram of a 14×14 matrix two-dimensional barcode.

[0050] Figure 6 Shown is a schematic diagram of an 18×18 matrix two-dimensional barcode.

[0051] Figure 7 It is a schematic diagram showing the structure obtained after forming the first electroplating layer, the first opening and the second opening in the method for preparing a packaging substrate with full process traceability of the present invention.

[0052] Figure 8 Display as Figure 7 Schematic diagram of the enlarged structure of area A in the middle.

[0053] Fig. 9 It is a schematic diagram showing a secondary lamination structure obtained after forming a second composite layer in the method for preparing a packaging substrate with full process traceability of the present invention.

[0054] Fig.10 It is a schematic diagram showing the structure obtained by forming a second traceability code in the method for preparing a packaging substrate with full-process traceability of the present invention.

[0055] Fig.11 Shown is a schematic image of the first traceability code under X-ray irradiation in the method for preparing a packaging substrate with full-process traceability of the present invention.

[0056] Fig.12 It is a schematic diagram showing the structure obtained after peeling off the first copper foil layer and forming a traceability code in the method for preparing a packaging substrate with full process traceability of the present invention.

[0057] Fig.13 It is a schematic diagram showing the structure obtained after forming the second electroplating layer in the method for preparing a packaging substrate with full process traceability of the present invention.

[0058] Fig.14 Display as Fig.13 Schematic diagram of the enlarged structure of area B in the middle.

[0059] Fig.15 Shown is a top view of a packaging substrate structure that can be traced throughout the entire process of the present invention.

[0060] Fig.16 Display as Fig.15 Schematic diagram of the enlarged structure of the C area in the middle.

[0061] Fig.17 A schematic diagram showing a pressing structure before separation in another embodiment of the method for preparing a packaging substrate with full process traceability of the present invention.

[0062] Fig.18 Shown is a schematic diagram of the structure of a packaging substrate that can be traced throughout the entire process.

[0063] Description of Reference Numerals

[0064] 1 Loading plate

[0065] 101 Core Layer

[0066] 102 Adhesion layer

[0067] 103 First copper foil layer

[0068] 2 First composite layer

[0069] 201 First semi-cured layer

[0070] 202 Second copper foil layer

[0071] 3. First traceability code

[0072] 301 Blind hole

[0073] 4 First electroplating layer

[0074] 5 First Opening

[0075] 6 Second opening

[0076] 7 Second composite layer

[0077] 701 Second semi-cured layer

[0078] 702 third copper foil layer

[0079] 8 Pattern

[0080] 9 Second traceability code

[0081] 901 Blind hole

[0082] 10 Second electroplating layer

[0083] 11 Traceability code

[0084] 1101 Through hole

[0085] 12 The first coreless packaging substrate

[0086] 13. Second coreless packaging substrate

[0087] 14 Outlying Areas

[0088] 15 Coding Area

[0089] 16 Third composite layer

[0090] 17 Third traceability code

[0091] D1 Top diameter of blind hole

[0092] D2 bottom diameter of blind hole

[0093] D3 Top diameter of blind hole

[0094] D4 bottom diameter of blind hole

[0095] L1 Length of the coding area

[0096] L2 Distance between the coding area and the edge of the coreless package substrate

[0097] L3 The distance between the first traceability code and the second traceability code

[0098] L4 The distance between the second traceability code and the third traceability code

[0099] L5 The distance between the first traceability code and the third traceability code

[0100] P Centerline of coreless package substrate

[0101] Steps S1 to S8 DETAILED DESCRIPTION

[0102] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0103] It should be emphasized that the term “include / comprises” when used herein refers to the presence of features, integers, steps or components, but does not exclude the presence or addition of one or more other features, integers, steps or components.

[0104] Features described and / or illustrated with respect to one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0105] For example, when describing the embodiments of the present invention in detail, for the sake of convenience, the schematic diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0106] For ease of description, spatially relative terms such as "under", "below", "below", "below", "above", "on", etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

[0107] In the context of the present application, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0108] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and therefore the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0109] See also Figure 1 , which is a process flow chart of a method for preparing a packaging substrate with full process traceability according to the present invention, comprising the following steps:

[0110] S1: providing a carrier board, the carrier board comprising a core layer, a first copper foil layer is disposed on the top and bottom surfaces of the core layer, and an adhesive layer is disposed between the first copper foil layer and the core layer;

[0111] S2: forming a first composite layer on a side of the first copper foil layer away from the core layer to obtain a primary lamination structure;

[0112] S3: laser engraving a first traceability code on the top surface and the bottom surface of the one-time pressing structure, wherein the first traceability code includes a plurality of blind holes that do not completely penetrate the first copper foil layer;

[0113] S4: performing a first electroplating to form a first electroplating layer on a side of the first composite layer away from the core layer;

[0114] S5: forming a second composite layer covering the first electroplating layer, wherein the first traceability code is covered by the second composite layer, thereby obtaining a secondary lamination structure;

[0115] S6: laser engraving a second traceability code on the top surface and the bottom surface of the secondary lamination structure, wherein the second traceability code includes a plurality of blind holes that do not completely penetrate the first copper foil layer;

[0116] S7: peeling the first copper foil layer from the adhesive layer to obtain two coreless packaging substrates;

[0117] S8: laser engraving a traceability code in the coreless packaging substrate, wherein the traceability code includes a plurality of through holes penetrating the coreless packaging substrate.

[0118] The following will be combined Figures 2 to 14 , detailing each step of the method for manufacturing a packaging substrate with full process traceability of the present invention.

[0119] First, please refer to Figure 2 , perform step S1: provide a carrier board 1, the carrier board 1 includes a core layer 101, the top and bottom surfaces of the core layer 101 are both provided with a first copper foil layer 103, and an adhesive layer 102 is provided between the first copper foil layer 103 and the core layer 101.

[0120] As an example, the carrier board 1 is a detachable copper foil board, and the first copper foil 103 can be detached from the adhesive layer 102 .

[0121] As an example, the thickness of the first copper foil 102 ranges from 2 to 6 μm.

[0122] It should be noted that the thickness of the adhesive layer 102 in the carrier board 1 is set according to demand. The thickness of the adhesive layer 102 can be greater than the thickness of the first copper foil 103, or the thickness of the adhesive layer 102 can be set to be less than the thickness of the first copper foil 103. In the present embodiment, the adhesive layer 102 is a thicker adhesive layer.

[0123] Please see again Figure 3 , executing step S2: forming a first composite layer 2 on a side of the first copper foil layer 103 away from the core layer 101 to obtain a primary lamination structure.

[0124] As an example, the first composite layer 2 includes a first semi-cured layer 201 and a second copper foil layer 202, and the steps of forming the first composite layer 2 include:

[0125] (1) placing a first semi-cured layer 201 on a side of the first copper foil layer 103 away from the core layer 101;

[0126] (2) placing a second copper foil layer 202 on a side of the first semi-cured layer 201 away from the core layer 101;

[0127] (3) Perform pressing.

[0128] Please see again Figure 4 , execute step S3: laser engrave a first traceability code 3 on the top and bottom surfaces of the one-time pressing structure, the first traceability code 3 includes a plurality of blind holes 301 that do not completely penetrate the first copper foil layer 103. In this embodiment, taking the example that the first traceability code 3 does not penetrate the first semi-cured layer 201, a certain distance is maintained between the bottom of the blind hole 301 and the lower first copper foil layer 103 to prevent the blind hole 301 from adhering to the first copper foil layer 103. In the later board removal operation, the stress on the first copper foil layer 103 is prevented from damaging the blind hole 301, thereby ensuring the integrity of the first traceability code 3. In other embodiments, the first traceability code 3 may also penetrate the first semi-cured layer 201.

[0129] As an example, from product feeding to pressing, the laser engraves the first traceability code 3 on both sides of the current layer (the layer currently being processed, i.e., the first composite layer 2). The top and bottom surfaces of the current layer are exactly the same in position and size except for the different skip numbers. After removing the board, turning over the first traceability code 3 on any surface will completely overlap the position of the first traceability code 3 on the unturned surface.

[0130] As an example, a certain lateral spacing is provided between the first traceability code 3 located on the top surface of the carrier plate 1 and the first traceability code 3 located on the bottom surface of the carrier plate 1 .

[0131] As an example, the diameter of the blind hole 301 is not less than 180 μm, and the depth of the blind hole 301 ranges from 20 to 50 μm, ensuring that the blind hole 301 will not be plugged after the first electroplating operation, thereby avoiding affecting the subsequent code reading process. Such a design allows the blind hole 301 to maintain an appropriate distance from the underlying layer, avoiding chemical corrosion from penetrating the first semi-cured layer 201 and entering the underlying substrate, thereby preventing the first traceability code 3 from exposing the underlying substrate.

[0132] As an example, the format of the first traceability code 3 can be selected according to the specific situation, and is preferably a matrix two-dimensional barcode (Data Matrix). The matrix two-dimensional barcode has the characteristics of high density, reliability, coding diversity, flexibility, and rapid identification. It is widely used in logistics, manufacturing, etc. The number of rows and columns of the matrix two-dimensional barcode is selected according to the amount of information required. Please refer to Figure 5 , which is a schematic diagram of a 14×14 matrix two-dimensional barcode. In this embodiment, a 14×14 matrix two-dimensional barcode is selected as the first traceability code 3, wherein each dot represents a blind hole 301. In some other embodiments, please refer to Figure 6 , showing a schematic diagram of an 18×18 matrix two-dimensional barcode. The first traceability code 3 has a large amount of information, and an 18×18 matrix two-dimensional barcode is selected.

[0133] Please see again Figure 7 , executing step S4: performing a first electroplating to form a first electroplating layer 4 on a side of the first composite layer 2 away from the core layer 101 , wherein the first electroplating layer 4 is used to adjust the thickness of the second copper foil layer 202 .

[0134] As an example, see Figure 8 , displayed as Figure 7In the enlarged structural schematic diagram of area A (i.e., a slice of the first traceability code 3 after the first electroplating), the top diameter D1 of the blind hole 301 is larger than the bottom diameter D2 of the blind hole 301. In the present embodiment, the cross-section of the blind hole 301 is preferably funnel-shaped, which can effectively reduce the risk of damage to the blind hole 301 during the board removal process.

[0135] Please see again Fig. 9 , executing step S5: forming a second composite layer 7 covering the first electroplating layer 4, the first traceability code 3 is covered by the second composite layer 7, and a secondary lamination structure is obtained.

[0136] As an example, the second composite layer 7 includes a second semi-cured layer 701 and a third copper foil layer 702, and the steps of forming the second composite layer 7 include:

[0137] (1) placing a second semi-cured layer 701 on a side of the first electroplated layer 4 away from the core layer 101;

[0138] (2) placing a third copper foil layer 702 on a side of the second semi-cured layer 701 away from the core layer 101;

[0139] (3) Perform pressing.

[0140] Please see again Fig.10 , execute step S6: laser engrave a second traceability code 9 on the top surface and the bottom surface of the secondary lamination structure, the second traceability code 9 includes a plurality of blind holes 901 that do not completely penetrate the first copper foil layer 103. In this embodiment, taking the second traceability code 9 not penetrating the second semi-cured layer 701 as an example, that is, the blind holes 901 of the second traceability code 9 penetrate the third copper foil layer 702 and do not penetrate the second semi-cured layer 701. In other embodiments, the second traceability code 9 may also penetrate the second semi-cured layer 701.

[0141] As an example, the steps of laser engraving the second traceability code 9 include:

[0142] (1) Irradiating the first traceability code 3 with X-rays to obtain an X-ray image of the first traceability code 3.

[0143] (2) Reading information of the first traceability code 3 based on the X-ray image.

[0144] (3) Laser engraving is performed to transcribe the information of the first traceability code 3 into the second traceability code 9, thereby completing the traceability process of transcribing the inner layer information to the outer layer information (transcoding).

[0145] For details, please refer to Fig.11, which is a schematic diagram of an image of the first traceability code 3 under X-ray irradiation in the method for preparing a fully traceable packaging substrate of the present invention (i.e., an image obtained by X-ray irradiation of the first traceability code 3 located on the top surface of the carrier board 1), wherein the circular ring outside the first traceability code 3 is the pattern 8 on the third copper foil layer 702, and the information of the X-ray image of the first traceability code 3 (i.e., the inner layer information) is read and identified by the view software, and then the inner layer information is transcribed into the second traceability code 9 by using a two-dimensional code generator, and finally, the second traceability code 9 is laser engraved on the top and bottom surfaces of the secondary lamination structure.

[0146] As an example, the second traceability code 9 of any side after the board is removed will be turned over and will completely overlap with the position of the second traceability code 9 of the unturned side.

[0147] As an example, the diameter of the blind hole 901 is not less than 180 μm, and the depth of the blind hole 901 is in the range of 20 to 50 μm.

[0148] As an example, the format of the second traceability code 9 is preferably a matrix two-dimensional barcode. In this embodiment, a 14×14 matrix two-dimensional barcode is selected as the second traceability code 9.

[0149] Please see again Fig.12 , executing step S7: peeling the first copper foil layer 103 from the adhesive layer 102 to obtain two coreless packaging substrates.

[0150] As an example, see Fig.13 In some embodiments, before peeling the first copper foil layer 103 from the adhesive layer 102, a step of forming a second electroplated layer 10 on a side of the second composite layer 7 away from the core layer 101 is also included. Fig.12 The two coreless packaging substrates obtained also have the second electroplating layer 10.

[0151] As an example, see Fig.14 , displayed as Fig.13 In the enlarged structural schematic diagram of area B (i.e., a slice of the second traceability code 9 after the second electroplating), the top diameter D3 of the blind hole 901 is greater than the bottom diameter D4 of the blind hole 901, and the cross-section of the blind hole 901 of the second traceability code 9 after the second electroplating is preferably funnel-shaped.

[0152] As an example, before the first copper foil layer 103 is peeled off from the adhesive layer 102, a first opening 5 is opened in the second copper foil layer 202 located on the top surface side of the carrier board 1 and the first electroplating layer 4 located on the top surface side of the carrier board 1, and a second opening 6 is opened in the second copper foil layer 202 located on the bottom surface side of the carrier board 1 and the first electroplating layer 4 located on the bottom surface side of the carrier board 1, the projection of the first opening 5 in the vertical direction is located within the projection of the first traceability code 3 on the top surface side of the carrier board 1 in the vertical direction, and the projection of the second opening 6 in the vertical direction is located within the projection of the first traceability code 3 on the bottom surface side of the carrier board 1 in the vertical direction.

[0153] As an example, after the first copper foil layer 103 located on the top side of the carrier board 1 is peeled off from the adhesive layer 102, a first coreless packaging substrate 12 is obtained, and after the first copper foil layer 103 located on the bottom side of the carrier board 1 is peeled off from the adhesive layer 102, a second coreless packaging substrate 13 is obtained. The traceability code 11 of the first coreless packaging substrate 12 passes through the first opening 5, and the traceability code 11 of the second coreless packaging substrate 13 passes through the second opening 6. The first opening 5 and the second opening 6 can reduce the number of inner copper foil layers and electroplating layers that need to be photoetched when laser engraving the traceability through hole, thereby improving the efficiency of laser engraving of the traceability through hole.

[0154] Please see again Fig.14 , executing step S8: laser engraving a traceability code 11 in the coreless packaging substrate, the traceability code 11 comprising a plurality of through holes 1101 penetrating the coreless packaging substrate.

[0155] As an example, the process of transcribing the second traceability code 9 into the traceability code 11 is the same as the process of transcribing the first traceability code 3 into the second traceability code 9 .

[0156] As an example, see Fig.15 , showing a top view of a packaging substrate structure that can be traced throughout the entire process of the present invention, wherein the first traceability code 3 is located in the peripheral area 14 of the first composite layer 2, the second traceability code 9 is located in the peripheral area 14 of the second composite layer 7, and the traceability code 11 is located in the peripheral area 14 of the coreless packaging substrate 13, and the projections of the first traceability code 3, the second traceability code 9 and the traceability code 11 in the vertical direction do not overlap with each other, and the area where the first traceability code 3, the second traceability code 9 and the traceability code 11 are located is a coding area 15, and the coding area 15 is located at any board edge of the coreless packaging substrate.

[0157] As an example, see Fig.16 , displayed as Fig.15Schematic diagram of the enlarged structure of the middle C area, half of the length L1 of the coding area 15 does not exceed 150mm, that is, the distance between the outermost boundary of the first traceability code 3, the second traceability code 9 and the traceability code 11 projected in the vertical direction and the center line P of the coreless packaging substrate does not exceed 150mm, and the distance L2 between the coding area 15 and the edge of the coreless packaging substrate is not less than 0.65mm, that is, the distance between the outermost boundary of the first traceability code 3, the second traceability code 9 and the traceability code 11 projected in the vertical direction and any side of the coreless packaging substrate is not less than 0.65mm.

[0158] As an example, see Fig.17 , showing a schematic diagram of a pressed structure before splitting in another embodiment of the method for preparing a fully traceable packaging substrate of the present invention, before peeling the first copper foil layer 103 from the adhesion layer 102, it also includes a step of forming a third composite layer 16 covering the second electroplating layer 10, and a third traceability code 17 is provided in the peripheral area of ​​the third composite layer 16, and a spacing L3 between the first traceability code 3 and the second traceability code 9 is not less than 0.8 mm, a spacing L4 between the second traceability code 9 and the third traceability code 17 is not less than 0.8 mm, and a spacing L5 between the first traceability code 3 and the third traceability code 17 is not less than 0.1 mm (i.e., the spacing between traceability codes of adjacent layers is not less than 0.8 mm, and the spacing between traceability codes of non-adjacent layers is not less than 0.1 mm), so as to avoid mutual interference between traceability codes of different layers when transcoding using X-rays.

[0159] The present invention also provides a packaging substrate that can be traced throughout the entire process. Fig.18 , which is a schematic diagram of the structure of the packaging substrate. The packaging substrate that can be traced throughout the entire process includes a first copper foil layer 103, a first composite layer 2, a first traceability code 3, a first electroplating layer 4, a second composite layer 7, a second traceability code 9 and a traceability code 11, wherein the first composite layer 2 is located on one side of the first copper foil layer 103, the first traceability code 3 is located in the first composite layer 2, the first traceability code 3 includes a plurality of blind holes 301 that do not completely penetrate the first copper foil layer 103, the first electroplating layer 4 is located on a side of the first composite layer 2 away from the first copper foil layer 103, the second composite layer 7 is located on a side of the first electroplating layer 4 away from the first composite layer 2, the second traceability code 9 is at least located in the second composite layer 7, the second traceability code 9 includes a plurality of blind holes 901 that do not completely penetrate the first copper foil layer 103, and the traceability code 11 includes a plurality of through holes 1101 that penetrate the first copper foil layer 103, the first composite layer 2, the first electroplating layer 4 and the second composite layer 7.

[0160] In some embodiments, the projections of the first traceability code 3, the second traceability code 9 and the traceability code 11 in the vertical direction do not overlap each other, the spacing between the first traceability code 3 and the second traceability code 9 is not less than 0.8 mm, the diameter of the blind hole 301 is not less than 180 μm, and the depth range of the blind hole 301 is 20 to 50 μm. In some other embodiments, the diameter of the blind hole 901 is not less than 180 μm, and the depth range of the blind hole 901 is 20 to 50 μm.

[0161] In some embodiments, the fully traceable packaging substrate further includes a second electroplating layer 10 located on a side of the second composite layer 7 away from the first copper foil layer 103 .

[0162] In some embodiments, the first composite layer 2 of the fully traceable packaging substrate includes a first semi-cured layer 201 and a second copper foil layer 202, the first semi-cured layer 201 is located on one side of the first copper foil layer 103, the second copper foil layer 202 is located on the side of the first semi-cured layer 201 away from the first copper foil layer 103, a first opening 5 is opened in the first electroplating layer 4 and the second copper foil layer 202, and the traceability code 11 passes through the first opening 5.

[0163] As an example, the packaging substrate with full process traceability can be manufactured using the above-mentioned manufacturing method or other suitable methods.

[0164] In summary, the preparation method of a packaging substrate that can be traced throughout the entire process of the present invention includes: providing a carrier board including a core layer and two first copper foil layers and an adhesive layer, forming a first composite layer on a side of the first copper foil layer away from the core layer to obtain a primary lamination structure, laser engraving a first traceability code on the top and bottom surfaces of the primary lamination structure to form a first electroplating layer, forming a second composite layer covering the first electroplating layer to obtain a secondary lamination structure, laser engraving a second traceability code on the top and bottom surfaces of the secondary lamination structure, peeling the first copper foil from the adhesive layer, removing the core layer to form a coreless packaging substrate, laser engraving a traceability code in the coreless packaging substrate, wherein the first copper foil layer is located on the top and bottom surfaces of the core layer, the adhesive layer is located between the first copper foil layer and the core layer, the first traceability code and the second traceability code include multiple blind holes that do not completely penetrate the first copper foil layer, and the traceability code includes multiple through holes. The preparation method of the packaging substrate with full process traceability of the present invention can avoid the problems of damage to the traceability code of the coreless packaging substrate during the splitting operation, exposure of the substrate, and influence on the material layer and product traceability, thereby realizing stable traceability of the whole process of the coreless packaging substrate, improving the quality of the product and meeting the needs of customers. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0165] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A method for preparing a packaging substrate with full process traceability, characterized in that: The following steps are involved: A carrier board is provided, the carrier board comprising a core layer, a first copper foil layer is disposed on the top and bottom surfaces of the core layer, and an adhesive layer is disposed between the first copper foil layer and the core layer; forming a first composite layer on a side of the first copper foil layer away from the core layer to obtain a primary lamination structure; Laser engraving a first traceability code on the top surface and the bottom surface of the one-time pressing structure, wherein the first traceability code includes a plurality of blind holes that do not completely penetrate the first copper foil layer; Performing a first electroplating to form a first electroplating layer on a side of the first composite layer away from the core layer; forming a second composite layer covering the first electroplating layer, wherein the first traceability code is covered by the second composite layer, thereby obtaining a secondary lamination structure; Laser engraving a second traceability code on the top surface and the bottom surface of the secondary lamination structure, wherein the second traceability code includes a plurality of blind holes that do not completely penetrate the first copper foil layer; Peeling the first copper foil layer off the adhesive layer to obtain two coreless packaging substrates; A traceability code is laser engraved in the coreless package substrate, wherein the traceability code includes a plurality of through holes penetrating the coreless package substrate.

2. The method for preparing a packaging substrate with full process traceability according to claim 1, characterized in that: The first composite layer includes a first semi-cured layer and a second copper foil layer, and the steps of forming the first composite layer include: placing a first semi-cured layer on a side of the first copper foil layer away from the core layer; placing a second copper foil layer on a side of the first semi-cured layer away from the core layer; Press fit.

3. The method for preparing a packaging substrate with full process traceability according to claim 2, characterized in that: The second composite layer includes a second semi-cured layer and a third copper foil layer, and the steps of forming the second composite layer include: placing a second semi-cured layer on a side of the first electroplated layer away from the core layer; placing a third copper foil layer on a side of the second semi-cured layer away from the core layer; Press fit.

4. The method for preparing a packaging substrate with full process traceability according to claim 2, characterized in that: Before peeling the first copper foil layer from the adhesive layer, a first opening is opened in the second copper foil layer located on the top surface side of the carrier board and the first electroplating layer located on the top surface side of the carrier board, and a second opening is opened in the second copper foil layer located on the bottom surface side of the carrier board and the first electroplating layer located on the bottom surface side of the carrier board, the projection of the first opening in the vertical direction is located within the projection of the first traceability code on the top surface side of the carrier board in the vertical direction, and the projection of the second opening in the vertical direction is located within the projection of the first traceability code on the bottom surface side of the carrier board in the vertical direction.

5. The method for preparing a packaging substrate with full process traceability according to claim 4, characterized in that: After peeling off the first copper foil layer located on the top side of the carrier board from the adhesive layer, a first coreless packaging substrate is obtained, and after peeling off the first copper foil layer located on the bottom side of the carrier board from the adhesive layer, a second coreless packaging substrate is obtained, the traceability code of the first coreless packaging substrate passes through the first opening, and the traceability code of the second coreless packaging substrate passes through the second opening.

6. The method for preparing a packaging substrate with full process traceability according to claim 1, characterized in that: The diameter of the blind hole is not less than 180 μm, and the depth of the blind hole is in the range of 20 to 50 μm.

7. The method for preparing a packaging substrate with full process traceability according to claim 1, characterized in that: Before peeling the first copper foil layer from the adhesive layer, the method further includes forming a second electroplating layer on a side of the second composite layer away from the core layer.

8. The method for preparing a packaging substrate with full process traceability according to claim 1, characterized in that: The step of laser engraving the second traceability code includes: irradiating the first traceability code with X-rays to obtain an X-ray image of the first traceability code; Reading information of the first traceability code based on the X-ray image; Laser engraving is performed to transcribe the information of the first traceability code into the second traceability code.

9. The method for preparing a packaging substrate with full process traceability according to claim 1, characterized in that: The distances between the outermost boundaries of the first traceability code, the second traceability code and the traceability code in the vertical direction and the center line of the coreless packaging substrate are not more than 150 mm, and the distances between the outermost boundaries of the first traceability code, the second traceability code and the traceability code in the vertical direction and any side of the coreless packaging substrate are not less than 0.65 mm.

10. The method for preparing a packaging substrate with full process traceability according to claim 1, characterized in that: The first traceability code is located in the peripheral area of ​​the first composite layer, the second traceability code is located in the peripheral area of ​​the second composite layer, the traceability pass code is located in the peripheral area of ​​the coreless packaging substrate, and the projections of the first traceability code, the second traceability code and the traceability pass code in the vertical direction do not overlap with each other.

11. The method for preparing a packaging substrate with full process traceability according to claim 1, characterized in that: Before peeling the first copper foil layer from the adhesion layer, the method further includes forming a third composite layer covering the second electroplated layer, wherein a third traceability code is provided in the peripheral area of ​​the third composite layer, and a distance between the first traceability code and the second traceability code is not less than 0.8 mm, a distance between the second traceability code and the third traceability code is not less than 0.8 mm, and a distance between the first traceability code and the third traceability code is not less than 0.1 mm.

12. A packaging substrate with full process traceability, characterized in that: include: First copper foil layer; A first composite layer, located on one side of the first copper foil layer; A first traceability code is located in the first composite layer, wherein the first traceability code includes a plurality of blind holes that do not completely penetrate the first copper foil layer; A first electroplating layer is located on a side of the first composite layer away from the first copper foil layer; a second composite layer, located on a side of the first electroplated layer away from the first composite layer; A second traceability code is located at least in the second composite layer, and the second traceability code includes a plurality of blind holes that do not completely penetrate the first copper foil layer; The traceability through code includes a plurality of through holes penetrating the first copper foil layer, the first composite layer, the first electroplating layer and the second composite layer. Wherein, the preparation process of the packaging substrate that can be traced throughout the entire process adopts the preparation method of the packaging substrate that can be traced throughout the entire process as described in any one of claims 1 to 11.

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