Process chamber pressure control method, device and equipment and storage medium

Abstract

The embodiment of the invention provides a pressure control method and device for a process chamber and a storage medium, and the method comprises the steps: carrying out the uniform-speed pressure reduction under the condition that the pressure value of the process chamber is in a first interval of a target pressure interval, and carrying out the uniform-speed pressure reduction under the condition that the pressure value of the process chamber is in a second interval of the target pressure interval, and when the pressure value of the process chamber is in the first interval of the target pressure interval, the step of reducing the pressure at the constant speed is carried out until the pressure value of the process chamber enters the next target pressure interval, and when the pressure value of the process chamber reaches the target pressure value, the step of reducing the pressure at the constant speed is returned. Therefore, under the condition that the wafer in the process chamber does not deviate greatly, the pressure reduction rate is greatly improved, and the production efficiency is further improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment technology, and in particular to a pressure control method for a process chamber, a semiconductor process equipment and a computer-readable storage medium. Background Art

[0002] Currently, in the process of using the epitaxial chamber, it is necessary to increase and decrease the pressure. During the pressure reduction process, it is necessary to consider the effect of the pressure reduction rate on the wafer displacement. In order to ensure that the wafer in the epitaxial chamber does not shift significantly during the pressure reduction process, the related technology uses a constant lower rate to reduce the pressure. Although this method can ensure that the wafer in the epitaxial chamber does not shift significantly, it takes a long time to reduce the pressure to the final pressure, which seriously affects the production efficiency. Summary of the invention

[0003] In view of the above problems, embodiments of the present invention are proposed to provide a process chamber pressure control method, a process chamber pressure control device, a semiconductor process equipment and a computer-readable storage medium that overcome the above problems or at least partially solve the above problems.

[0004] In order to solve the above problems, an embodiment of the present invention discloses a pressure control method for a process chamber, the method comprising:

[0005] When the pressure value of the process chamber is within a first interval of the target pressure interval, performing a uniform pressure reduction;

[0006] When the pressure value of the process chamber is in the second interval of the target pressure interval, the pressure is reduced at a uniform speed until the pressure value of the process chamber enters the next target pressure interval, and the process returns to the step of reducing the pressure at a uniform speed when the pressure value of the process chamber is in the first interval of the target pressure interval;

[0007] When the pressure value of the process chamber reaches the target pressure value, the pressure reduction is stopped.

[0008] Optionally, the method further comprises:

[0009] When the process chamber starts to be depressurized, a target depressurization rate is determined, and the pressure is uniformly accelerated according to a first preset depressurization acceleration until the depressurization rate reaches the target depressurization rate, so that the pressure value of the process chamber is in a first interval of the initial pressure interval;

[0010] When the pressure value of the process chamber is in a first interval of the initial pressure interval, uniformly reducing the pressure according to the target pressure reduction rate until the pressure value of the process chamber enters a second interval of the initial pressure interval;

[0011] When the pressure value of the process chamber is in the second interval of the initial pressure interval, the pressure is reduced at a uniform speed until the pressure value of the process chamber enters the target pressure interval.

[0012] Optionally, determining the target pressure reduction rate includes:

[0013] Obtaining a reference depressurization rate in a process recipe;

[0014] Obtaining an upper limit value of a pressure reduction rate corresponding to a pressure interval in which a pressure value of the process chamber is located;

[0015] Determine whether the reference pressure reduction rate is less than or equal to the pressure reduction rate upper limit;

[0016] If the reference pressure reduction rate is less than or equal to the pressure reduction rate upper limit, the reference pressure reduction rate is determined as the target pressure reduction rate;

[0017] If the reference pressure reduction rate is greater than the pressure reduction rate upper limit, the pressure reduction rate upper limit is determined as the target pressure reduction rate.

[0018] Optionally, the second interval of the target pressure interval is determined according to the following method:

[0019] Obtaining a pressure reduction rate upper limit value, a pressure reduction rate lower limit value, a second preset pressure reduction acceleration value, and a pressure lower limit value corresponding to a target pressure interval in which the pressure value of the process chamber is located;

[0020] Determine a uniform deceleration pressure reduction starting pressure value corresponding to a target pressure interval in which the pressure value of the process chamber is located according to the pressure reduction rate upper limit value, the pressure reduction rate lower limit value, the second preset pressure reduction acceleration value, and the pressure lower limit value;

[0021] The uniform speed pressure reduction starting pressure value is used as the upper limit value of the second interval, and the pressure lower limit value is used as the lower limit value of the second interval.

[0022] Optionally, determining the uniform deceleration pressure reduction starting pressure value corresponding to the target pressure interval in which the pressure value of the process chamber is located according to the pressure reduction rate upper limit value, the pressure reduction rate lower limit value, the second preset pressure reduction acceleration value and the pressure lower limit value includes:

[0023] The pressure value required for uniform deceleration and pressure reduction is calculated according to the target pressure reduction rate, the pressure reduction rate lower limit and the second preset pressure reduction acceleration;

[0024] The starting pressure value of the uniform deceleration and pressure reduction corresponding to the target pressure interval in which the pressure value of the process chamber is located is calculated according to the pressure value for which uniform deceleration and pressure reduction are required and the lower pressure limit.

[0025] Optionally, the second preset depressurization acceleration is less than or equal to a preset value, and the preset value is calculated based on a starting pressure value, a pressure lower limit value, a depressurization rate upper limit value and a depressurization rate lower limit value corresponding to a pressure interval in which the pressure value of the process chamber is located.

[0026] Optionally, the pressure reduction rate upper limit and the pressure reduction rate lower limit corresponding to the target pressure interval are determined in the following manner:

[0027] Setting a preset pressure range of a plurality of connected process chambers; the preset pressure range corresponds to the target pressure range;

[0028] Setting a plurality of preset pressure reduction rates for each target pressure interval;

[0029] According to the plurality of preset pressure reduction rates, when the pressure value of the process chamber is at the upper limit value of each of the target pressure intervals, the pressure is uniformly reduced according to the plurality of preset pressure reduction rates respectively, until the pressure value of the process chamber is at the lower limit value of each of the target pressure intervals, the pressure reduction is stopped, and a plurality of test results corresponding to each of the target pressure intervals are obtained;

[0030] Determining, among the plurality of test results, a target offset in which the wafer offset in the process chamber is less than a preset offset;

[0031] Determining a target preset pressure reduction rate corresponding to each target pressure interval according to the target offset;

[0032] Determine the target preset pressure reduction rate as the upper limit value of the pressure reduction rate in the target pressure interval corresponding to the target preset pressure reduction rate;

[0033] The upper limit value of the pressure reduction rate of the next target pressure interval of each target pressure interval is determined as the lower limit value of the pressure reduction rate of each target pressure interval.

[0034] Optionally, when the pressure value of the process chamber reaches the starting pressure value of the uniform deceleration pressure reduction, the pressure reduction rate of the process chamber is calculated based on the pressure value of the process chamber, the lower limit of the pressure reduction rate corresponding to the pressure interval in which the pressure value of the process chamber is located, the second preset acceleration and the lower limit of pressure.

[0035] An embodiment of the present invention discloses a pressure control device for a process chamber, the device comprising:

[0036] A first pressure reduction module, used for uniformly reducing the pressure when the pressure value of the process chamber is within a first interval of the target pressure interval;

[0037] a second pressure reduction module, configured to, when the pressure value of the process chamber is in a second interval of the target pressure interval, perform a uniform pressure reduction step until the pressure value of the process chamber enters a next target pressure interval, and return to the step of performing a uniform pressure reduction step when the pressure value of the process chamber is in the first interval of the target pressure interval;

[0038] The stop module is used to stop reducing the pressure when the pressure value of the process chamber reaches the target pressure value.

[0039] Optionally, the device further comprises:

[0040] an acceleration module, for determining a target depressurization rate when the process chamber starts to be depressurized, and uniformly accelerating the depressurization according to a first preset depressurization acceleration until the depressurization rate reaches the target depressurization rate, so that the pressure value of the process chamber is in a first interval of the initial pressure interval;

[0041] a third pressure reduction module, configured to, when the pressure value of the process chamber is in the first interval of the initial pressure interval, uniformly reduce the pressure according to the target pressure reduction rate until the pressure value of the process chamber enters the second interval of the initial pressure interval;

[0042] The fourth pressure reduction module is used to perform uniform deceleration and pressure reduction when the pressure value of the process chamber is in the second interval of the initial pressure interval, until the pressure value of the process chamber enters the target pressure interval.

[0043] Optionally, the acceleration module includes:

[0044] A first acquisition submodule is used to acquire a reference depressurization rate in a process recipe;

[0045] The second acquisition submodule is used to obtain the upper limit value of the pressure reduction rate corresponding to the pressure interval in which the pressure value of the process chamber is located;

[0046] A judging submodule, used to judge whether the reference voltage reduction rate is less than or equal to the voltage reduction rate upper limit value;

[0047] A first determination submodule, configured to determine the reference pressure reduction rate as a target pressure reduction rate if the reference pressure reduction rate is less than or equal to the pressure reduction rate upper limit;

[0048] The second determination submodule is configured to determine the upper limit of the pressure reduction rate as the target pressure reduction rate if the reference pressure reduction rate is greater than the upper limit of the pressure reduction rate.

[0049] Optionally, the second interval of the target pressure interval is determined according to the following module:

[0050] an acquisition module, used for acquiring an upper limit value of a depressurization rate, a lower limit value of a depressurization rate, a second preset depressurization acceleration, and a lower limit value of pressure corresponding to a target pressure interval in which the pressure value of the process chamber is located;

[0051] A first determination module is used to determine a uniform deceleration pressure reduction starting pressure value corresponding to a target pressure interval in which the pressure value of the process chamber is located according to the pressure reduction rate upper limit value, the pressure reduction rate lower limit value, the second preset pressure reduction acceleration value, and the pressure lower limit value;

[0052] The second determining module is used to use the uniform pressure reduction starting pressure value as the upper limit value of the second interval and the pressure lower limit value as the lower limit value of the second interval.

[0053] Optionally, the first determining module includes:

[0054] A first calculation submodule is used to calculate the pressure value required for uniform deceleration and pressure reduction according to the target pressure reduction rate, the pressure reduction rate lower limit and the second preset pressure reduction acceleration;

[0055] The second calculation submodule is used to calculate a uniform deceleration pressure reduction starting pressure value corresponding to a target pressure interval of the pressure value of the process chamber according to the pressure value required for uniform deceleration pressure reduction and the pressure lower limit value.

[0056] Optionally, the second preset depressurization acceleration is less than or equal to a preset value, and the preset value is calculated based on a starting pressure value, a pressure lower limit value, a depressurization rate upper limit value and a depressurization rate lower limit value corresponding to a pressure interval in which the pressure value of the process chamber is located.

[0057] Optionally, the pressure reduction rate upper limit and the pressure reduction rate lower limit corresponding to the target pressure interval are determined by the following modules:

[0058] A first setting module, used to set a preset pressure range of a plurality of connected process chambers; the preset pressure range corresponds to the target pressure range;

[0059] A second setting module, used for setting a plurality of preset pressure reduction rates for each target pressure interval;

[0060] a test module, configured to uniformly reduce the pressure at the plurality of preset pressure reduction rates when the pressure value of the process chamber is at the upper limit of each of the target pressure intervals, respectively, until the pressure value of the process chamber is at the lower limit of each of the target pressure intervals, stop reducing the pressure, and obtain a plurality of test results corresponding to each of the target pressure intervals;

[0061] A third determination module is used to determine a target offset in which the wafer offset in the process chamber is smaller than a preset offset among the plurality of test results;

[0062] A fourth determination module, configured to determine a target preset pressure reduction rate corresponding to each of the target pressure intervals according to the target offset;

[0063] a fifth determining module, configured to determine the target preset pressure reduction rate as a pressure reduction rate upper limit value of a target pressure interval corresponding to the target preset pressure reduction rate;

[0064] The sixth determination module is used to determine the pressure reduction rate upper limit value of the next target pressure interval of each target pressure interval as the pressure reduction rate lower limit value of each target pressure interval.

[0065] Optionally, when the pressure value of the process chamber reaches the starting pressure value of the uniform deceleration pressure reduction, the pressure reduction rate of the process chamber is calculated based on the pressure value of the process chamber, the lower limit of the pressure reduction rate corresponding to the pressure interval in which the pressure value of the process chamber is located, the second preset acceleration and the lower limit of pressure.

[0066] The present invention also discloses a semiconductor process equipment, including a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the pressure control method for the process chamber as described above when executing the computer program.

[0067] The present invention also discloses a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the pressure control method for a process chamber as described above are implemented.

[0068] The embodiments of the present invention include the following advantages:

[0069] In an embodiment of the present invention, when the pressure value of the process chamber is in the first interval of the target pressure interval, uniform pressure reduction is performed; when the pressure value of the process chamber is in the second interval of the target pressure interval, uniform pressure reduction is performed until the pressure value of the process chamber enters the next target pressure interval, and the process returns to the step of uniform pressure reduction when the pressure value of the process chamber is in the first interval of the target pressure interval. When the pressure value of the process chamber reaches the target pressure value, the pressure reduction is stopped, so that different pressure reduction rates and pressure reduction methods are used in different pressure intervals during the pressure reduction process, so that when the pressure value of the process chamber is high, a higher pressure reduction rate can be used for pressure reduction, and as the pressure value of the process chamber decreases, the pressure reduction rate is gradually reduced, thereby greatly improving the pressure reduction rate and further improving production efficiency while ensuring that the wafers in the process chamber do not have a large offset. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] Figure 1 is a flow chart of steps of a pressure control method for a process chamber provided by an embodiment of the present invention;

[0071] Figure 2 It is a schematic diagram of a relationship between a pressure reduction rate and a pressure value of an industrial chamber provided by an embodiment of the present invention;

[0072] Figure 3 is a flowchart of another process chamber pressure control method provided by an embodiment of the present invention;

[0073] Figure 4 It is a schematic diagram for comparison with uniform pressure reduction provided by an embodiment of the present invention;

[0074] Figure 5 It is a structural block diagram of a pressure control device for a process chamber provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0075] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0076] In the related art, a constant lower rate is used for pressure reduction. Although this method can ensure that the wafer does not deviate significantly, it takes a long time to reduce the pressure to the final pressure, which seriously affects the production efficiency. In order to solve the above technical problems, the present invention provides a pressure control method for a process chamber in an embodiment of the present invention. When the pressure value of the process chamber is in the first interval of the target pressure interval, a uniform pressure reduction is performed. When the pressure value of the process chamber is in the second interval of the target pressure interval, a uniform deceleration pressure reduction is performed until the pressure value of the process chamber enters the next target pressure interval, and the pressure value of the process chamber is returned to the first interval of the target pressure interval. The step of uniform pressure reduction is performed. When the pressure value of the process chamber reaches the target pressure value, the pressure reduction is stopped, so that different pressure reduction rates and pressure reduction methods are used in different pressure intervals during the pressure reduction process, and then when the pressure value of the process chamber is high, a higher pressure reduction rate can be used for pressure reduction. As the pressure value of the process chamber decreases, the pressure reduction rate is gradually reduced, thereby greatly improving the pressure reduction rate while ensuring that the wafer in the process chamber does not deviate significantly, and further improving the production efficiency.

[0077] Reference Figure 1 , shows a flow chart of a pressure control method for a process chamber provided by an embodiment of the present invention, and the method may specifically include the following steps:

[0078] Step 101 , when the pressure value of the process chamber is in a first interval of the target pressure interval, the pressure is reduced at a uniform speed.

[0079] In the embodiment of the present invention, before the chamber starts to depressurize, the parameters can be configured in the machine, and the parameters include: the range of the pressure interval, the acceleration corresponding to the pressure interval, the upper limit of the depressurization rate, the lower limit of the depressurization rate, and the lower limit of the pressure, etc. That is, before the process chamber starts to depressurize, a depressurization experiment is first performed to determine the relationship between the depressurization rate and the pressure value in the process chamber. When configuring the parameters or performing the depressurization experiment, the data of the offset in the chamber wafer being less than the preset offset is recorded, and the preset offset can be 1mm.

[0080] In an embodiment of the present invention, the configured pressure interval includes a target pressure interval, and the upper limit value and the lower limit value of the pressure reduction rate corresponding to the target pressure interval can be determined in the following manner: setting a preset pressure interval of multiple connected process chambers; the preset pressure interval corresponds to the target pressure interval; setting multiple preset pressure reduction rates for each target pressure interval; according to the multiple preset pressure reduction rates, when the pressure value of the process chamber is at the upper limit value of each target pressure interval, uniform pressure reduction is performed according to the multiple preset pressure reduction rates, until the pressure value of the process chamber is at the lower limit value of each target pressure interval, the pressure reduction is stopped, and multiple test results corresponding to each target pressure interval are obtained; determining a target offset value in which the wafer offset in the process chamber is less than the preset offset value in the multiple test results; determining the target preset pressure reduction rate corresponding to each target pressure interval according to the target offset; determining the target preset pressure reduction rate as the upper limit value of the pressure reduction rate of the target pressure interval corresponding to the target preset pressure reduction rate; determining the upper limit value of the pressure reduction rate of the next target pressure interval of each target pressure interval as the lower limit value of the pressure reduction rate of each target pressure interval.

[0081] Specifically, multiple target pressure intervals may be set, for example, 600-500 Torr, 500-200 Torr, 200-100 Torr, 100-40 Torr, etc. Multiple preset depressurization rates are set for each target pressure interval, for example, preset depressurization rates of 20 Torr / s and 15 Torr / s are set for the target pressure interval of 600-500 Torr, preset depressurization rates of 13 Torr / s and 12 Torr / s are set for the target pressure interval of 500-200 Torr, etc. Then, the pressure is uniformly reduced at the preset depressurization rate until the pressure value of the process chamber is at the lower limit of each target pressure interval, and the pressure reduction is stopped to obtain multiple test results for each target pressure interval, and then a data group in which the offset in the chamber wafer is less than the preset offset is determined from the multiple test results, for example, in the target pressure interval of 600-500 Torr, the preset rate of 20 Torr / s is used for uniform depressurization, and the offset in the chamber wafer is less than the preset offset. Finally, through experiments, it can be determined that the pressure range of 600-500Torr can use 20Torr / s, the pressure range of 500-200Torr can use 13Torr / s, the pressure range of 200-100Torr can use 4Torr / s, the pressure range of 100-40Torr can use 2Torr / s, and the pressure range below 40Torr can use 1.5Torr / s. Based on the experimental data obtained, the relationship between the pressure reduction rate and the pressure value of the process chamber is obtained. Figure 2 , which is a schematic diagram showing the relationship between a pressure reduction rate and a pressure value of a process chamber provided by an embodiment of the present invention. Figure 2 The thin solid line curve in is the curve of the relationship between the pressure reduction rate and the pressure value of the process chamber obtained based on the experimental data. It should be noted that if other process chamber pressure values ​​are selected, the relationship between the pressure reduction rate and the pressure value of the process chamber can also be determined according to the experimental method of the present invention. The specific range of the process chamber pressure value selected in the specific experiment can be set according to actual needs, and the present invention does not make specific limitations here. According to the experiment, the parameter configuration table shown in Table (1) below can be obtained. Table (1) is a parameter configuration table for configuring the parameters in the machine first:

[0082]

[0083] It should be noted that the upper limit value of the pressure reduction rate of the next target pressure interval of the target pressure interval is determined as the lower limit value of the pressure reduction rate of each target pressure interval. For example: the target pressure interval is 500-200Torr, the upper limit value of the pressure reduction rate of 500-200Torr is 13Torr / s, the next target pressure interval of the target pressure interval is 200-100Torr, and the upper limit value of the pressure reduction rate of 200-100Torr is 4Torr / s, then 4Torr / s can be used as the lower limit value of the pressure reduction rate of the target pressure interval 500-200Torr.

[0084] In an embodiment of the present invention, when the pressure of the process chamber is reduced, when the pressure value of the process chamber is in the first interval of the target pressure interval, the pressure is reduced at a uniform speed. In the present invention, the target pressure interval may include a first interval and a second interval, the first interval may be a uniform pressure reduction interval, and the second interval may be a uniform deceleration pressure reduction interval. The target pressure interval is determined from a plurality of preset pressure intervals according to the pressure of the process chamber.

[0085] For example, when the target pressure range is 500-200 Torr, when the pressure value of the process chamber is at 500 Torr, this indicates that the pressure value of the process chamber is in the first range of the target pressure range. At this time, the pressure can be uniformly reduced according to the current pressure reduction rate.

[0086] In an embodiment of the present invention, the pressure control method of a process chamber may further include: when starting to reduce the pressure of the process chamber, determining a target pressure reduction rate, and performing uniformly accelerated pressure reduction according to a first preset pressure reduction acceleration until the pressure reduction rate reaches the target pressure reduction rate, so that the pressure value of the process chamber is in a first interval of the initial pressure interval; when the pressure value of the process chamber is in the first interval of the initial pressure interval, performing uniform pressure reduction according to the target pressure reduction rate until the pressure value of the process chamber enters a second interval of the initial pressure interval; when the pressure value of the process chamber is in the second interval of the initial pressure interval, performing uniformly decelerated pressure reduction until the pressure value of the process chamber enters the target pressure interval.

[0087] Specifically, when the process chamber starts to be depressurized, the pressure value of the process chamber will be in the initial pressure interval, that is, the pressure interval corresponding to the pressure value of the process chamber when the pressure reduction starts is the initial pressure interval. In the initial pressure interval, it will go through a uniform acceleration pressure reduction stage, a uniform speed pressure reduction stage and a uniform deceleration pressure reduction stage. It can also be understood that the initial pressure reduction interval includes a uniform acceleration pressure reduction interval, a first interval and a second interval. The first interval can be a uniform speed pressure reduction interval, and the second interval can be a uniform deceleration pressure reduction interval. It should be noted that in the present invention, the target pressure interval corresponding to the pressure value of the process chamber when the pressure reduction starts can be used as the initial pressure interval. For example, if the pressure value of the process chamber when the pressure reduction starts is 580Torr, then the target pressure interval corresponding to 580Torr is 600-500Torr, then the target pressure interval corresponding to 600-500Torr can be used as the initial pressure interval.

[0088] When the process chamber starts to be depressurized, uniformly accelerated depressurization is first performed according to a first preset acceleration until the pressure is reduced. When uniformly accelerated depressurization is performed, a target depressurization rate can be determined before uniformly accelerated depressurization is performed.

[0089] In one embodiment, determining a target depressurization rate may include: obtaining a reference depressurization rate in a process recipe; obtaining an upper limit value of the depressurization rate corresponding to a pressure interval in which the pressure value of the process chamber is located; determining whether the reference depressurization rate is less than or equal to the upper limit value of the depressurization rate; if the reference depressurization rate is less than or equal to the upper limit value of the depressurization rate, determining the reference depressurization rate as the target depressurization rate; if the reference depressurization rate is greater than the upper limit value of the depressurization rate, determining the upper limit value of the depressurization rate as the target depressurization rate.

[0090] For example, when the pressure starts to drop, the pressure of the process chamber is 580 Torr. From the table (1) or Figure 2 It can be known that the upper limit of the pressure reduction rate in the pressure range of 600-500Torr corresponding to 580Torr is 20Torr / s. The reference pressure reduction rate in the obtained process formula is 19Torr / s, and the determined target pressure reduction rate is 19Torr / s. If the reference pressure reduction rate in the obtained process formula is 21Torr / s, the determined target pressure reduction rate is 20Torr / s.

[0091] In the present invention, after uniformly accelerating the pressure reduction according to the first preset pressure reduction acceleration until the pressure reduction rate reaches the target pressure reduction rate, the pressure value of the process chamber will be in the first interval of the initial pressure interval, or, after uniformly accelerating the pressure reduction according to the first preset pressure reduction acceleration until the pressure reduction rate reaches the target pressure reduction rate, it is determined that the pressure value of the process chamber will be in the first interval of the initial pressure interval. That is, after uniformly accelerating the pressure reduction according to the first preset pressure reduction acceleration until the pressure reduction rate reaches the target pressure reduction rate, uniform pressure reduction begins according to the target pressure reduction rate.

[0092] In the embodiment of the present invention, when the process chamber starts to be depressurized, the pressure can be uniformly accelerated according to the first preset acceleration, such as Figure 2 The thick solid line curve in is a curve diagram of uniformly accelerated depressurization according to the first preset acceleration. That is, in the present invention, when the process chamber starts to be depressurized, it first enters the acceleration stage, and the depressurization rate corresponding to each time point can be calculated according to the initial depressurization rate and the first preset acceleration. Each moment can be determined according to the interval time. For example: the process chamber is uniformly accelerated to depressurize for 2 seconds, that is, the current depressurization time is 2 seconds. According to the interval time, it can be determined that the current time point is the second time point. Then, according to the formula V=V1+at, where V is the depressurization rate, a is the first preset depressurization acceleration, t is the time point, and V1 is the starting rate of uniformly accelerated depressurization, the depressurization rate at the second time point can be calculated, that is, the current depressurization rate. Generally, the starting rate of uniformly accelerated depressurization is 0. The present invention performs uniformly accelerated depressurization according to the first preset acceleration, avoiding the particle problem caused by the sudden change of the butterfly valve opening.

[0093] In the present invention, when starting to reduce the pressure, the pressure point at which the uniform deceleration and pressure reduction starts in the initial pressure interval can be determined first. The pressure point at which the uniform deceleration and pressure reduction starts in the initial pressure interval is the uniform deceleration and pressure reduction starting value corresponding to the initial pressure interval, that is, it is determined when the uniform deceleration and pressure reduction starts. The pressure point at which the uniform deceleration and pressure reduction starts is the upper limit value of the second interval. For example, Figure 2 △P1 in the figure is the uniform deceleration pressure reduction interval in the pressure range of 600-500Torr. In the present invention, the uniform deceleration pressure reduction starting value corresponding to the initial pressure interval can be determined by the following method:

[0094] Obtain the upper limit value of the pressure reduction rate, the lower limit value of the pressure reduction rate, the second preset pressure reduction acceleration and the lower limit value of pressure corresponding to the initial pressure interval of the pressure value of the process chamber; determine the uniform deceleration starting pressure value corresponding to the initial pressure interval of the pressure value of the process chamber according to the upper limit value of the pressure reduction rate, the lower limit value of the pressure reduction rate, the second preset pressure reduction acceleration and the lower limit value of pressure.

[0095] For example, if the initial pressure range is 600-500 Torr, then it can be seen from Table (1) that the corresponding lower limit of the pressure reduction rate is 13 Torr / s, and the second preset pressure reduction acceleration is 5 Torr / s. 2 The lower limit of pressure is 500Torr, and the upper limit of the pressure reduction rate in the initial pressure interval is the determined target pressure reduction rate.

[0096] Specifically, the pressure value required for uniform deceleration and depressurization can be calculated based on the target depressurization rate, the lower limit of the depressurization rate and the second preset depressurization acceleration, that is, Figure 2 Then add △P1 to the lower limit of pressure corresponding to the initial pressure range, i.e. 500Torr, to obtain the starting pressure value of uniform deceleration and pressure reduction corresponding to the initial pressure range.

[0097] In the present invention, the starting pressure value for uniform deceleration and pressure reduction can be calculated by the following formula (1):

[0098]

[0099] Among them, ΔP is the starting pressure value for uniform deceleration and pressure reduction in the initial pressure interval, that is, when ΔP is □P1, V n is the upper limit of the pressure reduction rate corresponding to the initial pressure interval of the process chamber pressure value, that is, the target pressure reduction rate, V n-1 A is the lower limit of the pressure reduction rate corresponding to the initial pressure interval of the process chamber pressure value, n The second preset acceleration corresponding to the initial pressure range of the process chamber pressure value. For example, if the initial pressure range is 600-500 Torr, the upper limit of the pressure reduction rate in the initial pressure range is 20 Torr / s, the lower limit of the pressure reduction rate is 13 Torr / s, and the second preset acceleration is 5 Torr / s. 2 , then the pressure value required for uniform deceleration and pressure reduction can be calculated according to formula (1) to be 23.1 Torr. Then the pressure value required for uniform deceleration and pressure reduction is added to the pressure lower limit value to obtain the uniform deceleration and pressure reduction starting pressure value corresponding to the initial pressure interval of the pressure value of the process chamber. That is, the uniform deceleration and pressure reduction starting pressure is 23.1 Torr + 500 Torr = 523.1 Torr, which also shows that the uniform deceleration and pressure reduction interval of the initial pressure interval of 600-500 Torr is 523.1-500 Torr. That is, when the process chamber pressure reaches 523.1 Torr, uniform deceleration and pressure reduction can be performed. It should be noted that the second preset pressure reduction acceleration in the present application is less than or equal to the preset value, and the preset value can be calculated based on the starting pressure value, pressure lower limit value, pressure reduction rate upper limit value and pressure reduction rate lower limit value corresponding to the pressure interval of the pressure value of the process chamber. The preset value can be calculated according to the formula Calculated, where P n+1 is the starting pressure value corresponding to the pressure interval of the process chamber pressure value; P n V is the lower limit of the pressure corresponding to the pressure interval of the process chamber pressure value; n is the upper limit of the pressure reduction rate corresponding to the pressure interval in which the pressure value of the process chamber is located; the V n-1 It is the lower limit of the pressure reduction rate corresponding to the pressure range in which the pressure value of the process chamber is located.

[0100] In the present invention, in the initial pressure range, when the pressure is reduced at a uniform speed, it is possible to continue until the pressure value of the process chamber enters the target pressure range. After the pressure value of the process chamber enters the target pressure range, the pressure value of the process chamber may be in the first range of the target pressure range. When the pressure value of the process chamber is in the first range of the pressure range, the pressure may be reduced at a uniform speed.

[0101] For example: Figure 2 As shown, 600-500 Torr is the initial pressure range. When the pressure value of the process chamber reaches 500 Torr, it enters the first range of the target pressure range of 500-200 Torr. That is, when the pressure value of the process chamber reaches 500 Torr, the pressure is uniformly reduced at a pressure reduction rate of 13 Torr / s.

[0102] Step 102, when the pressure value of the process chamber is in the second interval of the target pressure interval, the pressure is reduced at a uniform speed until the pressure value of the process chamber enters the next target pressure interval, and the pressure is returned to the first interval of the target pressure interval, and the pressure is reduced at a uniform speed.

[0103] In an embodiment of the present invention, when the pressure of the process chamber is in the first interval of the target pressure interval, the pressure will be reduced at a uniform rate until the pressure value of the process chamber is in the second interval of the target pressure interval. When the pressure value of the process chamber is in the second interval of the target pressure interval, the pressure will be reduced at a uniform rate until the pressure value of the process chamber enters the next target pressure interval. The pressure will then continue to be reduced at a uniform rate until the pressure value of the process chamber is in the second interval of the target pressure interval, and the uniform rate of pressure reduction will then begin.

[0104] For example: the initial pressure range is 600-500Torr. When the pressure value of the process chamber reaches 500Torr, the pressure value of the process chamber is in the target pressure range of 500-200Torr. At this time, the pressure starts to drop at a uniform speed until the pressure value of the process chamber is in the second range of the target pressure range of 500-200Torr. When the pressure value of the process chamber is in the second range of the target pressure range of 500-200Torr, the pressure starts to drop at a uniform speed until the pressure value of the process chamber enters the next target pressure range of 200-100Torr, that is, the pressure drops at a uniform speed to 200Torr. At this time, the pressure starts to drop at a uniform speed until the pressure value of the process chamber is in the second range of the target pressure range of 200-100Torr. When the pressure value of the process chamber is in the second range of the target pressure range of 200-100Torr, the pressure starts to drop at a uniform speed until the pressure value of the process chamber enters the next target pressure range of 100-40Torr, and the pressure drop is cyclically performed.

[0105] In an embodiment of the present invention, the second interval of the target pressure interval can be determined as follows: obtain the upper limit value of the depressurization rate, the lower limit value of the depressurization rate, the second preset depressurization acceleration and the lower limit value of pressure corresponding to the target pressure interval in which the pressure value of the process chamber is located; determine the uniform deceleration pressure reduction starting pressure value corresponding to the target pressure interval in which the pressure value of the process chamber is located according to the upper limit value of the depressurization rate, the lower limit value of the depressurization rate, the second preset depressurization acceleration and the lower limit value of pressure; use the uniform depressurization starting pressure value as the upper limit value of the second interval, and use the lower limit value of pressure as the lower limit value of the second interval.

[0106] In one embodiment, a uniform deceleration pressure reduction starting pressure value corresponding to a target pressure interval in which the pressure value of the process chamber is located is determined based on an upper limit value of the depressurization rate, a lower limit value of the depressurization rate, a second preset depressurization acceleration, and a lower limit value of pressure, including: calculating the pressure value required for uniform deceleration pressure reduction based on the target depressurization rate, the lower limit value of the depressurization rate, and the second preset depressurization acceleration; calculating the uniform deceleration pressure reduction starting pressure value corresponding to the target pressure interval in which the pressure value of the process chamber is located based on the pressure value required for uniform deceleration pressure reduction and the lower limit value of pressure.

[0107] In the present invention, the method of determining the uniform deceleration and pressure reduction starting pressure value corresponding to the target pressure interval of the pressure value of the process chamber is the same as the method of determining the uniform deceleration and pressure reduction starting pressure value corresponding to the initial pressure interval of the pressure value of the process chamber, which will not be repeated here.

[0108] It should be noted that when the pressure value required for uniform deceleration and pressure reduction is calculated for the target pressure range, it is calculated by the above formula (1). When ΔP in formula (1) is the starting pressure value required for uniform deceleration and pressure reduction in the target pressure range, that is, when ΔP is □P2, V nV is the upper limit of the pressure reduction rate corresponding to the target pressure interval of the process chamber pressure value, n-1 A is the lower limit of the pressure reduction rate corresponding to the target pressure interval of the process chamber pressure value, n The second preset acceleration corresponding to the target pressure interval in which the pressure value of the process chamber is located. After calculating the starting pressure value for uniform deceleration and pressure reduction in the target pressure interval, the starting pressure value for uniform deceleration and pressure reduction can be used as the upper limit value of the second interval of the target pressure interval, and the lower limit value of the pressure of the target pressure interval can be used as the lower limit value of the second interval.

[0109] It should be noted that the pressure value of the process chamber in the present invention can be obtained by issuing a pressure value. When the process chamber starts to be depressurized, it is first in a uniform acceleration depressurization interval. The pressure value issued in each subsequent uniform acceleration depressurization interval can be calculated based on the initial pressure value and the first preset acceleration, that is, the pressure value issued after every 1 second. Specifically, it can be calculated by the following formula (2):

[0110]

[0111] Among them, P1 is the pressure value issued in the uniform acceleration and depressurization interval, that is, the issued pressure point, P1 corresponds to each time interval, P0 is the starting pressure value, A1 is the first preset acceleration, and t is the depressurization time in the uniform acceleration and depressurization interval. For example: if the starting pressure value is 600Torr, then the first issued pressure point is: 600-(5*1 2 / 2), the second pressure point is: 600-(5*2 2 / 2), the third pressure point is: 600-(5*3 2 / 2), and so on. The corresponding pressure reduction rate of the pressure point is A1*t. When the pressure is reduced at a uniform rate, the subsequent pressure points are calculated by the following formula P2=P n -V n *t is calculated, where P2 is the pressure value issued in the uniform pressure reduction interval, that is, the pressure point issued, P n is the current pressure value of the process chamber, V n is the upper limit of the pressure reduction rate corresponding to the pressure interval of the process chamber pressure value. When the pressure interval of the process chamber pressure value is the initial pressure interval, V n is the target pressure reduction rate, and t is the pressure reduction time in the uniform pressure reduction interval.

[0112] In the present invention, when the pressure value of the process chamber reaches the starting pressure value of the uniform deceleration pressure reduction, the pressure reduction rate of the process chamber is calculated based on the pressure value of the process chamber, the lower limit of the pressure reduction rate corresponding to the pressure interval in which the pressure value of the process chamber is located, the second preset acceleration and the lower limit of pressure.

[0113] Specifically, when entering the uniform deceleration and pressure reduction interval, when the pressure is issued, the corresponding pressure reduction rate issued can be calculated according to the following formula (3):

[0114]

[0115] Where V is the pressure drop rate corresponding to the pressure point, that is, the pressure drop rate of the process chamber, V n-1 is the lower limit of the pressure reduction rate corresponding to the pressure range of the process chamber pressure value, A n is the second preset acceleration corresponding to the pressure interval of the pressure value of the process chamber, P is the pressure value of the process chamber, and P n-1 It is the lower limit of the pressure corresponding to the pressure range in which the pressure value of the process chamber is located.

[0116] For example, if the starting pressure value of the uniform deceleration pressure reduction corresponding to the pressure range of the process chamber pressure value is 523.1 Torr, and the pressure value of the process chamber is 521, then the pressure reduction rate corresponding to the pressure point to be issued needs to be calculated using formula (3), that is, the current pressure reduction rate is calculated to be 19.47 Torr / s, then the pressure value issued at the next pressure point is 521-(19.47*1-5*1 2 / 2), the pressure value issued by the next pressure point is 504.03 Torr, that is, the pressure value of the process chamber in the next second is 504.03 Torr. 504.03 Torr is greater than 500 Torr, that is, the next second is still in the uniform deceleration and pressure reduction range. It is necessary to use formula (3) to calculate the pressure reduction rate corresponding to the pressure point issued in the next second, which is calculated to be 14.46 Torr / s. The pressure value issued by the next pressure point is 492.07 Torr, which is less than 500 Torr, indicating that the next second enters the next pressure range, and the pressure is uniformly reduced at the upper limit of the pressure reduction rate in the next range, that is, according to 13 Torr / s 2 Reduce the pressure at a uniform rate.

[0117] Step 103 , when the pressure value of the process chamber reaches the target pressure value, stop reducing the pressure.

[0118] In the embodiment of the present invention, before starting to reduce the pressure of the process chamber, the target pressure value in the process recipe may be obtained first, and when the pressure value of the process chamber reaches the target pressure value, the pressure reduction is stopped.

[0119] In order to better understand the embodiments of the present invention, Figure 3 FIG. 1 is a flowchart showing another method for controlling the pressure of a process chamber provided by an embodiment of the present invention, which is specifically as follows:

[0120] According to the pressure value of the process chamber, the pressure range in which the pressure value of the process chamber is located is determined, and the configuration value corresponding to the pressure range is determined. The configuration value includes: an upper limit value of the pressure reduction rate, a lower limit value of the pressure reduction rate, a second preset pressure reduction acceleration, a lower pressure limit value, etc. Perform uniform acceleration pressure reduction according to the first preset pressure reduction acceleration, and judge whether the reference pressure reduction rate in the process formula is less than or equal to the upper limit value of the pressure reduction rate. If the reference pressure reduction rate is less than or equal to the upper limit value of the pressure reduction rate, then determine the reference pressure reduction rate in the process formula as the target pressure reduction rate. If the reference pressure reduction rate is greater than the upper limit value of the pressure reduction rate, then determine the upper limit value of the pressure reduction rate as the target pressure reduction rate. After the pressure reduction rate reaches the target pressure reduction rate, perform uniform pressure reduction according to the target pressure reduction rate, and determine the uniform deceleration pressure reduction starting pressure value corresponding to the pressure range in which the pressure value of the process chamber is located. Judge whether the pressure value of the process chamber reaches the uniform deceleration pressure reduction starting pressure value. If not, continue to perform uniform pressure reduction until the pressure value of the process chamber reaches the uniform deceleration pressure reduction starting pressure value, and perform uniform deceleration. If the pressure is lowered to the target pressure range, the pressure is lowered at a uniform speed until the pressure value of the process chamber enters the target pressure range. When the pressure value of the process chamber enters the target pressure range, the pressure is lowered at a uniform speed according to the upper limit of the pressure reduction rate corresponding to the target pressure range, and it is determined whether the pressure value of the process chamber reaches the starting pressure value of the uniformly decelerated pressure reduction. If the pressure is not lowered to the target pressure range, the pressure is lowered at a uniform speed until the pressure value of the process chamber reaches the starting pressure value of the uniformly decelerated pressure reduction, and the pressure is lowered at a uniformly decelerated speed. If the pressure is lowered to the target pressure range, the pressure is lowered at a uniformly decelerated speed until the pressure value of the process chamber enters the next target pressure range. The pressure is lowered back to the step of lowering the pressure at a uniform speed according to the upper limit of the pressure reduction rate corresponding to the target pressure range, and it is determined whether the pressure value of the process chamber reaches the starting pressure value of the uniformly decelerated pressure reduction, thereby performing cyclic segmented pressure reduction.

[0121] It should be noted that during the pressure reduction process, it is determined in real time whether the pressure value of the process chamber has reached the target pressure value. When the pressure value of the process chamber has reached the target pressure value, the pressure reduction is stopped and the pressure reduction is completed.

[0122] In an embodiment of the present invention, when the pressure value of the process chamber is in the first interval of the target pressure interval, uniform pressure reduction is performed; when the pressure value of the process chamber is in the second interval of the target pressure interval, uniform pressure reduction is performed until the pressure value of the process chamber enters the next target pressure interval, and the process returns to the step of uniform pressure reduction when the pressure value of the process chamber is in the first interval of the target pressure interval. When the pressure value of the process chamber reaches the target pressure value, the pressure reduction is stopped, so that different pressure reduction rates and pressure reduction methods are used in different pressure intervals during the pressure reduction process, so that when the pressure value of the process chamber is high, a higher pressure reduction rate can be used for pressure reduction, and as the pressure value of the process chamber decreases, the pressure reduction rate is gradually reduced, thereby greatly improving the pressure reduction rate and further improving production efficiency while ensuring that the wafers in the process chamber do not have a large offset.

[0123] like Figure 4 As shown, a schematic diagram for comparison with uniform pressure reduction provided by an embodiment of the present invention is shown, wherein the solid line is a method of segmented pressure reduction using the present invention, and the dotted line is a method of uniform pressure reduction, the pressure reduction rate of the uniform pressure reduction is 1.5 Torr / s, the offset of the wafer in the uniform pressure reduction method is 0.3-0.7mm, and it takes a total of 397.4s to reduce the pressure from 600Torr to 10Torr. Using the pressure reduction method of the present invention, it takes a total of 135.2.4s to reduce the pressure from 600Torr to 10Torr, and the offset of the wafer is 0.2-0.7mm. It can be seen that the pressure reduction rate of the pressure reduction method of the present invention is greatly improved, and the pressure reduction time is significantly shortened, which can greatly improve the production capacity of the machine.

[0124] It should be noted that, for the sake of simplicity, the method embodiments are described as a series of action combinations, but those skilled in the art should be aware that the embodiments of the present invention are not limited by the order of the actions described, because according to the embodiments of the present invention, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of the present invention.

[0125] Reference Figure 5 , shows a structural block diagram of a pressure control device for a process chamber provided by an embodiment of the present invention, which may specifically include the following modules:

[0126] A first pressure reduction module 501, configured to reduce the pressure at a uniform speed when the pressure value of the process chamber is within a first interval of the target pressure interval;

[0127] A second pressure reduction module 502 is used for, when the pressure value of the process chamber is in the second interval of the target pressure interval, performing a uniform pressure reduction step until the pressure value of the process chamber enters the next target pressure interval, and returning to the step of performing a uniform pressure reduction step when the pressure value of the process chamber is in the first interval of the target pressure interval;

[0128] The stop module 503 is used to stop reducing the pressure when the pressure value of the process chamber reaches the target pressure value.

[0129] Optionally, the device further comprises:

[0130] an acceleration module, for determining a target depressurization rate when the process chamber starts to be depressurized, and uniformly accelerating the depressurization according to a first preset depressurization acceleration until the depressurization rate reaches the target depressurization rate, so that the pressure value of the process chamber is in a first interval of the initial pressure interval;

[0131] a third pressure reduction module, configured to, when the pressure value of the process chamber is in the first interval of the initial pressure interval, uniformly reduce the pressure according to the target pressure reduction rate until the pressure value of the process chamber enters the second interval of the initial pressure interval;

[0132] The fourth pressure reduction module is used to perform uniform deceleration and pressure reduction when the pressure value of the process chamber is in the second interval of the initial pressure interval, until the pressure value of the process chamber enters the target pressure interval.

[0133] Optionally, the acceleration module includes:

[0134] A first acquisition submodule is used to acquire a reference depressurization rate in a process recipe;

[0135] The second acquisition submodule is used to obtain the upper limit value of the pressure reduction rate corresponding to the pressure interval in which the pressure value of the process chamber is located;

[0136] A judging submodule, used to judge whether the reference voltage reduction rate is less than or equal to the voltage reduction rate upper limit value;

[0137] A first determination submodule, configured to determine the reference pressure reduction rate as a target pressure reduction rate if the reference pressure reduction rate is less than or equal to the pressure reduction rate upper limit;

[0138] The second determination submodule is configured to determine the upper limit of the pressure reduction rate as the target pressure reduction rate if the reference pressure reduction rate is greater than the upper limit of the pressure reduction rate.

[0139] Optionally, the second interval of the target pressure interval is determined according to the following module:

[0140] an acquisition module, used for acquiring an upper limit value of a depressurization rate, a lower limit value of a depressurization rate, a second preset depressurization acceleration, and a lower limit value of pressure corresponding to a target pressure interval in which the pressure value of the process chamber is located;

[0141] A first determination module is used to determine a uniform deceleration pressure reduction starting pressure value corresponding to a target pressure interval in which the pressure value of the process chamber is located according to the pressure reduction rate upper limit value, the pressure reduction rate lower limit value, the second preset pressure reduction acceleration value, and the pressure lower limit value;

[0142] The second determining module is used to use the uniform pressure reduction starting pressure value as the upper limit value of the second interval and the pressure lower limit value as the lower limit value of the second interval.

[0143] Optionally, the first determining module includes:

[0144] A first calculation submodule is used to calculate the pressure value required for uniform deceleration and pressure reduction according to the target pressure reduction rate, the pressure reduction rate lower limit and the second preset pressure reduction acceleration;

[0145] The second calculation submodule is used to calculate a uniform deceleration pressure reduction starting pressure value corresponding to a target pressure interval of the pressure value of the process chamber according to the pressure value required for uniform deceleration pressure reduction and the pressure lower limit value.

[0146] Optionally, the second preset depressurization acceleration is less than or equal to a preset value, and the preset value is calculated based on a starting pressure value, a pressure lower limit value, a depressurization rate upper limit value and a depressurization rate lower limit value corresponding to a pressure interval in which the pressure value of the process chamber is located.

[0147] Optionally, the pressure reduction rate upper limit and the pressure reduction rate lower limit corresponding to the target pressure interval are determined by the following modules:

[0148] A first setting module, used to set a preset pressure range of a plurality of connected process chambers; the preset pressure range corresponds to the target pressure range;

[0149] A second setting module, used for setting a plurality of preset pressure reduction rates for each target pressure interval;

[0150] a test module, configured to uniformly reduce the pressure at the plurality of preset pressure reduction rates when the pressure value of the process chamber is at the upper limit of each of the target pressure intervals, respectively, until the pressure value of the process chamber is at the lower limit of each of the target pressure intervals, stop reducing the pressure, and obtain a plurality of test results corresponding to each of the target pressure intervals;

[0151] A third determination module is used to determine a target offset in which the wafer offset in the process chamber is smaller than a preset offset among the plurality of test results;

[0152] A fourth determination module, configured to determine a target preset pressure reduction rate corresponding to each of the target pressure intervals according to the target offset;

[0153] a fifth determining module, configured to determine the target preset pressure reduction rate as a pressure reduction rate upper limit value of a target pressure interval corresponding to the target preset pressure reduction rate;

[0154] The sixth determination module is used to determine the pressure reduction rate upper limit value of the next target pressure interval of each target pressure interval as the pressure reduction rate lower limit value of each target pressure interval.

[0155] Optionally, when the pressure value of the process chamber reaches the starting pressure value of the uniform deceleration pressure reduction, the pressure reduction rate of the process chamber is calculated based on the pressure value of the process chamber, the lower limit of the pressure reduction rate corresponding to the pressure interval in which the pressure value of the process chamber is located, the second preset acceleration and the lower limit of pressure.

[0156] In an embodiment of the present invention, the first depressurization module is used to perform uniform depressurization when the pressure value of the process chamber is in the first interval of the target pressure interval; the second depressurization module is used to perform uniform depressurization when the pressure value of the process chamber is in the second interval of the target pressure interval until the pressure value of the process chamber enters the next target pressure interval, and returns to the step of performing uniform depressurization when the pressure value of the process chamber is in the first interval of the target pressure interval; the stop module is used to stop depressurization when the pressure value of the process chamber reaches the target pressure value. In this way, different depressurization rates and depressurization methods are used in different pressure intervals during the depressurization process, so that when the pressure value of the process chamber is high, a higher depressurization rate can be used for depressurization, and as the pressure value of the process chamber decreases, the depressurization rate is gradually reduced, thereby greatly improving the depressurization rate and further improving production efficiency while ensuring that the wafers in the process chamber do not have a large offset.

[0157] As for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0158] An embodiment of the present invention further provides a semiconductor process equipment, including:

[0159] It includes a processor, a memory, and a computer program stored in the memory and capable of running on the processor. When the computer program is executed by the processor, each process of the pressure control method embodiment of the above-mentioned process chamber is implemented, and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0160] An embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the various processes of the pressure control method embodiment of the above-mentioned process chamber are implemented, and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0161] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0162] It will be appreciated by those skilled in the art that the embodiments of the present invention may be provided as methods, devices, or computer program products. Therefore, the embodiments of the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the embodiments of the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0163] The embodiments of the present invention are described with reference to the flowcharts and / or block diagrams of the methods, terminal devices (systems), and computer program products according to the embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0164] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0165] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process, thereby providing instructions for executing on the computer or other programmable terminal device to implement the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0166] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0167] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0168] The pressure control method for a process chamber, a semiconductor process equipment and a computer-readable storage medium provided by the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A pressure control method for a process chamber, characterized in that: The method comprises: When the pressure value of the process chamber is within a first interval of the target pressure interval, performing a uniform pressure reduction; When the pressure value of the process chamber is in the second interval of the target pressure interval, the pressure is reduced at a uniform speed until the pressure value of the process chamber enters the next target pressure interval, and the process returns to the step of reducing the pressure at a uniform speed when the pressure value of the process chamber is in the first interval of the target pressure interval; When the pressure value of the process chamber reaches the target pressure value, the pressure reduction is stopped.

2. The pressure control method of a process chamber according to claim 1, characterized in that: The method further comprises: When the process chamber starts to be depressurized, a target depressurization rate is determined, and the pressure is uniformly accelerated according to a first preset depressurization acceleration until the depressurization rate reaches the target depressurization rate, so that the pressure value of the process chamber is in a first interval of the initial pressure interval; When the pressure value of the process chamber is in a first interval of the initial pressure interval, uniformly reducing the pressure according to the target pressure reduction rate until the pressure value of the process chamber enters a second interval of the initial pressure interval; When the pressure value of the process chamber is in the second interval of the initial pressure interval, the pressure is reduced at a uniform speed until the pressure value of the process chamber enters the target pressure interval.

3. The pressure control method of a process chamber according to claim 2, characterized in that: Determining the target pressure reduction rate includes: Obtaining a reference depressurization rate in a process recipe; Obtaining an upper limit value of a pressure reduction rate corresponding to a pressure interval in which a pressure value of the process chamber is located; Determine whether the reference pressure reduction rate is less than or equal to the pressure reduction rate upper limit; If the reference pressure reduction rate is less than or equal to the pressure reduction rate upper limit, the reference pressure reduction rate is determined as the target pressure reduction rate; If the reference pressure reduction rate is greater than the pressure reduction rate upper limit, the pressure reduction rate upper limit is determined as the target pressure reduction rate.

4. The pressure control method of a process chamber according to claim 1, characterized in that: The second interval of the target pressure interval is determined according to the following method: Obtaining a pressure reduction rate upper limit value, a pressure reduction rate lower limit value, a second preset pressure reduction acceleration value, and a pressure lower limit value corresponding to a target pressure interval in which the pressure value of the process chamber is located; Determine a uniform deceleration pressure reduction starting pressure value corresponding to a target pressure interval in which the pressure value of the process chamber is located according to the pressure reduction rate upper limit value, the pressure reduction rate lower limit value, the second preset pressure reduction acceleration value, and the pressure lower limit value; The uniform speed pressure reduction starting pressure value is used as the upper limit value of the second interval, and the pressure lower limit value is used as the lower limit value of the second interval.

5. The pressure control method of a process chamber according to claim 4, characterized in that: The step of determining a uniform deceleration pressure reduction starting pressure value corresponding to a target pressure interval in which the pressure value of the process chamber is located according to the pressure reduction rate upper limit value, the pressure reduction rate lower limit value, the second preset pressure reduction acceleration value, and the pressure lower limit value comprises: The pressure value required for uniform deceleration and pressure reduction is calculated according to the target pressure reduction rate, the pressure reduction rate lower limit and the second preset pressure reduction acceleration; The starting pressure value of the uniform deceleration and pressure reduction corresponding to the target pressure interval in which the pressure value of the process chamber is located is calculated according to the pressure value for which uniform deceleration and pressure reduction are required and the lower pressure limit.

6. The pressure control method of a process chamber according to claim 1, characterized in that: The second preset depressurization acceleration is less than or equal to a preset value, and the preset value is calculated based on a starting pressure value, a pressure lower limit value, a depressurization rate upper limit value, and a depressurization rate lower limit value corresponding to a pressure interval in which the pressure value of the process chamber is located.

7. The pressure control method of a process chamber according to claim 4, characterized in that: The pressure reduction rate upper limit and the pressure reduction rate lower limit corresponding to the target pressure interval are determined in the following manner: Setting a preset pressure range for a plurality of connected process chambers; the preset pressure range corresponds to the target pressure range; Setting a plurality of preset pressure reduction rates for each target pressure interval; According to the plurality of preset pressure reduction rates, when the pressure value of the process chamber is at the upper limit value of each of the target pressure intervals, the pressure is uniformly reduced according to the plurality of preset pressure reduction rates respectively, until the pressure value of the process chamber is at the lower limit value of each of the target pressure intervals, the pressure reduction is stopped, and a plurality of test results corresponding to each of the target pressure intervals are obtained; Determining, among the plurality of test results, a target offset in which the wafer offset in the process chamber is less than a preset offset; Determining a target preset pressure reduction rate corresponding to each target pressure interval according to the target offset; Determine the target preset pressure reduction rate as the upper limit value of the pressure reduction rate in the target pressure interval corresponding to the target preset pressure reduction rate; The upper limit value of the pressure reduction rate of the next target pressure interval of each target pressure interval is determined as the lower limit value of the pressure reduction rate of each target pressure interval.

8. The pressure control method of a process chamber according to claim 5, characterized in that: When the pressure value of the process chamber reaches the starting pressure value of the uniform deceleration pressure reduction, the pressure reduction rate of the process chamber is calculated based on the pressure value of the process chamber, the lower limit of the pressure reduction rate corresponding to the pressure interval in which the pressure value of the process chamber is located, the second preset acceleration and the lower limit of pressure.

9. A semiconductor process equipment, characterized in that: include: A processor, a memory, and a computer program stored in the memory and capable of running on the processor, wherein when the computer program is executed by the processor, the steps of the pressure control method for a process chamber as described in any one of claims 1 to 8 are implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the pressure control method for a process chamber according to any one of claims 1 to 8 are implemented.

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