Method for carrying semiconductor chip

Abstract

The invention discloses a method for bearing a semiconductor chip, which comprises the following steps of: firstly, providing a heat-sensitive adhesive tape, cutting the heat-sensitive adhesive tape into a plurality of adhesive tape sections with the width of 7.5-8.5 mm so as to avoid the problem that bubbles are easy to generate due to the over-wide adhesive tape, and then, adhering the plurality of adhesive tape sections on a tray, according to the utility model, the plurality of adhesive tape segments are arranged on the tray, and the plurality of semiconductor chips are bonded on the plurality of adhesive tape segments, so that the plurality of semiconductor chips can be bonded on the tray through the plurality of adhesive tape segments, and the problem of deformation of the semiconductor chips caused by operations such as mechanical screw fixation in the prior art is avoided; when the semiconductor chip is taken down from the tray, the adhesive tape is heated to 110-125 DEG C in a segmented mode, the semiconductor chip can be taken down easily, the problem of defective products caused by warping is reduced, and compared with operation such as mechanical screw fixing in the prior art, the production efficiency is greatly improved. The loading and unloading of the entire semiconductor chip reduces surface contamination and damage to the semiconductor chip.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a method for carrying a semiconductor chip. Background Art

[0002] At present, semiconductor components usually need to be carried on a smooth tray during processing. Usually, the edges are fixed with clips and screws, but this method can cause damage and contamination to the edges of the semiconductor chips during loading and unloading, and even cause deformation of the surface of the semiconductor chips. Summary of the invention

[0003] In view of the deficiencies in the prior art, an embodiment of the present invention provides a method for carrying a semiconductor chip, comprising:

[0004] Provide thermal tape;

[0005] Cutting the thermal tape into a plurality of tape segments; wherein the width of the tape segments is 7.5-8.5 mm;

[0006] Pasting a plurality of the adhesive tapes on the pallet in sections;

[0007] A plurality of semiconductor chips are bonded to the plurality of tape segments, wherein the tape segments are heated to 110-125° C. when the semiconductor chips are removed from the tray.

[0008] As a preferred solution, the number of the semiconductor chips is greater than the number of the tape segments.

[0009] As a preferred solution, when the semiconductor chip is removed from the tray, the tape is heated to 120° C. in sections.

[0010] As a preferred solution, when the semiconductor chip is removed from the tray, the heating time of the tape segment is 18-22 minutes.

[0011] As a preferred solution, when the semiconductor chip is removed from the tray, the heating time of the tape segment is 20 minutes.

[0012] As a preferred solution, before bonding the plurality of semiconductor chips to the plurality of tape segments, the method further comprises:

[0013] Provide an intermediate network;

[0014] Covering the intermediate net on the tray with the plurality of tape segments attached thereto; wherein the maximum length of the mesh of the intermediate net is smaller than the minimum length of the semiconductor chip;

[0015] The step of removing the semiconductor chip from the tray comprises:

[0016] After the adhesive tape has been heated in sections to 110-125° C., all semiconductor chips are removed through the intermediate web.

[0017] As a preferred solution, the middle net is composed of a plurality of mesh wires, and the diameter of the mesh wires is 0.08-0.3 mm.

[0018] As a preferred solution, each mesh of the intermediate net is equal and square.

[0019] As a preferred solution, the middle net is a stainless steel net or a nylon net.

[0020] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows: the embodiments of the present invention provide a method for carrying semiconductor chips, first, providing a thermal tape, and cutting the thermal tape into a plurality of tape segments, wherein the width of the tape segments is 7.5-8.5 mm, so as to avoid the problem of bubbles easily generated by too wide tape, and then, pasting the plurality of tape segments on a tray, and bonding a plurality of semiconductor chips to the plurality of tape segments, so that a plurality of semiconductor chips can be bonded to the tray through the plurality of tape segments, avoiding the problem of deformation of the semiconductor chip caused by operations such as fixing with mechanical screws in the prior art; in addition, when the semiconductor chip is removed from the tray, the tape segments are heated to 110-125°C, so that the adhesiveness of the tape segments is released, so that the semiconductor chip can be easily removed, reducing the problem of defective products caused by warping, and compared with operations such as fixing with mechanical screws in the prior art, the loading and unloading of the entire semiconductor chip reduces surface contamination and damage to the semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of a method for carrying a semiconductor chip in an embodiment of the present invention. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] See also Figure 1 , which is a structural schematic diagram of a method for carrying a semiconductor chip in an embodiment of the present invention.

[0024] The method for carrying a semiconductor chip according to an embodiment of the present invention includes:

[0025] Step S101, providing a thermal tape;

[0026] Step S102, cutting the thermal tape into a plurality of tape segments; wherein the width of the tape segments is 7.5-8.5 mm;

[0027] Step S103, pasting a plurality of the tapes on the pallet in sections;

[0028] Step S104, bonding a plurality of semiconductor chips to a plurality of the tape segments, wherein when the semiconductor chips are removed from the tray, the tape segments are heated to 110-125°C.

[0029] In an embodiment of the present invention, first, a thermal tape is provided, and the thermal tape is cut into a plurality of tape segments, wherein the width of the tape segments is 7.5-8.5 mm, so as to avoid the problem of bubbles easily generated by too wide tape, and then, the plurality of tape segments are pasted on a tray, and a plurality of semiconductor chips are bonded to the plurality of tape segments, so that the plurality of semiconductor chips can be bonded to the tray through the plurality of tape segments, avoiding the problem of deformation of the semiconductor chip caused by operations such as fixing with mechanical screws in the prior art; in addition, when the semiconductor chip is removed from the tray, the tape segments are heated to 110-125° C. to release the adhesiveness of the tape segments, so that the semiconductor chip can be easily removed, reducing the problem of defective products caused by warping, and compared with operations such as fixing with mechanical screws in the prior art, the loading and unloading of the entire semiconductor chip reduces surface contamination and damage to the semiconductor chip.

[0030] In order to carry the semiconductor chip into the tray for subsequent processing of the semiconductor, the embodiment of the present invention adopts thermal tape bonding to replace the mechanical bonding in the prior art. The thermal tape can form tiny particles after heating and can be easily removed at 110-125°C. However, the thermal tape cannot function below 80°C, and will damage the semiconductor chip above 150°C.

[0031] In a specific implementation, the width of the tape segment is 7.5-8.5 mm, for example, it can be 7.5 mm, 7.6 mm, 7.7 mm, 7.8 mm, 7.9 mm, 8 mm, 8.1 mm, 8.2 mm, 8.3 mm, 8.4 mm, 8.5 mm, etc. Of course, the width of the tape segment can be set according to actual use requirements, and no further details will be given here.

[0032] In an optional embodiment, the number of the semiconductor chips is greater than the number of the tape segments, so that one tape segment can be used to paste multiple semiconductor chips, thereby saving costs. In addition, the semiconductors can be closely arranged together, and the gaps between adjacent semiconductors are as small as possible, so that more semiconductors can be pasted on each tape segment, thereby saving tape.

[0033] In a specific implementation, when the semiconductor chip is removed from the tray, the tape is heated in sections to 110-125°C, for example, 110°C, 111°C, 112°C, 113°C, 114°C, 115°C, 116°C, 117°C, 118°C, 119°C, 120°C, 121°C, 122°C, 123°C, 124°C, 125°C, etc. Of course, the values ​​can be set according to actual use requirements, and no further details are given here. Preferably, when the semiconductor chip is removed from the tray, the tape is heated in sections to 120°C.

[0034] In an optional embodiment, when the semiconductor chip is removed from the tray, the heating time of the tape segment is 18-22 minutes, for example, 18 minutes, 19 minutes, 20 minutes, 21 minutes, 22 minutes, etc. Of course, its value can be set according to actual use requirements, and no further details are given here. Preferably, when the semiconductor chip is removed from the tray, the heating time of the tape segment is 20 minutes.

[0035] In an optional implementation, before the step S104 of "bonding a plurality of semiconductor chips to a plurality of the tape segments", the method further includes:

[0036] Provide an intermediate network;

[0037] Covering the intermediate net on the tray with the plurality of tape segments attached thereto; wherein the maximum length of the mesh of the intermediate net is smaller than the minimum length of the semiconductor chip;

[0038] The step of removing the semiconductor chip from the tray comprises:

[0039] After the adhesive tape has been heated in sections to 110-125° C., all semiconductor chips are removed through the intermediate web.

[0040] In the traditional semiconductor processing technology, after the semiconductor chip processing is completed, the semiconductor chips need to be removed from the tray one by one. In the embodiment of the present application, by pasting tape segments on the tray, setting an intermediate net, and finally pasting the semiconductor chip on the tray, after the semiconductor chip processing is completed, the tape segments can be heated to 110-125°C, and then all the semiconductor chips can be removed through the intermediate net. For example, at least 4 corners of the intermediate net can be lifted manually or by a robot, so that all the semiconductor chips can be removed when the intermediate net is lifted, which effectively improves the work efficiency.

[0041] In a specific implementation, the maximum length of the mesh of the intermediate net is smaller than the minimum length of the semiconductor chip. Thus, in a specific application, the size of each mesh is smaller than the size of the semiconductor chip, thereby ensuring that the intermediate net is disposed between the semiconductor chip and the tape segment, thereby ensuring that when the semiconductor chip needs to be removed, all semiconductor chips can be removed together through the intermediate net.

[0042] In a specific implementation, the heat-resistant temperature of the intermediate net is greater than the heating temperature of the tape segment when the semiconductor chip is removed, so as to avoid damage to the intermediate net when the tape segment is heated. Exemplarily, the heat-resistant temperature of the intermediate net is greater than 125°C, for example, it can be 126°C, 127°C, 130°C, 140°C, 150°C, 160°C, 200°C, 300°C, etc. Of course, the heat-resistant temperature of the intermediate net can also be set to other values ​​according to actual use requirements, which will not be described in detail here.

[0043] In an optional embodiment, the intermediate net is composed of a plurality of mesh wires, and the diameter of the mesh wires is 0.08-0.3 mm. By using the mesh wires with a diameter of 0.08-0.3 mm, when the semiconductor chip is pasted on the tray, the intermediate net will not cause excessive obstruction to the pasting between the semiconductor chip and the tape segment, thereby ensuring that the semiconductor chip can be pasted on the tape segment. In a specific implementation, for example, the intermediate net can be formed by weaving a plurality of mesh wires together in a criss-cross pattern. The diameter of the mesh wire can be, for example, 0.08 mm, 0.09 mm, 0.1 mm, 0.15 mm, 0.18 mm, 0.2 mm, 0.23 mm, 0.25 mm, 0.28 mm, 0.3 mm, etc. Of course, the diameter of the mesh wire can also be set to other values ​​according to actual use requirements, which will not be described in detail here. Specifically, each mesh hole of the intermediate net is equal and square.

[0044] In an optional implementation, the middle net is a stainless steel net or a nylon net. Of course, the material of the middle net can also be selected from other materials according to actual use requirements, which will not be further elaborated here.

[0045] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows: the embodiments of the present invention provide a method for carrying semiconductor chips, first, providing a thermal tape, and cutting the thermal tape into a plurality of tape segments, wherein the width of the tape segments is 7.5-8.5 mm, so as to avoid the problem of bubbles easily generated by too wide tape, and then pasting the plurality of tape segments on a tray, and bonding a plurality of semiconductor chips to the plurality of tape segments, so that the plurality of semiconductor chips can be bonded to the tray through the plurality of tape segments, avoiding the problem of deformation of the semiconductor chips caused by operations such as fixing with mechanical screws in the prior art; in addition, when the semiconductor chip is removed from the tray, the tape segments are heated to 110-125° C., so that the adhesiveness of the tape segments is released, so that the semiconductor chip can be easily removed, reducing the problem of defective products caused by warping, and compared with operations such as fixing with mechanical screws in the prior art, the loading and unloading of the entire semiconductor chip reduces surface contamination and damage to the semiconductor chip, thereby improving the yield of the semiconductor chip. In addition, the embodiments of the present invention simplify the operation of fixing by mechanical screws in the prior art, and the whole process is simple and easy, which reduces the messy mechanical screw operation and effectively improves the work efficiency of the operator.

[0046] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A method for carrying a semiconductor chip, characterized in that: include: Provide thermal tape; Cutting the thermal tape into a plurality of tape segments; wherein the width of the tape segments is 7.5-8.5 mm; Pasting a plurality of the adhesive tapes on the pallet in sections; A plurality of semiconductor chips are bonded to the plurality of tape segments, wherein the tape segments are heated to 110-125° C. when the semiconductor chips are removed from the tray.

2. The method for carrying a semiconductor chip according to claim 1, characterized in that: The number of the semiconductor chips is greater than the number of the tape segments.

3. The method for carrying a semiconductor chip according to claim 1, characterized in that: When the semiconductor chip is removed from the tray, the tape is heated to 120° C. in sections.

4. The method for carrying a semiconductor chip according to claim 1, characterized in that: When the semiconductor chip is removed from the tray, the heating time of the tape segment is 18-22 minutes.

5. The method for carrying a semiconductor chip according to claim 4, characterized in that: When the semiconductor chip is removed from the tray, the heating time of the tape segment is 20 minutes.

6. The method for carrying a semiconductor chip according to any one of claims 1 to 5, characterized in that: Before bonding the plurality of semiconductor chips to the plurality of tape segments, the method further includes: Provide an intermediate network; Covering the intermediate net on the tray with the plurality of tape segments attached thereto; wherein the maximum length of the mesh of the intermediate net is smaller than the minimum length of the semiconductor chip; The step of removing the semiconductor chip from the tray comprises: After the adhesive tape has been heated in sections to 110-125° C., all semiconductor chips are removed through the intermediate web.

7. The method for carrying a semiconductor chip according to claim 6, characterized in that: The middle net is composed of a plurality of mesh wires, and the diameter of the mesh wires is 0.08-0.3 mm.

8. The method for carrying a semiconductor chip according to claim 6, characterized in that: Each mesh of the intermediate net is equal and square.

9. The method for carrying a semiconductor chip according to claim 6, characterized in that: The middle net is a stainless steel net or a nylon net.

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