Semiconductor device

By designing a bent part on the main terminal of the semiconductor device, it bends and enters between the recess and nut of the housing, the torque problem to the housing when the external conductor is tightened is solved, and the device is miniaturized and the shell is realized. Optimization of body strength.

CN119517873APending Publication Date: 2025-02-25FUJI ELECTRIC CO LTD
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Patent Information

Application Number
CN202410865373.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-08-24
Filing Date
2024-07-01
Publication Date
2025-02-25

AI Technical Summary

Technical Problem

When the external conductor is fastened to the main terminal, a relatively large torque is required for the existing semiconductor device to be applied, resulting in an increase in the housing strength, thereby limiting the miniaturization of the device.

Method used

A semiconductor device is designed, with its main terminal having a bent portion, which is bent from the periphery of the fastened portion and enters between the recessed wall of the housing and the nut, reducing the application of torque to the housing.

Benefits of technology

By reducing the application of torque to the case, it is possible to suppress the damage of the case and to achieve miniaturization of the semiconductor device, while reducing the need for increased housing strength.

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Abstract

The invention relates to a semiconductor device. In a semiconductor device, torque applied to a housing when an outer conductor is fastened to a main terminal is reduced. The semiconductor device includes: a semiconductor element; a main terminal (for example, a P terminal, an N terminal, and an M terminal) having a fastened portion that includes a fastening hole and is fastened to the external conductor by a bolt and a nut in the fastening hole, and an extension portion that extends from the fastened portion toward the semiconductor element side and is electrically connected to the semiconductor element; and a case that houses the semiconductor element. The housing has a recess that accommodates the nut. The main terminal further has a bent portion that is bent from a peripheral edge different from the extended portion side of the fastened portion and enters between a wall surface of the recess of the housing and the nut.
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Description

Technical Field

[0001] The present invention relates to a semiconductor device including a housing for housing a nut for fastening an external conductor to a main terminal. Background Art

[0002] Conventionally, there are semiconductor devices that include a main terminal for electrically connecting a semiconductor element such as an IGBT (Insulated Gate Bipolar Transistor) to an external conductor (for example, see Patent Documents 1 to 4). In addition, as a method of fixing a plurality of components, fastening with bolts is used (for example, see Patent Documents 5 and 6).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 06-120390

[0006] Patent Document 2: Japanese Patent Application Publication No. 2002-076255

[0007] Patent Document 3: Japanese Patent Application Publication No. 2022-096958

[0008] Patent Document 4: Japanese Patent Application Publication No. 2021-190553

[0009] Patent Document 5: Japanese Patent Application Publication No. 2002-039141

[0010] Patent Document 6: Japanese Patent Application Publication No. 2012-209165 Summary of the invention

[0011] Problem that the invention aims to solve

[0012] In addition, there is a semiconductor device in which a housing for housing a semiconductor element houses a nut for fastening an external conductor to a main terminal. In this semiconductor device, when the external conductor is fastened to the main terminal by a bolt, torque is applied from the nut to the housing. As a result, for example, a structure for ensuring the strength of the housing is adopted, such as a structure for giving the housing a thickness, and thus miniaturization of the semiconductor device is difficult.

[0013] An object of the present invention is to provide a semiconductor device capable of reducing the torque applied to a housing when an external conductor is fastened to a main terminal.

[0014] Solutions for solving problems

[0015] In one technical solution, a semiconductor device comprises: a semiconductor element; a main terminal having a fastened portion and an extended portion, the fastened portion including a fastening hole and being fastened to an external conductor at the fastening hole by means of a bolt and a nut, the extended portion extending from the fastened portion toward the semiconductor element and being electrically connected to the semiconductor element; and a housing for accommodating the semiconductor element, the housing having a recess for accommodating the nut, the main terminal further having a bent portion, the bent portion being bent from a periphery of the fastened portion that is different from the extension portion side and entering between the wall surface of the recess of the housing and the nut.

[0016] Effects of the Invention

[0017] According to the above technical solution, the torque applied to the housing when the external conductor is fastened to the main terminal can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a top view showing a semiconductor device according to one embodiment.

[0019] Figure 2 This is a right side view transparently showing the internal structure of the semiconductor device according to one embodiment.

[0020] Figure 3 It is a top view, a front view, a right side view, and a development view of a P terminal in one embodiment.

[0021] Figure 4 It is a top view, a front view, a right side view, and a development view of a P terminal in a first modified example of an embodiment.

[0022] Figure 5 It is a top view, a front view, a right side view, and a development view of a P terminal in a second variation of an embodiment.

[0023] Figure 6 It is a top view, a front view, a right side view, and a development view of a P terminal in a third modified example of an embodiment.

[0024] Figure 7 It is a development view of the P terminal in the fourth modified example of one embodiment.

[0025] Figure 8 It is a development view of the P terminal in the fifth variation of one embodiment.

[0026] Description of Reference Numerals

[0027] 1. semiconductor device; 10. unit module; 11. laminated substrate; 11a. insulating plate; 11b. heat sink; 11c. circuit board; 12. semiconductor element; 13. metal wiring board; 20. metal base; 30. housing; 31. hollow portion; 32, 33, 34. recess; 32a, 34a. nut receiving portion; 32b, 34b. bolt receiving portion; 35. through hole; 40, 140, 240, 340, 440, 540. P terminal; 50. N terminal; 60. M terminal; 41, 51, 61, 141, 241, 341 , 441, 541, fastened portion; 41a, 51a, 61a, 141a, 241a, 341a, 441a, 541a, fastening hole; 42, 52, 62, 142, 242, 342, 442, 542, extending portion; 242a, opening; 43, 63, 143, 243, 343, 443, 543, bent portion; 243a, 343a, opening; 444, 544, bent portion; C1, C2, C3, external conductor; J1, J2, joining material; N, nut; Na, side; S, bolt. DETAILED DESCRIPTION

[0028] Hereinafter, a semiconductor device according to an embodiment of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiment described below, and can be implemented with appropriate modifications within the scope of the present invention.

[0029] Figure 1 and Figure 2 It is a top view of the semiconductor device 1 according to one embodiment and a right side view which transparently shows the internal structure.

[0030] In addition, regarding Figure 1 and Figure 2 and the following Figure 3 to Figure 6 The X direction, Y direction, and Z direction shown in the figure are defined as the vertical direction of the semiconductor device 1 (the thickness direction of the laminated substrate 11) as the Z direction, the length direction of the semiconductor device 1 in the X direction and the Y direction orthogonal to the Z direction as the X direction, and the width direction of the semiconductor device 1 as the Y direction. In addition, depending on the situation, the X direction is sometimes referred to as the left-right direction, the Y direction is sometimes referred to as the front-back direction, and the Z direction is sometimes referred to as the up-down direction. These directions are terms used for convenience of explanation, and the corresponding relationship between the XYZ directions varies depending on the mounting posture of the semiconductor device 1.

[0031] The semiconductor device 1 of this embodiment is applied to a power conversion device such as a power control unit and is a power semiconductor module constituting an inverter circuit. The semiconductor device 1 can be used for any purpose and is used as an inverter device for a vehicle-mounted or industrial motor, for example.

[0032] Figure 1 The semiconductor device 1 shown in the figure includes, for example, three unit modules 10, a metal base 20 (see Figure 2 ), a housing 30, and a P terminal 40, an N terminal 50, and an M terminal 60 are provided for each unit module 10. For example, the semiconductor device 1 is used together with a cooler (not shown) provided at the bottom of the metal base 20 in a state where a sealing resin or gel (not shown) is injected into the housing 30.

[0033] The unit module 10 includes a laminate substrate 11, a semiconductor element 12 disposed on the laminate substrate 11, and a metal wiring plate 13. In the present embodiment, three unit modules 10 are arranged in the X direction. The three unit modules 10 constitute, for example, a U phase, a V phase, and a W phase, and form a three-phase inverter circuit as a whole. In addition, the unit module 10 may also be referred to as a power unit or a semiconductor unit. In addition, the unit module 10 may be arranged in any number of one or more.

[0034] The laminate substrate 11 is composed of, for example, a DCB (Direct Copper Bonding) substrate, an AMB (Active Metal Brazing) substrate, or a metal base substrate. Figure 2 As shown, the laminated substrate 11 includes, for example, an insulating plate 11a, a heat sink 11b disposed on the lower surface of the insulating plate 11a, and a plurality of circuit boards 11c disposed on the upper surface of the insulating plate 11a. The laminated substrate 11 is formed in, for example, a rectangular shape in plan view.

[0035] The insulating plate 11a is formed of, for example, a ceramic material such as aluminum oxide (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), a composite material of aluminum oxide and zirconium oxide (ZrO2), a resin material such as epoxy resin, or an insulating material such as an epoxy resin material using a ceramic material as a filler. The insulating plate 11a may also be referred to as an insulating layer or an insulating film.

[0036] The heat sink 11b has a predetermined thickness in the Z direction and is formed on the lower surface of the insulating plate 11a. The heat sink 11b is formed of a metal plate with good thermal conductivity such as copper or aluminum. The heat sink 11b is bonded to the upper surface of the metal base 20 using a bonding material J1 such as solder.

[0037] like Figure 1 As shown, three circuit boards 11c are formed on the upper surface of the insulating plate 11a. The number of circuit boards 11c formed on the upper surface of the insulating plate 11a can be any number more than one. The circuit board 11c is a metal layer such as copper foil, which is formed on the circuit board 11c in an island shape in a state of electrical insulation from each other. In addition, the circuit board 11c can also be called a circuit layer.

[0038] like Figure 2 As shown in FIG. 1 , a semiconductor element 12 is arranged on the mounting surface which is the upper surface of the laminate substrate 11 (circuit board 11c) via a bonding material J2. Figure 1 , two semiconductor elements 12 are shown for one laminated substrate 11, but the number of semiconductor elements 12 is arbitrary. The semiconductor element 12 is formed into a square or rectangular shape in plan view using a semiconductor substrate such as silicon (Si), silicon carbide (SiC), calcium nitride (GaN), and diamond.

[0039] In addition, as the semiconductor element 12, switching elements such as IGBT, power MOSFET (Metal Oxide Semiconductor Field Effect Transistor), and diodes such as FWD (Free Wheeling Diode) are used. The switching element and the diode can be connected in reverse parallel. In addition, as the semiconductor element 12, an RC (Reverse Conducting: Reverse Conducting)-IGBT element, a power MOSFET element, and an RB (Reverse Blocking: Reverse Blocking)-IGBT with sufficient withstand voltage against reverse bias can also be used. In particular, the RC-IGBT element can achieve miniaturization of the internal circuit by bidirectional power supply, thereby achieving miniaturization of the semiconductor device 1 (laminated substrate 11).

[0040] The semiconductor element 12 is electrically connected to the predetermined circuit board 11c via the metal wiring plate 13. The metal wiring plate 13 is formed by bending a metal raw material such as a copper raw material, a copper alloy raw material, an aluminum alloy raw material, or an iron alloy raw material by stamping. For example, the semiconductor element 12 and the metal wiring plate 13 are bonded by a bonding material such as solder. These metal wiring plates 13 may also be referred to as lead frames. In addition, other connecting members such as wires may be configured instead of the metal wiring plate 13.

[0041] Figure 2 The metal base 20 shown is a rectangular plate-shaped member. The metal base 20 is a member that functions as a heat-conducting member that conducts heat generated by the semiconductor element 12 to a cooler (not shown) located below the metal base 20, and is formed of a metal plate such as a copper plate or an aluminum plate. In addition, the metal base 20 and the cooler are joined by a heat-conducting material such as thermal grease or a heat-conducting compound.

[0042] like Figure 1As shown, the housing 30 is formed in a rectangular frame shape having a hollow portion 31 in the center. The three unit modules 10 are accommodated in the rectangular hollow portion 31. That is, the three unit modules 10 are accommodated in a space defined by the frame-shaped housing 30.

[0043] like Figure 2 As shown, the recesses 32, 33, and 34 have nut receiving portions 32a and 34a and bolt receiving portions 32b and 34b. The recesses 32, 33, and 34 are formed in a shape that is recessed from the upper surface of the housing 30 toward the metal base 20. In addition, although the nut receiving portion and the bolt receiving portion of the recess 33 are not shown in the figure, the recess 33 can be set to the same structure as the recesses 32 and 34.

[0044] The nut receiving portions 32a and 34a receive the nut N screwed into the threaded portion of the bolt S. The shape of the nut receiving portions 32a and 34a is arbitrary, for example, a rectangular shape in a plan view. The bolt S and the nut N are members for fastening the outer conductors C1, C2, and C3 to the fastened portions 41, 51, and 61 in the fastening holes 41a, 51a, and 61a described later. As the nut N, any nut such as a hexagonal nut in a hexagonal barrel shape and a hexagonal cap nut in which an internal thread hole is not penetrated can be adopted.

[0045] The bolt receiving parts 32b and 34b receive the top ends of the threaded parts of the bolts S. The shapes of the bolt receiving parts 32b and 34b are arbitrary, for example, they are circular when viewed from above. In addition, the size of the bolt receiving parts 32b and 34b when viewed from above is smaller than the size of the nut receiving parts 32a and 34a when viewed from above, and the nut N is placed on the step portion between the nut receiving parts 32a and 34a and the bolt receiving parts 32b and 34b. However, it is also possible that the nut receiving parts 32a and 34a and the bolt receiving parts 32b and 34b are the same size when viewed from above, and the nut receiving parts 32a and 34a are not distinguished from the bolt receiving parts 32b and 34b.

[0046] exist Figure 2 In the example of , the recesses 32, 33, 34 (nut receiving portions 32a, 34a) are formed between the side surface of the housing 30 on the semiconductor element 12 side and the side surface of the housing 30 opposite to the side surface on the semiconductor element 12 side. In this case, the extension portion 42 passes through the inside of the housing 30 from the fastened portion 41 and protrudes from the side surface of the housing 30 on the semiconductor element 12 side toward the hollow portion 31. In addition, the recesses 32, 33, 34 may be further recessed from the upper surface of the housing 30 in such a manner that at least a part of the fastened portions 41, 51, 61 of each terminal 40, 50, 60 is inserted.

[0047] A plurality of through holes 35 are formed along the outer periphery of the housing 30. The through holes 35 are holes through which bolts for fixing the semiconductor device 1 to an external device such as a cooler (not shown) are inserted, for example.

[0048] In addition, the resin used for the housing 30 can be selected from insulating resins such as polybutylene terephthalate (PBT), polybutyl acrylate (PBA), polyamide (PA), acrylonitrile butadiene styrene (ABS), liquid crystal polymer (LCP), polyether ether ketone (PEEK), polybutylene succinate (PBS), polyurethane, silicone resin, etc., in addition to polyphenylene sulfide (PPS). In addition, the selected resin can also be a mixture of two or more resins. The resin can also contain fillers (such as glass fillers) for improving strength or functionality.

[0049] In addition, the sealing resin or gel (not shown) injected into the internal space defined by the frame-shaped housing 30 seals the laminated substrate 11 and the semiconductor element 12 mounted on the laminated substrate 11 in the above-mentioned space. The sealing resin is composed of, for example, a thermosetting resin. The sealing resin preferably contains any one of epoxy resin, silicone resin, polyurethane, polyimide, polyamide, and polyamide-imide. From the aspects of insulation, heat resistance, and heat dissipation, the sealing resin is preferably, for example, epoxy resin mixed with fillers. In addition, the gel is, for example, silicone gel.

[0050] The housing 30 is provided with a plurality of external conductors C1, C2, and C3 (see Figure 2 ) main terminals (P terminal 40, N terminal 50 and M terminal 60) functioning as external connection terminals for connection and control terminals (not shown) for control. One P terminal 40, one N terminal 50 and one M terminal 60 are each configured for one unit module 10. The P terminal 40 may also be referred to as a positive terminal (input terminal) or a first main terminal, the N terminal 50 may also be referred to as a negative terminal (output terminal) or a second main terminal, and the M terminal 60 may also be referred to as an intermediate terminal (output terminal) or a third main terminal.

[0051] The P terminal 40 and the N terminal 50 are located on the negative side in the Y direction relative to the laminated substrate 11. In addition, the M terminal 60 is located on the positive side in the Y direction relative to the laminated substrate 11. The P terminal 40, the N terminal 50, and the M terminal 60 are preferably formed by bending a metal material such as a copper material, a copper alloy material, an aluminum alloy material, or an iron alloy material by press working or the like.

[0052] The P terminal 40 , the N terminal 50 , and the M terminal 60 have fastened portions 41 , 51 , 61 and extending portions 42 , 52 , 62 extending from the fastened portions 41 , 51 , 61 toward the semiconductor element 12 .

[0053] The fastened parts 41, 51, 61 include fastening holes 41a, 51a, 61a, and are fastened to the external conductors C1, C2, C3 by bolts S and nuts N. The fastened parts 41, 51, 61 are rectangular in plan view. In addition, the fastening holes 41a, 51a, 61a penetrate the fastened parts 41, 51, 61 in the Z direction. The fastening holes 41a, 51a, 61a are, for example, in a shape in which the inner circumference is constant in the height direction. In addition, the fastened parts 41, 51, 61 are fastened to the external conductors C1, C2, C3 in a state of being placed on the housing 30, so that the fastened parts 41, 51, 61 (each terminal 40, 50, 60) can be held by the housing 30. Furthermore, when at least parts of the fastened portions 41 , 51 , 61 are inserted into the recesses 32 , 33 , 34 of the housing 30 as described above, the housing 30 holds the terminals 40 , 50 , 60 in a more stable state.

[0054] The extension portion 42, 52, 62 bends downward (negative side in the Z direction) from the fastened portion 41, 51, 61 extending horizontally, bends horizontally (side in the Y direction), bends downward (negative side in the Z direction), and bends horizontally (side in the Y direction). Moreover, the extension portion 42, 52, 62 is joined to the circuit board 11c or a copper block (not shown) provided on the circuit board 11c at the top end on the side opposite to the fastened portion 41, 51, 61. Moreover, the extension portion 42, 52, 62 is electrically connected to the semiconductor element 12 via the circuit board 11c. It is preferable that the extension portion 42, 52, 62 abuts against the nut N at the portion bent downward from the fastened portion 41, 51, 61, for example. Furthermore, as described above, the extension portion 42, 52, 62 is bent and extended from the fastened portion 41, 51, 61, but may be a portion that is not bent from the fastened portion 41, 51, 61 but extends on the same plane as the fastened portion 41, 51, 61. In addition, the width of the extension portion 42, 52, 62 in the X direction is shorter than the width of the fastened portion 41, 51, 61 in the X direction, but the width of the extension portion 42, 52, 62 in the X direction may be the same as or larger than the width of the fastened portion 41, 51, 61 in the X direction.

[0055] In the above description, as an example of the main terminal, three terminals, namely the P terminal 40, the N terminal 50 and the M terminal 60, are listed, and therefore the number of the recesses 32, 33, 34, the nut N, etc. of the shell 30 is also set to three, but the number of the main terminals, recesses 32, 33, 34, the nut N, etc. in this embodiment can be set to any number more than one.

[0056] Next, refer to Figure 3, the bending portions 43, 63 of the P terminal 40, the N terminal 50 and the M terminal 60 are described in detail by taking the P terminal 40 as an example. In addition, the bending portion of the N terminal 50 is not shown, and the bending portion 63 of the M terminal 60 is only shown in FIG. Figure 2 Although the bent portion 63 located on the negative side in the X direction of the nut N is slightly shown in FIG. 1 , the N terminal 50 and the M terminal 60 can be configured similarly to the P terminal 40 .

[0057] Figure 3 1 and 2 , respectively, show (a) a top view, (b) a front view, (c) a right side view, and (d) a development view of the P terminal 40 . Figure 3 (d) Figure 4 (d) Figure 5 (d) Figure 6 (d) Figure 7 as well as Figure 8 The single-dot chain line shown in the development diagram of represents the bending line (mountain fold line) of the P terminal 40. Figure 3 and the following Figures 4 to 6 In the figure, the indicator line of the part represented by the hidden line (dashed line) is represented by a dashed line.

[0058] like Figure 3 (a)~ Figure 3 As shown in (d), the P terminal 40 has the above-mentioned fastened portion 41 and the extension portion 42 and a pair of bent portions 43, 43 bent from the fastened portion 41. These bent portions 43, 43 are an example of a peripheral edge of the fastened portion 41 that is different from the side of the extension portion 42 (positive side in the Y direction), and are bent downward (negative side in the Z direction) from both ends of the fastened portion 41 in the width direction (X direction) of the P terminal 40 that intersects the extension direction (Y direction) of the extension portion 42. Furthermore, as shown in FIG. Figure 3 (a) and Figure 3 As shown in (b) , the bent portions 43 , 43 enter between the wall surface (left and right side surfaces) of the recessed portion 32 of the housing 30 and the nut N.

[0059] In addition, if Figure 3 (a)~ Figure 3 As shown in (c), it is desired that the fastened portion 41 and the bent portions 43, 43 are formed to a size that is accommodated in the recess 32 of the shell 30 when viewed from above, and the bent portions 43, 43 abut against both the wall surface (left and right sides) of the recess 32 and the side Na (left and right sides) of the nut N.

[0060] Here, the front corner of the nut N is preferably arranged at a distance from the front surface of the recess 32 to prevent the torque from being directly applied to the wall surface of the recess 32 from the nut N without passing through the bent portion 43. In addition, the rear corner of the nut N is preferably arranged at a distance from the extension portion 42 to prevent the torque from being applied to the extension portion 42 from the rear corner of the nut N.

[0061] The position of the lower end of the bent portion 43, 43 is the same as the position of the lower end of one side surface Na (left and right sides) of the nut N abutting against it. In addition, the bent portions 43, 43 are formed so that the width in the Y direction is longer than the width in the Y direction of one side surface Na of the nut N. That is, the bent portions 43, 43 are formed to be larger than the side surface Na of the nut N. The bent portions 43, 43 abut against the entire side surface Na of the nut N, and preferably expand in at least one direction of the width direction (Y direction) and the height direction (Z direction) compared to the abutting portion. In addition, one of the left and right pair of bent portions 43, 43 may be omitted, but for a single bent portion 43, it is preferred as described later. Figure 4 As shown, the single bent portion 143 faces the extended portion 142 and sandwiches the nut N. It is desirable that a plurality of bent portions 43 not facing the extended portion 42 are provided so as to face each other and sandwich the nut N.

[0062] Below, refer to Figures 4 to 8 The first to fifth modified examples of the present embodiment are described. In addition, the fastened portions 141, 241, 341, 441, 541 and the extended portions 142, 242, 342, 442, 542 of each modified example can be set to be the same as the fastened portion 41 and the extended portion 42 described above, and thus the description thereof is omitted. In addition, the N terminal and the M terminal can also be set to the same structure as the P terminal 140, 240, 340, 440, 540, and thus the description thereof is omitted.

[0063] Figure 4 1 and 2 are (a) a top view, (b) a front view, (c) a right side view, and (d) a development view of a P terminal 140 in a first modification.

[0064] like Figure 4 (a)~ Figure 4 As shown in (d), the P terminal 140 has: a fastened portion 141 including a fastening hole 141a; an extension portion 142 extending from the fastened portion 141; and a bent portion 143 bent from the fastened portion 141. The bent portion 143 is an example of a peripheral edge of the fastened portion 141 that is different from the side of the extension portion 142 (positive side in the Y direction), and is bent downward from the peripheral edge of the end of the fastened portion 141 on the opposite side of the extension portion 142 (negative side in the Y direction). Furthermore, as shown in FIG. Figure 4 (a) and Figure 4 As shown in (c) of FIG. 1 , the bent portion 143 enters between the wall surface (front surface) of the recessed portion 32 of the housing 30 and the side surface Na (front surface) of the nut N. The bent portion 143 is shaped to face the extended portion 142 and sandwich the nut N.

[0065] In addition, if Figure 4 (a)~ Figure 4 As shown in (c), it is desirable that the fastened portion 141 and the bent portion 143 are formed to be sized to be accommodated in the recess 32 of the housing 30 when viewed from above, and the bent portion 143 abuts against both the wall surface (front surface) of the recess 32 and the side surface Na (front surface) of the nut N. In addition, it is desirable that the rear surface of the nut N abuts against the extended portion 142.

[0066] The direction of the outer circumference of the nut N is Figure 3 Unlike the example shown, the front surface extending in the XZ plane constitutes one of the side surfaces Na. It is preferable that the left and right corners of the nut N are arranged at intervals from the left and right side surfaces of the recess 32 to prevent the torque from being directly applied to the wall surface of the recess 32 from the nut N without passing through the bent portion 143. The position of the lower end of the bent portion 143 is the same as the position of the lower end of the side surface Na (front surface) of the nut N abutting against it. In addition, the bent portion 143 is formed so that the width in the X direction is longer than the width in the X direction of one side surface Na of the nut N. That is, the bent portion 143 is formed to be larger than the side surface Na (front surface) of the nut N. The bent portion 143 abuts against the entire side surface Na (front surface) of the nut N, and preferably expands in at least one direction of the width direction (X direction) and the height direction (Z direction) compared to the abutting portion.

[0067] Figure 5 1 and 2 are (a) a top view, (b) a front view, (c) a right side view, and (d) a development view of a P terminal 240 in a second modification.

[0068] like Figure 5 (a)~ Figure 5 As shown in (d), the P terminal 240 has: a fastened portion 241 including a fastening hole 241a; an extension portion 242 extending from the fastened portion 241; and a bent portion 243 bent from the fastened portion 241. The bent portion 243 is an example of a peripheral edge of the fastened portion 241 that is different from the side of the extension portion 242 (positive side in the Y direction). Figure 4 Similarly to the first modified example shown in FIG. 1 , the peripheral edge of the end portion of the fastened portion 241 on the opposite side (negative side in the Y direction) to the extending portion 242 is bent downward. Figure 5 (a) and Figure 5As shown in (c) of FIG. 1 , the bent portion 243 enters between the wall surface (front surface) of the recessed portion 32 of the housing 30 and the nut N. The bent portion 243 is shaped to face the extended portion 242 and sandwich the nut N therein.

[0069] In addition, if Figure 5 (a)~ Figure 5 As shown in (c), it is desirable that the fastened portion 241 and the bent portion 243 are formed to be sized to be accommodated in the recess 32 of the housing 30 when viewed from above, and the bent portion 243 abuts against the nut N. In this second modified example, there is a gap in the Y direction between the bent portion 243 (and the corner portion on the front side of the nut N) and the front surface of the recess 32. In addition, the bent portion 243 abuts against the wall surface of the recess 32 at the ends on both the left and right sides.

[0070] The outer circumference of the nut N is Figure 3 In the example shown, the corners are located at the front and back, and the left and right sides are opposite to the left and right sides of the recess 32. It is preferable that the left and right sides of the nut N are spaced apart from the left and right sides of the recess 32 to prevent the torque from being directly applied to the wall surface of the recess 32 from the nut N without passing through the bent portions 243, 243. In addition, the bent portion 243 has an opening 243a that exposes the corner (front side) of the nut N. In addition, the extension portion 242 has an opening 242a that exposes the corner (rear side) of the nut N. In addition, the corner on the front side of the nut N passes through the bent portion 243 (the opening 243a as a through hole). In addition, the corner on the rear side of the nut N is located in the opening 242a of the extension portion 242. The openings 242a, 243a can be through holes or recesses that are recessed toward the nut N side. When viewed from above, the width in the X direction of the front and rear corners of the nut N becomes narrower in a conical shape as it goes toward the apex of the front and rear corners of the nut N. Accordingly, the opening 243a of the bent portion 243 and the opening 242a of the extended portion 242 become narrower in the X direction as they are farther away from the center of the nut N. Thus, the bent portion 243 and the extended portion 242 abut against the side of the nut N at the openings 243a and 242a to hold the nut N. However, the width in the X direction of the openings 242a and 243a may also be constant. In addition, the position of the lower end of the bent portion 243 is the same as the position of the lower end of the nut N. In addition, the extended portion 242 may also be aligned with the bent portion 243. Figure 3 The extension portion 42 of the nut N is also not provided with an opening 242a. In this case, the rear corner of the nut N is preferably arranged at a distance from the extension portion 242 to prevent torque from being applied to the extension portion 242 from the rear corner of the nut N. In addition, the bent portion 243 may also be formed along the side surface of the nut N.

[0071] Figure 61 and 2 are (a) a top view, (b) a front view, (c) a right side view, and (d) a development view of a P terminal 340 in a third modification example.

[0072] like Figure 6 (a)~ Figure 6 As shown in (d), the P terminal 340 has: a fastened portion 341 including a fastening hole 341a; an extension portion 342 extending from the fastened portion 341; and a pair of bent portions 343, 343 bent from the fastened portion 341. These bent portions 343, 343 are an example of the peripheral edge of the fastened portion 341 that is different from the side of the extension portion 342 (positive side in the Y direction), and are Figure 3 Similarly to the example shown in FIG. 1 , both ends of the P terminal 340 in the width direction (X direction) intersecting the extending direction (Y direction) of the extending portion 342 of the fastened portion 341 are bent downward. Figure 6 (a) and Figure 6 As shown in (b) , the bent portions 343 , 343 enter between the wall surface (left and right side surfaces) of the recessed portion 32 of the housing 30 and the nut N.

[0073] In addition, if Figure 6 (a)~ Figure 6 As shown in (c), it is desirable that the fastened portion 341 and the bent portions 343, 343 are formed to be sized to be accommodated in the recess 32 of the housing 30 when viewed from above, and the bent portions 343, 343 abut against the nut N. In this third modified example, there is a gap in the X direction between the bent portion 343 (and the left and right corners of the nut N) and the left and right side surfaces of the recess 32. In addition, the bent portion 343 abuts against the wall surface of the recess 32 at the front end.

[0074] The direction of the outer circumference of the nut N is Figure 3Unlike the example shown, the front surface extending in the XZ plane is opposite to the front surface of the recess 32. It is preferable that the front surface of the nut N is arranged at a distance from the front surface of the recess 32 to prevent the torque from being directly applied to the wall surface of the recess 32 from the nut N without passing through the bent portions 343, 343. Moreover, the bent portions 343, 343 each have an opening 343a that exposes the corners (left and right) of the nut N. Moreover, the left and right corners of the nut N penetrate the bent portions 343, 343. When viewed from above, the width of the corner of the nut N in the Y direction becomes narrower in a tapered shape as it goes toward the vertex of the corner of the nut N. Accordingly, the openings 343a, 343a of the bent portions 343, 343 become narrower in the Y direction as they are farther away from the center of the nut N. As a result, the bent portions 343, 343 abut against the side of the nut N at the openings 343a, 343a, and the nut N is held. However, the widths of the openings 343a, 343a in the Y direction may be constant. In addition, the position of the lower end of the bent portion 343 is the same as the position of the lower end of the nut N. In addition, the bent portion 343 may be formed along the side surface of the nut N.

[0075] Figure 7 It is a development view of the P terminal 440 in the fourth modification.

[0076] like Figure 7 As shown, the P terminal 440 has: a fastened portion 441 including a fastening hole 441 a ; an extending portion 442 extending from the fastened portion 441 ; and a pair of bent portions 443 , 443 and a pair of bent portions 444 , 444 bent from the fastened portion 441 .

[0077] The above Figure 3 The P terminal 40 shown in the figure abuts against the left and right side surfaces Na of the nut N only at the bent portions 43, 43 bent downward from both ends in the width direction (X direction) of the fastened portion 41. On the other hand, in this fourth modified example, the P terminal 440 has Figure 3 The bent portions 43, 43 of the P terminal 40 shown in the figure are similarly a pair of bent portions 443, 443 that abut against the side surface Na of the nut N and the wall surface of the recessed portion 32, and a pair of bent portions 444, 444 that abut against the two front surfaces of the nut N. In this way, the P terminal 440 abuts against the four side surfaces of the nut N. The pair of bent portions 444, 444 is formed, for example, to have the same size as the two front surfaces of the nut N. In addition, the pair of bent portions 443, 443 may be omitted, and only at least one bent portion 444 may be provided.

[0078] Figure 8 It is a development view of the P terminal 540 in the fifth modification.

[0079] like Figure 8As shown, the P terminal 540 has: a fastened portion 541 including a fastening hole 541 a ; an extending portion 542 extending from the fastened portion 541 ; and a bent portion 543 and a pair of bent portions 544 , 544 bent from the fastened portion 541 .

[0080] The above Figure 4 The P terminal 140 in the first modification shown in FIG. 1 abuts against the side surface Na (front surface) of the nut N at a single bent portion 143 bent downward from the peripheral edge of the end portion of the fastened portion 141 on the side opposite to the extending portion 142 (negative side in the Y direction). On the other hand, in the fifth modification, the P terminal 540 has a Figure 4 The bent portion 143 of the P terminal 140 shown in the figure similarly includes a bent portion 543 that abuts against the side surface Na (front surface) of the nut N and the wall surface of the recess 32, and a pair of bent portions 544, 544 that abut against the left and right side surfaces of the front side of the nut N. In this way, the P terminal 540 abuts against three side surfaces of the nut N. The pair of bent portions 544, 544 are formed, for example, to have the same size as the left and right side surfaces of the front side of the nut N. In addition, the bent portion 543 may be omitted, and only at least one bent portion 544 may be provided.

[0081] In the present embodiment (and the first to fifth modified examples) described above, the semiconductor device 1 includes a semiconductor element 12, main terminals (for example, a P terminal 40, an N terminal 50, and an M terminal 60), and a housing 30. The main terminals include fastened portions 41, 51, 61 and extending portions 42, 52, 62 extending from the fastened portions 41, 51, 61 toward the semiconductor element 12 and electrically connected to the semiconductor element 12. The fastened portions 41, 51, 61 include fastening holes 41a, 51a, 61a, and are fastened to the external conductors C1, C2, C3 in the fastening holes 41a, 51a, 61a by bolts S and nuts N. The housing 30 accommodates the semiconductor element 12. In addition, the housing 30 includes recesses 32, 33, 34 for accommodating the nuts N. The main terminal further includes a bent portion 43 (63) which is bent from a peripheral edge of the fastened portion 41, 51, 61 which is different from the extending portion 42, 52, 62 side and enters between the wall surface of the recess 32, 33, 34 of the housing 30 and the nut N.

[0082] Thus, when the external conductors C1, C2, and C3 are fastened to the main terminals (for example, the P terminal 40, the N terminal 50, and the M terminal 60), the bent portion 43 that enters between the wall surface of the recess 32 and the nut N can receive the torque applied from the nut N. Therefore, according to the present embodiment, the torque applied to the housing 30 when the external conductors C1, C2, and C3 are fastened to the main terminals can be reduced. Thus, the damage of the housing 30 can be suppressed, and therefore, the structure for ensuring the strength of the housing 30, such as the structure that gives the housing 30 a thickness, can be omitted, thereby achieving miniaturization of the semiconductor device 1. In addition, if the installation between the main terminal and the nut N is loose, the contact resistance between the main terminal and the upper surface of the nut N increases, and the main terminal is prone to heat. In order to suppress this contact resistance, it is considered to increase the tightening torque of the bolt S. In the case of increasing the tightening torque in this way, as in the present embodiment, the bent portion 43 receives the torque applied from the nut N, so that the torque applied to the housing 30 can be more effectively reduced.

[0083] In addition, in the present embodiment and the third and fourth variations, the P terminal 40, 340, 440 as an example of a main terminal has bent portions 43, 343, 443 bent from the periphery of the fastened portion 41, 341, 441 at both ends of the P terminal 40, 340, 440 in the width direction (X direction) of the fastened portion 41, 341, 441 which intersects the extension direction (Y direction) of the extending portion 42, 342, 442.

[0084] Thus, the nut N can be sandwiched by the pair of bent portions 43 , 343 , 443 facing each other, and thus the torque applied to the housing 30 can be more reliably reduced.

[0085] In the first, second and fifth modified examples of the present embodiment, the extension portion 142, 242, 542 is bent and extended from the fastened portion 141, 241, 541 to abut against the nut N. The bent portion 143, 243, 543 is bent from the peripheral edge of the end portion of the fastened portion 141, 241, 541 on the opposite side to the extension portion 142, 242, 542.

[0086] Thus, the nut N can be sandwiched by the bent portion 143 , 243 , 543 and the extended portion 142 , 242 , 542 , and thus the torque applied to the housing 30 can be more reliably reduced.

[0087] In the present embodiment and the first modified example, the bent portions 43 and 143 are in contact with the side surface Na of the nut N and are formed larger than the side surface Na of the nut N.

[0088] As a result, the contact area between the bent portion 43, 143 and the wall surface of the recessed portion 32 increases, so the bent portion 43, 143 can disperse the torque applied from the nut N. Therefore, it is possible to more reliably suppress damage to the housing 30. In addition, the contact area between the bent portion 43, 143 and the wall surface of the recessed portion 32 increases, thereby improving heat dissipation.

[0089] In the second and third modified examples of the present embodiment, the bent portions 243 and 343 have the openings 243 a and 343 a through which the corners of the nut N are exposed.

[0090] Thus, the amount of material used corresponding to the openings 243a and 343a can be reduced, and the bent portions 243 and 343 are close to the fastening holes 241a and 341a to make the fastened portions 241 and 341 smaller, thereby reducing the amount of material used for the fastened portions 241 and 341. Therefore, cost reduction can be achieved. In addition, with the miniaturization of the fastened portions 241 and 341, the P terminals 240 and 340 can be miniaturized. Moreover, if the P terminals 240 and 340 abut against the nuts N at the openings 243a and 343a, the nuts N can be more reliably held, and the torque applied to the housing 30 can be more reliably reduced.

[0091] In addition, in the second modification of the present embodiment, the extension portion 242 has an opening 242 a that exposes the corner of the nut N.

[0092] Thus, the amount of material used corresponding to the opening 242a can be reduced, and the extension portion 242 is close to the fastening hole 241a to make the fastened portion 241 smaller, thereby reducing the amount of material used in the fastened portion 241. Therefore, cost reduction can be achieved. In addition, with the miniaturization of the fastened portion 241, the miniaturization of the P terminal 240 can be achieved. Moreover, if the P terminal 240 abuts against the nut N at the opening 242a, the nut N can be more reliably held, and the torque applied to the housing 30 can be more reliably reduced.

[0093] Furthermore, in the present embodiment (and the first to fifth modifications), the bent portion 43 abuts against the wall surface of the recess 32 of the housing 30 .

[0094] Thus, even if the nut N tries to rotate, the bent portion 43 inserted between the wall surface of the recessed portion 32 and the nut N can stably receive torque from the nut N. Therefore, damage to the housing 30 can be more reliably suppressed.

[0095] Hereinafter, the invention described in the claims at the time of filing the present application will be appended.

[0096] <Additional Note 1>

[0097] A semiconductor device, characterized in that

[0098] The semiconductor device comprises:

[0099] Semiconductor components;

[0100] a main terminal having a fastened portion and an extending portion, the fastened portion including a fastening hole and being fastened to an external conductor at the fastening hole by a bolt and a nut, the extending portion extending from the fastened portion toward the semiconductor element side and being electrically connected to the semiconductor element; and

[0101] a housing for housing the semiconductor element;

[0102] The housing has a recessed portion for receiving the nut.

[0103] The main terminal further includes a bent portion that is bent from a peripheral edge of the fastened portion that is different from the extending portion and that enters between a wall surface of the recessed portion of the housing and the nut.

[0104] <Note 2>

[0105] The semiconductor device according to Supplementary Note 1, characterized in that

[0106] The main terminal has the bent portions bent from the peripheral edge of the fastened portion at both ends of the fastened portion in the width direction of the main terminal intersecting with the extending direction of the extending portion.

[0107] <Addendum 3>

[0108] The semiconductor device according to Supplementary Note 1, characterized in that

[0109] The extending portion is bent and extended from the fastened portion to abut against the nut.

[0110] The bent portion is bent from the peripheral edge of an end portion of the fastened portion on the side opposite to the extending portion.

[0111] <Addendum 4>

[0112] The semiconductor device according to any one of Supplementary Notes 1 to 3, characterized in that

[0113] The bent portion abuts against a side surface of the nut and is formed larger than the side surface of the nut.

[0114] <Addendum 5>

[0115] The semiconductor device according to any one of Supplementary Notes 1 to 3, characterized in that

[0116] The bent portion has an opening that exposes a corner of the nut.

[0117] <Addendum 6>

[0118] The semiconductor device according to Supplementary Note 3 is characterized in that

[0119] The extension portion has an opening that exposes a corner portion of the nut.

[0120] <Addendum 7>

[0121] The semiconductor device according to any one of Supplementary Notes 1 to 3, characterized in that

[0122] The bent portion abuts against the wall surface of the recessed portion.

[0123] Industrial Applicability

[0124] As described above, the present invention has an effect of reducing the torque applied to the case when the external conductor is fastened to the main terminal in the semiconductor device, and is useful for, for example, a power semiconductor device.

Claims

1. A semiconductor device, characterized in that: The semiconductor device comprises: Semiconductor components; a main terminal having a fastened portion and an extending portion, wherein the fastened portion includes a fastening hole and is fastened to an external conductor at the fastening hole by a bolt and a nut, and the extending portion extends from the fastened portion toward the semiconductor element side and is electrically connected to the semiconductor element; as well as a housing for housing the semiconductor element; The housing has a recessed portion for receiving the nut. The main terminal further includes a bent portion that is bent from a peripheral edge of the fastened portion that is different from the extending portion and that enters between a wall surface of the recessed portion of the housing and the nut.

2. The semiconductor device according to claim 1, wherein: The main terminal has the bent portions bent from the peripheral edge of the fastened portion at both ends of the fastened portion in the width direction of the main terminal intersecting with the extending direction of the extending portion.

3. The semiconductor device according to claim 1, wherein: The extending portion is bent and extended from the fastened portion to abut against the nut. The bent portion is bent from the peripheral edge of an end portion of the fastened portion on the side opposite to the extending portion.

4. The semiconductor device according to any one of claims 1 to 3, characterized in that The bent portion abuts against a side surface of the nut and is formed larger than the side surface of the nut.

5. The semiconductor device according to any one of claims 1 to 3, characterized in that The bent portion has an opening that exposes a corner of the nut.

6. The semiconductor device according to claim 3, wherein: The extension portion has an opening that exposes a corner portion of the nut.

7. The semiconductor device according to any one of claims 1 to 3, characterized in that The bent portion abuts against the wall surface of the recessed portion.

Citation Information

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