Voltage doubling circuit module, high-voltage power supply, X-ray generator and CT equipment

Abstract

The invention provides a voltage doubling circuit module, a high-voltage power supply, an X-ray generator and CT equipment. The voltage doubling circuit module comprises M circuit boards, the M circuit boards are respectively provided with at least one part of a plurality of electronic elements in the voltage doubling circuit, and M is a positive integer larger than or equal to 3; and a conductive switching part. Wherein the M circuit boards are encircled to form a three-dimensional structure; and the adjacent circuit boards in the M circuit boards are electrically connected through the conductive adapters.

Description

Technical Field

[0001] The present disclosure relates to the technical field of high-voltage power supplies, and more specifically, to a voltage doubling circuit module, a high-voltage power supply, an X-ray generator, and a CT device. Background Art

[0002] High voltage power supplies are widely used in security inspection, medical imaging, electron beam melting, and electrostatic dust removal. In particular, X-ray imaging equipment made of high voltage power supplies and X-ray tubes plays an important role in all aspects of daily life. For example, CT (computed tomography) equipment can obtain high-definition three-dimensional stereoscopic images or slice images, which are widely used in security inspection and medical diagnosis.

[0003] Usually, in CT equipment, high-voltage power supply and X-ray tube are installed on slip rings, and the detected object or human body is scanned 360 degrees by rotating the bearing. Due to the size limitation of the slip ring itself, there is little space left for the installation of high-voltage power supply. Summary of the invention

[0004] In view of this, embodiments of the present disclosure provide a voltage doubling circuit module, a high voltage power supply, an X-ray generator, and a CT device.

[0005] One aspect of the present disclosure provides a voltage doubling circuit module, comprising:

[0006] M circuit boards, each of which is provided with at least a portion of a plurality of electronic components in the voltage doubling circuit, wherein M is a positive integer greater than or equal to 3; and

[0007] Conductive transfer part,

[0008] Wherein, the M circuit boards are surrounded to form a three-dimensional structure; and

[0009] Adjacent circuit boards among the M circuit boards are electrically connected via the conductive adapter.

[0010] According to an embodiment of the present disclosure, the M circuit boards include: a first circuit board, on which a first part of electronic components of a voltage doubling circuit is disposed;

[0011] a second circuit board, on which a second portion of electronic components of the voltage doubling circuit are disposed;

[0012] A third circuit board, on which a third part of electronic components of the voltage doubling circuit is arranged, and the third circuit board is arranged opposite to the first circuit board; and

[0013] a fourth circuit board, on which a fourth part of electronic components of the voltage doubling circuit is arranged, and the fourth circuit board is arranged opposite to the second circuit board;

[0014] Wherein, the first circuit board, the second circuit board, the third circuit board and the fourth circuit board are surrounded to form a three-dimensional structure, and four sides of the three-dimensional structure respectively include the first circuit board, the second circuit board, the third circuit board and the fourth circuit board; and

[0015] Adjacent circuit boards among the first circuit board, the second circuit board, the third circuit board and the fourth circuit board are electrically connected via the conductive adapter.

[0016] According to an embodiment of the present disclosure, the first circuit board, the second circuit board, the third circuit board and the fourth circuit board are surrounded to form a rectangular parallelepiped structure.

[0017] According to an embodiment of the present disclosure, the first circuit board has a first length in a first direction, the second circuit board has a second length in the first direction, and the first length is greater than the second length.

[0018] According to an embodiment of the present disclosure, at least one of the second circuit board and the fourth circuit board includes a plurality of first slots distributed at intervals.

[0019] According to an embodiment of the present disclosure, the second circuit board includes a first side surface connected to the first circuit board, and the first side surface is covered by the first circuit board; and / or,

[0020] The second circuit board includes a second side surface connected to the third circuit board, and the second side surface is covered by the third circuit board; and / or,

[0021] The fourth circuit board comprises a third side surface connected to the first circuit board, and the third side surface is covered by the first circuit board; and / or,

[0022] The fourth circuit board includes a fourth side surface connected to the third circuit board, and the fourth side surface is covered by the third circuit board.

[0023] According to an embodiment of the present disclosure, the first circuit board includes a first protrusion protruding in a first direction relative to the second circuit board and the fourth circuit board, and the third circuit board includes a third protrusion protruding in the first direction relative to the second circuit board and the fourth circuit board;

[0024] The voltage doubler circuit module further includes a fifth circuit board, wherein the fifth circuit board is located between the first protrusion and the third protrusion; and

[0025] One end of the fifth circuit board is fixedly connected to the first protrusion, and the other end of the fifth circuit board is fixedly connected to the third protrusion.

[0026] According to an embodiment of the present disclosure, the fifth circuit board includes four voltage balancing units, and the four voltage balancing units are located in four corner areas of the fifth circuit board.

[0027] According to an embodiment of the present disclosure, the material of the voltage balancing unit includes copper.

[0028] According to an embodiment of the present disclosure, the first circuit board and the third circuit board have substantially the same shape and size; and / or,

[0029] The second circuit board and the fourth circuit board have substantially the same shape and size.

[0030] According to an embodiment of the present disclosure, the fifth circuit board and the second circuit board are arranged at an interval; and

[0031] The fifth circuit board and the fourth circuit board are arranged at an interval.

[0032] According to an embodiment of the present disclosure, the first circuit board, the second circuit board, the third circuit board and the fourth circuit board are each aligned and arranged away from one end of the fifth circuit board.

[0033] According to an embodiment of the present disclosure, the first circuit board, the second circuit board, the third circuit board, the fourth circuit board and the fifth circuit board form a first accommodating space, and at least a portion of the multiple electronic components in the voltage doubling circuit module are located in the first accommodating space.

[0034] According to an embodiment of the present disclosure, the voltage doubling circuit module includes an AC signal input terminal, an N-stage voltage doubling unit and a signal output terminal, and the signal output terminal is located on the fifth circuit board, wherein N is a positive integer greater than or equal to 1.

[0035] According to an embodiment of the present disclosure, the M circuit boards include:

[0036] A first circuit board, on which a first part of electronic components of a voltage doubling circuit is arranged;

[0037] a second circuit board, on which a second portion of electronic components of the voltage doubling circuit are disposed; and

[0038] A third circuit board, on which a third part of electronic components of the voltage doubling circuit is arranged;

[0039] Wherein, the first circuit board, the second circuit board and the third circuit board surround to form a three-dimensional structure, and three sides of the three-dimensional structure include the first circuit board, the second circuit board and the third circuit board respectively; and

[0040] Adjacent circuit boards among the first circuit board, the second circuit board and the third circuit board are electrically connected via the conductive adapter.

[0041] Another aspect of the present disclosure provides a high-voltage power supply, wherein the high-voltage power supply includes the voltage doubling circuit module as described in any one of the above items.

[0042] Another aspect of the present disclosure provides an X-ray generator, wherein the X-ray generator comprises:

[0043] A tube shell, wherein the interior of the tube shell is vacuum;

[0044] An anode and a cathode disposed in the tube shell; and

[0045] The high voltage power supply as described above is used to provide high voltage between the anode and the cathode.

[0046] Still another aspect of the present disclosure provides a CT device, wherein the CT device includes the X-ray generator as described above.

[0047] According to an embodiment of the present disclosure, the CT device further includes a rotatable slip ring, and the X-ray generator is connected to the slip ring and can rotate together with the slip ring.

[0048] One or more of the above embodiments have the following beneficial effects:

[0049] (1) Multiple circuit boards (also called PCB boards) form a three-dimensional structure to maximize the use of the internal space of the high-voltage power supply;

[0050] (2) The three-dimensional connection is more reliable and can withstand stronger mechanical stress when subjected to rotational force;

[0051] (3) PCB circuits are modularized and single boards can be replaced and repaired, which can save the cost of components and materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The above and other objects, features and advantages of the present disclosure will become more apparent through the following description of the embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0053] Figure 1 is a structural block diagram of a high voltage power supply according to an exemplary embodiment of the present disclosure;

[0054] Figure 2is an equivalent circuit diagram of a voltage doubling circuit module according to an exemplary embodiment of the present disclosure;

[0055] Figure 3 is a schematic diagram of a charging process of a voltage doubling circuit module according to an exemplary embodiment of the present disclosure;

[0056] Figure 4 is a schematic diagram of another charging process of a voltage doubling circuit module according to an exemplary embodiment of the present disclosure;

[0057] Figure 5 is a schematic diagram of a discharge process of a voltage doubling circuit module according to an exemplary embodiment of the present disclosure;

[0058] Figure 6-Figure 9 They are schematic structural diagrams of voltage doubling circuit modules at different angles according to exemplary embodiments of the present disclosure;

[0059] Fig.10 is a schematic structural diagram of a voltage doubling circuit module according to an exemplary embodiment of the present disclosure;

[0060] Fig.11A is a schematic structural diagram of a CT device according to an exemplary embodiment of the present disclosure, Fig. 11B yes Fig.11A A side view of the CT device shown;

[0061] Fig. 12A is a schematic structural diagram of an X-ray generator according to an exemplary embodiment of the present disclosure; Fig. 12B is a schematic diagram schematically illustrating a principle of generating X-rays by an X-ray generator according to an exemplary embodiment of the present disclosure;

[0062] Fig.13A is a schematic diagram of a power supply method of an X-ray generator according to an exemplary embodiment of the present disclosure, which schematically shows a single power supply method, Fig. 13B is a schematic diagram of a power supply method of an X-ray generator according to an exemplary embodiment of the present disclosure, which schematically shows a dual power supply method; and

[0063] Fig.14 A block diagram of an electronic device suitable for implementing a function of controlling a CT device and / or a data processing function of a CT device according to an embodiment of the present disclosure is schematically shown.

[0064] It should be noted that, for the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the sizes of the overall / local structures or the overall / local areas may be enlarged or reduced, that is, these drawings are not drawn according to the actual scale. DETAILED DESCRIPTION

[0065] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present disclosure. In the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present disclosure.

[0066] The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The terms "comprise", "include", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0067] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0068] First, some of the terms involved in this application are defined as follows:

[0069] Voltage doubler circuit: The main function of the voltage doubler circuit is to rectify and boost the high-frequency AC voltage to obtain the DC high voltage required by the next stage, which mainly includes diodes with higher reverse peak voltage and capacitors with higher withstand voltage. For example, in an electronic circuit, when the voltage required by the next stage is an integer multiple higher than that of the previous stage and the required current is not very large, a voltage doubler circuit can be used.

[0070] Creepage distance: The shortest distance between two adjacent conductors or between a conductor and the adjacent motor housing surface measured along the insulation surface.

[0071] Traditional voltage doubler circuits generally adopt a planar design, and all components are laid out on a PCB board. If the voltage doubler level is low, it can meet the use requirements. However, with the iteration of modern industrial products, the demand for output high voltage is getting higher and higher, the number of voltage doubler circuits is increasing, and the number of materials carried by a single PCB is increasing. The area required for a single PCB is large, which has obvious restrictions on the product size. In addition, all components contained in a single PCB board of a traditional voltage doubler circuit are usually connected by printed wires. If individual components are damaged, it is difficult to identify them individually, and the entire PCB board is scrapped at the same time, which is extremely costly. In general, the conventional voltage doubler circuit structure design does not meet the development needs of miniaturization, modularization, and low cost of high-voltage power supplies.

[0072] One aspect of the present disclosure provides a voltage doubling circuit module, which includes: M circuit boards, each of which is provided with at least a portion of a plurality of electronic components in the voltage doubling circuit, wherein M is a positive integer greater than or equal to 3; and a conductive transition portion. The M circuit boards are surrounded to form a three-dimensional structure; and adjacent circuit boards among the M circuit boards are electrically connected via a conductive transition.

[0073] By designing the voltage doubler circuit module on multiple PCB boards and forming multiple PCB boards into a three-dimensional structure, the space occupied by the voltage doubler circuit module can be reduced. At the same time, the three-dimensional connection is more reliable and can withstand stronger mechanical stress when rotating. In addition, multiple PCB boards can be replaced and repaired individually without replacing the voltage doubler circuit module as a whole, which can save the cost of components and materials.

[0074] Figure 1 is a structural block diagram of a high voltage power supply according to an exemplary embodiment of the present disclosure, Figure 2 is an equivalent circuit diagram of a voltage doubling circuit module according to an exemplary embodiment of the present disclosure, Figure 3 is a schematic diagram of a charging process of a voltage doubling circuit module according to an exemplary embodiment of the present disclosure, Figure 4 is a schematic diagram of another charging process of a voltage doubling circuit module according to an exemplary embodiment of the present disclosure, Figure 5 is a schematic diagram of a discharge process of a voltage doubling circuit module according to an exemplary embodiment of the present disclosure.

[0075] For example, in the embodiments of the present disclosure, referring to Figure 1 , a high-voltage power supply 1000 is provided. The high-voltage power supply 1000 may include an AC power supply 100 and a voltage doubling circuit module 200. The voltage doubling circuit module 200 includes an AC signal input terminal Vac and a signal output terminal Vo. The AC power supply 100 is electrically connected to the AC signal input terminal Vac of the voltage doubling circuit module 200, and can provide a high-frequency AC voltage signal to the voltage doubling circuit module 200. The voltage doubling circuit module 200 can rectify and boost the received high-frequency AC voltage signal to obtain the DC high voltage required by the subsequent stage. In other words, the signal output terminal Vo of the voltage doubling circuit module 200 can output a DC high-voltage signal to the outside.

[0076] For example, refer to Figure 2 According to some exemplary embodiments of the present disclosure, the voltage doubling circuit module 200 may include N-stage voltage doubling units VMC, where N is greater than or equal to 1. For example, the N-stage voltage doubling units VMC may include a first-stage voltage doubling unit VMC 1 , the second stage voltage multiplier unit VMC 2 , ..., Nth level voltage multiplier unit VMC nEach voltage doubling unit can be electrically connected in parallel with the voltage doubling unit of the next level to form a multi-level voltage doubling unit. By increasing the number of N-level voltage doubling units VMC, the voltage value of the DC high voltage output by the voltage doubling circuit module 200 can be increased, thereby meeting application scenarios that require higher voltages.

[0077] Exemplarily, the voltage doubling circuit module 200 may further include a transformer T, and the transformer T may be located between the AC signal input terminal Vac and the N-stage voltage doubling unit VMC. For example, the transformer T may be a high-frequency transformer with a center tap. With such a design, the center point (e.g., the second node N2) of the input terminal of the N-stage voltage doubling unit VMC may be kept at a constant potential.

[0078] It should be noted that the "center tap" here refers to a termination form used in power transformers, mainly used in input windings and output windings. The center tap method is used in the input winding, which is to extract the midpoint of the input winding as the center point, and then form two branches by connecting this center point to the ground or other reference potential. These two branches can be connected to different power supply voltages respectively, so that the center point potential can be kept constant when the input voltage changes.

[0079] Exemplarily, the voltage doubler circuit module 200 may further include a load Ro. The load Ro may be a load with a relatively high withstand voltage, and the signal output terminal Vo of the voltage doubler circuit module 200 may be electrically connected to both ends of the load Ro. In other words, the voltage outputted by the signal output terminal Vo of the voltage doubler circuit module 200 may be equal to the voltage across both ends of the load Ro.

[0080] For example, each voltage multiplier unit may have the same circuit structure. 1 For example, the first-stage voltage multiplier unit VMC 1 The first capacitor C1_1, the second capacitor C2_1, the third capacitor C3_1, the first diode D1_1, the second diode D2_1, the third diode D3_1 and the fourth diode D4_1 may be included. For example, the first diode D1_1, the second diode D2_1, the third diode D3_1 and the fourth diode D4_1 may be diodes with a higher reverse peak voltage. The first capacitor C1_1, the second capacitor C2_1 and the third capacitor C3_1 may be capacitors with a higher withstand voltage.

[0081] Exemplarily, the first plate of the first capacitor C1_1, the cathode of the first diode D1_1, and the anode of the third diode D3_1 are all electrically connected to the first node N1.

[0082] Exemplarily, the anode of the first diode D1_1, the first plate of the second capacitor C2_1, and the anode of the second diode D2_1 are all electrically connected to the second node N2.

[0083] Exemplarily, the cathode of the third diode D3_1, the second plate of the second capacitor C2_1, and the cathode of the fourth diode D4_1 are all electrically connected to the third node N3.

[0084] Exemplarily, the cathode of the second diode D2_1, the anode of the fourth diode D4_1, and the first plate of the third capacitor C3_1 are all electrically connected to the fourth node N4.

[0085] Exemplarily, the second plate of the first capacitor C1_1 (eg Figure 2 As shown, the left plate of the first capacitor C1_1) and the second plate of the third capacitor C3_1 (as shown Figure 2 As shown, the left plate of the third capacitor C3_1 is electrically connected to the second node N2. For example, the second plate of the first capacitor C1_1 and the second plate of the third capacitor C3_1 can be electrically connected to the second node N2 through a transformer T.

[0086] It should be noted that, although the embodiment of the present disclosure shows that the voltage doubling circuit module includes N-level voltage doubling units VMC, each level of voltage doubling unit includes three capacitors and four diodes, the embodiment of the present disclosure is not limited thereto. In the embodiment of the present disclosure, the voltage doubling circuit module can adopt various voltage doubling circuit designs known in the art.

[0087] The following will be combined Figure 3-Figure 5 The working process of the voltage doubler circuit is briefly described.

[0088] For example, in one cycle, the working process of the voltage doubler circuit may include four processes, two of which are charging processes and two are discharging processes. The working process of the first-stage voltage doubler unit VMC1 will be taken as an example for description.

[0089] During the first charging process, refer to Figure 3 , the AC signal inputted by the AC signal input terminal Vac is in the positive half cycle, the current I1 flows through the first capacitor C1_1, the third diode D3_1 and the second capacitor C2_1 in sequence; and the current I2 flows through the second diode D2_1 and the third capacitor C3_1 in sequence. The current I1 and the current I2 can be currents of substantially equal magnitude and the same direction. This process can charge the first capacitor C1_1, the second capacitor C2_1 and the third capacitor C3_1.

[0090] In the second charging process, refer to Figure 4, the AC signal inputted by the AC signal input terminal Vac is in the negative half cycle, the current I3 flows through the first diode D1_1 and the first capacitor C1_1 in sequence; and the current I4 flows through the third capacitor C3_1, the fourth diode D4_1 and the second capacitor C2_1 in sequence. The current I3 and the current I4 can be currents of substantially equal magnitude and the same direction. This process can charge the first capacitor C1_1, the second capacitor C2_1 and the third capacitor C3_1.

[0091] For example, in conjunction with reference Figure 3 and Figure 4 , the current I1 and the current I4 can be currents of substantially equal magnitude and opposite directions. The charging direction of the first capacitor C1_1 in the positive half cycle is opposite to that in the negative half cycle, so the charges on the capacitor plate of the first capacitor C1_1 can offset or neutralize each other in the two charging processes (e.g., the first charging process and the second charging process), so that the accumulated voltage stored in the first capacitor C1_1 is small.

[0092] Similarly, the charging direction of the third capacitor C3_1 in the positive half cycle is opposite to that in the negative half cycle, so the charges on the capacitor plate of the third capacitor C3_1 can offset or neutralize each other in two charging processes (such as the first charging process and the second charging process), so that the accumulated voltage stored in the third capacitor C3_1 is smaller.

[0093] Continue to combine references Figure 3 and Figure 4 , the charging direction of the second capacitor C2_1 in the positive half cycle is the same as that in the negative half cycle. Figure 3 The intermediate current I1 flows into the second plate of the second capacitor C2_1 (the plate on the right side of the second capacitor C2_1 ), and then flows out from the first plate of the second capacitor C2_1 (the plate on the left side of the second capacitor C2_1 ). Figure 4 The current I4 flows into the second plate of the second capacitor C2_1 (the plate on the right side of the second capacitor C2_1), and then flows out from the first plate of the second capacitor C2_1 (the plate on the left side of the second capacitor C2_1). In other words, the charging direction of the second capacitor C2_1 in the positive half cycle is the same as that in the negative half cycle, so that the second capacitor C2_1 can store a higher voltage in a complete cycle.

[0094] Exemplarily, the charging process of each level of the N-level voltage multiplier unit VMC is substantially the same as the charging process of the first level voltage multiplier unit VMC1. Therefore, in a complete cycle, the second capacitor C2_1 and the capacitors C2_2, ..., and C2_n can all store a relatively high voltage.

[0095] Exemplarily, the two discharge processes of the voltage doubler circuit may correspond to the two charging processes respectively. That is, the two discharge processes of the voltage doubler circuit may correspond to the positive half cycle and the negative half cycle of the AC power supply respectively. Since the charging processes of the second capacitor C2_1 and the capacitors C2_2, ..., and C2_n in the positive half cycle and the negative half cycle of the AC power supply are substantially the same, the equivalent circuits of the two discharge processes of the voltage doubler circuit may be substantially the same. For example, referring to Figure 5 The discharge circuit of the voltage doubler circuit can be equivalent to: the second capacitor C2_1, capacitor C2_2, ..., capacitor C2_n are connected in series and then connected to the load Ro, providing a higher voltage output for the load Ro. By increasing the number of N-level voltage doubler units VMC, the voltage doubler circuit module can provide a higher DC voltage.

[0096] However, as the number of N-level voltage multiplier units VMC increases, the number of electronic components required for the voltage multiplier circuit module also increases accordingly, and the required wiring space also increases. When designing a voltage multiplier circuit module on a traditional single-board PCB, the required PCB board is large in size, which has obvious limitations on the size of the product. For example, the high-voltage power supply used in CT equipment includes a voltage multiplier circuit module. Usually, the CT equipment is a slip ring CT product. The high-voltage power supply and X-ray tube are installed on the slip ring and the detected object or human body is rotated through the bearing to perform a 360° tomographic scan. The computer algorithm is used to reconstruct the three-dimensional image and the two-dimensional image to determine whether there are drugs or explosives in the package, or whether there are fractures or illnesses in the human body. Due to the size limitation of the slip ring itself, the space left for the installation of the high-voltage power supply is small, and the high-voltage power supply has many components and the system is more complex. Therefore, each component inside the high-voltage power supply needs to maximize the use of space under the best possible conditions.

[0097] In order to reduce the space occupied by the voltage doubling circuit module and expand the application scope of the voltage doubling circuit module, an embodiment of the present disclosure provides a voltage doubling circuit module. The voltage doubling circuit module may include M circuit boards, each of which is provided with at least a part of a plurality of electronic components in the voltage doubling circuit, where M is a positive integer greater than or equal to 3; and a conductive transition part. The M circuit boards are surrounded to form a three-dimensional structure; and adjacent circuit boards among the M circuit boards are electrically connected through a conductive transition part.

[0098] By arranging multiple circuit boards into a three-dimensional structure, the internal space of the high-voltage power supply can be utilized to the maximum extent, and the three-dimensional connection is more reliable, and can withstand stronger mechanical stress when rotating. In addition, multiple circuit boards can be replaced and repaired individually, without the need to replace the voltage doubling circuit module as a whole, which can save the cost of components and materials.

[0099] Exemplarily, the M circuit boards may include three circuit boards, and the three circuit boards may form a triangular prism structure.

[0100] Exemplarily, the M circuit boards may include four circuit boards, and the four circuit boards may form a rectangular three-dimensional structure.

[0101] Exemplarily, the M circuit boards may include 5 circuit boards. The 5 circuit boards may form a rectangular three-dimensional structure or a pentagonal three-dimensional structure. Figure 6-Figure 9 They are schematic structural diagrams at different angles of a voltage doubling circuit module according to an exemplary embodiment of the present disclosure.

[0102] Exemplarily, the embodiments of the present disclosure are further described by taking M circuit boards forming a rectangular three-dimensional structure.

[0103] For example, in the embodiments of the present disclosure, in combination with reference Figure 6-Figure 9 The voltage doubling circuit module 200 may include: a first circuit board PCB1, a second circuit board PCB2, a third circuit board PCB3 and a fourth circuit board PCB4. The first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4 may be surrounded to form a three-dimensional structure, for example, the four sides of the three-dimensional structure include the first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4 respectively.

[0104] Exemplarily, the third circuit board PCB3 is arranged opposite to the first circuit board PCB1. The fourth circuit board PCB4 is arranged opposite to the second circuit board PCB2. The first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4 may be surrounded to form a rectangular parallelepiped structure.

[0105] By forming multiple circuit boards into a matrix structure, the size of the voltage doubling circuit module can be reduced. At the same time, the rectangular connection is more reliable and can withstand stronger mechanical stress when subjected to rotational force.

[0106] Exemplarily, the voltage doubling circuit module 200 may include a plurality of electronic components, for example, the voltage doubling circuit module 200 may include a plurality of resistors and a plurality of capacitors. The plurality of electronic components may be respectively arranged on the first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4, so that the number of electronic components that need to be arranged on each circuit board is much less than the number of overall electronic components. Therefore, the sizes of the first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4 can be designed to be smaller. Furthermore, by forming the voltage doubling circuit module of a matrix structure of the first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4, the overall size of the voltage doubling circuit module is smaller, and it can be better arranged in the high voltage power supply.

[0107] Exemplarily, a first part of electronic components of a voltage doubling circuit is arranged on the first circuit board PCB1, a second part of electronic components of a voltage doubling circuit is arranged on the second circuit board PCB2, a third part of electronic components of a voltage doubling circuit is arranged on the third circuit board PCB3, and a fourth part of electronic components of a voltage doubling circuit is arranged on the fourth circuit board PCB4. Each of the first part of electronic components, the second part of electronic components, the third part of electronic components, and the fourth part of electronic components may include multiple resistors and multiple capacitors, and may also include other types of electronic components, such as inductors.

[0108] It should be noted that the embodiments of the present disclosure do not limit the type and quantity of electronic components included in each of the first part of electronic components, the second part of electronic components, the third part of electronic components and the fourth part of electronic components.

[0109] For example, refer to Figure 6 , the voltage doubling circuit module 200 may further include a conductive adapter MT. For example, the conductive adapter MT may include a resistor. Adjacent circuit boards among the first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4 may be electrically connected through the conductive adapter MT. In other words, at least some of the electronic components among the first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4 may be electrically connected through the conductive adapter MT, so that the electronic components among the first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4 form an integrally electrically connected voltage doubling circuit.

[0110] Through such a design, the first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4 can form a voltage doubler circuit module of a rectangular structure, and the electrical connection channel structure between adjacent circuit boards is simple and can be flexibly installed and disassembled. When a voltage doubler circuit module fails, one or several circuit boards can be more conveniently inspected and replaced without replacing the voltage doubler circuit module as a whole, which can save the cost of components and materials.

[0111] Exemplarily, the first circuit board PCB1 and the third circuit board PCB3 are substantially the same in shape and size. And / or, the second circuit board PCB2 and the fourth circuit board PCB4 are substantially the same in shape and size. With such a design, the rectangular structure formed by the first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4 can be more securely connected and can withstand stronger mechanical stress when subjected to rotational force.

[0112] Exemplarily, adjacent circuit boards may be fixedly connected by means of snap-fitting, gluing or welding.

[0113] Exemplarily, the first circuit board PCB1 has a first length L1 in the first direction X, and the second circuit board PCB2 has a second length L2 in the first direction X, and the first length L1 is greater than the second length L2. The first direction X is parallel to the extension direction of the long side PCB11 of the first circuit board PCB1. Alternatively, the first direction X is perpendicular to the extension direction of the short side PCB12 of the first circuit board PCB1.

[0114] Exemplarily, the first circuit board PCB1 includes a first protrusion PCB10 protruding in the first direction X relative to the second circuit board PCB2 and the fourth circuit board PCB4 . The third circuit board PCB3 includes a third protrusion PCB30 protruding in the first direction X relative to the second circuit board PCB2 and the fourth circuit board PCB4 .

[0115] For example, continue to refer to Figure 6 The voltage doubling circuit module 200 may further include a fifth circuit board PCB5. The fifth circuit board PCB5 is located between the first protrusion PCB10 and the third protrusion PCB30. One end of the fifth circuit board PCB5 is fixedly connected to the first protrusion PCB10, and the other end of the fifth circuit board PCB5 is fixedly connected to the third protrusion PCB30.

[0116] Exemplarily, the fifth circuit board PCB5 and the second circuit board PCB2 are arranged at intervals, and the fifth circuit board PCB5 and the fourth circuit board PCB4 are arranged at intervals.

[0117] For example, in conjunction with reference Figure 2 and Figure 6 , the signal output terminal Vo is located on the fifth circuit board PCB5. For example, the load Ro is located on the fifth circuit board PCB5, and the signal output terminal Vo electrically connected to both ends of the load Ro is also located on the fifth circuit board PCB5.

[0118] Through such a design, the signal output terminal Vo of the voltage doubling circuit module can be located on a separate circuit board (for example, the fifth circuit board PCB5), which can improve the stability of the signal output terminal Vo. The second circuit board PCB2 and the fourth circuit board PCB4 are both spaced apart from the fifth circuit board PCB5, which can reduce the influence of the electromagnetic field in the second circuit board PCB2 and the fourth circuit board PCB4 on the fifth circuit board PCB5, and further improve the stability of the signal output terminal Vo.

[0119] Under different usage conditions of the circuit board, the insulating material around the conductor may be charged due to the polarization of the insulating material. The radius of this charged area is called the creepage distance. Alternatively, the distance of discharge along the insulating surface is called the creepage distance. When there are high-voltage devices and low-voltage devices on the PCB, it is usually necessary to isolate the two parts so that the spacing between the two parts is greater than the creepage distance, so as to prevent the electronic components from being disturbed or damaged by the creepage current and affect the normal operation of the circuit.

[0120] For example, in conjunction with reference Figure 6 and Figure 7 At least one of the second circuit board PCB2 and the fourth circuit board PCB4 includes a plurality of first slots VH1 distributed at intervals.

[0121] In some embodiments, there may be a large voltage difference between a partial area of ​​the first circuit board PCB1 and a partial area of ​​the third circuit board PCB3, for example, the voltage of a partial edge area of ​​the first circuit board PCB1 is greater than the voltage of a partial edge area of ​​the third circuit board PCB3. One or more first slots VH1 are provided in partial areas of the second circuit board PCB2 and the fourth circuit board PCB4. Since the insulation performance of air is better than the insulation performance of the plate material of the PCB board, the insulation or isolation effect between the first circuit board PCB1 and the third circuit board PCB3 can be improved by designing a plurality of first slots VH1. For example, it can be avoided that the edge discharge of the first circuit board PCB1 flows into the third circuit board PCB3 through the second circuit board PCB2 or the fourth circuit board PCB4, causing the electronic components on the third circuit board PCB3 to be disturbed or damaged.

[0122] For example, the shape of the first slot VH1 may be a rectangle or a square, etc. A plurality of first slots VH1 may be distributed along the first direction X at intervals.

[0123] Through such a design, mutual interference between multiple circuit boards can be reduced, which is beneficial to improving the stability of the voltage doubling circuit module.

[0124] For example, refer to Figure 7 A second slot VH2 may be provided on one or more of the first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4. The shape and number of the second slot VH2 may be set according to specific requirements.

[0125] Exemplarily, the second slot VH2 may be in the shape of a straight slot or a curved slot. The second slot VH2 may be used to isolate electronic components on the same circuit board, reduce interference between electronic components on the same circuit board, and improve the stability of the voltage doubling circuit module.

[0126] For example, continue to refer to Figure 7 , a plurality of first slots VH1 and a plurality of second slots VH2 in the second circuit board PCB2 and / or the fourth circuit board PCB4 can be designed in combination, so as to improve the electrical isolation effect of the first circuit board PCB1 and the third circuit board PCB3. For example, at least one second slot VH2 can be provided below the spacing area between two adjacent first slots VH1 in the fourth circuit board PCB4. The length d2 of the second slot VH2 is greater than the spacing distance d1 between the two adjacent first slots VH1 above the second slot VH2.

[0127] Through such a design, the isolation distance between the first circuit board PCB1 and the third circuit board PCB3 can be increased (for example, the discharge current generated by the first circuit board PCB1 needs to flow through a longer distance to reach the third circuit board PCB3), thereby avoiding discharge interference between the first circuit board PCB1 and the third circuit board PCB3 and improving the stability of the voltage doubling circuit module.

[0128] Exemplarily, multiple second slots VH2 can be designed in multiple rows, and multiple second slots VH2 in adjacent rows can be designed in a staggered manner. For example, the orthographic projection of the second slots VH2 in the upper row on the third circuit board PCB3 at least partially overlaps with the orthographic projection of the second slots VH2 in the adjacent lower row on the third circuit board PCB3.

[0129] Through such a design, the isolation effect of the second circuit board PCB2 and / or the fourth circuit board PCB4 can be further improved, and the stability of the voltage doubling circuit module can be improved.

[0130] For example, refer to Figure 8 The second circuit board PCB2 includes a first side surface PCB21 connected to the first circuit board PCB1, and the first side surface PCB21 is covered by the first circuit board PCB1.

[0131] Exemplarily, the second circuit board PCB2 includes a second side surface PCB22 connected to the third circuit board PCB3 , and the second side surface PCB22 is covered by the third circuit board PCB3 .

[0132] In the embodiment of the present disclosure, the two sides of the second circuit board PCB2 (for example, the first side PCB21 and the second side PCB22) are respectively wrapped and covered by the first circuit board PCB1 and the third circuit board PCB3, which can avoid excessive charge accumulation on the two sides of the second circuit board PCB2, thereby reducing the probability of edge discharge of the second circuit board PCB2. Through such a design, the interference of the second circuit board PCB2 to other circuit boards can be reduced, which is conducive to improving the stability of the voltage doubling circuit module.

[0133] For example, refer to Fig. 9 The fourth circuit board PCB4 includes a third side surface PCB41 connected to the first circuit board PCB1, and the third side surface PCB41 is covered by the first circuit board PCB1.

[0134] Exemplarily, the fourth circuit board PCB4 includes a fourth side surface PCB42 connected to the third circuit board PCB3 , and the fourth side surface PCB4 is covered by the third circuit board PCB3 .

[0135] In the embodiment of the present disclosure, two sides of the fourth circuit board PCB4 (for example, the third side PCB41 and the fourth side PCB42) are respectively wrapped and covered by the first circuit board PCB1 and the third circuit board PCB3, which can avoid excessive charge accumulation on the two sides of the fourth circuit board PCB4, thereby reducing the probability of edge discharge of the fourth circuit board PCB4. Through such a design, the interference of the fourth circuit board PCB4 to other circuit boards can be reduced, which is conducive to improving the stability of the voltage doubling circuit module.

[0136] Exemplarily, the first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3 and the fourth circuit board PCB4 are each aligned and arranged away from one end of the fifth circuit board PCB5. Figure 8 The first circuit board PCB1 includes a side PCB14 away from the fifth circuit board PCB5, the second circuit board PCB2 includes a side PCB24 away from the fifth circuit board PCB5, the third circuit board PCB3 includes a side PCB34 away from the fifth circuit board PCB5, and the fourth circuit board PCB2 includes a side PCB44 away from the fifth circuit board PCB5. The side PCB14 of the first circuit board PCB1, the side PCB24 of the second circuit board PCB2, the side PCB34 of the third circuit board PCB3, and the side PCB44 of the fourth circuit board PCB4 are aligned.

[0137] Through such a design, on the one hand, the space occupied by multiple circuit boards can be reduced and the space utilization rate can be improved. On the other hand, the area of ​​the protruding edges of the circuit boards can be reduced, reducing the probability of edge discharge, thereby improving the stability of the voltage doubling circuit module.

[0138] For example, in conjunction with reference Figure 8 and Fig. 9 The fifth circuit board PCB5 includes four voltage balancing units PCB50 , and the four voltage balancing units PCB50 can be located in four corner areas of the fifth circuit board PCB5 .

[0139] Exemplarily, the material of the voltage balancing unit PCB50 may include copper. For example, the voltage balancing unit PCB50 may include four cubic copper blocks arranged in the four corner areas of the fifth circuit board PCB5. For example, the four voltage balancing units PCB50 may be electrically connected via resistors. By adjusting the size and position of the voltage balancing unit PCB50, the electric field distribution on the fifth circuit board PCB5 may be adjusted. For example, the voltage balancing units PCB50 in the four corner areas may be at the same potential, so that the voltage outputted by the signal output terminal Vo on the fifth circuit board PCB5 is more uniform, thereby improving the reliability of the voltage doubling circuit module.

[0140] For example, return to reference Figure 7 , the first circuit board PCB1, the second circuit board PCB2, the third circuit board PCB3, the fourth circuit board PCB4 and the fifth circuit board PCB5 can form a first accommodation space AS1. At least a portion of the multiple electronic components in the voltage doubling circuit module 200 can be located in the first accommodation space AS1. For example, at least a portion of the first part of the electronic components on the first circuit board PCB1 can be located in the first accommodation space AS1. At least a portion of the second part of the electronic components on the second circuit board PCB2 can be located in the first accommodation space AS1. At least a portion of the third part of the electronic components on the third circuit board PCB3 can be located in the first accommodation space AS1. At least a portion of the fourth part of the electronic components on the fourth circuit board PCB4 can be located in the first accommodation space AS1. Some of the electronic components on the fifth circuit board PCB5 can be located in the first accommodation space AS1, for example, the voltage equalizing unit PCB50 can be located in the first accommodation space AS1.

[0141] Through such a design, the internal space of the matrix structure circuit board can be flexibly utilized to reduce the size of the voltage doubling circuit module.

[0142] For example, in the embodiment of the present disclosure, at least a portion of the electronic components in the voltage doubling circuit module may be disposed on a surface of the circuit board that is away from the first accommodation space AS1. Figure 7 A plurality of resistors R1 are disposed on a surface of the first circuit board PCB1 on a side away from the first accommodation space AS1. For example, the plurality of resistors R1 may include chip resistors. The plurality of resistors R1 may be distributed along the first direction X at intervals.

[0143] Through such a design, the electronic components in the voltage doubler circuit module can be arranged more flexibly.

[0144] Fig.10 is a schematic structural diagram of a voltage doubling circuit module according to an exemplary embodiment of the present disclosure.

[0145] For example, in the embodiments of the present disclosure, referring to Fig.10The M circuit boards may include: a first circuit board PCB1, a second circuit board PCB2 and a third circuit board PCB3.

[0146] The first circuit board PCB1 is provided with a first part of electronic components of the voltage doubling circuit; the second circuit board PCB2 is provided with a second part of electronic components of the voltage doubling circuit; and the third circuit board PCB3 is provided with a third part of electronic components of the voltage doubling circuit.

[0147] Exemplarily, the first circuit board PCB1, the second circuit board PCB2 and the third circuit board PCB3 surround to form a three-dimensional structure, such as a triangular prism structure. The three rectangular sides of the triangular prism structure respectively include the first circuit board PCB1, the second circuit board PCB2 and the third circuit board PCB3.

[0148] Exemplarily, adjacent circuit boards among the first circuit board PCB1, the second circuit board PCB2 and the third circuit board PCB3 are electrically connected via a conductive adapter.

[0149] By arranging multiple circuit boards into a three-dimensional structure, the internal space of the high-voltage power supply can be utilized to the maximum extent, and the three-dimensional connection is more reliable, and can withstand stronger mechanical stress when rotating. In addition, multiple circuit boards can be replaced and repaired individually, without the need to replace the voltage doubling circuit module as a whole, which can save the cost of components and materials.

[0150] It should be noted that although the embodiments of the present disclosure show that the three-dimensional structure composed of multiple circuit boards includes a triangular prism three-dimensional structure and a rectangular three-dimensional structure, the embodiments of the present disclosure are not limited thereto. In the embodiments of the present disclosure, the three-dimensional shape composed of multiple circuit boards can be specifically designed according to the actual layout space.

[0151] For example, return to reference Figure 1 The embodiment of the present disclosure also provides a high voltage power supply 1000. The high voltage power supply 1000 may include the voltage doubling circuit module 200 provided in any of the above embodiments. It should be understood that the high voltage power supply 1000 has the same beneficial effects as the voltage doubling circuit module 200 provided in the above embodiments.

[0152] Fig.11A is a schematic structural diagram of a CT device according to an exemplary embodiment of the present disclosure, Fig. 11B yes Fig.11A A side view of a CT device is shown.

[0153] Combined with reference Fig.11A and Fig. 11BAccording to an exemplary embodiment of the present disclosure, a CT device 10 includes: a conveying device 17 for conveying an object to be inspected in a conveying direction V; a slip ring 12 capable of rotating around a rotation axis, and the rotation axis can be substantially parallel to the conveying direction V; a radiation source 11 connected to the slip ring 12; a detection device 16 opposite to the radiation source 11 and connected to the slip ring 12, and the detection device 16 and the radiation source 11 can rotate together with the slip ring 12; a control device 18 for controlling the operation of the CT device 10; and a data processing device 15 for processing data detected by the detection device 16.

[0154] In the embodiment of the present disclosure, the ray source 11 can emit X-rays, that is, the ray source 11 can be an X-ray generator. For example, the ray source 11 can be an X-ray tube (also called an X-ray tube). For example, the ray source 11 can be installed on the slip ring 12 and can rotate with the slip ring 12.

[0155] It should be noted that although Fig.11A and Fig. 11B The CT device shown in the figure is a CT device for inspecting luggage or articles, but the figure is only for illustration. The CT device according to the embodiment of the present disclosure is not limited to a CT device for inspecting luggage or articles, for example, it can also be a CT device for inspecting the human body.

[0156] Fig. 12A is a schematic structural diagram of an X-ray generator according to an exemplary embodiment of the present disclosure, Fig. 12B is a schematic diagram schematically illustrating a principle of generating X-rays by an X-ray generator according to an exemplary embodiment of the present disclosure.

[0157] Combined with reference Fig. 12A and Fig. 12B The X-ray generator 20 according to the exemplary embodiment of the present disclosure may include a tube shell 21 , the interior of the tube shell 21 is vacuum; and an anode 22 and a cathode 24 disposed in the tube shell 21 .

[0158] For example, the tube shell 21 may be a glass shell, which is used to fix and support the anode 22 and the cathode 24 and maintain the vacuum degree in the tube. The tube shell 21 may be made of molybdenum-group hard glass with high melting point, high insulation strength and small expansion coefficient. Since the expansion coefficients of the molybdenum-group glass shell and the metals of the cathode and anode are different, the two are not suitable for direct welding. Therefore, an alloy ring containing about 54% iron, about 29% nickel and about 17% cobalt may be inlaid on the copper body as an intermediate transition body, and then the glass shell is welded on the alloy ring, so that the expansion coefficients of the alloy ring and the hard glass are close to each other, so as to avoid cracks or breakages in the glass at the joint due to temperature changes.

[0159] In order to prevent the gas discharge in the tube shell 21 and ensure that the electrons emitted by the cathode 24 can fly to the anode 22 unimpeded and at high speed, the vacuum degree in the tube shell 21 should be maintained at 133.3×10 -7 In addition, all parts installed in the tube shell 21 are strictly cleaned, degreased and thoroughly degassed, for example, high-frequency vacuum heating and degassing can be used.

[0160] The main function of the anode 22 is to block the high-speed electron flow EB and generate X-rays XB, and at the same time radiate or conduct away the heat generated during exposure. In addition, the anode 22 can also absorb secondary electrons and scattered rays. In the embodiment of the present disclosure, the anode 22 can be a fixed anode or a rotating anode. Fig. 12A In the illustrated embodiment, the schematic diagram shows that the anode 22 is a rotating anode.

[0161] Reference Fig. 12A The anode 22 may include a target plate 221 and a target surface 222. The X-ray generator 20 may also include a driving mechanism 25 for driving the anode 22 to rotate. For example, the driving mechanism 25 may include a rotor 251, a stator 252, a rotating shaft 253, a bearing 254 and a bracket 255.

[0162] For example, the target disk 221 can be a single convex disk, the center of which is fixed on the rotating shaft 253, and the other end of the rotating shaft 253 is connected to the rotor 251. The target surface 222 has a certain target angle α (refer to Figure 12), for example, the target angle α can be between 6° and 17.5°. For example, a rhenium-tungsten alloy (for example, containing 10% to 20% rhenium) can be used to make the target surface 222, and molybdenum or graphite can be used to make the target disk 221. In this way, the target surface of the rhenium-tungsten alloy has fine grains, high thermal expansion resistance, and high recrystallization temperature, thereby reducing or even eliminating the defects such as cracking and roughness of the target surface. Compared with metal tungsten, molybdenum and graphite have large heat capacity, good heat dissipation rate and small mass. In this way, the formed target disk 221 has the advantages of large heat capacity, good heat dissipation effect and light mass, which effectively improves the continuous load capacity of the X-ray generator 20.

[0163] The rotor 251 is connected to the target plate 221 and the target surface 222 through the molybdenum rod 256. When the rotor 251 rotates, the target plate 221 and the target surface 222 rotate accordingly. In an X-ray tube using a rotating anode, the rotor 251 is installed in the tube shell 21, the stator 252 is installed outside the tube shell 21, a bearing 254 is installed at each end of the rotating shaft 253, and the rotor 251, the stator 252, the rotating shaft 253 and the bearing 254 are supported by a bracket 255.

[0164] The main function of the cathode 24 is to emit an electron beam and focus the electron beam so that the electron beam bombarding the target surface has a certain size and shape. The cathode 24 may include a filament 241. For example, the filament 241 may be made of tungsten, because tungsten has certain electron emission capabilities at high temperatures, a high melting point, good ductility, is easy to draw, has good tensile strength, and is not easily deformed under a strong electric field. The filament 241 may be wound into a small solenoid shape. For example, the filament voltage may be AC ​​5 to 10 V / 50 Hz, and the filament current may be 2 to 9 A. After the filament 241 is powered on, the temperature gradually rises, and electrons begin to be emitted after reaching a certain temperature (about 2100 K).

[0165] When a high voltage is applied between the anode 22 and the cathode 24 and a certain voltage is applied to both ends of the filament 241, a large number of free electrons are emitted from the cathode 24, which will collide with the rotating target surface 222. After the energy carried by the high-speed electron beam EB is sharply blocked, part of it is lost in the form of heat energy, and the other effective part will produce X-rays XB.

[0166] Fig.13A is a schematic diagram of a power supply method of an X-ray generator according to an exemplary embodiment of the present disclosure, which schematically shows a single power supply method. Fig. 13B is a schematic diagram of a power supply method of an X-ray generator according to an exemplary embodiment of the present disclosure, which schematically shows a dual power supply method.

[0167] Combined with reference Fig.13A and Fig. 13B According to an exemplary embodiment of the present disclosure, the power supply 30 of the X-ray generator may include a high voltage power supply 1000 and a filament power supply 32 , wherein the high voltage power supply 1000 is used to apply a high voltage to the anode 22 and the cathode 24 , and the filament power supply 32 is used to provide current to the filament 241 .

[0168] exist Fig.13A In the embodiment shown, the high voltage power supply 1000 and the filament power supply 32 can be closed-loop controlled by a control system, and the control circuit is relatively simple.

[0169] exist Fig. 13B In the embodiment shown, a dual power supply mode of positive and negative high voltage power supplies is adopted, which makes it easier to obtain high voltage, and the withstand voltage strength of the device and the volume of the power supply can be reduced.

[0170] According to the working principle of the X-ray tube, a sufficiently high voltage, i.e., a sufficient electric field strength, is required between the anode 22 (corresponding to the target) and the cathode 24 (corresponding to the filament) to make the electrons of the filament hit the target at high energy and high speed. Therefore, the voltage provided by the high-voltage power supply 1000 needs to be sufficiently high. For example, the voltage provided by the high-voltage power supply 1000 can be tens to hundreds of kilovolts (KV). The filament power supply 32 supplies the filament 241 with a low voltage power supply, whose voltage amplitude can be tens of volts (V) and power is tens of watts (W).

[0171] The negative electrode of the filament power supply 32 is electrically connected to the negative electrode of the high voltage power supply 1000, so that the filament 241 of the entire X-ray tube is at a negative high voltage potential. Therefore, the high voltage insulation requirements for the filament power supply 32 are extremely high. In other words, the voltage at the high potential end inside the power supply 30 of the X-ray generator 20 is relatively high, and the withstand voltage and insulation requirements of the device are extremely high.

[0172] In the embodiment of the present disclosure, a filament transformer 40 may be added between the high voltage power supply 1000 and the filament power supply 32 to achieve isolation.

[0173] Due to the size limitation of the slip ring itself, the space left for the installation of the X-ray generator is relatively small, so the various subcomponents inside the X-ray generator need to maximize the effective use of space. In the embodiment of the present disclosure, a plurality of circuit boards are used to form a voltage doubler circuit module with a matrix structure, and then a high-voltage power supply is formed by using the voltage doubler circuit module. When the high-voltage power supply is applied to the X-ray generator and CT equipment, it has at least one of the following advantages: (1) The matrix structure composed of multiple PCB boards effectively reduces the overall width of the voltage doubler circuit module, thereby driving the reduction of the overall size of the high-voltage power supply, which is more conducive to assembly in products such as slip ring CT equipment; (2) The rectangular connection is more reliable and can withstand stronger mechanical stress when subjected to rotational force; during vibration testing and transportation, the probability of damage is effectively reduced; (3) The PCB board circuit is modularized, and the single board can be replaced and repaired to avoid overall scrapping, which can save the cost of components and materials.

[0174] It should be noted that, in the embodiment of the present disclosure, the control device 18 and the data processing device 15 can be independent electronic devices respectively. For example, the control device 18 can be a first electronic device for controlling the CT device, and the data processing device 15 can be a second electronic device for realizing the data processing function of the CT device. The first electronic device and the second electronic device can be separate. Optionally, in the embodiment of the present disclosure, the control device 18 and the data processing device 15 can be integrated electronic devices. For example, the CT device can include an electronic device that realizes both the function of controlling the CT device and the data processing function of the CT device.

[0175] Fig.14 A block diagram of an electronic device suitable for implementing a function of controlling a CT device and / or a data processing function of a CT device according to an embodiment of the present disclosure is schematically shown.

[0176] like Fig.14 As shown, the electronic device 1100 according to an embodiment of the present disclosure includes a processor 1101, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1102 or a program loaded from a storage part 1108 to a random access memory (RAM) 1103. The processor 1101 may include, for example, a general-purpose microprocessor (such as a CPU), an instruction set processor and / or a related chipset and / or a special-purpose microprocessor (for example, an application-specific integrated circuit (ASIC)), etc. The processor 1101 may also include an onboard memory for caching purposes. The processor 1101 may include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of the present disclosure.

[0177] In RAM 1103, various programs and data required for the operation of electronic device 1100 are stored. Processor 1101, ROM 1102 and RAM 1103 are connected to each other through bus 1104. Processor 1101 performs various operations of the method flow according to the embodiment of the present disclosure by executing the program in ROM 1102 and / or RAM 1103. It should be noted that the program can also be stored in one or more memories other than ROM 1102 and RAM 1103. Processor 1101 can also perform various operations of the method flow according to the embodiment of the present disclosure by executing the program stored in one or more memories.

[0178] According to an embodiment of the present disclosure, the electronic device 1100 may further include an input / output (I / O) interface 1105, which is also connected to the bus 1104. The electronic device 1100 may further include one or more of the following components connected to the I / O interface 1105: an input portion 1106 including a keyboard, a mouse, etc.; an output portion 1107 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage portion 1108 including a hard disk, etc.; and a communication portion 1109 including a network interface card such as a LAN card, a modem, etc. The communication portion 1109 performs communication processing via a network such as the Internet. A drive 1110 is also connected to the I / O interface 1105 as needed. A removable medium 1111, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 1110 as needed, so that a computer program read therefrom is installed into the storage portion 1108 as needed.

[0179] Those skilled in the art can understand that the embodiments described above are exemplary and can be improved by those skilled in the art. The structures described in various embodiments can be freely combined without causing conflicts in structure or principle.

[0180] After describing the preferred embodiments of the present disclosure in detail, those skilled in the art can clearly understand that various changes and modifications can be made without departing from the scope and spirit of the appended claims, and the present disclosure is not limited to the implementation methods of the exemplary embodiments listed in the specification.

Claims

1. A voltage doubling circuit module, characterized in that: include: M circuit boards, each of which is provided with at least a portion of a plurality of electronic components in the voltage doubling circuit, wherein M is a positive integer greater than or equal to 3; and Conductive transfer part, Wherein, the M circuit boards are surrounded to form a three-dimensional structure; and Adjacent circuit boards among the M circuit boards are electrically connected via the conductive adapter.

2. The voltage doubling circuit module according to claim 1, wherein: The M circuit boards include: A first circuit board, on which a first part of electronic components of a voltage doubling circuit is arranged; a second circuit board, on which a second portion of electronic components of the voltage doubling circuit are disposed; A third circuit board, on which a third part of electronic components of the voltage doubling circuit is arranged, and the third circuit board is arranged opposite to the first circuit board; and a fourth circuit board, on which a fourth part of electronic components of the voltage doubling circuit is arranged, and the fourth circuit board is arranged opposite to the second circuit board; Wherein, the first circuit board, the second circuit board, the third circuit board and the fourth circuit board are surrounded to form a three-dimensional structure, and four sides of the three-dimensional structure respectively include the first circuit board, the second circuit board, the third circuit board and the fourth circuit board; and Adjacent circuit boards among the first circuit board, the second circuit board, the third circuit board and the fourth circuit board are electrically connected via the conductive adapter.

3. The voltage doubling circuit module according to claim 2, wherein: The first circuit board, the second circuit board, the third circuit board and the fourth circuit board are surrounded to form a rectangular parallelepiped structure.

4. The voltage doubling circuit module according to claim 3, wherein: The first circuit board has a first length in a first direction, and the second circuit board has a second length in the first direction, and the first length is greater than the second length.

5. The voltage doubling circuit module according to claim 4, wherein: At least one of the second circuit board and the fourth circuit board includes a plurality of first slots distributed at intervals.

6. The voltage doubling circuit module according to claim 2 or 3, wherein: The second circuit board comprises a first side surface connected to the first circuit board, and the first side surface is covered by the first circuit board; and / or, The second circuit board includes a second side surface connected to the third circuit board, and the second side surface is covered by the third circuit board; and / or, The fourth circuit board comprises a third side surface connected to the first circuit board, and the third side surface is covered by the first circuit board; and / or, The fourth circuit board includes a fourth side surface connected to the third circuit board, and the fourth side surface is covered by the third circuit board.

7. The voltage doubling circuit module according to claim 4, wherein: The first circuit board includes a first protrusion that protrudes in a first direction relative to the second circuit board and the fourth circuit board, and the third circuit board includes a third protrusion that protrudes in the first direction relative to the second circuit board and the fourth circuit board; The voltage doubler circuit module further includes a fifth circuit board, wherein the fifth circuit board is located between the first protrusion and the third protrusion; and One end of the fifth circuit board is fixedly connected to the first protrusion, and the other end of the fifth circuit board is fixedly connected to the third protrusion.

8. The voltage doubling circuit module according to claim 7, wherein: The fifth circuit board includes four voltage balancing units, and the four voltage balancing units are located at four corner areas of the fifth circuit board.

9. The voltage doubling circuit module according to claim 8, wherein: The material of the voltage balancing unit includes copper.

10. The voltage doubling circuit module according to any one of claims 2 to 9, wherein: The first circuit board and the third circuit board have substantially the same shape and size; and / or, The second circuit board and the fourth circuit board have substantially the same shape and size.

11. The voltage doubling circuit module according to claim 7, wherein: The fifth circuit board and the second circuit board are arranged at intervals; and The fifth circuit board and the fourth circuit board are arranged at an interval.

12. The voltage doubling circuit module according to claim 7, wherein: The first circuit board, the second circuit board, the third circuit board and the fourth circuit board are each aligned and arranged away from one end of the fifth circuit board.

13. The voltage doubling circuit module according to claim 12, wherein: The first circuit board, the second circuit board, the third circuit board, the fourth circuit board and the fifth circuit board form a first accommodating space, and at least a portion of the plurality of electronic components in the voltage doubling circuit module are located in the first accommodating space.

14. The voltage doubling circuit module according to claim 7, wherein: The voltage doubling circuit module includes an AC signal input terminal, an N-stage voltage doubling unit and a signal output terminal, and the signal output terminal is located on the fifth circuit board, wherein N is a positive integer greater than or equal to 1.

15. The voltage doubling circuit module according to claim 1, wherein: The M circuit boards include: A first circuit board, on which a first part of electronic components of a voltage doubling circuit is arranged; a second circuit board, on which a second portion of electronic components of the voltage doubling circuit are disposed; and A third circuit board, on which a third part of electronic components of the voltage doubling circuit is arranged; Wherein, the first circuit board, the second circuit board and the third circuit board surround to form a three-dimensional structure, and three sides of the three-dimensional structure include the first circuit board, the second circuit board and the third circuit board respectively; and Adjacent circuit boards among the first circuit board, the second circuit board and the third circuit board are electrically connected via the conductive adapter.

16. A high voltage power supply, characterized in that: The high voltage power supply comprises a voltage doubling circuit module as described in any one of claims 1-15.

17. An X-ray generator, characterized in that: The X-ray generator comprises: A tube shell, wherein the interior of the tube shell is vacuum; An anode and a cathode disposed in the tube shell; and The high voltage power supply as claimed in claim 16, wherein the high voltage power supply is used to provide a high voltage between the anode and the cathode.

18. A CT device, characterized in that: The CT apparatus comprises the X-ray generator according to claim 17.

19. The CT device according to claim 18, wherein: The CT device further comprises a rotatable slip ring, and the X-ray generator is connected to the slip ring and can rotate together with the slip ring.

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