Bonding structure for quartz crystal wafer and base of subminiature resonator

Abstract

The invention discloses a subminiature resonator quartz crystal wafer and base bonding structure, and relates to a quartz crystal resonator. The crystal oscillator is especially a vehicle-mounted ultra-small crystal oscillator product. Comprising a base and a quartz crystal wafer fixed on the base, a chromium-plated surface layer and an electrode surface layer are plated on the surface of the quartz crystal wafer, and the quartz crystal wafer is adhered to a wafer platform of the base through a conductive silver adhesive; a plurality of concave areas are arranged on a chromium-plated surface layer and an electrode surface layer on the quartz crystal wafer in a bonding area where the quartz crystal wafer is bonded with the conductive silver adhesive, and the concave areas penetrate through the chromium-plated surface layer and the electrode surface layer; and the conductive silver adhesive can be immersed in the concave area. Therefore, the reinforced bonding of the quartz crystal wafer and the base is realized, and the quartz crystal wafer is prevented from loosening or falling off.

Description

Technical Field

[0001] The invention discloses a bonding structure of a quartz crystal plate and a base of a super-small resonator, and relates to a quartz crystal resonator, and in particular to a super-small crystal oscillator product for vehicle use. Background Art

[0002] Since the vibration frequency and vibration intensity of the vehicle body are very high during the movement of high-speed moving vehicles, the ultra-small crystal oscillator products for vehicles have high requirements for the resistance of quartz crystal pieces to falling or vibration. The quartz crystal pieces of the existing quartz crystal resonators are directly bonded to the chip platform of the resonator ceramic base through conductive silver glue. When used in high-speed moving vehicles, the quartz crystal pieces often become loose or even fall off the chip platform of the ceramic base, which greatly affects the safety of product use.

[0003] To this end, someone invented the method of using laser to punch holes in the quartz crystal sheet. When using conductive silver glue for bonding, the conductive silver glue will enter the holes of the quartz crystal sheet, thereby ensuring that the quartz crystal sheet is better fixed on the chip platform of the ceramic base. For example, the technical solution named "A New Type of Quartz Wafer" and patent number 201711434645.6 disclosed in the Chinese patent document has the following defects:

[0004] 1. Drilling holes in the quartz crystal changes the stress distribution balance of the quartz crystal, which will affect the vibration of the quartz crystal, and therefore have a significant impact on the product quality of the resonator.

[0005] 2. Since the car-mounted crystal oscillator products used are ultra-small (1.6*1.2mm), the quartz crystal sheets used are very thin. After punching holes in the quartz crystal sheet, the quartz crystal sheet will easily crack at the punching point when it encounters vibration during use, affecting the vibration of the quartz crystal sheet and even causing the quartz crystal sheet to separate from the conductive silver glue.

[0006] 3. The existing technology uses laser to punch holes in quartz crystal sheets. This adds another step to the manufacture of the resonator, reducing work efficiency. At the same time, it is necessary to increase laser equipment and equip skilled workers, which greatly increases product costs. Summary of the invention

[0007] The technical problem to be solved by the present invention is to overcome the defects of the above-mentioned prior art. Without destroying the main structure of the quartz crystal piece, the conductive silver glue is allowed to enter the chrome-plated surface layer and the electrode surface layer, thereby achieving enhanced bonding between the quartz crystal piece and the base, preventing the quartz crystal piece from loosening or falling off, and improving the product quality of the ultra-small quartz crystal resonator.

[0008] The technical solution of the present invention is a bonding structure of an ultra-small resonator quartz crystal piece and a base, comprising a base and a quartz crystal piece fixed on the base, the surface of the quartz crystal piece being plated with a chrome-plated surface layer and an electrode surface layer, and the quartz crystal piece being bonded to a wafer platform of the base by means of a conductive silver glue; it is characterized in that in a bonding area where the quartz crystal piece and the conductive silver glue are bonded, the chrome-plated surface layer and the electrode surface layer on the quartz crystal piece have several concave areas, and the concave areas penetrate the chrome-plated surface layer and the electrode surface layer; the conductive silver glue can be immersed in the concave areas.

[0009] In the above-mentioned ultra-small resonator quartz crystal plate and base bonding structure, the concave area is a groove, and several grooves in the bonding area are cross-distributed.

[0010] In the above-mentioned ultra-small resonator quartz crystal plate and base bonding structure, the plurality of grooves are regularly and evenly distributed.

[0011] In the above-mentioned ultra-small resonator quartz crystal plate and base bonding structure, before the quartz crystal plate is plated, a mesh screen is fixed in the bonding area, and then the quartz crystal plate is placed in a fixture for chrome plating and electrode plating to form a chrome-plated surface layer and an electrode surface layer, and then the fixture is removed, and the mesh screen is removed from the quartz crystal plate, forming a plurality of grooves that are regularly and evenly distributed in the bonding area.

[0012] In the above-mentioned ultra-small resonator quartz crystal plate and base bonding structure, the concave area is a hole, and the plurality of holes in the bonding area are regularly and evenly distributed.

[0013] The above-mentioned ultra-small resonator quartz crystal plate and base bonding structure has a regularly and evenly distributed row of nails fixed in the bonding area before the quartz crystal plate is coated, and then the quartz crystal plate is placed in a fixture for chrome coating and electrode coating to form a chrome-plated surface layer and an electrode surface layer, and then the fixture is removed, and the row of nails is removed from the quartz crystal plate, forming a number of holes regularly and evenly distributed in the bonding area.

[0014] The technical solution of the present invention uses a jig to leave part of the surface of the quartz crystal piece unplated in the bonding area during film coating, that is, exposed, so as to form holes or grooves in the chrome-plated surface layer and the electrode surface layer, so that the conductive silver glue can enter or immerse in the holes or grooves and adhere to the surface of the quartz crystal piece. Therefore, the quartz crystal piece and the base are strengthened and bonded, preventing the quartz crystal piece from loosening or falling off. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of a first embodiment of the bonding structure of the ultra-small resonator quartz crystal plate and the base of the present invention.

[0016] Figure 2 yes Figure 1 AA section view shown.

[0017] Figure 3 yes Figure 2 The enlarged view of the part is shown.

[0018] Figure 4 yes Figure 1 Schematic diagram of the quartz crystal piece shown.

[0019] Figure 5 It is a schematic diagram of a quartz crystal piece of the second embodiment of the bonding structure of the ultra-small resonator quartz crystal piece and the base of the present invention. DETAILED DESCRIPTION

[0020] The present invention is further described in detail below in conjunction with the embodiments and drawings.

[0021] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 The figure shows the first embodiment of the bonding structure of the ultra-small resonator quartz crystal plate and the base of the present invention. It includes a base 1 and a quartz crystal plate 2 fixed on the base 1, the surface of the quartz crystal plate 2 is plated with a chrome-plated surface layer 3 and an electrode surface layer 4, and the quartz crystal plate 2 is bonded to the wafer platform 11 of the base 1 through a conductive silver glue 5; in the bonding area 6 where the quartz crystal plate 2 and the conductive silver glue 5 are bonded, the chrome-plated surface layer 3 and the electrode surface layer 4 on the quartz crystal plate 2 have several concave areas, and the concave areas in this embodiment are holes 7, which penetrate the chrome-plated surface layer 3 and the electrode surface layer 4 and directly reach the outer surface of the quartz crystal plate 2; the conductive silver glue 5 can be immersed in the holes 7 and directly bonded to the outer surface of the quartz crystal plate 2. In this way, the quartz crystal plate 2 and the base 1 can be strengthened and bonded to prevent the quartz crystal plate 2 from loosening or falling off.

[0022] In this embodiment, before the quartz crystal plate 2 is plated, a regularly and evenly distributed row of nails is fixed in the bonding area 6, and then the quartz crystal plate 2 is placed in a fixture for chrome plating and electrode plating to form a chrome-plated surface layer 3 and an electrode surface layer 4, and then the fixture is removed, and the row of nails is removed from the quartz crystal plate 2, forming a regularly and evenly distributed plurality of holes 7 in the bonding area 6.

[0023] Reference Figure 5The figure shows the second embodiment of the bonding structure of the ultra-small resonator quartz crystal plate and the base of the present invention. Different from the first embodiment, the chrome-plated surface layer 3 and the electrode surface layer 4 on the quartz crystal plate 2 have several concave areas, and the concave areas in this embodiment are grooves 8. The grooves 8 penetrate the chrome-plated surface layer 3 and the electrode surface layer 4, and the bottom of the grooves is the outer surface of the quartz crystal plate 2; the conductive silver glue 5 can be immersed in the grooves 8 and directly bonded to the outer surface of the quartz crystal plate 2. In this way, the quartz crystal plate 2 and the base 1 can be strengthened to prevent the quartz crystal plate 2 from loosening or falling off. The grooves 8 of this embodiment are regularly and evenly distributed in the bonding area 6, so the bonding strength between the quartz crystal plate 2 and the base 1 in this second embodiment is higher than that in the first embodiment.

[0024] The method for making the groove 8 of the second embodiment is to fix a mesh screen in the bonding area 6 before the quartz crystal plate 2 is plated, and then the quartz crystal plate 2 is placed in a fixture for chrome plating and electrode plating to form a chrome-plated surface layer 3 and an electrode surface layer 4, and then the fixture is removed, and the mesh screen is removed from the quartz crystal plate 2, so that a plurality of grooves are formed in the bonding area 6 and are regularly and evenly distributed.

[0025] The above is only a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several modifications and improvements without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. An ultra-small resonator quartz crystal plate and base bonding structure, comprising a base and a quartz crystal plate fixed on the base, wherein the surface of the quartz crystal plate is plated with a chrome-plated surface layer and an electrode surface layer, and the quartz crystal plate is bonded to the wafer platform of the base by conductive silver glue; characterized in that In the bonding area where the quartz crystal sheet and the conductive silver glue are bonded, the chrome-plated surface layer and the electrode surface layer on the quartz crystal sheet have several concave areas, and the concave areas penetrate the chrome-plated surface layer and the electrode surface layer; the conductive silver glue can be immersed in the concave areas.

2. The ultra-small resonator quartz crystal plate and base bonding structure according to claim 1 is characterized in that The concave area is a groove, and several grooves are cross-distributed in the bonding area.

3. The ultra-small resonator quartz crystal plate and base bonding structure according to claim 2 is characterized in that The plurality of grooves are regularly and evenly distributed.

4. The ultra-small resonator quartz crystal plate and base bonding structure according to claim 3 is characterized in that Before the quartz crystal sheet is plated, a mesh screen is fixed in the bonding area, and then the quartz crystal sheet is placed in a fixture for chrome plating and electrode plating to form a chrome-plated surface layer and an electrode surface layer, and then the fixture is removed, and the mesh screen is removed from the quartz crystal sheet, forming a plurality of grooves in the bonding area that are regularly and evenly distributed.

5. The ultra-small resonator quartz crystal plate and base bonding structure according to claim 1, characterized in that The concave area is a hole, and a plurality of holes in the bonding area are regularly and evenly distributed.

6. The ultra-small resonator quartz crystal plate and base bonding structure according to claim 5, characterized in that Before the quartz crystal sheet is coated, a row of nails that are regularly and evenly distributed is fixed in the bonding area, and then the quartz crystal sheet is placed in a fixture for chrome coating and electrode coating to form a chrome-plated surface layer and an electrode surface layer, and then the fixture is removed, and the row of nails is removed from the quartz crystal sheet, forming a number of holes that are regularly and evenly distributed in the bonding area.

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