Circuit board and manufacturing method thereof

Abstract

The invention provides a circuit board and a manufacturing method thereof. The circuit board comprises a circuit substrate and an embedded three-dimensional electronic element embedded in the circuit substrate. The embedded three-dimensional electronic component comprises a plurality of flip chip support plates; the plurality of wafers are arranged on the plurality of flip chip support plates; and a plurality of flexible connection portions disposed between adjacent two of the plurality of flip chip substrates. According to the circuit board, the space utilization rate of the circuit board can be effectively increased, and the element density of the circuit board is further improved.

Description

Technical Field

[0001] The present invention relates to a circuit board and a manufacturing method thereof, and in particular to a circuit board with embedded components and a manufacturing method thereof. Background Art

[0002] In recent years, electronic devices have developed rapidly, and multifunctionality, high circuit density and miniaturization are the main research directions. Among them, embedding various electronic components into printed circuit boards (PCBs) is a common technical means. For example, embedding various passive components and / or active components into the printed circuit board can not only reduce the area and weight of the printed circuit board, but also improve the reliability of electronic products. Summary of the invention

[0003] One aspect of the present invention is to provide a circuit board including embedded three-dimensional electronic components.

[0004] Another aspect of the present invention is to provide a method for manufacturing a circuit board.

[0005] According to one aspect of the present invention, a circuit board is provided, which includes a circuit substrate and an embedded three-dimensional electronic component embedded in the circuit substrate. The embedded three-dimensional electronic component includes a plurality of flip chip carriers; a plurality of chips disposed on the plurality of flip chip carriers; and a plurality of flexible connecting portions disposed between two adjacent flip chip carriers.

[0006] According to an embodiment of the present invention, the plurality of flip chip carriers further include a plurality of pads, and each of the plurality of pads is at least electrically connected to another one of the plurality of pads.

[0007] According to an embodiment of the present invention, the embedded three-dimensional electronic component is in the shape of a cube, and the plurality of flip chip carriers include an upper carrier, a lower carrier and four side carriers.

[0008] According to an embodiment of the present invention, the plurality of chips include a first chip disposed on the upper loading board; a second chip disposed on the lower loading board, and the first chip is electrically connected to the second chip.

[0009] According to an embodiment of the present invention, the plurality of chips further include a plurality of third chips respectively disposed on the side carriers, and the plurality of third chips are electrically connected to at least one of the first chip and the second chip.

[0010] According to another aspect of the present invention, a method for manufacturing a circuit board is provided. The method includes providing an inner layer circuit substrate; forming an opening in the inner layer circuit substrate; attaching an adhesive layer to the lower surface of the inner layer circuit substrate and covering the opening; folding a flexible composite component to form an embedded three-dimensional electronic component; and placing the embedded three-dimensional electronic component in the opening. The flexible composite component includes a hard-soft composite board and a plurality of chips arranged on the hard-soft composite board.

[0011] According to an embodiment of the present invention, after the embedded three-dimensional electronic component is disposed, the method further includes forming a first metal layer on the inner circuit substrate; removing the adhesive layer; and forming a second metal layer on the lower surface of the inner circuit substrate.

[0012] According to one embodiment of the present invention, after forming the first metal layer and the second metal layer, the method further includes etching the first metal layer and the second metal layer to form a plurality of grooves, respectively, wherein the plurality of grooves extend from the first metal layer and the second metal layer to the embedded three-dimensional electronic component, respectively; electroplating a plurality of conductive materials into the plurality of grooves to form a plurality of conductive holes; and patterning the first metal layer and the second metal layer to form a first outer circuit layer and a second outer circuit layer.

[0013] According to one embodiment of the present invention, the plurality of conductive holes include a plurality of first conductive holes electrically connecting the first outer circuit layer and the embedded three-dimensional electronic components; and a plurality of second conductive holes electrically connecting the second outer circuit layer and the embedded three-dimensional electronic components.

[0014] According to an embodiment of the present invention, the rigid-flex composite board includes a plurality of flip chip carriers, the plurality of flip chip carriers include a plurality of pads, and the plurality of pads are electrically connected to the plurality of chips.

[0015] The circuit board and the manufacturing method thereof of the present invention are used to embed the embedded three-dimensional electronic components configured with multiple chips into the circuit substrate, so as to effectively increase the space utilization of the circuit board and further improve the component density of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present disclosure is better understood by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that, as is standard practice in the industry, many features are not drawn to scale. In fact, for the sake of clarity of discussion, the dimensions of many features may be arbitrarily scaled.

[0017] Figure 1 A cross-sectional view of a circuit board according to some embodiments of the present invention is shown.

[0018] Figure 2AA three-dimensional view of an embedded three-dimensional electronic component according to some embodiments of the present invention is shown.

[0019] Figure 2B Schematic diagrams of flexible composite components according to some embodiments of the present invention are shown.

[0020] FIG. 3A to FIG. 3F A cross-sectional view illustrating an intermediate stage of a method for manufacturing a circuit board according to some embodiments of the present invention is shown. DETAILED DESCRIPTION

[0021] The following disclosure provides many different embodiments or illustrations to implement different features of the invention. The specific examples of components and configurations described below are intended to simplify the present invention. These are of course only for illustration and are not intended to be limiting. For example, the description of a first feature formed on or above a second feature includes embodiments in which the first feature and the second feature are in direct contact, and also includes embodiments in which other features are formed between the first feature and the second feature, so that the first feature and the second feature are not in direct contact. In addition, the present invention repeats component symbols and / or letters in various specific examples. The purpose of this repetition is to simplify and clarify the description and does not indicate a relationship between the various discussed embodiments and / or configurations.

[0022] Furthermore, spatially relative terms, such as "beneath," "below," "lower," "above," "upper," etc., are intended to facilitate description of the relationship of parts or features illustrated in the drawings to other parts or features. Spatially relative terms encompass different orientations of the elements in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted so.

[0023] In existing embedded component circuit boards, only one component or chip can be embedded in one cavity. If multiple components (or chips) are to be embedded, multiple cavities must be provided, which may result in the rigidity of the circuit board not being suitable for the application. Therefore, the present invention provides a circuit board and a manufacturing method thereof, so as to configure multiple chips on a soft-hard composite board, and then fold the soft-hard composite board into an embedded three-dimensional electronic component, and embed it into a circuit substrate, so as to effectively increase the space utilization of the circuit board, thereby increasing the component density of the circuit board.

[0024] See also Figure 1, which depicts a cross-sectional view of a circuit board 100 according to some embodiments of the present invention. The circuit board 100 includes a circuit substrate 101 and an embedded three-dimensional electronic component 105. The circuit substrate 101 includes a substrate 110, a circuit layer 120, and a conductive through hole 130. The circuit layer 120 includes a first outer circuit layer 160 and a second outer circuit layer 165. In addition, the circuit substrate 101 also includes a conductive hole 140 electrically connected to the embedded three-dimensional electronic component 105. The embedded three-dimensional electronic component 105 includes a plurality of chips 150, wherein the chips 150 can be any electronic component set according to requirements.

[0025] The present invention does not limit the shape of the embedded three-dimensional electronic component 105, which can be any suitable shape. In some embodiments, the shape of the embedded three-dimensional electronic component 105 can be a cube, such as Figure 2A shown. Figure 2A A three-dimensional diagram of an embedded three-dimensional electronic component 105 according to some embodiments of the present invention is shown; and Figure 2B A schematic diagram of a flexible composite component 200 according to some embodiments of the present invention is shown (ie, an expanded diagram of a three-dimensional electronic component 105 embedded therein).

[0026] See also Figure 2A The embedded three-dimensional electronic component 105 includes a plurality of flip chip carriers 210, wherein the flip chip carriers 210 include a plurality of pads 220. Figure 2B The flip chip carrier 210 of the flexible composite component 200 includes an upper carrier 212, a lower carrier 214 and four side carriers (side carrier 216A, side carrier 216B, side carrier 216C and side carrier 216D). When folded into a three-dimensional electronic component 105 embedded therein, as shown in FIG. Figure 2A As shown, the upper carrier plate 212 is located opposite to the lower carrier plate 214, and the side carrier plates 216A, 216B, 216C, and 216D are located between the upper carrier plate 212 and the lower carrier plate 214. The flexible composite component 200 includes a plurality of chips 150, and the chips 150 include a first chip 232 disposed on the upper carrier plate 212, a second chip 234 disposed on the lower carrier plate 214, a third chip 236A disposed on the side carrier plate 216A, a third chip 236B disposed on the side carrier plate 216B, a third chip 236C disposed on the side carrier plate 216C, and a third chip 236D disposed on the side carrier plate 216D.

[0027] The flexible composite component 200 also includes a flexible connection portion 250. The flexible connection portion 250 is disposed between adjacent flip chip substrates 210 so that the flexible composite component 200 can be folded into an embedded three-dimensional electronic component 105. The combination of the flip chip substrate 210 and the flexible connection portion 250 can be referred to as a hard-soft composite board. In some embodiments, the hard-soft composite board can be a whole piece of soft board, and then a plurality of hard materials are bonded to the soft board to form a plurality of hard boards (i.e., flip chip substrates 210), wherein the aforementioned hard materials can be epoxy resin or resin sheets (prepreg). These hard boards can be separated from each other so that a gap is formed between adjacent hard boards, and this gap can be used as a space for accommodating the flexible connection portion 250. In other embodiments, the hard-soft composite board can also be formed by bonding a plurality of soft boards between adjacent hard boards, wherein these hard boards are connected via these soft boards. In addition, during the folding process, the joints of adjacent flip chip substrates 210 can be bonded using an adhesive layer.

[0028] Please also see Figure 2A and Figure 2B , the pads 220 on the flip chip carrier 210 can be electrically connected to the plurality of chips 150. For example, the first chip 232 on the upper carrier 212 is electrically connected to the second chip 234 on the lower carrier 214 using the pads 222A; the first chip 232 on the upper carrier 212 is electrically connected to the third chip 236A (using the pads 224B) on the side carrier 216A using the pads 224A; and the first chip 232 on the upper carrier 212 is electrically connected to the third chip 236C on the side carrier 216C using the pads 226A. Similarly, although Figure 2A Although not clearly shown in the figure, the download board 214 also has a configuration of pads 220 similar to that of the upper board 212, so as to electrically connect the second chip 234 on the download board 214 with the first chip 232 on the upper board 212, the third chip 236B on the side board 216B, and the third chip 236D on the side board 216D. Figure 2A As shown, pads 228B on the side carrier plate 216B are electrically connected to the download plate 214 .

[0029] It must be understood that Figure 2A and Figure 2B The embedded three-dimensional electronic component 105 (or the flexible composite component 200) is only used as an example, and the embedded three-dimensional electronic component 105 can also be designed in different shapes. Similarly, the number of the flip chip carrier 210, the flexible connection part 250 and the pad 220 can be changed with different shapes or designs, and various changes are still within the scope of the present invention.

[0030] FIG. 3A to FIG. 3F A cross-sectional view of an intermediate stage of a method for manufacturing a circuit board 100 according to some embodiments of the present invention is shown. Figure 3A, providing an inner circuit substrate 301. The inner circuit substrate 301 includes a substrate 110, a circuit layer 320 and a conductive via 330. The circuit layer 320 is disposed on the upper surface 110A and the lower surface 110B of the substrate 110. Figure 3A Only two circuit layers 320 are shown on both sides of the substrate 110 , and the number of layers of the circuit layer 320 may be one or more. The conductive vias 330 are configured to electrically connect the circuit layers 320 .

[0031] See also Figure 3B , the inner circuit substrate 301 is etched through to form an opening O1. Next, an adhesive layer 340 is attached to the lower surface 301B of the inner circuit substrate 301, and one side of the opening O1 is closed. It should be noted that the adhesive layer 340 does not cover the circuit layer 320 on the lower surface 301B, but only joins the lower surface 301B of the inner circuit substrate 301 at both ends of the opening O1. Since the adhesive layer 340 will be removed in the subsequent manufacturing process, a glue layer material that is easier to remove, such as a peelable glue, must be used.

[0032] See also Figure 3C , the folded embedded three-dimensional electronic component 105 (refer to Figure 2A ) is disposed in the opening O1. As described above, the embedded three-dimensional electronic component 105 includes a flip chip carrier 210, a chip 150 and a pad 220 (refer to Figure 2A and Figure 2B ).

[0033] See also Figure 3D After the embedded three-dimensional electronic component 105 is embedded, the first metal layer 350 is pressed on the inner circuit substrate 301, that is, the side not attached with the adhesive layer 340. Next, the adhesive layer 340 on the lower surface 301B of the inner circuit substrate 301 is removed, and the second metal layer 355 is pressed on the lower surface 301B of the inner circuit substrate 301.

[0034] See also Figure 3E ,right Figure 3D The structure is laser etched to form a groove R1 and a groove R2. The groove R1 extends from the first metal layer 350 and the second metal layer 355 to the embedded three-dimensional electronic component 105. The groove R2 extends from the first metal layer 350 and the second metal layer 355 to the conductive through hole 330 of the inner circuit substrate 301.

[0035] See also Figure 3F , electroplating conductive material into the groove R1 and the groove R2 to form the first conductive hole 140A, the second conductive hole 140B and the conductive through hole 335 respectively. Figure 1 and Figure 3F, patterning the first metal layer 350 and the second metal layer 355 to form a first outer circuit layer 160 and a second outer circuit layer 165, respectively, to obtain Figure 1 The circuit board 100 shown in FIG. 1 is a circuit board 100. The first conductive hole 140A can electrically connect the first outer circuit layer 160 and the embedded three-dimensional electronic component 105, and the second conductive hole 140B can electrically connect the second outer circuit layer 165 and the embedded three-dimensional electronic component 105. The conductive through hole 335 can electrically connect the first outer circuit layer 160 and the second outer circuit layer 165 to the conductive through hole 330 of the inner circuit substrate 301. The conductive through hole 335 and the conductive through hole 330 can be collectively referred to as the conductive through hole 130. The first conductive hole 140A and the second conductive hole 140B (such as Figure 3F ) may be collectively referred to as conductive vias 140 (as shown Figure 1 shown).

[0036] Based on the above, the present invention provides a circuit board and a method for manufacturing the same, so as to configure a plurality of chips on a flip chip carrier of a hard-soft composite board, and then fold the hard-soft composite board into an embedded three-dimensional electronic component, so as to connect a plurality of flip chip carriers using a flexible connection portion. The embedded three-dimensional electronic components are embedded in the circuit substrate to effectively increase the space utilization of the circuit board, thereby increasing the component density of the circuit board. The use of embedded three-dimensional electronic components can also allow the circuit board to have more space to accommodate other functional components, which helps to manufacture higher performance products. Furthermore, the circuit board of the present invention embeds a plurality of chips in a cavity, so the number of cavities can be reduced, thereby increasing the rigidity of the circuit board and reducing the production time of the circuit board.

[0037] Although the present invention has been disclosed as above with several embodiments, they are not intended to limit the present invention. Those skilled in the art to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the definition of the attached claims.

[0038]

Explanation of symbols

[0039] 100: Circuit board

[0040] 101: Circuit board

[0041] 105: Embedded three-dimensional electronic components

[0042] 110:Substrate

[0043] 110A: Upper surface

[0044] 110B: Bottom surface

[0045] 120: Circuit layer

[0046] 130: Conductive via

[0047] 140: Conductive hole

[0048] 140A: First conductive hole

[0049] 140B: Second conductive hole

[0050] 150: Chip

[0051] 160: first outer circuit layer

[0052] 165: Second outer circuit layer

[0053] 200: Flexible composite components

[0054] 210:Flip Chip Substrate

[0055] 212: Upload board

[0056] 214: Download Board

[0057] 216A,216B,216C,216D: Side loading plate

[0058] 220:Padding

[0059] 222A,224A,224B,226A,228B: Gasket

[0060] 232: First chip

[0061] 234: Second chip

[0062] 236A, 236B, 236C, 236D: The third chip

[0063] 250: Flexible connection part

[0064] 301: Inner circuit board

[0065] 301B: Lower surface

[0066] 320: Circuit layer

[0067] 330: Conductive via

[0068] 335: Conductive via

[0069] 340: Adhesive layer

[0070] 350: First metal layer

[0071] 355: Second metal layer

[0072] O1: Opening

[0073] R1, R2: Groove.

Claims

1. A circuit board, characterized in that: Include: a circuit board; and The embedded three-dimensional electronic component is embedded in the circuit substrate, wherein the embedded three-dimensional electronic component comprises: Multiple flip chip substrates; A plurality of chips are disposed on the plurality of flip chip carriers; and A plurality of flexible connection parts are arranged between two adjacent flip chip carriers.

2. The circuit board according to claim 1, characterized in that: The plurality of flip chip carriers further include: A plurality of pads, wherein each of the plurality of pads is at least electrically connected to another one of the plurality of pads.

3. The circuit board according to claim 1, characterized in that: The embedded three-dimensional electronic component is in the shape of a cube, and the plurality of flip chip carriers include an upper carrier, a lower carrier and four side carriers.

4. The circuit board according to claim 3, characterized in that: The plurality of wafers comprises: A first chip is disposed on the upper loading board; The second chip is disposed on the download board, and the first chip is electrically connected to the second chip.

5. The circuit board according to claim 4, characterized in that: The plurality of wafers further comprises: A plurality of third chips are respectively disposed on the side carriers, and the plurality of third chips are electrically connected to at least one of the first chip and the second chip.

6. A method for manufacturing a circuit board, characterized in that: Include: Providing an inner circuit substrate; forming an opening in the inner circuit substrate; Laminating an adhesive layer on the lower surface of the inner circuit substrate and covering the opening; The flexible composite component is folded to form an embedded three-dimensional electronic component, wherein the flexible composite component comprises: Soft and hard composite panels; as well as A plurality of chips are arranged on the hard-flex composite board; and The embedded three-dimensional electronic component is arranged in the opening.

7. The method for manufacturing a circuit board according to claim 6, characterized in that: After the embedded three-dimensional electronic component is arranged, the method further comprises: forming a first metal layer on the inner circuit substrate; removing the adhesive layer; and A second metal layer is formed on the lower surface of the inner layer circuit substrate.

8. The method for manufacturing a circuit board according to claim 7, characterized in that: After forming the first metal layer and the second metal layer, the method further comprises: Etching the first metal layer and the second metal layer to form a plurality of grooves respectively, wherein the plurality of grooves extend from the first metal layer and the second metal layer to the embedded three-dimensional electronic component respectively; Electroplating a plurality of conductive materials into the plurality of grooves to form a plurality of conductive holes; as well as The first metal layer and the second metal layer are patterned to form a first outer circuit layer and a second outer circuit layer.

9. The method for manufacturing a circuit board according to claim 8, characterized in that: The plurality of conductive holes include: A plurality of first conductive holes electrically connecting the first outer circuit layer and the embedded three-dimensional electronic components; and A plurality of second conductive holes electrically connect the second outer circuit layer and the embedded three-dimensional electronic component.

10. The method for manufacturing a circuit board according to claim 6, characterized in that: The soft-hard composite board comprises: A plurality of flip chip carriers, wherein the plurality of flip chip carriers include a plurality of pads, and the plurality of pads are electrically connected to the plurality of chips.

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