Evaporator, radiator assembly and power equipment

Abstract

The invention discloses an evaporator, a radiator assembly and power equipment, the evaporator comprises a first side plate and a second side plate, the first side plate and the second side plate are oppositely arranged, the first side plate is divided into a first area and a second area in the height direction, the height of the first area is higher than that of the second area, and the height of the second area is lower than that of the first area. The first area is used for being opposite to at least one heat source; a first vertical line, opposite to the center of the heat source, on the inner wall of the first area does not coincide with a second vertical line, facing the vertex of the second side plate, on the inner wall of the second area. A first vertical line, opposite to the center of a heat source, on the inner wall of a first area does not coincide with a second vertical line, facing the vertex of a second side plate, on the inner wall of a second area, so that the position, opposite to the center of the heat source, in the first area and the outermost point of the second area are not in the same plane; the probability of moving to the position opposite to the heat source in the first area is reduced, and therefore the heat exchange effect of the first area and the heat source can be improved.

Description

[0001] This application claims priority to Chinese patent application No. 2024106271072 filed on May 17, 2024, with invention name “An evaporator, radiator assembly and power device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the technical field of heat dissipation, and in particular to an evaporator, a radiator assembly and a power device. Background Art

[0003] Existing power devices have heat sources, and components in the heat source generate a large amount of heat during operation, forming a heat source.

[0004] In order to ensure the normal use of the heat source, it is necessary to dissipate the heat from the heat source. Existing commonly used and efficient heat dissipation solutions include thermal siphon heat dissipation and liquid cooling heat dissipation.

[0005] Among them, the principle of the thermal siphon heat dissipation method is that the low-temperature liquid working medium in the evaporator will become a gaseous working medium after absorbing the heat from the heat source. The gaseous working medium enters the condenser through the outlet channel. After the gaseous working medium is cooled in the condenser, it will return to the evaporator through the inlet channel as a low-temperature liquid working medium to dissipate heat from the heat source.

[0006] Therefore, how to provide an evaporator to improve the cooling effect on the heat source is a technical problem that needs to be solved urgently by technical personnel in this field. Summary of the invention

[0007] In view of this, the present disclosure provides an evaporator to improve the effect of the bubbles below on the heat dissipation of the upper wall and improve the cooling effect on the heat source. In addition, the present disclosure also provides a radiator assembly having the above evaporator and a power device having the radiator assembly.

[0008] To achieve the above objectives, the present disclosure provides the following technical solutions:

[0009] An evaporator, comprising: a first side plate and a second side plate, wherein the first side plate and the second side plate are arranged opposite to each other, and the first side plate is divided into a first area and a second area along a height direction, the height of the first area is higher than that of the second area, and the first area is used to face at least one heat source;

[0010] A first perpendicular line on the inner wall of the first region at a position opposite to the center of the heat source does not coincide with a second perpendicular line on the inner wall of the second region toward the vertex of the second side plate.

[0011] Preferably, in the above-mentioned evaporator, at least a part of the inner wall is not coplanar with other positions of the inner wall; and / or, the inner wall of the second area is an inner wall that at least a part of the inner wall is not coplanar with other positions of the area.

[0012] Preferably, in the above evaporator, the inner wall of the first region is a non-coplanar inner wall; and / or the inner wall of the second region is a non-coplanar inner wall.

[0013] Preferably, in the above-mentioned evaporator, the inner wall of the first region is an inclined surface or a stepped surface;

[0014] And / or, the inner wall of the second region is an inclined surface or a stepped surface.

[0015] Preferably, in the above evaporator, the wall thickness of the first region and / or the second region decreases along the direction from the second region to the first region.

[0016] Preferably, in the above evaporator, the inner wall of the first region and the inner wall of the second region are connected to form a step structure.

[0017] Preferably, in the above evaporator, the wall thickness of the second region is greater than the wall thickness of the first region;

[0018] Alternatively, the first area protrudes relative to the second area in a direction away from the second side plate.

[0019] Preferably, in the above evaporator, the inner wall of the first region and / or the inner wall of the second region has a guide member for guiding the working medium;

[0020] When the guide member is located on the inner wall of the first region, the guide member forms a part of the inner wall of the first region; when the guide member is located on the inner wall of the second region, the guide member forms a part of the inner wall of the second region, and the vertex of the guide member of the second region is formed as a vertex on the inner wall of the second region facing the second side panel.

[0021] Preferably, in the above-mentioned evaporator, the guide member is arranged perpendicular to the first vertical line or arranged at an angle to the first vertical line.

[0022] Preferably, in the above-mentioned evaporator, when the guide member and the first vertical line form an angle, the guide member is inclined in a direction away from the inner wall of the first side plate along the direction from the second area to the first area.

[0023] Preferably, in the above evaporator, a plurality of the guide members are arranged on the inner wall of the first side plate along the direction from the second area to the first area;

[0024] And / or, a plurality of the guide members are arranged on the inner wall of the first side plate along a direction perpendicular to the direction from the second area to the first area.

[0025] Preferably, in the above evaporator, the length of the guide member gradually decreases along the direction from the second area to the first area;

[0026] Alternatively, the length of the guide member located in the middle position among the guide members is greater than the length of the guide members at the two side positions.

[0027] Preferably, in the above-mentioned evaporator, the guide member is located between adjacent heat sources in the height direction of the evaporator; or, the guide member is opposite to the heat source or is located at the edge of the heat source.

[0028] Preferably, in the above evaporator, the guide member is a flat plate.

[0029] Alternatively, the guide member is a plate member, and the side surface of the guide member close to the bottom end of the evaporator is a guide surface, and the guide surface is smoothly guided from the first side plate to the second side plate toward the top end of the evaporator.

[0030] A radiator assembly comprises: an evaporator and a condenser, wherein the evaporator is any one of the evaporators described above.

[0031] A power device comprises a cabinet, a heat source arranged in the cabinet and a radiator assembly for dissipating heat from the heat source, wherein the radiator assembly is the radiator assembly described above.

[0032] An evaporator is disclosed in an embodiment of the present disclosure, which divides a first side plate into a first area and a second area along a height direction, wherein the first area is higher than the second area, and the first area corresponds to at least one heat source, and a first vertical line on the inner wall of the first area at a position opposite to the center of the heat source does not coincide with a second vertical line on the inner wall of the second area toward the vertex of the second side plate, so that the position opposite to the center of the heat source in the first area of ​​the inner wall of the first side plate and the outermost point of the second area are not in the same plane. Therefore, the bubbles generated in the second area have a reduced probability of moving to the position opposite to the heat source in the first area during the process of floating upward in the vertical direction, thereby improving the heat exchange effect between the first area and the heat source. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 It is a schematic diagram of the structure of the power device disclosed in the embodiment of the present disclosure;

[0035] Figure 2 for Figure 1 Sectional view in the AA direction;

[0036] Figure 3 It is a front view of a first structure of a radiator assembly disclosed in an embodiment of the present disclosure;

[0037] Figure 4 It is a front view of the evaporator when the heat source modules disclosed in the embodiment of the present disclosure are arranged in a single layer;

[0038] Figure 5 for Figure 4 Side view of

[0039] Figure 6 It is a front view of the evaporator when the heat source modules disclosed in the embodiment of the present disclosure are arranged in multiple layers;

[0040] Figure 7 for Figure 6 Side view of

[0041] Figure 8 The disclosed embodiment of the present disclosure Figure 1 A cross-sectional view of another structure in the AA direction;

[0042] Fig. 9 It is a front view of another structure of the radiator assembly disclosed in the embodiment of the present disclosure;

[0043] Fig.10 It is a front view of the first solution of the evaporator when the heat source modules disclosed in the embodiment of the present disclosure are arranged in a single layer;

[0044] Fig.11 for Fig.10 Side view of

[0045] Fig.12 It is a front view of the second solution of the evaporator when the heat source modules disclosed in the embodiment of the present disclosure are arranged in a single layer;

[0046] Fig.13 for Fig.12 A side view of a first structure;

[0047] Fig.14 for Fig.12 A side view of a second structure;

[0048] Fig.15 for Fig.12 A side view of the third structure;

[0049] Fig.16 for Fig.12 A side view of a fourth structure;

[0050] Fig.17 for Fig.12 A side view of a fifth structure;

[0051] Fig.18 for Fig.12 A side view of a sixth structure;

[0052] Fig.19 for Fig.12 A side view of the seventh structure;

[0053] Fig. 20 for Fig.12 A side view of an eighth structure;

[0054] Fig.21 It is a front view of the first solution of the evaporator when the heat source modules disclosed in the embodiment of the present disclosure are arranged in multiple layers;

[0055] Fig. 22 for Fig.21 A side view of a first structure;

[0056] Fig.23 for Fig.21 A side view of a second structure;

[0057] Fig.24 for Fig.21 A side view of the third structure;

[0058] Fig.25a for Fig.21 A side view of a fourth structure;

[0059] Fig.25b for Fig.21 A side view of a fifth structure;

[0060] Fig.26 It is a front view of the second solution of the evaporator when the heat source modules disclosed in the embodiment of the present disclosure are arranged in multiple layers;

[0061] Fig. 27 for Fig.26 A side view of a first structure;

[0062] Fig.28 The front view of the third solution of the evaporator when the heat source modules disclosed in the embodiment of the present disclosure are arranged in multiple layers

[0063] Fig.29 for Fig.28 A side view of a first structure;

[0064] Fig.30 for Fig.28 A side view of a second structure;

[0065] Fig.31 for Fig.28 A side view of the third structure;

[0066] Fig.32 for Fig.28 A side view of a fourth structure;

[0067] Fig.33 for Fig.28 A side view of a fifth structure;

[0068] Fig.34 for Fig.28 A side view of a sixth structure;

[0069] Fig.35 for Fig.28 Side view of the seventh structure.

[0070] 1 is the cabinet, 2 is the heat dissipation channel, 3 is the fan, 4 is the heat source, and 5 is the radiator assembly;

[0071] 21 is the first channel, 22 is the second channel, 211 is the air inlet, 212 is the air outlet, 221 is the air exchange port, 41 is the shell, 42 is the heat source, 51 is the condenser, 52 is the evaporator, 521 is the first side plate, 522 is the second side plate, 5211 is the first area, 5212 is the second area, 5213 is the groove, 5214 is the protrusion, the first gradually expanding section 52111, the second gradually expanding section 52121, 523 is the guide member, 5231 is the guide surface, 53 is the inlet channel, 54 is the outlet channel, 55 is the infusion tube, and 551 is the infusion port. DETAILED DESCRIPTION

[0072] The present disclosure discloses an evaporator, which improves the influence of bubbles below on the heat dissipation of the upper wall surface and improves the cooling effect on the heat source. In addition, the present disclosure also discloses a radiator assembly having the evaporator and a power device having the radiator assembly.

[0073] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present disclosure.

[0074] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0075] In order to ensure the normal use of heat sources in power equipment, it is necessary to dissipate heat from the heat sources. Commonly used and efficient heat dissipation solutions include thermal siphon heat dissipation and liquid cooling.

[0076] Among them, the principle of the thermal siphon heat dissipation method is that the low-temperature liquid working medium in the evaporator will become a gaseous working medium after absorbing the heat from the heat source. The gaseous working medium enters the condenser through the outlet channel. After the gaseous working medium is cooled in the condenser, it will return to the evaporator through the inlet channel as a low-temperature liquid working medium to dissipate heat from the heat source.

[0077] In some embodiments, the heat source is arranged along the height direction of the evaporator. During the cooling process of the heat source, the medium in the lower part of the evaporator is vaporized after heat exchange with the lower heat source. The bubbles generated after vaporization will rise and affect the content of the medium above the evaporator, thus affecting the heat dissipation of the upper heat source by the medium above the evaporator; in addition, bubbles are usually generated at the position where the evaporator and the heat source are attached. When the bubbles generated on the lower wall of the evaporator float upward along the inner wall of the evaporator, if the bubbles move to the position on the upper wall of the evaporator that is attached to the heat source, the heat exchange effect between the medium in the evaporator and the heat source will be reduced.

[0078] like Figure 1 and Figure 2 The power device shown includes: a cabinet 1 , a heat dissipation channel 2 , a fan 3 , a heat source 4 and a heat sink assembly 5 .

[0079] The cabinet 1 is the outer shell of the power device, which is used to protect the internal components of the power device and serve as the installation base of the internal components and external structures. The shape and size of the cabinet 1 are not specifically limited here. In addition, the power device includes but is not limited to an inverter.

[0080] The heat dissipation channel 2 is installed on the outside of the cabinet 1 and is divided into a first channel 21 and a second channel 22, wherein the fan 3 is arranged in the first channel 21, and an air inlet 211 and an air outlet 212 are respectively arranged on the opposite sides of the first channel 21. The fan 3 is arranged between the air inlet 211 and the air outlet 212, and is used to blow the incoming air from the air inlet 211 to the air outlet 212.

[0081] An air exchange port 221 is provided on the side wall of the second channel 22 , so as to connect the second channel 22 with the outside through the air exchange port 221 .

[0082] In some embodiments, the first channel 21 and the second channel 22 are sealed and isolated from each other.

[0083] The heat source 4 is a heating element in the cabinet 1, and includes but is not limited to a structure that generates heat during operation. The heat source 4 includes each wafer in the power device, for example, one wafer can be used as a heat source; usually, one device can contain more than one wafer.

[0084] Combination Figure 2 and Figure 3 As shown, the radiator assembly 5 includes: a condenser 51 , an evaporator 52 (or a cold plate), an inlet channel 53 and an outlet channel 54 , and a heat dissipating medium circulating inside the radiator assembly 5 .

[0085] The condenser 51 is located in the first channel 21 . In some embodiments, the condenser 51 is located between the fan 3 and the air outlet 212 , and the fan 3 is used to dissipate heat from the condenser 51 .

[0086] The evaporator 52 is located in the second channel 22 and is arranged in close contact with the cabinet 1. In some embodiments, the evaporator 52 is opposite to the heat source 4, for example, the heat source 4 is welded, bonded, or embedded on the surface of the evaporator 52 through an intermediate layer; or directly welded, bonded, or embedded on the surface of the evaporator 52. The area where the evaporator 52 is in close contact with the cabinet 1 is larger than the area where the heat source 4 is in close contact with the cabinet 1. Optionally, the evaporator 52 is arranged along the second channel 22. Figure 2 The projection in the middle horizontal direction on the heat source 4 completely blocks the heat source 4.

[0087] In some embodiments, one end of the inlet channel 53 is connected to the bottom end of the condenser 51, and the other end is connected to the bottom end of the evaporator 52; one end of the outlet channel 54 is connected to the top end of the evaporator 52, and the other end is connected to the condenser 51. The connection position of the inlet channel 53 and the outlet channel 54 in the evaporator 52 can be set according to different needs, and no matter where the inlet channel 53 and the outlet channel 54 are located in the evaporator 52, they are within the protection range.

[0088] It should be noted that the bottom and top ends of the condenser 51 are the two ends in the height direction of the condenser 51, and the bottom and top ends of the evaporator 52 are the two ends in the height direction of the evaporator 52. The direction of the condenser 51 is the same as the height direction of the evaporator 52 and is defined as the first direction. This description is referred to in this article.

[0089] In some embodiments, when the power device is placed normally, the height of the condenser 51 is higher than the height of the evaporator 52 , and the height direction of the power device when placed normally is the first direction.

[0090] During the process of heat dissipation of the heat source 4 by the radiator assembly 5, the low-temperature liquid working medium in the evaporator 52 absorbs the heat of the heat source 4 and turns into a gaseous working medium. The gaseous working medium enters the condenser 51 through the outlet channel 54. The fan 3 dissipates heat to the condenser 51, so that the gaseous working medium is cooled in the condenser 51 and turns into a low-temperature liquid working medium, and flows back to the evaporator 52 through the inlet channel 53, dissipating the heat to the heat source 4, thereby realizing circulating cooling of the working medium.

[0091] In practical applications, such as when a phase change heat sink or a cold plate is used for heat dissipation, the container used to hold the liquid coolant in the phase change heat sink and the cold plate used in conventional liquid cooling can be referred to as an evaporator. The present disclosure uses the term "evaporator" to refer to the container used to hold the liquid coolant. In practical applications, the evaporator is usually a hollow plate-like structure. Figure 2 and Figure 3 As shown, in order to reduce the thickness of the power changing device in the horizontal direction, the evaporator is usually placed vertically. In practical applications, it can also be placed tilted, such as with the upper end of the evaporator facing Figure 2 The center line of the evaporator is moved closer to the left or right direction, thereby causing the extension direction of the center line of the evaporator to deviate from the horizontal direction; Figure 5 As shown, it has two left and right planes with larger areas, namely the first side panel 521 and the second side panel 522. Usually, the heat source 4 is arranged on the outer surface of one or more of the side panels. The embodiment of the present disclosure takes the heat source 4 arranged on the outer surface of the first side panel 521 as an example for explanation. In addition, the evaporator can also have other shapes besides rectangular plates. For example, the shape of the plane with larger area is circular, square, elliptical or irregular. Similarly, the overall shape of the evaporator is not necessarily plate-shaped, for example, it can be spherical. Or one of the first side panel and the second side panel can be an overall shape composed of a plane, an inclined surface, or an arc surface. Or, the outer surface of one of the first side panel and the second side panel can be a plane formed by splicing multiple planes. The embodiment of the present disclosure only takes the shape of a plane formed by splicing multiple planes. Figure 4 The rectangular plate-shaped evaporator shown is used as an example for explanation.

[0092] It should be noted that the radiator assembly 5 in this article includes but is not limited to a thermosyphon radiator.

[0093] Combination Figures 4 to 7 As shown, the heat source 4 in some embodiments includes a single layer arrangement or a multi-layer arrangement.

[0094] in, Figure 4 and Figure 5 The single-layer arrangement in the example is that a plurality of heat sources 4 are arranged in the second direction of the cabinet 1 , wherein the second direction intersects with the first direction. In some embodiments, the first direction is perpendicular to the second direction.

[0095] In some embodiments, the heat source 4 includes: a shell 41 and a heat source 42. One or more heat sources 42 may be arranged in the shell 41, and these heat sources 42 may be arranged in multiple layers along the first direction, or in multiple layers along the second direction. In practical applications, in order to improve the power density of the device, the heat source 4 may also be arranged in multiple columns in the second direction, and further, the heat sources in the same column may be staggered along the second direction, for example, similar to the distribution of dark or light blocks in a chess board, thereby increasing the center distance between adjacent heat sources 4 to avoid mutual interference and improve the heat dissipation effect and electromagnetic stability.

[0096] It should be noted that the heat source 42 includes but is not limited to a wafer, and may also be a capacitor, a resistor or an inductor, or a power electronic module formed by a packaged wafer, such as a diode, a triode, a MOS tube or an iGBT.

[0097] Figure 6 and Figure 7 When the heat sources 4 disclosed in the disclosure are arranged in multiple layers, the heat sources 4 are arranged in multiple layers in the first direction of the cabinet 1 , wherein multiple heat sources 4 can be arranged in each layer.

[0098] It should be noted that the above-mentioned evaporator 52 can cool all the heat sources 4 at the same time. In an optional embodiment, the projections of all the heat sources 4 on the evaporator 52 along the horizontal direction completely fall into the evaporator 52.

[0099] In some embodiments, all heat sources 4 are located between the inlet channel 53 and the outlet channel 54 .

[0100] The number of the inlet channels 53 and the outlet channels 54 can be set according to different needs, and the horizontal heights of all the inlet channels 53 and all the outlet channels 54 are the same.

[0101] Since the heat source 4 is arranged in multiple layers or each heat source 4 has multiple layers of heat sources 42, during the cooling process of the heat source by the radiator assembly 5, the medium in the lower part of the evaporator 52 is vaporized after heat exchange with the heat source below. The bubbles generated after vaporization will rise and affect the content of the medium above the evaporator 52, thereby affecting the heat dissipation of the heat source 42 above the heat source 4 by the medium above the evaporator 52; in addition, bubbles are usually generated at the position where the evaporator 52 and the heat source 4 are in contact. When the bubbles generated on the wall below the evaporator 52 float upward along the inner wall of the evaporator 52, if the bubbles move to the position on the wall above the evaporator 52 that is in contact with the heat source 4, the heat exchange effect between the medium in the evaporator 52 and the heat source 4 will be reduced.

[0102] In addition, after the medium at the bottom of the evaporator 52 is heated, it will exchange heat with the medium above, affecting the temperature of the medium above, further affecting the heat dissipation of the heat source 42 above along the first direction, causing a temperature difference between the heat sources 42 at the upper and lower positions, affecting the use of the heat source.

[0103] Based on the above problems, Figure 8 and Fig. 9 The heat sink assembly 5 shown in the figure can alleviate the temperature difference between the heat sources 42 at the upper and lower positions.

[0104] like Figure 8 and Fig. 9 As shown, the radiator assembly 5 includes: a condenser 51 , an evaporator 52 (or a cold plate), an inlet channel 53 , an outlet channel 54 , a liquid replenishing pipe 55 , and a heat dissipating medium circulating inside the radiator assembly 5 .

[0105] The arrangement and connection relationship of the condenser 51, the evaporator 52 (or the cold plate), the inlet channel 53 and the outlet channel 54 can be seen in Figure 2 and Figure 3 The description about the radiator assembly 5 will not be repeated here.

[0106] One end of the infusion tube 55 is connected to the condenser 51, or is connected to the inlet channel 53, so as to realize the connection between the infusion tube 55 and the condenser 51. The other end of the infusion tube 55 is connected to the middle position of the evaporator 52, and the connection position between the infusion tube 55 and the evaporator 52 can be set according to different needs. For example, the infusion tube 55 can be set at different heights on the first side plate, and the infusion tube 55 can also be set on the second side plate; the infusion tube 55 is usually set near the heat source 4, for example, above, below, on the left side, or on the right side of the heat source 4, and of course, it can also be set on the second side plate at a position directly facing the heat source 4, so as to achieve the effect of reducing the temperature of the coolant near the heat source 4.

[0107] Furthermore, in one embodiment, the middle position of the evaporator 52 in the first direction can be replenished by adding a replenishing tube 55, so as to reduce the temperature of the medium in the middle position and above the evaporator 52, which is beneficial for the evaporator 52 to cool the heat source 42 above.

[0108] The above content explains the relationship between the components of the radiator assembly. Figures 10 to 35 The structure of the evaporator 52 will be described in detail.

[0109] Referring to the accompanying drawings, the evaporator 52 includes a first side plate 521 and a second side plate 522, wherein the first side plate 521 and the second side plate 522 are arranged opposite to each other, and the first side plate 521 is divided into a first area 5211 and a second area 5212 along the height direction, the height of the first area 5211 is higher than that of the second area 5212, and the first area 5211 corresponds to at least one heat source 4; a first vertical line O1 on the inner wall of the first area 5211 at a position opposite to the center of the heat source 4 does not coincide with a second vertical line O2 on the inner wall of the second area 5212 toward the vertex of the second side plate 522, and the first vertical line O1 and the second vertical line O2 are both along the height direction of the evaporator.

[0110] It should be emphasized that the vertical line referred to in the embodiment of the present disclosure refers to a straight line pointing to the center of the earth or parallel to the direction of gravity. The position on the inner wall of the first area 5211 relative to the center of the heat source 4 can be: Figure 5 The heat source 4 shown is the projection area on the left, or the area where the inner wall temperature of the first area 5211 increases after the heat of the heat source 4 is conducted to the first area 5211; or an area pre-divided for carrying the heat source 4, and the distance from the center of the projection of the heat source 4 on the inner wall of the evaporator is within a set distance range.

[0111] The first side plate 521 in the present application is opposite to the heat source 4, including but not limited to being fitted and connected to the heat source 4. Since the outer wall of the first side plate 521 is opposite to the heat source 4, bubbles will be generated at the heat source of the inner wall of the first side plate 521. If the bubbles move upward along the inner wall of the first side plate 521, the heat exchange effect of the inner wall above the first side plate 521 will be affected.

[0112] Based on this, in the present application, the first side plate 521 is divided into a first area 5211 and a second area 5212 along the height direction, the first area 5211 is higher than the second area 5212, and the first area 5211 corresponds to at least one heat source, and the first vertical line O1 on the inner wall of the first area 5211 at a position opposite to the center of the heat source 4 does not coincide with the second vertical line O2 on the inner wall of the second area 5212 toward the vertex of the second side plate 522, so that the position opposite to the center of the heat source 4 in the first area 5211 of the inner wall of the first side plate 521 and the outermost point of the second area 5212 are not in the same plane. Therefore, the bubbles generated in the second area 5212 have a reduced probability of moving to the position opposite to the heat source 4 in the first area 5211 during the process of floating upward in the vertical direction, thereby improving the heat exchange effect between the first area 5211 and the heat source.

[0113] It should be noted that, since the first area 5211 in the present application is higher than the second area 5212, it can be understood that the first area 5211 is the upper section of the evaporator involved in the content of the present application, and the second area 5212 is the lower section of the evaporator involved in the content of the present application. Fig.11 In practical applications, a heat source 4 may also be provided on the outer surface of the evaporator corresponding to the second region 5212 in one or more embodiments of the present disclosure, and the method for providing the heat source 4 may be the same or similar to that described above.

[0114] In some embodiments, the first vertical line O1 is located between the second side plate 522 and the second vertical line O2, or the second vertical line O2 is located between the second side plate 522 and the first vertical line O1. Simply put, the first area 5211 can be outward relative to the second area 5212, or the first area 5211 is inward relative to the second area 5212. Taking the surface of the second side plate 522 as a plane as an example, the first area 5211 is far away from the second side plate 522 relative to the second area 5212, or the first area 5211 is close to the second side plate 522 relative to the second area 5212, that is, the first vertical line O1 and the second vertical line O2 do not overlap.

[0115] When the first region 5211 is inward relative to the second region 5212, since the first region 5211 squeezes the working fluid inward, the bubbles will grow larger and break up and become smaller during the upward movement, and the influence of the tiny bubbles on the density of the upper layer will be reduced, especially when the path of the bubble movement is longer, the bubbles will gradually disappear. Therefore, the influence of the bubbles can be reduced and the heat exchange effect between the medium in the evaporator 52 and the heat source 4 can be improved.

[0116] In order to achieve the non-coincidence of the first vertical line O1 and the second vertical line O2, the inner wall of the first area 5211 can be set to an inner wall having at least a partial area that is not coplanar with other positions of the inner wall, and the inner wall of the second area 5212 can be set to an inner wall having at least a partial area that is not coplanar with other positions of the inner wall, that is, it can be understood that the inner wall of the first area 5211 and the inner wall of the second area 5212 are both set to non-coplanar inner walls. In some embodiments, in order to achieve the non-coincidence of the first vertical line O1 and the second vertical line O2, only the inner wall of the first area 5211 can be set to an inner wall having at least a partial area that is not coplanar with other positions of the inner wall, or only the inner wall of the second area 5212 can be set to an inner wall having at least a partial area that is not coplanar with other positions of the inner wall. In the present application, the method of achieving non-coplanarity includes but is not limited to setting the wall thickness of the first side plate 521 to be different or setting the first side plate 521 to a step structure.

[0117] like Fig.11 , Figures 13 to 16 , Figures 21 to 31In the illustrated embodiments, different wall thicknesses or a step structure are used to achieve the non-coplanarity of the first area 5211 and the second area 5212 of the first side plate 521.

[0118] In some embodiments, the inner wall of the first region 5211 may be a sloped surface or a stepped surface; and / or the inner wall of the second region 5212 may be a sloped surface or a stepped surface, so that the inner wall of the first region 5211 and the inner wall of the second region 5212 do not overlap.

[0119] By setting the inner wall of the first area 5211 and / or the second area 5212 as a step surface, or setting the inner wall of the first area 5211 and / or the second area 5212 as a slope, the probability of bubbles sticking along the inner wall of the first side plate 521 during the floating process can be reduced, thereby improving the heat exchange efficiency between the working fluid in the first area and the heat source 4.

[0120] The following is a detailed description of the specific implementation method provided in conjunction with the accompanying drawings.

[0121] In some embodiments, the wall thickness of the first region 5211 and / or the second region 5212 may be reduced along the direction from the second region 5212 to the first region 5211, and the inner wall of the first side plate 521 may form an inclined surface or a stepped surface. By reducing the wall thickness, the inner wall of the first side plate 521 forms a stepped surface or an inclined surface. When the bubbles in the first region 5211 and / or the second region 5212 float upward in the height direction, they will move away from the inner wall surface above the first side plate 521, thereby reducing the number of bubbles on the inner wall and improving the heat exchange effect of the inner wall.

[0122] It can be understood that, along the direction from the second region 5212 to the first region 5211, the wall thickness of the first region 5211 and the second region 5212 both decreases, or, along the direction from the second region 5212 to the first region 5211, the wall thickness of the first region 5211 or the second region 5212 decreases.

[0123] like Fig.15 and Fig.16 and Fig.30 as well as Fig.31 As shown, the method of reducing the wall thickness of the first area 5211 and the second area 5212 includes but is not limited to that the wall thickness of the first side plate 521 gradually decreases along the direction from the second area 5212 to the first area 5211, and the inner wall of the first side plate 521 forms an inclined surface. The inclination angle of the inclined surface can be set according to different needs. In practical applications, the inner walls of the first area 5211 and the second area 5212 corresponding to the inner walls in contact with the cooling medium can be located on the same inclined surface, such as Fig.15 , Fig.16 and Fig.30, which is easier to process; of course, they may not be located on the same inclined surface, such as the inner wall of the first area 5211 and the upper end of the inner wall of the second area 5212 (see the above Fig.11 The upper and lower explanations in the figure) are two parallel planes, and such an arrangement can avoid the lateral size of the evaporator being too large due to the excessive thickness of some areas of the first side plate 521. Of course, in practical applications, the planes where the inner walls of the two are located are not necessarily strictly parallel, and there may be a certain deviation. Ideally, the slopes of the two should be positive or negative, or the inner walls of the two should be vertical planes.

[0124] in, Fig.15 and Fig.30 The manner in which the wall thickness of the first side plate 521 gradually decreases from the second area 5212 to the first area 5211 includes but is not limited to: the first area 5211 is above the straight line where the infusion tube 55 is located, and the second area 5212 is below the straight line where the infusion tube 55 is located; and Fig.16 and Fig.31 The first area 5211 and the second area 5212 are respectively inclined surfaces, including but not limited to: the first area 5211 is above the straight line where the infusion tube 55 is located, and the second area 5212 is below the straight line where the infusion tube 55 is located.

[0125] like Figures 11 to 14 , Fig. 22 , Figure 27 to Figure 29 As shown, the wall thickness of the first area 5211 of the inner wall of the first side plate 521 is smaller than the wall thickness of the second area 5212 of the inner wall of the first side plate 521, so that there is a relative lateral displacement difference between the inner wall of the first area 5211 and the inner wall of the second area 5212, thereby forming a step surface, so that the inner wall of the first area 5211 and the inner wall of the second area 5212 do not overlap.

[0126] It can be understood that Fig.11 , Fig.13 , Fig. 22 The first area 5211 in the figure may be the portion above the straight line where the infusion tube 55 is located, and the second area 5212 may be the portion below the straight line where the infusion tube 55 is located; Fig.14 The first area 5211 is the position above the boss of the first side plate 521, and the second area 5212 is the position at and below the boss; Fig. 27 and Fig.29 The first region 5211 may be a position above the step surface of the first side plate 521 , and the second region 5212 may be a region below the step surface. It can be understood that the wall thickness of the first region 5211 is smaller than the wall thickness of the second region 5212 .

[0127] Figure 23 to Figure 25aAs shown, the first region 5211 protrudes relative to the second region 5212 in a direction away from the second side plate 522 , so that an inner wall of the first region 5211 and the second region 5212 form a step surface.

[0128] The first area 5211 is a portion protruding outward from the upper position of the first side plate 521, and all positions below the first area 5211 include but are not limited to protruding positions.

[0129] It should be noted that the above only discloses some exemplary shapes of the first side plate 521. Those skilled in the art will appreciate that, based on the above disclosure, the shape of the inner wall of the first side plate 521 can be changed according to different needs. Fig.25a In the figure, the leftward protrusion 5214 on the first side plate 521 below the infusion tube 55 is a part of the second area 5212, and the area on the first side plate 521 above the infusion tube 55 is the first area 5211. The first area 5211 and the second area 5212 serve as part or all of the inner wall of the first side plate 521.

[0130] exist Fig.25b In the figure, the leftward protrusion 5214 on the first side plate 521 below the infusion tube 55 is a part of the first area 5211, and the area on the first side plate 521 below the protrusion 5214 is the second area 5211. The first area 5211 and the second area 5212 serve as part or all of the inner wall of the first side plate 521. In this way, the first area 5211 can be closer to the second side plate 522 relative to the second area 5212 to meet different processing requirements.

[0131] In summary, as long as the first area 5211 and the second area 5212 are not coplanar, they are all within the protection scope. This article will not list them one by one, but they are all within the protection scope.

[0132] In addition, if Fig.30 , Fig.31As shown, by setting the wall thickness of the first area 5211 of the first side plate 521 to be smaller than the wall thickness of the second area 5212, the wall thickness between the second area 5212 of the first side plate 521 and the heat source 4 can be increased. Due to the large wall thickness, the amount of heat transfer can be reduced, the heat exchange efficiency is reduced, and the effect of heat exchange between the first side plate 521 and the heat source 42 below is reduced. The wall thickness between the first area 5211 of the first side plate 521 and the heat source 4 is reduced. Due to the small wall thickness, the amount of heat transfer can be large, the heat exchange efficiency is increased, and the effect of heat exchange between the first side plate 521 and the heat source 42 above is increased. In addition, since the coolant at the second area 5212 is far away from the heat source, the temperature of the coolant at the second area 5212 is low; while the coolant at the first area 5211 is close to the top of the evaporator and the distance to the heat source is close, so the temperature of the coolant at the first area 5211 is high. In summary, the heat exchange efficiency of the first area 5211 is high, but the temperature of the coolant in the first area 5211 is relatively high; while the heat exchange efficiency of the second area 5212 is low, but the temperature of the coolant in the second area 5212 is relatively low. Therefore, the difference in heat exchange effect between the first area 5211 and the second area 5212 can be reduced, thereby reducing the temperature difference between the lower heat source 42 and the upper heat source 42.

[0133] In addition, if Figures 17 to 20 as well as Figure 32 to Figure 35 As shown, in some embodiments, a guide member 523 can also be provided on the inner wall of the first side plate 521, so as to guide the vaporized working fluid below in a direction away from the first side plate 521, thereby reducing the influence of the bubbles generated in the second area 5212 on the first area 5211 of the first side plate 521, reducing the temperature difference between the heat source 42 below and the heat source 42 above, and ensuring the heat exchange effect of the first area 5211.

[0134] It should be noted that the inner wall of the first area 5211 and / or the inner wall of the second area 5212 in this article has a guide member 523; when the guide member 523 is located on the inner wall of the first area 5211, the guide member 523 forms a part of the inner wall of the first area 5211; when the guide member 523 is located on the inner wall of the second area 5212, the guide member 523 forms a part of the inner wall of the second area 5212, and the vertex of the guide member 523 of the second area 5212 is the vertex on the inner wall of the second area 5212 facing the second side plate 522.

[0135] The guide member 523 is arranged perpendicular to the first vertical line O1 or at an angle to the first vertical line O1. In some embodiments, the guide member 523 is a structure protruding from the straight part of the inner wall of the first side plate 521, and the guide member 523 is perpendicular or inclined to the straight part of the inner wall of the first side plate 521.

[0136] The inclination angle and inclination mode of the guide member 523 can be set according to different needs and are all within the protection range. It should be noted that in some embodiments, the radiator assembly 5 can select at least one of the guide member 523, the improvement of the evaporator and the liquid replenishing pipe 55 to solve the problem of poor heat exchange effect with the heat source.

[0137] like Fig.10 and Fig.11 In the illustrated embodiment, the heat source 4 is arranged in a single layer and is arranged in plurality along the second direction. The evaporator 52 has a plurality of infusion ports 551 connected to the infusion tube. In some embodiments, the infusion tube 55 corresponds one-to-one to the infusion ports 551 , or a plurality of infusion ports 551 correspond to one infusion tube 55 .

[0138] It should be noted that the evaporator 52 is provided with a plurality of liquid replenishing ports 551 along the first direction, and the liquid replenishing ports 551 are located beside the heat source 4 , including but not limited to being located at the center of the heat source 4 along the first direction.

[0139] The liquid replenishing port 551 is disposed beside the heat source 4 , which can facilitate the installation and arrangement of the liquid replenishing pipe 55 on the evaporator 52 .

[0140] like Fig.12 and Fig.13 In the illustrated embodiment, the liquid replenishing port 551 is arranged opposite to the heat source 4 , that is, the projection of the liquid replenishing port 551 along the second direction falls into the heat source 4 .

[0141] In some embodiments, the evaporator 52 is a box structure, and includes a first side plate 521 close to the heat source 4 and a second side plate 522 opposite to the first side plate 521 .

[0142] The liquid replenishing port 551 is provided on the first side plate 521 and / or the second side plate 522. The arrangement of the liquid replenishing port 551 can be set according to different needs and are all within the protection range. The inlet channel 53 and the outlet channel 54 include but are not limited to being connected with the second side plate 522, and can also be connected with the first side plate 521. The connection position of the inlet channel 53 and the outlet channel 54 can be set according to the spatial position of the evaporator 52, as long as the position where the installation can be achieved is within the protection range.

[0143] When the liquid replenishing port 551 is disposed beside the heat source 4 , the liquid replenishing port 551 may be opened on the first side plate 521 . When the liquid replenishing port 551 is opposite to the heat source 4 , the liquid replenishing port 551 may be opened on the second side plate 522 .

[0144] It should be noted that the above arrangement of the liquid infusion port 551 may be adopted in other embodiments.

[0145] Fig.11 and Fig.13In the direction from the second area 5212 to the first area 5211 of the evaporator 52, the wall thickness of the first side plate 521 decreases.

[0146] In some embodiments, the first side plate 521 includes but is not limited to the inner side of the first side plate 521 being a stepped surface. The first side plate 521 has a thick wall including but is not limited to having three sections of different sizes. From the top to the bottom of the evaporator 52, it includes the first section, the second section and the third section in sequence, wherein the thickness of the first section is less than the thickness of the second section, and the thickness of the second section is less than the thickness of the third section. The first section forms the first area 5211, and the second section and the third section form the second area 5212.

[0147] The thickness of the first section, the second section and the third section and the length along the first direction can be set according to different needs and are all within the protection range.

[0148] In order to achieve different wall thicknesses between the first area 5211 and the second area 5212 of the first side plate 521, other methods may be used in some embodiments, such as Fig.15 and Fig.16 In the illustrated embodiment, the first area 5211 on the inner side of the first side plate 521 includes a first gradually expanding section 52111 that gradually expands from the first area 5211 of the evaporator 52 toward the second area 5212, and the second area 5212 includes a second gradually expanding section 52121 that gradually expands from the first area 5211 of the evaporator 52 toward the second area 5212.

[0149] The position and length of the first gradually expanding section 52111 of the first side plate 521 can be set according to different needs, and the taper of the first gradually expanding section 52111 of the first side plate 521 can also be set according to different heat dissipation requirements.

[0150] Fig.15 The first gradually expanding section 52111 of the first area 5211 and the second gradually expanding section 52121 of the second area 5212 are connected as an integrated gradually expanding structure and are located in the middle position of the first direction of the first side plate 521. The length along the first direction is the length of the heat source 4 along the first direction, and the first gradually expanding section 52111 of the first area 5211 is opposite to the heat source 4.

[0151] Fig.16 A groove 5213 is provided on the gradually expanding structure for connecting the liquid replenishing tube 55 to replenish the evaporator 52. The opening position of the groove 5213 includes but is not limited to the edge of the liquid replenishing port 551 connected to the liquid replenishing tube 55. The size, opening position and number of the groove 5213 can be set according to different needs and are all within the protection range.

[0152] like Figures 17 to 20 As shown, a guide member 523 is disposed on the inner side of the first side plate 521 .

[0153] The guide member 523 includes but is not limited to an inclined plate, and the inclined direction of the inclined plate is from the bottom end to the top end of the evaporator 52, and is inclined in the direction away from the first side plate 521, so as to guide the working fluid vaporized after heat exchange at the bottom of the evaporator 52 in the direction away from the first side plate 521.

[0154] In some embodiments, a plurality of heat sources 42 are integrated in the heat source 4 , the heat sources 42 are arranged along a first direction, and the guide member 523 is located between adjacent heat sources 42 arranged along the first direction.

[0155] Along the first direction, the guide member 523 is located between adjacent fluid infusion ports 551 that are in communication with the fluid infusion tube 55. The size and inclination angle of the guide member 523 can be set according to different needs and are within the protection range.

[0156] like Fig.18 and Fig.19 In the illustrated embodiment, along the first direction, the length of the guide member 523 gradually decreases from the bottom end to the top end of the evaporator 52. In an optional embodiment, the inclination angles of the guide member 523 may be the same or different.

[0157] Fig. 20 The guide member 523 is a plate member, and the side of the guide member 523 close to the bottom end of the evaporator 52 is a guide surface 5231, and the guide surface 5231 is smoothly guided from the first side plate 521 to the second side plate 522 to the top end of the evaporator 52. The guide surface 5231 of the guide member 523 is a smooth surface, which can reduce the resistance of the guide member 523 to the gasified working medium and further guide the gasified working medium, which is conducive to improving the rapid flow of the gasified working medium away from the first side plate 521 and avoiding the accumulation of the gasified working medium.

[0158] The above embodiment is based on the description of the wall thickness of the first side plate 521, the arrangement of the liquid infusion tube 55 and the arrangement of the guide member 523 when the heat source 4 is arranged in a single layer. Figures 21 to 35 When the heat source 4 is arranged in multiple layers, the wall thickness of the first side plate 521, the arrangement of the liquid infusion tube 55, and the arrangement of the guide member 523 are described.

[0159] like Fig.21 In the illustrated embodiment, the heat source 4 is arranged in two layers along the first direction, which is included but not limited to two layers in the present application, and may also be arranged in three layers or more. When arranging other numbers of layers, the wall thickness of the first side plate 521 of the radiator assembly 5, the setting of the infusion tube 55, and the arrangement of the guide member 523 may be referred to the description below and will not be repeated herein.

[0160] It should be noted that, a layer of heat source 42 or multiple layers of heat source 42 may be arranged in the heat source 4 along the first direction.

[0161] like Fig.21 As shown, the evaporator 52 has a plurality of liquid infusion ports 551 connected to the liquid infusion tube. In some embodiments, the liquid infusion tube 55 corresponds to the liquid infusion ports 551 one by one, or a plurality of liquid infusion ports 551 corresponds to one liquid infusion tube 55 .

[0162] It should be noted that the evaporator 52 is arranged with a plurality of liquid replenishing ports 551 along the first direction, and the liquid replenishing ports 551 are located between adjacent heat sources 4 arranged along the first direction, including but not limited to being located at the center position of the heat source 4 along the first direction.

[0163] like Fig.26 In the illustrated embodiment, the refill port 551 may also be disposed beside the heat source 4, which may facilitate the installation and arrangement of the refill pipe 55 on the evaporator 52. In some embodiments, the refill port 551 is distributed between adjacent heat sources 4 arranged along the second direction. By disposing the refill port 551 between adjacent heat sources 4 in the second direction, the temperature difference above and below the refill port 551 may be improved. It can be understood that after the working fluid below exchanges heat with the heat source 4, the temperature of the working fluid increases, and after the temperature of the working fluid increases, the working fluid will exchange heat with the working fluid above, which will increase the temperature of the working fluid above and reduce the heat absorption effect of the working fluid above. Based on this, disposing the refill port 551 between the heat sources 4 may reduce the temperature at the connection between the working fluid below and the working fluid above, thereby alleviating the influence of the working fluid below on the temperature of the working fluid above.

[0164] The distance between the liquid replenishing port 551 and the heat source 4 can be set according to different needs and is within the protection range.

[0165] like Fig.28 In the illustrated embodiment, the liquid replenishing port 551 is located directly opposite to the heat source 4 , that is, the projection of the liquid replenishing port 551 along the second direction falls into the heat source 4 .

[0166] The opening position of the liquid replenishing port 551 can be set according to different needs. Preferably, the liquid replenishing port is opened in the middle position of the evaporator 52 along the first direction to reduce the temperature of the working fluid in the middle position inside the evaporator 52, reduce the influence of the working fluid at the bottom of the evaporator 52 on the working fluid at the top, and thereby reduce the temperature difference between the upper and lower heat sources 42.

[0167] Combination Figure 22 to Figure 24 , Fig.26 and Fig. 27 as well as Fig.28 and Fig.29 As shown, in some embodiments, the evaporator 52 is a box structure, and includes a first side plate 521 close to the heat source 4 and a second side plate 522 opposite to the first side plate 521 .

[0168] The liquid inlet 551 is provided on the first side plate 521 and / or the second side plate 522. The arrangement of the liquid inlet 551 can be set according to different needs and is within the protection range.

[0169] When the liquid inlet 551 is disposed beside the heat source 4, the liquid inlet 551 can be disposed on the first side plate 521. When the liquid inlet 551 is opposite to the heat source 4, the liquid inlet 551 can be disposed on the second side plate 522. Of course, it is not necessary to dispose the liquid inlet 551 on the first side plate 521 or the second side plate according to the position of the heat source 4.

[0170] It should be noted that the arrangement of the above-mentioned liquid inlet 551 may be adopted in the other embodiments mentioned above.

[0171] The wall thickness of the first side plate 521 is described below with reference to the accompanying drawings.

[0172] Fig. 22 , Fig. 27 and Fig.29 In the illustrated embodiment, the inner side surface of the first side plate 521 is a stepped surface, and includes a first section and a second section in sequence from the top to the bottom of the evaporator 52, wherein the thickness of the first section is less than the thickness of the second section. It can be understood that the first section is the first area 5211, and the second section is the second area 5212.

[0173] The lengths of the first section and the second section along the first direction can be set according to different needs. In some embodiments, the first section is opposite to the upper heat source 4, and the second section is opposite to the lower heat source 4. When multiple layers of heat sources 4 are arranged along the first direction, the inner wall of the first side plate 521 can be set to multiple sections, and the thickness increases sequentially from the top end to the bottom end of the evaporator 52.

[0174] The thickness of the first section and the second section can be set according to different needs and is not specifically limited here.

[0175] In order to achieve different wall thicknesses between the first area 5211 and the second area 5212 of the first side plate 521, other methods may be used in some embodiments. Fig.15 and Fig.16 In the illustrated embodiment, the first region 5211 and the second region 5212 on the inner side of the first side plate 521 both include a gradually expanding section that gradually expands from the top end to the bottom end of the evaporator 52 .

[0176] Fig.30In the illustrated embodiment, the gradually expanding structure formed by the first region 5211 and the second region 5212 is located in the middle of the first direction of the first side plate 521, and the length along the first direction is the length of the heat source 4 along the first direction, and the first gradually expanding section 52111 of the first region 5211 is opposite to the heat source 4. The first gradually expanding section 52111 of the first region 5211 and the second gradually expanding section 52121 of the second region 5212 are connected to form an integrated gradually expanding structure.

[0177] Fig.31 In the illustrated embodiment, the first gradually expanding section 52111 and the second gradually expanding section 52121 are arranged in sections along the first direction, i.e., there is a non-gradually expanding structure between the two, so that the inner wall of the first side plate 521 has a multi-section gradually expanding structure, and is arranged one-to-one with the heat source 4.

[0178] Fig.23 In some embodiments, the first region 5211 of the first side plate 521 protrudes in a direction away from the second side plate 522 relative to the second region 5212 .

[0179] Fig.24 In the illustrated embodiment, the second region 5212 of the first side plate 521 protrudes relative to the first region 5211 toward the second side plate 522 , so that the cross-sectional shape of the inner wall of the first side plate 521 from top to bottom forms a U-shaped structure as a whole.

[0180] Fig.32 In the illustrated embodiment, a guide member 523 is provided on the inner side of the first side plate 521. The guide member 523 includes but is not limited to an inclined plate, and the inclined direction of the inclined plate is from the bottom end to the top end of the evaporator 52, and is inclined in a direction away from the first side plate 521, so as to guide the bubbles generated after the heat exchange in the lower part of the evaporator 52 in a direction away from the first side plate 521.

[0181] The heat sources 4 are arranged in multiple layers along the first direction, and the guide members 523 are arranged between adjacent heat sources 4 arranged along the first direction. Exemplarily, the guide member 523 may be located above the center position corresponding to any heat source 4 on the first area 5211, and the guide member 523 is used to guide the bubbles generated by the heat source on the inner wall of the first side plate 521; if the guide member 523 is located below the position relative to the center of the heat source, it can guide the bubbles generated by the heat source located below the heat source.

[0182] Similarly, the guide member 523 may also be arranged along the second direction on the inner wall of the first side plate 521 opposite to the heat source 4 .

[0183] Fig.33In the illustrated embodiment, a guide member 523 is disposed inside the first side plate 521, and a plurality of guide members 523 are disposed along the first direction. In some embodiments, the length of the guide member 523 located in the middle is greater than the lengths of the guide members 523 on both sides.

[0184] Fig.19 In the illustrated embodiment, a guide member 523 is disposed on the inner wall of the first side plate 521 . There are two guide members 523 along the first direction, and the length of the upper guide member 523 is shorter than the length of the lower guide member 523 .

[0185] Fig.34 In the illustrated embodiment, a guide member 523 is provided on the inner wall of the first side plate 521 , and the guide member 523 serves as a part of the inner wall of the second area 5212 . The vertex of the guide member 523 is the vertex on the inner wall of the second area 5212 facing the second side plate 522 .

[0186] Fig.35 In the illustrated embodiment, the inner wall of the first side plate 521 is provided with a guide member 523. Along the first direction, there are multiple guide members 523, and at least one guide member 523 is arranged obliquely, and the other guide members 523 are arranged perpendicular to the first direction. In an optional embodiment, the inclination angles of the multiple guide members 523 can be the same or different; the lengths of the multiple guide members 523 can be the same or different.

[0187] The inventors have found that when two or more guide members 523 are of equal length, the bubbles leave the end of the guide member 523 away from the first side plate 521, that is, Fig.35 After reaching the left end of the guide member 523 shown in the figure, the bubbles derived from the upper and lower guide members 523 will overlap with each other, thereby forming an air curtain area with very low density in the area above the end of the uppermost guide member 523 among the above-mentioned multiple guide members 523. The air curtain area will have a negative impact on the rightward flow of the coolant on the left side. In addition, it will also increase the flow trend of the coolant at the upper heat source of the uppermost guide member 523 toward the air curtain area, thereby reducing the cooling effect at the upper heat source. In the preferred scheme, the simulation results show that the unequal lengths of the guide members 523 have a better effect.

[0188] It should be noted that the length of the guide member 523 herein refers to the distance from one end of the guide member 523 connected to the first side plate 521 to the other end.

[0189] In addition, the present application also discloses a power device, including a cabinet 1, a heat source 4 arranged in the cabinet 1, and a radiator assembly 5 for dissipating heat from the heat source 4, wherein the radiator assembly 5 is the radiator assembly 5 disclosed in the above-mentioned embodiment. Therefore, the power device having the radiator assembly 5 also has all the above-mentioned technical effects, which will not be repeated here one by one.

[0190] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0191] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An evaporator, characterized in that: include: a first side panel and a second side panel, The first side plate and the second side plate are arranged opposite to each other, and the first side plate is divided into a first area and a second area along a height direction, the height of the first area is higher than that of the second area, and the first area is used to face at least one heat source; A first perpendicular line on the inner wall of the first region at a position opposite to the center of the heat source does not coincide with a second perpendicular line on the inner wall of the second region toward the vertex of the second side plate.

2. The evaporator according to claim 1, characterized in that The first vertical line is located between the second side plate and the second vertical line, or, The second vertical line is located between the second side plate and the first vertical line.

3. The evaporator according to claim 2, characterized in that The inner wall of the first region is an inner wall having at least a partial region which is not coplanar with other positions of the inner wall; and / or, The inner wall of the second region is an inner wall having at least a partial region which is not coplanar with other positions of the region.

4. The evaporator according to claim 3, characterized in that The inner wall of the first region is an inclined surface or a stepped surface; and / or, The inner wall of the second area is an inclined surface or a stepped surface.

5. The evaporator according to claim 4, characterized in that Along the direction from the second region to the first region, the wall thickness of the first region and / or the second region decreases.

6. The evaporator according to claim 4, characterized in that The inner wall of the first area and the inner wall of the second area are connected to form a step structure.

7. The evaporator according to claim 6, characterized in that The wall thickness of the second region is greater than the wall thickness of the first region; Alternatively, the first area protrudes relative to the second area in a direction away from the second side plate.

8. The evaporator according to claim 2, characterized in that The inner wall of the first region and / or the inner wall of the second region has a guide member for guiding the working medium; When the guide member is located on the inner wall of the first region, the guide member forms a part of the inner wall of the first region; when the guide member is located on the inner wall of the second region, the guide member forms a part of the inner wall of the second region, and the vertex of the guide member of the second region is formed as a vertex on the inner wall of the second region facing the second side panel.

9. The evaporator according to claim 8, characterized in that The guide member is arranged perpendicular to the first vertical line or at an angle to the first vertical line.

10. The evaporator according to claim 9, characterized in that When the guide member and the first vertical line form an included angle, the guide member is inclined in a direction away from the inner wall of the first side plate along the direction from the second area to the first area.

11. The evaporator according to claim 9, characterized in that A plurality of guide members are arranged on the inner wall of the first side plate in a direction from the second area to the first area; And / or, a plurality of the guide members are arranged on the inner wall of the first side plate along a direction perpendicular to the direction from the second area to the first area.

12. The evaporator according to claim 11, characterized in that The length of the guide member gradually decreases along the direction from the second area to the first area; Alternatively, the length of the guide member located in the middle position among the guide members is greater than the length of the guide members at the two side positions.

13. The evaporator according to claim 8, characterized in that The guide member is located between adjacent heat sources in the height direction of the evaporator; or, The guide is opposite to the heat source or located at the edge of the heat source.

14. The evaporator according to claim 8, characterized in that The guide member is a flat plate member. Alternatively, the guide member is a plate member, and the side surface of the guide member close to the bottom end of the evaporator is a guide surface, and the guide surface is smoothly guided from the first side plate to the second side plate toward the top end of the evaporator.

15. A heat sink assembly, comprising: An evaporator and a condenser, characterized in that the evaporator is an evaporator as described in any one of claims 1-14.

16. A power device, comprising a cabinet, a heat source disposed in the cabinet, and a heat sink assembly for dissipating heat from the heat source, characterized in that: The radiator assembly is the radiator assembly according to claim 15.

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