Photoelectric coupler and multichannel photoelectric coupler

Abstract

The invention provides a photoelectric coupler and a multi-channel photoelectric coupler, and relates to the technical field of integrated circuits, the photoelectric coupler comprises a tube shell, a light-emitting chip, a photosensitive chip and a cover plate, an opening is formed in the shell wall of the tube shell, and the opening is communicated with a cavity of the tube shell; the light-emitting chip and the photosensitive chip are both located in the cavity, and the cover plate covers the opening. The cover plate is used for sealing the cavity. The light incident surface of the photosensitive chip is not higher than the light emitting chip, and the light emitted by the light emitting chip can irradiate the photosensitive chip, so that electric-optical-electric signal conversion of the photoelectric coupler is realized; in addition, the light-emitting chip and the photosensitive chip are arranged in the cavity of the tube shell, so that the packaging process of the photoelectric coupler is simplified, and the packaging efficiency of the photoelectric coupler is improved; the multi-channel photoelectric coupler comprises a plurality of photoelectric couplers, the packaging efficiency of the multi-channel photoelectric coupler is improved, and optical crosstalk between channels is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuits, and in particular to a photoelectric coupler and a multi-channel photoelectric coupler. Background Art

[0002] Optocoupler (optical coupler equipment), also known as photoelectric isolator or optical coupler, referred to as optocoupler, is a device that uses light as a medium to transmit electrical signals. Optocouplers include a light source and a light receiver sealed in the same housing. In the process of optocoupler signal conversion, the light source converts the electrical signal into an optical signal, and the light receiver receives the optical signal and converts the optical signal into an electrical signal for output, thereby realizing the electrical-optical-electrical conversion.

[0003] In the prior art, the packaging structure of the optocoupler includes a tube shell, an inner ceramic chip and a cover plate, the light source is located on the inner ceramic chip, and the light receiver is located in the tube shell. In the optocoupler packaging process, the light source and the light receiver are respectively mounted on the inner ceramic chip and the tube shell through two mounting and bonding processes, and then the inner ceramic chip and the tube shell are aligned and assembled, and finally the cover plate is assembled at the shell opening of the tube shell to complete the packaging.

[0004] However, existing optical couplers have the problem of low assembly efficiency. Summary of the invention

[0005] The present application provides a photoelectric coupler and a multi-channel photoelectric coupler, which improve the assembly efficiency of the photoelectric coupler.

[0006] In a first aspect, an embodiment of the present application provides a photocoupler. The photocoupler includes a tube shell, a light-emitting chip, a photosensitive chip, and a cover plate. An opening is provided on the shell wall of the tube shell. The opening is used to communicate with the cavity of the tube shell. The light-emitting chip and the photosensitive chip are both located in the cavity. The cover plate covers the opening, and the cover plate is used to seal the cavity.

[0007] The light emitting surface of the light emitting chip and the light incident surface of the photosensitive chip are both away from the bottom of the tube shell, and the light incident surface of the photosensitive chip is not higher than the light emitting chip.

[0008] In the above-mentioned photoelectric coupler, optionally, it further includes a first step. The first step is located in the cavity. The step surface of the first step is higher than the inner bottom wall of the tube shell and lower than the opening of the tube shell. The light-emitting chip is arranged on the first step.

[0009] The photosensitive chip is arranged on the inner bottom wall of the tube shell and is spaced apart from the first step.

[0010] In the above-mentioned photoelectric coupler, optionally, it further includes at least two pins, at least two conductive layers and at least two conductive members. The pins are connected to the outer wall of the tube shell. The conductive layer is arranged in the cavity. The at least two conductive layers are electrically connected to the at least two conductive members in a one-to-one correspondence, and are electrically connected to the at least two pins in a one-to-one correspondence through the corresponding conductive members.

[0011] The photosensitive chip and the light-emitting chip are electrically connected to different conductive layers respectively.

[0012] In the above-mentioned photoelectric coupler, optionally, the photoelectric coupler has a first conductive through hole. The first conductive through hole passes through the shell wall of the tube shell and the first step. The number of the first conductive through holes is two.

[0013] The conductive member includes two first conductive members, and the two first conductive members are located in two first conductive through holes in a one-to-one correspondence.

[0014] The conductive layer includes two first conductive layers, and both first conductive layers are electrically connected to the light emitting chip.

[0015] The pins include a first pin; the number of the first pins is two.

[0016] The two first conductive layers are electrically connected to the two first conductive members in a one-to-one correspondence, and the two first conductive members are electrically connected to the two first pins in a one-to-one correspondence.

[0017] In the above-mentioned photoelectric coupler, optionally, the first conductive layer is disposed on the step surface of the first step, and the orthographic projection of the first conductive layer on the step surface of the first step at least partially overlaps with the orthographic projection of the light emitting chip on the step surface of the first step.

[0018] In the above-mentioned photoelectric coupler, optionally, it also includes a metal layer and an auxiliary metal layer, the metal layer is arranged on the side of the tube shell close to the opening, the auxiliary metal layer is arranged on the side of the cover plate close to the opening, and the cover plate is covered at the opening through the auxiliary metal layer and the metal layer.

[0019] In the above-mentioned photoelectric coupler, optionally, the light-emitting chip includes a first light-emitting electrode and a second light-emitting electrode. A first bonding wire is arranged on the light-emitting chip. The first light-emitting electrode is electrically connected to a first conductive layer through the first bonding wire. The second light-emitting electrode is electrically connected to another first conductive layer through a conductive adhesive.

[0020] In the above-mentioned photoelectric coupler, optionally, the conductive layer includes a second conductive layer. The number of the second conductive layers is two. The two second conductive layers are both arranged on the inner bottom wall of the cavity.

[0021] The photosensitive chip comprises a first photosensitive electrode and a second photosensitive electrode, and the first photosensitive electrode and the second photosensitive electrode are electrically connected to the two second conductive layers in a one-to-one correspondence.

[0022] In the above-mentioned photoelectric coupler, optionally, a second bonding wire is provided on the photosensitive chip, the first photosensitive electrode and one second conductive layer are electrically connected via the second bonding wire, and the second photosensitive electrode is connected to another second conductive layer via a conductive adhesive.

[0023] The photoelectric coupler also includes two second conductive through holes, which are arranged through the shell wall of the tube shell.

[0024] The conductive member includes two second conductive members; the two second conductive members are located in the second conductive through holes in a one-to-one correspondence.

[0025] The pins include two second pins. The two second conductive layers are electrically connected to the two second conductive members in a one-to-one correspondence, and the two second conductive members are electrically connected to the two second pins in a one-to-one correspondence.

[0026] In the above-mentioned photoelectric coupler, optionally, the tube shell has a plurality of cavities, the plurality of cavities are arranged in an array, and the plurality of cavities are all connected to the opening.

[0027] There are multiple cover plates, which are arranged in one-to-one correspondence with the multiple cavities, and the cover plates are used to seal the cavities.

[0028] There are multiple light-emitting chips and multiple photosensitive chips, and the multiple light-emitting chips are located in the multiple cavities in a one-to-one correspondence, and the multiple photosensitive chips are located in the multiple cavities in a one-to-one correspondence.

[0029] In the above-mentioned photoelectric coupler, optionally, it further includes a reflective layer, which is arranged on a side of the cover plate close to the tube shell; the reflective layer and the cover plate are connected, or the reflective layer and the cover plate are abutted.

[0030] Along the height direction of the photoelectric coupler, the orthographic projection of the reflective layer on the cover plate covers at least a portion of the cover plate.

[0031] In a second aspect, an embodiment of the present application provides a multi-channel optocoupler, comprising at least one optocoupler.

[0032] In the above multi-channel photoelectric coupler, optionally, there are multiple photoelectric couplers, and the multiple photoelectric couplers are arranged in an array, with a gap between two adjacent photoelectric couplers.

[0033] The present application provides a photocoupler and a multi-channel photocoupler, the photocoupler comprising a tube shell, a light-emitting chip, a photosensitive chip and a cover plate, wherein an opening is provided on the shell wall of the tube shell, the opening is connected to the cavity of the tube shell; the light-emitting chip and the photosensitive chip are both located in the cavity, and the cover plate covers the opening; the cover plate is used to seal the cavity. The light-emitting surface of the light-emitting chip and the light-entering surface of the photosensitive chip are both away from the bottom of the tube shell. Compared with the prior art, in the prior art, the light-emitting chip of the photocoupler is located on the cover plate, and the photosensitive chip is located in the cavity of the tube shell. During the assembly process of the light-emitting chip and the photosensitive chip, the photosensitive chip and the light-emitting chip need to be mounted and bonded separately, while in the photocoupler provided in the embodiment of the present application, the light-emitting chip and the photosensitive chip are both located in the tube shell, and the photosensitive chip and the light-emitting chip can be mounted and bonded at the same time. The photocoupler provided in the embodiment of the present application has the advantages of simpler and more convenient packaging, which improves the packaging efficiency of the photocoupler. By setting the light incident surface of the photosensitive chip to be lower than the light emitting chip, the transmission of light during the use of the photoelectric coupler is ensured, and the electrical-optical-electrical signal conversion of the photoelectric coupler is realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0035] Figure 1 A schematic diagram of the structure of a photoelectric coupler from a first perspective provided in an embodiment of the present application;

[0036] Figure 2 A schematic diagram of the structure of the optocoupler from a second viewing angle provided in an embodiment of the present application;

[0037] Figure 3 A schematic diagram of the structure of a multi-channel optocoupler provided in an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 100: tube shell; 110: opening; 200: light emitting chip; 300: photosensitive chip; 400: cover plate; 500: first step;

[0040] 600: metal layer; 610: auxiliary metal layer;

[0041] 700: pin; 701: first pin; 702: second pin;

[0042] 800: conductive layer; 801: first conductive layer; 802: second conductive layer; 811: first bonding wire; 812: second bonding wire;

[0043] 901: first conductive via; 902: second conductive via.

[0044] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0045] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0046] First, the nouns appearing in this application are explained:

[0047] Chip Mounting: Accurately mount surface mounted components to the target location. The equipment used is a chip mounter.

[0048] Chip mounter: Chip mounter, also known as "mounting machine" or "surface mount system", is a device that is placed after the dispensing machine or screen printer in the production line. It is used to place surface mount components accurately at preset positions by moving the mounting head.

[0049] Bonding: A process that uses copper wire, gold wire or aluminum wire to connect the chip pad and frame pin is called wire bonding process. Parameters that affect bonding include bonding temperature and bonding time.

[0050] The inventor of the present application discovered during actual research that in the field of integrated circuits, an optical coupler is an electrical-optical-electrical conversion device that uses light as a medium to transmit electrical signals.

[0051] In the prior art, the photoelectric coupler includes a light source, a light receiver, a tube shell, an inner ceramic chip and a cover plate. In the process of photoelectric coupler signal conversion, the light source converts the electrical signal into an optical signal, and the light receiver receives the optical signal and converts the optical signal into an electrical signal for output, so as to realize the conversion of electricity, light and electricity. In the packaging process of the photoelectric coupler, the light source is mounted on the inner ceramic chip by a mounting machine, and the light receiver is mounted in the tube shell by a mounting machine. Through two mounting and bonding, the light source and the light receiver are respectively mounted on the inner ceramic chip and the tube shell, and then the inner ceramic chip and the tube shell are aligned and assembled, and finally the cover plate is assembled at the shell opening of the tube shell to complete the packaging.

[0052] However, during the packaging process of the optocoupler, the light source chip is mounted on the inner ceramic chip, and the light receiver chip is mounted on the tube shell. Therefore, during the packaging process of the optocoupler, the light source and the light receiver need to be mounted separately, and the light source and the light receiver need to be bonded twice respectively. In other words, two mounting and bonding operations are required during the packaging process. Therefore, the existing optocouplers have the problem of low production efficiency.

[0053] In view of this, the embodiments of the present application provide a photocoupler and a multi-channel photocoupler, the photocoupler comprising a tube shell, a light-emitting chip, a photosensitive chip and a cover plate, wherein an opening is provided on the shell wall of the tube shell, the opening is connected to the cavity of the tube shell; the light-emitting chip and the photosensitive chip are both located in the cavity, and the cover plate covers the opening; the light-emitting surface of the light-emitting chip and the light-entering surface of the photosensitive chip are both away from the bottom of the tube shell. Compared with the prior art, in the prior art, the light-emitting chip of the photocoupler is located on the cover plate, and the photosensitive chip is located in the cavity of the tube shell. During the assembly process of the light-emitting chip and the photosensitive chip, the photosensitive chip and the light-emitting chip need to be mounted and bonded separately, while in the photocoupler provided in the embodiments of the present application, the light-emitting chip and the photosensitive chip are both located in the tube shell, and the photosensitive chip and the light-emitting chip can be mounted and bonded at the same time. The photocoupler provided in the embodiments of the present application has the advantages of simpler and more convenient packaging, which improves the packaging efficiency of the photocoupler. By setting the light incident surface of the photosensitive chip to be lower than the light emitting chip, the transmission of light during the use of the photoelectric coupler is ensured, and the electrical-optical-electrical signal conversion of the photoelectric coupler is realized. The multi-channel photoelectric coupler provided in the embodiment of the present application includes a plurality of the above-mentioned photoelectric couplers, thereby improving the packaging efficiency of the multi-channel photoelectric coupler.

[0054] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0055] In the first aspect, the present application provides a photocoupler, including a tube shell 100, a light-emitting chip 200, a photosensitive chip 300 and a cover plate 400. An opening 110 is provided on the shell wall of the tube shell 100, and the opening 110 is used to communicate with the cavity of the tube shell 100; the light-emitting chip 200 and the photosensitive chip 300 are both located in the cavity, and the cover plate 400 covers the opening 110. The cover plate 400 is used to seal the cavity.

[0056] The light emitting surface of the light emitting chip 200 and the light incident surface of the photosensitive chip 300 are both away from the bottom of the tube shell 100 , and the light incident surface of the photosensitive chip 300 is not higher than the light emitting chip 200 .

[0057] For example, refer to Figure 1 and Figure 2 As shown, in the packaging process of the optocoupler, the light emitting chip 200 and the photosensitive chip 300 are firstly mounted on the cavity of the tube shell 100 by a mounting machine. During the mounting process, the light emitting surface of the light emitting chip 200 and the light incident surface of the photosensitive chip 300 are both away from the bottom of the tube shell 100, and the light incident surface of the photosensitive chip 300 is set to be no higher than the light emitting chip 200. Finally, the cover plate 400 is covered on the opening 110. Compared with the optocoupler in the prior art, in the prior art, the light emitting chip 200 is placed on the cover plate 400, and the photosensitive chip 300 is placed on the cover plate 400. In the tube shell 100, since the photosensitive chip 300 and the light-emitting chip 200 are located at different positions, during the production process of the optocoupler, the photosensitive chip 300 and the light-emitting chip 200 need to be mounted and bonded separately. In the optocoupler provided in the embodiment of the present application, the light-emitting chip 200 and the photosensitive chip 300 are both located in the tube shell 100, and the photosensitive chip 300 and the light-emitting chip 200 can be mounted and bonded at the same time. The optocoupler provided in the embodiment of the present application has the advantages of simpler and more convenient packaging, which improves the packaging efficiency of the optocoupler. By setting the light incident surface of the photosensitive chip 300 to be lower than the light-emitting chip 200, the transmission of light during the use of the optocoupler is guaranteed, and the electrical-optical-electrical signal conversion of the optocoupler is realized.

[0058] During the use of the photoelectric coupler, after the light emitting chip 200 receives an electrical signal, the light emitting chip 200 converts the electrical signal into an optical signal, and the light emitting surface of the light emitting chip 200 emits light toward the cavity. At the same time, part of the light emitted from the light emitting surface of the light emitting chip 200 directly irradiates the light incident surface of the photosensitive chip 300 which is lower than the light emitting chip 200, and the other part of the light is reflected by the cover plate 400 and irradiates the light incident surface of the photosensitive chip 300. The photosensitive chip 300 converts the optical signals of the two parts of the received light into electrical signals. In this way, the photoelectric coupler realizes electrical-optical-electrical signal transmission.

[0059] In some embodiments, the light incident surface of the photosensitive chip 300 is lower than that of the light emitting chip 200 .

[0060] In some other embodiments, the light incident surface of the photosensitive chip 300 is flush with the bottom of the light emitting chip 200 .

[0061] As an achievable implementation, the optocoupler further includes a first step 500 , which is located in the cavity. The step surface of the first step 500 is higher than the inner bottom wall of the tube shell 100 and lower than the opening 110 of the tube shell 100 ; the light emitting chip 200 is disposed on the first step 500 .

[0062] The photosensitive chip 300 is disposed on the inner bottom wall of the tube shell 100 and is spaced apart from the first step 500 .

[0063] Exemplarily, in the packaging process of the optocoupler, first, the photosensitive chip 300 is mounted on the inner bottom wall of the tube shell 100, and the light-emitting chip 200 is mounted on the step surface of the first step 500, wherein the step surface of the first step 500 is higher than the inner bottom wall of the tube shell 100 to ensure that the light-emitting chip 200 located on the step surface of the first step 500 transmits light to the photosensitive chip 300; at the same time, the step surface of the first step 500 is lower than the opening 110 of the tube shell 100 to ensure that there is no contact between the top of the light-emitting chip 200 and the cover plate 400, so as to avoid affecting the sealing of the optocoupler.

[0064] As a feasible implementation, the optocoupler also includes at least two pins 700, at least two conductive layers 800 and at least two conductive parts; the pins 700 are connected to the outer wall of the tube shell 100, the conductive layer 800 is arranged in the cavity, and the at least two conductive layers 800 are electrically connected to the at least two conductive parts in a one-to-one correspondence, and are electrically connected to the at least two pins 700 in a one-to-one correspondence through the corresponding conductive parts.

[0065] The photosensitive chip 300 and the light-emitting chip 200 are electrically connected to different conductive layers 800 , respectively.

[0066] Exemplarily, during the use of the optocoupler, the electrical signal is transmitted to the light-emitting chip 200 through the pin 700 and the conductive member, the light-emitting chip 200 converts the electrical signal into an optical signal, the light-emitting chip 200 emits light into the cavity, the photosensitive chip 300 located on the bottom wall of the cavity receives the light from the light-emitting chip 200 on the step layer set on the first step 500, and converts the optical signal into an electrical signal, and the electrical signal is output from the corresponding pin 700 through the conductive member to realize signal transmission.

[0067] By defining the pin 700 connected to the conductive part and the light-emitting chip 200 as the input end, and defining the pin 700 connected to the conductive part and the photosensitive chip 300 as the output end, when an electrical signal is input to the input end, the light-emitting chip 200 will emit light, and the photosensitive chip 300 will convert the optical signal into an electrical signal after receiving the light, and the electrical signal will flow out from the output end, thereby realizing "electric-light-electric" control.

[0068] As a feasible implementation, the photocoupler has a first conductive through hole 901. The first conductive through hole 901 passes through the shell wall of the tube shell 100 and the first step 500. The number of the first conductive through holes 901 is two.

[0069] The conductive member includes two first conductive members, and the two first conductive members are located in two first conductive through holes 901 in a one-to-one correspondence.

[0070] The conductive layer 800 includes two first conductive layers 801 , and both first conductive layers 801 are electrically connected to the light emitting chip 200 .

[0071] The pins include a first pin 701 ; the number of the first pins 701 is two.

[0072] The two first conductive layers 801 are electrically connected to the two first conductive members in a one-to-one correspondence, and the two first conductive members are electrically connected to the two first pins 701 in a one-to-one correspondence.

[0073] Exemplarily, there are two first pins 701. The two first pins 701 are marked as an input first pin and an output first pin, respectively.

[0074] There are two first conductive layers 801. The two first conductive layers 801 are respectively marked as an input first conductive layer and an output first conductive layer.

[0075] The number of the first conductive vias 901 is two, and the two first conductive vias 901 are marked as an input first conductive via 901 and an output first conductive via 901, respectively.

[0076] The number of the first conductive members is two, and the two first conductive members are respectively marked as an input first conductive member and an output first conductive member.

[0077] When voltage is applied to the optocoupler through a power supply, current flows through the input first pin to the input first conductive member in the input first conductive via 901, and the input first conductive member transmits the current to the light-emitting chip 200 through the input first conductive layer; the current flowing through the light-emitting chip 200 transmits the current to the output first conductive member in the output first conductive via 901 through the output first conductive layer, and the output first conductive member transmits the current to the output first pin, so that the light-emitting chip 200 emits light and converts the electrical signal into an optical signal.

[0078] Exemplarily, the first pin 701 includes a first pin segment, a second pin segment, and a third pin segment connected to each other, wherein the first pin segment is connected to the bottom of the tube shell 100, the first pin segment and the third pin segment both extend along a first direction, the extension direction of the second pin segment intersects the first direction, and the first direction is referenced to Figure 1In the direction indicated by X in the figure; in this way, by connecting the first pin segment to the bottom of the tube shell 100, the contact area between the first pin 701 and the bottom of the tube shell 100 is increased, thereby ensuring smooth transmission of current; by arranging the first pin segment and the third pin segment to extend along the first direction, in this way, the first pin segment is connected to the bottom of the tube shell 100, and the third pin segment is connected to the plane to be installed of the optocoupler, thereby improving the installation stability of the first pin segment and the tube shell 100, the third pin segment and the surface to be installed; by arranging the extension direction of the second pin segment to intersect with the first direction, the bottom of the optocoupler is reasonably utilized, which is beneficial to the installation of the bottom of the optocoupler and the surface to be installed.

[0079] As a feasible implementation, the first conductive layer 801 is disposed on the surface of the first step 500, and the orthographic projection of the first conductive layer 801 on the step surface of the first step 500 at least partially overlaps with the orthographic projection of the light emitting chip 200 on the step surface of the first step 500. In this way, the connection area between the light emitting chip 200 and the first conductive layer 801 is increased, and the connection strength between the light emitting chip 200 and the first conductive layer 801 is increased. Such enhanced connection strength can effectively reduce connection failures caused by mechanical stress or thermal stress, thereby improving the reliability and durability of the light emitting chip 200.

[0080] As an achievable implementation, the light emitting chip 200 includes a first light emitting electrode and a second light emitting electrode. A first bonding wire 811 is provided on the light emitting chip 200, the first light emitting electrode is electrically connected to a first conductive layer 801 through the first bonding wire 811, and the second light emitting electrode is electrically connected to another first conductive layer 801 through a conductive adhesive.

[0081] Exemplarily, the first bonding wire 811 generally has low resistance and high conductivity, so that the first light-emitting electrode is electrically connected to a first conductive layer 801 via the first bonding wire 811, which is beneficial to efficient transmission of electrical signals.

[0082] The conductive adhesive can provide a large contact area and a stable electrical connection. Thus, the second light-emitting electrode is electrically connected to another first conductive layer 801 through the conductive adhesive, which is beneficial to improving the connection stability between the light-emitting chip 200 and the first conductive layer 801 .

[0083] By using different connection methods (the first light emitting electrode is connected via the first bonding wire 811 , and the second light emitting electrode is connected via a conductive adhesive), the reliability of the electrical connection of the light emitting chip 200 is improved.

[0084] Exemplarily, the light emitting chip 200 and the first conductive layer 801 are electrically connected via a first bonding wire 811. The first end of the first bonding wire 811 may be connected to the top of the light emitting chip 200, and the second end of the first bonding wire 811 may be connected to the first conductive layer 801; the first end of the first bonding wire 811 may also be connected to the bottom of the light emitting chip 200, and the second end of the first bonding wire 811 may be electrically connected to the first conductive layer 801.

[0085] Exemplarily, the first bonding wire 811 may be any one of a gold wire, a copper wire, and an aluminum wire.

[0086] As an achievable implementation, the conductive layer 800 includes two second conductive layers 802. The two second conductive layers 802 are both disposed on the inner bottom wall of the cavity.

[0087] The photosensitive chip 300 includes a first photosensitive electrode and a second photosensitive electrode, and the first photosensitive electrode and the second photosensitive electrode are electrically connected to two second conductive layers 802 in a one-to-one correspondence.

[0088] Exemplarily, after the photosensitive chip 300 is attached to the inner bottom wall of the tube shell 100 , the photosensitive chip 300 is bonded to the second conductive layer 802 to achieve electrical signal transmission.

[0089] As an achievable implementation, a second bonding wire 812 is provided on the photosensitive chip 300. The first photosensitive electrode is electrically connected to one second conductive layer 802 via the second bonding wire 812. The second photosensitive electrode is electrically connected to another second conductive layer 802 via a conductive adhesive.

[0090] The photoelectric coupler further includes two second conductive through holes 902 , and the second conductive through holes 902 are disposed through the shell wall of the tube shell 100 .

[0091] The conductive member includes two second conductive members, and the two second conductive members are located in the second conductive through hole 902 in a one-to-one correspondence.

[0092] The pin 700 includes two second pins 702. The two second conductive layers 802 are electrically connected to the two second conductive members in a one-to-one correspondence, and the two second conductive members are electrically connected to the two second pins 702 in a one-to-one correspondence.

[0093] Exemplarily, the number of the second pins 702 is two. The two second pins 702 are marked as an input second pin and an output second pin, respectively.

[0094] The number of the second conductive layers 802 is two. The two second conductive layers 802 are respectively marked as an input second conductive layer and an output second conductive layer.

[0095] The number of the second conductive vias 902 is two. The two second conductive vias 902 are marked as an input second conductive via 902 and an output second conductive via 902, respectively.

[0096] The number of the second conductive members is two, and the two second conductive members are marked as an input second conductive member and an output second conductive member, respectively.

[0097] It is understandable that when the photosensitive chip 300 has not yet received the light from the light emitting chip 200 , the resistance of the photosensitive chip 300 is infinite; when the photosensitive chip 300 receives the light from the light emitting chip 200 , the resistance of the photoresistor is a normal value.

[0098] When the photosensitive chip 300 receives light from the light-emitting chip 200, when the power supply applies voltage to the optocoupler, current flows through the input second pin to the input second conductive element in the input second conductive via 902, and the input second conductive element transmits the current to the photosensitive chip 300 through the input second conductive layer. The current is transmitted to the output second conductive layer through the photosensitive chip 300, and then the current is transmitted to the output second conductive element in the output second conductive via 902 through the output second conductive layer. The output second conductive element transmits the current to the output second pin. In this way, the photosensitive chip 300 converts the optical signal into an electrical signal.

[0099] Exemplarily, the second pin 702 includes a fourth pin segment, a fifth pin segment and a sixth pin segment connected to each other, wherein the fourth pin segment is connected to the bottom of the tube shell 100, and the fourth pin segment and the sixth pin segment both extend along a first direction, and the first direction refers to Figure 1 In the X direction shown, the extension direction of the fifth pin segment intersects with the first direction; thus, by connecting the fourth pin segment to the bottom of the tube shell 100, the contact area between the fourth pin and the bottom of the tube shell 100 is increased, thereby ensuring smooth transmission of current; by setting the fourth pin segment and the sixth pin segment to extend along the first direction, thus, the fourth pin segment is connected to the bottom of the tube shell 100, and the sixth pin segment is connected to the plane to be installed of the optocoupler, thereby improving the installation stability of the fourth pin segment and the tube shell 100, the sixth pin segment and the surface to be installed; by setting the extension direction of the fifth pin segment to intersect with the first direction, the bottom of the optocoupler is reasonably utilized, which is conducive to the installation at the bottom of the optocoupler and the surface to be installed.

[0100] By way of example, the second bonding wire 812 may be any one of a gold wire, a copper wire, and an aluminum wire.

[0101] Exemplarily, the light emitting chip 200 includes a far-infrared LED chip and a laser chip.

[0102] As a feasible implementation, the optocoupler further includes a metal layer 600 and an auxiliary metal layer 610. The metal layer 600 is arranged on the side of the tube shell 100 close to the opening 110. The auxiliary metal layer 610 is arranged on the side of the cover plate 400 close to the opening 110. The cover plate 400 is covered at the opening 110 through the auxiliary metal layer 610 and the metal layer 600.

[0103] For example, by setting a metal layer 600 on the side of the tube shell 100 close to the opening 110, and setting an auxiliary metal layer 610 on the side of the cover plate 400 close to the opening 110, the setting of the metal layer 600 and the auxiliary metal layer 610 can significantly enhance the adhesion between the cover plate 400 and the tube shell 100, ensuring the firmness and sealing of the optocoupler package. At the same time, the metal layer 600 and the auxiliary metal layer 610 can form an airtight package during the welding or bonding process, thereby improving the sealing of the tube shell 100 cavity, preventing external moisture, dust and other contaminants from entering the cavity, and protecting the optoelectronic components inside the optocoupler. This sealing is crucial to the long-term reliability of the optocoupler, especially when used in harsh environments, it can significantly extend the service life of the optocoupler.

[0104] Exemplarily, the solder ring is an annular structure supported by a metal material, and the materials of the solder ring include tin, lead, silver, gold, etc.

[0105] In some embodiments, the metal layer 600 and the auxiliary metal layer 610 can be part of the solder ring, respectively. In this way, the solder ring melts when heated, fills the gap between the tube shell 100 and the cover plate 400, and forms an airtight package to prevent the external environment from affecting the components in the optocoupler cavity.

[0106] As a feasible implementation, the photoelectric coupler further includes a reflective layer, which is disposed on a side of the cover plate 400 close to the tube shell 100 ; the reflective layer is connected to the cover plate 400 . Alternatively, the reflective layer is in contact with the cover plate 400 .

[0107] Along the height direction of the photoelectric coupler, the orthographic projection of the reflective layer on the cover plate 400 covers at least a portion of the cover plate 400 .

[0108] Exemplarily, a reflective layer is disposed on a side of the cover plate 400 close to the tube shell 100 . The reflective layer may be a nickel layer or a gold layer to improve the reflective capability of the light emitted by the light emitting chip 200 .

[0109] In some embodiments, a reflective layer is formed on the side of the cover plate 400 close to the tube shell 100. The reflective layer is connected to the cover plate 400. For example, the reflective layer can be directly deposited on the side of the cover plate 400 close to the tube shell 100. In this way, the reflective layer and the cover plate 400 are closely combined to ensure the stability and durability of the reflective layer.

[0110] In other embodiments, the cover plate 400 and the reflective layer are two separate components, and the reflective layer can be a prefabricated thin layer. During the photoelectric coupler assembly process, the reflective layer is assembled to the cover plate 400 near the tube shell 100. The reflective layer and the cover plate 400 are in contact. In this way, by preparing the reflective layer separately, the material and thickness of the reflective layer can be replaced or adjusted as needed during the photoelectric coupler assembly process to optimize the optical performance.

[0111] During the use of the optocoupler, the electrical signal is transmitted to the light-emitting chip 200 through the pin 700 and the conductive member, and the light-emitting chip 200 converts the electrical signal into an optical signal. The light-emitting chip emits light to the cavity. At this time, part of the light is directly directed to the photosensitive chip 300 located on the bottom wall of the cavity, and part of the light is directed to the cover plate 400 at the top opening 110 of the tube shell 100. Then, the photosensitive chip 300 receives the reflected optical signal from the reflective layer and the optical signal of the photosensitive chip 300 directly directed by the light-emitting chip 200 and converts it into an electrical signal. The electrical signal is output from the corresponding pin 700 through the conductive member to realize signal transmission. By arranging the metal layer 600 on the cover plate 400, the reflection capability of the light from the light-emitting chip 200 is improved, the intensity of the light received by the photosensitive chip 300 is improved, and the transmission efficiency of the optical signal is improved.

[0112] In some embodiments, along the height direction of the photocoupler, the positive projection of the reflective layer on the cover plate 400 completely covers the cover plate 400 to effectively reflect the light emitted from the light-emitting chip 200, reduce light scattering and loss, and improve the light transmission efficiency of the photocoupler.

[0113] In some other embodiments, along the height direction of the photoelectric coupler, the orthographic projection of the reflective layer on the cover plate 400 covers part of the cover plate 400 .

[0114] As a feasible implementation, the tube shell 100 has a plurality of cavities, the plurality of cavities are arranged in an array, and the plurality of cavities are all connected to the opening 110;

[0115] There are multiple cover plates 400 , and the multiple cover plates 400 are arranged in one-to-one correspondence with the multiple cavities. The cover plates 400 are used to seal the cavities.

[0116] There are multiple light-emitting chips 200 and multiple photosensitive chips 300. The multiple light-emitting chips 200 are located in multiple cavities in a one-to-one correspondence, and the multiple photosensitive chips 300 are located in multiple cavities in a one-to-one correspondence.

[0117] Exemplarily, by providing multiple cavities, the design of multiple cavities helps to disperse the heat of the optocoupler and avoid overheating of a single cavity, thereby improving the heat dissipation efficiency of the optocoupler and extending the service life of the light-emitting chip 200 and the photosensitive chip 300.

[0118] Exemplarily, by equipping each cavity with an independent cover plate 400, each cavity is an independent sealed cavity, which can effectively prevent the influence of the external environment on the components in the cavity, such as dust, moisture, etc., thereby improving the reliability and life of the optocoupler.

[0119] Second, refer to Figure 3 As shown, the present application provides a multi-channel optocoupler, comprising at least one of the above-mentioned optocouplers.

[0120] As a feasible implementation, there are multiple photoelectric couplers, and the multiple photoelectric couplers are arranged in an array, with a gap between two adjacent photoelectric couplers.

[0121] Exemplarily, the multi-channel pipeline photoelectric coupler includes a plurality of the above-mentioned photoelectric couplers, the light emitting chip 200 and the photosensitive chip 300 in each photoelectric coupler are arranged in the same manner, each photoelectric coupler is independent of each other, and the optical signals between them do not interfere with each other.

[0122] A plurality of photoelectric couplers may be arranged in one direction to form a row or a column, or a plurality of photoelectric couplers may be arranged in an array to form multiple rows and columns.

[0123] Exemplarily, the tube shell 100 and the cover plate 400 of each photoelectric coupler may be arranged in a one-to-one correspondence to improve the sealing performance of the cover plate 400 and the tube shell 100 and avoid interference of optical signals between adjacent photoelectric couplers.

[0124] Exemplarily, multiple optocouplers may also share a cover plate 400 , which is connected to the opening 110 at the top of each tube shell 100 , and the sealing method between the cover plate 400 and the top of the tube shell 100 may be parallel sealing to improve the packaging efficiency between the cover plate 400 and the tube shell 100 .

[0125] It is understandable that, since the multi-channel optocoupler of the present application adopts the technical solution of the above-mentioned optocoupler embodiment, it at least has the beneficial effects brought by the technical solution of the above-mentioned embodiment, which will not be described one by one here.

[0126] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0127] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A photoelectric coupler, characterized in that: The invention comprises a tube shell, a light-emitting chip, a photosensitive chip and a cover plate, wherein an opening is arranged on the shell wall of the tube shell, and the opening is used to communicate with the cavity of the tube shell; the light-emitting chip and the photosensitive chip are both located in the cavity, and the cover plate covers the opening, and the cover plate is used to seal the cavity; The light emitting surface of the light emitting chip and the light incident surface of the photosensitive chip are both away from the bottom of the tube shell, and the light incident surface of the photosensitive chip is not higher than the light emitting chip.

2. The photocoupler according to claim 1, characterized in that: It also includes a first step, which is located in the cavity; the step surface of the first step is higher than the inner bottom wall of the tube shell and lower than the opening of the tube shell; the light-emitting chip is arranged on the first step; The photosensitive chip is arranged on the inner bottom wall of the tube shell and is spaced apart from the first step.

3. The photocoupler according to claim 2, characterized in that: It also includes at least two pins, at least two conductive layers and at least two conductive members; the pins are connected to the outer wall of the tube shell, and the conductive layer is arranged in the cavity; At least two of the conductive layers are electrically connected to at least two of the conductive members in a one-to-one correspondence, and are electrically connected to at least two of the pins in a one-to-one correspondence through the corresponding conductive members; The photosensitive chip and the light-emitting chip are electrically connected to different conductive layers respectively.

4. The photocoupler according to claim 3, characterized in that: The photoelectric coupler has a first conductive through hole, and the first conductive through hole passes through the shell wall of the tube shell and the first step; the number of the first conductive through holes is two; The conductive member includes a first conductive member, the number of the first conductive members is two, and the two first conductive members are located in the two first conductive through holes in a one-to-one correspondence; The conductive layer includes two first conductive layers, and both of the two first conductive layers are electrically connected to the light-emitting chip; The pins include a first pin; the number of the first pins is two; The two first conductive layers are electrically connected to the two first conductive members in a one-to-one correspondence, and the two first conductive members are electrically connected to the two first pins in a one-to-one correspondence.

5. The photocoupler according to claim 4, characterized in that: The first conductive layer is disposed on the step surface of the first step, and an orthographic projection of the first conductive layer on the step surface of the first step at least partially overlaps with an orthographic projection of the light emitting chip on the step surface of the first step.

6. The photocoupler according to claim 4, characterized in that: It also includes a metal layer and an auxiliary metal layer. The metal layer is arranged on the side of the tube shell close to the opening, and the auxiliary metal layer is arranged on the side of the cover plate close to the opening. The cover plate is covered at the opening through the auxiliary metal layer and the metal layer.

7. The photoelectric coupler according to claim 4, characterized in that: The light-emitting chip includes a first light-emitting electrode and a second light-emitting electrode. A first bonding wire is arranged on the light-emitting chip. The first light-emitting electrode is electrically connected to one of the first conductive layers through the first bonding wire, and the second light-emitting electrode is electrically connected to another of the first conductive layers through a conductive adhesive.

8. The photoelectric coupler according to any one of claims 3 to 7, characterized in that: The conductive layer includes a second conductive layer; the number of the second conductive layers is two; the two second conductive layers are both arranged on the inner bottom wall of the cavity; The photosensitive chip includes a first photosensitive electrode and a second photosensitive electrode, and the first photosensitive electrode and the second photosensitive electrode are electrically connected to two second conductive layers in a one-to-one correspondence.

9. The photoelectric coupler according to claim 8, characterized in that: The photosensitive chip is provided with a second bonding wire, the first photosensitive electrode and one of the second conductive layers are electrically connected via the second bonding wire, and the second photosensitive electrode is connected to another of the second conductive layers via a conductive glue; The photoelectric coupler further includes two second conductive through holes, and the second conductive through holes are disposed through the shell wall of the tube shell; The conductive member includes a second conductive member, and the number of the second conductive members is two; the two second conductive members are located in the second conductive through holes in a one-to-one correspondence; The pins include two second pins. The two second conductive layers are electrically connected to the two second conductive members in a one-to-one correspondence, and the two second conductive members are electrically connected to the two second pins in a one-to-one correspondence.

10. The photoelectric coupler according to claim 8, characterized in that: The tube shell has a plurality of cavities, the plurality of cavities are arranged in an array, and the plurality of cavities are all connected to the opening; There are multiple cover plates, and the multiple cover plates are arranged in one-to-one correspondence with the multiple cavities, and the cover plates are used to seal the cavities; There are multiple light-emitting chips and multiple photosensitive chips. The multiple light-emitting chips are located in the multiple cavities in a one-to-one correspondence, and the multiple photosensitive chips are located in the multiple cavities in a one-to-one correspondence.

11. The photoelectric coupler according to claim 8, characterized in that: It also includes a reflective layer, which is disposed on a side of the cover plate close to the tube shell; the reflective layer is connected to the cover plate, or the reflective layer is in contact with the cover plate; Along the height direction of the photoelectric coupler, the orthographic projection of the reflective layer on the cover plate covers at least a portion of the cover plate.

12. A multi-channel optocoupler, characterized in that: Comprising at least one optocoupler according to any one of claims 1-11.

13. The multi-channel optocoupler according to claim 12, characterized in that: There are multiple photoelectric couplers, which are arranged in an array, with a gap between two adjacent photoelectric couplers.

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