A crystal bar processing apparatus, a crystal bar processing method, and a device

Abstract

This disclosure provides a crystal ingot processing apparatus, method, and equipment. The crystal ingot processing apparatus includes: a clamping unit for clamping and rotating a crystal ingot; a first crystal orientation detection unit located on one radial side of the crystal ingot for detecting the crystal orientation of the crystal ingot surface; a V-groove processing unit located on one radial side of the crystal ingot for processing V-grooves on the crystal ingot surface; a second crystal orientation detection unit located on one radial side of the crystal ingot for detecting the crystal orientation of the crystal ingot surface; and a control unit for: controlling the crystal ingot to rotate by a preset angle to the crystal orientation position of the V-groove to be processed based on the crystal orientation detection result of the first crystal orientation detection unit; and determining the deviation of the crystal orientation position of the V-groove to be processed relative to the target V-groove processing crystal orientation position based on the crystal orientation detection result of the second crystal orientation detection unit. The crystal ingot processing apparatus, method, and equipment of this disclosure can avoid V-groove processing errors.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a crystal rod processing apparatus, crystal rod processing method and equipment. Background Technology

[0002] In the semiconductor industry, the crystal ingots produced by crystal pulling undergo rounding, cutting, and dicing before silicon wafer processing. Rounding involves grinding the outer surface of the crystal ingot to process ingots with unequal body diameters into ingots with equal body diameters.

[0003] To identify specific crystal orientations on crystal ingots or wafers, V-Notch grooves are typically machined onto the ingot after orientation. Ingot orientation is determined using a crystal orientation detection tool. After orientation, the ingot is rotated by a predetermined angle to machine the V-Notch grooves. However, over time, factors such as decreased rotational accuracy of the equipment and reduced accuracy of the crystal orientation detection tool can cause the V-Notch groove machining direction to deviate from the target value, ultimately rendering the entire ingot unusable. Summary of the Invention

[0004] To address at least one of the technical problems in the prior art, this disclosure provides a crystal rod processing apparatus, a crystal rod processing method, and equipment.

[0005] The technical solutions provided in this disclosure are as follows:

[0006] In a first aspect, embodiments of this disclosure provide a crystal rod processing apparatus, comprising:

[0007] The clamping unit is configured to clamp and rotate the crystal rod;

[0008] A first crystal orientation detection unit is disposed on one radial side of the crystal rod, and the first crystal orientation detection unit is used to perform crystal orientation detection on the surface of the crystal rod;

[0009] A V-groove processing unit is located on one radial side of the crystal rod, and the V-groove processing unit is used to process V-grooves on the surface of the crystal rod.

[0010] The second crystal orientation detection unit is located on one radial side of the crystal rod, and the second crystal orientation detection unit is used to perform crystal orientation detection on the surface of the crystal rod;

[0011] The control unit is connected to the first crystal orientation detection unit, the second crystal orientation detection unit, the clamping unit, and the V-groove processing unit, respectively; wherein, the control unit is used for:

[0012] Based on the crystal orientation detection result of the first crystal orientation detection unit, the crystal rod is controlled to rotate at a preset angle to the crystal orientation position of the V-groove to be processed;

[0013] Based on the crystal orientation detection results of the second crystal orientation detection unit, the deviation of the crystal orientation position of the V-groove to be processed from the target V-groove processing crystal orientation position is determined.

[0014] For example, the V-groove processing unit and the second crystal orientation detection unit are located on the same side of the crystal rod.

[0015] For example, the crystal rod has a first side and a second side that are radially opposite to it; wherein the V-groove processing unit and the second crystal orientation detection unit are located on the first side of the crystal rod, and the first crystal orientation detection unit is located on the second side of the crystal rod.

[0016] For example, the V-groove processing unit has a processing portion for contacting the surface of the crystal rod to process a V-groove; the second crystal orientation detection unit has a detection portion for detecting the crystal orientation of the surface of the crystal rod; when the V-groove processing unit is in the target processing position and the second crystal orientation detection unit is in the target detection position, the processing portion and the detection portion are on the same horizontal plane.

[0017] For example, the V-groove processing unit includes a V-groove grinding wheel and a first moving component. The V-groove grinding wheel can move closer to or further away from the surface of the crystal rod along the radial direction of the crystal rod under the drive of the first moving component.

[0018] For example, the second crystal orientation detection unit includes a second crystal orientation detector, which is connected to the first moving component so that the second crystal orientation detector and the V-groove grinding wheel can move synchronously.

[0019] For example, the first crystal orientation detection unit includes a first crystal orientation detector and a second moving component. The first crystal orientation detector is connected to the second moving component. Under the drive of the second moving component, the first crystal orientation detector can move closer to or further away from the surface of the crystal rod along the radial direction of the crystal rod.

[0020] For example, the crystal rod processing apparatus further includes an alarm unit connected to the control unit; wherein, the control unit is further configured to control the alarm unit to issue an alarm signal when it is determined that the actual deviation of the crystal orientation position of the V-groove to be processed relative to the crystal orientation position of the target V-groove is greater than a deviation threshold.

[0021] Secondly, this disclosure also provides a method for processing crystal rods, applied to the crystal rod processing apparatus described above, the method comprising:

[0022] Based on the crystal orientation detection result of the first crystal orientation detection unit, the crystal rod is controlled to rotate at a preset angle to the crystal orientation position of the V-groove to be processed;

[0023] Based on the crystal orientation detection results of the second crystal orientation detection unit, the deviation of the crystal orientation position of the V-groove to be processed from the target V-groove processing crystal orientation position is determined.

[0024] Thirdly, embodiments of this disclosure also provide an electronic device, including a memory, a processor, and one or more programs stored in the memory and executable on the processor, wherein when the one or more programs are executed by the processor, the electronic device performs the ingot processing method as described above.

[0025] The beneficial effects of the embodiments disclosed herein are as follows:

[0026] The crystal rod processing apparatus, method, and equipment disclosed herein include a clamping unit, a first crystal orientation detection unit, a V-groove processing unit, a second crystal orientation detection unit, and a control unit. The clamping unit is used to clamp and rotate the crystal rod. The first and second crystal orientation detection units can perform crystal orientation detection on the surface of the crystal rod. The V-groove processing unit can process a V-groove on the surface of the crystal rod. The control unit is used to control the crystal rod to rotate by a preset angle to the crystal orientation position of the V-groove to be processed based on the crystal orientation detection result of the first crystal orientation detection unit. Based on the crystal orientation detection result of the second crystal orientation detection unit, the control unit is used to determine the deviation state of the crystal orientation position of the V-groove to be processed relative to the target V-groove processing crystal orientation position.

[0027] In this way, the crystal orientation of the crystal rod can be oriented by the first crystal orientation detection unit. Then, by rotating the crystal rod by a predetermined angle, the crystal rod can be rotated to the processing position of the V-groove to be processed. After the crystal rod is rotated to the processing position of the V-groove to be processed, the crystal orientation of the crystal rod can be detected a second time by the second crystal orientation detection unit to verify the crystal orientation of the crystal rod and determine the deviation of the crystal orientation position of the V-groove to be processed from the target V-groove processing crystal orientation position. This can avoid V-groove processing errors, avoid crystal rod waste, and improve the yield of processed products. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of the wafer processing apparatus provided in the embodiments of this disclosure;

[0029] Figure 2 This is a schematic diagram showing the first crystal orientation detection unit performing crystal orientation detection in the wafer processing apparatus provided in this embodiment of the present disclosure;

[0030] Figure 3 This is a schematic diagram showing the first crystal orientation detection unit performing crystal orientation verification in the wafer processing apparatus provided in this embodiment. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0032] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0033] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.

[0034] Furthermore, throughout this document, unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can cover situations where the event or situation occurs precisely or approximately. For example, when used with a numerical value, these terms can include a range of variation of the numerical value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces arranged along the same plane within a micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0035] like Figure 1 As shown, this disclosure provides a crystal rod processing apparatus, including:

[0036] The clamping unit 100 is configured to clamp and rotate the crystal rod 10;

[0037] A first crystal orientation detection unit 200 is disposed on one radial side of the crystal rod 10, and the first crystal orientation detection unit 200 is used to perform crystal orientation detection on the surface of the crystal rod 10;

[0038] A V-groove processing unit 300 is disposed on one radial side of the crystal rod 10, and the V-groove processing unit 300 is used to process V-grooves on the surface of the crystal rod 10.

[0039] The second crystal orientation detection unit 400 is disposed on one radial side of the crystal rod 10, and the second crystal orientation detection unit 400 is used to perform crystal orientation detection on the surface of the crystal rod 10.

[0040] The control unit 500 is connected to the first crystal orientation detection unit 200, the second crystal orientation detection unit 400, the clamping unit 100, and the V-groove processing unit 300, respectively.

[0041] The control unit 500 is used for:

[0042] Based on the crystal orientation detection result of the first crystal orientation detection unit 200, the crystal rod 10 is controlled to rotate at a preset angle to the crystal orientation position of the V groove to be processed;

[0043] Based on the crystal orientation detection results of the second crystal orientation detection unit 400, the deviation state of the crystal orientation position of the V-groove to be processed relative to the processing crystal orientation position of the target V-groove is determined.

[0044] In the above scheme, such as Figure 2As shown, the first crystal orientation detection unit 200 orients the crystal orientation of the surface of the crystal rod 10. Then, by rotating the crystal rod 10 by a predetermined angle, the crystal rod 10 can be rotated to the processing position of the V-groove to be processed; when the crystal rod 10 is rotated to such a position... Figure 3 After the V-groove to be processed is located, the crystal orientation of the surface of the crystal rod 10 can be detected a second time by the second crystal orientation detection unit 400 to verify the crystal orientation of the crystal rod 10, and then determine the deviation of the crystal orientation position of the V-groove to be processed from the target V-groove processing crystal orientation position. This can avoid V-groove processing errors, avoid waste of the crystal rod 10, and improve the yield of processed products.

[0045] In some exemplary embodiments, such as Figure 1 As shown, the clamping unit 100 may include a head clamping unit 110 for clamping the head of the crystal rod 10 and a tail clamping unit 120 for clamping the tail of the crystal rod 10.

[0046] In some exemplary embodiments, such as Figure 1 As shown, the head clamping unit 110 may include a first clamping part 111, a first rotating component 112, and a first driving component 113. The first clamping part 111 is used to clamp the head of the crystal ingot 10, and the first rotating component 112 drives the first clamping part 111 to rotate under the drive of the first driving component 113. The tail clamping unit 120 may include a second clamping part 121, a second rotating component 122, and a second driving component 123. The second clamping part 121 is used to clamp the tail of the crystal ingot 10, and the second rotating component 122 drives the second clamping part 121 to rotate under the drive of the second driving component 123. For example, the first driving component 113 and the second driving component 123 may be any suitable structure such as a servo motor.

[0047] In some exemplary embodiments, such as Figures 1 to 3 As shown, the V-groove processing unit 300 and the second crystal orientation detection unit 400 are located on the same side of the crystal rod 10. Thus, since the crystal rod 10 is oriented by the first crystal orientation detection unit 200 and then rotated by a predetermined angle to the crystal orientation position of the V-groove to be processed, and the second crystal orientation detection unit 400 is mainly used to verify the crystal orientation of the crystal rod 10 after rotating by the predetermined angle, the second crystal orientation detection unit 400 can be located on the same side as the V-groove processing unit 300 to perform crystal orientation detection on the crystal rod 10 before processing the V-groove.

[0048] In some exemplary embodiments, as shown in the figure, the crystal rod 10 has a first side and a second side that are radially opposite to it; wherein the V-groove processing unit 300 and the second crystal orientation detection unit 400 are located on the first side of the crystal rod 10, and the first crystal orientation detection unit 200 is located on the second side of the crystal rod 10.

[0049] For different crystal orientations (e.g.) <100> direction and <110> The processing requirements (direction) are achieved through orientation. <110> After orientation, rotate crystal rod 10 360° or 315° and then proceed. <110> direction or <100> Machining of V-grooves in the crystal orientation direction. In some embodiments, the first crystal orientation detection unit 200 and the V-groove machining unit 300 may be respectively located on opposite radial sides of the crystal rod 10. However, it is understood that the above is only an example, and the positional relationship between the first crystal orientation detection unit 200, the second crystal orientation detection unit 400, and the V-groove machining unit 300 is not limited thereto.

[0050] In some exemplary embodiments, the V-groove processing unit 300 has a processing portion for contacting the surface of the crystal ingot 10 to process a V-groove. For example, the V-groove processing unit 300 may include a V-groove grinding wheel 310 and a first moving component 320. The V-groove grinding wheel 310, driven by the first moving component 320, can move closer to or further away from the surface of the crystal ingot 10 along the radial direction to process a V-groove on the surface of the crystal ingot 10. The V-groove grinding wheel 310 is mainly used for contacting the surface of the crystal ingot 10 to process a V-groove; therefore, the processing portion may refer to the V-groove grinding wheel 310.

[0051] For example, the first moving component 320 may include a first driving member 321, a first guide rail 322, and a first moving platform 323, which can translate along the first guide rail 322 under the drive of the first driving member 321.

[0052] The second crystal orientation detection unit 400 has a detection area for detecting the crystal orientation of the surface of the crystal rod 10. For example, the second crystal orientation detection unit 400 can be an X-ray single crystal orientation instrument.

[0053] The orientation principle of an X-ray single-crystal orientation instrument is as follows: The instrument includes an X-ray generator and an X-ray receiver. The X-ray generator emits X-rays. When the angle θ between the irradiated X-rays and the surface of the crystal rod 10 is exactly the diffraction angle, the intensity of the X-rays received by the X-ray receiver is at its maximum. Therefore, the crystal orientation can be determined based on the intensity of the X-rays received by the X-ray receiver. The detection area can refer to both the X-ray generator and the X-ray receiver.

[0054] All other necessary components of the X-ray single-crystal orientation instrument are present in the art and should be understood by those skilled in the art. They will not be described in detail here, nor should they be construed as limiting the present disclosure.

[0055] The V-groove grinding wheel 310 in the V-groove processing unit 300 can be close to or far from the crystal rod 10. When the V-groove grinding wheel 310 in the V-groove processing unit 300 processes the surface of the crystal rod 10, the position of the V-groove processing unit 300 is the target processing position. Similarly, the second crystal orientation detection unit 400 can also be constructed to be fixed or movable. When the second crystal orientation detection unit 400 detects the crystal orientation of the crystal rod 10, the position it is at is the target detection position.

[0056] When the V-groove processing unit 300 is at the target processing position and the second crystal orientation detection unit 400 is at the target detection position, the processing area and the detection area are on the same horizontal plane. Thus, the surface of the crystal rod 10 detected by the second crystal orientation detection unit 400 is precisely the area of ​​the V-groove to be processed, accurately reflecting whether the area of ​​the V-groove to be processed deviates from the target V-groove processing crystal orientation area.

[0057] In some embodiments, the crystal rod processing apparatus further includes an alarm unit connected to the control unit 500; wherein the control unit 500 is further configured to control the alarm unit to issue an alarm signal when it is determined that the actual deviation of the crystal orientation position of the V-groove to be processed relative to the processing crystal orientation position of the target V-groove is greater than a preset deviation threshold. The alarm signal may include sound signals, visual signals, tactile signals, communication signals, and odor signals, etc. The alarm method can avoid erroneous processing caused by factors such as rotational positioning and decreased accuracy of the first crystal orientation detection.

[0058] The control unit 500 can pre-store a target X-ray intensity value, which is the X-ray intensity value detected by the second crystal orientation detection unit 400 when the crystal rod 10 is in the target V-groove processing crystal orientation position. The actual deviation can be obtained based on the difference between the actual X-ray intensity value and the target X-ray intensity value. For example, when the difference between the actual X-ray intensity value detected by the second crystal orientation detection unit 400 and the target X-ray intensity value is greater than a threshold, it is determined that the actual deviation is greater than a preset deviation threshold.

[0059] In some exemplary embodiments, the control unit 500 can also be used to obtain correction parameters for the rotation angle of the crystal rod 10 based on the actual deviation amount and the deviation threshold. Thus, the rotation angle of the crystal rod 10 can be corrected according to the correction parameters.

[0060] For example, a crystal orientation check can be performed before V-groove processing to obtain the correction parameters and correct the rotation angle of the crystal rod 10. Then, during subsequent V-groove processing, after orientation by the first crystal orientation detection unit 200 and rotation by a certain corrected angle, the crystal rod 10 can be directly processed for V-groove processing. This reduces the number of crystal orientation checks and improves production efficiency.

[0061] In some exemplary embodiments, such as Figure 1 As shown, the first crystal orientation detection unit 200 includes a first crystal orientation detector 210 and a second moving component 220. The first crystal orientation detector 210 is connected to the second moving component 220. Under the drive of the second moving component 220, the first crystal orientation detector 210 can move closer to or further away from the surface of the crystal rod 10 along the radial direction of the crystal rod 10. For example, the second moving component 220 may include a second driving member 221, a second guide rail 222, and a second moving stage 223. The second moving stage 223 can translate along the second guide rail 222 under the drive of the second driving member 221.

[0062] In some embodiments, see Figure 1 As shown, the second crystal orientation detection unit 400 includes a second crystal orientation detector 410, which is connected to the first moving component 320 so that the second crystal orientation detector 410 and the V-groove grinding wheel 310 can move synchronously.

[0063] This arrangement results in a compact structure and ensures a relatively stable positional relationship between the second crystal orientation detection unit 400 and the V-groove grinding wheel 310. It is understood that in other embodiments, the second crystal orientation detection unit 400 may move independently of the V-groove grinding wheel 310.

[0064] Furthermore, this disclosure also provides a method for processing crystal rods, applied to the crystal rod processing apparatus of this disclosure, the method comprising the following steps:

[0065] Step S01: Based on the crystal orientation detection result of the first crystal orientation detection unit 200, control the crystal rod 10 to rotate at a preset angle to the crystal orientation position of the V-groove to be processed;

[0066] Step S02: Based on the crystal orientation detection result of the second crystal orientation detection unit 400, determine the deviation state of the crystal orientation position of the V-groove to be processed relative to the processing crystal orientation position of the target V-groove.

[0067] In the above scheme, the crystal orientation of the surface of the crystal rod 10 is oriented by the first crystal orientation detection unit 200. Then, by rotating the crystal rod 10 by a predetermined angle, the crystal rod 10 can be rotated to the processing position of the V-groove to be processed. After the crystal rod 10 is rotated to the processing position of the V-groove to be processed, the crystal orientation of the surface of the crystal rod 10 can be detected a second time by the second crystal orientation detection unit 400 to verify the crystal orientation of the crystal rod 10, and then determine the deviation of the crystal orientation position of the V-groove to be processed from the target V-groove processing crystal orientation position. In this way, V-groove processing errors can be avoided, crystal rod 10 can be avoided, and the yield of processed products can be improved.

[0068] For example, after step S02 above, the method further includes:

[0069] Step S03: When it is determined that the actual deviation of the crystal orientation position of the V-groove to be processed relative to the crystal orientation position of the target V-groove is greater than a preset deviation threshold, the alarm unit is controlled to issue an alarm signal.

[0070] In this way, alarm mechanisms can prevent erroneous processing caused by factors such as rotational positioning and decreased accuracy of the first crystal orientation detection.

[0071] Step S04: Based on the actual deviation amount and the deviation threshold, obtain the correction parameters of the rotation angle of the crystal rod 10, and correct the rotation angle of the crystal rod 10 according to the correction parameters.

[0072] For example, a crystal orientation check can be performed before V-groove processing to obtain the correction parameters and correct the rotation angle of the crystal rod 10. Then, during subsequent V-groove processing, after orientation by the first crystal orientation detection unit 200 and rotation by a certain corrected angle, the crystal rod 10 can be directly processed for V-groove processing. This reduces the number of crystal orientation checks and improves production efficiency.

[0073] Furthermore, this disclosure also provides an electronic device, including a memory, a processor, and one or more programs stored in the memory and executable on the processor, wherein when the one or more programs are executed by the processor, the electronic device performs the ingot processing method as described above.

[0074] Since the principle by which this crystal rod processing method solves the problem is similar to that of the crystal rod processing apparatus described above, the embodiments of the crystal rod processing method provided in this disclosure can refer to the embodiments of the crystal rod processing apparatus described above in this disclosure, and will not be repeated here.

[0075] Furthermore, this disclosure also provides an apparatus including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the methods described above. The above-described apparatus can implement the methods described above when its processor executes the computer program.

[0076] In one embodiment, this disclosure also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps in the above method embodiments.

[0077] The aforementioned computer-readable storage medium enables the implementation of the steps in the above method embodiments when a computer program stored in its memory is executed by a processor.

[0078] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical storage, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0079] The following points need to be explained:

[0080] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0081] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0082] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0083] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

1. A crystal rod processing apparatus, characterized in that, include: The clamping unit is configured to clamp and rotate the crystal rod; A first crystal orientation detection unit is disposed on one radial side of the crystal rod, and the first crystal orientation detection unit is used to perform crystal orientation detection on the surface of the crystal rod; A V-groove processing unit is located on one radial side of the crystal rod, and the V-groove processing unit is used to process V-grooves on the surface of the crystal rod. The second crystal orientation detection unit is located on one radial side of the crystal rod, and the second crystal orientation detection unit is used to perform crystal orientation detection on the surface of the crystal rod; The control unit is connected to the first crystal orientation detection unit, the second crystal orientation detection unit, the clamping unit, and the V-groove processing unit, respectively; wherein, the control unit is used for: Based on the crystal orientation detection result of the first crystal orientation detection unit, the crystal rod is controlled to rotate at a preset angle to the crystal orientation position of the V-groove to be processed; After controlling the crystal rod to rotate by a preset angle based on the crystal orientation detection result of the first crystal orientation detection unit and before the V-groove processing unit processes the V-groove, based on the crystal orientation detection result of the second crystal orientation detection unit, the deviation state of the crystal orientation position of the V-groove to be processed relative to the preset target V-groove processing crystal orientation position is determined, so as to determine whether the actual deviation of the crystal orientation position of the V-groove to be processed relative to the target V-groove processing crystal orientation position is greater than the preset deviation threshold.

2. The crystal rod processing apparatus according to claim 1, characterized in that, The V-groove processing unit and the second crystal orientation detection unit are located on the same side of the crystal rod.

3. The crystal rod processing apparatus according to claim 2, characterized in that, The crystal rod has a first side and a second side that are radially opposite to each other; wherein the V-groove processing unit and the second crystal orientation detection unit are located on the first side of the crystal rod, and the first crystal orientation detection unit is located on the second side of the crystal rod.

4. The crystal rod processing apparatus according to claim 1, characterized in that, The V-groove processing unit has a processing part for contacting the surface of the crystal rod to process a V-groove; the second crystal orientation detection unit has a detection part for detecting the crystal orientation of the surface of the crystal rod; when the V-groove processing unit is in the target processing position and the second crystal orientation detection unit is in the target detection position, the processing part and the detection part are on the same horizontal plane.

5. The crystal rod processing apparatus according to claim 1, characterized in that, The V-groove processing unit includes a V-groove grinding wheel and a first moving component. The V-groove grinding wheel can move closer to or further away from the surface of the crystal rod along the radial direction of the crystal rod under the drive of the first moving component.

6. The crystal rod processing apparatus according to claim 5, characterized in that, The second crystal orientation detection unit includes a second crystal orientation detector, which is connected to the first moving component so that the second crystal orientation detector and the V-groove grinding wheel can move synchronously.

7. The crystal rod processing apparatus according to claim 1, characterized in that, The first crystal orientation detection unit includes a first crystal orientation detector and a second moving component. The first crystal orientation detector is connected to the second moving component. Under the drive of the second moving component, the first crystal orientation detector can move closer to or further away from the surface of the crystal rod along the radial direction of the crystal rod.

8. The crystal rod processing apparatus according to claim 1, characterized in that, The crystal rod processing apparatus further includes an alarm unit connected to the control unit; wherein, the control unit is further configured to control the alarm unit to issue an alarm signal when it is determined that the actual deviation of the crystal orientation position of the V-groove to be processed relative to the crystal orientation position of the target V-groove is greater than a deviation threshold.

9. A method for processing crystal rods, characterized in that, The method, applied to the ingot processing apparatus as described in any one of claims 1 to 8, comprises: Based on the crystal orientation detection result of the first crystal orientation detection unit, the crystal rod is controlled to rotate at a preset angle to the crystal orientation position of the V-groove to be processed; Based on the crystal orientation detection results of the second crystal orientation detection unit, the deviation of the crystal orientation position of the V-groove to be processed from the target V-groove processing crystal orientation position is determined.

10. An electronic device, characterized in that: The electronic device includes a memory, a processor, and one or more programs stored in the memory and executable on the processor, which, when executed by the processor, cause the electronic device to perform the ingot processing method as described in claim 9.

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