Resin grinding wheel for sapphire substrate processing and preparation method thereof

Abstract

The invention discloses a resin grinding wheel for processing a sapphire substrate and a preparation method of the resin grinding wheel. The resin grinding wheel comprises a wheel body and a grinding material, the wheel body is provided with a plurality of T-shaped clamping grooves; a part of the grinding material is embedded in the clamping groove; the abrasive material is a metallic bond abrasive material, and the wheel body is formed by processing high-density aluminum alloy or bakelite. The method can effectively reduce the processing stress, reduce the adverse cracking of the subsequent process, improve the strength and hardness of the cutting knife by utilizing the combined action of metals, avoid the precipitation of metal elements by combining with the addition of rare earth elements, and especially improve the wear resistance of the final product by adding carbon fibers during the preparation of the green body. More importantly, oxidation of metal lanthanum is inhibited, sintering parameters are matched, excessive oxidation of the metal lanthanum is prevented, and meanwhile a small amount of lanthanum oxide can provide high strength.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor cutting, and in particular to a resin grinding wheel for sapphire substrate processing and a preparation method thereof. Background Art

[0002] Sapphire substrate crystals are extremely hard, and not only have excellent optical, mechanical and good thermal conductivity, but also have good wear resistance and wind erosion resistance, making them an ideal LED substrate material. Sapphire substrates currently have mature production and processing technology, stable quality, and can be used in high-temperature growth processes; in addition, sapphire substrates have high mechanical strength and are easy to handle and clean. Therefore, the substrate material is mainly sapphire substrates. In recent years, LED technology based on sapphire substrates has developed rapidly, occupying more than 90% of the LED substrate market share; most of the sapphire substrate production capacity is invested in epitaxial wafer production. From the history of LED development, the scale expansion and application of LED backlight and LED lighting have promoted the vigorous development of the LED industry. From the perspective of the industrial chain, the surge in demand for LED backlight and LED lighting has also stimulated the demand of LED packaging plants and their upstream. The strong demand has promoted the development of the LED market and driven the demand for sapphire substrate epitaxial wafers.

[0003] In the LED manufacturing process, the sapphire substrate needs to be sliced, ground, chamfered and polished (from 0.4mm to about 0.1mm). The more processes are performed, the higher the processing accuracy and difficulty. Traditional grinding and polishing uses ceramic grinding wheels, which wear and fall off and scratch the surface of the grinding wheel. Such production lines have low yield, low efficiency and high cost.

[0004] Therefore, how to provide a resin grinding wheel for sapphire substrate processing and a preparation method thereof to solve the problems existing in the prior art is of great significance to its application. Summary of the invention

[0005] In view of this, the purpose of the present application is to provide a resin grinding wheel for sapphire substrate processing and a preparation method thereof to solve the problem.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A resin grinding wheel for processing sapphire substrates comprises a wheel body and abrasives; the wheel body is provided with a plurality of T-shaped slots; parts of the abrasives are embedded in the slots; and the abrasives are metal-bonded abrasives.

[0008] Preferably, the wheel body is made of high-density aluminum alloy or bakelite.

[0009] Preferably, the method for preparing the abrasive comprises the following steps:

[0010] A: Put titanium powder, aluminum powder, carbon fiber and lanthanum metal into a three-dimensional mixer, pre-mix for 2.5 hours, then add diamond, mix for 6 hours, and pass through a 60-mesh screen to obtain a mixture;

[0011] B: The mixture was passed through a 200-mesh sieve, and then pressed at a pressure of 3.5 tons / cm2 for 25 minutes at room temperature to obtain a cold-pressed green body;

[0012] C: Place the cold pressed green body together with the mold into a sintering furnace, heat up at a rate of 25°C / min, heat to the final sintering temperature of 700°C and keep it for 0.5 hours, cool to room temperature, take out, and obtain the abrasive after deburring.

[0013] Preferably, the mass ratio of the titanium powder, aluminum powder, carbon fiber, metal lanthanum and diamond is 6:2.5:1.8:0.7:2.5; the carbon fiber has a length of 8 to 10 microns and a diameter of 300 nanometers, which can provide excellent wear resistance while avoiding affecting the density of the grinding wheel.

[0014] A method for preparing a resin grinding wheel for processing a sapphire substrate comprises the following steps:

[0015] S1: Put titanium powder, aluminum powder, carbon fiber and metal lanthanum into a three-dimensional mixer according to the proportion, pre-mix for 2.5 hours, then add diamond, mix for 6 hours, and pass through a 60-mesh screen to obtain a mixture;

[0016] S2: The mixture is passed through a 200-mesh sieve and sieved 4 times to ensure that the material does not agglomerate, then slowly put into the mold, rotate the mold and flatten it with a scraper, put on the upper pressing ring, and place it together with the mold on the pressing platform of the grinding wheel hydraulic press, apply a pressure of 3.5 tons / cm2 at room temperature, and hold the pressure for 25 minutes to obtain a cold pressed green body;

[0017] S3: placing the cold pressed green body together with the mold into a sintering furnace, heating at a rate of 25°C / min, heating to a final sintering temperature of 700°C and keeping the temperature for 0.5 hours, cooling to room temperature with the furnace, taking out, deburring and obtaining an abrasive;

[0018] S4: Opening a slot on the wheel body;

[0019] S5: Vapor-depositing microcrystalline particles on the surface of the wheel body to increase the roughness of the wheel body surface and the inner wall of the slot;

[0020] S6: The abrasive is fixed in the wheel body slot by gluing to obtain a prefabricated part.

[0021] Preferably, the method for preparing the abrasive comprises the following steps: a mold groove corresponding to the clamping groove is provided on the top of the mold in step S2; and an integrally formed clamping block is provided at the bottom end of the molded abrasive.

[0022] Preferably, in step S6, the block at the bottom of the abrasive is aligned with the slot above the wheel body, and adhesive is applied inside the slot to complete the installation of the abrasive and the wheel body.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. The present invention can effectively reduce processing stress and reduce the subsequent process of fragmentation and fragmentation. The strength and hardness of the cutting knife can be improved by utilizing the combined effect between metals. The addition of rare earth elements can avoid the precipitation of metal elements, especially the addition of carbon fiber when preparing the blank, which can improve the wear resistance of the final product. More importantly, the oxidation of metallic lanthanum can be inhibited, and the sintering parameters can be coordinated to prevent the excessive oxidation of metallic lanthanum. At the same time, the presence of a small amount of lanthanum oxide can provide high strength.

[0025] 2. The present invention has a long service life, and its unique slot design can well fix the abrasive to prevent it from breaking during processing.

[0026] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application so that it can be implemented in accordance with the contents of the specification, and to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings as follows.

[0027] Based on the detailed description of the specific embodiments of the present application in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other objects, advantages and features of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0029] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a top view of the structure of the present invention.

[0030] In the figure: 1. abrasive; 2. slot; 3. wheel body. DETAILED DESCRIPTION

[0031] To make the purpose, technical scheme and advantages of the embodiment of the present application clearer, the technical scheme in the embodiment of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the present application. Obviously, the described embodiment is a part of the embodiment of the present application, rather than all of the embodiments. In the following description, specific details such as specific configuration and components are provided only to help fully understand the embodiments of the present application. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. In addition, for clarity and brevity, the description of known functions and structures is omitted in the embodiment.

[0032] In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0033] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, B exists alone, and A and B exist at the same time. The term " / and" in this article describes another type of association object relationship, indicating that there can be two relationships. For example, A / and B can mean: A exists alone, and A and B exist alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship.

[0034] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusions.

[0035] See also Figure 1 The present invention provides a resin grinding wheel for sapphire substrate processing and a technical solution for its preparation method:

[0036] Embodiment 1

[0037] A resin grinding wheel for processing sapphire substrates comprises a wheel body 3 and an abrasive 1; the wheel body 3 is provided with a plurality of T-shaped slots 2; a T-shaped block is provided below the abrasive 1, and the block is embedded in the slot 2; the abrasive 1 is a metal bond abrasive, and the wheel body 3 is made of high-density aluminum alloy or bakelite.

[0038] The preparation of abrasive includes the following steps:

[0039] A: Put titanium powder, aluminum powder, carbon fiber and metal lanthanum into a three-dimensional mixer, pre-mix for 2.5 hours, then add diamond, mix for 6 hours, and pass through a 60-mesh screen to obtain a mixture; the mass ratio of titanium powder, aluminum powder, carbon fiber, metal lanthanum and diamond is 6:2.5:1.8:0.7:2.5; the length of the carbon fiber is 8-10 microns and the diameter is 300 nanometers;

[0040] B: The mixed material was passed through a 200-mesh sieve and sieved 4 times to ensure that the material did not clump, then slowly put into the mold, rotated the mold and flattened it with a scraper, put on the upper pressing ring, and placed it together with the mold on the pressing platform of the grinding wheel hydraulic press, applied a pressure of 3.5 tons / cm2 at room temperature, and maintained the pressure for 25 minutes to obtain a cold pressed green body;

[0041] C: Place the cold pressed green body together with the mold into a sintering furnace, heat up at a rate of 25°C / min, heat to the final sintering temperature of 700°C and keep it for 0.5 hours, cool to room temperature, take out, and obtain the abrasive after deburring.

[0042] The method for preparing a resin grinding wheel for processing a sapphire substrate comprises the following steps:

[0043] S1: Put titanium powder, aluminum powder, carbon fiber and metal lanthanum into a three-dimensional mixer, pre-mix for 2.5 hours, then add diamond, mix for 6 hours, and pass through a 60-mesh screen to obtain a mixture; the mass ratio of titanium powder, aluminum powder, carbon fiber, metal lanthanum and diamond is 6:2.5:1.8:0.7:2.5; the length of the carbon fiber is 8-10 microns and the diameter is 300 nanometers;

[0044] S2: The mixture is passed through a 200-mesh sieve and sieved 4 times to ensure that the material does not agglomerate, then slowly put into the mold, rotate the mold and flatten it with a scraper, put on the upper pressing ring, and place it together with the mold on the pressing platform of the grinding wheel hydraulic press, apply a pressure of 3.5 tons / cm2 at room temperature, and hold the pressure for 25 minutes to obtain a cold pressed green body;

[0045] S3: placing the cold pressed green body together with the mold into a sintering furnace, heating at a rate of 25°C / min, heating to a final sintering temperature of 700°C and keeping the temperature for 0.5 hours, cooling to room temperature with the furnace, taking out, deburring and obtaining an abrasive;

[0046] S4: Opening a slot on the wheel body;

[0047] S5: Vapor-depositing microcrystalline particles on the surface of the wheel body to increase the roughness of the wheel body surface and the inner wall of the slot;

[0048] S6: The abrasive is fixed in the wheel body slot by gluing to obtain a prefabricated part.

[0049] The sapphire substrate grinding wheel can be used for thinning and grinding of sapphire substrates. It has the characteristics of strong self-sharpening and long life. The conventional processing load is less than 22, which can effectively avoid fragmentation. It can fine-process 4-inch wafers with a thickness of 660μm. The general life is about 3500 wafers, which is higher than the existing common imported products.

[0050] Comparative Example 1

[0051] S1: Put titanium powder, aluminum powder and carbon fiber into a three-dimensional mixer, pre-mix for 2.5 hours, then add diamond, mix for 6 hours, and pass through a 60-mesh screen to obtain a mixture; the mass ratio of titanium powder, aluminum powder, carbon fiber, metal lanthanum and diamond is 6:2.5:2:2.5; the length of the carbon fiber is 8-10 microns and the diameter is 300 nanometers;

[0052] S2: The mixture is passed through a 200-mesh sieve and sieved 4 times to ensure that the material does not agglomerate, then slowly put into the mold, rotate the mold and flatten it with a scraper, put on the upper pressing ring, and place it together with the mold on the pressing platform of the grinding wheel hydraulic press, apply a pressure of 3.5 tons / cm2 at room temperature, and hold the pressure for 25 minutes to obtain a cold pressed green body;

[0053] S3: placing the cold pressed green body together with the mold into a sintering furnace, heating at a rate of 25°C / min, heating to a final sintering temperature of 700°C and keeping the temperature for 0.5 hours, cooling to room temperature with the furnace, taking out, deburring and obtaining an abrasive;

[0054] S4: using conventional technology to open a slot on the base to obtain a wheel body;

[0055] S5: fixing the abrasive in the wheel body slot by gluing to obtain a prefabricated part;

[0056] S6: After the inner and outer circles of the preform are processed, they are placed on a surface grinder and processed to the dimensional accuracy required by the drawing to obtain a sapphire substrate grinding wheel. This thinning grinding wheel is used for thinning and grinding of sapphire substrates. The conventional processing load is less than 22, and it can finely process 4-inch sheets with a thickness of 660μm. The service life is about 2,600 pieces, which is higher than the existing common imported products.

[0057] Comparative Example 2

[0058] S1: Put titanium powder, aluminum powder and metal lanthanum into a three-dimensional mixer, pre-mix for 2.5 hours, then add diamond, mix for 6 hours, and pass through a 60-mesh screen to obtain a mixture; the mass ratio of titanium powder, aluminum powder, carbon fiber, metal lanthanum and diamond is 6:2.5:1.5:2.5; the length of the carbon fiber is 8-10 microns and the diameter is 300 nanometers;

[0059] S2: The mixture is passed through a 200-mesh sieve and sieved 4 times to ensure that the material does not agglomerate, then slowly put into the mold, rotate the mold and flatten it with a scraper, put on the upper pressing ring, and place it together with the mold on the pressing platform of the grinding wheel hydraulic press, apply a pressure of 3.5 tons / cm2 at room temperature, and hold the pressure for 25 minutes to obtain a cold pressed green body;

[0060] S3: placing the cold pressed green body together with the mold into a sintering furnace, heating at a rate of 25°C / min, heating to a final sintering temperature of 700°C and keeping the temperature for 0.5 hours, cooling to room temperature with the furnace, taking out, deburring and obtaining an abrasive;

[0061] S4: Opening a slot on the wheel body;

[0062] S5: The abrasive is fixed in the wheel body slot with glue to obtain a preform. The thinning grinding wheel is used for thinning grinding of sapphire substrates. The conventional processing load is less than 22, and it can finely process 4-inch sheets with a thickness of 660μm. The service life is about 2700 sheets, which is higher than the existing common imported products.

[0063] Comparative Example 3

[0064] S1: Put titanium powder, carbon fiber and lanthanum metal into a three-dimensional mixer, pre-mix for 2.5 hours, then add diamond, mix for 6 hours, and pass through a 60-mesh screen to obtain a mixture; the mass ratio of titanium powder, aluminum powder, carbon fiber, lanthanum metal and diamond is 6:2:0.8:2.5; the length of the carbon fiber is 8-10 microns and the diameter is 300 nanometers;

[0065] S1: The mixture is passed through a 200-mesh sieve and sieved 4 times to ensure that the material does not agglomerate, then slowly put into the mold, rotate the mold and flatten it with a scraper, put on the upper pressing ring, and place it together with the mold on the pressing platform of the grinding wheel hydraulic press, apply a pressure of 3.5 tons / cm2 at room temperature, and hold the pressure for 25 minutes to obtain a cold pressed green body;

[0066] S1: placing the cold pressed green body together with the mold into a sintering furnace, heating at a rate of 25°C / min, heating to a final sintering temperature of 700°C and keeping the temperature for 0.5 hours, cooling to room temperature with the furnace, taking out, and removing burrs to obtain an abrasive;

[0067] S4: Opening a slot on the wheel body;

[0068] S5: Vapor-depositing microcrystalline particles on the surface of the wheel body to increase the roughness of the wheel body surface and the inner wall of the slot;

[0069] S6: The abrasive is fixed in the wheel body slot by gluing to obtain a prefabricated part.

[0070] This thinning grinding wheel is used for thinning grinding of sapphire substrates. The conventional processing load is 25, and it can finish 4-inch wafers with a thickness of 660μm. The service life is about 2500 wafers, which is higher than the existing common imported products.

[0071] The above description is only the preferred embodiment of the present invention, which does not limit the protection scope of the present invention. For those skilled in the art, the present invention can be modified and varied in various ways. Within the spirit and principle of the present invention, any change, modification, replacement, integration and parameter change of these embodiments by conventional substitution or capable of achieving the same function without departing from the principle and spirit of the present invention shall fall within the protection scope of the present invention.

Claims

1. A resin grinding wheel for sapphire substrate processing, characterized in that : comprising a wheel body (3) and an abrasive (1); the wheel body (3) is provided with a plurality of T-shaped slots (2); a portion of the abrasive (1) is embedded in the slots (2); the abrasive (1) is a metal bond abrasive.

2. A resin grinding wheel for sapphire substrate processing according to claim 1, characterized in that The wheel body (3) is made of high-density aluminum alloy or bakelite.

3. The resin grinding wheel for sapphire substrate processing according to claim 1, characterized in that The preparation method of the abrasive (1) comprises the following steps: A: Put titanium powder, aluminum powder, carbon fiber and lanthanum metal into a three-dimensional mixer, pre-mix for 2.5 hours, then add diamond, mix for 6 hours, and pass through a 60-mesh screen to obtain a mixture; B: The mixture was passed through a 200-mesh sieve, and then pressed at a pressure of 3.5 tons / cm2 for 25 minutes at room temperature to obtain a cold-pressed green body; C: Place the cold pressed green body together with the mold into a sintering furnace, heat up at a rate of 25°C / min, heat to the final sintering temperature of 700°C and keep it for 0.5 hours, cool to room temperature, take out, and obtain the abrasive after deburring.

4. The method for preparing the abrasive according to claim 3, characterized in that The mass ratio of the titanium powder, aluminum powder, carbon fiber, metal lanthanum and diamond is 6:2.5:1.8:0.7:2.5; the length of the carbon fiber is 8 to 10 microns and the diameter is 300 nanometers, which can provide excellent wear resistance and avoid affecting the density of the grinding wheel.

5. A method for preparing a resin grinding wheel for processing a sapphire substrate, comprising the following steps: S1: Put titanium powder, aluminum powder, carbon fiber and metal lanthanum into a three-dimensional mixer according to the proportion, pre-mix for 2.5 hours, then add diamond, mix for 6 hours, and pass through a 60-mesh screen to obtain a mixture; S2: The mixture is passed through a 200-mesh sieve and sieved 4 times to ensure that the material does not agglomerate, then slowly put into the mold, rotate the mold and flatten it with a scraper, put on the upper pressing ring, and place it together with the mold on the pressing platform of the grinding wheel hydraulic press, apply a pressure of 3.5 tons / cm2 at room temperature, and hold the pressure for 25 minutes to obtain a cold pressed green body; S3: placing the cold pressed green body together with the mold into a sintering furnace, heating at a rate of 25°C / min, heating to a final sintering temperature of 700°C and keeping the temperature for 0.5 hours, cooling to room temperature with the furnace, taking out, deburring and obtaining an abrasive; S4: Opening a slot on the wheel body; S5: Vapor-depositing microcrystalline particles on the surface of the wheel body to increase the roughness of the wheel body surface and the inner wall of the slot; S6: The abrasive is fixed in the wheel body slot by gluing to obtain a prefabricated part.

6. The method for preparing a resin grinding wheel for processing a sapphire substrate according to claim 5, characterized in that The method for preparing the abrasive comprises the following steps: a mold groove corresponding to the card slot is opened on the top of the mold in step S2; and an integrally formed card block is arranged at the bottom of the molded abrasive.

7. The method for preparing a resin grinding wheel for processing a sapphire substrate according to claim 6, characterized in that In step S6, the block at the bottom of the abrasive is aligned with the slot above the wheel body, and adhesive is applied inside the slot to complete the installation of the abrasive and the wheel body.

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