Wafer chamfer cutting method, electronic equipment, computer readable storage medium and scribing machine

Abstract

The invention relates to the technical field of scribing machines, in particular to a wafer chamfer cutting method, electronic equipment, a computer readable storage medium and a scribing machine. According to the chamfer cutting method for the wafer, the coordinate of a corner point B to be cut off on the wafer and the coordinate of a cutting point A on one side edge where the corner point B is located are obtained, and the cutting point A is located on a chamfer cutting line of the corner point B. And the carrying table rotates by a preset angle, so that the corner point B falls on the X axis, and the chamfering cutting line is parallel to the Y axis of the rectangular plane coordinate system. The coordinate of the cutting point A after rotation is obtained according to the preset angle, the carrying table moves towards the cut-off tool in the X-axis direction till the chamfering cutting line is located under the cut-off tool, the cut-off tool descends to the cutting height, the carrying table moves towards the cut-off tool in the Y-axis direction, and chamfering cutting of the corner point B is completed. Chamfer cutting is carried out on the corners of the wafer through the cut-off tool, the grooving tool does not need to be replaced, and the chamfer cutting efficiency of the wafer is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer dicing machines, and in particular to a wafer chamfering cutting method, electronic equipment, computer-readable storage medium and wafer dicing machine. Background Art

[0002] During the wafer cutting process, the dicing machine controls the slotting tool of the first axis to descend to the first height to slot and cut the wafer on the stage. Then the cutting tool of the second axis is controlled to descend to the second height so that the cutting tool can cut the wafer into small pieces along the slotting marks. Finally, the slotting tool of the first axis is replaced, and the corners of the small wafers are chamfered to avoid defects, cracks and other problems at the corners of the wafer after the wafer (based on the brittle characteristics of the silicon substrate itself) is slightly squeezed or collided.

[0003] In the above-mentioned cutting process, since the first axis and the second axis have different set tool heights (the descending heights of the tool), after the tool change operation on the first axis, it is necessary to reset the tool height of the first axis, and perform operations such as tool sharpening and warm-up, which reduces the chamfer cutting efficiency of the wafer. Summary of the invention

[0004] The object of the present invention is to provide a wafer chamfer cutting method, electronic equipment, computer-readable storage medium and dicing machine to improve the chamfer cutting efficiency of the wafer.

[0005] To achieve this purpose, the technical solution adopted by the present invention is:

[0006] The chamfer cutting method of a wafer comprises the following steps:

[0007] The wafer to be cut is placed and adsorbed on the stage of the dicing machine;

[0008] Establishing a plane rectangular coordinate system with the rotation center of the carrier as the origin; obtaining the coordinates of the corner point B to be cut off on the wafer and the coordinates of the cutting point A on a side where the corner point B is located, wherein the cutting point A is located on the chamfering cutting line of the corner point B;

[0009] The stage is rotated by a preset angle so that the corner point B falls on the X-axis of the plane rectangular coordinate system, and the chamfer cutting line is parallel to the Y-axis of the plane rectangular coordinate system;

[0010] The coordinates of the cutting point A after rotation are obtained according to the preset angle, and the carrier moves toward the cutting tool along the X-axis direction until the chamfer cutting line is located directly below the cutting tool;

[0011] The cutting tool is lowered to a cutting height, and the carrier moves along the Y axis toward the cutting tool to complete the chamfering of the corner point B.

[0012] As an optional solution of the wafer chamfering cutting method, before the carrier rotates, it is determined whether the corner point B is located on the X-axis or the Y-axis;

[0013] If the corner point B is located on the X-axis, the preset angle is 0° or 180°;

[0014] If the corner point B is located on the Y axis, the preset angle is 90° or 270°.

[0015] As an optional solution of the chamfer cutting method of the wafer, if the corner point B is not on the X-axis or the Y-axis, the preset angle is calculated according to the coordinates of the corner point B before and after rotation.

[0016] As an optional solution of the wafer chamfer cutting method, before the carrier rotates, it is determined whether the coordinates of the cutting point A are located at the origin of the plane rectangular coordinate system;

[0017] If the coordinates of the cutting point A are located at the origin of the plane rectangular coordinate system, then the coordinate value of the cutting point A after rotation is.

[0018] As an optional solution for the chamfer cutting method of the wafer, the coordinates of the corner point B and the cutting point A before rotation are acquired by a positioning camera on the dicing machine.

[0019] As an optional solution of the wafer chamfering cutting method, the moving speed of the carrier along the Y-axis toward the cutting tool is 0 mm / s to 400 mm / s.

[0020] Electronic equipment, including:

[0021] at least one processor; and

[0022] a memory communicatively connected to the at least one processor; wherein,

[0023] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can perform the above-mentioned wafer chamfering cutting method.

[0024] A computer readable storage medium stores a computer program, which implements the above-mentioned wafer chamfering cutting method when executed by a processor.

[0025] The dicing machine comprises a carrier, a second shaft and a cutting tool, wherein the carrier is used to carry the wafer, the second shaft is located above the carrier and the cutting tool is provided at the output end of the second shaft, and the cutting tool performs chamfer cutting of the wafer by the above-mentioned wafer chamfer cutting method.

[0026] As an optional solution of the dicing machine, the dicing machine further includes a first shaft and a slotting tool, wherein the first shaft is located above the carrier and the slotting tool is provided at the output end of the first shaft.

[0027] The beneficial effects of the present invention are:

[0028] The chamfer cutting method of the wafer proposed by the present invention first establishes a plane rectangular coordinate system with the rotation center of the carrier as the origin, obtains the coordinates of the corner point B to be cut on the wafer and the coordinates of the cutting point A on a side where the corner point B is located, and the cutting point A is located on the chamfer cutting line of the corner point B. The carrier rotates a preset angle so that the corner point B falls on the X-axis of the plane rectangular coordinate system, and the chamfer cutting line is parallel to the Y-axis of the plane rectangular coordinate system. According to the preset angle, the coordinates of the rotating cutting point A are obtained, and the carrier moves toward the cutting tool along the X-axis direction until the chamfer cutting line is directly below the cutting tool. The cutting tool is lowered to the cutting height, and the carrier moves toward the cutting tool along the Y-axis to complete the chamfer cutting of the corner point B. The corners of the wafer are chamfered by the cutting tool, and there is no need to replace the slotting tool, which avoids the operations of resetting the knife height of the first axis, sharpening the knife, and warming up the machine, thereby improving the chamfer cutting efficiency of the wafer.

[0029] The electronic device, computer-readable storage medium and dicing machine proposed in the present invention directly chamfer the corners of the wafer by using a cutting tool, thereby improving the chamfering efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a top view of a dicing machine before the stage is rotated provided by an embodiment of the present invention;

[0031] Figure 2 is a top view of the dicing machine after the carrier is rotated provided by an embodiment of the present invention;

[0032] Figure 3 It is a main flow chart of the wafer chamfering cutting method provided by an embodiment of the present invention;

[0033] Figure 4 It is a block diagram of an electronic device provided by an embodiment of the present invention.

[0034] The names and numbers of the components in the figure are as follows:

[0035] 400, dicing machine; 401, memory; 402, processor;

[0036] 1. Carrier; 2. Slotting tool; 3. Cutting tool; 4. Turntable; 5. Wafer; 6. Chamfer cutting line. DETAILED DESCRIPTION

[0037] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the present invention are further described below in conjunction with the accompanying drawings and through specific implementation methods. It is understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for the convenience of description, only the parts related to the present invention are shown in the accompanying drawings, not all.

[0038] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0040] In the description of this embodiment, the terms "upper", "lower", "right", "left" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0041] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0042] like Figure 1 and Figure 2 As shown, this embodiment proposes a dicing machine 400, which includes a carrier 1, a first axis and a slotting tool 2, a second axis and a cutting tool 3, and the carrier 1 is used to carry a wafer 5. The first axis is located above the carrier 1 and the slotting tool 2 is provided at the output end of the first axis. The second axis is located above the carrier 1 and the cutting tool 3 is provided at the output end of the second axis.

[0043] Specifically, the dicing machine 400 also includes a machine platform, a turntable 4, a driving member and a vacuum adsorption mechanism. The turntable 4 is rotatably mounted on the machine platform, and the carrier 1 is mounted on the turntable 4 and rotates synchronously with the turntable 4. Both the first axis and the second axis can be lifted and lowered on the machine platform. A plurality of driving members are also installed on the machine platform to respectively drive the turntable 4 to rotate and the first axis and the second axis to lift and move. An adsorption hole is provided on the carrier 1, and the pipeline of the vacuum adsorption mechanism is connected to the adsorption hole, so that the carrier 1 carries and fixes the wafer 5 by vacuum adsorption. Since the dicing machine 400 is a prior art, the structure and working process of the dicing machine 400 will not be described in detail.

[0044] In this embodiment, the dicing machine 400 controls the slotting tool 2 of the first axis to descend to the first height to slot and cut the wafer 5 on the stage 1. Then the cutting tool 3 of the second axis is controlled to descend to the second height so that the cutting tool 3 divides the wafer 5 into small pieces along the slotting marks. Finally, the slotting tool 2 of the first axis is replaced, and the corners of the small wafer 5 are chamfered to avoid defects, cracks, and other problems of the wafer 5.

[0045] In the above-mentioned cutting process, after the tool changing operation is performed on the first axis, the tool height of the first axis needs to be reset, and operations such as tool sharpening and warming up need to be performed, which reduces the chamfer cutting efficiency of the wafer 5 .

[0046] To solve the above problems, Figure 1 to Figure 3 As shown, this embodiment also proposes a wafer chamfering cutting method, and the wafer chamfering cutting method includes the following steps:

[0047] The wafer 5 to be cut is placed and adsorbed on the carrier 1 of the dicing machine 400 .

[0048] A plane rectangular coordinate system is established with the rotation center of the carrier 1 as the origin, and the coordinates of the corner point B to be cut on the wafer 5 and the coordinates of the cutting point A on a side where the corner point B is located are obtained. The cutting point A is located on the chamfering cutting line 6 of the corner point B.

[0049] The stage 1 is rotated by a preset angle (clockwise as indicated by the arrow in the figure) so that the corner point B falls on the X-axis of the plane rectangular coordinate system and the chamfer cutting line 6 is parallel to the Y-axis of the plane rectangular coordinate system.

[0050] The coordinates of the cutting point A after rotation are obtained according to the preset angle, and the stage 1 moves toward the cutting tool 3 along the X-axis direction until the chamfer cutting line 6 is located directly below the cutting tool 3;

[0051] The cutting tool 3 descends to the cutting height, and the carrier 1 moves along the Y axis toward the cutting tool 3 to complete the chamfering of the corner point B.

[0052] The chamfer cutting method of the wafer of this embodiment first establishes a plane rectangular coordinate system with the rotation center of the carrier 1 as the origin, that is, the XY coordinate system in the figure. The coordinates of the corner point B to be cut on the wafer 5 and the coordinates of the cutting point A on one side where the corner point B is located are obtained, and the cutting point A is located on the chamfer cutting line 6 of the corner point B. The carrier 1 rotates a preset angle so that the corner point B falls on the X axis of the plane rectangular coordinate system, and the chamfer cutting line 6 is parallel to the Y axis of the plane rectangular coordinate system. According to the preset angle, the coordinates of the rotating cutting point A are obtained, and the carrier 1 moves toward the cutting tool 3 along the X axis until the chamfer cutting line 6 is directly below the cutting tool 3. The cutting tool 3 is lowered to the cutting height, and the carrier 1 moves toward the cutting tool 3 along the Y axis to complete the chamfer cutting of the corner point B. The corners of the wafer 5 are chamfered by the cutting tool 3, and there is no need to replace the slotting tool 2, which avoids the operations of resetting the knife height of the first axis, sharpening the knife and warming up the machine, thereby improving the chamfer cutting efficiency of the wafer 5.

[0053] It should be noted that the coordinates of the corner point B and the cutting point A before rotation are obtained by the positioning camera (not shown in the figure) on the dicing machine 400 to ensure the coordinate accuracy of the corner point B and the cutting point A, thereby improving the quality of chamfer cutting. The above-mentioned positioning camera can be a CCD camera to obtain the coordinates of the corner point B and the cutting point A in the plane rectangular coordinate system by taking pictures. Since the positioning camera and the process of obtaining the coordinate value are both existing technologies, the structure and working process of the positioning camera will not be described in detail.

[0054] Specifically, Figure 1 As shown, first, the wafer 5 to be cut is placed on the carrier 1, and the carrier 1 fixes the wafer 5 by vacuum adsorption to ensure that the position of the wafer 5 relative to the carrier 1 remains fixed. Then, a plane rectangular coordinate system is established with the rotation center of the carrier 1 as the origin, and the projection of the cutting tool 3 on the carrier 1 along the height direction falls on the X-axis. Secondly, the coordinates of the corner point B to be cut off and the coordinates of the cutting point A on one side where the corner point B is located are obtained by positioning the camera. It should be noted that the selection of cutting point A depends on the angle of the chamfer, and the cutting point A is located on the chamfer cutting line 6 of the corner point B, so that the cutting point A is the starting point or end point of the chamfer cutting.

[0055] The chamfered cutting line 6 is made parallel to the Y axis by rotating the carrier 1 by a preset angle, and the corner point B falls on the X axis. Since the rotation angle of the corner point B is the same as that of the cutting point A, the preset angle of the present embodiment can be calculated based on the coordinates of the corner point B before and after rotation, thereby obtaining the rotation angle of the cutting point A, and then the coordinate value of the rotating cutting point A is calculated based on the coordinates of the cutting point A before rotation and the rotation angle, thereby obtaining the coordinate value of the X axis of the chamfered cutting line 6. Thus, based on the coordinates of the rotating cutting point A and the coordinate value of the projection point of the cutting tool 3 falling on the plane rectangular coordinate system, that is, the difference between the X coordinate value of the rotating cutting point A and the X coordinate value of the projection point, the carrier 1 moves toward the cutting tool 3 along the X axis direction until the chamfered cutting line 6 is located directly below the cutting tool 3. At this time, the X coordinate value of the rotating cutting point A is equal to the X coordinate value of the projection point. Finally, the cutting tool 3 descends to the cutting height, and the carrier 1 moves along the Y axis (forward or reverse) toward the cutting tool 3. The cutting tool 3 cuts off the corner point B along the chamfering cutting line 6 and forms a chamfer to complete the chamfering cutting of the corner point B.

[0056] It should be noted that before the stage 1 rotates, it is determined whether the coordinates of the cutting point A are located at the origin of the plane rectangular coordinate system. If the coordinates of the cutting point A are located at the origin of the plane rectangular coordinate system, the coordinate value of the cutting point A after rotation is (0, 0).

[0057] Before the stage 1 rotates, determine whether the corner point B is located on the X-axis or the Y-axis. If the corner point B is located on the X-axis, the preset angle is 0° or 180°; if the corner point B is located on the Y-axis, the preset angle is 90° or 270°. Specifically, when the corner point B is located in the positive direction of the X-axis, the preset angle is 0°, that is, chamfering can be performed at the corner point B without rotation. When the corner point B is located in the negative direction of the X-axis, the preset angle is 180°, that is, the stage 1 is rotated 180° in the clockwise direction as indicated by the arrow in the figure, and the corner point B can be rotated to the positive direction of the X-axis. When the corner point B is located in the positive direction of the Y-axis, the preset angle is 90°, that is, the stage 1 is rotated 90° in the clockwise direction as indicated by the arrow in the figure, and the corner point B can be rotated to the positive direction of the X-axis. If the corner point B is located in the negative direction of the Y axis, the preset angle is 270°, that is, the stage 1 is rotated 270° in the clockwise direction as indicated by the arrow in the figure to rotate the corner point B to the positive direction of the X axis.

[0058] Furthermore, if the corner point B is not on the X-axis or the Y-axis, the preset angle is calculated according to the coordinates of the corner point B before and after the rotation.

[0059] In this embodiment, the moving speed of the stage 1 along the Y axis toward the cutting tool 3 is 0 mm / s to 400 mm / s. The moving speed of the stage 1 along the Y axis toward the cutting tool 3 can be 50 mm / s, 100 mm / s, 150 mm / s, 200 mm / s, 250 mm / s, 300 mm / s, 350 mm / s or 400 mm / s, etc., to ensure the stability of the chamfer cutting, avoid excessive cutting force due to excessive chamfer cutting speed, thereby causing problems such as wafer 5 cracking, incomplete cutting or uneven cutting edge, and improve the chamfer cutting quality of the wafer 5.

[0060] like Figure 4 As shown, this embodiment also proposes an electronic device, which includes at least one processor 402 and a memory 401 that is communicatively connected to at least one processor 402. The memory 401 stores a computer program that can be executed by at least one processor 402, and the computer program is executed by at least one processor 402 so that at least one processor 402 can perform the above-mentioned chamfering cutting method of the wafer. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present application described and / or required herein.

[0061] This embodiment further provides a computer-readable storage medium on which a computer program is stored. When the program is executed by the processor 402, the above-mentioned wafer chamfering cutting method is implemented.

[0062] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor 402, which can be a special purpose or general purpose programmable processor 402, which can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0063] The program code for implementing the method itself can be written in any combination of one or more programming languages. These program codes can be provided to a processor 402 or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the program code, when executed by the processor 402 or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code can be executed entirely on the machine, partially on the machine, partially on the machine as a stand-alone software package and partially on a remote machine, or entirely on a remote machine or server.

[0064] In the context of the present application, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0065] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0066] The systems and techniques described herein can be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a grid browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication grid). Examples of communication grids include: a local area network (LAN), a wide area network (WAN), the Internet, and a blockchain grid.

[0067] A computer system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication grid. The relationship between the client and the server is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or a cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services ("Virtual Private Server", or "VPS" for short). The server may also be a server for a distributed system, or a server combined with a blockchain.

[0068] The above embodiments are only to illustrate the basic principles and characteristics of the present invention. The present invention is not limited by the above embodiments. Without departing from the spirit and scope of the present invention, the present invention may be subject to various changes and modifications, which are within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A method for chamfering a wafer, characterized in that: The steps include: The wafer (5) to be cut is placed and adsorbed on the carrier (1) of the dicing machine (400); A plane rectangular coordinate system is established with the rotation center of the carrier (1) as the origin; the coordinates of the corner point B to be cut off on the wafer (5) and the coordinates of a cutting point A on a side where the corner point B is located are obtained, and the cutting point A is located on the chamfering cutting line (6) of the corner point B; The carrier (1) is rotated at a preset angle so that the corner point B falls on the X-axis of the plane rectangular coordinate system, and the chamfer cutting line (6) is parallel to the Y-axis of the plane rectangular coordinate system; The coordinates of the cutting point A after rotation are obtained according to the preset angle, and the carrier (1) moves along the X-axis direction toward the cutting tool (3) until the chamfer cutting line (6) is located directly below the cutting tool (3); The cutting tool (3) is lowered to a cutting height, and the carrier (1) moves along the Y axis toward the cutting tool (3) to complete the chamfering of the corner point B.

2. The wafer chamfering cutting method according to claim 1, characterized in that: Before the carrier (1) rotates, determining whether the corner point B is located on the X-axis or the Y-axis; If the corner point B is located on the X-axis, the preset angle is 0° or 180°; If the corner point B is located on the Y axis, the preset angle is 90° or 270°.

3. The wafer chamfering cutting method according to claim 1, characterized in that: If the corner point B is not on the X-axis or the Y-axis, the preset angle is calculated according to the coordinates of the corner point B before and after the rotation.

4. The wafer chamfering cutting method according to claim 1, characterized in that: Before the carrier (1) rotates, determining whether the coordinates of the cutting point A are located at the origin of the plane rectangular coordinate system; If the coordinates of the cutting point A are located at the origin of the plane rectangular coordinate system, the coordinate value of the cutting point A after rotation is (0, 0).

5. The wafer chamfering cutting method according to claim 1, characterized in that: The coordinates of the corner point B and the cutting point A before rotation are acquired through a positioning camera on the dicing machine (400).

6. The wafer chamfering cutting method according to claim 1, characterized in that: The moving speed of the carrier (1) along the Y axis toward the cutting tool (3) is 0 mm / s to 400 mm / s.

7. An electronic device, characterized in that include: at least one processor (402); as well as A memory (401) communicatively connected to the at least one processor (402); wherein, The memory (401) stores a computer program executable by the at least one processor (402), and the computer program is executed by the at least one processor (402) so that the at least one processor (402) can perform the wafer chamfering cutting method according to any one of claims 1 to 6.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the wafer chamfering method according to any one of claims 1 to 6 is implemented.

9. A dicing machine, characterized in that: The invention comprises a carrier (1), a second shaft and a cutting tool (3), wherein the carrier (1) is used to carry a wafer (5), the second shaft is located above the carrier (1) and the cutting tool (3) is provided at the output end of the second shaft, and the cutting tool (3) performs chamfer cutting of the wafer (5) by the chamfer cutting method of the wafer according to any one of claims 1 to 6.

10. The dicing machine according to claim 9, characterized in that: The dicing machine (400) further comprises a first shaft and a slotting tool (2), wherein the first shaft is located above the carrier (1) and the slotting tool (2) is arranged at the output end of the first shaft.

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