High-precision micro-fluidic chip mold and preparation process thereof

Abstract

The invention discloses a high-precision micro-fluidic chip mold and a preparation process thereof, and relates to the field of chip molds, the high-precision micro-fluidic chip mold comprises a metal mold core, a photosensitive tape, a photoetching forming groove, metal and a metal protection layer, the metal mold core comprises but is not limited to a silicon template, a copper template, an aluminum template and a tungsten template; the photosensitive adhesive tape comprises but is not limited to a PI heat-resistant film silica gel adhesive tape, a printable photosensitive adhesive and a photosensitive adhesive tape for injection molding of a plastic micro-fluidic chip; the metal protection layer comprises but is not limited to a titanium nitride protection layer, an aluminum protection layer and a tantalum and tantalum nitride protection layer. According to the high-precision micro-fluidic chip mold and the preparation process thereof, the mold manufacturing period is short, general patterns can be controlled to be completed within 3 days, compared with machining, the cost is greatly reduced, the pattern fineness can reach the UM level, and the precision is the same as that of a photoresist direct curing mold; and after-process polishing is not needed, and the method can be directly used.

Description

Technical Field

[0001] The invention relates to the field of chip molds, and in particular to a high-precision microfluidic chip mold and a preparation process thereof. Background Art

[0002] The simple mold after photoresist curing, although the mold production is precise and fast, but the small sharp-angle graphics in the mold are worn too quickly during the production process, and are not suitable for batch continuous production. The molds processed by precision mechanical equipment can be mass-produced, but the equipment cost is very high, the processing cycle is long, and the size of the fine graphics is generally above 0.1MM. Generally, electroforming molds can realize rapid mold production, but the traditional process limits the fine precision and size of the graphics directly on the mold, and generally need to be re-assembled; at the same time, the hardness of the mold is between the above two.

[0003] Therefore, it is necessary to propose a high-precision microfluidic chip mold and its preparation process to solve the above problems. Summary of the invention

[0004] The main purpose of the present invention is to provide a high-precision microfluidic chip mold and a preparation process thereof, which can effectively solve the problems in the background technology.

[0005] To achieve the above object, the technical solution adopted by the present invention is: A high-precision microfluidic chip mold, comprising a metal mold core, a photosensitive tape, a photolithography molding groove, a metal, and a metal protective layer. The metal mold core includes but is not limited to a silicon template, a copper template, an aluminum template, and a tungsten template; the photosensitive tape includes but is not limited to a PI heat-resistant film silicone tape, a printable photosensitive adhesive, and a photosensitive tape for injection molding of plastic microfluidic chips; the metal protective layer includes but is not limited to a titanium nitride protective layer, an aluminum protective layer, tantalum, and a tantalum nitride protective layer.

[0006] Preferably, the thickness of the metal protective layer is 10-30 nm, the thickness of the metal mold core is 100-500 μm, and the thickness of the photosensitive tape is 50-150 μm.

[0007] A preparation process of a high-precision microfluidic chip mold includes the following steps: S1: Select the appropriate metal mold core and clean it; S2: Electroplated metal film as base layer; S3: packaging photosensitive tape; S4: Photolithography of product graphics; S5: growing electroplated metal within the etched pattern; S6: removing the photosensitive tape; S7: electroplating metal film again; S8: Finally, a metal protective layer is applied to form an injection molded product.

[0008] Preferably, S1 comprises the following steps: S101: Degreasing and cleaning: put the metal mold core into the degreasing solution, control the temperature at 40-62℃, and soak for 20 minutes until the grease and dirt on the surface are removed; S102: hot water washing, washing the metal mold core with hot water to remove residual degreasing liquid; S103: rust removal treatment, using rust removal liquid to spray and clean the metal mold core, the temperature is controlled at 40-50°C, until the rust on the surface is removed; S104: Secondary hot water washing, using hot water to rinse the metal mold core again to remove the residual rust removal solution; S105: Thinning treatment, using acidic liquid to spray and clean the metal mold core, the temperature is controlled at 42-60°C, and the cycle is repeated three times, and water is washed after each rinse until the surface oxide layer is completely removed; S106: washing with hot water three times, washing the metal mold core with hot water to remove residual acidic liquid; S107: Pickling: Soak the metal mold core in an acid solution until impurities and oxides on the surface are removed; S108: Neutralization treatment: soaking the metal mold core with alkaline liquid until the acidic substances on the surface are neutralized; S109: washing with hot water four times, washing the metal mold core with hot water four times to remove the residual liquid medicine; S110: Drying treatment: purge, dehydrate and dry the metal mold core, and the drying temperature is controlled at 180-260℃; S111: Destatic treatment, the dried metal mold core is destaticized to prevent static electricity from absorbing dust and impurities.

[0009] Preferably, S2 comprises the following steps: S201: preparing the electroplating solution, using copper sulfate electroplating solution, adding sulfuric acid, the concentration of the copper sulfate electroplating solution is 150-250 g / L, and the concentration of sulfuric acid is 50-100 g / L, dissolving the copper sulfate electroplating solution in water, then slowly adding sulfuric acid, stirring evenly, and filtering the prepared electroplating solution using filter paper or a filter; S202: Install the electrode and the template, use the processed metal mold as the cathode and connect it to the negative pole of the power supply; select the copper block as the anode material, connect the anode to the positive pole of the power supply, ensure that the electrode is firmly connected to the power supply, and the position of the electrode and the template in the electroplating tank is appropriate to make the current evenly distributed; S203: Set the electroplating parameters, the current density is set between 1-5A / dm²; the electroplating time is calculated by the thickness of the electroplated layer, the thickness of the electroplated layer (μm) = current density (A / dm²) × electroplating time (h) × electrochemical equivalent of the electroplated metal (g / Ah) ÷ density of the electroplated metal (g / cm³); temperature: keep the plating solution temperature generally between 45-60℃; S204: start electroplating, turn on the power supply, start electroplating, during the electroplating process, metal ions in the electroplating solution move toward the cathode metal mold core under the action of the electric field, and obtain electrons on the surface of the metal mold core to be reduced to metal atoms, and deposit on the surface of the metal mold core to form an electroplating layer; S205: Post-plating treatment: After the electroplating is completed, the metal mold core is immediately taken out from the electroplating tank and rinsed with running water to remove the electroplating liquid remaining on the surface.

[0010] Preferably, S5 includes the following steps: S501: Preparation before plating: soak the metal mold with etched patterns in an ultrasonic cleaning machine filled with acetone for 5-10 minutes at an ultrasonic frequency of 40-60kHz until the oil stains, photoresist residues and other organic pollutants on the surface are removed, and rinse the metal mold with a large amount of deionized water until there is no organic solvent residue on the surface, and the rinsing time is 3-5 minutes; S502: Acid etching treatment: immerse the metal mold core in a 5%-10% hydrochloric acid solution for 2-3 minutes until the slight oxide layer and metal debris that may exist on the surface are removed, and then rinse thoroughly with deionized water again; S503: Preparation of electroplating solution: the electroplating solution is 150-250g / L copper sulfate, 50-100g / L sulfuric acid, and 20-50g / L chloride ion additive. First, various salts are dissolved in an appropriate amount of deionized water, then fully stirred, and the electroplating solution is filtered to remove suspended impurities; S504: Heating and stirring the plating solution, heating the plating solution to 20-30°C and keeping it stable, turning on the plating solution stirring device until the plating solution forms a moderate convection to ensure uniform distribution of metal ions; S505: The cleaned metal mold with etched patterns is used as the cathode, and is firmly connected to the negative pole of the DC power supply through a wire to ensure good contact at the connection point. A nickel plate is used as the anode. The shape and size of the anode should be designed according to the conditions of the electroplating tank and the metal mold. The anode is installed in the electroplating tank to keep a distance of 10-20 cm from the cathode metal mold; S506: Electroplating parameter setting and monitoring, current density setting: current density is controlled at 1-3A / dm²; electroplating time calculation and control: electroplating time is calculated according to the thickness of the required electroplated metal layer and the set current density. The thickness calculation formula is: thickness (μm) = current density (A / dm²) × electroplating time (h) × electrochemical equivalent of electroplated metal (g / Ah) ÷ density of electroplated metal (g / cm³). During the electroplating process, a timer is used to accurately control the electroplating time, and the current size is monitored in real time through a current monitoring device to ensure that it is stable within the set value range; temperature monitoring and adjustment: a high-precision thermometer is used to monitor the temperature of the electroplating solution in real time, and it is linked with the heating and cooling devices to ensure that the temperature fluctuation is controlled within ±1-2℃; S507: electroplating operation, turn on the DC power supply, start electroplating, under the action of the electric field, the metal ions in the electroplating solution move to the metal mold core of the cathode, and obtain electrons in the area of ​​the etched pattern to be reduced to metal atoms, and gradually deposit to form a metal layer. During the electroplating process, the state of the electroplating solution, the bubble generation on the surface of the metal mold core, and the stability of the current and temperature are continuously observed. When abnormal phenomena are found, including excessive growth of the local coating, excessive current fluctuations, and temperature out of control, the electroplating is stopped immediately, the cause is checked and adjustments are made; S508: Post-plating treatment, cleaning and rinsing with deionized water: After the electroplating is completed, the metal mold core is quickly taken out from the electroplating tank, and first rinsed in running ordinary water for 3-5 minutes until most of the residual electroplating liquid on the surface is removed, and then the metal mold core is transferred to the deionized water rinsing device and rinsed with deionized water for multiple times, each rinsing time is 1-2 minutes, to ensure that there is no electroplating liquid residue on the surface; Drying treatment: Use clean hot air at a temperature of 60-80℃ to blow the surface of the metal mold core, and the drying time is 10-15 minutes.

[0011] Compared with the prior art, the present invention provides a high-precision microfluidic chip mold and a preparation process thereof, which has the following beneficial effects: The high-precision microfluidic chip mold and its preparation process have a short mold manufacturing cycle. Generally, the graphics can be completed within 3 days. Compared with mechanical processing, the cost is greatly reduced. The graphic fineness can reach UM level, and the precision is the same as that of the photoresist direct curing mold. The mold with surface hardening treatment does not need post-process polishing and can be used directly. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a flow chart of the present invention.

[0013] In the figure: 1. Metal mold core; 2. Photosensitive tape; 3. Photolithography molding groove; 4. Metal; 5. Metal protective layer; 6. Injection molded product. DETAILED DESCRIPTION

[0014] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods. Embodiment 1

[0015] like Figure 1 As shown, a high-precision microfluidic chip mold includes a metal mold core 1, a photosensitive tape 2, a photolithography molding groove 3, a metal 4, and a metal protective layer 5. The metal mold core 1 includes but is not limited to a silicon template, a copper template, an aluminum template, and a tungsten template; the photosensitive tape 2 includes but is not limited to a PI heat-resistant film silicone tape, a printable photosensitive adhesive, and a photosensitive tape for injection molding of a plastic microfluidic chip; the metal protective layer 5 includes but is not limited to a titanium nitride protective layer, an aluminum protective layer, a tantalum and a tantalum nitride protective layer, the thickness of the metal protective layer 5 is 10-30nm, the thickness of the metal mold core 1 is 100-500μm, and the thickness of the photosensitive tape 2 is 50-150μm. Embodiment 2

[0016] A preparation process of a high-precision microfluidic chip mold includes the following steps: S1: Select a suitable metal mold core 1, purify and clean it, including the following steps: S101: Degreasing and cleaning, placing the metal mold core 1 in a degreasing solution, controlling the temperature at 40-62° C., and soaking for 20 minutes until the grease and dirt on the surface are removed; S102: hot water washing, washing the metal mold core 1 with hot water to remove the residual degreasing liquid; S103: rust removal treatment, using rust removal liquid to spray and clean the metal mold core 1, and the temperature is controlled at 40-50° C. until the rust on the surface is removed; S104: washing with hot water for the second time, washing the metal mold core 1 again with hot water to remove the residual rust removal liquid; S105: Thinning treatment, using an acidic liquid to spray and clean the metal mold core 1, the temperature is controlled at 42-60°C, and the cycle is repeated three times, and water is washed after each rinse until the oxide layer on the surface is completely removed; S106: washing with hot water three times, washing the metal mold core 1 with hot water to remove residual acidic liquid; S107: pickling: soaking the metal mold core 1 with an acid solution until impurities and oxides on the surface are removed; S108: Neutralization treatment: soaking the metal mold core 1 with an alkaline solution until the acidic substances on the surface are neutralized; S109: washing with hot water four times, washing the metal mold core 1 with hot water four times to remove the residual liquid medicine; S110: Drying treatment, purging, dehydrating and drying the metal mold core 1, and the drying temperature is controlled at 180-260°C; S111: Destatic treatment, performing destatic treatment on the dried metal mold core 1 to prevent static electricity from absorbing dust and impurities; S2: Electroplating metal film as the base layer, including the following steps: S201: preparing the electroplating solution, using copper sulfate electroplating solution, adding sulfuric acid, the concentration of the copper sulfate electroplating solution is 150-250 g / L, and the concentration of sulfuric acid is 50-100 g / L, dissolving the copper sulfate electroplating solution in water, then slowly adding sulfuric acid, stirring evenly, and filtering the prepared electroplating solution using filter paper or a filter; S202: installing electrodes and templates, using the processed metal mold core 1 as a cathode and connecting it to the negative pole of a power source; selecting a copper block as an anode material, connecting the anode to the positive pole of a power source, ensuring that the electrode is firmly connected to the power source, and that the electrode and template are properly positioned in the electroplating tank so that the current is evenly distributed; S203: Set the electroplating parameters, the current density is set between 1-5A / dm²; the electroplating time is calculated by the thickness of the electroplated layer, the thickness of the electroplated layer μm=current density A / dm²×electroplating time h×electrochemical equivalent of the electroplated metal g / Ah÷density of the electroplated metal g / cm³; Temperature: keep the plating solution temperature generally between 45-60℃; S204: start electroplating, turn on the power supply, start electroplating, during the electroplating process, the metal ions in the electroplating solution move toward the cathode metal mold core 1 under the action of the electric field, and obtain electrons on the surface of the metal mold core 1 to be reduced to metal atoms, and are deposited on the surface of the metal mold core 1 to form an electroplating layer; S205: Post-plating treatment: after the electroplating is completed, the metal mold core 1 is immediately taken out from the electroplating tank and rinsed with running water to remove the electroplating liquid remaining on the surface; S3: packaging photosensitive tape 2; S4: Photolithography of product graphics; S5: Electroplating metal growth is performed in the etched pattern, including the following steps: S501: Preparation before plating: immerse the metal mold 1 with the etched pattern in an ultrasonic cleaning machine filled with acetone for 5-10 minutes at an ultrasonic frequency of 40-60kHz until the oil stains, photoresist residues and other organic pollutants on the surface are removed, and rinse the metal mold 1 with a large amount of deionized water until no organic solvent remains on the surface, and the rinsing time is 3-5 minutes; S502: Acid etching treatment: immerse the metal mold core 1 in a 5%-10% hydrochloric acid solution for 2-3 minutes until the slight oxide layer and metal debris that may exist on the surface are removed, and then rinse thoroughly with deionized water again; S503: Preparation of electroplating solution: the electroplating solution is 150-250g / L copper sulfate, 50-100g / L sulfuric acid, and 20-50g / L chloride ion additive. First, various salts are dissolved in an appropriate amount of deionized water, then fully stirred, and the electroplating solution is filtered to remove suspended impurities; S504: Heating and stirring the plating solution, heating the plating solution to 20-30°C and keeping it stable, turning on the plating solution stirring device until the plating solution forms a moderate convection to ensure uniform distribution of metal ions; S505: The cleaned metal mold 1 with the etched pattern is used as a cathode and firmly connected to the negative pole of the DC power supply through a wire to ensure that the connection point is in good contact. A nickel plate is used as an anode. The shape and size of the anode should be designed according to the conditions of the electroplating tank and the metal mold 1. The anode is installed in the electroplating tank to keep a distance of 10-20 cm from the cathode metal mold 1; S506: Electroplating parameter setting and monitoring, current density setting: current density is controlled at 1-3A / dm²; electroplating time calculation and control: electroplating time is calculated according to the required thickness of the electroplated metal layer and the set current density. The thickness calculation formula is: thickness μm = current density A / dm² × electroplating time h × electrochemical equivalent of electroplated metal g / Ah ÷ density of electroplated metal g / cm³. During the electroplating process, a timer is used to accurately control the electroplating time, and the current size is monitored in real time through a current monitoring device to ensure that it is stable within the set value range; temperature monitoring and adjustment: a high-precision thermometer is used to monitor the temperature of the electroplating solution in real time, and it is linked with the heating and cooling devices to ensure that the temperature fluctuation is controlled within ±1-2℃; S507: electroplating operation, turn on the DC power supply, start electroplating, under the action of the electric field, the metal ions in the electroplating solution move to the metal mold core 1 of the cathode, and obtain electrons in the area of ​​the etched pattern to be reduced to metal atoms, and gradually deposit to form a metal layer. During the electroplating process, the state of the electroplating solution, the bubble generation on the surface of the metal mold core 1, and the stability of the current and temperature are continuously observed. When abnormal phenomena are found, including excessive growth of the local coating, excessive current fluctuations, and temperature out of control, the electroplating is stopped immediately, the cause is checked and adjustments are made; S508: Post-plating treatment, cleaning and deionized water rinsing: After the electroplating is completed, the metal mold core 1 is quickly taken out from the electroplating tank, and first rinsed in running ordinary water for 3-5 minutes until most of the residual electroplating liquid on the surface is removed, and then the metal mold core 1 is transferred to the deionized water rinsing device and rinsed with deionized water for multiple times, each rinsing time is 1-2 minutes, to ensure that there is no electroplating liquid residue on the surface; Drying treatment: Use clean hot air at a temperature of 60-80°C to blow the surface of the metal mold core 1, and the drying time is 10-15 minutes; S6: removing the photosensitive tape 2; S7: electroplating metal film again; S8: Finally, a metal protective layer 5 is plated to form an injection molded product 6.

[0017] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A high-precision microfluidic chip mold, comprising a metal mold core (1), a photosensitive tape (2), a photolithography molding groove (3), a metal (4), and a metal protective layer (5), characterized in that: The metal mold core (1) includes but is not limited to silicon molds, copper molds, aluminum molds, and tungsten molds; the photosensitive tape (2) includes but is not limited to PI heat-resistant film silicone tape, printable photosensitive adhesive, and photosensitive tape for plastic microfluidic chip injection molding; the metal protective layer (5) includes but is not limited to titanium nitride protective layer, aluminum protective layer, tantalum, and tantalum nitride protective layer.

2. A high-precision microfluidic chip mold according to claim 1, characterized in that: The thickness of the metal protective layer (5) is 10-30 nm, the thickness of the metal mold core (1) is 100-500 μm, and the thickness of the photosensitive tape (2) is 50-150 μm.

3. The process for preparing a high-precision microfluidic chip mold according to claim 1, characterized in that: The steps include: S1: Select a suitable metal mold core (1) and clean it; S2: Electroplated metal film as base layer; S3: Packaging photosensitive tape (2); S4: Photolithography of product graphics; S5: growing electroplated metal within the etched pattern; S6: removing the photosensitive tape (2); S7: electroplating metal film again; S8: Finally, a metal protective layer (5) is plated to form an injection molded product (6).

4. The process for preparing a high-precision microfluidic chip mold according to claim 3, characterized in that: The S1 comprises the following steps: S101: Degreasing and cleaning: placing the metal mold core (1) in a degreasing solution at a temperature of 40-62°C for 20 minutes until the grease and dirt on the surface are removed; S102: washing with hot water, washing the metal mold core (1) with hot water to remove residual degreasing liquid; S103: rust removal treatment, using a rust removal liquid to spray and clean the metal mold core (1), with the temperature controlled at 40-50° C., until the rust on the surface is removed; S104: washing with hot water for the second time, washing the metal mold core (1) again with hot water to remove the residual rust removal liquid; S105: Thinning treatment, using an acid solution to spray and clean the metal mold core (1), with the temperature controlled at 42-60°C, for three cycles, with water washing after each rinse until the oxide layer on the surface is completely removed; S106: washing with hot water three times, rinsing the metal mold core (1) with hot water to remove residual acidic liquid; S107： Pickling: soaking the metal mold core (1) in an acidic liquid until impurities and oxides on the surface are removed; S108: Neutralization treatment: soaking the metal mold core (1) in an alkaline solution until the acidic substances on the surface are neutralized; S109: washing with hot water four times, washing the metal mold core (1) with hot water four times to remove residual liquid medicine; S110: Drying treatment, purging, dehydrating and drying the metal mold core (1), with the drying temperature controlled at 180-260°C; S111: Destatic treatment is performed on the dried metal mold core (1) to prevent static electricity from absorbing dust and impurities.

5. The process for preparing a high-precision microfluidic chip mold according to claim 3, characterized in that: The S2 comprises the following steps: S201: preparing the electroplating solution, using copper sulfate electroplating solution, adding sulfuric acid, the concentration of the copper sulfate electroplating solution is 150-250 g / L, and the concentration of sulfuric acid is 50-100 g / L, dissolving the copper sulfate electroplating solution in water, then slowly adding sulfuric acid, stirring evenly, and filtering the prepared electroplating solution using filter paper or a filter; S202: installing electrodes and templates, using the processed metal mold core (1) as a cathode and connecting it to the negative pole of a power source; selecting a copper block as an anode material and connecting the anode to the positive pole of a power source, ensuring that the electrode is firmly connected to the power source, and that the electrode and template are properly positioned in the electroplating tank so that the current is evenly distributed; S203: Set the electroplating parameters, the current density is set between 1-5A / dm²; the electroplating time is calculated by the thickness of the electroplated layer, the thickness of the electroplated layer (μm) = current density (A / dm²) × electroplating time (h) × electrochemical equivalent of the electroplated metal (g / Ah) ÷ density of the electroplated metal (g / cm³); temperature: keep the plating solution temperature generally between 45-60℃; S204: electroplating is started. The power supply is turned on to start electroplating. During the electroplating process, metal ions in the electroplating solution move toward the cathode metal mold core (1) under the action of the electric field, and obtain electrons on the surface of the metal mold core (1) to be reduced to metal atoms, and are deposited on the surface of the metal mold core (1) to form an electroplating layer; S205: Post-plating treatment: After the electroplating is completed, the metal mold core (1) is immediately taken out from the electroplating tank and rinsed with running water to remove the electroplating liquid remaining on the surface.

6. The process for preparing a high-precision microfluidic chip mold according to claim 3, characterized in that: The S5 comprises the following steps: S501: Preparation before plating, immerse the metal mold (1) with the etched pattern in an ultrasonic cleaning machine filled with acetone for 5-10 minutes at an ultrasonic frequency of 40-60kHz until the oil stains, photoresist residues and other organic pollutants on the surface are removed, and rinse the metal mold (1) with a large amount of deionized water until no organic solvent remains on the surface, and rinse for 3-5 minutes; S502: Acid etching treatment: immerse the metal mold core (1) in a 5%-10% hydrochloric acid solution for 2-3 minutes until the slight oxide layer and metal debris that may exist on the surface are removed, and then rinse thoroughly with deionized water again; S503: Preparation of electroplating solution: the electroplating solution is 150-250g / L copper sulfate, 50-100g / L sulfuric acid, and 20-50g / L chloride ion additive. First, various salts are dissolved in an appropriate amount of deionized water, then fully stirred, and the electroplating solution is filtered to remove suspended impurities; S504: Heating and stirring the plating solution, heating the plating solution to 20-30°C and keeping it stable, turning on the plating solution stirring device until the plating solution forms a moderate convection to ensure uniform distribution of metal ions; S505: The cleaned metal mold (1) with the etched pattern is used as a cathode and firmly connected to the negative pole of the DC power supply through a wire to ensure good contact at the connection point. A nickel plate is used as an anode. The shape and size of the anode should be designed according to the conditions of the electroplating tank and the metal mold (1). The anode is installed in the electroplating tank so that it is kept 10-20 cm away from the cathode metal mold (1); S506: Electroplating parameter setting and monitoring, current density setting: current density is controlled at 1-3A / dm²; electroplating time calculation and control: electroplating time is calculated according to the thickness of the required electroplated metal layer and the set current density. The thickness calculation formula is: thickness (μm) = current density (A / dm²) × electroplating time (h) × electrochemical equivalent of electroplated metal (g / Ah) ÷ density of electroplated metal (g / cm³). During the electroplating process, a timer is used to accurately control the electroplating time, and the current size is monitored in real time through a current monitoring device to ensure that it is stable within the set value range; temperature monitoring and adjustment: a high-precision thermometer is used to monitor the temperature of the electroplating solution in real time, and it is linked with the heating and cooling devices to ensure that the temperature fluctuation is controlled within ±1-2℃; S507: electroplating operation, turning on the DC power supply, starting electroplating, under the action of the electric field, the metal ions in the electroplating solution move toward the cathode metal mold (1), and obtain electrons in the area of ​​the etched pattern to be reduced to metal atoms, and gradually deposit to form a metal layer. During the electroplating process, the state of the electroplating solution, the bubble generation on the surface of the metal mold (1), and the stability of the current and temperature are continuously observed. When any abnormal phenomenon is found, including excessive growth of the local coating, excessive current fluctuation, and temperature out of control, the electroplating is stopped immediately, the cause is checked and adjustments are made; S508: Post-plating treatment, cleaning and rinsing with deionized water: After the electroplating is completed, the metal mold (1) is quickly taken out of the electroplating tank and first rinsed in running ordinary water for 3-5 minutes until most of the residual electroplating liquid on the surface is removed. The metal mold (1) is then transferred to a deionized water rinsing device and rinsed with deionized water for multiple times, each rinsing time being 1-2 minutes, to ensure that there is no electroplating liquid residue on the surface; Drying treatment: Use clean hot air at a temperature of 60-80°C to blow the surface of the metal mold (1) for 10-15 minutes.

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