Small-equivalent initiating explosive device safety protection chip and preparation method thereof

Abstract

The invention provides a small-equivalent initiating explosive device safety protection chip and a preparation method thereof, and belongs to the field of initiating explosive device safety protection. The invention aims to solve the problems that the current small-equivalent (less than or equal to 20g) initiating explosive device safety protection product is not ideal in protection effect, heavy, inflexible to move, uncomfortable to wear and the like. The small-equivalent initiating explosive device safety protection chip comprises aramid fiber non-woven cloth, aramid fiber woven cloth and a protection enhanced resin adhesive. The aramid non-woven cloth is arranged on the outer side of the aramid woven cloth; the aramid woven fabric is a close-fitting surface; the protective enhanced resin adhesive is uniformly smeared on the outer layer surfaces of the aramid fiber non-woven cloth and the aramid fiber woven cloth. The chips dissipate impact energy layer by layer in a laminated structure, and the protection effect is excellent; the whole body is soft and comfortable, can be freely bent by 180 degrees, is suitable for free matching and combination of coats of different structures and styles, has few layers and light weight, does not influence normal production activities of wearers, and can be worn for a long time.

Description

Technical Field

[0001] The invention belongs to the field of pyrotechnic safety protection, and in particular relates to a small equivalent pyrotechnic safety protection chip and a preparation method thereof. Background Art

[0002] In recent years, my country's safety management regulations for pyrotechnics have been continuously improved, and higher requirements have been put forward for the safety protection of the production, storage, transportation, and use of pyrotechnics, and the safety protection awareness of operators has also been continuously improved. However, there are still obvious deficiencies in the safety protection products for small equivalent (≤20g) pyrotechnics on the market, such as unsatisfactory protection effects, bulky, inflexible movements, uncomfortable wearing, etc., which are not suitable for operators to wear for a long time and are difficult to meet the growing demand for safe production, which leads to the inability to achieve 100% effective protection for operators in the production process of a series of pyrotechnics such as small equivalent pyrotechnic agents, detonating agents, and explosives.

[0003] As is known to all, safety protection products are composed of a jacket and a protection chip. The jacket mainly plays a role in bearing and beautifying the appearance, while the protection performance and comfort of the protection chip are the main factors that ultimately determine the product's protection effect and wearing comfort. Therefore, in view of the above defects and shortcomings, the present invention provides a small equivalent pyrotechnic safety protection chip and a preparation method thereof. Summary of the invention

[0004] The purpose of the present invention is to solve the problems of current small equivalent (≤20g) pyrotechnic safety protection products, such as unsatisfactory protection effect, bulkiness, inflexibility and discomfort in wearing.

[0005] The present invention is realized through the following technical solutions:

[0006] A small equivalent pyrotechnic safety protection chip includes aramid weftless fabric, aramid woven fabric, and protection-enhanced resin adhesive. The aramid weftless fabric is on the outside of the aramid woven fabric; the aramid woven fabric is a close-fitting surface; and the protection-enhanced resin adhesive is evenly applied on the outer surface of the aramid weftless fabric and the aramid woven fabric.

[0007] The aramid non-woven fabric of the present invention has 1 to 3 layers, and the aramid woven fabric has 3 to 5 layers;

[0008] Preferably, the aramid non-woven fabric has a surface density of 170 to 180 g / m 2 The aramid woven fabric has a surface density of 150 to 160 g / m 2 .

[0009] A method for preparing a small equivalent pyrotechnic safety protection chip is as follows:

[0010] Step 1: prepare a protective enhanced resin adhesive and evenly apply it on the outer surface of the aramid non-woven fabric and the aramid woven fabric. After drying at room temperature for 5 to 8 hours, a protective enhanced resin adhesive layer is formed. Then, the aramid non-woven fabric and the aramid woven fabric are cut into protective chip patterns.

[0011] The thickness of the protective enhanced resin adhesive layer is 1 to 2 mm.

[0012] Step 2: stack the aramid non-woven fabric and aramid woven fabric cut in step 1 in the order of aramid non-woven fabric on the outside and aramid woven fabric on the inside, with the inner aramid woven fabric as the skin-friendly surface, and then use black heat-sealing cloth to heat-seal, so as to obtain a small equivalent pyrotechnic safety protection chip.

[0013] The preparation method of the protective enhanced resin adhesive is as follows: polyacrylate, trimethylolpropane, nano silicon carbide ceramic powder, titanate coupling agent TMC-201, and triisooctanoic acid glycerol are weighed respectively according to the mass volume ratio of 20g: 8-10g: 0.5-1g: 0.2-0.3g: 5-10ml. Polyacrylate, trimethylolpropane, titanate coupling agent TMC-201, and triisooctanoic acid glycerol are mixed, and mechanical stirring is used at a speed of 300-600r / min, and a precursor solution A is obtained after 10-20min. Then, the nano silicon carbide ceramic powder is added to the precursor solution A, and mechanical stirring is continued at a speed of 700-1000r / min, and the protective enhanced resin adhesive is obtained after 30-50min.

[0014] Wherein, the particle size distribution of the nano silicon carbide ceramic powder is 30-50 nm.

[0015] Beneficial Effects

[0016] 1. The invention provides a small equivalent pyrotechnic safety protection chip. By designing a protection-enhanced resin adhesive formula, the adhesive has good compatibility with aramid flat cloth and aramid woven cloth, and has excellent interface bonding performance. At the same time, the protection performance is enhanced by adding nano silicon carbide ceramic powder, and the impact energy is dissipated layer by layer in a laminated structure, so the protection effect is excellent.

[0017] 2. The invention provides a small equivalent pyrotechnics safety protection chip, which is soft and comfortable, can be bent freely at 180°, has few overall layers, is light in weight, does not affect the normal production activities of the wearer, and can be worn for a long time;

[0018] 3. The small equivalent pyrotechnics safety protection chip provided by the present invention can be freely matched and combined with jackets of different structures and styles;

[0019] 4. The present invention provides a small equivalent pyrotechnic safety protection chip with a simple chip structure, easily available protection-enhanced resin adhesive components, convenient preparation method, low cost, and no "three wastes" are generated during the production and preparation process, which meets the requirements of green development. DETAILED DESCRIPTION

[0020] The following embodiments are further explanations of the present invention, which are partial embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without any creative work belong to the scope of protection of the present invention.

[0021] Example 1

[0022] 1700g polyacrylate, 725.43g trimethylolpropane, 19.53g titanate coupling agent TMC-201, and 580ml triethylhexanoin were mixed and mechanically stirred at a speed of 350r / min for 14 minutes to obtain precursor solution A. Then 56.72g nano silicon carbide ceramic powder was added to precursor solution A and mechanical stirring was continued at a speed of 900r / min. After 43 minutes, a protective enhanced resin adhesive was obtained.

[0023] The protective enhanced resin adhesive is evenly applied on the outer surface of the aramid non-woven fabric and the aramid woven fabric, and dried at room temperature for 5.6 hours to form a 1.3 mm protective enhanced resin adhesive layer. The aramid non-woven fabric and the aramid woven fabric are then cut into protective chip patterns. The cut 2 layers of aramid non-woven fabric and 4 layers of aramid woven fabric are then stacked in the order of aramid non-woven fabric on the outside and aramid woven fabric on the inside, with the inner aramid woven fabric as the close-fitting surface. Black heat-sealing cloth is then used for heat sealing to obtain a small-equivalent pyrotechnic safety protection chip.

[0024] Example 2

[0025] 4800g polyacrylate, 2268.61g trimethylolpropane, 56.34g titanate coupling agent TMC-201, and 1800ml triethylhexanoin were mixed and mechanically stirred at a speed of 560r / min. After 18min, a precursor solution A was obtained. Then 187.58g nano silicon carbide ceramic powder was added to the precursor solution A and mechanical stirring was continued at a speed of 750r / min. After 38min, a protective enhanced resin adhesive was obtained.

[0026] The protective enhanced resin adhesive is evenly applied on the outer surface of the aramid non-woven fabric and the aramid woven fabric, and dried at room temperature for 7.2 hours to form a 1.2 mm protective enhanced resin adhesive layer. The aramid non-woven fabric and the aramid woven fabric are then cut into protective chip patterns. The cut 2 layers of aramid non-woven fabric and 5 layers of aramid woven fabric are then stacked in the order of aramid non-woven fabric on the outside and aramid woven fabric on the inside, with the inner aramid woven fabric as the close-fitting surface. Black heat-sealing cloth is then used for heat sealing to obtain a small-equivalent pyrotechnic safety protection chip.

[0027] Example 3

[0028] 2600g polyacrylate, 1168.63g trimethylolpropane, 33.27g titanate coupling agent TMC-201, and 960ml triethylhexanoin were mixed and mechanically stirred at a speed of 430r / min. After 15min, a precursor solution A was obtained. Then 78.26g nano silicon carbide ceramic powder was added to the precursor solution A and mechanical stirring was continued at a speed of 800r / min. After 45min, a protective enhanced resin adhesive was obtained.

[0029] The protective enhanced resin adhesive is evenly applied on the outer surface of the aramid non-woven fabric and the aramid woven fabric, and dried at room temperature for 6.3 hours to form a 1.4 mm protective enhanced resin adhesive layer. The aramid non-woven fabric and the aramid woven fabric are then cut into protective chip patterns. The three layers of cut aramid non-woven fabric and the three layers of aramid woven fabric are then stacked in the order of the aramid non-woven fabric on the outside and the aramid woven fabric on the inside, with the inner aramid woven fabric as the close-fitting surface. Black heat-sealing cloth is then used for heat sealing to obtain a small-equivalent pyrotechnic safety protection chip.

[0030] Example 4

[0031] 3400g polyacrylate, 1560.89g trimethylolpropane, 43.26g titanate coupling agent TMC-201, and 1400ml triethylhexanoin were mixed and mechanically stirred at a speed of 400r / min for 12 minutes to obtain precursor solution A. Then 136.25g nano silicon carbide ceramic powder was added to precursor solution A and mechanical stirring was continued at a speed of 950r / min. After 40 minutes, a protective enhanced resin adhesive was obtained.

[0032] The protective enhanced resin adhesive is evenly applied on the outer surface of the aramid non-woven fabric and the aramid woven fabric, and dried at room temperature for 6.8 hours to form a 1.8 mm protective enhanced resin adhesive layer. The aramid non-woven fabric and the aramid woven fabric are then cut into protective chip patterns. The cut 3 layers of aramid non-woven fabric and 5 layers of aramid woven fabric are then stacked in the order of aramid non-woven fabric on the outside and aramid woven fabric on the inside, with the inner aramid woven fabric as the close-fitting surface. Black heat-sealing cloth is then used for heat sealing to obtain a small-equivalent pyrotechnic safety protection chip.

[0033] Example 5

[0034] 6200g polyacrylate, 2895.63g trimethylolpropane, 73.23g titanate coupling agent TMC-201, and 2600ml triethylhexanoin were mixed and mechanically stirred at a speed of 450r / min for 16 minutes to obtain precursor solution A. Then 286.58g nano silicon carbide ceramic powder was added to precursor solution A and mechanical stirring was continued at a speed of 850r / min. After 35 minutes, a protective enhanced resin adhesive was obtained.

[0035] The protective enhanced resin adhesive is evenly applied on the outer surface of the aramid non-woven fabric and the aramid woven fabric, and dried at room temperature for 5.7 hours to form a 1.6 mm protective enhanced resin adhesive layer. The aramid non-woven fabric and the aramid woven fabric are then cut into protective chip patterns. The cut 1 layer of aramid non-woven fabric and 3 layers of aramid woven fabric are then stacked in the order of aramid non-woven fabric on the outside and aramid woven fabric on the inside, with the inner aramid woven fabric as the close-fitting surface. Black heat-sealing cloth is then used for heat sealing to obtain a small-equivalent pyrotechnic safety protection chip.

[0036] Effect verification

[0037] The small equivalent pyrotechnics safety protection chips obtained in Example 1, Example 2, Example 3, Example 4 and Example 5 were tested for their 1.1g fragmentation resistance according to GJB 4300-2012 "Technical Performance Requirements for Safety of Military Bulletproof Vests". 50 The value is ≥90.2m / s, with excellent protection performance; the small equivalent pyrotechnics safety protection chip can be freely bent 180°, soft and comfortable, meeting the safety protection requirements of small equivalent pyrotechnics operation sites.

Claims

1. A small equivalent pyrotechnic safety protection chip, characterized in that: A small equivalent pyrotechnic safety protection chip includes aramid non-woven fabric, aramid woven fabric, and protective enhanced resin adhesive. The aramid non-woven fabric is on the outside of the aramid woven fabric; the aramid woven fabric is the skin-friendly surface; the protective enhanced resin adhesive is evenly applied to the outer surface of the aramid non-woven fabric and the aramid woven fabric. The aramid non-woven fabric is 1 to 3 layers, and the aramid woven fabric is 3 to 5 layers; preferably, the surface density of the aramid non-woven fabric is 170 to 180 g / m 2 The aramid woven fabric has a surface density of 150 to 160 g / m 2 .

2. A small equivalent explosive device safety protection chip as claimed in claim 1, characterized in that: A method for preparing a small equivalent pyrotechnic safety protection chip is as follows: Step 1: prepare a protective enhanced resin adhesive and evenly apply it on the outer surface of the aramid non-woven fabric and the aramid woven fabric. After drying at room temperature for 5 to 8 hours, a protective enhanced resin adhesive layer is formed. Then, the aramid non-woven fabric and the aramid woven fabric are cut into protective chip patterns. The thickness of the protective enhanced resin adhesive layer is 1 to 2 mm. Step 2: stack the aramid non-woven fabric and aramid woven fabric cut in step 1 in the order of aramid non-woven fabric on the outside and aramid woven fabric on the inside, with the inner aramid woven fabric as the skin-friendly surface, and then use black heat-sealing cloth to heat-seal, so as to obtain a small equivalent pyrotechnic safety protection chip.

3. A small equivalent explosive device safety protection chip as claimed in claim 2, characterized in that: The preparation method of the protective enhanced resin adhesive is as follows: polyacrylate, trimethylolpropane, nano silicon carbide ceramic powder, titanate coupling agent TMC-201, and triisooctanoic acid glycerol are weighed respectively according to the mass volume ratio of 20g: 8-10g: 0.5-1g: 0.2-0.3g: 5-10ml. Polyacrylate, trimethylolpropane, titanate coupling agent TMC-201, and triisooctanoic acid glycerol are mixed, and mechanical stirring is used at a speed of 300-600r / min, and a precursor solution A is obtained after 10-20min. Then, the nano silicon carbide ceramic powder is added to the precursor solution A, and mechanical stirring is continued at a speed of 700-1000r / min, and the protective enhanced resin adhesive is obtained after 30-50min. Wherein, the particle size distribution of the nano silicon carbide ceramic powder is 30-50 nm.