Source bottle heating device for atomic layer deposition equipment

Abstract

The invention belongs to the technical field of precursor source bottle heating, and relates to a source bottle heating device for atomic layer deposition equipment, comprising: a housing assembly for loading a source bottle; a closed space is arranged in the shell assembly, and the closed space is used for loading the source bottle; the heating assembly is used for heating the source bottle; the heating assembly is arranged in the closed space and at least partially wraps the source bottle; the heating assembly at least partially extends out of the shell assembly. According to the source bottle heating device for the atomic layer deposition equipment, a precursor can be evenly heated, and the source bottle heating device has the excellent characteristics of being high in temperature control precision, easy to disassemble, good in heat preservation performance and good in durability.

Description

Technical Field

[0001] The invention relates to the technical field of precursor source bottle heating, and in particular to a source bottle heating device for atomic layer deposition equipment. Background Art

[0002] Atomic layer deposition (ALD) is a special chemical vapor deposition technology that forms thin films in the form of single atomic layers by alternately passing gaseous precursors into the reaction chamber in pulses and causing chemical adsorption reactions on the surface of the deposited material. The heating uniformity and temperature control accuracy of the precursor source bottle heating device will affect the stability of the gaseous precursor pulses, and thus affect the thickness control accuracy of the film in the atomic layer deposition technology.

[0003] Generally, traditional source bottle heating devices use alkali-free glass fiber as insulating material. Cr20Ni80 alloy wire is first made into an insulating heating rope, and then a flexible heating sleeve is made by knitting. However, this heating device has many disadvantages, such as poor adhesion to the heated source bottle, resulting in poor thermal uniformity of the source bottle, low temperature control accuracy, poor thermal insulation performance, and repeated disassembly will cause internal glass fiber leakage, posing a safety hazard. Summary of the invention

[0004] In view of this, the present invention provides a source bottle heating device for atomic layer deposition equipment.

[0005] Specifically, the present invention is achieved through the following technical solutions:

[0006] According to a first aspect of the present invention, there is provided a source bottle heating device for an atomic layer deposition device, comprising:

[0007] A shell component, used for loading the source bottle; a closed space is provided inside the shell component, and the closed space is used for loading the source bottle;

[0008] A heating component is used to heat the source bottle; the heating component is arranged in the enclosed space and at least partially wraps the source bottle; the heating component at least partially extends out of the shell component.

[0009] Optionally, the shell component includes: a thermal insulation sleeve, the internal cavity of the thermal insulation sleeve at least partially forms the enclosed space, the heating component is arranged in the thermal insulation sleeve, and the heating component at least partially extends out of the thermal insulation sleeve.

[0010] Optionally, the shell assembly further includes: a cover plate, the cover plate is tightly connected to the opening of the thermal insulation sleeve, and the thermal insulation sleeve and the cover plate together form the enclosed space.

[0011] Optionally, the thermal insulation sleeve is provided with a through hole for allowing the heating component to at least partially extend out.

[0012] Optionally, a through hole is provided on the cover plate.

[0013] Optionally, the heating component includes: a heating wire, a heat-conducting medium and a thermocouple, wherein the heat-conducting medium is arranged in a circular ring shape, the internal cavity of the heat-conducting medium is used to support the source bottle, the heating wire is arranged around the outer wall of the heat-conducting medium, the first end of the thermocouple is arranged on the outer wall of the heat-conducting medium and connected to the heating wire, and the second end of the thermocouple extends out of the through hole of the thermal insulation sleeve in the outer shell component.

[0014] Optionally, a thread groove is provided on the outer wall of the heat conducting medium, and the heating wire is arranged in the thread groove.

[0015] Optionally, a mounting groove is provided on the bottom wall of the heat-conducting medium, and the thermocouple is arranged in the mounting groove.

[0016] Optionally, the heating component further includes: a fixing plate, the fixing plate is arranged on the bottom wall of the heat-conducting medium, and the first end of the thermocouple is arranged on the fixing plate.

[0017] Optionally, a fixing groove is provided on the bottom wall of the heat conducting medium, and the fixing plate is buried in the fixing groove.

[0018] The technical solution provided by the present invention brings at least the following beneficial effects:

[0019] The source bottle heating device for atomic layer deposition equipment provided in the present application can heat the precursor evenly and has the excellent characteristics of high temperature control accuracy, easy disassembly, good thermal insulation performance and good durability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0022] Figure 1 A schematic structural diagram of a source bottle heating device for an atomic layer deposition device provided by an embodiment of the present invention;

[0023] Figure 2A cross-sectional view of a source bottle heating device for an atomic layer deposition device provided in an embodiment of the present invention;

[0024] Figure 3 A schematic structural diagram of a heating component in a source bottle heating device for atomic layer deposition equipment provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] Figure 1 A source bottle heating device for an atomic layer deposition device applicable to an embodiment of the present invention is schematically shown.

[0027] Reference Figure 1-3 As shown, the present application provides a source bottle heating device for an atomic layer deposition device, comprising:

[0028] A housing component, used for loading the source bottle; a closed space is provided in the housing component, and the closed space is used for loading the source bottle 100;

[0029] The heating component 101 is used to heat the source bottle; the heating component 101 is arranged in the enclosed space and at least partially wraps the source bottle; the heating component 101 at least partially extends out of the shell component.

[0030] In the embodiment of the present application, the housing assembly is used to provide a closed space for the heating assembly 101 and the source bottle 100. The heating assembly 101 is connected to an external power source and generates heat by itself, and the heat is used to heat the source bottle 100. The device is intended to optimize the heating process of the source bottle. The following is a detailed description of the device and its features:

[0031] Housing assembly: used to load the source bottle and provide it with a closed space. Closed space: ensures that the heating process is carried out in a closed environment, which helps to maintain temperature stability and safety.

[0032] Heating assembly 101: used to heat the source bottle to ensure that the source bottle reaches the required temperature during the atomic layer deposition process. Layout: The heating assembly is arranged in a closed space and at least partially wraps the source bottle to maximize the heat transfer efficiency. External connection: The heating assembly at least partially extends out of the housing assembly so as to be powered by an external power source.

[0033] Compared with the traditional source bottle heating device, the design provided in this application has the following significant advantages:

[0034] Improved thermal uniformity: By optimizing the fit between the heating component and the source bottle, this device can significantly improve the thermal uniformity of the source bottle, thereby ensuring the stability and consistency of the deposition process. Improved temperature control accuracy: The improved design of the heating component helps to more accurately control the temperature of the source bottle, which is critical for a temperature-sensitive process such as atomic layer deposition. Enhanced thermal insulation performance: The sealed shell assembly and optimized heating component together improve the thermal insulation performance of the device, reduce energy loss, and improve energy efficiency. Enhanced safety: The safety hazard of glass fiber leakage in traditional heating devices is avoided, and the safety and reliability of the heating process are ensured through more advanced materials and structural design.

[0035] Exemplarily, the shell component includes: a thermal insulation sleeve 102, the internal cavity of the thermal insulation sleeve 102 at least partially forms the enclosed space, the heating component 101 is arranged in the thermal insulation sleeve 102, and the heating component 101 at least partially extends out of the thermal insulation sleeve 102.

[0036] In the embodiment of the present application, the thermal insulation sleeve 102 can reduce the proportion of heat generated by the heating component 101 that is leaked, and can be used to support the heating component 101 and the source bottle 100.

[0037] Exemplarily, the housing assembly further includes: a cover plate 204 , wherein the cover plate 204 is tightly connected to the opening of the thermal insulation sleeve 102 , and the thermal insulation sleeve 102 and the cover plate 204 together form the enclosed space.

[0038] In the embodiment of the present application, the cover plate 204 is covered at the opening of the thermal insulation sleeve 102 , and the thermal insulation sleeve 102 and the cover plate 204 together form a closed space therebetween.

[0039] Exemplarily, the thermal insulation sleeve 102 is provided with a through hole for allowing the heating component 101 to at least partially extend out.

[0040] In the embodiment of the present application, a portion of the structure of the heating component 101 is connected to an external power source via a through hole.

[0041] Exemplarily, the cover plate 204 is provided with a through hole.

[0042] In the embodiment of the present application, the through hole is used to allow a part of the structure of the source bottle 100 to pass through.

[0043] Exemplarily, the heating component 101 includes: a heating wire 200, a heat-conducting medium 201 and a thermocouple 202, wherein the heat-conducting medium 201 is arranged in a circular ring shape, the internal cavity of the heat-conducting medium 201 is used to support the source bottle, the heating wire 200 is arranged around the outer wall of the heat-conducting medium 201, the first end of the thermocouple 202 is arranged on the outer wall of the heat-conducting medium 201 and is connected to the heating wire 200, and the second end of the thermocouple 202 extends out of the through hole of the thermal insulation sleeve 102 in the outer shell component.

[0044] In the embodiment of the present application, the thermocouple 202 is connected to an external power supply, and the power supply transmits electrical energy to the heating wire 200. The heating wire 200 generates heat, and the heat is transferred to the heat-conducting medium 201. The heat-conducting medium 201 directly contacts the source bottle 100, and the heat is directly transferred to the source bottle 100.

[0045] Exemplarily, a thread groove is provided on the outer wall of the heat conducting medium 201 , and the heating wire 200 is arranged in the thread groove.

[0046] In the embodiment of the present application, the thread groove is spirally arranged on the outer wall of the heat-conducting medium 201 , and the heating wire 200 is arranged along the thread groove, which can evenly transfer heat to the heat-conducting medium 201 .

[0047] Exemplarily, a mounting groove is provided on the bottom wall of the heat conducting medium 201 , and the thermocouple 202 is disposed in the mounting groove.

[0048] In the embodiment of the present application, the mounting groove is used to install and fix the thermocouple 202 .

[0049] Exemplarily, the heating component 101 further includes: a fixing plate 203 , wherein the fixing plate 203 is disposed on the bottom wall of the heat-conducting medium 201 , and the first end of the thermocouple 202 is disposed on the fixing plate 203 .

[0050] In the embodiment of the present application, the fixing plate 203 and the bottom wall of the heat-conducting medium 201 jointly clamp the first end of the thermocouple 202 to prevent the first end of the thermocouple 202 from shaking.

[0051] Exemplarily, a fixing groove is provided on the bottom wall of the heat conducting medium 201 , and the fixing plate 203 is buried in the fixing groove.

[0052] In the embodiment of the present application, the fixing plate 203 and the fixing groove have the same size, and the fixing plate 203 is completely embedded in the fixing groove.

[0053] In this embodiment, the heating wire 200 and the thermocouple 202 are embedded in the heat-conducting medium 201 to uniformly heat and precisely control the temperature of the precursor source bottle. The fixing plate 203 fixes the thermocouple 202 and is located at the bottom of the heat-conducting medium 201. The cover plate 204 is placed above the precursor source bottle 100 and is in direct contact with the precursor source bottle. The precursor source bottle 100 is in direct contact with the heat-conducting medium 201. In addition, the heating wire 200 is embedded in the heat-conducting medium 201, and the thermocouple 202 is fixed to the bottom of the heat-conducting medium 201 by the fixing plate 203 and screws, which ensures the integrity of the heat-conducting medium 201 and the uniformity of heating, while meeting the requirements of easy disassembly and replacement, thereby reducing maintenance costs.

[0054] In this embodiment, the thermal insulation sleeve 102 is made of thermal conductive fiber and tightly covers the heating component 101 through Velcro, thereby playing the role of internal insulation, preventing the outer temperature of the source bottle body from being too high, and preventing burns.

[0055] In this embodiment, the heat conducting medium 201 and the cover plate 204 are both made of aluminum alloy material, which is processed by CNC cutting, and the surface is anodized and polished.

[0056] In this embodiment, the heating wire 200 is made of Cr20Ni80 alloy wire, has a length of 2-3 meters, a diameter of 8-10 mm, is wound 9-10 times, and is embedded on the outside of the heat-conducting medium 201 , in direct contact with the heat-conducting medium 201 .

[0057] In this embodiment, the heating wire 200 and the thermocouple 202 are temperature controlled by PID technology. The heating wire can be heated to 300°C, the heating control accuracy is ±1°C, and the heating time is less than 10 minutes.

[0058] In this embodiment, the thermocouple 202 is located at the bottom center of the heat conducting medium 201 and is fixed by a fixing plate and M5 screws.

[0059] In this embodiment, the thermocouple 202 is a K-type thermocouple with a temperature measurement range of -10°C-500°C, which is used to monitor the temperature of the precursor source bottle in real time, thereby performing temperature feedback and adjusting the temperature of the heating rod in real time to achieve precise temperature control.

[0060] During operation, the precursor source bottle 100 is installed inside the heating component 101, and the heat-insulating sleeve 102 is fixed outside the heating component 101. The heating component 101 heats the precursor source bottle 100 at a constant and uniform high temperature, and the heat-insulating sleeve 102 is wrapped around the outside of the heating component 101, which plays the role of internal heat preservation and external scalding protection. The temperature generated by the heating wire 200 is evenly conducted to the precursor source bottle through the heat-conducting medium 201.

[0061] The following is a more detailed description and analysis of the source bottle heating device of the atomic layer deposition equipment:

[0062] 1. Shell components

[0063] Thermal insulation sleeve 102: As the main part of the housing assembly, the internal cavity of the thermal insulation sleeve 102 at least partially forms a closed space for loading the heating assembly 101 and the source bottle 100. The thermal insulation sleeve 102 is made of high-efficiency thermal insulation material to reduce the proportion of heat generated by the heating assembly 101 that leaks out, thereby improving energy utilization efficiency. Structure: The thermal insulation sleeve 102 is provided with perforations for the heating assembly 101 (especially the connection part of the heating wire 200 and the thermocouple 202) to at least partially extend out so as to be connected to an external power source.

[0064] Cover plate 204: The cover plate 204 is tightly connected to the opening of the heat-insulating sleeve 102 to form a closed space to ensure the stability and safety of the heating process. Structure: The cover plate 204 is provided with a through hole for a part of the structure of the source bottle 100 (such as the bottleneck or the connecting part) to pass through so as to fix the source bottle 100 on the heating assembly 101.

[0065] 2. Heating Components 101

[0066] Heating wire 200: The heating wire 200 is the main element for generating heat, and generates heat after being powered by an external power source. Layout: The heating wire 200 is wound around the outer wall of the heat-conducting medium 201, and is particularly arranged in the threaded groove of the outer wall of the heat-conducting medium 201 to ensure that heat can be evenly transferred to the heat-conducting medium 201.

[0067] Heat-conducting medium 201: The heat-conducting medium 201 is arranged in a circular ring shape, and its internal cavity is used to carry the source bottle 100. The heat-conducting medium 201 directly contacts the source bottle 100 and transfers the heat generated by the heating wire 200 to the source bottle 100. Structure: The outer wall of the heat-conducting medium 201 is provided with a threaded groove for accommodating the heating wire 200; the bottom wall is provided with an installation groove and a fixing groove for installing and fixing the thermocouple 202 and the fixing plate 203, respectively.

[0068] Thermocouple 202: Thermocouple 202 is used to monitor the temperature of the heat-conducting medium 201 (indirectly monitor the source bottle 100) and feed back the temperature signal to the control system to achieve precise temperature control. Layout: The first end of the thermocouple 202 is set on the outer wall of the heat-conducting medium 201 (fixed by the fixing plate 203) and connected to the heating wire 200; the second end extends out of the through hole of the heat-insulating sleeve 102 and is connected to the external power supply and control system.

[0069] Fixed plate 203: The fixed plate 203 is disposed on the bottom wall of the heat-conducting medium 201, and clamps the first end of the thermocouple 202 together with the bottom wall of the heat-conducting medium 201 to prevent the first end of the thermocouple 202 from shaking, thereby ensuring the accuracy of the measurement. Structure: The fixed plate 203 is buried in the fixing groove on the bottom wall of the heat-conducting medium 201 to achieve a stable fixation.

[0070] 3. Technical advantages

[0071] Efficient heating: The heating wire 200 is wound in the thread groove of the heat-conducting medium 201, ensuring uniform heat transfer and improving heating efficiency. Accurate temperature control: The thermocouple 202 monitors the temperature of the heat-conducting medium 201 in real time and feeds back to the control system, realizing accurate control of the temperature of the source bottle 100. Excellent thermal insulation performance: The thermal insulation sleeve 102 is made of high-efficiency thermal insulation material, which reduces the proportion of heat leakage and improves energy utilization efficiency. Compact structure: The entire heating device has a compact structure, is easy to install and maintain, and ensures the stability and safety of the heating process.

[0072] In summary, the source bottle heating device of the atomic layer deposition equipment has significant advantages in both structural design and functional realization, and provides an efficient, stable and safe heating solution for the atomic layer deposition process. The source bottle heating device for atomic layer deposition equipment provided in this application can heat the precursor evenly, and has the excellent characteristics of high temperature control accuracy, easy disassembly, good thermal insulation performance and good durability.

[0073] It should be noted that, in the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0074] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0075] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0076] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0077] The foregoing is merely a specific embodiment of the present invention, which enables those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A source bottle heating device for atomic layer deposition equipment, characterized in that: include: A shell component, used for loading the source bottle; a closed space is provided inside the shell component, and the closed space is used for loading the source bottle; A heating component is used to heat the source bottle; the heating component is arranged in the enclosed space and at least partially wraps the source bottle; the heating component at least partially extends out of the shell component.

2. The source bottle heating device for atomic layer deposition equipment according to claim 1, characterized in that: The shell component includes: a thermal insulation sleeve, the inner cavity of the thermal insulation sleeve at least partially forms the enclosed space, the heating component is arranged in the thermal insulation sleeve, and the heating component at least partially extends out of the thermal insulation sleeve.

3. The source bottle heating device for atomic layer deposition equipment according to claim 2, characterized in that: The shell component also includes a cover plate, which is tightly connected to the opening of the thermal insulation sleeve, and the thermal insulation sleeve and the cover plate together form the enclosed space.

4. The source bottle heating device for atomic layer deposition equipment according to claim 2, characterized in that: The thermal insulation sleeve is provided with a through hole for allowing the heating component to at least partially extend out.

5. The source bottle heating device for atomic layer deposition equipment according to claim 3, characterized in that: The cover plate is provided with a through hole.

6. The source bottle heating device for atomic layer deposition equipment according to claim 1, characterized in that: The heating component includes: a heating wire, a heat-conducting medium and a thermocouple, wherein the heat-conducting medium is arranged in a circular ring shape, the internal cavity of the heat-conducting medium is used to support the source bottle, the heating wire is arranged to be wrapped around the outer wall of the heat-conducting medium, the first end of the thermocouple is arranged on the outer wall of the heat-conducting medium and connected to the heating wire, and the second end of the thermocouple extends out of the through hole of the thermal insulation sleeve in the outer shell component.

7. The source bottle heating device for atomic layer deposition equipment according to claim 6, characterized in that: A thread groove is arranged on the outer wall of the heat conducting medium, and the heating wire is arranged in the thread groove.

8. The source bottle heating device for atomic layer deposition equipment according to claim 6, characterized in that: A mounting groove is arranged on the bottom wall of the heat-conducting medium, and the thermocouple is arranged in the mounting groove.

9. The source bottle heating device for atomic layer deposition equipment according to claim 6, characterized in that: The heating component further includes: a fixing plate, the fixing plate is arranged on the bottom wall of the heat-conducting medium, and the first end of the thermocouple is arranged on the fixing plate.

10. The source bottle heating device for atomic layer deposition equipment according to claim 9, characterized in that: A fixing groove is arranged on the bottom wall of the heat conducting medium, and the fixing plate is buried in the fixing groove.

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