Monolithic integrated single-axis silicon micromechanical disc gyroscope and processing method

Abstract

The invention discloses a monolithic integrated uniaxial silicon micromechanical disc gyroscope which sequentially comprises a disc structure resonator, a silicon electrode layer, a glass substrate and an external electrode from top to bottom, and the glass substrate and the silicon electrode layer are bonded through an anode; the disc-type structure resonator comprises a disc center mass block structure, a multi-dimensional concentric annulus structure, an anchor point structure, a multi-dimensional spring-damping structure and a peripheral electrode structure, the center of the disc-type structure resonator is the fixed disc mass block structure, the disc mass block structure is fixed through anchor points, the multi-dimensional concentric annulus structure and the multi-dimensional spring-damping structure are distributed on the periphery of the disc-type structure resonator, and the multi-dimensional concentric annulus structure and the multi-dimensional spring-damping structure are distributed on the periphery of the disc-type structure resonator. The multi-dimensional spring-damping structure is distributed on the periphery of the disc center mass block structure. The silicon electrode layer is used for connecting the disc-type structure resonator and an external electrode, and conducting the change of an electric signal generated by the disc-type structure resonator to the external electrode so as to be detected by a discrete external circuit; and the glass substrate is supported by an integral structure. The problems that a traditional gyroscope is large in size, large in weight and not high in precision are solved.

Description

Technical Field

[0001] The invention belongs to the field of micro-electromechanical and inertial navigation, and in particular relates to a monolithically integrated single-axis silicon micro-mechanical disc gyroscope. Background Art

[0002] Micro-electromechanical (MEMS) gyroscope is a key device for measuring the angular velocity of an object, which is manufactured using MEMS processing technology. Compared with traditional inertial devices, it has the characteristics of small size, low power consumption, low cost, and easy mass production. It is particularly suitable for application fields with large demand and low cost. Therefore, it has been highly valued by various countries in the past few decades. Emerging application fields such as individual navigation, tactical weapons, small unmanned combat aircraft, heading and attitude systems, micro-nano satellites, satellite navigation, intelligent robots, and internal loop stabilization of large aircraft are in urgent need of small-sized, low-power, and low-cost high-performance gyroscopes. Therefore, researching and developing high-performance MEMS gyroscopes to meet the urgent needs of developing industrial equipment and national defense forces is of great significance and application value. Silicon micromechanical gyroscopes have outstanding characteristics such as small size, low power consumption, long life, and low cost. At present, they have been widely used in industrial fields such as mobile carriers, automobiles, and drones.

[0003] Compared with the traditional concentrated mass gyroscope, the Coriolis force vibration gyroscope represented by the disk topology structure is becoming one of the mainstream technical solutions in this field. Its flat and compact axisymmetric structure is suitable for the current MEMS silicon processing technology, which is conducive to the batch processing of MEMS gyroscopes. It is also easy to achieve modal matching and improve the sensitivity and signal-to-noise ratio of the gyroscope. Therefore, the disk silicon micromechanical gyroscope is considered to be one of the gyroscope types with the most high-performance application potential. Summary of the invention

[0004] The object of the present invention is to provide a monolithically integrated single-axis silicon micromechanical disc gyroscope to solve the problems of large size, heavy weight and low precision of traditional gyroscopes.

[0005] In order to solve the above problems, the present invention discloses a monolithically integrated single-axis silicon micromechanical disk gyroscope, which includes a disk structure resonator, a silicon electrode layer, a glass substrate and an external electrode from top to bottom, and the glass substrate and the silicon electrode layer are bonded by an anodic bonding;

[0006] The disk-type structure resonator mainly comprises a disk center mass block structure, a multi-dimensional concentric ring structure, an anchor point structure, a multi-dimensional "spring-damper" structure, and a peripheral electrode structure. The center is a fixed disk center mass block structure, which is fixed by an anchor structure, and the periphery is distributed with multi-dimensional concentric ring structures and multi-dimensional "spring-damping" structures. In order to improve the detection accuracy, the diameter of the multi-dimensional ring structure gradually increases from the inside to the outside, so that the mass of the ring gradually increases, ensuring the overall total detection quality and effectively improving the detection accuracy; the multi-dimensional "spring-damping" structure is also distributed on the periphery of the mass block, consisting of a total of 16 groups of multi-dimensional "spring-damping" structures, which are distributed at angles of 0°, 22.5°, 45°, 67.5°, 90°, 112.5°, 135°, 157.5°, 180°, 202.5°, 225°, 247.5°, 270°, 292.5°, 315°, and 337.5° with the x-axis respectively;

[0007] The silicon electrode layer is located directly below the disk-type structure resonator. The silicon electrode layer is mainly used to connect the disk-type structure resonator and the external electrode, and can transmit the electrical signal changes generated by the disk-type structure resonator to the external electrode, and then be detected by a discrete external circuit;

[0008] The glass substrate is located underneath the entire structure and mainly supports the silicon electrode layer and the disk-type structure resonator.

[0009] The present invention also provides a working principle of a single-axis silicon micromechanical disc gyroscope integrated with the above-mentioned monolithic chip, and the working principle is:

[0010] When the monolithically integrated single-axis silicon micromechanical disc gyroscope is in normal working condition, its overall structure can be equivalent to two spring-mass-damper systems, one along the driving axis x and the other along the detection axis y, with the Z axis being its sensitive axis. When this second-order system is in working condition, the driving mode drives the Coriolis mass block to vibrate linearly along the driving axis under the action of the driving force. When there is an angular velocity Ω input around the Z axis, according to the Coriolis theorem, the Coriolis mass block will be subjected to the Coriolis force along the y direction, which will drive the Coriolis mass block to move along the y direction. According to Newton's second law. The product of the acceleration of the mass block and its mass is the sum of the external forces. Then the force equations in the driving direction and the detection direction are:

[0011]

[0012] According to formulas (1) to (2), m x is the driving direction equivalent mass block of the monolithically integrated single-axis silicon micromechanical disk gyroscope, m y is the sensitive detection direction equivalent mass block of the monolithically integrated single-axis silicon micromechanical disk gyroscope, d xis the driving direction equivalent damping of the monolithically integrated single-axis silicon micromechanical disk gyroscope, d y is the equivalent damping of the sensitive detection direction of the monolithically integrated single-axis silicon micromechanical disk gyroscope, k x is the driving direction equivalent stiffness of the monolithically integrated single-axis silicon micromechanical disk gyroscope, k y is the equivalent stiffness of the sensitive detection direction of the monolithically integrated single-axis silicon micromechanical disk gyroscope, F d The total driving force applied to the driving direction of the monolithically integrated single-axis silicon micromechanical disk gyroscope, w d is the driving angular frequency, Ω z is the input Z-axis angular velocity. The monolithically integrated single-axis silicon micromechanical disc gyroscope is a fully decoupled structure. In an ideal state, the motions between the driving mode and the detection mode in the structure are independent of each other and will not be affected in any way;

[0013] The monolithically integrated single-axis silicon micromechanical disc gyroscope is composed of 16 spring-damper systems, and the expression is as follows:

[0014]

[0015] In the formula, m i d i , k i and F i are the equivalent mass, equivalent damping coefficient, equivalent stiffness coefficient, and electrostatic driving force of the monolithically integrated single-axis silicon micromechanical disk gyroscope in the driving direction and sensitive detection direction; m1, m5, m9, and m 13 is the driving equivalent mass; m3, m7, m 11 and m 15 Equivalent mass for sensitive detection; d1, d5, d9 and d 13 , k1, k5, k9 and k 13 is the driving equivalent damping, driving equivalent stiffness; d3, d7, d 11 and d 15 , k3, k7, k 11 and k 15 It is sensitive to detect equivalent damping and sensitive to detect equivalent stiffness;

[0016] Substituting the structure shown in the above equation into equations (1) and (2), the basic dynamic equation of the monolithically integrated single-axis silicon micromechanical disk gyroscope under ideal conditions can be obtained:

[0017]

[0018]

[0019] Since the monolithically integrated single-axis silicon micromechanical disc gyroscope is a completely symmetrical structure, the parameters in each direction are consistent in size, whether in the four driving directions or the four sensitive detection directions, and only the directions are different; therefore, the equivalent analysis method is used in the analysis, that is, the driving direction selects the driving equivalent mass m x , driving equivalent damping d x and drive equivalent stiffness k x , sensitive detection direction selects sensitive detection equivalent mass m y , sensitive detection equivalent damping d y and sensitive detection equivalent stiffness k y After analysis, the second-order dynamic equation of a monolithically integrated single-axis silicon micromechanical disc gyroscope is as follows:

[0020]

[0021] Furthermore, the specific electrodes of the monolithically integrated single-axis silicon micromechanical disk gyroscope are distributed as 16 electrodes outside the disk structure. They are 0° electrode, 22.5° electrode, 45° electrode, 67.5° electrode, 90° electrode, 112.5° electrode, 135° electrode, 157.5° electrode, 180° electrode, 202.5° electrode, 225° electrode, 247.5° electrode, 270° electrode, 292.5° electrode, 315° electrode and 337.5° electrode. The 16 electrodes are symmetrical about the center of the anchor point, and electrodes 1-16 are mainly divided into three categories, namely, driving mode electrodes, detection mode electrodes and orthogonal mode electrodes. Among them, the 0° electrode and the 180° electrode are driving signal detection electrodes for generating electrostatic driving force; the 90° electrode and the 270° electrode are driving signal feedback electrodes for driving mode displacement detection; the 45° electrode and the 225° electrode are sensitive signal detection electrodes for orthogonal error correction of the gyroscope, and the 135° electrode and the 315° electrode are sensitive signal feedback electrodes for sensitive mode displacement detection; the 22.5° electrode, the 112.5° electrode, the 202.5° electrode and the 292.5° electrode are orthogonal signal detection electrodes for orthogonal error correction of the gyroscope; the 67.5° electrode, the 157.5° electrode, the 247.5° electrode and the 337.5° electrode are orthogonal signal feedback electrodes for orthogonal error correction of the gyroscope.

[0022] The present invention also provides a monolithically integrated single-axis silicon micromechanical disc gyroscope and a processing method thereof, comprising the following steps:

[0023] Step 1: coating a layer of photoresist having a first predetermined thickness on the upper surface of the pre-processed single crystal silicon;

[0024] Step 2: using the photoresist as a mask, etching a step having a second predetermined thickness on the upper surface of the single crystal silicon in step 1;

[0025] Step 3: forming an Al material layer having a third predetermined thickness on the non-step portion of the upper surface of the single crystal silicon in step 1;

[0026] Step 4: removing the photoresist;

[0027] Step 5: Under predetermined conditions, the single crystal silicon obtained in step 4 is turned over so that the original upper surface of the single crystal silicon is aligned and bonded with the pre-processed glass anode surface;

[0028] Step 6: in the structure after bonding, thinning the original lower surface of the single crystal silicon so that the thickness of the step portion of the single crystal silicon is a fourth predetermined thickness;

[0029] Step 7: sputtering an Al material layer having a fifth predetermined thickness on the original lower surface of the single crystal silicon, and engraving and etching an Al electrode;

[0030] Step 8: coating the surface of the single crystal silicon with Al in step 1 with photoresist and performing photolithography treatment in sequence;

[0031] Step 9: Perform etching and structure release treatment in sequence;

[0032] Step 10: removing the photoresist and the Al material layer attached to the original upper surface of the single crystal silicon to obtain a device structure of a monolithically integrated single-axis silicon micromechanical disc gyroscope.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] The present invention utilizes a new disk structure to propose a new monolithic integrated single-axis silicon micromechanical disk gyroscope. This type of gyroscope adopts a flat, compact axisymmetric structure, is suitable for current MEMS silicon processing technology, and has the characteristics of small size, high precision, and a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0036] Figure 2 It is a schematic diagram of the explosion structure of the present invention;

[0037] Figure 3 It is a schematic diagram of the disk-type resonance structure of the present invention;

[0038] Figure 4 Schematic diagram of the silicon electrode layer structure of the present invention;

[0039] Figure 5 This is a schematic diagram of the glass substrate structure of the present invention;

[0040] Figure 6 It is a schematic diagram of the multi-dimensional spring damping structure of the present invention;

[0041] Figure 7 It is a schematic diagram of the equivalent structure of the multi-dimensional spring damping of the present invention;

[0042] Figure 8 This is a schematic diagram of the electrode distribution structure of the present invention;

[0043] Fig. 9 It is a schematic diagram of the processing method of the present invention.

[0044] Reference numerals: 1, disk structure resonator; 2, silicon electrode layer; 3, glass substrate; 101, disk center mass block structure; 102, anchor point structure 102; 103, multi-dimensional "spring-damper" structure; 104, multi-dimensional concentric ring structure; 201, 0° electrode; 202, 22.5° electrode; 203, 45° electrode; 204, 67.5° electrode; 205, 90° electrode; 206, 112. 5° electrode; 207, 135° electrode; 208, 157.5° electrode; 209, 180° electrode; 210, 202.5° electrode; 211, 225° electrode; 212, 247.5° electrode; 213, 270° electrode; 214, 292.5° electrode; 215, 315° electrode; 216, 337.5° electrode; 301, external electrode; 1031, symmetrical U-beam. DETAILED DESCRIPTION

[0045] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0046] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0047] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] like Figures 1 to 6 As shown, this embodiment discloses a monolithically integrated single-axis silicon micromechanical disk gyroscope, which includes a disk structure resonator 1, a silicon electrode layer 2, a glass substrate 3 and an external electrode 301 from top to bottom, and the glass substrate and the silicon electrode layer are bonded by an anodic bonding;

[0050] The disk-type structure resonator 1 includes a disk center mass block structure 101, a multi-dimensional concentric ring structure 104, an anchor structure 102, and a multi-dimensional "spring-damping" structure 103. The center is a fixed disk center mass block structure 101, which is fixed by the anchor structure 102, and the multi-dimensional concentric ring structure 104 and the multi-dimensional "spring-damping" structure 103 are distributed on the periphery. The multi-dimensional "spring-damping" structure 103 is composed of the anchor structure 102 and a symmetrical U-shaped beam 1031.

[0051] In order to improve the detection accuracy, the diameter of the multi-dimensional "spring-damper" structure 103 gradually increases from the inside to the outside, so that the mass of the ring gradually increases, ensuring the overall total detection quality, and effectively improving the detection accuracy; the multi-dimensional "spring-damper" structure 103 is distributed on the periphery of the disk center mass block structure 101, including 16 groups, which are respectively distributed at angles of 0°, 22.5°, 45°, 67.5°, 90°, 112.5°, 135°, 157.5°, 180°, 202.5°, 225°, 247.5°, 270°, 292.5°, 315°, and 337.5° with the x-axis.

[0052] The silicon electrode layer 2 is used to connect the disk-type structure resonator 1 and the external electrode 301, and is composed of 16 electrodes, which are mainly divided into three categories: driving mode electrodes, detection mode electrodes and orthogonal mode electrodes. The electrical signal changes generated by the disk-type structure resonator 1 can be transmitted to the external electrode 301, and then detected by a discrete external circuit.

[0053] The present invention also provides a working principle of a single-axis silicon micromechanical disc gyroscope integrated with the above-mentioned monolithic chip:

[0054] When a monolithic integrated single-axis silicon micromechanical disc gyroscope is in normal working condition, its overall structure can be equivalent to two spring-mass-damper systems, one along the driving axis x and the other along the detection axis y, with the Z axis as its sensitive axis. When this second-order system is in working condition, the driving mode drives the Coriolis mass block to vibrate linearly along the driving axis under the action of the driving force. When there is an angular velocity Ω input around the Z axis, according to the Coriolis theorem, the Coriolis mass block will be subjected to the Coriolis force along the y direction, which will drive the Coriolis mass block to move along the y direction. According to Newton's second law. The product of the acceleration of the mass block and its mass is the sum of the external forces. Then the force equations in the driving direction and the detection direction are:

[0055]

[0056] According to formulas (1) to (2), m x is the driving direction equivalent mass block of a monolithically integrated single-axis silicon micromechanical disk gyroscope, m y It is a sensitive detection direction equivalent mass block of a monolithically integrated single-axis silicon micromechanical disk gyroscope, d x is the driving direction equivalent damping of a monolithically integrated single-axis silicon micromechanical disk gyroscope, d y is the equivalent damping of the sensitive detection direction of a monolithically integrated single-axis silicon micromechanical disk gyroscope, k x is the driving direction equivalent stiffness of a monolithically integrated single-axis silicon micromechanical disk gyroscope, k y is the equivalent stiffness of the sensitive detection direction of a monolithically integrated single-axis silicon micromechanical disk gyroscope, F d The total driving force applied to the driving direction of a monolithically integrated single-axis silicon micromechanical disk gyroscope, w d is the driving angular frequency, Ω z is the input Z-axis angular velocity. A monolithically integrated single-axis silicon micromechanical disc gyroscope is a fully decoupled structure. In an ideal state, the motion between the driving mode and the detection mode in its structure is independent of each other and will not be affected in any way;

[0057] like Figure 7 As shown, a monolithically integrated single-axis silicon micromechanical disk gyroscope consists of 16 spring-damper systems, and the expression is as follows:

[0058]

[0059] In the formula, m i d i , k i and F i The equivalent mass, equivalent damping coefficient, equivalent stiffness coefficient, and electrostatic driving force of a monolithically integrated single-axis silicon micromechanical disk gyroscope in the driving direction and sensitive detection direction; m1, m5, m9, and m 13 is the driving equivalent mass; m3, m7, m 11 and m 15 Equivalent mass for sensitive detection; d1, d5, d9 and d 13 , k1, k5, k9 and k 13 is the driving equivalent damping, driving equivalent stiffness; d3, d7, d 11 and d 15 , k3, k7, k 11 and k 15 It is sensitive to detect equivalent damping and sensitive to detect equivalent stiffness;

[0060] Substituting the structure shown in the above equation into equations (1) and (2), the basic dynamic equation of a monolithically integrated single-axis silicon micromechanical disk gyroscope under ideal conditions can be obtained:

[0061]

[0062] Since a monolithic integrated single-axis silicon micromechanical disk gyroscope is a completely symmetrical structure, no matter in the four driving directions or the four sensitive detection directions, the parameters in each direction are the same, only the directions are different; therefore, the equivalent analysis method is used in the analysis, that is, the driving direction selects the driving equivalent mass m x , driving equivalent damping d x and drive equivalent stiffness k x , sensitive detection direction selects sensitive detection equivalent mass m y , sensitive detection equivalent damping d y and sensitive detection equivalent stiffness k y After analysis, the second-order dynamic equation of a monolithically integrated single-axis silicon micromechanical disk gyroscope is as follows:

[0063]

[0064] like Figure 8As shown, it is a distribution diagram of 16 electrodes, including 0° electrode 201, 22.5° electrode 202, 45° electrode 203, 67.5° electrode 204, 90° electrode 205, 112.5° electrode 206, 135° electrode 207, 157.5° electrode 208, 180° electrode 209, 202.5° electrode 210, 225° electrode 211, 247.5° electrode 212, 270° electrode 213, 292.5° electrode 214, 315° electrode 215 and 337.5° electrode 216. The 16 electrodes are symmetrical about the anchor point center, and the electrodes are mainly divided into three categories, namely, driving mode electrodes, detection mode electrodes and orthogonal mode electrodes. Among them, the 0° electrode 201 and the 180° electrode 209 are driving signal detection electrodes for generating electrostatic driving force; the 90° electrode 205 and the 270° electrode 213 are driving signal feedback electrodes for driving mode displacement detection; the 45° electrode 203 and the 225° electrode 211 are sensitive signal detection electrodes for orthogonal error correction of the gyroscope, and the 135° electrode 207 and the 315° electrode 215 are sensitive signal feedback electrodes for sensitive mode displacement detection; the 22.5° electrode 202, the 112.5° electrode 206, the 202.5° electrode 210 and the 292.5° electrode 214 are orthogonal signal detection electrodes for orthogonal error correction of the gyroscope; the 67.5° electrode 204, the 157.5° electrode 208, the 247.5° electrode 212 and the 337.5° electrode 216 are orthogonal signal feedback electrodes for orthogonal error correction of the gyroscope.

[0065] like Fig. 9 As shown, the present invention also discloses a method for processing a monolithically integrated single-axis silicon micromechanical disc gyroscope, comprising the following steps:

[0066] Step 1: coating a layer of photoresist having a first predetermined thickness on the upper surface of the pre-processed single crystal silicon;

[0067] Step 2: using photoresist as a mask, etching a step having a second predetermined thickness on the upper surface of the single crystal silicon in step 1;

[0068] Step 3: forming an Al material layer having a third predetermined thickness on the non-step portion of the upper surface of the single crystal silicon in step 1;

[0069] Step 4: Remove the photoresist;

[0070] Step 5: Under predetermined conditions, the single crystal silicon obtained in step 4 is turned over so that the original upper surface of the single crystal silicon is aligned and bonded with the pre-processed glass anode surface;

[0071] Step 6: in the structure after bonding, thinning the original lower surface of the single crystal silicon so that the thickness of the step portion of the single crystal silicon is a fourth predetermined thickness;

[0072] Step 7: sputtering an Al material layer having a fifth predetermined thickness on the original lower surface of the single crystal silicon, and engraving and etching an Al electrode;

[0073] Step 8: coating the surface of the single crystal silicon with Al in step 1 with photoresist and performing photolithography treatment in sequence;

[0074] Step 9: Perform etching and structure release treatment in sequence;

[0075] Step 10: removing the photoresist and the Al material layer attached to the original upper surface of the single crystal silicon to obtain a device structure of a monolithically integrated single-axis silicon micromechanical disc gyroscope.

[0076] The above is only an embodiment of the present invention, and the common sense such as the known specific structure and characteristics in the scheme is not described in detail here. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the attached claims rather than the above description, so it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

Claims

1. A monolithically integrated single-axis silicon micromechanical disc gyroscope, characterized in that: It includes a disk-type structure resonator, a silicon electrode layer, a glass substrate and an external electrode from top to bottom, wherein the glass substrate and the silicon electrode layer are bonded by an anodic bonding; The disk-type structure resonator comprises a disk center mass block structure, a multi-dimensional concentric ring structure, an anchor structure, a multi-dimensional "spring-damping" structure and a peripheral electrode structure, wherein the center is a fixed disk center mass block structure, which is fixed by the anchor structure, and the multi-dimensional concentric ring structure and the multi-dimensional "spring-damping" structure are distributed on the periphery, wherein the multi-dimensional concentric ring structure gradually increases the diameter of the ring from the inside to the outside in order to improve the detection accuracy, so that the mass of the ring gradually increases, thereby ensuring the overall total detection quality and effectively improving the detection accuracy; the multi-dimensional "spring-damping" structure is distributed on the periphery of the disk center mass block structure; The silicon electrode layer is used to connect the disk-type structure resonator and the external electrode. The silicon electrode layer is divided into three categories: driving mode electrode, detection mode electrode and orthogonal mode electrode, which transmits the electrical signal change generated by the disk-type structure resonator to the external electrode, and then detects it through a discrete external circuit; The glass substrate provides support for the overall structure of the monolithically integrated single-axis silicon micromechanical disk gyroscope.

2. A monolithically integrated single-axis silicon micromechanical disc gyroscope according to claim 1, characterized in that: The disk center mass block structure provides support for the disk structure resonator of the monolithically integrated single-axis silicon micromechanical disk gyroscope and is located at the center of the entire disk structure resonator.

3. The monolithically integrated single-axis silicon micromechanical disc gyroscope according to claim 1, characterized in that: The multi-dimensional concentric ring structure is a concentric circle of the disk center mass block structure, and is used to transmit the movement of the disk center mass block structure.

4. The monolithically integrated single-axis silicon micromechanical disc gyroscope according to claim 1, characterized in that: The anchor point structure is used to connect and support the multi-dimensional concentric ring structure and the multi-dimensional "spring-damper" structure, and the anchor point structure is used to ensure that the overall structure of the monolithic integrated single-axis silicon micromechanical disc gyroscope will not "twist" during the process of detecting angular velocity.

5. The monolithically integrated single-axis silicon micromechanical disc gyroscope according to claim 1, characterized in that: The multidimensional "spring-damper" structure comprises 16 groups, which are respectively distributed at angles of 0°, 22.5°, 45°, 67.5°, 90°, 112.5°, 135°, 157.5°, 180°, 202.5°, 225°, 247.5°, 270°, 292.5°, 315°, and 337.5° with respect to the x-axis; the multidimensional "spring-damper" structure is located on the sensitive axis of the monolithically integrated single-axis silicon micromechanical disc gyroscope; when the sensitive mode of the multidimensional "spring-damper" structure is excited, the multidimensional "spring-damper" structure is deformed, thereby helping the monolithically integrated single-axis silicon micromechanical disc gyroscope to detect the angular velocity.

6. The monolithically integrated single-axis silicon micromechanical disc gyroscope according to claim 1, characterized in that: The external electrode includes 16 electrodes distributed outside the disk structure resonator, including a 0° electrode, a 22.5° electrode, a 45° electrode, a 67.5° electrode, a 90° electrode, a 112.5° electrode, a 135° electrode, a 157.5° electrode, a 180° electrode, a 202.5° electrode, a 225° electrode, a 247.5° electrode, a 270° electrode, a 292.5° electrode, a 315° electrode and a 337.5° electrode; the 16 electrodes are symmetrical about the center of the anchor structure.

7. An operating principle of a monolithically integrated single-axis silicon micromechanical disc gyroscope according to any one of claims 1 to 6, characterized in that: The principle is: When the monolithic integrated single-axis silicon micromechanical disc gyroscope is in normal working state, its overall structure is equivalent to two spring-mass-damping systems, respectively along the driving axis x and the detection axis y, and the Z axis is its sensitive axis. When this second-order system is in working state, the driving mode drives the Coriolis mass block to vibrate linearly along the driving axis under the action of the driving force. When there is an angular velocity Ω input around the Z axis, according to the Coriolis theorem, the Coriolis mass block will be subjected to the Coriolis force along the y direction, which will drive the Coriolis mass block to move along the y direction. According to Newton's second law, the product of the acceleration of the mass block and its mass is the sum of the external forces, and the force equations in the driving direction and the detection direction are: According to formulas (1) to (2), m x is the driving direction equivalent mass block of the monolithically integrated single-axis silicon micromechanical disk gyroscope, m y is the sensitive detection direction equivalent mass block of the monolithically integrated single-axis silicon micromechanical disk gyroscope, d x is the driving direction equivalent damping of the monolithically integrated single-axis silicon micromechanical disk gyroscope, d y is the equivalent damping of the sensitive detection direction of the monolithically integrated single-axis silicon micromechanical disk gyroscope, k x is the driving direction equivalent stiffness of the monolithically integrated single-axis silicon micromechanical disk gyroscope, k y is the equivalent stiffness of the sensitive detection direction of the monolithically integrated single-axis silicon micromechanical disk gyroscope, F d The total driving force applied to the driving direction of the monolithically integrated single-axis silicon micromechanical disk gyroscope, w d is the driving angular frequency, Ω z is the input Z-axis angular velocity; the monolithically integrated single-axis silicon micromechanical disc gyroscope is a fully decoupled structure, and under ideal conditions, the motions between the driving mode and the detection mode in its structure are independent of each other and will not be affected in any way; The monolithically integrated single-axis silicon micromechanical disc gyroscope is composed of 16 spring-damper systems, and the expression is as follows: In the formula, m i ,d i , k i and F i The equivalent mass, equivalent damping coefficient, equivalent stiffness coefficient, and electrostatic driving force of a monolithically integrated single-axis silicon micromechanical disk gyroscope in the driving direction and sensitive detection direction; m1, m5, m9, and m 13 is the driving equivalent mass; m3, m7, m 11 and m 15 Equivalent mass for sensitive detection; d1, d5, d9 and d 13 , k1, k5, k9 and k 13 is the driving equivalent damping, driving equivalent stiffness; d3, d7, d 11 and d 15 , k3, k7, k 11 and k 15 It is sensitive to detect equivalent damping and sensitive to detect equivalent stiffness; Substituting the structure shown in the above equation into equations (1) and (2), the basic dynamic equation of the monolithically integrated single-axis silicon micromechanical disk gyroscope under ideal conditions can be obtained: Since the monolithically integrated single-axis silicon micromechanical disc gyroscope is a completely symmetrical structure, the parameters in each direction are consistent in size, whether in the four driving directions or the four sensitive detection directions, and only the directions are different; therefore, the equivalent analysis method is used in the analysis, that is, the driving direction selects the driving equivalent mass m x , driving equivalent damping d x and drive equivalent stiffness k x , sensitive detection direction selects sensitive detection equivalent mass m y , sensitive detection equivalent damping d y and sensitive detection equivalent stiffness k y The second-order dynamic equation of the monolithically integrated single-axis silicon micromechanical disc gyroscope is as follows:

8. The method for processing a monolithically integrated single-axis silicon micromechanical disk gyroscope according to claim 1, characterized in that: The following steps are involved: Step 1: coating a layer of photoresist having a first predetermined thickness on the upper surface of the pre-processed single crystal silicon; Step 2: using the photoresist as a mask, etching a step having a second predetermined thickness on the upper surface of the single crystal silicon in step 1; Step 3: forming an Al material layer having a third predetermined thickness on the non-step portion of the upper surface of the single crystal silicon in step 1; Step 4: removing the photoresist; Step 5: Under predetermined conditions, the single crystal silicon obtained in step 4 is turned over so that the original upper surface of the single crystal silicon is aligned and bonded with the pre-processed glass anode surface; Step 6: in the structure after bonding, thinning the original lower surface of the single crystal silicon so that the thickness of the step portion of the single crystal silicon is a fourth predetermined thickness; Step 7: sputtering an Al material layer having a fifth predetermined thickness on the original lower surface of the single crystal silicon, and engraving and etching an Al electrode; Step 8: coating the surface of the single crystal silicon with Al in step 1 with photoresist and performing photolithography treatment in sequence; Step 9: Perform etching and structure release treatment in sequence; Step 10: The photoresist and the Al material layer attached to the original upper surface of the single crystal silicon are removed to obtain a monolithically integrated single-axis silicon micromechanical disc gyroscope.

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