Chip substrate surface quality detection equipment and detection method thereof

Abstract

The invention provides chip substrate surface quality detection equipment and a detection method thereof, and belongs to the technical field of chip detection.The chip substrate surface quality detection equipment comprises a workbench, a first mounting through groove is formed in the top of the workbench, transparent bearing glass is arranged in the first mounting through groove, and a tool used for containing a chip substrate is arranged at the top of the transparent bearing glass; a mounting box is arranged at the bottom of the first mounting through groove, a mounting groove is formed in the top of the mounting box, a positioning assembly is arranged in the mounting groove and comprises four sets of laser positioners, four sets of laser receivers are arranged at the bottom of the tool, and four sets of laser positioners corresponding to the four sets of laser receivers are arranged in the mounting groove, so that the chip substrate is positioned at a detection position; the reliability of a detection result is improved; a detection assembly is arranged on the workbench and comprises two visual detection modules used for detecting the chip substrate, the two visual detection modules are located at the top and the bottom of the chip substrate respectively, the two faces of the chip substrate can be detected at the same time, and repositioning after turning over is not needed.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip detection, and more specifically, particularly relates to a chip substrate surface quality detection device and a detection method thereof. Background Art

[0002] As an important carrier of the chip, the surface quality of the chip substrate directly affects the packaging effect and electrical performance of the chip. With the continuous refinement of the chip manufacturing process, the requirements for the detection of the surface quality of the chip substrate are becoming higher and higher.

[0003] For example, the Chinese invention patent with patent number 202110532077.3 provides a contactless detection device and method for LED chips. When in use, the device places the LED chip on the surface of the second substrate, and then detects the LED chip through the optical signal detection system on the top; however, traditional detection devices usually require operators to manually position the chip substrate, relying on the proficiency and accuracy of manual operation, which makes the chip substrate easy to be inaccurately positioned, and after detecting one side, it needs to be manually turned over and repositioned, which affects the reliability of the detection results. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a chip substrate surface quality inspection device and an inspection method thereof to solve the technical problems in the prior art that traditional inspection devices rely on the proficiency and accuracy of manual operation, and that after inspecting one side, the device needs to be manually turned over and repositioned, thereby affecting the reliability of the inspection results.

[0005] The purpose and effect of a chip substrate surface quality detection device and a detection method thereof of the present invention are achieved by the following specific technical means: A chip substrate surface quality detection device comprises a workbench, a first mounting slot is provided on the top of the workbench, a transparent supporting glass is arranged in the first mounting slot, and a tooling for placing the chip substrate is arranged on the top of the transparent supporting glass; a mounting box is provided at the bottom of the first mounting slot, a mounting slot is provided on the top of the mounting box, a positioning component is arranged in the mounting slot, the positioning component comprises four groups of laser locators, four groups of laser receivers are arranged at the bottom of the tooling, and four groups of laser locators are arranged in the mounting slot corresponding to the four groups of laser receivers; a detection component is provided on the workbench, the detection component comprises two groups of visual detection modules for detecting the chip substrate, one group of the visual detection modules is arranged in the mounting box, and the other group of the visual detection modules is arranged above the workbench.

[0006] In a preferred embodiment, the positioning assembly also includes two groups of diagonal fixing claws, two groups of sliding grooves are opened on the top of the transparent supporting glass, the bottom of the two groups of sliding grooves are provided with a first slide rail, the two groups of the first slide rails are provided with a slidable slider, the top of the slider is provided with a first connecting column, the bottom of the two groups of diagonal fixing claws are provided with a connecting port, the top ends of the two groups of the first connecting columns respectively pass through the two groups of sliding grooves and are arranged in the two groups of the connecting ports, and the tooling is arranged between the two groups of diagonal fixing claws.

[0007] In a preferred embodiment, two groups of first mounting holes are provided at the bottom of the mounting box, a positioning motor is provided at the bottom of one group of the first mounting holes, a transmission column is provided at the top of the main shaft of the positioning motor, a first bearing is provided on the other group of the first mounting holes, the bottom end of the rotating column is passed through the first bearing, pulleys are provided at the top of the transmission column and the rotating column, the two groups of pulleys are connected by belts, clamping plates are provided at the bottom of the two groups of sliders, and the two groups of clamping plates are respectively connected to the two sides of the belts; a first mounting seat is provided at the bottom of the mounting groove, four groups of mounting columns are provided at the top of the first mounting seat, the adjacent sides of the four groups of mounting columns are installed with the laser locator by screws, an electric telescopic rod is also provided at the top of the first mounting seat, and one group of the visual detection modules is installed at the top of the electric telescopic rod.

[0008] In a preferred embodiment, the detection component also includes a switching motor, a first screw slide is arranged on the top of the workbench, a first drive motor is arranged at one end of the first screw slide, a support column is connected to the threaded slider of the first screw slide by a screw, a second mounting groove is opened on one side of the support column, the switching motor is installed on the bottom of the second mounting groove, a second mounting hole connected to the second mounting groove is opened on the top of the support column, the bottom end of the second connecting column passes through the second mounting hole and is connected to the main shaft of the switching motor, a second bearing is arranged in the second mounting hole, the top of the second bearing is in contact with the second connecting column, and two groups of connecting beams are arranged on the outside of the second connecting column, and the two groups of connecting beams are at 90 degrees.

[0009] In a preferred embodiment, a limiting member is provided on the top of the support column, and one side of the limiting member can contact one group of the connecting beams, and one end of one group of the connecting beams away from the second connecting column is connected to a second screw slide, and a second driving motor is provided at the top of the second screw slide. A first mounting plate is connected to the threaded slider of the second screw slide, and one side of the first mounting plate is connected to a cross plate by screws, and two groups of connecting plates are provided at the bottom of the cross plate, and a cylinder is provided on the corresponding side of the two groups of connecting plates.

[0010] In a preferred embodiment, a second mounting plate is provided at the bottom end of the two groups of cylinder pneumatic rods, four groups of magnetic parts are provided on the top of the tooling, four groups of electromagnets are provided at the bottom of the two groups of the second mounting plates corresponding to the four groups of magnetic parts, a connecting seat is provided on the top of the two groups of partitions, the two groups of connecting seats are connected to the bottom end of the connecting plate by screws, an electrical box is provided between the two groups of connecting plates, the electrical box is connected to the four groups of electromagnets by wires, and a buffer layer is provided at the bottom of the two groups of partitions.

[0011] In a preferred embodiment, a second slide rail is provided at one end of another group of connecting beams away from the second connecting column, an electric slider is provided on the second slide rail, an L-shaped mounting plate is provided on one side of the electric slider, a second mounting seat is installed on the L-shaped mounting plate, a horizontal adjustment motor is provided on the second mounting seat, a mounting table is connected to the bottom end of the main shaft of the horizontal adjustment motor, and one group of the visual inspection modules and the ring light are provided at the bottom of the mounting table, and the ring light is located around the visual inspection module.

[0012] In a preferred embodiment, another group of connecting beams is connected to a second slide rail at one end away from the second connecting column, and an electric slider is arranged on the second slide rail, a first support arm is arranged on one side of the electric slider, one end of the first support arm is connected to a third mounting plate, a horizontal adjustment motor is arranged on the third mounting plate, a movable plate is connected to the main shaft of the horizontal adjustment motor, a ring light is arranged at the bottom of the movable plate, a second support arm is connected to one side of the movable plate, a rotating seat is arranged at one end of the second support arm away from the movable plate, a rotatable rotating part is arranged on the rotating seat, an angle adjustment motor is arranged on one side of the rotating seat, one end of the main shaft of the angle adjustment motor is connected to the rotating part, one group of the visual detection modules is arranged at the bottom of the rotating part, and a gyroscope is arranged at the top.

[0013] In a preferred embodiment, a through groove is provided on the top of the tooling, a transparent silicone layer for supporting the chip substrate is arranged in the through groove, four groups of positioning protrusions are arranged around the first mounting through groove, the bottom of the transparent supporting glass is in contact with the four groups of positioning protrusions, the workbench and the top of the transparent supporting glass are provided with corresponding fixing grooves, and fixing blocks are arranged in both groups of the fixing grooves.

[0014] A method for detecting a chip substrate surface quality detection device comprises the following steps: Step 1: Positioning operation; By starting two groups of cylinders to push four groups of electromagnets close to two groups of partitions, the distance between the electromagnets and the magnetic attraction parts is shortened, so that the tooling is adsorbed on the bottom of the two groups of partitions. Through the cooperation of the first screw slide and the second screw slide, the tooling with the chip substrate is placed on the top of the transparent bearing glass, so that the four groups of laser receivers at the bottom of the tooling correspond one by one to the four groups of laser locators in the installation groove; Step 2: Fixed operation; The positioning motor is started to drive the transmission column to rotate, and the rotating column rotates synchronously through the transmission effect of the pulley and the belt, thereby driving the two sets of sliders to slide relatively on the first slide rail, and the first connecting column on the top of the slider drives the diagonal fixed claws to move, so that the tooling is fixed between the two sets of the diagonal fixed claws to ensure that the chip substrate is in the detection position; then, the two sets of cylinders retract the pneumatic rods to move the four sets of electromagnets upward, increase the distance between the electromagnets and the magnetic suction parts, and release the adsorption of the tooling; Step 3: Switch detection; The switching motor is started to drive the second connecting column to rotate 90 degrees counterclockwise, thereby driving the two groups of connecting beams to rotate, so that one group of visual inspection modules moves to the top of the chip substrate, and the horizontal adjustment motor is started to rotate the mounting table, so that the visual inspection module rotates accordingly to inspect the top of the chip substrate; at the same time, the electric telescopic rod is started to raise the other group of visual inspection modules to inspect the bottom of the chip substrate; Step 4: Detection completed; After the detection is completed, the switching motor is started to drive the second connecting column to rotate 90 degrees clockwise. At the same time, the electric telescopic rod is retracted to move the two groups of visual inspection modules back to their initial positions; the two groups of cylinders extend the pneumatic rods to move the four groups of electromagnets downward, so that the tooling is adsorbed by the four groups of magnetic suction parts and the four groups of electromagnets, and the positioning motor is started to reverse, driving the two groups of sliders to slide in the opposite direction on the first slide rail, so that the two groups of diagonal fixed claws release the tooling, and then the first screw slide and the second screw slide move in the opposite direction to move the tooling with the chip substrate placed on it from the top of the transparent supporting glass.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. Through the setting of two groups of cylinders and four groups of electromagnets, when using the device, the two groups of cylinders are used to push the electromagnets close to the partition so that the tooling is adsorbed on the bottom of the partition. At the same time, with the help of the cooperation of the first screw slide and the second screw slide, the tooling can be placed on the top of the transparent supporting glass, so that the laser receiver at the bottom of the tooling corresponds one by one with the laser locator in the installation groove, so that the chip substrate is positioned at the detection position, which solves the problem of traditional detection devices relying on manual operation accuracy and improves the reliability of the detection results.

[0016] 2. Through the setting of the positioning motor and two sets of diagonal fixed claws, the positioning motor is started to drive the pulley to rotate, thereby driving two sets of sliders connected to the belt to slide relative to each other on the first slide rail, and the two sets of diagonal fixed claws are used to fix the tooling on which the chip substrate is placed, so as to fix the chip substrate in the detection position, thereby improving the stability of the detection device.

[0017] 3. Through the setting of two groups of visual inspection modules, by starting the switching motor to drive the two groups of connecting beams to rotate, one group of visual inspection modules can be quickly moved to the top of the chip substrate, and at the same time, the horizontal adjustment motor can rotate the mounting table to allow the visual inspection module to inspect the top of the chip substrate. At the same time, the electric telescopic rod can lift the other group of visual inspection modules to inspect the bottom of the chip substrate. Both sides of the chip substrate can be inspected at the same time, which solves the problem that the traditional inspection device needs to be manually turned over and repositioned after inspecting one side. It is not only simple and quick to operate, but also shortens the inspection time and improves the inspection efficiency.

[0018] 4. Through the setting of the transparent silicone layer and the buffer layer, when using the device, a transparent silicone layer is set on the tooling to carry the chip substrate, and the buffer layer is set at the bottom of the partition, which can prevent the chip substrate from being damaged by collision when the components move, play a certain buffering and protective role, and reduce the risk of damage to the chip substrate during the detection process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of a chip substrate surface quality detection device after assembly according to Embodiment 1 of the present invention; Figure 2 It is a schematic diagram of the structure of a chip substrate surface quality detection device after the first embodiment of the present invention is expanded; Figure 3 It is a schematic diagram of the structure after the positioning component of the present invention is assembled; Figure 4 It is a schematic diagram of the structure after the positioning component in the present invention is disassembled; Figure 5 It is a schematic diagram of the structure after the workbench and the positioning assembly are assembled in the present invention; Figure 6 yes Figure 5 Schematic diagram of the structure after splitting; Figure 7 yes Figure 6 A magnified schematic diagram of area a in the middle; Figure 8 It is a schematic diagram of the structure after the detection component of the present invention is assembled; Fig. 9 yes Figure 8 Schematic diagram of the structure after splitting; Fig.10 It is a schematic diagram of the structure after the partition plate and the connecting plate are assembled in the present invention; Fig.11 yes Fig.10 Schematic diagram of the structure after splitting; Fig.12 It is a schematic diagram of the structure after the second mounting seat and the mounting platform are separated in the present invention; Fig.13 It is a schematic structural diagram of the assembly of the rotating member and the rotating seat in the second embodiment of the chip substrate surface quality inspection device of the present invention; Fig.14 It is a schematic diagram of the structure after the rotating member and the rotating seat are separated in Embodiment 2 of a chip substrate surface quality inspection device of the present invention; Fig.15 The present invention is a flow chart of the steps of a detection method of a chip substrate surface quality detection device.

[0020] In the figure, the corresponding relationship between the component names and the figure numbers is as follows: 101, workbench; 102, first installation slot; 103, transparent bearing glass; 104, chip substrate; 105, tooling; 106, installation box; 107, installation slot; 108, transparent silicone layer; 109, positioning protrusion; 110, fixing slot; 111, fixing block; 201, laser locator; 202, laser receiver; 203, diagonal fixing claw; 204, sliding slot; 205, first slide rail; 206, slider; 207 , first connecting column; 208, connecting port; 209, first mounting hole; 210, positioning motor; 211, transmission column; 212, first bearing; 213, rotating column; 214, pulley; 215, belt; 216, clamping plate; 217, first mounting seat; 218, mounting column; 219, electric telescopic rod; 301, visual inspection module; 302, switching motor; 303, first screw slide; 304, first drive motor; 305 , support column; 306, second mounting groove; 308, second mounting hole; 309, second connecting column; 310, second bearing; 311, connecting beam; 312, stopper; 313, second screw slide; 314, second drive motor; 315, first mounting plate; 316, horizontal plate; 317, connecting plate; 318, cylinder; 319, second mounting plate; 320, magnetic element; 321, electromagnet; 322, partition; 323, connecting seat ; 324. Electrical box; 325. Buffer layer; 326. Second slide rail; 327. Electric slider; 328. L-shaped mounting plate; 329. Second mounting seat; 330. Horizontal adjustment motor; 331. Mounting table; 332. Ring light; 333. First support arm; 334. Third mounting plate; 335. Movable plate; 336. Second support arm; 337. Rotating seat; 338. Rotating part; 339. Angle adjustment motor; 340. Gyroscope. DETAILED DESCRIPTION

[0021] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but cannot be used to limit the protection scope of the present invention.

[0022] Embodiment 1: As shown in the attached Figures 1 to 15 As shown: The present invention provides a chip substrate surface quality detection device, comprising a workbench 101, a first installation slot 102 is provided on the top of the workbench 101, a transparent bearing glass 103 is provided in the first installation slot 102, a tooling 105 for placing a chip substrate 104 is provided on the top of the transparent bearing glass 103; the transparent bearing glass 103 can provide a clear observation field of view, which is convenient for detecting the chip substrate 104, a mounting box 106 is provided at the bottom of the first installation slot 102, a mounting slot 107 is provided on the top of the mounting box 106, in order to ensure that the chip substrate 104 can be accurately placed at the detection position during the detection process, a positioning component is provided in the mounting slot 107, and the positioning component includes four groups of laser locators 201, four groups of laser receivers 202 are provided at the bottom of the tooling 105, four groups of laser locators 201 are provided in the mounting slot 107 corresponding to the four groups of laser receivers 202, and the four groups of laser receivers 202 and the four groups of laser locators are connected to each other through the four groups of laser receivers 202. 201, the device can position the chip substrate 104 at the detection position, thereby solving the problem that the traditional detection device relies on manual operation accuracy and improving the reliability of the detection result; a detection component is arranged on the workbench 101, and the detection component includes two groups of visual detection modules 301 for detecting the chip substrate 104, one group of visual detection modules 301 is installed in the installation box 106, and the other group of visual detection modules 301 is arranged above the workbench 101, so that the two groups of visual detection modules 301 are respectively located at the top and bottom of the chip substrate 104, thereby realizing the simultaneous detection of both sides of the chip substrate 104, solving the problem that the traditional detection device needs to be manually turned over and repositioned after detecting one side, and through this double-sided detection method, the operator can quickly complete the double-sided detection of the chip substrate 104 without performing additional operations, thereby simplifying the operation process, thereby shortening the detection time and improving the detection efficiency.

[0023] Please refer to Figure 3 and Figure 4As shown, the positioning component also includes two groups of diagonal fixing claws 203 to fix the chip substrate 104 in the detection position to ensure the stability of its position during the detection process. In addition, two groups of sliding grooves 204 are opened on the top of the transparent supporting glass 103, and a first slide rail 205 is arranged at the bottom of each group of sliding grooves 204. The setting of the first slide rail 205 provides a sliding guide, and a slidable slider 206 is arranged on each group of first slide rails 205. A first connecting column 207 is arranged on the top of the slider 206. A connecting port 208 is opened at the bottom of the two groups of diagonal fixing claws 203. The top ends of the two groups of first connecting columns 207 pass through the two groups of sliding grooves 204 and are respectively arranged in the two groups of connecting ports 208. Through the setting of the two groups of connecting ports 208, a reliable connection is formed between the slider 206 and the diagonal fixing claws 203.

[0024] Please refer to Figure 4 , Figure 6 and Figure 7 As shown, two groups of first mounting holes 209 are provided at the bottom of the mounting box 106 for mounting components, and a positioning motor 210 is provided at the bottom of one group of the first mounting holes 209, which is driven by the positioning motor 210. At the same time, a transmission column 211 is provided at the top of the main shaft of the positioning motor 210, and a first bearing 212 is provided on the other group of the first mounting holes 209. The function of the first bearing 212 is to provide rotation support to make its movement smoother. The bottom end of the rotating column 213 is penetrated in the first bearing 212, thereby allowing it to rotate freely. The top of the transmission column 211 and the rotating column 213 are both provided with pulleys 214, and the two groups of pulleys 214 are connected by belts 215. The bottoms of the two groups of sliders 206 are both provided with clamping plates 216, which are respectively connected to the two sides of the belt 215. By starting the positioning motor 210, the rotation of the pulley 214 is driven, thereby driving the two groups of sliders 206 connected to the belt 215. Relative sliding is achieved on the first slide rail 205, so that the tooling 105 can be clamped between the two groups of diagonal fixed claws 203 to fix the chip substrate 104 in the detection position, ensuring that the position of the chip substrate 104 can remain unchanged during the detection process, thereby improving the stability of the detection device; at the same time, a first mounting seat 217 is provided at the bottom of the mounting groove 107, and four groups of mounting columns 218 are provided on the top of the first mounting seat 217. The adjacent sides of the four groups of mounting columns 218 are all installed with laser locators 201 by screws to ensure positioning accuracy, so as to locate the chip substrate 104 during the detection process. In addition, an electric telescopic rod 219 is also provided on the top of the first mounting seat 217. The electric telescopic rod 219 can be raised and lowered as needed, and one group of visual inspection modules 301 is installed at the top of the electric telescopic rod 219, so that the visual inspection module 301 can detect the chip substrate 104 at different heights during the detection process.

[0025] Please refer to Figure 8 and Fig. 9 As shown, the detection component also includes a switching motor 302, a first screw slide 303 is arranged on the top of the workbench 101, and a first drive motor 304 is arranged at one end of the first screw slide 303 to provide power support, and the top of the threaded slider of the first screw slide 303 is connected to a support column 305 by a screw, and a second mounting slot 306 is opened on one side of the support column 305, and the switching motor 302 is installed at the bottom of the second mounting slot 306, and the top of the support column 305 is opened with a screw connected to the second mounting slot 306. The second mounting hole 308 is connected to the second connecting column 309, and the bottom end of the second connecting column 309 passes through the second mounting hole 308 and is connected to the main shaft of the switching motor 302. In order to further enhance the stability of the structure, a second bearing 310 is also arranged in the second mounting hole 308. The top of the second bearing 310 is in contact with the second connecting column 309, thereby ensuring the smoothness and stability of the second connecting column 309 during rotation. Two groups of connecting beams 311 are arranged on the outer side of the second connecting column 309, and the two groups of connecting beams 311 are cross-arranged at an angle of 90 degrees.

[0026] Please refer to Fig. 9 , Fig.10 and Fig.11 As shown, a limit member 312 is provided at the top of the support column 305, and one side of the limit member 312 can contact one of the groups of connecting beams 311 to limit the rotation angle of the support column 305. When the support column 305 rotates under the drive of the switching motor 302, the limit member 312 can effectively limit the rotation range of the connecting beam 311 to avoid detection deviation caused by excessive rotation; one end of one group of connecting beams 311 away from the second connecting column 309 is connected to a second screw slide 313, and a second drive motor 314 is provided at the top of the second screw slide 313. When the second drive motor 314 is started, it can drive the threaded slider of the second screw slide 313 to move up and down, and a first mounting plate 315 is provided on one side of the threaded slider, and a cross plate 316 is connected to one side of the first mounting plate 315 by screws, thereby constructing a stable support structure; two groups of connecting plates 317 are symmetrically provided at the bottom of the cross plate 316, and cylinders 318 are provided on the corresponding sides of the two groups of connecting plates 317.

[0027] Please refer to Fig.11As shown, the bottom ends of the pneumatic rods of the two groups of cylinders 318 are provided with second mounting plates 319, and four groups of magnetic suction members 320 are arranged on the top of the tooling 105. Matching this, the bottoms of the two groups of second mounting plates 319 are respectively provided with four groups of electromagnets 321 corresponding to the four groups of magnetic suction members 320. When the cylinders 318 drive the pneumatic rods to extend and retract, the second mounting plates 319 and the electromagnets 321 thereon can be driven to move up and down. By controlling the electromagnetic force between the electromagnets 321 and the magnetic suction members 320, the tooling 105 can be adsorbed and released, thereby moving the chip substrate 104. The tops of the two groups of partitions 322 are provided with connecting seats 321. 23, and the two groups of connecting seats 323 are connected to the bottom ends of the two groups of connecting plates 317 through screws respectively, an electrical box 324 is arranged between the two groups of connecting plates 317, the electrical box 324 is connected to the four groups of electromagnets 321 through wires, and a buffer layer 325 is arranged at the bottom of the two groups of partitions 322. The buffer layer 325 is made of a material with elasticity and buffering properties, such as sponge, silicone, etc. When the components of the equipment are in action, such as the movement of the tooling 105, it can effectively absorb and disperse the impact force that may be generated, prevent collision damage to the chip substrate 104, and play a certain buffering and protective role.

[0028] Please refer to Fig.12 As shown, another set of connecting beams 311 is provided with a second slide rail 326 at one end away from the second connecting column 309, and an electric slider 327 is provided on the second slide rail 326, and linear motion is performed on the second slide rail 326 through the electric slider 327. An L-shaped mounting plate 328 is installed on one side of the electric slider 327, and a second mounting seat 329 is also installed on the L-shaped mounting plate 328. The function of the second mounting seat 329 is to provide a stable mounting platform for the installation of subsequent components. In addition, a horizontal adjustment motor 330 is provided on the second mounting seat 329, and the bottom end of the main shaft of the horizontal adjustment motor 330 is connected to the mounting table 331. One of the visual inspection modules 301 and the ring light 332 are provided at the bottom of the mounting table 331. The ring light 332 is located on the peripheral side of the visual inspection module 301 to provide uniform lighting, so that the lighting conditions are more balanced and consistent, thereby ensuring the imaging quality during the detection process.

[0029] Please refer to Fig.13 and Fig.14As shown, another group of connecting beams 311 is connected to a second slide rail 326 at one end away from the second connecting column 309, and an electric slider 327 is arranged on the second slide rail 326. A first support arm 333 is arranged on one side of the electric slider 327, and one end of the first support arm 333 is connected to a third mounting plate 334, and a horizontal adjustment motor 330 is arranged on the third mounting plate 334. A movable plate 335 is connected to the main shaft of the horizontal adjustment motor 330, and a ring light 332 is arranged at the bottom of the movable plate 335. A second supporting arm 336 is connected to one side of the movable plate 335, and a rotating seat 337 is arranged at one end of the second supporting arm 336 away from the movable plate 335, and a rotatable rotating member 338 is arranged on the rotating seat 337, and an angle adjustment motor 339 is arranged on one side of the rotating seat 337, and a rotating member 338 is connected to one end of the main shaft of the angle adjustment motor 339, and one group of visual detection modules 301 is arranged at the bottom of the rotating member 338, and a gyroscope 340 is arranged at the top.

[0030] Please refer to Figure 2 and Figure 6 As shown, a through groove is provided on the top of the tooling 105, and a transparent silicone layer 108 for carrying the chip substrate 104 is arranged in the through groove. The function of the transparent silicone layer 108 is to effectively reduce the risk of damage to the chip substrate 104 during the detection process, and ensure that the chip substrate 104 can be well supported and protected during the detection process. In addition, four groups of positioning protrusions 109 are provided on the surrounding side of the first installation through groove 102, and the bottom of the transparent supporting glass 103 is in contact with these four groups of positioning protrusions 109 to form a stable supporting structure; corresponding fixing grooves 110 are provided on the top of the workbench 101 and the transparent supporting glass 103, and fixing blocks 111 are provided in the two groups of fixing grooves 110. Through the setting of the fixing blocks 111, the transparent supporting glass 103 can be fixed together with the workbench 101.

[0031] A method for detecting a chip substrate surface quality detection device comprises the following steps: Step 1: Positioning operation; By starting the two groups of cylinders 318, the four groups of electromagnets 321 are pushed closer to the two groups of partitions 322, so that the distance between the electromagnets 321 and the magnetic suction parts 320 is shortened, and then the tooling 105 is adsorbed on the bottom of the two groups of partitions 322. During the placement of the tooling 105, the tooling 105 with the chip substrate 104 is smoothly moved and placed on the top of the transparent supporting glass 103 by relying on the cooperation of the first screw slide 303 and the second screw slide 313. In this process, a one-to-one correspondence is formed between the four groups of laser receivers 202 at the bottom of the tooling 105 and the four groups of laser positioners 201 in the installation groove 107, ensuring that the chip substrate 104 is correctly positioned at the detection position; Step 2: Fixed operation; The positioning motor 210 is started to drive the transmission column 211 to rotate. Through the transmission effect between the pulley 214 and the belt 215, the rotating column 213 rotates synchronously, thereby pushing the two groups of sliders 206 to slide relatively on the first slide rail 205, so that the first connecting column 207 on the top of the slider 206 drives the diagonal fixing claws 203 to move, so that the tooling 105 is clamped between the two groups of diagonal fixing claws 203 for fixation, ensuring that the chip substrate 104 is always in the detection position during the detection process; after the fixation is completed, the two groups of cylinders 318 begin to retract their pneumatic rods, thereby causing the four groups of electromagnets 321 to move upward. As the electromagnets 321 move upward, the distance between the electromagnets 321 and the magnetic suction member 320 also increases, thereby releasing the adsorption of the tooling 105; Step 3: Switch detection; The switching motor 302 is started to drive the second connecting column 309 to rotate 90 degrees counterclockwise, driving the two groups of connecting beams 311 to rotate accordingly, so that one group of visual inspection modules 301 moves to the top of the chip substrate 104, and then the horizontal adjustment motor 330 is started to rotate the mounting platform 331, so that the visual inspection module 301 rotates accordingly to inspect the top of the chip substrate 104; at the same time, in order to achieve a comprehensive inspection of the chip substrate 104, the electric telescopic rod 219 is started to raise another group of visual inspection modules 301 to inspect the bottom of the chip substrate 104, ensuring full coverage of the upper and lower surfaces of the chip substrate 104; Step 4: Detection completed; After the inspection work is completed, start the switching motor 302 to drive the second connecting column 309 to rotate 90 degrees clockwise. At the same time, retract the electric telescopic rod 219 to move the two groups of visual inspection modules 301 back to the initial position; the two groups of cylinders 318 extend the pneumatic rods to move the four groups of electromagnets 321 downward, so that the tooling 105 forms an adsorption connection with the four groups of magnetic suction parts 320 and the four groups of electromagnets 321 again, and then start the positioning motor 210 for reverse operation, driving the two groups of sliders 206 to slide in the opposite direction on the first slide rail 205. This process will cause the two groups of diagonal fixed claws 203 to gradually loosen the tooling 105. In addition, through the movement of the first screw slide 303 and the second screw slide 313, the tooling 105 with the chip substrate 104 can be smoothly moved out from the top of the transparent supporting glass 103.

[0032] Embodiment 2: Based on a chip substrate surface quality detection device and a detection method thereof provided in Embodiment 1 of the present application, Embodiment 2 of the present application proposes a chip substrate surface quality detection device and a detection method thereof. This Embodiment 2 is only a preferred method of Embodiment 1, and the implementation of Embodiment 2 will not affect the independent implementation of Embodiment 1. The second Embodiment 2 of the present invention will be further described below.

[0033] Please refer to Fig.13 and Fig.14 As shown, another group of connecting beams 311 is connected to a second slide rail 326 at one end away from the second connecting column 309. The second slide rail 326 provides track support for other components. An electric slider 327 is arranged on the second slide rail 326. The electric slider 327 can slide linearly along the second slide rail 326. A first support arm 333 is firmly arranged on one side of the electric slider 327. One end of the first support arm 333 is connected to a third mounting plate 334. A horizontal adjustment motor 330 is arranged on the third mounting plate 334. A movable plate 335 is connected to the main shaft of the horizontal adjustment motor 330. Through the setting of the horizontal adjustment motor 330, horizontal rotation power is provided for the movable plate 335 connected to the main shaft. A ring light 332 is installed at the bottom of the movable plate 335. The ring light 332 can emit uniform light during the detection process, provide good lighting conditions for the visual detection module 301, and ensure that the visual detection module 301 can be clearly Capture the surface image information of the chip substrate 104; a second support arm 336 is connected to one side of the movable plate 335, and a rotating seat 337 is arranged at the end of the second support arm 336 away from the movable plate 335, and a rotatable rotating member 338 is installed on the rotating seat 337, and an angle adjustment motor 339 is provided on one side of the rotating seat 337. The main shaft of the angle adjustment motor 339 is connected to the rotating member 338. Through the control of the angle adjustment motor 339, the rotating member 338 can be rotated at multiple angles in a vertical plane. One group of visual inspection modules 301 is installed at the bottom of the rotating member 338 to detect the surface quality of the chip substrate 104. A gyroscope 340 is arranged on the top of the rotating member 338. Through the setting of the gyroscope 340, the angle change information of the rotating member 338 can be monitored in real time, so as to control the angle adjustment motor 339 and the horizontal adjustment motor 330, thereby improving the stability of the visual inspection module 301 in detecting the angle adjustment.

[0034] Compared with the first embodiment in which the horizontal angle is adjusted only by setting the horizontal adjustment motor 330, the second embodiment installs a rotatable rotating part 338 on the rotating seat 337, and an angle adjustment motor 339 is provided on one side of the rotating seat 337. The main shaft of the angle adjustment motor 339 is connected to the rotating part 338, and one group of visual inspection modules 301 is installed at the bottom of the rotating part 338. The main difference is that the visual inspection module 301 can be adjusted in horizontal angle and vertical angle, so that the visual inspection module 301 is no longer limited to a single horizontal direction movement, and can not only scan the chip substrate 104 on the horizontal plane to obtain the surface information on the chip substrate 104, but also adjust the angle in the vertical direction to detect the features and defects at different heights on the surface of the chip substrate 104. Therefore, compared with the single horizontal angle adjustment, such a multi-angle adjustment function enhances the adaptability of the visual inspection module 301, and can better cope with the detection needs of chip substrates 104 with complex shapes and structures, thereby improving the detection accuracy and reliability of the equipment; the remaining conditions are consistent with the first embodiment, so this embodiment will not be repeated.

[0035] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A chip substrate surface quality inspection device, comprising a workbench (101), characterized in that: The workbench (101) has a first installation slot (102) at the top, a transparent supporting glass (103) is arranged in the first installation slot (102), and a tool (105) for placing a chip substrate (104) is arranged on the top of the transparent supporting glass (103); a mounting box (106) is arranged at the bottom of the first installation slot (102), a mounting slot (107) is arranged on the top of the mounting box (106), and a positioning component is arranged in the mounting slot (107), and the positioning component includes four groups of laser positioners (201). Four groups of laser receivers (202) are arranged at the bottom of the device (105), and four groups of laser locators (201) are arranged in the installation groove (107) corresponding to the four groups of laser receivers (202); a detection component is arranged on the workbench (101), and the detection component includes two groups of visual detection modules (301) for detecting the chip substrate (104), one group of the visual detection modules (301) is arranged in the installation box (106), and the other group of the visual detection modules (301) is arranged above the workbench (101).

2. The chip substrate surface quality detection device according to claim 1, characterized in that: The positioning assembly also includes two groups of diagonal fixing claws (203), two groups of sliding grooves (204) are provided on the top of the transparent supporting glass (103), first slide rails (205) are provided at the bottom of the two groups of sliding grooves (204), slidable sliders (206) are provided on the two groups of first slide rails (205), first connecting columns (207) are provided on the top of the sliders (206), connecting ports (208) are provided at the bottom of the two groups of diagonal fixing claws (203), top ends of the two groups of first connecting columns (207) respectively pass through the two groups of sliding grooves (204) and are provided in the two groups of connecting ports (208), and the tooling (105) is clamped between the two groups of diagonal fixing claws (203).

3. The chip substrate surface quality detection device according to claim 2, characterized in that: Two groups of first mounting holes (209) are provided at the bottom of the mounting box (106), a positioning motor (210) is provided at the bottom of one group of the first mounting holes (209), a transmission column (211) is provided at the top of the main shaft of the positioning motor (210), and a first bearing (212) is provided on the other group of the first mounting holes (209), the bottom of the rotating column (213) is inserted into the first bearing (212), the top of the transmission column (211) and the rotating column (213) are both provided with pulleys (214), and the two groups of pulleys (214) are connected by belts (215). The bottom of the slider (206) is provided with a clamping plate (216), and two groups of the clamping plates (216) are respectively connected to the two sides of the belt (215); the bottom of the mounting groove (107) is provided with a first mounting seat (217), and the top of the first mounting seat (217) is provided with four groups of mounting columns (218), and the laser locator (201) is installed on the adjacent sides of the four groups of mounting columns (218) by screws; the top of the first mounting seat (217) is also provided with an electric telescopic rod (219), and one group of the visual detection modules (301) is installed on the top of the electric telescopic rod (219).

4. The chip substrate surface quality detection device according to claim 1, characterized in that: The detection component also includes a switching motor (302), a first screw slide (303) is arranged on the top of the workbench (101), a first drive motor (304) is arranged at one end of the first screw slide (303), a support column (305) is connected to the threaded slider of the first screw slide (303) by screws, a second mounting slot (306) is opened on one side of the support column (305), the switching motor (302) is installed at the bottom of the second mounting slot (306), and the support column (305) is connected to the threaded slider of the first screw slide (303) by screws. 5) A second mounting hole (308) connected to the second mounting through groove (306) is provided at the top, the bottom end of the second connecting column (309) passes through the second mounting hole (308) and is connected to the main shaft of the switching motor (302), a second bearing (310) is provided in the second mounting hole (308), the top of the second bearing (310) is in contact with the second connecting column (309), and two groups of connecting beams (311) are provided on the outside of the second connecting column (309), and the two groups of connecting beams (311) are 90 degrees.

5. The chip substrate surface quality detection device according to claim 4, characterized in that: A limiting member (312) is provided at the top of the support column (305), and one side of the limiting member (312) can contact one group of the connecting beams (311). One end of one group of the connecting beams (311) away from the second connecting column (309) is connected to a second screw slide (313), a second drive motor (314) is provided at the top of the second screw slide (313), a first mounting plate (315) is connected to the threaded slider of the second screw slide (313), one side of the first mounting plate (315) is connected to a transverse plate (316) by screws, two groups of connecting plates (317) are provided at the bottom of the transverse plate (316), and cylinders (318) are provided on the corresponding sides of the two groups of connecting plates (317).

6. The chip substrate surface quality detection device according to claim 5, characterized in that: A second mounting plate (319) is provided at the bottom end of the pneumatic rod of the two groups of cylinders (318), four groups of magnetic suction parts (320) are provided at the top of the tooling (105), four groups of electromagnets (321) are provided at the bottom of the two groups of the second mounting plates (319) corresponding to the four groups of magnetic suction parts (320), a connecting seat (323) is provided at the top of the two groups of partitions (322), the two groups of connecting seats (323) are connected to the bottom end of the connecting plate (317) by screws, an electrical box (324) is provided between the two groups of connecting plates (317), the electrical box (324) is connected to the four groups of electromagnets (321) by wires, and a buffer layer (325) is provided at the bottom of the two groups of partitions (322).

7. The chip substrate surface quality inspection device according to claim 5, characterized in that: A second slide rail (326) is provided at one end of another group of the connecting beams (311) away from the second connecting column (309); an electric slider (327) is provided on the second slide rail (326); an L-shaped mounting plate (328) is provided on one side of the electric slider (327); a second mounting seat (329) is mounted on the L-shaped mounting plate (328); a horizontal adjustment motor (330) is provided on the second mounting seat (329); a mounting platform (331) is connected to the bottom end of the main shaft of the horizontal adjustment motor (330); one group of the visual inspection modules (301) and the annular light (332) is provided at the bottom of the mounting platform (331); the annular light (332) is located around the visual inspection module (301).

8. The chip substrate surface quality inspection device according to claim 5, characterized in that: One end of another group of connecting beams (311) away from the second connecting column (309) is connected to a second slide rail (326), an electric slider (327) is provided on the second slide rail (326), a first support arm (333) is provided on one side of the electric slider (327), one end of the first support arm (333) is connected to a third mounting plate (334), a level adjustment motor (330) is provided on the third mounting plate (334), a main shaft of the level adjustment motor (330) is connected to a movable plate (335), and a ring light (335) is provided at the bottom of the movable plate (335). 2), a second support arm (336) is connected to one side of the movable plate (335), a rotating seat (337) is provided at one end of the second support arm (336) away from the movable plate (335), a rotatable rotating member (338) is provided on the rotating seat (337), an angle adjustment motor (339) is provided on one side of the rotating seat (337), one end of the main shaft of the angle adjustment motor (339) is connected to the rotating member (338), one group of the visual detection modules (301) is provided at the bottom of the rotating member (338), and a gyroscope (340) is provided at the top.

9. The chip substrate surface quality inspection device according to claim 1, characterized in that: A through groove is provided on the top of the tooling (105), a transparent silicone layer (108) for supporting the chip substrate (104) is arranged in the through groove, four groups of positioning protrusions (109) are arranged around the first installation through groove (102), the bottom of the transparent supporting glass (103) is in contact with the four groups of positioning protrusions (109), the workbench (101) and the top of the transparent supporting glass (103) are both provided with corresponding fixing grooves (110), and fixing blocks (111) are arranged in both groups of the fixing grooves (110).

10. A detection method for a chip substrate surface quality detection device according to any one of claims 1 to 9, characterized in that: The following steps are included: Step 1: Positioning operation; By starting two groups of cylinders (318) to push four groups of electromagnets (321) close to two groups of partitions (322), the distance between the electromagnets (321) and the magnetic attraction member (320) is shortened, so that the tooling (105) is adsorbed on the bottom of the two groups of partitions (322), and the tooling (105) with the chip substrate (104) is placed on the top of the transparent supporting glass (103) through the cooperation of the first screw slide (303) and the second screw slide (313), so that the four groups of laser receivers (202) at the bottom of the tooling (105) correspond one by one to the four groups of laser positioners (201) in the installation groove (107); Step 2: Fixed operation; The positioning motor (210) is started to drive the transmission column (211) to rotate, and the rotating column (213) is synchronously rotated through the transmission effect of the pulley (214) and the belt (215), thereby driving the two groups of sliders (206) to slide relatively on the first slide rail (205), and the first connecting column (207) at the top of the slider (206) drives the diagonal fixing claws (203) to move, so that the tooling (105) is clamped between the two groups of diagonal fixing claws (203) for fixation, ensuring that the chip substrate (104) is in the detection position; then, the two groups of cylinders (318) retract the pneumatic rods to move the four groups of electromagnets (321) upward, increase the distance between the electromagnets (321) and the magnetic attraction member (320), and release the adsorption of the tooling (105); Step 3: Switch detection; Starting the switching motor (302) to drive the second connecting column (309) to rotate 90 degrees counterclockwise, thereby driving the two groups of connecting beams (311) to rotate, so that one group of visual inspection modules (301) moves to the top of the chip substrate (104), and starting the horizontal adjustment motor (330) to rotate the mounting platform (331), so that the visual inspection module (301) rotates accordingly to inspect the top of the chip substrate (104); at the same time, starting the electric telescopic rod (219) to raise the other group of visual inspection modules (301) to inspect the bottom of the chip substrate (104); Step 4: Detection completed; After the detection is completed, the switching motor (302) is started to drive the second connecting column (309) to rotate 90 degrees clockwise, and at the same time, the electric telescopic rod (219) is retracted, so that the two groups of visual detection modules (301) move back to the initial position; the two groups of cylinders (318) extend the pneumatic rod to make the four groups of electromagnets (321) move downward, so that the tooling (105) is adsorbed by the four groups of magnetic suction parts (320) and the four groups of electromagnets (321), and the positioning motor (210) is started to reverse, driving the two groups of sliders (206) to slide in the opposite direction on the first slide rail (205), so that the two groups of diagonal fixed claws (203) release the tooling (105), and then through the reverse movement of the first screw slide (303) and the second screw slide (313), the tooling (105) on which the chip substrate (104) is placed is moved out from the top of the transparent supporting glass (103).

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