Probe card PCB design method and system and probe card PCB

Abstract

The invention provides a probe card PCB design method and system and a probe card PCB. The probe card PCB design method comprises the following steps that an overcurrent protection device is arranged between a Force Line of an ATE power source and a probe bonding pad; and performing over-current protection on the probe of the probe card by using the over-current protection device to complete the PCB design of the probe card. According to the technical scheme, in the testing process, when the chip power source generates large current and the current is larger than the fusing current of the over-current protection device, the over-current protection device is fused, the current loop is cut off, so that the probe is protected, only the over-current protection device needs to be replaced, the maintenance cost is greatly reduced, and the maintenance period is greatly shortened.

Description

Background Art

[0002] The probe card is a device between the automatic test system (ATE) and the semiconductor wafer, used to test the semiconductor wafer before packaging. During the test process, the power pins of some chips on the wafer will generate a transient large current in some cases. The current flows through the probes of the probe card. Because the current resistance of the probes is limited, the probes will be melted due to the transient high temperature, which is also called burnt needles. The maintenance cycle and cost after burnt needles are often high. Summary of the invention

[0003] The present application provides a probe card PCB design method, system and probe card PCB board to solve the problem of chip power pin burnout.

[0004] In a first aspect, a probe card PCB design method is provided, comprising the following steps:

[0005] An overcurrent protection device is provided between the Force Line of the ATE power supply and the probe pad;

[0006] The overcurrent protection device is used to perform overcurrent protection on the probes of the probe card, thereby completing the probe card PCB design.

[0007] In the above technical solution, an overcurrent protection device is set between the Force Line of the ATE power supply and the probe pad; the overcurrent protection device is used to perform overcurrent protection on the probe of the probe card to complete the probe card PCB design; during the test process, when the chip power supply generates a large current, when the current is greater than the fuse current of the overcurrent protection device, the overcurrent protection device fuses and cuts off the current loop to protect the probe. In this case, only the overcurrent protection device needs to be replaced, and the maintenance cost and maintenance cycle are greatly reduced.

[0008] In a specific embodiment, it also includes:

[0009] Select the overcurrent protection device.

[0010] In a specific implementation scheme, the step of selecting the overcurrent protection device specifically includes:

[0011] Acquire the current resistance parameter information Imax of the probe of the probe card;

[0012] The overcurrent protection device is selected using the current carrying parameter information Imax.

[0013] In a specific implementation scheme, the step of obtaining the flow resistance parameter information Imax of the probe of the probe card is specifically as follows:

[0014] Confirming the model of the probe of the probe card that meets the chip test specifications;

[0015] According to the model of the probe of the probe card, the current resistance parameter information Imax of the probe of the probe card is obtained.

[0016] In a specific implementation scheme, the selection conditions of the overcurrent protection device are:

[0017] The fusing current parameter of the overcurrent protection device is less than the current resistance parameter information Imax of the probe of the probe card.

[0018] In a second aspect, a probe card PCB design system is provided, comprising:

[0019] Design module for setting overcurrent protection device between Force Line and probe pad of ATE power supply;

[0020] A drawing module is used to use the overcurrent protection device to perform overcurrent protection on the probes of the probe card, thereby completing the PCB design of the probe card.

[0021] In the above technical solution, an overcurrent protection device is set between the Force Line of the ATE power supply and the probe pad; the overcurrent protection device is used to perform overcurrent protection on the probe of the probe card to complete the probe card PCB design; during the test process, when the chip power supply generates a large current, when the current is greater than the fuse current of the overcurrent protection device, the overcurrent protection device fuses and cuts off the current loop to protect the probe. In this case, only the overcurrent protection device needs to be replaced, and the maintenance cost and maintenance cycle are greatly reduced.

[0022] In a specific embodiment, it also includes:

[0023] A selection module is used to select the overcurrent protection device.

[0024] In a third aspect, a probe card PCB board is provided, comprising: an overcurrent protection device, wherein:

[0025] The overcurrent protection device is arranged between the Force Line of the ATE power supply and the probe pad.

[0026] In the above technical solution, an overcurrent protection device is set between the Force Line of the ATE power supply and the probe pad; the overcurrent protection device is used to perform overcurrent protection on the probe of the probe card to complete the probe card PCB design; during the test process, when the chip power supply generates a large current, when the current is greater than the fuse current of the overcurrent protection device, the overcurrent protection device fuses and cuts off the current loop to protect the probe. In this case, only the overcurrent protection device needs to be replaced, and the maintenance cost and maintenance cycle are greatly reduced.

[0027] In a specific implementation manner, the Sense Line of the ATE power supply is connected to the probe pad.

[0028] In a specific implementation manner, the overcurrent protection device is a fuse device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A flowchart of a probe card PCB design method provided in an embodiment of the present application;

[0030] Figure 2 A structural block diagram of a probe card PCB design system provided in an embodiment of the present application;

[0031] Figure 3 A schematic diagram of the structure of a probe card PCB board provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The present application is further described in detail below through the accompanying drawings and embodiments. Through these descriptions, the characteristics and advantages of the present application will become clearer and more specific.

[0033] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. Although various aspects of the embodiments are shown in the drawings, the drawings are not necessarily drawn to scale unless otherwise noted.

[0034] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0035] To facilitate understanding of the probe card PCB design method, system and probe card PCB board provided in the embodiment of the present application, its application scenario is first explained. The probe card PCB design method, system and probe card PCB board provided in the embodiment of the present application are used to solve the problem of chip power pin burning. The probe card is a device between the automatic test system (ATE) and the semiconductor wafer, used to test the semiconductor wafer before packaging. During the test process, the power pin of some chips on the wafer will generate a transient large current in some cases. The current flows through the probe of the probe card. Because the current resistance of the probe is limited, the probe will melt due to the transient high temperature, which is also called burning the needle. The maintenance cycle and cost after burning the needle are often high. For this reason, the embodiment of the present application provides a probe card PCB design method, system and probe card PCB board to solve the problem of chip power pin burning. The following is a detailed description of the embodiment in conjunction with specific drawings.

[0036] refer to Figures 1 to 3 , Figure 1A flowchart of a probe card PCB design method provided in an embodiment of the present application; Figure 2 A structural block diagram of a probe card PCB design system provided in an embodiment of the present application; Figure 3 A schematic diagram of the structure of a probe card PCB board provided in an embodiment of the present application.

[0037] exist Figure 1 In the present application, an embodiment provides a probe card PCB design method, comprising the following steps:

[0038] An overcurrent protection device is provided between the Force Line of the ATE power supply and the probe pad;

[0039] The overcurrent protection device is used to perform overcurrent protection on the probes of the probe card, thereby completing the probe card PCB design.

[0040] In the above technical solution, an overcurrent protection device is set between the Force Line of the ATE power supply and the probe pad; the overcurrent protection device is used to perform overcurrent protection on the probe of the probe card to complete the probe card PCB design; during the test process, when the chip power supply generates a large current, when the current is greater than the fuse current of the overcurrent protection device, the overcurrent protection device fuses and cuts off the current loop to protect the probe. In this case, only the overcurrent protection device needs to be replaced, and the maintenance cost and maintenance cycle are greatly reduced.

[0041] In a specific embodiment, it also includes:

[0042] Select the overcurrent protection device.

[0043] In a specific implementation scheme, the step of selecting the overcurrent protection device specifically includes:

[0044] Acquire the current resistance parameter information Imax of the probe of the probe card;

[0045] The overcurrent protection device is selected using the current carrying parameter information Imax.

[0046] In a specific implementation scheme, the step of obtaining the flow resistance parameter information Imax of the probe of the probe card is specifically as follows:

[0047] Confirming the model of the probe of the probe card that meets the chip test specifications;

[0048] According to the model of the probe of the probe card, the current resistance parameter information Imax of the probe of the probe card is obtained.

[0049] In a specific implementation scheme, the selection conditions of the overcurrent protection device are:

[0050] The fusing current parameter of the overcurrent protection device is less than the current resistance parameter information Imax of the probe of the probe card.

[0051] Specifically, the probe card PCB design method includes:

[0052] Confirm the model of the probe that meets the chip test specifications and obtain its current resistance parameter information Imax;

[0053] Draw the PCB schematic diagram, reserve a fuse device between the Force Line of the ATE power supply and the probe pad (PINPAD), connect the Sense Line of the ATE power supply to the probe pad, and select the fuse model according to the probe current withstand parameter Imax, and its fusing current parameter should be less than Imax.

[0054] exist Figure 2 In the present application, an embodiment provides a probe card PCB design system, including:

[0055] Design module for setting overcurrent protection device between Force Line and probe pad of ATE power supply;

[0056] A drawing module is used to use the overcurrent protection device to perform overcurrent protection on the probes of the probe card, thereby completing the PCB design of the probe card.

[0057] In the above technical solution, an overcurrent protection device is set between the Force Line of the ATE power supply and the probe pad; the overcurrent protection device is used to perform overcurrent protection on the probe of the probe card to complete the probe card PCB design; during the test process, when the chip power supply generates a large current, when the current is greater than the fuse current of the overcurrent protection device, the overcurrent protection device fuses and cuts off the current loop to protect the probe. In this case, only the overcurrent protection device needs to be replaced, and the maintenance cost and maintenance cycle are greatly reduced.

[0058] In a specific embodiment, it also includes:

[0059] A selection module is used to select the overcurrent protection device.

[0060] exist Figure 3 In the embodiment of the present application, a probe card PCB board is provided, including: an overcurrent protection device, wherein:

[0061] The overcurrent protection device is arranged between the Force Line of the ATE power supply and the probe pad.

[0062] In the above technical solution, an overcurrent protection device is set between the Force Line of the ATE power supply and the probe pad; the overcurrent protection device is used to perform overcurrent protection on the probe of the probe card to complete the probe card PCB design; during the test process, when the chip power supply generates a large current, when the current is greater than the fuse current of the overcurrent protection device, the overcurrent protection device fuses and cuts off the current loop to protect the probe. In this case, only the overcurrent protection device needs to be replaced, and the maintenance cost and maintenance cycle are greatly reduced.

[0063] In a specific implementation manner, the Sense Line of the ATE power supply is connected to the probe pad.

[0064] In a specific implementation manner, the overcurrent protection device is a fuse device.

[0065] Specifically, refer to Figure 3 , DPS stands for Device Power Supply. During the test, when the chip power supply generates a large current, when the current is greater than the fuse melting current, the fuse will blow, cutting off the current loop to protect the probe. In this case, you only need to replace the fuse, which greatly reduces the maintenance cost and maintenance cycle.

[0066] Those skilled in the art will appreciate that the present application may be implemented as a system, method or computer program product.

[0067] Therefore, the present disclosure may be specifically implemented in the following forms, namely: it may be completely hardware, it may be completely software (including firmware, resident software, microcode, etc.), or it may be a combination of hardware and software, generally referred to herein as a "circuit", "module" or "system". In addition, in some embodiments, the present application may also be implemented in the form of a computer program product in one or more computer-readable media, and the computer-readable medium may contain computer-readable program code.

[0068] Any combination of one or more computer-readable media can be used. Computer-readable media can be computer-readable signal media or computer-readable storage media. Computer-readable storage media can be, for example, but not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or devices, or any combination of the above. More specific examples (non-exhaustive list) of computer-readable storage media include: electrical connections with one or more wires, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above. In this document, computer-readable storage media can be any tangible medium containing or storing a program, which can be used by an instruction execution system, device or device or used in combination with it.

[0069] Although the embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and cannot be understood as limiting the present application. A person of ordinary skill in the art can change, modify, replace and modify the above embodiments within the scope of the present application. On this basis, a variety of replacements and improvements can be made to the present application, all of which fall within the scope of protection of the present application.

Claims

1. A probe card PCB design method, characterized in that: The following steps are involved: An overcurrent protection device is provided between the Force Line of the ATE power supply and the probe pad; The overcurrent protection device is used to perform overcurrent protection on the probes of the probe card, thereby completing the probe card PCB design.

2. The probe card PCB design method according to claim 1, characterized in that: Also includes: Select the overcurrent protection device.

3. The probe card PCB design method according to claim 2, characterized in that: The step of selecting the overcurrent protection device specifically includes: Acquire the current resistance parameter information Imax of the probe of the probe card; The overcurrent protection device is selected using the current carrying parameter information Imax.

4. The probe card PCB design method according to claim 3, characterized in that: The step of obtaining the current resistance parameter information Imax of the probe of the probe card is specifically as follows: Confirming the model of the probe of the probe card that meets the chip test specifications; According to the model of the probe of the probe card, the current resistance parameter information Imax of the probe of the probe card is obtained.

5. The probe card PCB design method according to claim 4, characterized in that: The selection conditions of the overcurrent protection device are: The fusing current parameter of the overcurrent protection device is less than the current resistance parameter information Imax of the probe of the probe card.

6. A probe card PCB design system, characterized in that: include: Design module for setting overcurrent protection device between Force Line and probe pad of ATE power supply; A drawing module is used to use the overcurrent protection device to perform overcurrent protection on the probes of the probe card, thereby completing the PCB design of the probe card.

7. The probe card PCB design system according to claim 6, characterized in that: Also includes: A selection module is used to select the overcurrent protection device.

8. A probe card PCB board, characterized in that: include: Overcurrent protection devices, where The overcurrent protection device is arranged between the Force Line of the ATE power supply and the probe pad.

9. The probe card PCB board according to claim 8, characterized in that: The Sense Line of the ATE power supply is connected to the probe pad.

10. The probe card PCB board according to claim 8, characterized in that: The overcurrent protection device is a fuse device.

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