Display module, electronic equipment, alignment jig and preparation method of display module

Abstract

The embodiment of the invention provides a display module, electronic equipment, an alignment jig and a preparation method of the display module. The display module comprises a first circuit board and a second circuit board, the first circuit board comprises a first connecting area and a first positioning hole located in the first connecting area; the second circuit board comprises a second connecting area, and a second positioning hole and a first through hole which are positioned in the second connecting area; wherein the first connecting area and the second connecting area are arranged in a stacked mode, the first positioning hole is communicated with the second positioning hole, the first circuit board covers the first through hole, and the positioning column is aligned to the first connecting area and the second connecting area in a mode of penetrating through the first positioning hole and the second positioning hole. The first circuit board covers the first through hole, and the first circuit board is adsorbed to the second circuit board by communicating the adsorption device with the first through hole, so that the probability of deviation in the alignment binding process can be reduced. Therefore, the alignment precision of the first circuit board and the second circuit board is improved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display module, an electronic device, an alignment fixture, and a method for preparing the display module. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the process performance of current display modules needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display module, an electronic device, an alignment fixture, and a method for manufacturing the display module, aiming to improve the process performance of the display module.

[0005] An embodiment of the first aspect of the present application provides a display module, comprising: a first circuit board and a second circuit board; the first circuit board comprises a first connection area and a first positioning hole located in the first connection area; the second circuit board comprises a second connection area and a second positioning hole and a first through hole located in the second connection area; wherein the first connection area and the second connection area are stacked, the first positioning hole and the second positioning hole are connected, and the first circuit board covers the first through hole, so that the first circuit board can be adsorbed on the second circuit board through the first through hole.

[0006] According to an embodiment of the present application, the first circuit board further includes a first connection portion located in the first connection area, and the second circuit board further includes a second connection portion located in the second connection area, and the first connection portion and the second connection portion are connected.

[0007] According to an embodiment of the present application, the first through hole is disposed on at least one side of the circumference of the second connecting portion.

[0008] According to an embodiment of the present application, the second circuit board includes at least two first through holes that are spaced apart from each other.

[0009] According to an embodiment of the present application, the first connecting part includes a plurality of first solder pads arranged at intervals along a first direction, the second connecting part includes a plurality of second solder pads arranged at intervals along the first direction, each first solder pad and each second solder pad are connected to each other, and the first through hole is located on at least one side of the second connecting part in the first direction.

[0010] According to an embodiment of the present application, the first circuit board also includes a first wire, which is connected to each first solder pad and extends along the second direction. The second circuit board also includes a second wire, which is connected to each second solder pad and extends along the second direction. The first direction and the second direction are arranged to intersect.

[0011] According to an embodiment of the present application, the first positioning hole is disposed on at least one side of the circumference of the first connecting portion, and the second positioning hole is disposed on at least one side of the circumference of the second connecting portion.

[0012] According to an embodiment of the present application, the first circuit board includes at least two first positioning holes, the second circuit board includes at least two second positioning holes, and each first positioning hole and each second positioning hole are connected to each other.

[0013] According to an embodiment of the present application, the first positioning hole is disposed on at least one side of the first connecting portion along the first direction, and the second positioning hole is disposed on at least one side of the second connecting portion along the first direction.

[0014] According to an embodiment of the present application, the first positioning hole includes a first segment and a second segment that are connected, the first segment extends along a first direction, the second segment extends along a second direction, and the first direction and the second direction intersect.

[0015] According to an embodiment of the present application, one end of the second segment is connected to one end of the first segment.

[0016] According to an embodiment of the present application, the first direction and the second direction are perpendicular to each other.

[0017] According to an embodiment of the present application, the second positioning hole includes a third segment and a fourth segment that are connected, the third segment extends along the first direction, the fourth segment extends along the second direction, and the first direction and the second direction intersect.

[0018] According to an embodiment of the present application, one end of the fourth segment is connected to one end of the third segment.

[0019] An embodiment of the second aspect of the present application further provides an electronic device, comprising the display module in any embodiment of the first aspect mentioned above.

[0020] The embodiment of the third aspect of the present application also provides a positioning jig for aligning the display module in any embodiment of the first aspect, the positioning jig comprising: a main body, a positioning column and an air hole; the main body comprises a first surface, the positioning column is protrudingly arranged on the first surface of the main body; the air hole is used to connect a negative pressure device, and the air hole comprises an opening located on the first surface.

[0021] According to an embodiment of the present application, the positioning column is telescopically arranged along a direction perpendicular to the first surface.

[0022] According to an embodiment of the present application, the alignment jig further includes a pressing structure, which is arranged opposite to the first surface and is movably arranged in a direction perpendicular to the first surface.

[0023] According to an embodiment of the present application, the positioning column includes a first section, an elastic member and a second section, the elastic member is connected between the first section and the second section, the main body is provided with a positioning groove, the first section is fixed in the positioning groove, and the second section protrudes from the first surface.

[0024] According to an embodiment of the present application, part of the second sub-portion is located in the positioning groove.

[0025] According to an embodiment of the present application, the positioning column includes a first section and a second section connected to each other, the first section extends along a first direction, the second section extends along a second direction, and the first direction and the second direction intersect each other.

[0026] According to an embodiment of the present application, one end of the second section is connected to one end of the first section.

[0027] According to an embodiment of the present application, the first direction and the second direction are perpendicular to each other.

[0028] According to an embodiment of the present application, the alignment fixture includes at least two positioning posts that are spaced apart.

[0029] According to an embodiment of the present application, the alignment fixture further includes at least two air holes arranged at intervals.

[0030] According to an embodiment of the present application, the positioning posts are arranged at intervals along the first direction, and the air holes are arranged at intervals along the first direction.

[0031] The fourth aspect of the present application also provides a method for preparing a display module, using the alignment jig in any one of the embodiments of the third aspect, the preparation method comprising:

[0032] The second circuit board is arranged on the first surface, and the second circuit board comprises a second connection area and a second positioning hole and a first through hole located in the second connection area. The second positioning hole is sleeved on the positioning column, and the first through hole is connected with the air hole through an opening.

[0033] The first circuit board is arranged on the side of the second circuit board away from the first surface, the first circuit board comprises a first connection area and a first positioning hole located in the first connection area. The first positioning hole is sleeved on the positioning column, and the first circuit board covers the first through hole;

[0034] The air holes adsorb the first circuit board onto a side of the second circuit board away from the first surface.

[0035] The first circuit board and the second circuit board are connected.

[0036] In the embodiment of the present application, the positioning column aligns the first connection area and the second connection area by penetrating the first positioning hole and the second positioning hole. The first circuit board covers the first through hole, and the first circuit board is adsorbed to the second circuit board by connecting the adsorption device to the first through hole, thereby reducing the probability of relative displacement of the first connection area and the second connection area during the alignment and binding process. This improves the alignment accuracy of the first circuit board and the second circuit board, which is conducive to improving the production efficiency and product yield of the display module, thereby improving the process performance of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.

[0038] Figure 1 is a schematic diagram of a partial structure of a first circuit board provided in an embodiment of the present application;

[0039] Figure 2 is a schematic diagram of a partial structure of a second circuit board provided in an embodiment of the present application;

[0040] Figure 3 It is a partial structural schematic diagram of a first circuit board and a second circuit board provided in an embodiment of the present application;

[0041] Figure 4 It is a structural schematic diagram of an alignment fixture provided in an embodiment of the present application;

[0042] Figure 5 It is a structural schematic diagram of another alignment fixture provided in an embodiment of the present application;

[0043] Figure 6 This is a schematic diagram of an alignment process of an alignment fixture provided in an embodiment of the present application;

[0044] Figure 7 This is a schematic diagram of another alignment process of an alignment fixture provided in an embodiment of the present application;

[0045] Figure 8 It is a flow chart of a method for preparing a display module provided in an embodiment of the present application.

[0046] Description of reference numerals: 100, first circuit board; 110, first connection area; 120, first positioning hole; 121, first segment; 122, second segment; 130, first connection portion; 131, first pad; 132, first conductor; 200, second circuit board; 210, second connection area; 220, second positioning hole; 221, third segment; 222, fourth segment; 230, first through hole; 240, second connection portion; 2 41. second solder pad; 242. second conductive line; 300. main body; 310. first surface; 320. air hole; 330. positioning groove; 400. positioning column; 410. first division; 420. elastic member; 430. second division; 440. first section; 450. second section; 500. pressing structure; 600. first copper leakage area; 700. second copper leakage area; X. first direction; Y. second direction; Z. thickness direction. DETAILED DESCRIPTION

[0047] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0048] In the description of the present application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating directions or positional relationships, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0049] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0050] like Figures 1 to 3 As shown, a display module provided by an embodiment of the first aspect of the present application includes: a first circuit board 100 and a second circuit board 200, the first circuit board 100 includes a first connection area 110 and a first positioning hole 120 located in the first connection area 110; the second circuit board 200 includes a second connection area 210 and a second positioning hole 220 and a first through hole 230 located in the second connection area 210; wherein the first connection area 110 and the second connection area 210 are stacked, the first positioning hole 120 and the second positioning hole 220 are connected, and the first circuit board 100 covers the first through hole 230, so that the first circuit board 100 can be adsorbed on the second circuit board 200 through the first through hole 230.

[0051] In this embodiment, the first positioning hole 120 and the second positioning hole 220 are connected, and the positioning column 400 aligns the first connection area 110 and the second connection area 210 by penetrating the first positioning hole 120 and the second positioning hole 220. The first circuit board 100 covers the first through hole 230, and the first circuit board 100 is adsorbed on the second circuit board 200 by connecting the adsorption device to the first through hole 230, thereby reducing the probability of relative displacement of the first connection area 110 and the second connection area 210 during the alignment and binding process. In some embodiments, the first connection area 110 of the first circuit board 100 is aligned and pressed to the second connection area 210 of the second circuit board 200, and in the process of releasing the pressure applied to the first circuit board 100, the first connection area 110 of the first circuit board 100 has a tendency to move in a direction away from the second connection area 210. In the present embodiment, the first circuit board 100 is adsorbed onto the second circuit board 200 through the first through hole 230, thereby reducing the probability of the first connection area 110 and the second connection area 210 being separated from each other, thereby improving the alignment accuracy of the first circuit board 100 and the second circuit board 200, which is beneficial to improving the production efficiency and product yield of the display module, thereby improving the process performance of the display module.

[0052] like Figure 1 and Figure 2As shown, in some optional embodiments, the first circuit board 100 further includes a first connection portion 130 located in the first connection area 110, and the second circuit board 200 further includes a second connection portion 240 located in the second connection area 210, and the first connection portion 130 and the second connection portion 240 are connected.

[0053] In these optional embodiments, the first connection portion 130 and the second connection portion 240 are electrically connected to each other, so that the first circuit board 100 and the second circuit board 200 can transmit electrical signals through the first connection portion 130 and the second connection portion 240 .

[0054] Optionally, the display module includes a touch electrode and a driving integrated circuit, the first circuit board 100 is electrically connected to the touch electrode, the second circuit board 200 is electrically connected to the integrated circuit, and the first connection portion 130 and the second connection portion 240 are electrically connected to each other so as to transmit a touch electrical signal. Alternatively, the first circuit board 100 is electrically connected to the integrated circuit, and the second circuit board 200 is electrically connected to the touch electrode.

[0055] Optional, such as Figure 2 As shown, the first through hole 230 is disposed on at least one side of the second connection portion 240. The first through hole 230 is located on at least one side of the second connection portion 240, so that the first through hole 230 can be disposed adjacent to the second connection portion 240, thereby improving the bonding strength between the first connection portion 130 and the second connection portion 240.

[0056] Optional, such as Figure 2 As shown, the second circuit board 200 includes at least two first through holes 230 spaced apart. The number of the first through holes 230 includes at least two, which can increase the adsorption force on the first circuit board 100 and make the force of the first through holes 230 on the first circuit board 100 more balanced.

[0057] Optionally, the first through hole 230 may be centrally symmetrically disposed in the second connection region 210 .

[0058] Optional, such as Figure 1 and Figure 2As shown, the first connection part 130 includes a plurality of first pads 131 arranged at intervals along the first direction X, the second connection part 240 includes a plurality of second pads 241 arranged at intervals along the first direction X, each first pad 131 and each second pad 241 are connected to each other, and the first through hole 230 is located at least on one side of the second connection part 240 in the first direction X. The plurality of first pads 131 are arranged at intervals along the first direction X, and one side of the first pad 131 along the second direction Y is used to set the connecting wire, the plurality of second pads 241 are arranged at intervals along the first direction X, and one side of the second pad 241 along the second direction Y is used to set the connecting wire, and the first through hole 230 is arranged at least on one side of the second pad 241 along the first direction X, thereby reducing the influence of the first through hole 230 on the wiring of the connecting wire of the second pad 241, thereby improving the wiring density and simplifying the wiring design scheme.

[0059] Optional, such as Figure 1 and Figure 2 As shown, the first circuit board 100 further includes a first wire 132, the first wire 132 is connected to each first pad 131 and extends along the second direction Y, the second circuit board 200 further includes a second wire 242, the second wire 242 is connected to each second pad 241 and extends along the second direction Y, and the first direction X and the second direction Y are arranged to intersect. The second wire 242 is connected to the second pad 241 and extends along the second direction Y, and the first through hole 230 is arranged on at least one side of the second pad 241 along the first direction X, so as to reduce the influence of the first through hole 230 on the routing of the second wire 242.

[0060] Optional, such as Figure 2 As shown, the second copper leakage area 700 is provided on both sides of the second connection part 240 along the first direction X, and the second copper leakage area 700 is covered with conductive ink to release or guide the electrostatic charge accumulated on the circuit board. And the second copper leakage area 700 is provided on both sides of the second connection part 240 in the first direction X, so as to reduce the influence of the second copper leakage area 700 on the wiring of the second wire 242.

[0061] Optional, such as Figure 2 As shown, the first through hole 230 is located in the second copper leakage area 700 , thereby reducing the influence of the first through hole 230 on the wiring of the second conductive line 242 .

[0062] Optional, such as Figure 2 As shown, the number of the first through holes 230 is at least two, and they are disposed on both sides of the second pad 241 along the first direction X.

[0063] like Figure 1 and Figure 2As shown, in some optional embodiments, the first positioning hole 120 is disposed on at least one side of the first connection portion 130 , and the second positioning hole 220 is disposed on at least one side of the second connection portion 240 .

[0064] In these optional embodiments, the first positioning hole 120 can be disposed adjacent to the first connection portion 130, and the second positioning hole 220 can be disposed adjacent to the second connection portion 240, thereby improving the alignment accuracy of the first connection portion 130 and the second connection portion 240. Optionally, at least one of the first circuit board 100 and the second circuit board 200 is a flexible circuit board, and disposing the first positioning hole 120 close to the first connection portion 130 can reduce the influence of the deformation of the first circuit board 100 on the alignment accuracy, and disposing the second positioning hole 220 close to the second connection portion 240 can reduce the influence of the deformation of the second circuit board 200 on the alignment accuracy.

[0065] like Figures 1 to 3 As shown, optionally, the first circuit board 100 includes at least two first positioning holes 120, the second circuit board 200 includes at least two second positioning holes 220, and each first positioning hole 120 and each second positioning hole 220 are connected to each other. At least two first positioning holes 120 and at least two second positioning holes 220 are provided, and increasing the number of positioning holes can improve the alignment accuracy and can prevent the first circuit board 100 and the second circuit board 200 from rotating relative to each other.

[0066] Optional, such as Figure 1 and Figure 2 As shown, the first positioning hole 120 is arranged on at least one side of the first connecting portion 130 along the first direction X, and the second positioning hole 220 is arranged on at least one side of the second connecting portion 240 along the first direction X, thereby reducing the influence of the first positioning hole 120 and the second positioning hole 220 on the wiring of the first wire 132 and the second wire 242.

[0067] Optional, such as Figure 1 and Figure 2 As shown, the first copper leakage area 600 is provided on both sides of the first connection part 130 along the first direction X, and the first positioning hole 120 is located in the first copper leakage area 600 on both sides of the first connection part 130 along the first direction X. Optionally, the second positioning hole 220 is located in the second copper leakage area 700. The first copper leakage area 600 is covered with conductive ink to release or derive the electrostatic charge accumulated on the circuit board. And the first copper leakage area 600 is arranged on both sides of the first connection part 130 in the first direction X, so as to reduce the influence of the first copper leakage area 600 on the wiring of the first wire 132.

[0068] like Figure 1As shown, in some optional embodiments, the first positioning hole 120 includes a first segment 121 and a second segment 122 that are connected, the first segment 121 extends along a first direction X, the second segment 122 extends along a second direction Y, and the first direction X and the second direction Y intersect.

[0069] In these optional embodiments, the first segment 121 is extended along the first direction X, thereby increasing the size of the first positioning hole 120 along the first direction X, and the second segment 122 is extended along the second direction Y, thereby increasing the size of the first positioning hole 120 along the second direction Y, and reducing the influence of the opening error on the positioning accuracy of the first positioning hole 120. In some embodiments, when the positioning hole includes a segment, the segment needs to extend along the first direction X and the second direction Y at the same time, which increases the opening area of ​​the positioning hole, which is not conducive to improving the structural strength of the circuit board, and also increases the wiring difficulty of the circuit board. In this embodiment, the first segment 121 extends along the first direction X, and the second segment 122 extends along the second direction Y, which can reduce the width of the first segment 121 along the second direction Y and the width of the second segment 122 along the first direction X, thereby reducing the opening area of ​​the first positioning hole 120, which is conducive to improving the structural strength of the first circuit board 100 and reducing the wiring difficulty of the first circuit board 100.

[0070] like Figure 1 As shown, optionally, one end of the second segment 122 is connected to one end of the first segment 121, so that the first positioning hole 120 forms an "L"-shaped hole. The "L"-shaped hole has less impact on the structural stability of the first circuit board 100, thereby improving the positioning accuracy of the first positioning hole 120.

[0071] Optionally, the first direction X and the second direction Y are perpendicular to each other, so that the first positioning hole 120 is easy to process. Optionally, the first direction X and the second direction Y are both perpendicular to the thickness direction Z of the first circuit board 100 .

[0072] like Figure 2 As shown, in some optional embodiments, the second positioning hole 220 includes a third segment 221 and a fourth segment 222 that are connected, the third segment 221 extends along the first direction X, the fourth segment 222 extends along the second direction Y, and the first direction X and the second direction Y intersect.

[0073] In these optional embodiments, the third segment 221 is extended along the first direction X, thereby increasing the size of the second positioning hole 220 along the first direction X, and the fourth segment 222 is extended along the second direction Y, thereby increasing the size of the second positioning hole 220 along the second direction Y, reducing the influence of the opening error on the positioning accuracy of the second positioning hole 220. The third segment 221 extends along the first direction X, and the fourth segment 222 extends along the second direction Y, which can reduce the width of the third segment 221 along the second direction Y and the width of the fourth segment 222 along the first direction X, thereby reducing the opening area of ​​the second positioning hole 220, which is beneficial to improving the structural strength of the second circuit board 200 and reducing the wiring difficulty of the second circuit board 200.

[0074] like Figure 2 As shown, optionally, one end of the fourth segment 222 is connected to one end of the third segment 221, so that the second positioning hole 220 forms an "L"-shaped hole. The "L"-shaped hole has little effect on the structural stability of the second circuit board 200, thereby improving the positioning accuracy of the second positioning hole 220.

[0075] The embodiment of the second aspect of the present application also provides an electronic device, including the display module of any of the above-mentioned first aspect embodiments. Since the electronic device provided by the embodiment of the second aspect of the present application includes the display module of any of the above-mentioned first aspect embodiments, the electronic device provided by the embodiment of the second aspect of the present application has the beneficial effects of the display module of any of the above-mentioned first aspect embodiments, which will not be repeated here.

[0076] The electronic devices in the embodiments of the present application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, smart watches, smart bracelets, etc.

[0077] like Figures 4 to 6 As shown, an embodiment of the third aspect of the present application further provides an alignment jig for aligning the display module in any one of the first aspect mentioned above, the alignment jig comprises: a main body 300, a positioning column 400 and an air hole 320, the main body 300 comprises a first surface 310, the positioning column 400 is protrudingly disposed on the first surface 310 of the main body 300; the air hole 320 is used to connect a negative pressure device, and the air hole 320 comprises an opening located on the first surface 310.

[0078] In this embodiment, the first surface 310 of the body 300 is used to carry the first circuit board 100 and the second circuit board 200. The second circuit board 200 is attached to the first surface 310, and the first circuit board 100 is arranged on the side of the second circuit board 200 away from the first surface 310. The positioning column 400 is used to penetrate the first positioning hole 120 and the second positioning hole 220, so that the first connection area 110 and the second connection area 210 are aligned. The air hole 320 includes an opening located on the first surface 310, and the opening is used to connect to the first through hole 230. The first circuit board 100 covers the first through hole 230 to close the first through hole 230. After the air hole 320 is connected to the negative pressure device, the negative pressure device forms a negative pressure in the first through hole 230 to adsorb the first circuit board 100 to the second circuit board 200 and press the second circuit board 200 to the first surface 310, so as to maintain the relative position of the first circuit board 100 and the second circuit board 200, thereby reducing the probability of separation of the first circuit board 100 and the second circuit board 200.

[0079] like Figure 4 As shown, in some optional embodiments, the positioning column 400 is telescopically arranged along a direction perpendicular to the first surface 310 .

[0080] In these optional embodiments, the positioning post 400 is retractable in a direction perpendicular to the first surface 310 , thereby increasing the height of the positioning post 400 in a direction perpendicular to the first surface 310 , thereby reducing the probability of the first circuit board 100 and the second circuit board 200 detaching from the positioning post 400 .

[0081] Optional, such as Figure 4 , Figure 6 and Figure 7 As shown, the alignment fixture further includes a pressing structure 500 , which is disposed opposite to the first surface 310 , and the pressing structure 500 is movably disposed along a direction perpendicular to the first surface 310 .

[0082] The pressing structure 500 moves in a direction close to the first surface 310 to press the first connection area 110 and the second connection area 210. The positioning column 400 is retractable in a direction perpendicular to the first surface 310. The positioning column 400 moves in a direction away from the pressing structure 500 under the pressure of the pressing structure 500, thereby reducing the influence of the positioning column 400 on the pressing effect of the pressing structure 500, and increasing the height of the positioning column 400 in a direction perpendicular to the first surface 310. Further, in the process of the pressing structure 500 moving in a direction close to the first surface 310, the negative pressure device forms a negative pressure in the first through hole 230 to adsorb the first circuit board 100 to the second circuit board 200 and press the second circuit board 200 to the first surface 310, so as to maintain the relative position of the first circuit board 100 and the second circuit board 200, thereby improving the alignment accuracy.

[0083] Optional, such as Figure 4 As shown, the positioning column 400 includes a first section 410, an elastic member 420 and a second section 430, the elastic member 420 is connected between the first section 410 and the second section 430, the main body 300 is provided with a positioning groove 330, the first section 410 is fixed in the positioning groove 330, and the second section 430 protrudes from the first surface 310. The first section 410 is located in the positioning groove 330 to achieve mutual fixation with the main body 300, the second section 430 protrudes from the first surface 310 and can be set through the first positioning hole 120 and the second positioning hole 220, and the elastic member 420 is connected between the first section 410 and the second section 430 so that the second section 122 can be retracted.

[0084] Optional, such as Figure 4 As shown, part of the second section 430 is located in the positioning groove 330 , and the positioning groove 330 can play a positioning role for the second section 430 .

[0085] like Figure 5 As shown, in some optional embodiments, the positioning column 400 includes a first section 440 and a second section 450 connected to each other, the first section 440 extends along a first direction X, the second section 450 extends along a second direction Y, and the first direction X and the second direction Y intersect.

[0086] In these optional embodiments, the first section 440 is extended along the first direction X, thereby increasing the size of the first section 440 along the first direction X, and the second section 450 is extended along the second direction Y, thereby increasing the size of the second section 450 along the second direction Y, reducing the influence of the manufacturing accuracy of the positioning column 400 on the positioning accuracy.

[0087] Optional, such as Figure 5 As shown, one end of the second section 450 is connected to one end of the first section 440 , so that the positioning column 400 has better positioning accuracy, and the shape of the positioning column 400 is adapted to the shapes of the first positioning hole 120 and the second positioning hole 220 .

[0088] like Figure 5 As shown, in some optional embodiments, the alignment fixture includes at least two positioning posts 400 that are spaced apart.

[0089] In these optional embodiments, providing at least two positioning posts 400 can increase the positioning accuracy of the alignment fixture and can prevent the first circuit board 100 and the second circuit board 200 from rotating relative to each other.

[0090] Optional, such as Figure 5As shown, the alignment fixture further includes at least two spaced-apart air holes 320. Providing at least two air holes 320 can increase the adsorption force on the first circuit board 100 and reduce the probability of the first circuit board 100 and the second circuit board 200 being separated from the first surface 310.

[0091] Optional, such as Figure 5 As shown, the positioning posts 400 are arranged at intervals along the first direction X, and the air holes 320 are arranged at intervals along the first direction X. The positioning posts 400 and the air holes 320 are arranged at intervals along the first direction X, so that the first circuit board 100 and the second circuit board 200 can arrange the wires in the middle area of ​​the positioning posts 400 and the air holes 320 along the first direction X, thereby reducing the influence of the alignment fixture on the wiring of the first circuit board 100 and the second circuit board 200.

[0092] The fourth aspect of the present application also provides a method for preparing a display module, using the alignment jig in any embodiment of the third aspect, such as Figure 8 As shown, the preparation method comprises:

[0093] Step S01: Figure 6 As shown, the second circuit board 200 is arranged on the first surface 310, and the second circuit board 200 includes a second connection area 210 and a second positioning hole 220 and a first through hole 230 located in the second connection area 210. The second positioning hole 220 is sleeved on the positioning column 400, and the first through hole 230 is connected to the air hole 320 through an opening.

[0094] Step S02: Figure 6 As shown, the first circuit board 100 is disposed on the side of the second circuit board 200 away from the first surface 310, and the first circuit board 100 includes a first connection area 110 and a first positioning hole 120 located in the first connection area 110. The first positioning hole 120 is sleeved on the positioning column 400, and the first circuit board 100 covers the first through hole 230;

[0095] Step S03: Figure 6 As shown, the air holes 320 adsorb the first circuit board 100 onto the side of the second circuit board 200 away from the first surface 310 .

[0096] Step S04: connecting the first circuit board 100 and the second circuit board 200 .

[0097] In this embodiment, the second circuit board 200 is attached to the first surface 310, and the first circuit board 100 is disposed on the side of the second circuit board 200 away from the first surface 310. The positioning post 400 is used to penetrate the first positioning hole 120 and the second positioning hole 220, so that the first connection area 110 and the second connection area 210 are aligned. The air hole 320 includes an opening located on the first surface 310, and the opening is used to connect to the first through hole 230. The first circuit board 100 covers the first through hole 230 to close the first through hole 230. After the air hole 320 is connected to the negative pressure device, the negative pressure device forms a negative pressure in the first through hole 230 to adsorb the first circuit board 100 to the second circuit board 200 and press the second circuit board 200 to the first surface 310 to maintain the relative position of the first circuit board 100 and the second circuit board 200, thereby reducing the probability of separation of the first circuit board 100 and the second circuit board 200. At this time, when connecting the first circuit board 100 and the second circuit board 200, the connection accuracy can be improved, thereby improving the process performance of the display panel.

[0098] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display module, characterized in that: include: A first circuit board, comprising a first connection area and a first positioning hole located in the first connection area; A second circuit board includes a second connection area and a second positioning hole and a first through hole located in the second connection area; The first connection area and the second connection area are stacked, the first positioning hole and the second positioning hole are connected, and the first circuit board covers the first through hole, so that the first circuit board can be adsorbed on the second circuit board through the first through hole.

2. The display module according to claim 1, characterized in that: The first circuit board further includes a first connection portion located in the first connection area, and the second circuit board further includes a second connection portion located in the second connection area, wherein the first connection portion and the second connection portion are connected; Preferably, the first through hole is provided on at least one side of the circumference of the second connecting portion; Preferably, the second circuit board comprises at least two of the first through holes arranged at intervals; Preferably, the first connection portion includes a plurality of first pads spaced apart along a first direction, the second connection portion includes a plurality of second pads spaced apart along the first direction, each of the first pads and each of the second pads are connected to each other, and the first through hole is located at least on one side of the second connection portion in the first direction; Preferably, the first circuit board further includes a first wire, which is connected to each of the first pads and extends along a second direction, and the second circuit board further includes a second wire, which is connected to each of the second pads and extends along a second direction, and the first direction and the second direction are arranged to intersect.

3. The display module according to claim 2, characterized in that: The first positioning hole is provided on at least one side of the first connecting portion, and the second positioning hole is provided on at least one side of the second connecting portion; Preferably, the first circuit board includes at least two first positioning holes, the second circuit board includes at least two second positioning holes, and each of the first positioning holes and each of the second positioning holes are connected to each other; Preferably, the first positioning hole is disposed on at least one side of the first connecting portion along the first direction, and the second positioning hole is disposed on at least one side of the second connecting portion along the first direction.

4. The display module according to claim 1, characterized in that: The first positioning hole includes a first segment and a second segment that are connected, the first segment is extended along a first direction, the second segment is extended along a second direction, and the first direction and the second direction are intersecting; Preferably, one end of the second segment is connected to one end of the first segment; Preferably, the first direction and the second direction are perpendicular to each other.

5. The display module according to claim 1, characterized in that: The second positioning hole includes a third segment and a fourth segment which are connected to each other, the third segment is extended along the first direction, the fourth segment is extended along the second direction, and the first direction and the second direction are intersected; Preferably, one end of the fourth segment is connected to one end of the third segment; Preferably, the first direction and the second direction are perpendicular to each other.

6. An electronic device, characterized in that: A display module comprising any one of claims 1 to 5.

7. A positioning fixture, characterized in that: Used for aligning the display module according to any one of claims 1 to 5, the alignment fixture comprises: A body portion including a first surface; A positioning column protruding from the first surface of the main body; The air hole is used to connect the negative pressure device, and the air hole includes an opening located on the first surface.

8. The alignment jig according to claim 7, characterized in that: The positioning column is telescopically arranged along a direction perpendicular to the first surface; Preferably, the alignment fixture further comprises a pressing structure, the pressing structure is arranged opposite to the first surface, and the pressing structure is movably arranged in a direction perpendicular to the first surface; Preferably, the positioning column comprises a first sub-section, an elastic member and a second sub-section, the elastic member is connected between the first sub-section and the second sub-section, the main body is provided with a positioning groove, the first sub-section is fixed in the positioning groove, and the second sub-section protrudes from the first surface; Preferably, part of the second sub-portion is located in the positioning groove; Preferably, the alignment fixture comprises at least two positioning posts arranged at intervals; Preferably, the alignment jig further comprises at least two air holes arranged at intervals; Preferably, the positioning posts are arranged at intervals along the first direction, and the air holes are arranged at intervals along the first direction.

9. The alignment jig according to claim 7, characterized in that: The positioning column comprises a first section and a second section connected to each other, the first section is extended along a first direction, the second section is extended along a second direction, and the first direction and the second direction are intersecting; Preferably, one end of the second section is connected to one end of the first section; Preferably, the first direction and the second direction are perpendicular to each other.

10. A method for preparing a display module, characterized in that: The alignment jig according to any one of claims 7 to 9 is used, and the preparation method comprises: The second circuit board is arranged on the first surface, wherein the second circuit board comprises a second connection area and a second positioning hole and a first through hole located in the second connection area, wherein the second positioning hole is sleeved on the positioning column, and the first through hole is connected to the air hole through the opening; The first circuit board is arranged on the side of the second circuit board away from the first surface, the first circuit board comprises a first connection area and a first positioning hole located in the first connection area, the first positioning hole is sleeved on the positioning column, and the first circuit board covers the first through hole; The air holes adsorb the first circuit board to the side of the second circuit board facing away from the first surface; The first circuit board and the second circuit board are connected.

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