Manufacturing method of packaging structure, packaging structure and electronic equipment
By cutting and wrapping the substrate structure with plastic sealing layer, the edge collapse, cracks and layering phenomena caused by stress concentration during chip packaging are solved, and the stability and reliability of the packaging structure are achieved.
Patent Information
- Application Number
- CN202411640340.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2025-02-28
AI Technical Summary
During chip packaging, stress concentration problems caused by the differences in properties between the glass substrate and other film layers may lead to product edge collapse, cracks and layering.
By cutting the substrate structure or the first plastic sealing layer or the first packaging layer, stress between the different film layers is reduced, and the first plastic sealing layer is completely wrapped around the surface and sides of the substrate structure to reduce the risk of layering phenomenon.
It effectively reduces problems such as edge collapse and cracks in the packaging structure during cutting, ensures the stability and reliability of the packaging structure, reduces the risk of layering, and improves the overall performance of the product.
Smart Images
Figure CN119542152A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a method for manufacturing a packaging structure, a packaging structure and an electronic device. Background Art
[0002] At present, in the chip packaging process, the redistribution layer and the stacking layer are usually directly processed based on the glass substrate, and then cut into a single package structure. However, during the cutting process, due to the difference in properties between the glass substrate and other film layers, stress concentration problems may occur, which may cause edge collapse and cracks in the product, and may also cause delamination. Summary of the invention
[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a method for manufacturing a packaging structure, a packaging structure and an electronic device.
[0004] In a first aspect, an embodiment of the present application provides a method for manufacturing a packaging structure, the method for manufacturing the packaging structure comprising:
[0005] Providing a substrate structure;
[0006] Disposing the substrate structure on a first carrier;
[0007] Plastic-sealing the substrate structure to form a first plastic-sealing layer;
[0008] forming a first packaging layer on a side of the first plastic packaging layer away from the first carrier;
[0009] removing the first carrier board;
[0010] forming a second encapsulation layer on a side of the substrate structure away from the first encapsulation layer;
[0011] Wherein, after the step of disposing the substrate structure on the first carrier and before the step of removing the first carrier, the method further includes:
[0012] The substrate structure or the first plastic packaging layer or the first encapsulation layer is cut.
[0013] In a possible implementation manner, a material of the first encapsulation layer includes insulating resin or polyimide, and a material of the second encapsulation layer includes insulating resin.
[0014] In a possible implementation, the step of providing a substrate structure includes:
[0015] Providing a substrate to be processed, the substrate to be processed comprising a substrate, a through hole penetrating the substrate, and a wiring layer located on a partial surface of the substrate via the through hole;
[0016] A filling layer is formed on the surface of the routing layer to obtain a substrate structure.
[0017] In a possible implementation, before the step of plastic-sealing the substrate structure to form a first plastic-sealing layer, the method further includes:
[0018] Etching the filling layer to form a plurality of grooves exposing the wiring layer;
[0019] A plurality of conductive pillars are respectively formed in the grooves, and the plurality of conductive pillars are respectively electrically connected to the wiring layer.
[0020] In a possible implementation, the step of forming a first encapsulation layer on a side of the first plastic encapsulation layer away from the first carrier includes:
[0021] Grinding the first plastic packaging layer to expose the conductive pillars;
[0022] A first packaging layer is formed on a side of the first plastic packaging layer away from the first carrier, and the first packaging layer is electrically connected to the conductive pillar.
[0023] In a possible implementation manner, the step of forming a second encapsulation layer on a side of the substrate structure away from the first encapsulation layer includes:
[0024] Disposing a second carrier on a side of the first packaging layer away from the substrate structure;
[0025] A second encapsulation layer is formed on a side of the substrate structure away from the first encapsulation layer.
[0026] In a possible implementation manner, after the step of forming a second encapsulation layer on a side of the substrate structure away from the first encapsulation layer, the method further includes:
[0027] A chip is arranged on a side of the first packaging layer away from the substrate structure.
[0028] In a possible implementation manner, after the step of arranging a chip on a side of the first packaging layer away from the substrate structure, the method further includes:
[0029] A second plastic packaging layer is formed on a side of the chip away from the substrate structure.
[0030] In a second aspect, an embodiment of the present application further provides a packaging structure, which is manufactured using the manufacturing method of the packaging structure described in the first aspect above.
[0031] In a third aspect, an embodiment of the present application further provides an electronic device, wherein the electronic device includes the packaging structure described in the second aspect.
[0032] Based on any one of the above aspects, the manufacturing method of the packaging structure, the packaging structure and the electronic device provided in the embodiments of the present application can effectively reduce the stress caused by different material properties between different film layers by cutting the substrate structure or the first plastic packaging layer or the first packaging layer, thereby avoiding problems such as edge collapse and cracks when cutting again after the packaging is completed, thereby ensuring the stability and reliability of the packaging structure. In addition, by setting the first plastic packaging layer to completely wrap the surface and sides of the substrate structure, the risk of delamination can be reduced, the overall performance of the product can be improved, and the yield loss of the process can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.
[0034] Figure 1 This is a schematic diagram of a process of manufacturing a packaging structure provided in this embodiment;
[0035] Figure 2 One of the manufacturing process schematic diagrams of the manufacturing method of the packaging structure provided in this embodiment;
[0036] Figure 3 A second schematic diagram of the manufacturing process of the packaging structure provided in this embodiment;
[0037] Figure 4a One of the cutting schematic diagrams provided for this embodiment;
[0038] Figure 4b The second cutting diagram provided for this embodiment;
[0039] Figure 5 The third manufacturing process diagram of the manufacturing method of the packaging structure provided in this embodiment;
[0040] Figure 6 A fourth manufacturing process diagram of the manufacturing method of the packaging structure provided in this embodiment;
[0041] Figure 7 A schematic diagram of sub-steps of step S110 provided in this embodiment;
[0042] Figure 8 A manufacturing process diagram of the substrate structure provided in this embodiment;
[0043] Fig. 9 A schematic diagram of the structure of the substrate provided in this embodiment;
[0044] Fig.10 A second flow chart of the method for manufacturing the packaging structure provided in this embodiment;
[0045] Fig.11 A schematic diagram of the manufacturing process of the conductive column provided in this embodiment;
[0046] Fig.12 A schematic diagram of sub-steps of step S140 provided in this embodiment;
[0047] Fig.13 A schematic diagram of sub-steps of step S160 provided in this embodiment;
[0048] Fig.14 A fifth manufacturing process diagram of the manufacturing method of the packaging structure provided in this embodiment;
[0049] Fig.15 A sixth manufacturing process diagram of the manufacturing method of the packaging structure provided in this embodiment;
[0050] Fig.16 This is the seventh manufacturing process schematic diagram of the manufacturing method of the packaging structure provided in this embodiment.
[0051] Icon: 100-substrate structure; 110-substrate; 120-wiring layer; 130-filling layer; 141-groove; 142-conductive column; 210-first carrier; 220-second carrier; 230-third carrier; 300-first plastic sealing layer; 400-first packaging layer; 500-second packaging layer; 600-chip; 700-second plastic sealing layer. DETAILED DESCRIPTION
[0052] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0053] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0054] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0055] In the description of this application, it should be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0056] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.
[0057] This embodiment provides a solution that can solve the above-mentioned problem. The specific implementation methods of this application are described in detail below in conjunction with the accompanying drawings.
[0058] Please refer to Figure 1 , Figure 1 Example This embodiment provides a method for manufacturing a packaging structure, and the method for manufacturing the packaging structure may include the following steps.
[0059] Step S110 , providing a substrate structure 100 .
[0060] In step S120 , the substrate structure 100 is disposed on a first carrier plate 210 .
[0061] In this embodiment, please refer to Figure 2 , a bonding adhesive may be coated on one side of the first carrier 210, and the substrate structure 100 may be connected to the first carrier 210 by the bonding adhesive. The first carrier 210 may be a glass carrier. Exemplarily, the bonding adhesive may be a thermally debonded adhesive or a laser debonding material.
[0062] Step S130 , performing plastic packaging on the substrate structure 100 to form a first plastic packaging layer 300 .
[0063] In this embodiment, please refer to Figure 2, the substrate structure 100 can be encapsulated with a plastic encapsulation material to form the first plastic encapsulation layer 300 that completely covers the substrate structure 100, and the orthographic projection of the first plastic encapsulation layer 300 on the first carrier 210 can completely cover the orthographic projection of the substrate structure 100 on the first carrier 210. Specifically, the first plastic encapsulation layer 300 can completely cover the surface of the substrate structure 100 away from the first carrier 210 and the side surface of the substrate structure 100.
[0064] The first plastic sealing layer 300 can be formed by wafer-level or board-level plastic sealing, lamination of plastic sealing films, hot pressing plastic sealing or injection molding, etc., which is not specifically limited here.
[0065] The material of the first plastic sealing layer 300 can be an insulating material, for example, it can include epoxy molding compound (Epoxy Molding Compound, EMC). Epoxy molding compound (Epoxy Molding Compound, EMC) is a powder molding compound made of epoxy resin as a base resin, high-performance phenolic resin as a curing agent, silicon micropowder and the like as a filler, and a variety of additives. Epoxy molding compound (Epoxy Molding Compound, EMC) is easy to shape and has a hard texture. It can protect the substrate structure 100 and effectively prevent external water and oxygen from contacting the substrate structure 100. It can also reduce the risk of delamination and improve the reliability of the packaging structure.
[0066] Step S140 , forming a first encapsulation layer 400 on a side of the first plastic packaging layer 300 away from the first carrier 210 .
[0067] In this embodiment, please refer to Figure 2 , a plurality of conductive pillars 142 are disposed on a side of the substrate structure 100 away from the first carrier 210, and the first encapsulation layer 400 formed on a side of the first plastic encapsulation layer 300 away from the first carrier 210 can be electrically connected to the substrate structure 100 through the plurality of conductive pillars 142. The orthographic projection of the first encapsulation layer 400 on the first carrier 210 can completely overlap with the orthographic projection of the first plastic encapsulation layer 300 on the first carrier 210.
[0068] Step S150 , removing the first carrier board 210 .
[0069] In this embodiment, please refer to Figure 2When the bonding adhesive between the first carrier 210 and the substrate structure 100 is a pyrolytic bonding material, the pyrolytic adhesive can be softened by heating to remove the first carrier 210. When the bonding adhesive between the first carrier 210 and the substrate structure 100 is a laser debonding material, the first carrier 210 can be removed by laser.
[0070] It should be noted that the method of removing the first carrier 210 is not limited to heating and laser, and the first carrier 210 can also be removed by other methods. The removal method can be selected according to the actual connection method, and is not specifically limited here.
[0071] Step S160 , forming a second encapsulation layer 500 on a side of the substrate structure 100 away from the first encapsulation layer 400 .
[0072] In this embodiment, please refer to Figure 2 The second encapsulation layer 500 may be formed on a side of the substrate structure 100 away from the first encapsulation layer 400 , and the second encapsulation layer 500 may completely cover the substrate structure 100 .
[0073] Wherein, after step S120 and before step S150, the substrate structure 100 or the first plastic encapsulation layer 300 or the first encapsulation layer 400 may be cut to release stress in advance.
[0074] In the first possible implementation, please refer to Figure 3 After the substrate structure 100 is disposed on the first carrier 210, the substrate structure 100 may be cut. Specifically, the cutting depth may be equal to the thickness of the substrate structure 100 or may be less than the thickness of the substrate structure 100, as long as the stress release effect can be achieved.
[0075] When the cutting depth is equal to the thickness of the substrate structure 100, the substrate structure 100 can be cut into a plurality of structural units. In step S130, a plastic encapsulation material can be filled between the plurality of structural units, and the first plastic encapsulation layer 300 can not only cover the surface of the plurality of structural units away from the first carrier 210, but also cover the side surfaces of the plurality of structural units.
[0076] When the cutting depth is less than the thickness of the substrate structure 100, a plurality of grooves may be formed on a side of the substrate structure 100 away from the first carrier 210. In step S130, a molding material may be filled in the plurality of grooves.
[0077] In addition, when cutting the substrate structure 100, the number of cutting times and the cutting position can be adjusted according to actual needs. Figure 4a and Figure 4b For the same substrate structure 100, different cutting times and cutting positions will result in different numbers of structural units or grooves formed.
[0078] In a second possible implementation, please refer to Figure 5 After forming the first plastic encapsulation layer 300, the first plastic encapsulation layer 300 may be cut. Specifically, the cutting depth may be equal to the thickness of the first plastic encapsulation layer 300, or may be less than the thickness of the first plastic encapsulation layer 300, as long as the stress release effect can be achieved.
[0079] In addition, when cutting the first plastic packaging layer 300 , the number of cutting times and the cutting position can be adjusted according to actual needs.
[0080] In a third possible implementation, please refer to Figure 6 After forming the first encapsulation layer 400, the first encapsulation layer 400 may be cut. Specifically, the cutting depth may be equal to the thickness of the first encapsulation layer 400 or may be less than the thickness of the first encapsulation layer 400, as long as the stress release effect can be achieved.
[0081] In addition, when cutting the first encapsulation layer 400 , the number of cutting times and the cutting position can be adjusted according to actual needs.
[0082] It should be noted that when the substrate structure 100 or the first plastic packaging layer 300 or the first encapsulation layer 400 is cut, laser cutting, mechanical cutting and the like may be used for cutting, which is not specifically limited here.
[0083] In the above design, by cutting the substrate structure 100 or the first plastic sealing layer 300 or the first encapsulation layer 400, the stress generated between different film layers due to different material properties can be effectively reduced, thereby avoiding problems such as edge collapse and cracks when cutting again after the encapsulation is completed, thereby ensuring the stability and reliability of the encapsulation structure. In addition, by setting the first plastic sealing layer 300 to completely wrap the surface and side of the substrate structure 100, the risk of delamination can be reduced, the overall performance of the product can be improved, and the yield loss of the process can be reduced.
[0084] In a possible implementation, the material of the first encapsulation layer 400 may include insulating resin or polyimide (PI), and the material of the second encapsulation layer 500 may include insulating resin.
[0085] In a possible implementation, the packaging structure provided in the present application may be an asymmetric structure, the material of the first packaging layer 400 may be polyimide (PI) photoresist, and the material of the second packaging layer 500 may be an insulating resin, for example, Ajinomoto Build-up Film (ABF).
[0086] Specifically, the first encapsulation layer 400 and the second encapsulation layer 500 may be formed by photolithography, plating, sputtering, or the like.
[0087] In another possible implementation, the packaging structure provided in the present application may be a symmetrical structure, and the materials of the first packaging layer 400 and the second packaging layer 500 may both be insulating resins, for example, Ajinomoto Build-up Film (ABF).
[0088] In one possible implementation, see Figure 7 , step S110 may include the following sub-steps.
[0089] In step S111 , a substrate to be processed is provided. The substrate to be processed includes a substrate 110 , a through hole penetrating the substrate 110 , and a wiring layer 120 located on a portion of the surface of the substrate 110 via the through hole.
[0090] In this embodiment, please refer to Figure 8 , a plurality of through holes distributed at intervals may be formed on the substrate 110 by laser drilling, and the routing layer 120 that at least partially covers the substrate 110 may be formed on the plurality of through holes and the surface of the substrate 110. Specifically, the routing layer 120 may include a seed layer and a metal layer, the seed layer being located on the inner wall of the through hole and at least a portion of the surface of the substrate 110, and the metal layer being located on a side of the seed layer away from the through hole.
[0091] The substrate 110 may be a glass substrate.
[0092] Step S112 , forming a filling layer 130 on the surface of the wiring layer 120 to obtain a substrate structure 100 .
[0093] In this embodiment, please refer to Fig. 9 Insulating material may be covered in the through hole and on the surface of the routing layer 120 to form the filling layer 130 . The filling layer 130 may completely cover the routing layer 120 and the surface of the substrate 110 not covered by the routing layer 120 .
[0094] The material of the filling layer 130 may be an insulating material, for example, may include Ajinomoto Build-up Film (ABF).
[0095] In one possible implementation, see Fig.10 Before the substrate structure 100 is plastic-sealed to form the first plastic-sealing layer 300, the method for manufacturing the packaging structure may further include the following steps.
[0096] Step S210 , etching the filling layer 130 to form a plurality of grooves 141 exposing the wiring layer 120 .
[0097] In step S220 , a plurality of conductive pillars 142 are formed in the grooves 141 , respectively. The plurality of conductive pillars 142 are electrically connected to the wiring layer 120 .
[0098] In this embodiment, please refer to Fig.11 The substrate structure 100 may include a first surface and a second surface that are arranged opposite to each other. A plurality of grooves 141 exposing the wiring layer 120 may be formed on the first surface and the second surface of the substrate structure 100 respectively by an etching process. The plurality of grooves 141 are arranged at intervals. The conductive pillars 142 may be formed by filling the grooves 141 on the first surface of the substrate structure 100 with conductive material. One end of the conductive pillar 142 may contact the wiring layer 120 on the surface of the substrate 110, and the other end of the conductive pillar 142 may cover at least a portion of the surface of the filling layer 130.
[0099] Exemplarily, the conductive material filled in the plurality of grooves 141 may include conductive materials such as copper, aluminum, nickel, or alloys of at least two of the above, or a combination of the above, which is not specifically limited herein.
[0100] It should be noted that the number of the conductive pillars 142 can be determined according to actual needs and is not specifically limited here.
[0101] Specifically, when the conductive pillars 142 for electrically connecting to the first encapsulation layer 400 are formed on the substrate structure 100, the process may be performed before or after the substrate structure 100 is disposed on the first carrier 210. When the grooves 141 are formed on the second surface of the substrate structure 100, the process may be performed before or after the substrate structure 100 is disposed on the first carrier 210.
[0102] In the above design, by forming the conductive column 142 on the first surface of the substrate structure 100, the first packaging layer 400 can be electrically connected to the wiring layer 120 on the surface of the substrate 110 through the conductive column 142, and by forming the groove 141 exposing the wiring layer 120 on the second surface of the substrate structure 100, the second packaging layer 500 can be electrically connected to the wiring layer 120 on the surface of the substrate 110 through the groove 141.
[0103] In one possible implementation, see Fig.12 , step S140 may include the following sub-steps.
[0104] Step S141 , grinding the first plastic packaging layer 300 to expose the conductive pillars 142 .
[0105] Step S142 , forming a first packaging layer 400 on a side of the first plastic packaging layer 300 away from the first carrier 210 , wherein the first packaging layer 400 is electrically connected to the conductive pillar 142 .
[0106] In this embodiment, since the first plastic encapsulation layer 300 completely covers the conductive column 142, it is necessary to grind the first plastic encapsulation layer 300 so that the surface of the first plastic encapsulation layer 300 is flush with the surface of the conductive column 142 and the surface of the conductive column 142 is exposed, so as to facilitate the electrical connection between the conductive column 142 and the first encapsulation layer 400.
[0107] In one possible implementation, see Fig.13 , step S160 may include the following sub-steps.
[0108] Step S161 , disposing a second carrier 220 on a side of the first packaging layer 400 away from the substrate structure 100 .
[0109] In this embodiment, please refer to Fig.14 The first packaging layer 400 and the second carrier board 220 may be bonded together by bonding adhesive, wherein the bonding adhesive may be a thermally degradable adhesive or a laser debonding material.
[0110] Step S162 , forming a second encapsulation layer 500 on a side of the substrate structure 100 away from the first encapsulation layer 400 .
[0111] In this embodiment, please refer to Fig.14The second encapsulation layer 500 may be formed on a side of the substrate structure 100 away from the first encapsulation layer 400 , and the orthographic projection of the second encapsulation layer 500 on the second carrier 220 may completely overlap with the orthographic projection of the first encapsulation layer 400 on the second carrier 220 .
[0112] It should be noted that before forming the second packaging layer 500 , the filling layer 130 needs to be etched to form a plurality of grooves 141 exposing the wiring layer 120 , so that the second packaging layer 500 is electrically connected to the wiring layer 120 through the grooves 141 .
[0113] In one possible implementation, see Fig.15 After the second packaging layer 500 is formed on the side of the substrate structure 100 away from the first packaging layer 400, the second carrier 220 can be removed, and a third carrier 230 can be set on the side of the second packaging layer 500 away from the substrate structure 100, and then a chip 600 can be set on the side of the first packaging layer 400 away from the substrate structure 100.
[0114] In this embodiment, the number of the chips 600 disposed on the side of the first packaging layer 400 away from the substrate structure 100 may be multiple, and the multiple chips 600 are disposed in the same layer. The multiple chips 600 may be electrically connected to the first packaging layer 400 respectively.
[0115] Exemplarily, the chip 600 may be a high bandwidth memory (HBM) chip, or an application specific integrated circuit (ASIC) chip, a system on chip (SoC), etc.
[0116] It should be noted that a chip 600 may be further disposed on one side of the substrate structure 100 of the second packaging layer 500 .
[0117] In one possible implementation, see Fig.16 After the chip 600 is arranged on the side of the first packaging layer 400 away from the substrate structure 100 , a second plastic packaging layer 700 may be formed on the side of the chip 600 away from the substrate structure 100 .
[0118] In this embodiment, a molding material may be filled between the plurality of chips 600 to form the second molding layer 700. After the second molding layer 700 is formed, the third carrier 230 may be removed, and the second molding layer 700, the first packaging layer 400, the first molding layer 300, the substrate structure 100 and the second packaging layer 500 may be cut to obtain a target packaging structure.
[0119] The material of the second molding layer 700 may be the same as that of the first molding layer 300 , for example, may include epoxy molding compound (EMC).
[0120] An embodiment of the present application also provides a packaging structure, which can be manufactured using the manufacturing method of the packaging structure provided in the present application.
[0121] An embodiment of the present application also provides an electronic device, which may include the packaging structure provided in the present application.
[0122] In summary, the present embodiment provides a method for manufacturing a packaging structure, a packaging structure and an electronic device. By cutting the substrate structure or the first plastic packaging layer or the first packaging layer, the stress generated between different film layers due to different material properties can be effectively reduced, thereby avoiding problems such as edge collapse and cracks when cutting again after the packaging is completed, thereby ensuring the stability and reliability of the packaging structure. In addition, by setting the first plastic packaging layer to completely wrap the surface and sides of the substrate structure, the risk of delamination can be reduced, the overall performance of the product can be improved, and the yield loss of the process can be reduced.
[0123] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0124] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A method for manufacturing a packaging structure, characterized in that: The method comprises: Providing a substrate structure; Disposing the substrate structure on a first carrier; Plastic-sealing the substrate structure to form a first plastic-sealing layer; forming a first packaging layer on a side of the first plastic packaging layer away from the first carrier; removing the first carrier board; forming a second encapsulation layer on a side of the substrate structure away from the first encapsulation layer; Wherein, after the step of disposing the substrate structure on the first carrier and before the step of removing the first carrier, the method further includes: The substrate structure or the first plastic packaging layer or the first encapsulation layer is cut.
2. The method for manufacturing a packaging structure according to claim 1, characterized in that: The material of the first encapsulation layer includes insulating resin or polyimide, and the material of the second encapsulation layer includes insulating resin.
3. The method for manufacturing a packaging structure according to claim 1, characterized in that: The step of providing a substrate structure includes: Providing a substrate to be processed, the substrate to be processed comprising a substrate, a through hole penetrating the substrate, and a wiring layer located on a partial surface of the substrate via the through hole; A filling layer is formed on the surface of the routing layer to obtain a substrate structure.
4. The method for manufacturing a packaging structure according to claim 3, characterized in that: Before the step of plastic-sealing the substrate structure to form a first plastic-sealing layer, the method further includes: Etching the filling layer to form a plurality of grooves exposing the wiring layer; A plurality of conductive pillars are respectively formed in the grooves, and the plurality of conductive pillars are respectively electrically connected to the wiring layer.
5. The method for manufacturing a packaging structure according to claim 4, characterized in that: The step of forming a first encapsulation layer on a side of the first plastic encapsulation layer away from the first carrier board includes: Grinding the first plastic packaging layer to expose the conductive pillars; A first packaging layer is formed on a side of the first plastic packaging layer away from the first carrier, and the first packaging layer is electrically connected to the conductive pillar.
6. The method for manufacturing a packaging structure according to claim 1, characterized in that: The step of forming a second encapsulation layer on a side of the substrate structure away from the first encapsulation layer comprises: Disposing a second carrier on a side of the first packaging layer away from the substrate structure; A second encapsulation layer is formed on a side of the substrate structure away from the first encapsulation layer.
7. The method for manufacturing a packaging structure according to claim 1, characterized in that: After the step of forming a second encapsulation layer on a side of the substrate structure away from the first encapsulation layer, the method further includes: A chip is arranged on a side of the first packaging layer away from the substrate structure.
8. The method for manufacturing a packaging structure according to claim 7, characterized in that: After the step of arranging a chip on a side of the first packaging layer away from the substrate structure, the method further includes: A second plastic packaging layer is formed on a side of the chip away from the substrate structure.
9. A packaging structure, characterized in that: The packaging structure is manufactured using the packaging structure manufacturing method described in any one of claims 1 to 8.
10. An electronic device, characterized in that: The electronic device comprises the packaging structure according to claim 9.