Semiconductor temporary bonding packaging structure and preparation method thereof

Abstract

The invention discloses a semiconductor temporary bonding packaging structure and a preparation method thereof. The method comprises the following steps: coating a first layer of bonding glue on a substrate; pressing a separable structure on the first layer of bonding glue and solidifying the first layer of bonding glue; coating a second layer of bonding glue on the separable structure; mounting a semiconductor device on the second layer of bonding glue and curing the second layer of bonding glue; carrying out plastic packaging on the surface-mounted semiconductor device; and different rewiring process routes are selected according to different orientations of the salient points of the semiconductor device, so that the rewiring structure is distributed on the surface of the molding compound or the second layer of bonding glue. Temporary bonding glue or a temporary bonding film does not need to be used, the temporary bonding cost is effectively reduced, the bonding glue and the separable structure can serve as a passivation layer and an RDL structure in the packaging structure respectively, the temporary bonding process is effectively shortened, the packaging cost is reduced, and the application range can include the Face-up process route and the Face-down process route.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to a semiconductor temporary bonding packaging structure and a preparation method thereof. Background Art

[0002] The development of Moore's Law has slowed down and is approaching its physical limit. It is difficult to meet the high demands of the integrated circuit industry simply by miniaturizing the size. Advanced packaging technology is urgently needed to break this dilemma. At present, semiconductor packaging technology is developing in the direction of large size, ultra-thinness and three-dimensional stacking. Technologies such as Info, Cowos, and 3D SiP meet the needs of modern electronic devices for high performance and high efficiency by increasing packaging integration, reducing volume and weight, and improving system performance. In order to realize these advanced packaging structures and ensure the accuracy and yield of chip packaging, temporary bonding technology came into being. However, the materials used in existing temporary bonding technologies are costly, have many processes, and have low work efficiency. Summary of the invention

[0003] In order to solve the technical problems existing in the prior art, the object of the present invention is to provide a semiconductor temporary bonding packaging structure and a preparation method thereof.

[0004] In order to achieve the above purpose and the above technical effect, the technical solution adopted by the present invention is:

[0005] A method for preparing a semiconductor temporary bonding packaging structure comprises the following steps:

[0006] Step 1: Apply the first layer of bonding glue on the substrate;

[0007] Step 2: Pressing the separable structure on the first layer of bonding glue and curing the first layer of bonding glue;

[0008] Step 3: Apply a second layer of bonding glue on the separable structure;

[0009] Step 4: Mounting semiconductor devices on the second layer of bonding glue and curing the second layer of bonding glue;

[0010] Step 5: Plastic-encapsulate the mounted semiconductor device;

[0011] Step 6: Select different redistribution process routes according to the different orientations of the bumps of the semiconductor device, so as to distribute the redistribution structure on the surface of the plastic packaging material or the surface of the second layer of bonding glue.

[0012] Furthermore, the thickness of the first layer of bonding glue is greater than 5 microns.

[0013] Furthermore, in step 4, a face-up process route is adopted to mount the semiconductor device on the second layer of bonding glue, with the bumps of the semiconductor device facing upward.

[0014] Furthermore, in step six, the step of distributing the redistribution structure on the surface of the plastic packaging material includes:

[0015] Grind and thin the plastic packaging material to expose the interface of the semiconductor device;

[0016] Then, the substrate, the first layer of bonding glue, the separable structure, and the second layer of bonding glue are separated and peeled off, leaving only the plastic encapsulation material and the semiconductor device therein;

[0017] Then apply a third layer of bonding glue on the plastic packaging material, lead out the signal of the semiconductor device through rewiring, and then plant solder balls.

[0018] Furthermore, in step 4, a face-down process route is adopted to mount the semiconductor device on the second layer of bonding glue, with the bumps of the semiconductor device facing downward.

[0019] Furthermore, in step six, the step of distributing the redistribution structure on the surface of the second layer of bonding glue includes:

[0020] Separate and peel off the substrate, the first layer of bonding glue, and the separable structure;

[0021] Then, a third layer of bonding glue is applied on the second layer of bonding glue, the signal of the semiconductor device is led out through rewiring, and then solder balls are planted.

[0022] The present invention also discloses a semiconductor temporary bonding packaging structure, which is prepared by the preparation method of the semiconductor temporary bonding packaging structure as described above. The semiconductor temporary bonding packaging structure includes a plastic packaging material, a semiconductor device is mounted in the plastic packaging material, a third layer of bonding glue is arranged on the plastic packaging material, a redistribution structure is arranged on the third layer of bonding glue, and solder balls are planted on the redistribution structure.

[0023] The present invention also discloses a semiconductor temporary bonding packaging structure, which is prepared by the preparation method of the semiconductor temporary bonding packaging structure as described above. The semiconductor temporary bonding packaging structure includes a plastic packaging material, a semiconductor device is mounted in the plastic packaging material, a second layer of bonding glue is arranged on the plastic packaging material, a third layer of bonding glue is arranged on the second layer of bonding glue, a redistribution structure is arranged on the third layer of bonding glue, and solder balls are planted on the redistribution structure.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] The present invention discloses a semiconductor temporary bonding packaging structure and a preparation method thereof. A substrate is bonded to a separable structure through a first layer of bonding glue, and a semiconductor device is bonded to the separable structure through a second layer of bonding glue. A rewiring structure can be distributed on the surface of a plastic packaging material or the surface of the second layer of bonding glue according to a Face-up or Face-down process route of the semiconductor device, or distributed on both sides of the semiconductor device through conductive through holes. No temporary bonding glue or temporary bonding film is required throughout the entire process, thereby avoiding the high cost problem caused by using the temporary bonding glue or temporary bonding film in the existing temporary bonding technology, and effectively reducing the temporary bonding cost. At the same time, the bonding glue and the separable structure used in the bonding process can be used as a passivation layer and an RDL structure in the packaging structure, respectively, thereby shortening the temporary bonding process, further reducing the packaging cost, and improving the packaging efficiency. The scope of application can cover both the Face-up and Face-down process routes, and has universal applicability for promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of step 1 of the present invention;

[0027] Figure 2 It is a structural schematic diagram of step 2 of the present invention;

[0028] Figure 3 It is a structural schematic diagram of step three of the present invention;

[0029] Figure 4 This is a schematic diagram of the structure of step 4 of embodiment 1 of the present invention;

[0030] Figure 5 This is a schematic diagram of the structure of step 5 of embodiment 1 of the present invention;

[0031] Figure 6-7 They are respectively structural schematic diagrams of step six of embodiment 1 of the present invention;

[0032] Figure 8 This is a schematic diagram of the structure of step 4 of embodiment 2 of the present invention;

[0033] Fig. 9 This is a schematic diagram of the structure of step 5 of embodiment 2 of the present invention;

[0034] Figure 10-11 They are respectively structural schematic diagrams of step six of embodiment 2 of the present invention. DETAILED DESCRIPTION

[0035] The present invention is described in detail below so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0036] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or critical elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0037] like Figure 1-11 As shown, a method for preparing a semiconductor temporary bonding packaging structure comprises the following steps:

[0038] Step 1: If Figure 1 As shown, a first layer of bonding glue 2 is coated on the substrate 1, and the coating method includes but is not limited to printing, coating, etc. The thickness of the first layer of bonding glue 2 is greater than 5 microns;

[0039] Step 2: If Figure 2 As shown, the separable structure 3 is pressed on the first layer of bonding glue 2, and the first layer of bonding glue 2 is cured;

[0040] Step 3: If Figure 3 As shown, a second layer of bonding glue 4 is coated on the separable structure 3. The second layer of bonding glue 4 can be of the same or different type and the same or different thickness as the first layer of bonding glue 2. It can be flexibly selected according to actual needs.

[0041] Step 4: Mounting the semiconductor device 5 on the second layer of bonding glue 4, and curing the second layer of bonding glue 4;

[0042] Step 5: Plastic-sealing the mounted semiconductor device 5 using a plastic film, a solid plastic material (including a powder material, a cake material) or a liquid plastic material 6;

[0043] Step six: different redistribution process routes are selected according to different orientations of the bumps of the semiconductor device 5 , so as to achieve distribution of the redistribution structure on the surface of the molding compound 6 or the surface of the second layer of bonding glue 4 .

[0044] In the present invention, the substrate 1 is a flat plate such as a steel plate or a glass plate that meets the requirements of roughness and flatness.

[0045] In step 4, the semiconductor device 5 can be mounted using a face-up process route or a face-down process route.

[0046] Example 1

[0047] A method for preparing a semiconductor temporary bonding packaging structure comprises the following steps:

[0048] Step 1: If Figure 1As shown, a first layer of bonding glue 2 is coated on the steel plate, and the coating method includes but is not limited to printing, coating, etc. The thickness of the first layer of bonding glue 2 is greater than 5 microns;

[0049] Step 2: If Figure 2 As shown, the separable structure 3 is pressed on the first layer of bonding glue 2, and the first layer of bonding glue 2 is cured;

[0050] Step 3: If Figure 3 As shown, a second layer of bonding glue 4 is coated on the separable structure 3, and the second layer of bonding glue 4 can be of a different type and thickness from the first layer of bonding glue 2;

[0051] Step 4: If Figure 4 As shown, a face-up process route is adopted to mount a semiconductor device 5 on the second layer of bonding glue 4, and the second layer of bonding glue 4 is cured;

[0052] Step 5: If Figure 5 As shown, the mounted semiconductor device 5 is encapsulated using a plastic film, a solid plastic material (including a powder material, a cake material) or a liquid plastic material 6;

[0053] Step 6: If Figure 6 As shown, the plastic encapsulation material 6 is ground and thinned to expose the interface of the semiconductor device 5; Figure 7 As shown, the substrate 1, the first layer of bonding glue 2, the separable structure 3, and the second layer of bonding glue 4 are separated and peeled off, leaving only the plastic encapsulation material 6 and the semiconductor device 5 therein, and then the third layer of bonding glue 7 is coated on the plastic encapsulation material 6, the signal of the semiconductor device 5 is led out by rewiring, and then the solder ball 8 is implanted.

[0054] A semiconductor temporary bonding packaging structure comprises a plastic packaging material 6, a semiconductor device 5 is mounted in the plastic packaging material 6, a third layer of bonding glue 7 is arranged on the plastic packaging material 6, a redistribution structure is arranged on the third layer of bonding glue 7, and a solder ball 8 is planted on the redistribution structure.

[0055] Example 2

[0056] A method for preparing a semiconductor temporary bonding packaging structure comprises the following steps:

[0057] Step 1: If Figure 1 As shown, a first layer of bonding glue 2 is coated on the steel plate, and the coating method includes but is not limited to printing, coating, etc. The thickness of the first layer of bonding glue 2 is greater than 5 microns;

[0058] Step 2: If Figure 2 As shown, the separable structure 3 is pressed on the first layer of bonding glue 2, and the first layer of bonding glue 2 is cured;

[0059] Step 3: If Figure 3 As shown, a second layer of bonding glue 4 is coated on the separable structure 3, and the second layer of bonding glue 4 can be of a different type and thickness from the first layer of bonding glue 2;

[0060] Step 4: If Figure 8 As shown, a face-down process route is adopted to mount a semiconductor device 5 on the second layer of bonding glue 4, and the second layer of bonding glue 4 is cured;

[0061] Step 5: If Fig. 9 As shown, the mounted semiconductor device 5 is encapsulated using a plastic film, a solid plastic material (including a powder material, a cake material) or a liquid plastic material 6;

[0062] Step 6: If Fig.10 As shown, the substrate 1, the first layer of bonding glue 2, and the separable structure 3 are separated and peeled off; Fig.11 As shown, bonding glue is further coated on the second bonding glue layer 4 to form a third bonding glue layer 7 , the signal of the semiconductor device 5 is led out by rewiring, and then solder balls 8 are implanted.

[0063] A semiconductor temporary bonding packaging structure includes a plastic packaging material 6, a semiconductor device 5 is mounted in the plastic packaging material 6, a second layer of bonding glue 4 is arranged on the plastic packaging material 6, a third layer of bonding glue 7 is arranged on the second layer of bonding glue 4, a redistribution structure is arranged on the third layer of bonding glue 7, and a solder ball 8 is planted on the redistribution structure.

[0064] Parts or structures not specifically described in the present invention may adopt existing technologies or existing products and will not be described in detail here.

[0065] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for preparing a semiconductor temporary bonding packaging structure, characterized in that: The following steps are involved: Step 1: Apply the first layer of bonding glue on the substrate; Step 2: Pressing the separable structure on the first layer of bonding glue and curing the first layer of bonding glue; Step 3: Apply a second layer of bonding glue on the separable structure; Step 4: Mounting semiconductor devices on the second layer of bonding glue and curing the second layer of bonding glue; Step 5: Plastic-encapsulate the mounted semiconductor device; Step 6: Select different redistribution process routes according to the different orientations of the bumps of the semiconductor device, so as to distribute the redistribution structure on the surface of the plastic packaging material or the surface of the second layer of bonding glue.

2. The method for preparing a semiconductor temporary bonding packaging structure according to claim 1, characterized in that: The thickness of the first layer of bonding glue is greater than 5 microns.

3. The method for preparing a semiconductor temporary bonding packaging structure according to claim 1, characterized in that: In step 4, a face-up process route is adopted to mount the semiconductor device on the second layer of bonding glue, with the bumps of the semiconductor device facing upward.

4. The method for preparing a semiconductor temporary bonding packaging structure according to claim 3, characterized in that: In step six, the step of distributing the redistribution structure on the surface of the molding compound includes: Grind and thin the plastic packaging material to expose the interface of the semiconductor device; Then, the substrate, the first layer of bonding glue, the separable structure, and the second layer of bonding glue are separated and peeled off, leaving only the plastic encapsulation material and the semiconductor device therein; Then apply a third layer of bonding glue on the plastic packaging material, lead out the signal of the semiconductor device through rewiring, and then plant solder balls.

5. The method for preparing a semiconductor temporary bonding packaging structure according to claim 1, characterized in that: In step 4, a face-down process route is adopted to mount the semiconductor device on the second layer of bonding glue, with the bumps of the semiconductor device facing downward.

6. The method for preparing a semiconductor temporary bonding packaging structure according to claim 5, characterized in that: In step six, the step of distributing the redistribution structure on the surface of the second layer of bonding glue includes: Separate and peel off the substrate, the first layer of bonding glue, and the separable structure; Then, a third layer of bonding glue is applied on the second layer of bonding glue, the signal of the semiconductor device is led out through rewiring, and then solder balls are planted.

7. A semiconductor temporary bonding packaging structure, characterized in that: The semiconductor temporary bonding packaging structure is prepared by the preparation method of any one of claims 1-4, wherein the semiconductor temporary bonding packaging structure includes a plastic packaging material, a semiconductor device is mounted in the plastic packaging material, a third layer of bonding glue is arranged on the plastic packaging material, a redistribution structure is arranged on the third layer of bonding glue, and solder balls are planted on the redistribution structure.

8. A semiconductor temporary bonding packaging structure, characterized in that: The semiconductor temporary bonding packaging structure is prepared by the preparation method of claim 1, 2, 5 or 6, wherein the semiconductor temporary bonding packaging structure includes a plastic packaging material, a semiconductor device is mounted in the plastic packaging material, a second layer of bonding glue is arranged on the plastic packaging material, a third layer of bonding glue is arranged on the second layer of bonding glue, a redistribution structure is arranged on the third layer of bonding glue, and solder balls are planted on the redistribution structure.

Images