Wafer carrying device and method

Abstract

The invention discloses a wafer carrying device and method, and particularly relates to the technical field of wafer carrying, the wafer carrying device comprises a protective cover, a plurality of station frames are fixedly mounted on the outer side of the protective cover, carrying equipment is fixedly mounted in the protective cover, the carrying equipment comprises a transposition mechanism, a positioning mechanism is fixedly mounted at the end of the transposition mechanism, and the positioning mechanism is fixedly mounted at the end of the transposition mechanism. A correcting mechanism is arranged on the outer side of the positioning mechanism; and the transposition mechanism comprises a transposition outer cylinder, the transposition outer cylinder is fixedly installed in the middle of the inner lower wall of the protective cover, a longitudinal sliding frame is movably installed at the top of the transposition outer cylinder, and a first rotating shaft is rotatably installed in the middle of the top end of the longitudinal sliding frame. According to the wafer carrying device, a plurality of wafers with different heights are adsorbed, positioned, carried and placed, so that the carrying efficiency of the wafers is improved, the positions of the plurality of wafers can be corrected, the subsequent wafers can be conveniently and accurately placed on a processing table, and the using effect of the whole wafer carrying device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer handling, and in particular to a wafer handling device and method. Background Art

[0002] Wafers are thin disks used to produce integrated circuits in the semiconductor manufacturing process. They are usually made of single-crystal silicon. The diameter of a wafer can range from a few inches to twelve inches, and its thickness is usually between a few hundred microns and one millimeter. The wafer will go through a series of complex processes, such as photolithography, etching, and ion implantation, to eventually form the required circuit structure.

[0003] Wafers need to be transported during processing. Traditional wafer transport methods mostly use Bernoulli suction cups to transport wafers by non-contact adsorption. There is a lack of positioning during the adsorption and transport process. When placed on the processing table later, auxiliary positioning is required to accurately place the wafer on the processing table, which is more troublesome. Secondly, only one wafer can be transported each time, and the efficiency is relatively low. To this end, we propose a wafer transport device and method to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a wafer handling device and method to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: a wafer handling device, comprising a protective cover, a plurality of station frames are fixedly installed on the outer side of the protective cover, a handling device is fixedly installed in the protective cover, the handling device comprises a transfer mechanism, a positioning mechanism is fixedly installed at the end of the transfer mechanism, and a correction mechanism is provided on the outer side of the positioning mechanism;

[0006] The cam is an angular channel that is fixedly mounted on the side of the gear train and is adapted to move the gear train to a different location on the camshaft so that the camshaft can move relative to the gear train when the camshaft is in a rotationally opposed position.

[0007] The first gear is connected with the transmission gear of the second end through the cam, and the second gear is connected with the transmission gear of the second end through the cam, and the transmission gear of the second end through the cam is connected with the transmission gear of the second end through the cam.

[0008] As a preferred technical solution of the present invention, the number of teeth of the large sprocket is twice the number of teeth of the small sprocket, and the number of teeth of the first sprocket and the second sprocket are the same.

[0009] As a preferred technical solution of the present invention, a first bearing is fixedly clamped on the inner top of the indexing outer cylinder, a rotating sleeve is fixedly clamped on the middle of the first bearing, the longitudinal sliding frame is slidably clamped in the middle of the rotating sleeve, a fourth shaft is rotatably installed on the side of the top of the indexing outer cylinder away from the rotating sleeve, a first transmission wheel is fixedly installed on the top of the rotating sleeve, a second transmission wheel is fixedly installed on the top of the fourth shaft, a transmission belt is provided on the outer movable sleeves of the first and second transmission wheels, a lifting cylinder is fixedly installed on the inner lower wall of the indexing outer cylinder, a second bearing is fixedly installed on the driving end of the lifting cylinder, and the second bearing is fixedly clamped in the middle of the bottom end of the longitudinal sliding frame.

[0010] As a preferred technical solution of the present invention, the positioning mechanism includes a longitudinal sliding outer frame, a sliding card in the longitudinal sliding outer frame is provided with a plurality of longitudinal sliding seats distributed at equal intervals, a connecting shaft is fixedly provided in the middle of the longitudinal sliding seat, a Bernoulli suction cup body is fixedly installed on one end of the connecting shaft, a U-shaped sliding frame is fixedly installed on the side of the longitudinal sliding outer frame away from the Bernoulli suction cup body, the positioning mechanism is vertically installed on the end of the third transfer arm through the bottom of the U-shaped sliding frame, an equidistant adjustment plate is provided on the inner horizontal sliding card of the U-shaped sliding frame, and an equidistant adjustment groove corresponding to the connecting shaft is opened on the equidistant adjustment plate, and the connecting shaft is slidably connected in the corresponding equidistant adjustment groove.

[0011] As a preferred technical solution of the present invention, a telescopic rod is fixedly installed in the middle of one side of the U-shaped sliding frame away from the longitudinal sliding outer frame, a driving frame is fixedly installed at the driving end of the telescopic rod, and the driving frame is fixedly installed in the middle of the equidistant adjustment plate.

[0012] As a preferred technical solution of the present invention, the correction mechanism includes an L-shaped bracket and a U-shaped rotating frame, the L-shaped bracket is fixedly installed on the top of the longitudinal sliding outer frame, the U-shaped rotating frame is provided with two symmetrically distributed, the two U-shaped rotating frames are fixedly installed on the top of the longitudinal sliding outer frame and the U-shaped sliding frame, the U-shaped rotating frame and the L-shaped bracket are vertically distributed, the top of the L-shaped bracket is movably clamped with a translation slide cylinder, one end of the translation slide cylinder is vertically mounted with a first positioning rod, the first positioning rod is slidably clamped on the side of the multiple Bernoulli suction cup bodies close to the longitudinal sliding outer frame, and the end of the translation slide cylinder away from the first positioning rod is threadedly mounted with A translation screw, a rotating seat is rotatably installed at one end of the translation screw away from the translation slide, the rotating seat is fixedly installed on the top of the longitudinal sliding outer frame, a rotating shaft is rotatably installed at one end of the U-shaped rotating frame away from the U-shaped sliding frame, a positioning frame is fixedly installed at the bottom of the rotating shaft, a second positioning rod is vertically installed at one end of the positioning frame away from the rotating shaft, a transmission gear is fixedly installed in the middle of the rotating shaft, a transmission rack is meshed and connected to the outer side of the transmission gear, an auxiliary frame is vertically installed at one end of the transmission rack away from the transmission gear, and the auxiliary frame is fixedly installed on the outer side of the translation slide.

[0013] As a preferred technical solution of the present invention, a first motor is fixedly installed on the inner top of the longitudinal sliding frame, and a driving end of the first motor and a bottom end of the first rotating shaft are fixedly installed.

[0014] As a preferred technical solution of the present invention, a second motor is fixedly installed on the side of the top end of the indexing outer cylinder away from the rotating sleeve, and the driving end of the second motor and the bottom end of the fourth shaft are fixedly installed.

[0015] As a preferred technical solution of the present invention, a third motor is fixedly installed on the top of the U-shaped sliding frame, and the driving end of the third motor and the end of the translation screw are fixedly installed.

[0016] A method for using a wafer transport device comprises the following steps:

[0017] Step 1: Control the second motor to drive the fourth shaft to rotate, cooperate with the transmission of the first transmission wheel, the second transmission wheel and the transmission belt, control the rotating sleeve and the longitudinal sliding frame to rotate, thereby controlling the first transfer arm, the second transfer arm and the third transfer arm to transfer synchronously, and transfer the third transfer arm to the position of the loading station frame;

[0018] Step 2: Control the first motor to start and drive the first rotating shaft to rotate, thereby controlling the first transfer arm to rotate a certain angle with the first rotating shaft as the axis, cooperate with the limit fixation of the large sprocket and the meshing drive of the first chain, and the number of teeth of the large sprocket is twice the number of teeth of the small sprocket, drive the second rotating shaft to rotate in the opposite direction, thereby synchronously controlling the second transfer arm to rotate in the opposite direction with the second rotating shaft as the axis by twice the angle, so that the second transfer arm moves straightly along the diameter route away from one end of the first transfer arm;

[0019] When the second transfer arm performs synchronous and angular reverse rotation with the second rotating shaft as the axis, the first sprocket is limited and fixed, and the second sprocket is driven in meshing, the first sprocket and the second sprocket have the same number of teeth, and the third rotating shaft is driven to rotate in the opposite direction, thereby controlling the third transfer arm to perform synchronous and angular reverse rotation with the third rotating shaft as the axis, so that the third transfer arm always maintains a diameter path for linear movement, thereby facilitating the third transfer arm to be linearly inserted into a wafer storage rack in one of the station frames;

[0020] During this period, the lifting cylinder is controlled to drive the longitudinal sliding frame to rise and fall in the rotating sleeve, thereby controlling the first indexing arm, the second indexing arm and the third indexing arm to rise and fall, and flexibly adjusting the height of the positioning mechanism, so that the positioning mechanism can adsorb and position wafers at different heights;

[0021] Step 3: Multiple Bernoulli suction cup bodies in the positioning mechanism are respectively placed on the lower surface of the corresponding wafer, and multiple wafers can be automatically sucked and positioned at one time by using multiple Bernoulli suction cup bodies;

[0022] Step 4: Control the first motor to drive the first rotating shaft to rotate in the opposite direction, so that the third transfer arm can be directly separated from the wafer storage rack in the work station frame;

[0023] Step 5: Control the third motor to start driving the translation screw to rotate, thereby controlling the translation slide and the first positioning rod to move toward the side close to the wafer, and at the same time drive the auxiliary frame and the transmission rack to move, thereby synchronously driving the transmission racks, the positioning frame, and the second positioning rod on both sides to rotate toward each other, contact with the rest of the wafer, and cooperate with the movement of the first positioning rod to correct the position of the wafer;

[0024] Step six: Then, control the first transfer arm, the second transfer arm and the third transfer arm to transfer synchronously again, transfer the third transfer arm to the next workstation frame position, and then insert multiple position-corrected wafers into another workstation frame for processing in a straight line, so as to realize automatic and stable handling and placement of multiple wafers.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. By setting up the handling equipment, multiple wafers at different heights can be adsorbed, positioned, transported and placed between multiple workstation frames, thereby improving the wafer handling efficiency, and can correct the positions of multiple wafers, making it convenient for subsequent wafers to be accurately placed on the processing table, thereby improving the use effect of the entire wafer handling device.

[0027] 2. By setting up a positioning mechanism, the spacing between multiple Bernoulli suction cup bodies can be flexibly and equidistantly adjusted, making it convenient to use multiple Bernoulli suction cup bodies to absorb and position multiple wafers placed at different spacings, thereby improving the flexibility of the entire device. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 It is a schematic diagram of the structure of the present invention.

[0030] Figure 2 It is a schematic diagram of the structural connection between the protective cover and the handling equipment in the present invention.

[0031] Figure 3 It is a schematic diagram of the structural connection of the handling equipment in the present invention.

[0032] Figure 4 It is a schematic diagram of the structural connection of the transfer mechanism in the present invention.

[0033] Figure 5 For the present invention Figure 4 Enlarged view of point A in the middle.

[0034] Figure 6 For the present invention Figure 4 Enlarged view of point B in the middle.

[0035] Figure 7 It is a partial structural connection diagram of the transfer mechanism in the present invention.

[0036] Figure 8 It is a structural schematic diagram of the positioning mechanism in the present invention.

[0037] Fig. 9 It is a structural schematic diagram of the correction mechanism in the present invention.

[0038] Fig.10 For the present invention Fig. 9 Enlarged view of point C in the middle.

[0039] In the figure: 1, protective cover; 11, work station frame; 2, handling equipment; 3, transfer mechanism; 4, positioning mechanism; 5, correction mechanism; 31, transfer outer cylinder; 32, longitudinal sliding frame; 321, first rotating shaft; 322, first motor; 33, first transfer arm; 331, second rotating shaft; 332, large sprocket; 3321, first sleeve; 333, small sprocket; 334, first chain; 34, second transfer arm; 341, third rotating shaft; 342, first sprocket; 3421, second sleeve; 343, second sprocket; 344, second chain; 35, third transfer arm; 36, first bearing; 361, rotating sleeve; 37, fourth shaft; 371, first transmission wheel ; 372, second transmission wheel; 373, transmission belt; 38, lifting cylinder; 381, second bearing; 39, second motor; 41, longitudinal sliding outer frame; 42, longitudinal sliding seat; 43, connecting shaft; 44, Bernoulli suction cup body; 45, U-shaped sliding frame; 46, equidistant adjustment plate; 401, equidistant adjustment slot; 47, telescopic rod; 471, driving frame; 51, L-shaped bracket; 52, U-shaped rotating frame; 53, translation slide; 531, translation screw; 532, rotating seat; 533, third motor; 54, first positioning rod; 55, rotating shaft; 551, positioning frame; 56, second positioning rod; 57, transmission gear; 571, transmission rack; 572, auxiliary frame. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] Example: Figure 1-10 As shown, the present invention provides a wafer handling device, comprising a protective cover 1, a plurality of station frames 11 are fixedly installed on the outer side of the protective cover 1, a handling device 2 is fixedly installed in the protective cover 1, the handling device 2 comprises a transfer mechanism 3, a positioning mechanism 4 is fixedly installed at the end of the transfer mechanism 3, and a correction mechanism 5 is provided on the outer side of the positioning mechanism 4;

[0042] The indexing mechanism 3 includes an indexing outer cylinder 31, which is fixedly mounted on the middle part of the inner lower wall of the protective cover 1, and a longitudinal sliding frame 32 is movably mounted on the top of the indexing outer cylinder 31. The longitudinal sliding frame 32 is convenient for rotating and lifting in the indexing outer cylinder 31, and a first rotating shaft 321 is rotatably mounted on the middle part of the top of the longitudinal sliding frame 32. A first motor 322 is fixedly mounted on the inner top of the longitudinal sliding frame 32, and a driving end of the first motor 322 and a bottom end of the first rotating shaft 321 are fixedly mounted;

[0043] The first rotating shaft 321 is fixedly installed with a first transfer arm 33 at the top end, and the second rotating shaft 331 is rotatably installed at one end of the first transfer arm 33 away from the first rotating shaft 321. A large sprocket 332 is provided on the inner side of one end of the first transfer arm 33 close to the first rotating shaft 321. The large sprocket 332 is movably sleeved on the outer side of the first rotating shaft 321. A first sleeve 3321 is fixedly installed at the middle part of the bottom end of the large sprocket 332. The bottom end of the first sleeve 3321 extends out of the bottom end of the first transfer arm 33 and is fixedly installed at the middle part of the top end of the longitudinal sliding frame 32 to fix the large sprocket 332. The first rotating shaft 321 movably passes through the first sleeve 3321. A small sprocket 333 is fixedly installed at the bottom of the second rotating shaft 331. The number of teeth of the large sprocket 332 is twice the number of teeth of the small sprocket 333. The outer sides of the large sprocket 332 and the small sprocket 333 are meshedly connected with the first chain 334, and the top of the second rotating shaft 331 is fixedly installed with the second transfer arm 34. When in use, the first motor 322 is controlled to drive the first rotating shaft 321 to rotate, thereby controlling the first transfer arm 33 to rotate a certain angle around the first rotating shaft 321 as the axis, and cooperating with the limit fixation of the large sprocket 332 and the meshing drive of the first chain 334, and the number of teeth of the large sprocket 332 is twice the number of teeth of the small sprocket 333, driving the second rotating shaft 331 to rotate in the opposite direction, thereby synchronously controlling the second transfer arm 34 to rotate in the opposite direction at twice the angle around the second rotating shaft 331 as the axis, so that the second transfer arm 34 moves straightly along the diameter route away from one end of the first transfer arm 33;

[0044] The third rotating shaft 341 is rotatably mounted on one end of the second rotating shaft 331 of the second rotating arm 34, and a first sprocket 342 is provided on the inner side of one end of the second rotating arm 34 close to the second rotating shaft 331, and the first sprocket 342 is movably sleeved on the outer side of the second rotating shaft 331, and a second sleeve 3421 is fixedly mounted on the middle part of the bottom end of the first sprocket 342, and the bottom end of the second sleeve 3421 extends out of the bottom end of the second rotating arm 34 and is fixedly mounted on the top end of the first rotating arm 33 to fix the first sprocket 342, and the second rotating shaft 331 movably passes through the second sleeve 3421, and a second sprocket 343 is fixedly mounted on the bottom of the third rotating shaft 341, and the first sprocket 342 and the second sprocket 343 are meshed and connected with the second chain 344, and the first sprocket 342 and the second sprocket 343 have the same number of teeth; The third transfer arm 35 is fixedly installed at the top. When the second transfer arm 34 rotates in the opposite direction synchronously and at the same angle with the second rotating shaft 331 as the axis, the first sprocket 342 and the second sprocket 343 are cooperated with the limiting fixation of the first sprocket 342 and the meshing drive of the second sprocket 343. The first sprocket 342 and the second sprocket 343 have the same number of teeth, driving the third rotating shaft 341 to rotate in the opposite direction, thereby controlling the third transfer arm 35 to rotate in the opposite direction synchronously and at the same angle with the third rotating shaft 341 as the axis, so that the third transfer arm 35 always maintains a diameter path for linear movement, thereby facilitating the third transfer arm 35 to be linearly inserted into the wafer rack in one of the workstation frames 11, and facilitating the third transfer arm 35 to be linearly separated from the wafer rack in the workstation frame 11, and facilitating the third transfer arm 35 to automatically and linearly and stably transport the wafer to another workstation frame 11 for processing.

[0045] The first bearing 36 is fixedly mounted on the inner top of the indexing outer cylinder 31, a rotating sleeve 361 is fixedly mounted in the middle of the first bearing 36, the longitudinal sliding frame 32 is slidably mounted in the middle of the rotating sleeve 361, a fourth shaft 37 is rotatably mounted on the side of the top of the indexing outer cylinder 31 away from the rotating sleeve 361, a first transmission wheel 371 is fixedly mounted on the top of the rotating sleeve 361, a second transmission wheel 372 is fixedly mounted on the top of the fourth shaft 37, and a transmission belt 373 is provided on the outer movable sleeves of the first transmission wheel 371 and the second transmission wheel 372; the indexing outer cylinder A second motor 39 is fixedly installed on one side of the top of 31 away from the rotating sleeve 361, and the driving end of the second motor 39 is fixedly installed on the bottom end of the fourth shaft 37. By controlling the second motor 39 to start, the fourth shaft 37 is driven to rotate, and the first transmission wheel 371, the second transmission wheel 372 and the transmission belt 373 are coordinated to control the rotating sleeve 361 and the longitudinal sliding frame 32 to rotate, thereby controlling the first transfer arm 33, the second transfer arm 34 and the third transfer arm 35 to transfer synchronously, and transfer the third transfer arm 35 to another position of the station frame 11;

[0046] A lifting cylinder 38 is fixedly installed on the inner lower wall of the indexing outer cylinder 31, and a second bearing 381 is fixedly installed on the driving end of the lifting cylinder 38. The second bearing 381 is fixedly clamped in the middle of the bottom end of the longitudinal sliding frame 32. The lifting cylinder 38 is controlled to open and drive the longitudinal sliding frame 32 to rise and fall in the rotating sleeve 361, thereby controlling the first indexing arm 33, the second indexing arm 34 and the third indexing arm 35 to rise and fall, and flexibly adjusting the height of the positioning mechanism 4, so that the subsequent positioning mechanism 4 can adsorb, position, transport and place wafers of different heights.

[0047] The positioning mechanism 4 includes a longitudinal sliding outer frame 41, in which a plurality of longitudinal sliding seats 42 are equidistantly distributed. A connecting shaft 43 is fixedly mounted in the middle of each longitudinal sliding seat 42, and a Bernoulli suction cup body 44 is fixedly mounted at one end of each connecting shaft 43. By using a plurality of Bernoulli suction cup bodies 44, a plurality of wafers can be automatically sucked and positioned for transportation at one time, thereby improving the transportation efficiency of the wafers.

[0048] A U-shaped sliding frame 45 is fixedly installed on one side of the longitudinal sliding outer frame 41 away from the Bernoulli suction cup body 44. The positioning mechanism 4 is vertically installed on the end of the third indexing arm 35 through the bottom of the U-shaped sliding frame 45. An equidistant adjustment plate 46 is provided on the inner side of the U-shaped sliding frame 45 for horizontal sliding. An equidistant adjustment groove 401 corresponding to the connecting shaft 43 is provided on the equidistant adjustment plate 46. The connecting shaft 43 is slidably connected in the corresponding equidistant adjustment groove 401. A telescopic rod 47 is fixedly installed on the middle part of the side of the U-shaped sliding frame 45 away from the longitudinal sliding outer frame 41. A driving frame 471 is fixedly installed on the driving end of the telescopic rod 47. The driving frame 471 is fixedly installed in the middle part of the equidistant adjustment plate 46. When in use, the telescopic rod 47 is controlled to open and close. The rod 47 drives the driving frame 471 to control the horizontal movement of the equidistant adjustment plate 46, and cooperates with the connecting shaft 43 to slide and engage in the corresponding equidistant adjustment groove 401, thereby controlling the equidistant separation of multiple Bernoulli suction cup bodies 44. On the contrary, the telescopic rod 47 is controlled to be opened to drive the driving frame 471 to control the reverse horizontal movement of the equidistant adjustment plate 46, and cooperates with the connecting shaft 43 to slide and engage in the corresponding equidistant adjustment groove 401, thereby controlling the equidistant approach of multiple Bernoulli suction cup bodies 44, and then flexibly and equidistantly adjusting the spacing between multiple Bernoulli suction cup bodies 44, so as to facilitate the use of multiple Bernoulli suction cup bodies 44 to adsorb and position multiple wafers placed at different spacings, thereby improving the flexibility of the entire device.

[0049] The correction mechanism 5 includes an L-shaped bracket 51 and a U-shaped rotating frame 52. The L-shaped bracket 51 is fixedly mounted on the top of the longitudinal sliding outer frame 41. The U-shaped rotating frame 52 is provided with two symmetrically distributed ones. The two U-shaped rotating frames 52 are fixedly mounted on the top of the longitudinal sliding outer frame 41 and the U-shaped sliding frame 45. The U-shaped rotating frame 52 and the L-shaped bracket 51 are vertically distributed. A translation slide 53 is movably mounted on the top of the L-shaped bracket 51. A first positioning rod 54 is vertically mounted on one end of the translation slide 53. The first positioning rod 54 is slidably mounted on one side of the plurality of Bernoulli suction cup bodies 44 close to the longitudinal sliding outer frame 41. A translation screw 531 is threadedly mounted on one end of the translation slide 53 away from the first positioning rod 54. , a rotating seat 532 is rotatably installed at one end of the translation screw 531 away from the translation slide 53, and the rotating seat 532 is fixedly installed on the top of the longitudinal sliding outer frame 41; a third motor 533 is fixedly installed on the top of the U-shaped sliding frame 45, and the driving end of the third motor 533 and the end of the translation screw 531 are fixedly installed, and the third motor 533 is controlled to be turned on to drive the translation screw 531 to rotate, thereby controlling the translation slide 53 and the first positioning rod 54 to move to the side close to the wafer, on the contrary, the third motor 533 is controlled to be turned on to drive the translation screw 531 to rotate in the opposite direction, thereby controlling the translation slide 53 and the first positioning rod 54 to move to the side away from the wafer;

[0050] A rotating shaft 55 is rotatably installed at one end of the U-shaped rotating frame 52 away from the U-shaped sliding frame 45, a positioning frame 551 is fixedly installed at the bottom of the rotating shaft 55, a second positioning rod 56 is vertically installed at one end of the positioning frame 551 away from the rotating shaft 55, a transmission gear 57 is fixedly installed in the middle of the rotating shaft 55, a transmission rack 571 is meshed and connected to the outer side of the transmission gear 57, an auxiliary frame 572 is vertically installed at one end of the transmission rack 571 away from the transmission gear 57, and the auxiliary frame 572 is fixedly installed on the outer side of the translation slide 53. When the translation slide 53 is controlled to move to the side close to the wafer, the driving The auxiliary frame 572 and the transmission rack 571 move, thereby synchronously driving the transmission racks 571 on both sides, the positioning frame 551, and the second positioning rod 56 to rotate toward each other, contact with the rest of the wafer, and cooperate with the movement of the first positioning rod 54 to correct the position of the wafer, thereby facilitating the subsequent precise placement of the wafer on the processing table, thereby improving the use effect of the entire wafer handling device. On the contrary, when the translation slide 53 is controlled to move to the side away from the wafer, the auxiliary frame 572 and the transmission rack 571 are driven to move in the opposite direction, thereby synchronously driving the transmission racks 571 on both sides, the positioning frame 551, and the second positioning rod 56 to rotate and fold in the opposite directions.

[0051] A method for using a wafer transport device comprises the following steps:

[0052] Step 1: Control the second motor 39 to drive the fourth shaft 37 to rotate, cooperate with the transmission of the first transmission wheel 371, the second transmission wheel 372 and the transmission belt 373, control the rotating sleeve 361 and the longitudinal sliding frame 32 to rotate, thereby controlling the first transfer arm 33, the second transfer arm 34 and the third transfer arm 35 to transfer synchronously, and transfer the third transfer arm 35 to the position of the loading station frame 11;

[0053] Step 2: Control the first motor 322 to start driving the first rotating shaft 321 to rotate, thereby controlling the first transfer arm 33 to rotate a certain angle around the first rotating shaft 321 as the axis, cooperate with the limit fixation of the large sprocket 332, and the meshing drive of the first chain 334, and the number of teeth of the large sprocket 332 is twice the number of teeth of the small sprocket 333, drive the second rotating shaft 331 to rotate in the opposite direction, thereby synchronously controlling the second transfer arm 34 to rotate in the opposite direction twice around the second rotating shaft 331 as the axis, so that the second transfer arm 34 moves straightly along the diameter route away from one end of the first transfer arm 33;

[0054] When the second transfer arm 34 performs synchronous and angular reverse rotation with the second rotating shaft 331 as the axis, in conjunction with the limiting fixation of the first sprocket 342 and the meshing drive of the second sprocket 343, the first sprocket 342 and the second sprocket 343 have the same number of teeth, driving the third rotating shaft 341 to rotate in the opposite direction, thereby controlling the third transfer arm 35 to perform synchronous and angular reverse rotation with the third rotating shaft 341 as the axis, so that the third transfer arm 35 always maintains a diameter path for linear movement, thereby facilitating the third transfer arm 35 to be linearly inserted into a wafer storage rack in one of the station frames 11;

[0055] During this period, the lifting cylinder 38 is controlled to drive the longitudinal sliding frame 32 to rise and fall in the rotating sleeve 361, thereby controlling the first indexing arm 33, the second indexing arm 34 and the third indexing arm 35 to rise and fall, and flexibly adjusting the height of the positioning mechanism 4, so that the positioning mechanism 4 can adsorb and position wafers at different heights;

[0056] Step 3: The multiple Bernoulli suction cup bodies 44 in the positioning mechanism 4 are respectively placed on the lower surface of the corresponding wafers, and multiple wafers can be automatically sucked and positioned at one time by using the multiple Bernoulli suction cup bodies 44;

[0057] Step 4: Control and start the first motor 322 to drive the first rotating shaft 321 to rotate in the opposite direction, so that the third transfer arm 35 can be directly separated from the wafer storage rack in the work station frame 11;

[0058] Step 5: Control the third motor 533 to start driving the translation screw 531 to rotate, thereby controlling the translation slide 53 and the first positioning rod 54 to move toward the side close to the wafer, and at the same time drive the auxiliary frame 572 and the transmission rack 571 to move, thereby synchronously driving the transmission racks 571, the positioning frame 551, and the second positioning rod 56 on both sides to rotate toward each other, contact with the rest of the wafer, and cooperate with the movement of the first positioning rod 54 to correct the position of the wafer;

[0059] Step six, then, control the first transfer arm 33, the second transfer arm 34 and the third transfer arm 35 to transfer synchronously again, transfer the third transfer arm 35 to the position of the next work station frame 11, and then, insert the multiple position-corrected wafers into another work station frame 11 in a straight line for processing, so as to realize automatic and stable transportation and placement of multiple wafers.

[0060] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer handling device, comprising a protective cover (1), characterized in that: A plurality of workstation frames (11) are fixedly mounted on the outer side of the protective cover (1), a handling device (2) is fixedly mounted in the protective cover (1), the handling device (2) comprises a transfer mechanism (3), a positioning mechanism (4) is fixedly mounted on the end of the transfer mechanism (3), and a correction mechanism (5) is provided on the outer side of the positioning mechanism (4); The indexing mechanism (3) comprises an indexing outer cylinder (31), the indexing outer cylinder (31) is fixedly mounted on the middle part of the inner lower wall of the protective cover (1), a longitudinal sliding frame (32) is movably mounted on the top of the indexing outer cylinder (31), a first rotating shaft (321) is rotatably mounted on the middle part of the top end of the longitudinal sliding frame (32), a first indexing arm (33) is fixedly mounted on the top end of the first rotating shaft (321), a second rotating shaft (331) is rotatably mounted on the end of the first indexing arm (33) away from the first rotating shaft (321), a large sprocket (331) is provided on the inner side of the end of the first indexing arm (33) close to the first rotating shaft (321), and a plurality of sprockets (331) are provided on the inner side of the first indexing arm (33) and the inner side of the first indexing arm (33) are provided with a plurality of sprockets (331). 32), the large sprocket (332) is movably sleeved on the outside of the first rotating shaft (321), a first sleeve (3321) is fixedly installed in the middle of the bottom end of the large sprocket (332), the bottom end of the first sleeve (3321) extends out of the bottom end of the first transfer arm (33) and is fixedly installed in the middle of the top end of the longitudinal sliding frame (32), the first rotating shaft (321) movably passes through the first sleeve (3321), a small sprocket (333) is fixedly installed at the bottom of the second rotating shaft (331), and the outer sides of the large sprocket (332) and the small sprocket (333) are meshedly connected with a first chain (334); A second transfer arm (34) is fixedly mounted on the top of the second rotating shaft (331); a third rotating shaft (341) is rotatably mounted on one end of the second transfer arm (34) away from the second rotating shaft (331); a first sprocket (342) is disposed on the inner side of one end of the second transfer arm (34) close to the second rotating shaft (331); the first sprocket (342) is movably sleeved on the outer side of the second rotating shaft (331); a second sleeve (3421) is fixedly mounted on the middle part of the bottom end of the first sprocket (342); The bottom end of the second sleeve (3421) extends out of the bottom end of the second transfer arm (34) and is fixedly mounted on the top end of the first transfer arm (33); the second rotating shaft (331) movably passes through the second sleeve (3421); a second sprocket (343) is fixedly mounted on the bottom of the third rotating shaft (341); the first sprocket (342) and the second sprocket (343) are meshedly connected with a second chain (344) on their outer sides; and a third transfer arm (35) is fixedly mounted on the top end of the third rotating shaft (341).

2. A wafer handling device according to claim 1, characterized in that: The number of teeth of the large sprocket (332) is twice the number of teeth of the small sprocket (333), and the number of teeth of the first sprocket (342) and the second sprocket (343) are the same.

3. The wafer handling device according to claim 1, characterized in that: A first bearing (36) is fixedly clamped on the inner top of the indexing outer cylinder (31); a rotating sleeve (361) is fixedly clamped on the middle of the first bearing (36); the longitudinal sliding frame (32) is slidably clamped on the middle of the rotating sleeve (361); a fourth shaft (37) is rotatably mounted on the side of the top of the indexing outer cylinder (31) away from the rotating sleeve (361); a first transmission wheel (371) is fixedly mounted on the top of the rotating sleeve (361); a second transmission wheel (372) is fixedly mounted on the top of the fourth shaft (37); a transmission belt (373) is provided on the outer movable sleeves of the first transmission wheel (371) and the second transmission wheel (372); a lifting cylinder (38) is fixedly mounted on the inner lower wall of the indexing outer cylinder (31); a second bearing (381) is fixedly mounted on the driving end of the lifting cylinder (38); and the second bearing (381) is fixedly clamped on the middle of the bottom end of the longitudinal sliding frame (32).

4. The wafer handling device according to claim 1, characterized in that: The positioning mechanism (4) comprises a longitudinal sliding outer frame (41), wherein a plurality of longitudinal sliding seats (42) are slidingly provided in the longitudinal sliding outer frame (41) and are equidistantly distributed, wherein a connecting shaft (43) is fixedly provided in the middle of each longitudinal sliding seat (42), wherein a Bernoulli suction cup body (44) is fixedly provided at one end of each connecting shaft (43), wherein a U-shaped sliding frame (45) is fixedly provided on the side of the longitudinal sliding outer frame (41) away from the Bernoulli suction cup body (44), wherein the positioning mechanism (4) is vertically installed at the end of the third transfer arm (35) through the bottom of the U-shaped sliding frame (45), wherein an equidistant adjustment plate (46) is horizontally slidingly provided on the inner side of the U-shaped sliding frame (45), wherein an equidistant adjustment groove (401) corresponding to the connecting shaft (43) is provided on the equidistant adjustment plate (46), and wherein the connecting shaft (43) is slidably connected in the corresponding equidistant adjustment groove (401).

5. The wafer handling device according to claim 4, characterized in that: A telescopic rod (47) is fixedly mounted on the middle of one side of the U-shaped sliding frame (45) away from the longitudinal sliding outer frame (41); a driving frame (471) is fixedly mounted on the driving end of the telescopic rod (47); and the driving frame (471) is fixedly mounted on the middle of the equidistant adjustment plate (46).

6. The wafer handling device according to claim 4, characterized in that: The correction mechanism (5) comprises an L-shaped bracket (51) and a U-shaped rotating frame (52), wherein the L-shaped bracket (51) is fixedly mounted on the top of the longitudinal sliding outer frame (41), and the U-shaped rotating frame (52) is provided with two symmetrically distributed U-shaped rotating frames (52), which are fixedly mounted on the top of the longitudinal sliding outer frame (41) and the U-shaped sliding frame (45). The U-shaped rotating frame (52) and the L-shaped bracket (51) are vertically distributed, and a translation slide (53) is movably mounted on the top of the L-shaped bracket (51), and a first positioning rod (54) is vertically mounted on one end of the translation slide (53), and the first positioning rod (54) is slidably mounted on a side of a plurality of Bernoulli suction cup bodies (44) close to the longitudinal sliding outer frame (41), and a translation screw (531) is threadedly mounted on one end of the translation slide (53) away from the first positioning rod (54), and the translation screw (53 1) A rotating seat (532) is rotatably mounted on one end away from the translation slide (53), and the rotating seat (532) is fixedly mounted on the top of the longitudinal sliding outer frame (41); a rotating shaft (55) is rotatably mounted on one end of the U-shaped rotating frame (52) away from the U-shaped sliding frame (45); a positioning frame (551) is fixedly mounted on the bottom of the rotating shaft (55); a second positioning rod (56) is vertically mounted on one end of the positioning frame (551) away from the rotating shaft (55); a transmission gear (57) is fixedly mounted on the middle part of the rotating shaft (55); a transmission rack (571) is meshedly connected to the outer side of the transmission gear (57); an auxiliary frame (572) is vertically mounted on one end of the transmission rack (571) away from the transmission gear (57); and the auxiliary frame (572) is fixedly mounted on the outer side of the translation slide (53).

7. The wafer handling device according to claim 1, characterized in that: A first motor (322) is fixedly mounted on the inner top of the longitudinal sliding frame (32), and a driving end of the first motor (322) and a bottom end of the first rotating shaft (321) are fixedly mounted.

8. The wafer transport device according to claim 3, characterized in that: A second motor (39) is fixedly mounted on the side of the top end of the indexing outer cylinder (31) away from the rotating sleeve (361), and a driving end of the second motor (39) and a bottom end of the fourth shaft (37) are fixedly mounted.

9. The wafer handling device according to claim 6, characterized in that: A third motor (533) is fixedly mounted on the top end of the U-shaped sliding frame (45), and a driving end of the third motor (533) and an end of the translation screw (531) are fixedly mounted.

10. A method for using the wafer transport device according to any one of claims 1 to 9, characterized in that: The steps include: Step 1, by controlling the second motor (39) to start, drive the fourth shaft (37) to rotate, cooperate with the transmission of the first transmission wheel (371), the second transmission wheel (372) and the transmission belt (373), control the rotating sleeve (361) and the longitudinal sliding frame (32) to rotate, thereby controlling the first transfer arm (33), the second transfer arm (34) and the third transfer arm (35) to transfer synchronously, and transfer the third transfer arm (35) to the position of the loading station frame (11); Step 2: Control the first motor (322) to start driving the first rotating shaft (321) to rotate, thereby controlling the first transfer arm (33) to rotate a certain angle around the first rotating shaft (321), cooperate with the limit fixation of the large sprocket (332) and the meshing drive of the first chain (334), and the number of teeth of the large sprocket (332) is twice the number of teeth of the small sprocket (333), drive the second rotating shaft (331) to rotate in the opposite direction, thereby synchronously controlling the second transfer arm (34) to rotate in the opposite direction at twice the angle around the second rotating shaft (331), so that the end of the second transfer arm (34) away from the first transfer arm (33) moves straight along the diameter route; When the second transfer arm (34) performs synchronous and angular reverse rotation with the second rotating shaft (331) as the axis, in conjunction with the limiting fixation of the first sprocket (342) and the meshing drive of the second sprocket (343), the first sprocket (342) and the second sprocket (343) have the same number of teeth, driving the third rotating shaft (341) to rotate in the opposite direction, thereby controlling the third transfer arm (35) to perform synchronous and angular reverse rotation with the third rotating shaft (341) as the axis, so that the third transfer arm (35) always maintains a diameter path for linear movement, thereby facilitating the third transfer arm (35) to be linearly inserted into a wafer storage rack in one of the workstation frames (11); During this period, the lifting cylinder (38) is controlled to be turned on to drive the longitudinal sliding frame (32) to rise and fall in the rotating sleeve (361), thereby controlling the first indexing arm (33), the second indexing arm (34) and the third indexing arm (35) to rise and fall, and flexibly adjusting the height of the positioning mechanism (4), so that the positioning mechanism (4) can adsorb and position wafers at different heights; Step 3: The plurality of Bernoulli suction cup bodies (44) in the positioning mechanism (4) are respectively placed on the lower surface of the corresponding wafers, and the plurality of Bernoulli suction cup bodies (44) can be used to automatically suck and position the plurality of wafers at one time; Step 4: Control and start the first motor (322) to drive the first rotating shaft (321) to rotate in the opposite direction, so as to facilitate the third transfer arm (35) to linearly detach from the wafer storage rack in the workstation frame (11); Step 5: Control the third motor (533) to start driving the translation screw (531) to rotate, thereby controlling the translation slide (53) and the first positioning rod (54) to move toward the side close to the wafer, and at the same time drive the auxiliary frame (572) and the transmission rack (571) to move, thereby synchronously driving the transmission racks (571) on both sides, the positioning frame (551), and the second positioning rod (56) to rotate toward each other, contact with the rest of the wafer, and cooperate with the movement of the first positioning rod (54) to correct the position of the wafer; Step six, then, control the first transfer arm (33), the second transfer arm (34) and the third transfer arm (35) to transfer synchronously again, transfer the third transfer arm (35) to the position of the next work station frame (11), and then, insert the multiple position-corrected wafers into another work station frame (11) in a straight line for processing, so as to realize automatic and stable transportation and placement of multiple wafers.

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