Restoration device

Abstract

The invention provides a restoration device for wafer restoration. The restoration device comprises a first base; the driving roller is arranged on the first base, the driving roller is used for driving the wafer to rotate, and the rotating axis of the driving roller is parallel to the rotating axis of the wafer; the restoration assembly comprises a positioning piece and a supporting assembly, the positioning piece is used for being in positioning fit with the positioning notch of the wafer, and the supporting assembly can ascend and descend relative to the driving roller; and the restoration assembly is arranged on the driving assembly and is in driving fit with the driving assembly, so that after the positioning piece is in positioning fit with the positioning notch of the wafer, the supporting assembly is driven to ascend to lift the wafer and separate from the driving roller. According to the restoration device, the restoration assembly and the driving assembly are arranged, the positioning piece in the restoration assembly is in linkage fit with the supporting assembly through the driving assembly, and after the positioning piece is in positioning fit with the positioning notch of the wafer, the wafer is separated from the driving roller, so that friction between the driving roller and the wafer is avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a correction device. Background Art

[0002] In the field of semiconductor manufacturing, positioning notches are usually set on wafers to help subsequent transmission and scanning processes determine the placement and positioning of the wafers, and also mark the reference of the wafers, providing a reference for subsequent process, cutting, packaging, and testing. It can correct multiple disordered wafers and provide alignment conditions for subsequent processes.

[0003] In the prior art, a correction mechanism is used to cooperate with the wafer through a positioning notch, thereby realizing the correction operation of the wafer. However, after the wafer is positioned, the existing correction mechanism is easily caused to vibrate the wafer due to unreasonable settings, causing the correction mechanism and the wafer to be out of positioning cooperation, resulting in positioning failure. Summary of the invention

[0004] The present invention aims to at least solve the problem in the prior art that after the wafer is positioned, the correction mechanism is improperly set, which easily causes the wafer to vibrate and causes the correction mechanism and the wafer to be out of positioning and cooperation, and proposes a correction device.

[0005] In order to achieve the purpose of the present invention, a correction device for wafer correction is provided, comprising: a first base; a driving roller, which is arranged on the first base, the driving roller is used to drive the wafer to rotate, and the rotation axis of the driving roller is parallel to the rotation axis of the wafer; a correction component, comprising: a positioning member and a supporting component, the positioning member is used to position and cooperate with the positioning notch of the wafer, and the supporting component can be raised and lowered relative to the driving roller; a driving component, the correction component is arranged on the driving component and is driven and cooperated with the driving component, so that after the positioning member is positioned and cooperated with the positioning notch of the wafer, the supporting component is driven to rise to lift the wafer and separate it from the driving roller.

[0006] In some embodiments, there are multiple return assemblies, and the multiple return assemblies are arranged at intervals along the rotation axis direction of the wafer; the driving assembly is respectively driven and cooperated with each of the return assemblies, and the positioning member and the supporting assembly in the same return assembly are linked and cooperated through the driving assembly, so that after any positioning member is positioned and cooperated with the positioning notch of the wafer, the corresponding supporting assembly rises to lift the wafer and detach it from the driving roller.

[0007] In some embodiments, the driving assembly includes: a second base; a plurality of linkage structures, which are arranged inside the second base; a plurality of first driving rods, which are arranged one-to-one with the plurality of supporting assemblies and the plurality of linkage structures, and each of the first driving rods can be arranged on the second base in a liftable manner, the supporting assembly is drivingly connected to the corresponding first driving rod, and the first driving rod is drivingly matched with the corresponding linkage structure; a plurality of linkage rods, which are arranged one-to-one with the plurality of positioning members and the plurality of linkage structures, and each of the linkage rods can be arranged on the second base in a liftable manner, the positioning member is drivingly connected to the corresponding linkage rod, and the linkage rod is drivingly matched with the corresponding linkage structure; a plurality of elastic members, which are arranged one-to-one with the plurality of linkage rods, and the elastic members are connected to the corresponding linkage rods, and the elastic members are used to provide elastic force to the corresponding linkage rods so that the positioning member abuts against the corresponding wafer; after any of the positioning members is positioned and matched with the positioning notch of the corresponding wafer, the positioning member drives the linkage rod to cooperate with the first driving rod so that the corresponding supporting assembly rises.

[0008] In some embodiments, the linkage structure includes: a first power chamber, which is arranged in the second base, the first end of the first driving rod can be raised and lowered in the first power chamber, the second end of the first driving rod is fixedly connected to the support assembly, and the first power chamber is used to introduce fluid to drive the first driving rod to rise; a second power chamber, which is arranged in the second base, the first end of the linkage rod can be movably arranged in the second power chamber, the second end of the linkage rod is fixedly connected to the positioning member, and the second power chamber is connected to the fluid source; a first channel, whose first end is connected to the first power chamber, and the second end of the first channel is connected to the second power chamber, and the linkage rod avoids or blocks the second end of the first channel by lifting and lowering to connect or cut off the first power chamber and the second power chamber.

[0009] In some embodiments, the positioning member has a first position and a second position; in the first position, the positioning member abuts against the outside of the positioning notch, and the linkage rod blocks the second end of the first channel to cut off the first power chamber from the second power chamber; in the second position, the positioning member abuts against the positioning notch and is positioned to limit the rotation of the wafer, and the linkage rod avoids the second end of the first channel to connect the first power chamber with the second power chamber.

[0010] In some embodiments, each of the support assemblies comprises: two support members, the two support members are respectively arranged on both sides of the positioning member in the same correction assembly; each of the first drive rods comprises: two sub-drive rods, each of the sub-drive rods is connected to one of the support members in the corresponding support assembly; each of the linkage structures comprises: two first power chambers and two first channels, each of the first power chambers is connected to the second power chamber through one of the first channels; each sub-drive rod is arranged in one of the first power chambers of the corresponding linkage structure.

[0011] In some embodiments, the plurality of second power chambers of the plurality of linkage structures are spaced apart along the axial direction of the driving roller, and a first flow hole is provided between two adjacent second power chambers and the chambers are interconnected through the first flow hole; a limiting structure is provided at the first end of each linkage rod, and the limiting structure is used to limit the descending position of the linkage rod so that the linkage rod always avoids the first flow hole during the lifting process.

[0012] In some embodiments, the driving assembly also includes: a second driving rod, which is liftably disposed on the second base, the second driving rod is elastically connected to the linkage rod, and the second driving rod drives the linkage rod to rise or fall by moving, so that the positioning piece abuts against or separates from the wafer.

[0013] In some embodiments, the linkage structure also includes: a third power chamber, which is arranged in the second base, the third power chamber is located above the second power chamber, and the third power chamber is connected to a fluid source; the linkage rod passes through the third power chamber, and an outer circumferential wall of the linkage rod and an inner circumferential wall of the third power chamber form a gap; the second drive rod includes: a hollow rod, a piston ring and an installation chamber, the first end of the hollow rod is located in the third power chamber, the second end of the hollow rod is located above the second base, the piston ring is connected to the first end of the hollow rod, and the installation chamber is connected to the second end of the hollow rod; the linkage rod is movably inserted into the piston ring, the hollow rod and the installation chamber, an elastic member is provided in the installation chamber, and the second drive rod and the linkage rod are connected through the elastic member.

[0014] In some embodiments, there are multiple third power chambers and second drive rods, and the second drive rods, the third power chambers and the connecting rods are arranged in a one-to-one correspondence. Each second drive rod can be movably arranged in the corresponding third power chamber, and each connecting rod can be movably passed through the corresponding second drive rod, and adjacent third power chambers are connected to each other.

[0015] The correction device of the present invention is provided with a correction component and a driving component, and the positioning piece and the supporting component in the correction component are linked and matched through the driving component. After the positioning piece is positioned and matched with the positioning notch of the wafer, the wafer is lifted to separate the wafer from the driving roller, thereby avoiding friction between the driving roller and the stopped wafer, thereby avoiding the occurrence of positioning failure due to vibration, and can also reduce the occurrence of dust and increase the service life of the driving roller. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural diagram of a correction mechanism in the related art;

[0017] Figure 2 It is a structural schematic diagram of a correction device according to an embodiment of the present invention;

[0018] Figure 3 It is a structural schematic diagram of a positioning member of a correction device according to an embodiment of the present invention in a first position;

[0019] Figure 4 It is a structural schematic diagram of a positioning member of a correction device according to an embodiment of the present invention in a second position;

[0020] Figure 5 A schematic diagram of the structure of a driving assembly of a correction device according to an embodiment of the present invention;

[0021] Figure 6 It is a schematic diagram of the first power chamber and the second power chamber of the correction device of the embodiment of the present invention when they are cut off;

[0022] Figure 7 This is a schematic diagram of the first power chamber and the second power chamber of the correction device according to an embodiment of the present invention being connected;

[0023] Figure 8 A cross-sectional view of a three-dimensional view of a full-time driving assembly for correcting an embodiment of the present invention;

[0024] List of reference numerals:

[0025] 10. Guard teeth; 20. Support teeth; 30. Drive roller; 40. First base; 50. Alignment assembly; 51. Positioning member; 52. Support assembly; 521. Support member; 60. Drive assembly; 61. Second base; 62. First drive rod; 621. Sub-drive rod; 63. Linkage rod; 631. Positioning protrusion; 64. Elastic member; 65. Linkage structure; 651. First power chamber; 652. Second power chamber; 653. First channel; 654. Third power chamber; 655. First flow hole; 656. Second flow hole; 66. Second drive rod; 661. Hollow rod; 662. Piston ring;

[0026] 663, installation chamber; 664, limiting ring; 70, connecting pipe; 71, connecting hole; 72, connecting hole; 100, wafer; 110, positioning notch. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the technical solution of the present invention, the correction device provided by the present invention is described in detail below with reference to the accompanying drawings.

[0028] In the field of semiconductor manufacturing, positioning notches are usually set on wafers to help subsequent transmission and scanning processes determine the placement and positioning of the wafers, and also mark the reference of the wafers, providing a reference for subsequent process, cutting, packaging, and testing. It can correct multiple disordered wafers and provide alignment conditions for subsequent processes.

[0029] In some related technologies, a correction mechanism is used to coordinate with the wafer through the positioning notch, thereby realizing the correction operation of the wafer. Figure 1 As shown, the correction mechanism includes: a bracket (not shown in the figure), a tooth guard 1, a supporting tooth 2, a positioning baffle 3, a driving roller 4 and a lifting platform 5.

[0030] Among them, the guard teeth 1 and the supporting teeth 2 are fixedly connected to the bracket, and the bracket can be fixed on the ground. There are two guard teeth 1, which are respectively arranged on the left and right sides of the wafer 100, and are used to limit the wafer 100 so that the wafer 100 can be kept vertically set; there are also two supporting teeth 2, both of which are arranged at the bottom of the wafer 100 and are arranged at intervals to support the wafer 100.

[0031] The lifting platform 5 can be raised and lowered relative to the bracket, and the positioning baffle 3 and the driving roller 4 are connected to the lifting platform 5 and rise and fall with the lifting platform 5. When the lifting platform 5 rises to a preset position, the positioning baffle 3 and the driving roller 4 both abut against the outer periphery of the wafer 100, and the driving roller 4 drives the wafer 100 to rotate. When the positioning notch 110 rotates to the position of the positioning baffle 3, the positioning baffle 3 enters the positioning notch 110, thereby limiting the rotation of the wafer 100 in the circumferential direction, thereby achieving positioning.

[0032] However, in general, multiple wafers 100 need to be aligned at one time, that is, multiple wafers 100 need to be arranged at intervals in the axial direction of the driving roller 4, and the driving roller 4 needs to drive multiple wafers 100 to rotate at the same time, and the length direction of the positioning baffle 3 is also arranged along the axial direction of the driving roller 4, so as to be positioned and matched with the positioning notches 110 of multiple wafers 100, and whenever the positioning notch 110 of a wafer 100 rotates to be positioned and matched with the positioning baffle 3, the wafer 100 will stop rotating. However, the driving roller 4 will not stop rotating, but will continue to rotate to allow other unaligned wafers 100 to continue rotating until all wafers 100 are positioned and matched with the corresponding positioning baffles 3, that is, all wafers 100 rotate to the same position, and then the driving roller 4 will stop rotating.

[0033] Therefore, after any wafer 100 is positioned, since the drive roller 4 is still rotating, the wafer 100 will still rub against the drive roller 4 after being stuck by the positioning baffle 3, causing the wafer 100 to vibrate, and the vibrating wafer 100 can easily break away from the positioning baffle 3, resulting in positioning failure. Moreover, when the wafer 100 is stuck by the positioning baffle 3, the continuous friction between the wafer 100 and the drive roller 4 will cause a large amount of dust to be generated, thereby contaminating the wafer 100. In addition, since the drive roller 4 is made of non-metallic material and is easily worn, frequent friction with the wafer 100 will result in a short service life.

[0034] In addition, with the existing correction mechanism, after correction, although the positioning notch 110 of the wafer 100 faces the same direction, the wafer 100 cannot satisfy the problem that the positioning notch 110 is vertically upward or facing other specified directions. The reason is that the driving roller 4 and the positioning baffle 3 are synchronously abutted or separated from the wafer 100. Therefore, the driving roller 4 cannot contact the wafer 100 alone, resulting in the inability to achieve direction adjustment of the wafer 100 after correction.

[0035] In order to solve the above-mentioned problems, the present invention discloses a correction device for wafer correction. Like the correction mechanism in the related art, the correction device also includes: a bracket (not shown in the figure), a guard tooth 10, a supporting tooth 20, a driving roller 30 and a first base 40. The guard tooth 10 and the supporting tooth 20 are fixedly connected to the bracket, and the bracket can be fixed on a support object, such as the ground. There are two supporting teeth 20, and each supporting tooth 20 is provided with a plurality of tooth grooves along the first horizontal direction for placing the wafer 100. The two supporting teeth 20 are both arranged at the bottom of the wafer 100 and are spaced apart in the second horizontal direction so as to support the wafer 100 in the vertical direction. There are two guard teeth 10 and they are respectively arranged in the second horizontal direction and spaced apart. Each guard tooth 10 is provided with a plurality of limit grooves along the first horizontal direction, such as Figure 2As shown, two teeth guards 10 are located on the left and right sides of the middle of the wafer 100, and are used to limit the position of the wafer 100 so that the wafer 100 remains parallel to the vertical direction. Figure 2 As shown, the first base 40 is liftable relative to the bracket, and the driving roller 30 is arranged along the first horizontal direction to drive the wafer 100 to rotate. That is, the rotation axis of the driving roller 30 is parallel to the rotation axis of the wafer 100, and the driving roller 30 is also arranged on the first base 40.

[0036] Different from the related art, the correction device of the present invention further comprises: a correction component 50 and a driving component 60. Figure 2 In the illustrated embodiment, the alignment assembly 50 and the driving assembly 60 are also disposed on the first base 40 , and the alignment assembly 50 , the driving assembly 60 and the driving roller 30 can all be raised and lowered along with the first base 40 .

[0037] The return assembly 50 includes: a positioning member 51 and a support assembly 52. ​​The positioning member 51 is used to position and cooperate with the positioning notch 110 of the wafer 100, and the support assembly 52 can be raised and lowered relative to the driving roller 30. The return assembly 50 is arranged on the driving assembly 60 and is driven and cooperated with the driving assembly 60, so that after the positioning member 51 is positioned and cooperated with the positioning notch 110 of the wafer 100, the support assembly 52 is driven to rise to lift the wafer 100 and separate it from the driving roller 30.

[0038] When the wafer 100 is corrected, the first base 40 rises, the driving roller 30 is pressed against the outer periphery of the wafer 100 and the wafer 100 is driven to rotate, and the positioning member 51 is also pressed against the outer periphery of the wafer 100. As the wafer 100 rotates, when the positioning notch 110 on the wafer 100 is positioned and matched with the positioning member 51, the wafer 100 stops rotating. At the same time, the positioning member 51 is linked and matched with the supporting assembly 52 through the driving assembly 60, so that the supporting assembly 52 rises, the wafer 100 is lifted and separated from the driving roller 30, so that the driving roller 30 is separated from the driving cooperation with the wafer 100, thereby preventing the driving roller 30 from rubbing against the stopped wafer 100.

[0039] The correction device of the present invention is provided with a correction component 50 and a driving component 60, and the positioning member 51 and the supporting component 52 in the correction component 50 are linked and matched through the driving component. After the positioning member 51 is positioned and matched with the positioning notch 110 of the wafer 100, the wafer 100 is lifted and separated from the driving roller 30, thereby avoiding friction between the driving roller 30 and the stopped wafer 100, thereby avoiding the occurrence of positioning failure due to vibration, and can also reduce the occurrence of dust and increase the service life of the driving roller 30.

[0040] It should be noted that, in the present embodiment, the alignment component 50 and the drive component 60 are also arranged on the first base 40, but this is not restrictive. In some other embodiments not shown in the figure, the alignment component 50 and the drive component 60 can also be arranged on other structures. As long as the alignment component 50 can be matched with the wafer 100 and the positioning member 51 is positioned and matched with the positioning notch 110 of the wafer 100, the wafer 100 can be separated from the drive roller 30. No limitation is made here.

[0041] In some embodiments, there are multiple alignment components 50, and the multiple alignment components 50 are arranged at intervals along the rotation axis direction of the wafer 100; the driving component 60 is respectively driven and cooperated with each alignment component 50, and the positioning member 51 and the support component 52 in the same alignment component 50 are linked and cooperated through the driving component 60, so that after any positioning member 51 is positioned and cooperated with the positioning notch 110 of the wafer 100, the corresponding support component 52 rises to lift the wafer 100 and detach it from the driving roller 30.

[0042] Specifically, multiple alignment components 50 are arranged at intervals along the rotation axis direction of the wafer 100, that is, all the alignment components 50 are arranged at intervals along the first horizontal direction, and the alignment components 50 are used to correspond one-to-one with the wafer 100. Each alignment component 50 includes: a positioning member 51 and a group of support components 52. The positioning member 51 is used to position and cooperate with the corresponding positioning notch 110 of the wafer 100, so that the wafer 100 stops rotating after rotating to a preset direction, and the support component 52 can be raised and lowered relative to the driving roller 30; the driving component 60 is respectively driven and cooperated with each alignment component 50, and the positioning member 51 and the support component 52 in the same alignment component 50 are linked and cooperated through the driving component 60, so that after any positioning member 51 is positioned and cooperated with the positioning notch 110 of the wafer 100, the corresponding support component 52 rises to lift the wafer 100 and separate it from the driving roller 30.

[0043] When the wafer 100 is oriented, Figure 2 As shown, a plurality of wafers 100 to be corrected are first placed on the correction device, and supported and limited by the supporting teeth 20 and the guard teeth 10, so that each wafer 100 corresponds to a correction component 50. Figure 3 As shown, the first base 40 is raised to push the driving roller 30 against all the wafers 100, so that all the wafers 100 rotate together, and each positioning member 51 is pressed against the outer periphery of the corresponding wafer 100. As the driving roller 30 drives all the wafers 100 to rotate, for any wafer 100, Figure 4As shown, when the wafer 100 rotates to the positioning notch 110 and is positioned and matched with the corresponding positioning member 51, it stops rotating. At the same time, the positioning member 51 is linked and matched with the corresponding support assembly 52 through the driving assembly 60, so that the support assembly 52 rises, lifts the wafer 100 and disengages it from the driving roller 30, thereby disengaging the wafer 100 from the driving roller 30, thereby preventing the wafer 100 from rubbing against the rotating driving roller 30 after stopping.

[0044] The correction device of the present invention is provided with a plurality of correction components 50, and each correction component 50 is provided with a positioning member 51 and a supporting member 52 that cooperate with each other. The positioning member 51 is connected with the supporting member 52, so that the wafer 100 that cooperates with the positioning member 51 can be lifted, and the wafer 100 can be separated from the driving roller 30, thereby avoiding friction between the stopped wafer 100 and the rotating driving roller 30, thereby avoiding the occurrence of positioning failure due to vibration, and can also reduce the occurrence of dust and increase the service life of the driving roller 30.

[0045] In this embodiment, the first horizontal direction (that is, the direction of the rotation axis of the wafer 100 and the direction of the rotation axis of the driving roller 30) is the x-axis direction, the second horizontal direction is the y-axis direction, and the vertical direction is the z-axis direction, wherein the first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other.

[0046] The correction device of the present invention is specifically described below in conjunction with specific embodiments:

[0047] like Figure 5As shown, the driving assembly 60 includes: a second base 61, a linkage structure 65, a first driving rod 62, a linkage rod 63 and an elastic member 64. A plurality of linkage structures 65 are arranged inside the second base 61; there are a plurality of first driving rods 62, and a plurality of first driving rods 62 are arranged one-to-one with a plurality of supporting assemblies 52 and a plurality of linkage structures 65. Each first driving rod 62 can be lifted and lowered on the second base 61, and the supporting assemblies 52 are drivingly connected to the corresponding first driving rod 62, and the first driving rod 62 is drivingly matched with the corresponding linkage structure 65. A plurality of linkage rods 63 are arranged one-to-one with a plurality of positioning members 51 and a plurality of linkage structures 65, and each linkage rod 63 can be lifted and lowered on the second base 61, and the positioning members 51 are drivingly connected to the corresponding linkage rod 63, and the linkage rod 63 is drivingly matched with the corresponding linkage structure 65. There are multiple elastic members 64, and the multiple elastic members 64 are arranged in a one-to-one correspondence with the multiple linkage rods 63. The elastic members 64 are connected to the corresponding linkage rods 63. The elastic members 64 are used to provide elastic force to the corresponding linkage rods 63 so that the positioning member 51 abuts against the corresponding wafer 100; when any positioning member 51 is positioned and matched with the positioning notch 110 of the corresponding wafer 100, the positioning member 51 drives the linkage rod 63 to cooperate with the first driving rod 62 so that the supporting assembly 52 corresponding to the positioning member 51 rises, thereby lifting the wafer 100 rotated to a preset direction.

[0048] It should be noted that a positioning notch 110 for positioning is disposed on the outer periphery of each wafer 100 , the positioning notch 110 is V-shaped, and the positioning member 51 is used for positioning and cooperating with the positioning notch 110 of the wafer 100 .

[0049] Specifically, if Figure 3 and Figure 4 As shown, when the first base 40 is lifted up to make the driving roller 30 contact the wafer 100, the positioning member 51 moves to a position close to the wafer 100 and abuts against the outer periphery of the corresponding wafer 100 under the action of the elastic member 64. The positioning member 51 has a first position and a second position. Figure 3 As shown in FIG. 1 , in the first position, the positioning member 51 abuts against the outside of the positioning notch 110. When the driving roller 30 drives the wafer 100 to rotate, when the wafer 100 rotates to the same position as the positioning notch 110 and the positioning member 51, as shown in FIG. Figure 4 As shown, the positioning member 51 rises to the second position under the action of the elastic member 64, that is, the positioning member 51 abuts against the positioning notch 110 and is positioned and matched, thereby limiting the rotation of the wafer 100. After the positioning member 51 rises to the second position, the linkage rod 63 and the first driving rod 62 are linked to each other, so that the supporting assembly 52 rises and lifts the corresponding wafer 100, thereby separating the wafer 100 from the driving roller 30.

[0050] like Figure 5As shown, the linkage structure 65 includes: a first power chamber 651, a second power chamber 652 and a first channel 653. The first power chamber 651 is arranged in the second base 61, the first end of the first driving rod 62 is arranged in the first power chamber 651 in a manner that it can be raised and lowered, the second end of the first driving rod 62 is fixedly connected to the support assembly 52, and the first power chamber 651 is used to pass fluid (such as compressed air) to drive the first driving rod 62 to rise. In other words, the first end of the first driving rod 62 is equivalent to a piston and is slidably sealed with the inner circumferential wall of the first power chamber 651. When the fluid is filled between the bottom of the first power chamber 651 and the first driving rod 62, the fluid will apply a vertical upward thrust to the first end of the first driving rod 62, thereby pushing the first driving rod 62 to rise, thereby causing the support assembly 52 to rise and lift the wafer 100; and when the fluid is discharged from the first power chamber 651, the first driving rod 62 descends under the action of gravity, thereby causing the support assembly 52 to also descend.

[0051] like Figure 5 As shown, the second power chamber 652 is arranged in the second base 61, the first end of the linkage rod 63 is movably arranged in the second power chamber 652, the second end of the linkage rod 63 is fixedly connected to the positioning member 51, and the second power chamber 652 is connected to the fluid source. The first end of the first channel 653 is connected to the first power chamber 651, and the second end of the first channel 653 is connected to the second power chamber 652. The linkage rod 63 avoids or blocks the second end of the first channel 653 by lifting and lowering, so that the first power chamber 651 is connected or cut off with the second power chamber 652. In other words, the linkage rod 63 moves with the positioning member 51, and the positioning member 51 controls the connection or cutoff of the first power chamber 651 and the second power chamber 652 by driving the linkage rod 63 to lift and lower.

[0052] Exemplarily, the first end of the first channel 653 is connected to the bottom of the first power chamber 651, and the second end of the first channel 653 is connected to the middle of the second power chamber 652. A connecting tube 70 is provided at the first end of the linkage rod 63, and a connecting hole 71 and a connecting hole 72 are provided on the outer peripheral wall of the connecting tube 70. Figure 6 As shown, when the positioning member 51 is located at the first position, that is, the positioning member 51 abuts against the outside of the positioning notch 110, at this time, driven by the positioning member 51, the connecting pipe 70 is offset from the first channel 653 and is located below the first channel 653, and the outer peripheral wall of the linkage rod 63 blocks the second end of the first channel 653, so that the first power chamber 651 and the second power chamber 652 are cut off. Figure 7As shown, when the positioning member 51 is located at the second position, that is, the positioning member 51 is against the positioning notch 110 to limit the rotation of the wafer 100, driven by the positioning member 51, the linkage rod 63 rises so that its second end is higher than the first channel 653, that is, the linkage rod 63 avoids the second end of the first channel 653, so that the second end of the first channel 653 corresponds to and is connected with the connecting hole 71, and the connecting hole 72 is connected with the inside of the second power chamber 652. Therefore, the first power chamber 651 and the second power chamber 652 are connected through the first channel 653, the connecting hole 71, the connecting tube 70, and the connecting hole 72. That is to say, when the positioning member 51 is in the first position, the first power chamber 651 and the second power chamber 652 are cut off and not connected, and the first driving rod 62 has no fluid to push it, so it will not rise; when the positioning member 51 is in the second position, the fluid provided by the fluid source enters the second power chamber 652, and then flows into the first power chamber 651 through the connecting hole 72, the connecting tube 70, the connecting hole 71, and the first channel 653, thereby pushing the first driving rod 62 to rise, so that the supporting assembly 52 lifts the corresponding wafer 100 and disengages it from the driving roller 30.

[0053] For example, Figure 5 As shown, each support assembly 52 includes: two support members 521, the two support members 521 are arranged at intervals along a second horizontal direction intersecting the first horizontal direction, and the positioning member 51 is located between the two support members 521, that is, the two support members 521 are respectively arranged on both sides of the positioning member 51 in the same correction assembly 50. By providing two support members 521, the force on the wafer 100 can be more balanced, thereby ensuring the stability of the wafer 100 when being lifted.

[0054] It is understandable that if Figure 5 As shown, each first driving rod 62 includes: two sub-driving rods 621, each sub-driving rod 621 is connected to a supporting member 521 in the corresponding supporting assembly 52; each linkage structure 65 includes: two first power chambers 651 and two first channels 653, each first power chamber 651 is connected to the second power chamber 652 through a first channel 653; each sub-driving rod 621 is arranged in a first power chamber 651 of the corresponding linkage structure 65. By setting two first power chambers 651 and two first channels 653, in conjunction with two sub-driving rods 621, the synchronous rise of two supporting members 521 in the same correction assembly 50 can be achieved, thereby ensuring the stability of the wafer 100 lifting.

[0055] In this embodiment, if Figure 6 and Figure 7As shown, the multiple linkage structures 65 have multiple second power chambers 652, and the multiple second power chambers 652 are spaced apart along the first horizontal direction. A first flow hole 655 is provided between two adjacent second power chambers 652 and the chambers are interconnected through the first flow hole 655. A limiting structure is provided at the first end of each linkage rod 63, and the limiting structure is used to limit the descending position of the linkage rod 63 so that the linkage rod 63 always avoids the first flow hole 655 during the lifting process.

[0056] Exemplarily, the limiting structure is a connecting tube 70. By providing the connecting tube 70, the connecting tube 70 can cooperate with the bottom limiting of the second power chamber 652 to prevent the first end of the linkage rod 63 from being too low and blocking the first flow hole 655, so that the adjacent second power chamber 652 cannot flow into the fluid. Figure 6 and Figure 7 As shown, the connecting hole 72 is a waist-shaped hole, and the length direction of the waist-shaped hole is the vertical direction. It can be understood that there are two waist-shaped holes, and the two waist-shaped holes are arranged on the outer peripheral wall of the connecting tube 70 at intervals along the first horizontal direction to ensure that the first flow hole 655 is always located within the range of the connecting hole 72, so as to connect the second power chamber 652 with two other adjacent second power chambers 652. In addition, the fluid inlet of the first second power chamber 652 is also arranged at a position corresponding to the waist-shaped hole to ensure that the fluid inlet is always connected with the inside of the second power chamber 652 during the lifting and lowering process of the linkage rod 63.

[0057] Exemplarily, there are two driving rollers 30 , which are spaced apart on the first base 40 along the second horizontal direction. Using two driving rollers 30 can reduce the friction between the wafer 100 and a single driving roller 30 , thereby reducing dust generation.

[0058] like Figure 5As shown, the driving assembly 60 includes: a second driving rod 66. The second driving rod 66 is arranged on the second base 61 in a liftable manner, and the second driving rod 66 is elastically connected to the linkage rod 63. The second driving rod 66 drives the linkage rod 63 to rise or fall by moving, so that the positioning member 51 abuts against the wafer 100 or is separated from the wafer 100. By setting the second driving rod 66, after the first base 40 rises, the linkage rod 63 can be driven to rise by the second driving rod 66, so that the positioning member 51 abuts against the outer periphery of the corresponding wafer 100, so that the wafer 100 rotated to the preset direction is positioned and matched with the corresponding positioning member 51. After all the wafers 100 are rotated to the preset direction, the driving roller 30 is stopped, and the fluid is stopped from being input into the second power chamber 652, and under the action of gravity, the support frame descends, so that the wafer 100 contacts the driving roller 30 again. At this time, the positioning member 51 is still against the positioning notch 110. The second driving rod 66 is used to lower the positioning member 51 and disengage it from the wafer 100. Then the driving roller 30 is started. All wafers 100 with the same orientation can be synchronously rotated to any direction, thereby adjusting the direction of the positioning notch 110 of the complete wafer 100 with high repeatability.

[0059] For example, Figure 6 and Figure 7 As shown, the linkage structure 65 further includes: a third power chamber 654. The third power chamber 654 is disposed in the second base 61, the third power chamber 654 is located above the second power chamber 652, and the third power chamber 654 is connected to the fluid source. The linkage rod 63 passes through the third power chamber 654, and a gap is formed between the outer peripheral wall of the linkage rod 63 and the inner peripheral wall of the third power chamber 654.

[0060] like Figure 6 and Figure 7 As shown, the second driving rod 66 includes: a hollow rod 661, a piston ring 662 and an installation chamber 663. The first end of the hollow rod 661 is located in the third power chamber 654, the second end of the hollow rod 661 is located above the second base 61, the piston ring 662 is connected to the first end of the hollow rod 661, and the installation chamber 663 is connected to the second end of the hollow rod 661; the linkage rod 63 is movably arranged in the piston ring 662, the hollow rod 661 and the installation chamber 663, and an elastic member 64 is arranged in the installation chamber 663, and a limited protrusion 631 is arranged on the outer peripheral wall of the linkage rod 63, and the elastic member 64 is sleeved on the linkage rod 63, and one end of the elastic member 64 abuts on the limited protrusion 631, and the other end abuts on the bottom of the installation chamber 663, so that the second driving rod 66 and the linkage rod 63 are connected through the elastic member 64.

[0061] When fluid is introduced into the third power chamber 654, the fluid exerts a vertical upward thrust on the piston ring 662, causing the hollow rod 661 to rise, and the rising hollow rod 661 drives the linkage rod 63 to rise through the elastic member 64, thereby causing the positioning member 51 to rise. When the fluid stops flowing into the third power chamber 654, the linkage rod 63 descends under the action of gravity, thereby driving the second driving rod 66 to descend through the elastic member 64.

[0062] It is understandable that if Figure 8 As shown, there are multiple third power chambers 654 and second drive rods 66, and the second drive rods 66, the third power chambers 654 and the connecting rods 63 are arranged in a one-to-one correspondence. Each second drive rod 66 can be movably arranged in the corresponding third power chamber 654, and each connecting rod 63 can be movably passed through the corresponding second drive rod 66. Second flow holes 656 are arranged between adjacent third power chambers 654 and are connected to each other through the second flow holes 656.

[0063] It should be noted that a limit ring 664 is provided on the outer wall of the hollow rod 661 , and the limit ring 664 is located outside the second base 61 , and is used to cooperate with the second base 61 to prevent the piston ring 662 from being too low and blocking the second flow hole 656 .

[0064] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A correction device for wafer correction, characterized in that: include: First Pedestal; A driving roller, disposed on the first base, the driving roller is used to drive the wafer to rotate, and the rotation axis of the driving roller is parallel to the rotation axis of the wafer; A correction component, comprising: a positioning member and a support component, wherein the positioning member is used to position and cooperate with the positioning notch of the wafer, and the support component can be raised and lowered relative to the driving roller; The driving assembly, the correction assembly is arranged on the driving assembly and cooperates with the driving assembly, so that after the positioning piece is positioned and matched with the positioning notch of the wafer, the supporting assembly is driven to rise to lift the wafer and separate it from the driving roller.

2. The correction device according to claim 1, characterized in that: There are a plurality of return assemblies, and the plurality of return assemblies are arranged at intervals along the rotation axis direction of the wafer; The driving assembly is respectively driven and cooperated with each of the return assemblies, and the positioning member and the supporting assembly in the same return assembly are linked and cooperated through the driving assembly, so that after any positioning member is positioned and cooperated with the positioning notch of the wafer, the corresponding supporting assembly rises to lift the wafer and detach it from the driving roller.

3. The correction device according to claim 2, characterized in that: The drive assembly comprises: Second Plinth; A plurality of linkage structures are arranged inside the second base; A plurality of first driving rods are arranged corresponding to the plurality of the supporting assemblies and the plurality of the linkage structures. Each of the first driving rods can be lifted and lowered on the second base. The supporting assemblies are drivingly connected to the corresponding first driving rods, and the first driving rods are drivingly matched with the corresponding linkage structures. A plurality of linkage rods are arranged corresponding to the plurality of positioning members and the plurality of linkage structures one by one, each linkage rod is arranged on the second base in a liftable manner, the positioning member is drivingly connected to the corresponding linkage rod, and the linkage rod is drivingly matched with the corresponding linkage structure; A plurality of elastic members are arranged corresponding to the plurality of linkage rods one by one, the elastic members are connected to the corresponding linkage rods, and the elastic members are used to provide elastic force to the corresponding linkage rods so that the positioning members abut against the corresponding wafers; After any of the positioning members is positioned and matched with the corresponding positioning notch of the wafer, the positioning member drives the linkage rod to be linked and matched with the first driving rod to make the corresponding supporting assembly rise.

4. The correction device according to claim 3, characterized in that: The linkage structure includes: a first power chamber, which is disposed in the second base; a first end of the first driving rod is movably disposed in the first power chamber; a second end of the first driving rod is fixedly connected to the supporting assembly; and the first power chamber is used to introduce fluid to drive the first driving rod to rise; A second power chamber is disposed in the second base, the first end of the linkage rod is movably disposed in the second power chamber, the second end of the linkage rod is fixedly connected to the positioning member, and the second power chamber is communicated with a fluid source; The first channel has a first end connected to the first power chamber, and a second end connected to the second power chamber. The linkage rod avoids or blocks the second end of the first channel by lifting and lowering to connect or disconnect the first power chamber with the second power chamber.

5. The correction device according to claim 4, characterized in that: The positioning member has a first position and a second position; In the first position, the positioning member abuts against the outside of the positioning notch, and the linkage rod blocks the second end of the first channel, so that the first power chamber is cut off from the second power chamber; In the second position, the positioning member abuts against the positioning notch and is positioned to limit the rotation of the wafer, and the linkage rod avoids the second end of the first channel to allow the first power cavity to communicate with the second power cavity.

6. The correction device according to claim 4, characterized in that: Each of the support assemblies comprises: two support members, the two support members are respectively arranged on both sides of the positioning member in the same correction assembly; Each of the first driving rods comprises: two sub-driving rods, each of the sub-driving rods is connected to one of the supporting members of the corresponding supporting assembly; Each of the linkage structures comprises: two first power chambers and two first channels, each of the first power chambers is connected with the second power chamber through one of the first channels; each sub-driving rod is arranged in one of the first power chambers of the corresponding linkage structure.

7. The correction device according to claim 4, characterized in that: The plurality of second power chambers of the plurality of linkage structures are spaced apart along the axis direction of the driving roller, and a first flow hole is provided between two adjacent second power chambers and the chambers are connected to each other through the first flow hole; A limiting structure is provided at the first end of each linkage rod, and the limiting structure is used to limit the descending position of the linkage rod, so that the linkage rod always avoids the first flow hole during the lifting process.

8. The correction device according to claim 4, characterized in that: The drive assembly also includes: The second driving rod is liftably arranged on the second base, the second driving rod is elastically connected to the linkage rod, and the second driving rod drives the linkage rod to rise or fall by moving, so that the positioning member abuts against or separates from the wafer.

9. The correction device according to claim 8, characterized in that: The linkage structure also includes: A third power chamber is disposed in the second base, the third power chamber is located above the second power chamber, and the third power chamber is connected to a fluid source; The linkage rod passes through the third power chamber, and a gap is formed between the outer peripheral wall of the linkage rod and the inner peripheral wall of the third power chamber; The second driving rod includes: a hollow rod, a piston ring and an installation chamber, the first end of the hollow rod is located in the third power chamber, the second end of the hollow rod is located above the second base, the piston ring is connected to the first end of the hollow rod, and the installation chamber is connected to the second end of the hollow rod; the linkage rod is movably inserted into the piston ring, the hollow rod and the installation chamber, an elastic member is arranged in the installation chamber, and the second driving rod and the linkage rod are connected via the elastic member.

10. The correction device according to claim 9, characterized in that: There are multiple third power chambers and second drive rods. The second drive rods, the third power chambers and the linkage rods are arranged in a one-to-one correspondence. Each of the second drive rods can be movably arranged in the corresponding third power chamber, and each of the linkage rods can be movably passed through the corresponding second drive rod. Adjacent third power chambers are connected to each other.

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