Device for alignment of eutectic machine

Abstract

The invention discloses a device for eutectic machine alignment, and relates to the field of eutectic machine alignment equipment.The device comprises a base and a high-precision alignment platform arranged at the top end of the base, a control substrate is fixed to the top end of the high-precision alignment platform, and a quartz negative pressure adsorption plate is arranged above the control substrate; a sapphire lining plate is fixed to the lower portion of the quartz negative pressure adsorption plate in an adsorption mode, sliding grooves are formed in the center of the base and the center of the high-precision alignment platform correspondingly, the two sliding grooves are staggered, and driving mechanisms are arranged in the two sliding grooves correspondingly; the driving mechanism comprises a lead screw rotationally arranged in the sliding groove and sliding blocks connected to the lead screw in a threaded and sleeving mode, and the top ends of the two sliding blocks are fixedly connected with the high-precision alignment platform and the control base plate respectively. According to the invention, the laser plane beam passes through the quartz negative pressure adsorption device to heat and weld the aligned and fixed Micro LED and the control substrate, so that the damage to the Micro LED caused by secondary melting of a single transfer eutectic welding point of the single Micro LED is avoided.

Description

Technical Field

[0001] The invention relates to the field of eutectic machine alignment equipment, and in particular to a device used for eutectic machine alignment. Background Art

[0002] Micro LED eutectic equipment is a kind of equipment with high precision requirements, stable operation and precision. It is widely used in semiconductor, LED and other electronic industries. It is very important to heat and weld the eutectic equipment and align the control substrate and chip of the eutectic. LED miniaturization matrix technology refers to a high-density micrometer-level LED array integrated on a chip, which is widely used in display screens, visible light communications, smart portable devices and other fields. It has the advantages of stable performance and long life, and also continues the advantages of LED such as low power consumption, fast response speed and strong contrast. At the same time, it also inherits the advantages of LED such as low power consumption, color saturation, fast response speed and strong contrast. The brightness of MicroLED is 30 times higher than that of OLED, and the energy consumption is about 10% of LCD and 50% of OLED.

[0003] The application number is 202011016366.X, which discloses an LD chip eutectic welding station, including a base plate and a substrate positioning mechanism fixed on the base plate, an XY compensation device, a eutectic temperature control device, a vacuum suction device and a eutectic upper cover, wherein the eutectic temperature control device includes a chip column, a chip insulation block, a ceramic heating plate, a eutectic plate and a cooling and blowing system arranged in sequence; the vacuum suction device is used to adsorb the substrate on the eutectic plate; the eutectic upper cover is connected to the chip insulation block to form a eutectic cavity, and the eutectic upper cover is provided with a through hole connected to the eutectic cavity; the substrate positioning mechanism is arranged on the eutectic temperature control device The vacuum suction device is connected with the chip column, the chip insulation block, the ceramic heating plate and the eutectic plate in sequence, and is used to adsorb the LD substrate on the eutectic plate through vacuum; the eutectic upper cover is connected with the chip insulation block to form a eutectic cavity, and the eutectic upper cover is provided with a through hole, which is connected with the eutectic cavity, and the substrate is adsorbed on the eutectic plate in the eutectic cavity through the through hole; the LD chip is mounted on the substrate through the through hole, and the LD chip and the substrate undergo a eutectic reaction in the eutectic cavity.

[0004] Micro LED will have great application prospects in the future, but the current problem of Micro LED manufacturing costs has seriously affected its commercialization process. The main reason is that the bottleneck of mass transfer technology still needs to be broken through. Traditional mass transfer is single-piece transfer and single-piece eutectic welding, which puts forward strict requirements on the production efficiency and product yield of Micro LED, and seriously limits the mass production process of Micro LED. Summary of the invention

[0005] Based on this, the purpose of the present invention is to provide a device for eutectic machine alignment to solve the technical bottleneck of mass transfer, which still needs to be broken through. Traditional mass transfer is a technical problem of single-grain transfer and single-grain eutectic welding.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a device for aligning a eutectic machine, comprising a base and a high-precision alignment platform arranged on the top of the base, a control substrate is fixed to the top of the high-precision alignment platform, a quartz negative pressure adsorption plate is arranged above the control substrate, a sapphire liner is adsorbed and fixed below the quartz negative pressure adsorption plate, slide grooves are provided at the center positions of the base and the high-precision alignment platform, the two slide grooves are staggered with each other, and driving mechanisms are provided in the two slide grooves.

[0007] The present invention is further configured such that the driving mechanism includes a lead screw rotatably arranged in a slide groove and a slider threadedly sleeved on the lead screw, and the top ends of the two sliders are fixedly connected to the high-precision alignment platform and the control substrate respectively.

[0008] The present invention is further configured such that motors are installed on the side walls of the base and the high-precision alignment platform, and the shafts of the two motors are fixedly connected to two lead screws respectively.

[0009] The present invention is further configured such that a plurality of grooves are provided on the top of the high-precision alignment platform, and positive electrodes and negative electrodes are respectively provided in the grooves.

[0010] The present invention is further configured such that a support frame is fixed on the top of the base, the quartz negative pressure adsorption plate is embedded and fixed in the support frame, and a plurality of negative pressure adsorption holes are opened at the bottom end of the quartz negative pressure adsorption plate, wherein a negative pressure adsorption tube connected to the negative pressure adsorption hole is installed on the side wall of the quartz negative pressure adsorption plate.

[0011] The present invention is further configured such that a mounting frame is fixed to the top end of the support frame, and a laser emission system and a high-definition camera are respectively embedded and fixed on the mounting frame.

[0012] The present invention is further configured such that an adsorption plate is provided at the top of the sapphire liner, and a sealing plate corresponding to the negative pressure adsorption hole is provided at the center of the adsorption plate.

[0013] The present invention is further configured such that LEDs are arranged on both sides of the bottom end surface of the adsorption plate, and alignment targets are fixed on the side surface of the adsorption plate facing the control substrate.

[0014] The present invention is further configured such that a plurality of connection holes are provided at the top of the adsorption plate, and connection rods embedded in the connection holes are fixed on the sapphire liner.

[0015] The present invention is further configured such that one end of the connecting rod extending into the connecting hole is symmetrically provided with an installation groove, a spring is embedded in the installation groove, and a block tightly connected to the bottom wall of the connecting hole is slidably inserted into the side wall of the installation groove.

[0016] In summary, the present invention mainly has the following beneficial effects: the present invention can realize eutectic of large-capacity chip and control substrate, use high-definition camera to collect position information of Micro LED chip and control substrate, cooperate with high-precision alignment platform to perform high-precision alignment of the two, use colorless and transparent quartz material to make quartz negative pressure adsorption device as MicroLED chip taking and fixing device, use laser heating to complete the eutectic welding and mounting process of Micro LED and control substrate, the eutectic process does not need to remove the sapphire liner of Micro LED, it is directly adsorbed by quartz negative pressure adsorption device to let the equipment complete the eutectic welding work, and adopts module transfer laser heating eutectic welding method. The laser plane beam heats and welds the Micro LED and control substrate that have been aligned and fixed through the quartz negative pressure adsorption device, and the laser heating temperature can accurately control the temperature of the heating area to realize Micro LED modular transfer eutectic welding, avoiding the secondary melting of the single MicroLED single transfer eutectic welding point and causing damage to the MicroLED. The eutectic welding speed of MicroLED modular transfer is fast, which effectively increases the eutectic speed. The laser heats and melts the Micro LED and the metal electrode (InSn) that controls the basic surface, and finally combines the two together without adding other solder. It reduces the solder adding process and saves production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 It is a structural schematic diagram of another angle of the present invention;

[0019] Figure 3 It is a structural schematic diagram of the mounting frame of the present invention;

[0020] Figure 4 It is a structural schematic diagram of the adsorption plate of the present invention;

[0021] Figure 5 It is a schematic cross-sectional structural diagram of the adsorption plate of the present invention;

[0022] Figure 6 For the present invention Figure 5 A schematic diagram of the enlarged structure in the middle.

[0023] In the figure: 1. base; 2. adsorption plate; 3. support frame; 4. quartz negative pressure adsorption plate; 5. negative pressure adsorption tube; 6. groove; 7. motor; 8. high-precision alignment platform; 9. alignment target; 10. control substrate; 11. negative pressure adsorption hole; 12. lead screw; 13. slider; 14. slide groove; 15. mounting frame; 16. laser emission system; 17. high-definition camera; 18. sealing plate; 19. LED; 20. sapphire liner; 21. connecting hole; 22. connecting rod; 23. block; 24. mounting groove; 25. spring. DETAILED DESCRIPTION

[0024] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0025] A device for aligning a eutectic machine, such as Figure 1-6 As shown, it includes a base 1 and a high-precision alignment platform 8 arranged on the top of the base 1, a control substrate 10 is fixed on the top of the high-precision alignment platform 8, a quartz negative pressure adsorption plate 4 is arranged above the control substrate 10, and a sapphire liner 20 is adsorbed and fixed below the quartz negative pressure adsorption plate 4, and a slide groove 14 is opened at the center position of the base 1 and the high-precision alignment platform 8, the two slide grooves 14 are staggered with each other, and a driving mechanism is arranged in the two slide grooves 14, which can realize eutectic of a large capacity chip and the control substrate 10, and a high-definition camera is used to collect the position information of the Micro LED 19 chip and the control substrate 10, and a high-precision alignment platform is used to perform high-precision alignment of the two, a quartz negative pressure adsorption device made of colorless and transparent quartz material is used as a Micro LED 19 chip picking and fixing device, and laser heating is used to complete the eutectic welding and mounting process of Micro LED 19 and the control substrate 10. The eutectic process does not require the removal of the sapphire liner 20 of the Micro LED 19, and it is directly adsorbed by the quartz negative pressure adsorption device to allow the equipment to complete the eutectic welding work, and a module transfer laser heating eutectic welding method is adopted. The laser plane beam heats and welds the already aligned and fixed Micro LED 19 and the control substrate 10 through the quartz negative pressure adsorption device. The laser heating temperature can accurately control the temperature of the heating area to achieve modular transfer eutectic welding of Micro LED 19, avoiding secondary melting of a single transfer eutectic welding point of a single Micro LED 19, which would damage the Micro LED 19. The modular transfer eutectic welding of Micro LED 19 is fast and effectively increases the eutectic speed. The laser heats and melts the metal electrode (InSn) on the surface of the Micro LED 19 and the control substrate, and finally combines the two together without adding other solder. It reduces the solder adding process and saves production costs.

[0026] The driving mechanism includes a lead screw 12 rotatably arranged in a slide groove 14 and a slider 13 threadedly sleeved on the lead screw 12. The top ends of the two sliders 13 are fixedly connected to the high-precision alignment platform 8 and the control substrate 10 respectively. Motors 7 are installed on the side walls of the base 1 and the high-precision alignment platform 8. The shafts of the two motors 7 are fixedly connected to the two lead screws 12 respectively. After starting, the two sets of motors 7 drive the lead screws 12 to rotate, and during the rotation process, the two sliders 13 drive the high-precision alignment platform 8 and the control substrate 10 to move horizontally and vertically respectively. A plurality of grooves 6 are opened on the top end of the high-precision alignment platform 8, and positive electrodes and negative electrodes are respectively arranged in the grooves 6. A support frame 3 is fixed on the top end of the base 1, and a quartz negative pressure adsorption plate 4 is embedded and fixed in the support frame 3. In the figure, a plurality of negative pressure adsorption holes 11 are provided at the bottom end of the quartz negative pressure adsorption plate 4, wherein a negative pressure adsorption tube 5 connected to the negative pressure adsorption hole 11 is installed on the side wall of the quartz negative pressure adsorption plate 4. When in use, the negative pressure adsorption tube 5 is connected to an external negative pressure pump, so that the negative pressure adsorption tube 5 adsorbs and fixes the adsorption plate 2 through the negative pressure adsorption hole 11. In order to allow the light of the high-definition camera 17 and the laser emitting system 18 to penetrate, the adsorption plate 2 and the quartz negative pressure adsorption plate 4 are both made of transparent materials. A mounting frame 15 is fixed to the top of the support frame 3, and a laser emitting system 16 and a high-definition camera 17 are respectively embedded and fixed on the mounting frame 15. The high-definition camera 17 positions the high-precision alignment platform 8. At the same time, the laser generated by the laser emitting system 16 heats and melts the Micro LED 19 and the metal electrode (InSn) that controls the basic surface, and finally combines the two together. At the same time, an adsorption plate 2 is provided at the top of the sapphire liner 20, and a sealing plate 18 corresponding to the negative pressure adsorption hole 11 is provided at the center of the adsorption plate 2. The sealing plate 18 fits the bottom of the negative pressure adsorption hole 11, and the sealing plate 18 improves the sealing effect of the adsorption plate 2. LEDs 19 are provided on both sides of the bottom end surface of the adsorption plate 2, and alignment targets 9 are fixed on the side of the adsorption plate 2 facing the control substrate 10. First, the quartz negative pressure adsorption device takes the material from the material discharge box, collects the position information of Micro LED 19 and the control substrate 10 through a high-definition camera, and aligns them through a high-precision alignment platform. After the alignment is completed, the high-precision alignment platform rises to attach Micro LED 19 to the control substrate 10. Then the laser system works to heat the welding point, and finally mounts and welds Micro LED 19 and the control substrate 10 together.

[0027] Furthermore, a plurality of connecting holes 21 are provided at the top of the adsorption plate 2, and a connecting rod 22 embedded in the connecting hole 21 is fixed on the sapphire liner 20, and a mounting groove 24 is symmetrically provided at one end of the connecting rod 22 extending into the connecting hole 21, in which a spring 25 is embedded, and a block 23 tightly connected to the bottom wall of the connecting hole 21 is slidably inserted on the side wall of the mounting groove 24. Before processing, the sapphire liner 20 inserts the connecting rod 22 at the top into the connecting hole 21, and the inner wall of the adsorption plate 2 abuts against the arc-shaped portion of the block 23 on the side wall of the connecting rod 22, so that the block 23 squeezes the spring 25 to shrink into the mounting groove 24, until the top of the connecting rod 22 is fully extended into the connecting hole 21, and the spring 25 in the mounting groove 24 pushes the block 23 to protrude from the side wall of the connecting hole 21 and abuts against the bottom wall of the connecting hole 21, so that the adsorption plate 2 and the sapphire liner 20 are kept fixed.

[0028] The working principle of the present invention is as follows: First, the quartz negative pressure adsorption device takes the material from the material discharging box, collects the position information of Micro LED 19 and the control substrate 10 through a high-definition camera, and aligns the two sets of motors 7 through the high-precision alignment platform to drive the lead screw 12 to rotate after starting, and during the rotation process, the two sliders 13 drive the high-precision alignment platform 8 and the control substrate 10 to move horizontally and vertically respectively. The control substrate 10 includes a fixed bottom and a lifting top. An electric push rod is embedded in the bottom end of the control substrate 10. The electric push rod drives the top of the control substrate 10 to rise and fall. After the alignment is completed, the electric push rod in the high-precision alignment platform causes it to rise so that the Micro LED 19 and the control substrate 10 are attached together. A high-definition camera is used to collect the position information of the Micro LED19 chip and the control substrate 10, and a high-precision alignment platform is used to perform high-precision alignment of the two. A quartz negative pressure adsorption device made of colorless and transparent quartz material is used as a Micro LED19 chip picking and fixing device, and laser heating is used to complete the eutectic welding and mounting process of Micro LED19 and the control substrate 10. During the eutectic process, there is no need to remove the sapphire liner 20 of the Micro LED19, which is directly adsorbed by the quartz negative pressure adsorption device to allow the equipment to complete the eutectic welding work, and then the laser system works to heat the welding point. The laser eutectic welding method uses a laser system to heat and melt the metal electrodes in contact with the welding point and mount them together, and finally the Micro LED19 and the control substrate 10 are mounted and welded together. The laser plane beam passes through the quartz negative pressure adsorption device to heat and weld the Micro LED19 and the control substrate 10 that have been aligned and fixed. The laser heating temperature can accurately control the temperature of the heating area to realize the modular transfer eutectic welding of Micro LED19, avoiding the secondary melting of the single transfer eutectic welding point of a single Micro LED19, which causes damage to the Micro LED19. The modular transfer eutectic welding speed of MicroLED19 is fast, which effectively increases the eutectic speed. The laser heats and melts the MicroLED19 and the metal electrode (InSn) that controls the basic surface, and finally combines the two together without adding other solder. It reduces the solder adding process and saves production costs.

[0029] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A device for aligning a eutectic machine, comprising a base (1) and a high-precision alignment platform (8) arranged on the top of the base (1), characterized in that: A control substrate (10) is fixed on the top of the high-precision alignment platform (8), a quartz negative pressure adsorption plate (4) is arranged above the control substrate (10), a sapphire liner (20) is adsorbed and fixed below the quartz negative pressure adsorption plate (4), and a slide groove (14) is provided at the center position of the base (1) and the high-precision alignment platform (8), the two slide grooves (14) are staggered with each other, and a driving mechanism is arranged in each of the two slide grooves (14).

2. The device for aligning a eutectic machine according to claim 1, characterized in that: The driving mechanism comprises a lead screw (12) rotatably arranged in a slide groove (14) and a slider (13) threadedly sleeved on the lead screw (12), and the top ends of the two sliders (13) are fixedly connected to a high-precision alignment platform (8) and a control substrate (10) respectively.

3. The device for aligning a eutectic machine according to claim 2, characterized in that: Motors (7) are installed on the side walls of the base (1) and the high-precision alignment platform (8), and the shafts of the two motors (7) are fixedly connected to two lead screws (12) respectively.

4. The device for aligning a eutectic machine according to claim 3, characterized in that: A plurality of grooves (6) are provided at the top of the high-precision alignment platform (8), and positive electrodes and negative electrodes are respectively arranged in the grooves (6).

5. The device for aligning a eutectic machine according to claim 1, characterized in that: A support frame (3) is fixed on the top of the base (1), the quartz negative pressure adsorption plate (4) is embedded and fixed in the support frame (3), and a plurality of negative pressure adsorption holes (11) are opened at the bottom of the quartz negative pressure adsorption plate (4), wherein a negative pressure adsorption tube (5) connected to the negative pressure adsorption holes (11) is installed on the side wall of the quartz negative pressure adsorption plate (4).

6. The device for aligning a eutectic machine according to claim 5, characterized in that: A mounting frame (15) is fixed to the top end of the support frame (3), and a laser emission system (16) and a high-definition camera (17) are respectively embedded and fixed on the mounting frame (15).

7. The device for aligning a eutectic machine according to claim 5, characterized in that: An adsorption plate (2) is arranged at the top of the sapphire liner (20), and a sealing plate (18) corresponding to the negative pressure adsorption hole (11) is arranged at the center of the adsorption plate (2).

8. The device for aligning a eutectic machine according to claim 7, characterized in that: LEDs (19) are arranged on both sides of the bottom end surface of the adsorption plate (2), and a positioning target (9) is fixed on the side of the adsorption plate (2) facing the control substrate (10).

9. The device for aligning a eutectic machine according to claim 8, characterized in that: A plurality of connection holes (21) are provided at the top of the adsorption plate (2), and a connection rod (22) embedded in the connection hole (21) is fixed on the sapphire liner (20).

10. The device for aligning a eutectic machine according to claim 9, characterized in that: A mounting groove (24) is symmetrically provided at one end of the connecting rod (22) extending into the connecting hole (21), a spring (25) is embedded in the mounting groove (24), and a clamping block (23) tightly connected to the bottom wall of the connecting hole (21) is slidably inserted into the side wall of the mounting groove (24).

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