Combiner, radio frequency system and communication device

Abstract

This application relates to a combiner, a radio frequency system, and a communication device. The combiner includes: a first frequency divider unit for frequency division processing of electromagnetic wave signals received at a common terminal to output a first frequency band signal via a first output terminal; a second frequency divider unit for frequency division processing of electromagnetic wave signals received at a common terminal to output a second frequency band signal via a second output terminal; a first stopband unit connected to the first frequency divider unit for generating a stopband zero within the frequency range of the second frequency band signal; and a second stopband unit connected to the second frequency divider unit for generating a stopband zero within the frequency range of the first frequency band signal. Each of the first frequency divider unit, the second frequency divider unit, the first stopband unit, and the second stopband unit includes multiple components, which are capacitors or inductors. Multiple discrete capacitors and inductors can be used, which significantly reduces the hardware cost of the combiner compared to LTCC combiners in related technologies.

Description

Technical Field

[0001] This application relates to the field of antenna technology, and in particular to a combiner, radio frequency system and communication device. Background Technology

[0002] With the development of technology, communication devices with communication functions (such as mobile phones, tablets, etc.) are becoming more and more popular and their functions are becoming more and more powerful. For example, the communication application scope of multi-band carrier aggregation (CA) is becoming wider and wider.

[0003] However, the need for multi-band CA combination requires combiners to perform frequency division processing. Generally, combiners are made of low-temperature co-fired ceramic (LTCC) technology, which is relatively expensive. Summary of the Invention

[0004] This application provides a combiner, a radio frequency system, and a communication device that can reduce the cost of the combiner.

[0005] In a first aspect, embodiments of this application provide a combiner, the combiner being configured with a common terminal, a first output terminal, and a second output terminal, wherein the combiner includes:

[0006] The first frequency division unit is connected to the common terminal and the first output terminal respectively, and is used to perform frequency division processing on the electromagnetic wave signal received by the common terminal so as to output a first frequency band signal through the first output terminal.

[0007] The second frequency division unit is connected to the common terminal and the second output terminal respectively, and is used to perform frequency division processing on the electromagnetic wave signal received by the common terminal so as to output a second frequency band signal through the second output terminal;

[0008] The first stopband unit has a first end connected to the first frequency divider unit and the other end grounded, and is used to generate a stopband zero within the frequency range of the second frequency band signal.

[0009] The second stopband unit has a first end connected to the second frequency divider unit and the other end grounded, used to generate a stopband zero within the frequency range of the first frequency band signal; wherein the first frequency divider unit, the second frequency divider unit, the first stopband unit, and the second stopband unit each include multiple components, and the components are capacitors or inductors.

[0010] Secondly, embodiments of this application provide a radio frequency system, including:

[0011] The aforementioned combiner, wherein the common terminal of the combiner is used to connect to an antenna;

[0012] The first filter circuit is connected to the first output terminal of the combiner;

[0013] A first low-noise amplifier circuit is connected to the first frequency divider circuit and is used to perform low-noise amplification processing on the received first frequency band signal.

[0014] The second filter circuit is connected to the first output terminal of the combiner.

[0015] The second low-noise amplifier circuit is connected to the second frequency divider circuit and is used to perform low-noise amplification processing on the received second frequency band signal.

[0016] Secondly, embodiments of this application provide a communication device, including:

[0017] antenna;

[0018] In the aforementioned radio frequency system, the common terminal of the combiner is connected to the antenna;

[0019] The radio frequency transceiver is connected to the output terminals of the first low-noise amplifier circuit and the second low-noise amplifier circuit, respectively.

[0020] The aforementioned combiner, radio frequency system, and communication equipment include a combiner configured with a common terminal, a first output terminal, and a second output terminal. The combiner comprises a first frequency divider unit, a second frequency divider unit, a first stopband unit, and a second stopband unit. The first frequency divider unit can perform frequency division processing on the electromagnetic wave signal received at the common terminal to output a first frequency band signal via the first output terminal. The second frequency divider unit performs frequency division processing on the electromagnetic wave signal received at the common terminal to output a second frequency band signal via the second output terminal. The first stopband unit and the first frequency divider unit are used to generate a stopband zero within the frequency range of the second frequency band signal. The second stopband unit is connected to the second frequency divider unit and can generate a stopband zero within the frequency range of the first frequency band signal. In the embodiments of this application, the first frequency division unit, the second frequency division unit, the first stopband unit, and the second stopband unit may each include multiple components, each of which may be a capacitor or an inductor. Thus, the combiner provided in this application can use multiple discrete capacitor and inductor components to realize the function of the combiner. Compared with the LTCC combiner in the related technology, it can greatly reduce the hardware cost of the combiner. In addition, by setting the first stopband unit and the second stopband unit, this application can generate zeros in the stopband of the corresponding frequency band signal, which can enhance the out-of-band rejection capability of the two frequency division units and enhance the isolation between the two frequency division units. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a communication principle diagram of carrier aggregation in one embodiment;

[0023] Figure 2 The first circuit schematic of the combiner in one embodiment;

[0024] Figure 3 The second circuit diagram of the combiner in one embodiment;

[0025] Figure 4 The third circuit diagram of the combiner in one embodiment;

[0026] Figure 5 The fourth circuit diagram of the combiner in one embodiment;

[0027] Figure 6 In one embodiment, such as Figure 3 The simulated S-curve diagram of the combiner is shown below.

[0028] Figure 7 In one embodiment, such as Figure 5 The simulated S-curve diagram of the combiner is shown below.

[0029] Figure 8a For example Figure 3 A schematic diagram of the overall structure of the microstrip line combiner shown.

[0030] Figure 8b For example Figure 8a A schematic diagram of the structure of the first metal layer of the microstrip line combiner is shown.

[0031] Figure 8c For example Figure 8a A schematic diagram of the structure of the second metal layer of the microstrip line combiner is shown.

[0032] Figure 9a For example Figure 5 A schematic diagram of the overall structure of the microstrip line combiner shown.

[0033] Figure 9b For example Figure 9a A schematic diagram of the structure of the first metal layer of the microstrip line combiner is shown.

[0034] Figure 9c For example Figure 9aA schematic diagram of the structure of the second metal layer of the microstrip line combiner is shown.

[0035] Figure 10 This is a block diagram of a radio frequency system in one embodiment;

[0036] Figure 11 This is a block diagram of the radio frequency system in another embodiment;

[0037] Figure 12 This is a block diagram of the radio frequency system in yet another embodiment;

[0038] Figure 13 This is a schematic diagram of the impedance variation curve of the combiner in one embodiment on a Smith chart;

[0039] Figure 14 This is a block diagram of the internal structure of an electronic device in one embodiment. Detailed Implementation

[0040] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0041] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0043] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0044] The antenna device described in this application can be applied to communication devices with wireless communication capabilities. These electronic devices can be handheld devices, in-vehicle devices, wearable devices, computing devices, or other processing devices connected to a wireless modem, as well as various forms of user equipment (UE) (e.g., mobile phones), mobile stations (MS), etc. For ease of description, the devices mentioned above are collectively referred to as electronic devices.

[0045] like Figure 1 As shown, communication device 10 can support carrier aggregation (CA) technology with various combinations of different frequency bands. Simply put, carrier aggregation combines multiple carriers of different (or the same) LTE frequencies into a wider spectrum, and can also aggregate discontinuous spectrum fragments to increase bandwidth. For example, five-carrier aggregation combines five carriers (which can be the same or different). Carrier aggregation can improve data rates and network performance in the uplink, downlink, or both, and can also achieve aggregation of frequency division duplex (FDD), time division duplex (TDD), and licensed and unlicensed carrier spectrum. In an FDD communication link, transmission and reception use independent frequency bands. In a TDD communication link, the uplink and downlink are separated by allocating different time slots within the same frequency band. Downlink carrier aggregation refers to the transmission method where base station 20 sends carrier aggregation signals to communication device 10. After receiving the downlink carrier aggregation signal, based on the combiner involved in this embodiment, communication device 10 can extract the downlink carrier aggregation signal to achieve signal reception processing for each member carrier frequency band. Currently, each user can be allocated a maximum of five subcarriers within a 100MHz bandwidth, meaning each subcarrier can have a maximum bandwidth of 20MHz. These five subcarriers are transmitted by the base station, simultaneously received by the antenna, and synthesized through CA data pipe 11, such as... Figure 1 As shown.

[0046] Generally speaking, common downlink CA combination frequency bands include: B1+B3, B1+B7, B2+B7, B1+B3+B5, B1+B3+B7, B1+B3+B40, B1+B3+B41, etc., but are not limited to these CA combination frequency bands.

[0047] like Figure 2 As shown in the illustration, this application provides a combiner. The combiner is configured with a common terminal Port1 for connection to an antenna, and a first output terminal Port2 and a second output terminal Port3 for connection to radio frequency devices. The combiner can be used to perform frequency division processing on the electromagnetic wave signal received from the antenna at the common terminal Port1, so as to output a first frequency band signal via the first output terminal Port2 and a second frequency band signal via the second output terminal Port3. It should be noted that the first frequency band signal and the second frequency band signal have different frequency ranges to achieve frequency division processing of multi-band signals.

[0048] It should be noted that, in the embodiments of this application, the first output terminal Port2 and the second output terminal Port3 configured in the combiner can also be used as input terminals. That is, the first output terminal Port2 and the second output terminal Port3 of the combiner can respectively receive electromagnetic wave signals of two frequency bands, and then perform combination processing on the electromagnetic wave signals of the two frequency bands, so as to output to the antenna through the common terminal Port1.

[0049] Specifically, the combiner 100 includes: a first frequency divider unit 110, a second frequency divider unit 120, a first stopband unit 130, and a second stopband unit 140.

[0050] The first frequency divider unit 110 is connected to the common terminal Port1 and the first output terminal Port2, respectively, and is used to perform frequency division processing on the electromagnetic wave signal received at the common terminal Port1, so as to output the first frequency band signal through the first output terminal Port2. The first end of the first stopband unit 130 is connected to the first frequency divider unit 110, and the other end of the first stopband unit 130 is grounded, used to generate a stopband zero within the frequency range of the second frequency band signal. Here, the zero point can be understood as the corresponding trough point in the S(2,1) curve or S(3,1) curve of the S-parameter curve. It can be understood that the first frequency divider unit 110 and the first stopband unit 130 can be understood together as a first filtering unit, used to allow the first frequency band signal to pass through and block the second frequency band signal to pass through. That is, the first path formed by the first frequency divider unit 110 and the first stopband unit 130 can be understood as a direct path for the first frequency band signal, which is in a high-impedance state for the second frequency band signal. In other words, the first path is in a direct-through state for the first frequency band signal and in a high-impedance state for other signals besides the first frequency band signal. Therefore, when the first frequency division unit 110 receives the carrier aggregation signal, it can filter out other signals other than the first frequency band signal by combining with the first stopband unit 130, allowing only the first frequency band signal to pass through and be output through the first output terminal Port2.

[0051] The second frequency divider unit 120 is connected to the common terminal Port1 and the second output terminal Port3, respectively. It is used to perform frequency division processing on the electromagnetic wave signal received at the common terminal Port1, so that the second frequency band signal is output through the second output terminal Port3. The second stopband unit 140, with its first end connected to the second frequency divider unit 120 and its other end grounded, is used to generate a stopband zero within the frequency range of the first frequency band signal. It can be understood that the second frequency divider unit 120 and the second stopband unit 140 together can be understood as a second filtering unit, used to allow the second frequency band signal to pass through while blocking the first frequency band signal. That is, the second path formed by the second frequency divider unit 120 and the second stopband unit 140 can be understood as a direct path for the second frequency band signal, exhibiting high impedance to the first frequency band signal. In other words, the second path is a direct path for the second frequency band signal and a high impedance to other signals besides the second frequency band signal. Therefore, when the second frequency division unit 120 receives the carrier aggregation signal, it can filter out other signals other than the second frequency band signal by combining with the second stopband unit 140, allowing only the second frequency band signal to pass through and be output through the second output terminal Port3.

[0052] In this application, the first frequency divider unit 110, the second frequency divider unit 120, the first stopband unit 130, and the second stopband unit 140 each include multiple components, each of which can be a capacitor or an inductor. It is understood that the first frequency divider unit 110 can be a combination of multiple capacitors or multiple inductors, and the second frequency divider unit 120 can also be a combination of multiple capacitors or multiple inductors; however, the component units of the first frequency divider unit 110 and the second frequency divider unit 120 are not the same. The first stopband unit 130 and the second stopband unit 140 can each be a combination of capacitors and inductors, respectively. The combination forms of the first stopband unit 130 and the second stopband unit 140 can be the same or different, but the component parameters of the capacitors and inductors included in the first stopband unit 130 and the second stopband unit 140 are different. The component parameters can be understood as the capacitance value of the capacitors and the inductance value of the inductors.

[0053] In the embodiments of this application, the first frequency division unit 110, the second frequency division unit 120, the first stopband unit 130, and the second stopband unit 140 may each include multiple components, each of which may be a capacitor or an inductor. Thus, the combiner provided in this application can use multiple discrete capacitor and inductor components, which can realize the function of the combiner. Compared with the LTCC combiner in the related technology, it can greatly reduce the hardware cost of the combiner. In addition, by setting the first stopband unit 130 and the second stopband unit 140, this application can generate zeros in the stopband of the corresponding frequency band signal, which can enhance the out-of-band rejection capability of the two filter units and enhance the isolation between the two filter units.

[0054] In one embodiment, the frequency of the first frequency band signal is lower than the frequency of the second frequency band signal. For example, the first frequency band signal can be a low-frequency band signal, and the second frequency band signal can be at least one of a mid-frequency band, a high-frequency band, and an ultra-high-frequency band signal. Optionally, the first frequency band signal can be a low-mid-high-frequency band signal, and the second frequency band signal can be an ultra-high-frequency band signal. The frequency range of the low-frequency band signal is 700–960 MHz, the frequency range of the mid-high-frequency band signal is 1700–2700 MHz, and the frequency range of the ultra-high-frequency band signal is 3300–3800 MHz.

[0055] like Figure 3 As shown, specifically, the first frequency divider unit 110 includes a first inductor L1 and a second inductor L2. The first end of the first inductor L1 is connected to a common terminal Port1, and the second end of the first inductor L1 is connected to a first output terminal Port2 via the second inductor L2. The first inductor L1 and the second inductor L2 are connected in series between the common terminal Port1 and the first output terminal Port2 of the combiner. The first frequency divider unit 110 can divide the electromagnetic wave signal to a first frequency band with a relatively lower frequency based on the first inductor L1 and the second inductor L2. The second frequency divider unit 120 includes a first capacitor C1 and a second capacitor C2. The first end of the first capacitor C1 is connected to a common terminal Port1, and the second end of the first capacitor C1 is connected to a second output terminal Port3 via the second capacitor C2. The first capacitor C1 and the second capacitor C2 are connected in series between the common terminal Port1 and the second output terminal Port3 of the combiner. The second frequency divider unit 120 can divide the electromagnetic wave signal to a second frequency band with a relatively higher frequency based on the first capacitor C1 and the second capacitor C2.

[0056] The inductance values ​​of each inductor in the first frequency divider unit 110 and the capacitance values ​​of each capacitor in the second frequency divider unit 120 can be adjusted adaptively according to the frequencies of the first frequency band signal and the second frequency band signal. In this embodiment, the combination mode of the first frequency band signal and the second frequency band signal is not limited, nor is it limited to the examples described above.

[0057] In the embodiments, the first frequency division unit 110 may include multiple inductor elements and the second frequency division unit 120 may include multiple capacitor elements. Thus, the combiner provided in this application can use multiple discrete capacitor elements and inductor elements, which can realize the frequency division function of the combiner. Compared with the LTCC combiner in the related technology, the hardware cost of the combiner can be greatly reduced.

[0058] like Figure 3 As shown, in one embodiment, the first stopband unit includes a first stopband branch 131, which includes a third inductor L3 and a third capacitor C3 connected in series. The first end of the first stopband branch 131 is connected to the first frequency divider unit 110, and the second end of the first stopband branch 131 is grounded. The first end of the first stopband branch 131 can be connected to the first end of the first inductor L1, the second end of the first inductor L1, or the second end of the second inductor L2 in the first frequency divider unit 110, while the second end of the second stopband branch is grounded.

[0059] The first stopband branch 131 includes a third inductor L3 and a third capacitor C3 connected in series. The first end of the third inductor L3 can be connected to the first frequency divider unit 110 as the first end of the first stopband branch 131. The first end of the third inductor L3 is connected to the second end of the third capacitor C3. The second end of the third capacitor C3 can be grounded as the second end of the first stopband branch 131.

[0060] Optionally, the positions of the third inductor L3 and the third capacitor C3 can be interchanged. That is, the first end of the third capacitor C3 can be used as the first end of the first stopband branch 131, and the second end of the third inductor L3 can be used as the second end of the first stopband branch 131.

[0061] The second stopband unit includes a second stopband branch 141, which includes a fourth inductor L4 and a fourth capacitor C4 connected in series. The first end of the second stopband branch 141 is connected to the second frequency divider unit 120, and the second end of the second stopband branch 141 is grounded. The first end of the second stopband branch 141 can be connected to the first end of the first capacitor C1, the second end of the first capacitor C1, or the second end of the second capacitor C2 in the second frequency divider unit 120, while the second end of the second stopband branch 141 is grounded.

[0062] The second stopband branch 141 includes a fourth inductor L4 and a fourth capacitor C4 connected in series. The first end of the fourth inductor L4 can be connected to the second frequency divider unit 120 as the first end of the second stopband branch 141. The first end of the fourth inductor L4 is connected to the second end of the fourth capacitor C4. The second end of the fourth capacitor C4 can be grounded as the second end of the second stopband branch 141.

[0063] Optionally, the positions of the fourth inductor L4 and the fourth capacitor C4 can be interchanged. That is, the first terminal of the fourth capacitor C4 can be used as the first terminal of the second stopband branch 141, and the second terminal of the fourth inductor L4 can be used as the second terminal of the second stopband branch 141.

[0064] In this embodiment, the capacitance value C1 of the capacitor and the inductance value L1 of the inductor in the first stopband branch 131 and the second stopband branch 141 need to satisfy the following relationship:

[0065] jωL1+(1 / jωC1)=0 (Formula 1)

[0066] For example, if the first frequency divider unit 110 needs to generate a zero at f0 = 2GHz, the component parameters of the third inductor L3 and the third capacitor C3 in the first stopband unit 130 need to satisfy the following formula:

[0067] j*2π*f0* L1+1 / j*2π*f0* C1=0 (Formula 2)

[0068] Accordingly, if the second frequency divider unit 120 needs to generate a zero at f1 = 800MHz, the inductance value L2 of the fourth inductor L4 and the capacitance value C2 of the fourth capacitor C4 in the second stopband unit 140 need to satisfy the following formula:

[0069] j*2π*f1* L2+1 / j*2π* f1* C2=0 (Formula 3)

[0070] In this embodiment, the capacitance values ​​of the capacitors and the inductance values ​​of the second stopband branch 141 can be reasonably set according to the frequency division requirements of the combiner, so that the first filter unit generates a zero point at a certain frequency of the second frequency band signal, and the second filter unit generates a zero point at a certain frequency of the first frequency band signal. The out-of-band rejection capability of each filter unit can be enhanced by using low-cost capacitors and inductors, and the isolation between the first filter unit and the second filter unit can be enhanced, thereby improving the frequency division performance of the combiner.

[0071] like Figure 4As shown, optionally, the first stopband unit may also include multiple first stopband branches 131, wherein the first end of each first stopband branch 131 is connected to a different connection node than the first frequency divider unit 110. Each first stopband branch 131 can generate a zero point in the stopband within the frequency range of the second frequency band signal, and the zero point generated by each first stopband branch 131 is at a different position. For example, the first stopband unit 130 may also include two first stopband branches 131, one of which has its first end connected to the second end of the first inductor L1, and the other has its first end connected to the second end of the second inductor L2.

[0072] In this embodiment, by setting two first stopband branches 131 and setting the component parameters of the inductors and capacitors in the two first stopband branches 131 in a reasonable manner, two zeros can be generated in the frequency range of the second frequency band signal, which can further enhance the out-of-band rejection capability of each filter unit, enhance the isolation between the first filter unit and the second filter unit, and thus improve the frequency division performance of the combiner.

[0073] like Figure 5 As shown, optionally, the second stopband unit may also include multiple second stopband branches 141, wherein the first end of each second stopband branch 141 is connected to a different connection node than the second frequency divider unit 120. Each second stopband branch 141 can generate a zero point in the stopband within the frequency range of the first frequency band signal, and the zero point generated by each second stopband branch 141 is at a different position. For example, the second stopband unit 140 may also include two second stopband branches 141, where the first end of one second stopband branch 141 can be connected to the first end of the first capacitor C1, and the first end of the other second stopband branch 141 can be connected to the first end of the second capacitor C2.

[0074] In this embodiment, by setting two second stopband branches 141 and setting the component parameters of the inductors and capacitors in the two second stopband branches 141 in a reasonable manner, two zeros of the stopband can be generated within the frequency range of the first frequency band signal. This can further enhance the out-of-band rejection capability of each filter unit, enhance the isolation between the first filter unit and the second filter unit, and thus improve the frequency division performance of the combiner.

[0075] In one embodiment, the first frequency band signal includes low-frequency electromagnetic wave signals, and the second frequency band signal includes mid-frequency and high-frequency electromagnetic wave signals. In this embodiment, when the first frequency band signal includes low-frequency electromagnetic wave signals, it may include sub-frequency band signals such as B8. When the second frequency band signal includes mid-to-high-frequency electromagnetic wave signals, it may include sub-frequency band signals such as B3, B40, and B41. The combiner provided in this embodiment can be used to support frequency division processing of low-frequency and mid-to-high-frequency electromagnetic wave signals. It should be noted that, in this embodiment, the sub-frequency bands included in the first and second frequency band signals are not limited to those illustrated above.

[0076] Please continue to refer to this. Figure 3 The first frequency divider unit 110 includes a first inductor L1 and a second inductor L2, which are connected in series and connected between the common terminal Port1 and the first output terminal Port2 of the combiner. The first stopband unit may include a first stopband branch 131, which includes a third inductor L3 and a third capacitor C3. The first end of the third inductor L3 is connected to both the first inductor L1 and the second inductor L2, and the second end of the third inductor L3 is grounded via the third capacitor C3. Optionally, the positions of the third inductor L3 and the third capacitor C3 can be interchanged. By setting the component parameters of each capacitor and inductor and the connection relationships between the components in the first frequency divider unit 110 and the first stopband unit, a first path can be formed in the combiner. This path only allows low-frequency signals to pass through, while presenting a high impedance state for mid-to-high frequency signals other than low-frequency signals, thus preventing the passage of mid-to-high frequency signals. Consequently, low-frequency signals can be output via the first output terminal Port2.

[0077] The second frequency divider unit 120 includes a first capacitor C1 and a second capacitor C2, which are connected in series between the common terminal Port1 and the second output terminal Port3 of the combiner. The second stopband unit may include a second stopband branch 141, which includes a fourth inductor L4 and a fourth capacitor C4. The first end of the fourth inductor L4 is connected to both the first capacitor C1 and the second capacitor C2, and the second end of the fourth inductor L4 is grounded via the fourth capacitor C4. Optionally, the positions of the fourth inductor L4 and the fourth capacitor C4 can be interchanged. By setting the component parameters of each capacitor and inductor and the connection relationships between the components in the second frequency divider unit 120 and the second stopband unit 140, a second path can be formed in the combiner. This path only allows mid-to-high frequency signals to pass through, while presenting a high impedance state for low-frequency signals other than mid-to-high frequency signals, thus preventing the passage of low-frequency signals. Consequently, mid-to-high frequency signals can be output via the first output terminal Port2.

[0078] In this embodiment, the combiner can use four capacitor elements (C1, C2, C3, C4) and four inductor elements (L1, L2, L3, L4), which can replace the LTCC combiner in the traditional technology to realize frequency division processing of low frequency and mid-to-high frequency band signals. Figure 6 for Figure 3 The schematic diagram and simulation diagram of the combiner are shown. Figure 6 As shown in the simulation data, the combiner provided in this embodiment has an insertion loss of less than 0.6 dB and an isolation greater than 20 dB, meeting the system performance requirements. Therefore, the combiner provided in this embodiment can significantly reduce the hardware cost of the combiner while having the same performance as the LTCC combiner.

[0079] In one embodiment, the first frequency band signal includes electromagnetic wave signals in the low, mid, and high frequency bands, and the second frequency band signal includes electromagnetic wave signals in the ultra-high frequency band. In this embodiment, when the first frequency band signal includes electromagnetic wave signals in the low, mid, and high frequency bands, it may include sub-frequency band signals such as B3, B5, and B8. When the second frequency band signal includes electromagnetic wave signals in the ultra-high frequency band, it may include sub-frequency band signals such as B78. The combiner provided in this embodiment can be used to support frequency division processing of electromagnetic wave signals in the low, mid, and high frequency bands and electromagnetic wave signals in the ultra-high frequency band. It should be noted that, in this embodiment, the sub-frequency band signals of the first and second frequency band signals include, but are not limited to, the examples described above.

[0080] Please continue to refer to this. Figure 5 The first frequency divider unit 110 includes a first inductor L1 and a second inductor L2, which are connected in series and connected between the common terminal Port1 and the first output terminal Port2 of the combiner. The first stopband unit may include a first stopband branch 131, which includes a third inductor L3 and a third capacitor C3. The first end of the third inductor L3 is connected to both the first inductor L1 and the second inductor L2, and the second end of the third inductor L3 is grounded via the third capacitor C3. Optionally, the positions of the third inductor L3 and the third capacitor C3 can be interchanged. By setting the component parameters of each capacitor and inductor in the first frequency divider unit 110 and the first stopband unit 130, a third path can be formed in the combiner. This path only allows low, mid, and high frequency signals to pass through, while presenting a high impedance state for ultra-high frequency signals other than mid and high frequency signals, thus preventing the passage of ultra-high frequency signals. Consequently, low, mid, and high frequency signals can be output via the first output terminal Port2.

[0081] The second frequency divider unit 120 includes a first capacitor C1 and a second capacitor C2, wherein the first capacitor C1 and the second capacitor C2 are connected in series and are connected between the common terminal Port1 and the second output terminal Port3 of the combiner. The second stopband unit may include two second stopband branches 141, each second stopband branch 141 including a fourth inductor L4 and a fourth capacitor C4, wherein the first end of one second stopband branch 141 is connected to the first end of the first capacitor C1 and the common terminal Port1 respectively; the first end of the other second stopband branch 141 is connected to the second end of the first capacitor C1 and the first end of the second capacitor C2 respectively. Optionally, the positions of the fourth inductor L4 and the fourth capacitor C4 can also be interchanged. In the second frequency division unit 120 and the second stopband unit, by setting the component parameters of each capacitor and inductor and the connection relationship between each component, a fourth path can be formed in the combiner. This path only allows the passage of ultra-high frequency band signals, while presenting a high impedance state for low, medium and high frequency band signals other than ultra-high frequency band signals, so as to prevent the passage of low, medium and high frequency band signals. In turn, the ultra-high frequency band signal can be output through the second output terminal Port3.

[0082] In this embodiment, the combiner can employ five capacitors (C1, C2, C3, C4, C5) and five inductors (L1, L2, L3, L4, L5), which can replace the LTCC combiner in traditional technology to achieve frequency division processing of ultra-high frequency and low-mid-high frequency signals. Figure 7 for Figure 5 The diagram shown is a schematic simulation of the combiner. Figure 7 As shown in the simulation data, the combiner provided in this embodiment has an insertion loss of less than 1 dB and an isolation greater than 20 dB, meeting the system performance requirements. Therefore, the combiner provided in this embodiment can significantly reduce the hardware cost of the combiner while having the same performance as the LTCC combiner. Furthermore, as... Figure 7 As shown in the simulation data, the combiner provided in this application embodiment can generate a zero at a higher frequency (the S(2,1) curve has a concave point) in the first filter unit and two zeros at a lower frequency (the S(3,1) curve has two concave points) in the second filter unit. This can further enhance the out-of-band rejection capability of each filter unit, enhance the isolation between the first filter unit and the second filter unit, and thus improve the frequency division performance of the combiner.

[0083] In one embodiment, the inductors included in the combiner of this application are either surface-mount inductors or microstrip inductors. In this embodiment, the inductors in the combiner can be microstrip inductors, which have the same performance as surface-mount inductors, are normal traces, and can further reduce costs compared to surface-mount inductors. At the same time, microstrip inductors have advantages in power capacity, heat dissipation, and coupling.

[0084] Optionally, the inductors included in the combiner in this application may also be bonding wire inductors, and the bonding wires may be gold wire, aluminum wire or copper wire, which can reduce the insertion loss of the combiner.

[0085] In one embodiment, Figure 8a for Figure 3 The diagram shows the overall structure of a microstrip line combiner. Figure 8b This is a schematic diagram of the structure of the first metal layer of a microstrip line combiner. Figure 8c This is a schematic diagram of the second metal layer of a microstrip line combiner. The combiner includes a first metal layer 101 and a second metal layer 102, wherein the second metal layer 102 is located on the first metal layer 101. The first metal layer 101 and the second metal layer 102 can be different metal layers on the same PCB board or on different PCB boards. In this application, the first metal layer 101 and the second metal layer 102 are not limited. The first metal layer 101 can be used as the bottom metal layer of the combiner, and the second metal layer 102 can be used as the top metal layer of the combiner. The common terminal Port1, the first output terminal Port2, and the second output terminal Port3 of the combiner are disposed on the second metal layer 102.

[0086] Specifically, the first metal layer 101 has a first sub-microstrip winding L1-1 and a second sub-microstrip winding L2-1, and the second metal layer 102 has a third sub-microstrip winding L1-2 and a fourth sub-microstrip winding L2-2. The first sub-microstrip winding L1-1 and the third sub-microstrip winding L1-2 are connected to form a first inductor L1, and the second sub-microstrip winding L2-1 and the fourth sub-microstrip winding L2-2 are connected to form a second inductor L2. The capacitors of the second frequency divider unit (e.g., the first capacitor C1 and the second capacitor C2), and the capacitors of the first stopband unit 130 and the second stopband unit (e.g., the third capacitor C3 and the fourth capacitor C4) are located in the second metal layer 102. The inductors in the first stopband unit are located in both the first metal layer 101 and the second metal layer 102, and the inductors in the second stopband unit are at least partially located in the second metal layer 102. The second metal layer 102 is also provided with transmission lines and ground lines. The transmission lines are used to connect various components (such as inductors and capacitors), and the ground lines can connect the capacitors in the first and second stopband units to the ground layer.

[0087] In this application, a first metal layer 101 and a second metal layer 102 are provided, and multiple sub-microstrip windings are provided on each metal layer to form a microstrip line inductor. In this way, compared with surface mount inductors, the cost can be reduced. At the same time, microstrip line inductors have advantages in terms of power capacity, heat dissipation, and coupling.

[0088] like Figures 8b-8cAs shown, the first metal layer 101 is further provided with a fifth sub-microstrip winding L3-1 and a sixth sub-microstrip winding L4-1, and the second metal layer 102 is further provided with a seventh sub-microstrip winding L3-2 and an eighth sub-microstrip winding L4-2. The fifth sub-microstrip winding L3-1 and the seventh sub-microstrip winding L3-2 are connected to form a third inductor L3, and the sixth sub-microstrip winding L4-1 and the eighth sub-microstrip winding L4-2 are connected to form a fourth inductor L4.

[0089] In one embodiment, Figure 9a for Figure 5 The diagram shows the overall structure of a microstrip line combiner. Figure 9b This is a schematic diagram of the structure of the first metal layer 101 of the microstrip line combiner. Figure 9c This is a schematic diagram of the structure of the second metal layer 102 of the microstrip combiner. Specifically, the first metal layer 101 is provided with a first sub-microstrip winding L1-1 and a second sub-microstrip winding L2-

[0090] 1. The second metal layer 102 is provided with a third sub-microstrip winding L1-2 and a fourth sub-microstrip winding L2-2; wherein, the first sub-microstrip winding L1-1 and the third sub-microstrip winding L1-2 are connected to form a first inductor L1, and the second sub-microstrip winding L2-1 and the fourth sub-microstrip winding L2-2 are connected to form a second inductor L2. The capacitors of the second frequency divider unit (e.g., the first capacitor C1 and the second capacitor C2), and the capacitors in the first stopband unit 130 and the second stopband unit 140 (e.g., the third capacitor C3 and two fourth capacitors C4) are disposed on the second metal layer 102. The first metal layer 101 is further provided with a ninth sub-microstrip winding L3-1, and the second metal layer 102 is further provided with a tenth sub-microstrip winding L3-2, an eleventh sub-microstrip winding L41 and a twelfth sub-microstrip winding L42. The ninth sub-microstrip winding L3-1 and the tenth sub-microstrip winding L3-2 are connected to form the third inductor L3 of the first stopband unit, and the eleventh sub-microstrip winding L41 and the twelfth sub-microstrip winding L42 are respectively used to form the fourth inductor L4 in the two second stopband branches 141.

[0091] In this application, a first metal layer 101 and a second metal layer 102 are provided, and multiple sub-microstrip windings are provided on each metal layer to form a microstrip line inductor. In this way, compared with surface mount inductors, the cost can be reduced. At the same time, microstrip line inductors have advantages in terms of power capacity, heat dissipation, and coupling.

[0092] like Figure 10As shown in the embodiments of this application, a radio frequency system is also provided, including a combiner 100, a first filter circuit 200, a first low-noise amplifier circuit 300, a second filter circuit 400, a second low-noise amplifier circuit 500, and a radio frequency transceiver 600 as described in any of the foregoing embodiments. The common terminal of the combiner 100 is used to connect to an antenna. The combiner 100 can perform frequency division processing on the electromagnetic wave signal received by the antenna to separate a first frequency band signal and a second frequency band signal. The first output terminal of the combiner 100 can output the first frequency band signal, and the second output terminal of the combiner 100 can output the second frequency band signal.

[0093] The first filtering circuit 200, connected to the first output terminal of the combiner 100, filters the received first frequency band signal to output at least one corresponding first sub-frequency band signal. The first sub-frequency band signal is a signal within a specific frequency band of the first frequency band signal. For example, when the first frequency band signal is a low-frequency band signal, its first sub-frequency band signal can be a signal from the B5 or B8 frequency band. Optionally, the first filtering circuit 200 may include at least one first filter. If there are multiple first filters, each first filter has a different passband, meaning that the frequency band of the first sub-frequency band signal output by each first filter is different.

[0094] A first low-noise amplifier circuit 300, connected to a first filter circuit 200, is used to perform low-noise amplification processing on the received first frequency band signal. The first low-noise amplifier circuit 300 may include at least one first low-noise amplifier, which can perform low-noise amplification processing on the received signal and output the amplified signal to the radio frequency transceiver 600, thereby realizing the reception processing of the first frequency band signal.

[0095] Optionally, the first low-noise amplifier circuit 300 may be an LNABank device or an LFEM device. In this embodiment, the specific form of the first low-noise amplifier circuit 300 is not limited.

[0096] The second filtering circuit 400, connected to the second output terminal Port3 of the combiner 100, filters the received second frequency band signal to output at least one corresponding second sub-frequency band signal. The second sub-frequency band signal is a signal within a specific frequency band of the second frequency band signal. For example, when the first frequency band signal is a mid-to-high frequency band signal, its second sub-frequency band signal can be a signal from the B40 or B41 frequency band. Optionally, the second filtering circuit 400 may include at least one second filter. If there are multiple second filters, each second filter has a different passband, meaning that the frequency band of the second sub-frequency band signal output by each second filter is different.

[0097] The second low-noise amplifier circuit 500, connected to the second filter circuit 400, is used to perform low-noise amplification processing on the received second frequency band signal. The second low-noise amplifier circuit 500 may include at least one second low-noise amplifier, which can perform low-noise amplification processing on the received signal and output the amplified signal to the radio frequency transceiver 600, thereby realizing the reception processing of the second frequency band signal.

[0098] Optionally, the second low-noise amplifier circuit 500 may be an LNABank device or an LFEM device. In this embodiment, the specific form of the first low-noise amplifier circuit 300 is not limited.

[0099] In the embodiments of this application, the radio frequency system may include the combiner 100, the first filter circuit 200, the first low-noise amplifier circuit 300, the second filter circuit 400, and the second low-noise amplifier circuit 500 as described in any of the foregoing embodiments. The combiner 100 may include a first frequency divider unit, a second frequency divider unit, a first stopband unit, and a second stopband unit, each of which may include multiple components, each of which may be a capacitor or an inductor. Thus, the combiner 100 provided in this application can use multiple discrete capacitor and inductor components to achieve the function of the combiner 100. Compared with the LTCC combiner in the related art, the hardware cost of the combiner 100 can be greatly reduced. In addition, by setting the first stopband unit and the second stopband unit, this application can generate a stopband zero, which can enhance the out-of-band rejection capability of the two filter units and enhance the isolation between the two filter units. In addition, the port impedance of the combiner 100 in the RF system of this application embodiment can be directly matched with the port impedance of the first filter circuit and the port impedance of the second filter circuit. Compared with the RF system in the related art, the first matching network set between the LTCC combiner and the first filter power supply and the second matching network set between the LTCC combiner and the second filter power supply can be omitted, which reduces the cost of the matching network, saves the workload of debugging, and improves the debugging efficiency.

[0100] For ease of explanation, to Figure 3 The example of the combiner 100 being applied to an RF system illustrates this concept. The combiner 100 can perform frequency division processing of low-frequency band signals and mid-to-high frequency band signals. For example, the RF system can support CA combination bands of first and second frequency band signals, including but not limited to B8+B3, B8+B40, B5+B41, etc.

[0101] like Figure 11As shown, when the RF system needs to support downlink CA of B8+B41, the electromagnetic wave signal received by the antenna ANT is processed by the combiner 100 through frequency division and filtering to output a low-frequency band signal LB and a mid-to-high frequency band signal MHB, respectively. These signals then enter the B8 filter and B41 filter in the first filter circuit 200, respectively, and are split into two paths, one entering the first low-noise amplifier LB1 LNA in the first low-noise amplifier circuit 300 and the other entering the second low-noise amplifier MHB4 LNA in the second low-noise amplifier circuit 500. Finally, they enter the RF transceiver 600 for demodulation. In this embodiment, the operating frequency band of the combiner 100 includes both low-frequency and mid-to-high frequency bands. Specifically, the low-frequency band LB is 700–960 MHz; and the mid-to-high frequency band MHB is 1700–2700 MHz. The working principle of combiner 100 is as follows: When the LB signal received by the antenna ANT terminal enters the common terminal of combiner 100, the LB signal goes through the first path, i.e., the LB path. This first path is a direct pass for the LB signal and a high impedance state for the MHB signal. When the MHB signal received by the antenna ANT terminal enters the common terminal of combiner 100, the MHB signal goes through the second path, i.e., the MHB path. This second path is a direct pass for the MHB signal and a high impedance state for the LB signal, so as to achieve isolation between the LB signal and the MHB signal.

[0102] The combiner 100 in this embodiment uses multiple discrete capacitors and resistors. The port impedance of the combiner 100 can be designed according to the port impedance of the filter. This avoids the need for a matching network between the combiner 100 and the filter, thereby further reducing costs and improving debugging efficiency.

[0103] For ease of explanation, to Figure 5 The example of the combiner 100 being applied to a radio frequency (RF) system illustrates this concept. The combiner 100 can perform frequency division processing on low, mid, and high frequency band signals as well as ultra-high frequency band signals. For instance, the RF system can support CA combination bands of first and second frequency band signals, including but not limited to B3+B78, B5+B78, B8+B78, etc.

[0104] like Figure 12As shown, when the RF system needs to support downlink CA of B5+B78, the electromagnetic wave signal received by the antenna ANT is processed by the combiner 100 through frequency division and filtering to output low-mid-high frequency band signal LMHB and ultra-high frequency band signal UHB respectively. These signals then enter the B5 filter and B78 filter in the first filter circuit 200, respectively, and are split into two paths, entering the first low-noise amplifier LB1 LNA in the first low-noise amplifier circuit 300 and the second low-noise amplifier UHB LNA in the second low-noise amplifier circuit 500. Finally, they enter the RF transceiver 600 for demodulation. In this embodiment, the operating frequency band of the combiner 100 includes low-mid-high frequency band signals and ultra-high frequency band signals. Specifically, the low-mid-high frequency band LMHB is 700–2700MHz; the ultra-high frequency band UHB is 3300–3800MHz. The working principle of combiner 100 is as follows: When the LMHB signal received by the antenna ANT terminal enters the common terminal of combiner 100, the LMHB signal goes through the third path, that is, the LMHB path. This first path is a direct pass for the LMHB signal and a high impedance state for the UHB signal. When the UHB signal received by the antenna ANT terminal enters the common terminal of combiner 100, the UHB signal goes through the fourth path, that is, the UHB path. This second path is a direct pass for the UHB signal and a high impedance state for the LMHB signal, so as to achieve isolation between the LMHB signal and the UHB signal.

[0105] Through theoretical research and simulation verification, the impedance variation curve of the combiner 100 provided in this application embodiment can be represented on a Smith chart as follows: Figure 13 As shown in the Smith chart, the frequencies of MHB and UHB are distributed around 1, meaning that the port impedance of combiner 100 is perfectly matched with the port impedances of each filter, eliminating the need for an additional impedance matching network to achieve a 1. Therefore, the combiner 100 in this embodiment uses multiple discrete capacitors and resistors, and its port impedance can be designed according to the port impedances of the filters. This avoids the need for a matching network between combiner 100 and the filters, further reducing costs and improving debugging efficiency.

[0106] This application also provides a communication device, including: an antenna and a radio frequency system as described in any of the foregoing embodiments; wherein the common terminal of the combiner is connected to the antenna.

[0107] In the embodiments of this application, the communication device may include the combiner, first filter circuit, first low-noise amplifier circuit, second filter circuit, second low-noise amplifier circuit, RF transceiver, and antenna as described in any of the foregoing embodiments. The combiner may include a first frequency divider unit, a second frequency divider unit, a first stopband unit, and a second stopband unit, each of which may include multiple components, such as capacitors or inductors. Thus, the combiner provided in this application can utilize multiple discrete capacitor and inductor components to achieve the function of a combiner, significantly reducing the hardware cost compared to LTCC combiners in related technologies. Furthermore, by setting the first and second stopband units, this application can generate stopband zeros, thereby enhancing the out-of-band rejection capability of the two filter units and improving the isolation between them. Furthermore, in the RF system of this application embodiment, the port impedance of the combiner can be directly matched with the port impedance of the first filter circuit, and it can also be directly matched with the port impedance of the second filter circuit. Compared with the RF system in the related art, the first matching network set between the LTCC combiner and the first filter power supply and the second matching network set between the LTCC combiner and the second filter power supply can be omitted, which reduces the cost of the matching network, saves the workload of debugging, and improves the debugging efficiency.

[0108] like Figure 14 As shown, further explanation will be given using mobile phone 10 as an example of a communication device. Specifically, as follows... Figure 14 As shown, the mobile phone 10 may include a memory 21 (which optionally includes one or more computer-readable storage media), processing circuitry 22, an input / output (I / O) subsystem 24, and at least one radio frequency system 25 as described in any of the foregoing embodiments. These components optionally communicate via one or more communication buses or signal lines 29. Those skilled in the art will understand that... Figure 14 The mobile phone 10 shown does not constitute a limitation on the mobile phone and may include more or fewer components than shown, or combine certain components, or have different component arrangements. Figure 14 The various components shown are implemented in hardware, software, or a combination of both, including one or more signal processing and / or application-specific integrated circuits.

[0109] Memory 21 optionally includes high-speed random access memory, and also optionally includes non-volatile memory, such as one or more disk storage devices, flash memory devices, or other non-volatile solid-state memory devices. Exemplary examples include software components stored in memory 21 such as an operating system 211, a communication module (or instruction set) 212, a global positioning system (GPS) module (or instruction set) 213, etc.

[0110] The processing circuit 22 can be used to control the operation of the mobile phone 10. The processing circuit 22 can be based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application-specific integrated circuits, etc.

[0111] The I / O subsystem 24 couples input / output peripherals on the mobile phone 10, such as the keypad and other input control devices, to the peripheral interface 23. The I / O subsystem 24 optionally includes a touchscreen, buttons, a tone generator, an accelerometer (motion sensor), an ambient light sensor and other sensors, LEDs and other status indicators, data terminals, etc. For example, a user can control the operation of the mobile phone 10 by supplying commands via the I / O subsystem 24, and can use the output resources of the I / O subsystem 24 to receive status information and other outputs from the mobile phone 10. For example, a user can press button 241 to turn the phone on or off.

[0112] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A combiner, characterized in that, The combiner is configured with a common terminal, a first output terminal, and a second output terminal, wherein the combiner includes: The first frequency divider unit is connected to the common terminal and the first output terminal respectively, and is used to perform frequency division processing on the electromagnetic wave signal received by the common terminal so as to output a first frequency band signal through the first output terminal; the first frequency divider unit includes a first inductor and a second inductor, wherein the first end of the first inductor is connected to the common terminal, and the second end of the first inductor is connected to the first output terminal through the second inductor. The second frequency divider unit is connected to the common terminal and the second output terminal respectively, and is used to perform frequency division processing on the electromagnetic wave signal received by the common terminal so as to output a second frequency band signal through the second output terminal; the second frequency divider unit includes a first capacitor and a second capacitor, wherein the first terminal of the first capacitor is connected to the common terminal, and the second terminal of the first capacitor is connected to the second output terminal through the second capacitor; the frequency of the first frequency band signal is less than the frequency of the second frequency band signal; The first stopband unit has a first end connected to the first frequency divider unit and the other end grounded, and is used to generate a stopband zero within the frequency range of the second frequency band signal. The second stopband unit has a first end connected to the second frequency divider unit and the other end grounded, used to generate a stopband zero within the frequency range of the first frequency band signal; wherein the first frequency divider unit, the second frequency divider unit, the first stopband unit, and the second stopband unit each include multiple components, and the components are capacitors or inductors; A first metal layer, wherein the first metal layer is provided with a first sub-microstrip winding and a second sub-microstrip winding; A second metal layer is located on the first metal layer. The second metal layer is configured with a common terminal, a first output terminal, and a second output terminal. The second metal layer also includes a first capacitor, a second capacitor, a third sub-microstrip winding, and a fourth sub-microstrip winding. The first and third sub-microstrip windings are connected to form the first inductor, and the second and fourth sub-microstrip windings are connected to form the second inductor. The capacitors in the first stopband unit and the second stopband unit are disposed in the second metal layer; The inductor in the first stopband unit is disposed on the first metal layer and the second metal layer, and the inductor in the second stopband unit is at least partially disposed on the second metal layer.

2. The combiner according to claim 1, characterized in that, The first stopband unit includes a first stopband branch, the first stopband branch includes a third inductor and a third capacitor connected in series, the first end of the first stopband branch is connected to the first frequency divider unit, and the second end of the first stopband branch is grounded. The second stopband unit includes a second stopband branch, which includes a fourth inductor and a fourth capacitor connected in series. The first end of the second stopband branch is connected to the second frequency divider unit, and the second end of the second stopband branch is grounded.

3. The combiner according to claim 2, characterized in that, The first stopband unit includes a plurality of first stopband branches, wherein the first end of each first stopband branch is connected to a different connection node from the first frequency divider unit. The second stopband unit includes multiple second stopband branches, wherein the first end of each second stopband branch is connected to a different connection node of the second frequency divider unit.

4. The combiner according to claim 3, characterized in that, The first stopband unit includes a first stopband branch, wherein the first end of the first stopband branch is connected to the second end of the first inductor and the first end of the second inductor, respectively. The second stopband unit includes a second stopband branch, wherein the first end of the second stopband branch is connected to the second end of the first capacitor and the first end of the second capacitor, respectively.

5. The combiner according to claim 4, characterized in that, The first frequency band signal includes low-frequency electromagnetic wave signals, and the second frequency band signal includes mid-to-high frequency electromagnetic wave signals.

6. The combiner according to claim 3, characterized in that, The second stopband unit includes two second stopband branches, wherein the first end of one second stopband branch is connected to the first end of the first capacitor and the common terminal, respectively; and the first end of the other second stopband branch is connected to the second end of the first capacitor and the first end of the second capacitor, respectively.

7. The combiner according to claim 6, characterized in that, The first frequency band signal includes electromagnetic wave signals in the low, medium and high frequency bands, and the second frequency band signal includes electromagnetic wave signals in the ultra-high frequency band.

8. The combiner according to claim 1, characterized in that, The first stopband unit includes a third inductor and a third capacitor, and the second stopband unit includes a fourth inductor and a fourth capacitor; wherein, The first metal layer is further provided with a fifth sub-microstrip winding and a sixth sub-microstrip winding, and the second metal layer is further provided with a seventh sub-microstrip winding and an eighth sub-microstrip winding, wherein the fifth sub-microstrip winding and the seventh sub-microstrip winding are connected to form the third inductor, and the sixth sub-microstrip winding and the eighth sub-microstrip winding are connected to form the fourth inductor.

9. The combiner according to claim 1, characterized in that, The first stopband unit includes a third inductor and a third capacitor, and the second stopband unit includes two second stopband branches, each of which includes a fourth inductor and a fourth capacitor; wherein... The first metal layer is further provided with a ninth sub-microstrip winding, and the second metal layer is further provided with a tenth sub-microstrip winding, an eleventh sub-microstrip winding, and a twelfth sub-microstrip winding. The ninth sub-microstrip winding and the tenth sub-microstrip winding are connected to form the third inductor, and the eleventh sub-microstrip winding and the twelfth sub-microstrip winding are respectively used to form the fourth resistor in the two second stopband branches.

10. The combiner according to claim 1, characterized in that, The inductor in the combiner is a microstrip line inductor.

11. A radio frequency system, characterized in that, include: The combiner as described in any one of claims 1-10, wherein the common terminal of the combiner is used to connect an antenna; The first filter circuit is connected to the first output terminal of the combiner; A first low-noise amplifier circuit is connected to the first filter circuit and is used to perform low-noise amplification processing on the received first frequency band signal. The second filter circuit is connected to the first output terminal of the combiner. The second low-noise amplifier circuit is connected to the second filter circuit and is used to perform low-noise amplification processing on the received second frequency band signal. The radio frequency transceiver is connected to the first low-noise amplifier circuit and the second low-noise amplifier circuit, respectively.

12. A communication device, characterized in that, include: antenna; The radio frequency system of claim 11, wherein the common terminal of the combiner is connected to the antenna.

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