Millimeter wave antenna and electronic device

Abstract

The invention provides a millimeter wave antenna and electronic equipment, and belongs to the technical field of antennas. The millimeter wave antenna comprises at least one unit array and a circuit board. The unit arrays are located on the surface of the circuit board; each unit array comprises a feed structure, a first radiation structure and a second radiation structure; the first radiation structure and the second radiation structure are arranged at an interval, the feed structure is located between the first radiation structure and the second radiation structure, the feed structure is in coupling connection with the first radiation structure and the second radiation structure, and the feed structure can perform coupling feed on the first radiation structure and the second radiation structure. According to the millimeter wave antenna, the occupied area of the antenna can be reduced, and integration of the low-profile and ultra-wideband millimeter wave antenna is facilitated.

Description

Technical Field

[0001] The present application relates to the field of antenna technology, and in particular to a millimeter wave antenna and electronic equipment. Background Art

[0002] As the technical support for 5G massive MIMO (Multiple Input Multiple Output), millimeter wave antenna integration technology is a key technology for realizing application scenarios such as high-resolution data streaming and mobile distributed computing.

[0003] Among the related technologies, millimeter wave antenna integration technologies mainly include AoC (Antenna on Chip) and AiP (Antenna in Package). The AoC antenna directly integrates the radiation element into the back end of the RF chip stack, while the AiP antenna is based on packaging materials and processes, integrating the antenna and chip in the package to achieve system-level wireless functions.

[0004] However, millimeter wave antennas using the above-mentioned integration technology generally have the problems of large size, narrow bandwidth, and performance that cannot meet communication requirements. Summary of the invention

[0005] The present application provides a millimeter wave antenna and electronic equipment, which can solve the problems of large size, narrow bandwidth, and performance that cannot meet communication requirements.

[0006] The technical solution is as follows:

[0007] In one aspect, a millimeter wave antenna is provided, the millimeter wave antenna comprising: at least one unit array and a circuit board;

[0008] The unit array is located on the surface of the circuit board;

[0009] The unit array includes a feeding structure, a first radiating structure and a second radiating structure;

[0010] The first radiating structure and the second radiating structure are arranged at intervals, the feeding structure is located between the first radiating structure and the second radiating structure, the feeding structure is coupled to the first radiating structure and the second radiating structure respectively, and the feeding structure can couple and feed the first radiating structure and the second radiating structure respectively.

[0011] In some embodiments, the first radiating structure and the second radiating structure can radiate energy in a direction perpendicular to the surface of the circuit board under the excitation of the feeding structure.

[0012] In some embodiments, the first radiating structure includes a first radiator and a second radiator, and the second radiating structure includes a third radiator and a fourth radiator;

[0013] The first radiator and the third radiator are respectively arranged in a direction parallel to the surface of the circuit board, and the first radiator and the third radiator form a pair of electric dipoles parallel to the surface of the circuit board under the excitation of the feeding structure;

[0014] The second radiator and the fourth radiator are respectively arranged in a direction perpendicular to the surface of the circuit board, and the second radiator and the fourth radiator form a pair of magnetic dipoles perpendicular to the surface of the circuit board under the excitation of the feeding structure;

[0015] The electric dipole and the magnetic dipole are combined to form a radiation pattern perpendicular to the surface of the circuit board.

[0016] In some embodiments, a first grounding point is provided at one end of the first radiator away from the feeding structure, and the other end of the first radiator close to the feeding structure is electrically connected to the second radiator;

[0017] A second grounding point is provided at one end of the third radiator away from the feeding structure, and the other end of the third radiator close to the feeding structure is electrically connected to the fourth radiator.

[0018] In some embodiments,

[0019] The first radiator includes at least two first conductor portions; the at least two first conductor portions are arranged at intervals along a first direction, and each of the first conductor portions extends along a second direction;

[0020] The first grounding point is respectively provided at one end of the at least two first conductor parts away from the feeding structure, and the other end of at least one of the at least two first conductor parts close to the feeding structure is electrically connected to the second radiator;

[0021] and / or,

[0022] The third radiator comprises at least two second conductor portions; the at least two second conductor portions are arranged at intervals along the first direction, and each of the second conductor portions extends along the second direction;

[0023] The second grounding point is respectively provided at one end of the at least two second conductor parts away from the feeding structure, and the other end of at least one of the at least two second conductor parts close to the feeding structure is electrically connected to the fourth radiator;

[0024] The second direction is a direction approaching or moving away from the feeding structure, the first direction is perpendicular to the second direction, and the first direction and the second direction are respectively parallel to the surface of the circuit board.

[0025] In some embodiments, the number of the first conductor parts is three, and the first grounding point is respectively provided at one end of the three first conductor parts away from the feeding structure; the three first conductor parts are arranged in sequence along the first direction at intervals, and the other ends of the two first conductor parts located on both sides close to the feeding structure are respectively electrically connected to the second radiator.

[0026] In some embodiments, the number of the second conductor parts is three, and the second grounding points are respectively provided at one end of the three second conductor parts away from the feeding structure; the three second conductor parts are arranged in sequence along the first direction at intervals, and the other ends of the two second conductor parts located on both sides close to the feeding structure are respectively electrically connected to the fourth radiator.

[0027] In some embodiments,

[0028] The first radiation structure further includes a first substrate body;

[0029] The first substrate is located on the surface of the circuit board, the first radiator is located on the surface of the first substrate parallel to the surface of the circuit board, and the second radiator is located on the surface of the first substrate facing the feeding structure;

[0030] and / or,

[0031] The second radiation structure further includes a second substrate body;

[0032] The second substrate is located on the surface of the circuit board, the third radiator is located on the surface of the second substrate parallel to the surface of the circuit board, and the fourth radiator is located on the surface of the second substrate facing the feeding structure.

[0033] In some embodiments, the distance L1 between the first radiator and the third radiator and the circuit board ranges from 1.5 mm to 2.5 mm;

[0034] The size L2 of the first radiator and the third radiator along the first direction ranges from 2 to 4 mm;

[0035] The size L3 of the first radiator and the third radiator along the second direction ranges from 2 to 4 mm.

[0036] In some embodiments, the height of the second radiator is equal to the distance L1 between the first radiator and the circuit board, and the width of the second radiator is equal to the dimension L2 of the first radiator along the first direction;

[0037] The height of the fourth radiator is equal to the distance L1 between the third radiator and the circuit board, and the width of the fourth radiator is equal to the dimension L2 of the third radiator along the first direction.

[0038] In some embodiments, the feeding structure is located between the second radiator and the third radiator, and at least a portion of the feeding structure is arranged parallel to and spaced from the second radiator and the third radiator.

[0039] In some embodiments, the height of the feeding structure is less than or equal to the height of the second radiator or the fourth radiator; and the width of the feeding structure is equal to the width of the second radiator or the fourth radiator.

[0040] In some embodiments, the feeding structure includes a third conductor portion and a fourth conductor portion; the third conductor portion is located on the circuit board between the second radiator and the third radiator and extends toward the top of the circuit board, and the fourth conductor portion is located at the top of the third conductor portion.

[0041] In some embodiments, the circuit board surface includes a first surface area and a second surface area;

[0042] The first surface area is located at the edge area of ​​the circuit board, and the board thickness of the first surface area is less than the board thickness of the second surface area;

[0043] The at least one unit array is located in the first surface area.

[0044] On the other hand, an electronic device is provided, comprising the millimeter wave antenna described in the present application.

[0045] The beneficial effects of the technical solution provided by this application include at least:

[0046] The millimeter wave antenna of the present application has at least one unit array on the circuit board, and the unit array includes a feeding structure and two radiating structures. The feeding structure is located between the two radiating structures. The feeding structure can couple and feed the two radiating structures, which can reduce the footprint of the antenna and is conducive to the integration of low-profile, ultra-wideband millimeter wave antennas. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0048] Figure 1 is a schematic diagram of the structure of the millimeter wave antenna provided in an embodiment of the present application;

[0049] Figure 2 It is a schematic diagram of the structure of an electric dipole and a magnetic dipole provided in an embodiment of the present application;

[0050] Figure 3 It is a schematic diagram of the combination of an electric dipole and a magnetic dipole provided in an embodiment of the present application;

[0051] Figure 4 is a top view of the structure of a unit array provided in an embodiment of the present application;

[0052] Figure 5 is a structural side view of a millimeter wave antenna provided in an embodiment of the present application;

[0053] Figure 6 is a structural schematic diagram of a millimeter wave antenna provided in another embodiment of the present application;

[0054] Figure 7 is an equivalent circuit diagram of the millimeter wave antenna provided in an embodiment of the present application;

[0055] Figure 8 This is a diagram of S11 simulation results when the millimeter wave antenna provided in the embodiment of the present application is configured with one unit array;

[0056] Fig. 9 This is a diagram of S11 simulation results when the millimeter wave antenna provided in an embodiment of the present application is configured with three unit arrays;

[0057] Fig.10 This is a diagram of the simulation results of the radiation efficiency and total efficiency when the millimeter wave antenna provided in the embodiment of the present application is configured with three unit arrays.

[0058] The reference numerals in the figures represent respectively:

[0059] 1. Unit array;

[0060] 11. feeding structure; 111. third conductor part; 112. fourth conductor part;

[0061] 12. first radiation structure; 121. first radiator; 1211. first conductor; 122. second radiator; 123. first grounding point; 124. first substrate; 125. first metallized hole;

[0062] 13, second radiation structure; 131, third radiator; 1311, second conductor; 132, fourth radiator; 133, second grounding point; 134, second substrate; 126, second metallized hole;

[0063] 2. Circuit board;

[0064] 21. First face area;

[0065] 22. Second face area;

[0066] 01. Feed source; 02. Power divider. DETAILED DESCRIPTION

[0067] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0068] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate directions or positional relationships based on the attached Figure 1 The orientation or positional relationship shown is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0069] Unless otherwise defined, all technical terms used in the embodiments of the present application have the same meanings as commonly understood by those of ordinary skill in the art.

[0070] The technical solution provided in this application is applicable to electronic devices that adopt one or more of the following communication technologies: Bluetooth (Blue Tooth, BT) communication technology, Global Positioning System (Global Positioning System, GPS) communication technology, Wireless Fidelity (Wireless Fidelity, WiFi) communication technology, Global System For mobile communications (Global System For mobile Communications, GSM) communication technology, Wideband Code Division Multiple Access (Wideband Code Division Multiple Access, WCDMA) communication technology, Long Term Evolution (Long Term Evolution, LTE) communication technology, 5G communication technology and other future communication technologies.

[0071] The electronic device in the embodiment of the present application may be a mobile phone, a tablet computer, a laptop computer, a smart bracelet, a smart watch, a smart helmet, smart glasses, etc. The electronic device may also be a cellular phone, a cordless phone, a Session Initiation Protocol (SIP) phone, a Wireless Local Loop (WLL) station, a Personal Digital Assistant (PDA), a handheld device with wireless communication function, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device, an electronic device in a 5G network, or an electronic device in a future Public Land Mobile Network (PLMN), etc., and the embodiment of the present application does not limit this.

[0072] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0073] On the one hand, combined with Figure 1 As shown, this embodiment provides a millimeter wave antenna, which includes: at least one unit array 1 and a circuit board 2.

[0074] The unit array 1 is located on the surface of the circuit board 2; the unit array 1 includes a feeding structure 11, a first radiating structure 12 and a second radiating structure 13; the first radiating structure 12 and the second radiating structure 13 are arranged at intervals, the feeding structure 11 is located between the first radiating structure 12 and the second radiating structure 13, the feeding structure 11 is coupled and connected with the first radiating structure 12 and the second radiating structure 13 respectively, and the feeding structure 11 can couple and feed the first radiating structure 12 and the second radiating structure 13 respectively.

[0075] The millimeter wave antenna of this embodiment has at least one unit array 1 on the circuit board 2. The unit array 1 includes a feeding structure 11 and two radiating structures. The feeding structure 11 is located between the two radiating structures. The feeding structure 11 can couple and feed the two radiating structures, which can reduce the footprint of the antenna and is conducive to the integration of low-profile, ultra-wideband millimeter wave antennas.

[0076] In some possible implementations, the number of the unit arrays 1 is, for example, one, two, three, etc. When the number of the unit arrays 1 is two or more, the two or more unit arrays 1 are arranged on the circuit board 2 in an array.

[0077] Two or more unit cells 1 form an antenna array. In various embodiments, the antenna array can form at least one beam for communicating with a base station or an external electronic device by using a plurality of unit cells 1. The electronic device can receive or send a millimeter wave signal through at least one beam.

[0078] The beam of the antenna array can be directional in a specific direction. For example, the beam can be directional toward the side surface of the housing, toward the front plate, or toward the back plate. When the antenna array forms a beam with directionality in a specific direction, the communication performance of the electronic device can be improved by improving the main radiation direction of the millimeter wave antenna.

[0079] In some possible implementations, the circuit board 2 includes a printed circuit board (PCB), a flexible printed circuit board (FPC), a rigid-flexible board, and the like.

[0080] In some possible implementations, the circuit board 2 also includes various electronic components, elements or printed circuits of the electronic device, such as an application processor, a communication processor or an intermediate frequency integrated circuit, etc. In the relevant technology, the circuit board 2 may be referred to as a "PCB", "main PCB", "mainboard" or "printed board assembly", etc.

[0081] Exemplarily, a radio frequency circuit is provided on the circuit board 2, and the radio frequency circuit is electrically connected to the feeding structure 11. The radio frequency circuit can provide a current of a specified amplitude to each unit array 1 in the millimeter wave antenna, and feed resonant energy to each unit array 1 through the current. The unit array 1 supplied with resonant energy can form at least one beam, and the radio frequency circuit can use the at least one beam to receive or send millimeter wave signals.

[0082] In some possible implementations, the RF circuit connected to the feed structure 11 can achieve n256 (4800MHz-4900 MHz), n257 (26500MHz-29500 MHz), and n260 (37000MHz-40000MHz) millimeter wave frequency bands, and the millimeter wave antenna can achieve full coverage of the n256, n257, and n260 millimeter wave frequency bands.

[0083] In some embodiments, the first radiation structure 12 and the second radiation structure 13 can radiate energy in a direction perpendicular to the surface of the circuit board 2 under the stimulation of the feeding structure 11 .

[0084] Through the coupling effect of the first radiation structure 12 and the second radiation structure 13, the millimeter wave antenna can generate a radiation pattern perpendicular to the surface of the circuit board 2, and the main radiation direction of the millimeter wave antenna is perpendicular to the circuit board 2. When the millimeter wave antenna of this embodiment is used in a mobile terminal, the circuit board 2 usually exists as a main board or a sub-board of the mobile terminal. At this time, the main radiation direction of the millimeter wave antenna is perpendicular to the middle frame surface of the mobile terminal, which is conducive to improving the communication performance of the mobile terminal and reducing the cross-sectional height of the millimeter wave antenna.

[0085] Combination Figure 1 , 2 As shown in FIG. 3 , in some embodiments, the first radiation structure 12 includes a first radiator 121 and a second radiator 122 , and the second radiation structure 13 includes a third radiator 131 and a fourth radiator 132 .

[0086] The first radiator 121 and the third radiator 131 are respectively arranged in a direction parallel to the surface of the circuit board 2 . The first radiator 121 and the third radiator 131 form a pair of electric dipoles parallel to the surface of the circuit board 2 under the excitation of the feeding structure 11 .

[0087] The second radiator 122 and the fourth radiator 132 are respectively arranged in a direction perpendicular to the surface of the circuit board 2. The second radiator 122 and the fourth radiator 132 form a pair of magnetic dipoles perpendicular to the surface of the circuit board 2 under the excitation of the feeding structure 11. The combination of the electric dipole and the magnetic dipole can form a radiation pattern perpendicular to the surface of the circuit board 2.

[0088] The working principle of the unit array 1 in this embodiment is that under the excitation of the feeding structure 11, the first radiator 121 and the third radiator 131 parallel to the surface of the circuit board 2 produce an electric dipole effect, and the second radiator 122 and the fourth radiator 132 perpendicular to the surface of the circuit board 2 produce a magnetic dipole effect. Figure 3It can be seen from the directional pattern that when the directional patterns of the electric dipole and the magnetic dipole are combined, a semicircular directional pattern perpendicular to the surface of the circuit board 2 (i.e., the radiation directional pattern of this embodiment) will be generated. This directional pattern is perpendicular to the ground, that is, it radiates perpendicular to the middle frame surface of the mobile phone. This type of antenna design is beneficial to reducing the cross-sectional height of the first radiating structure 12 and the second radiating structure 13.

[0089] Combination Figure 1 As shown, in some embodiments, a first grounding point 123 is disposed at one end of the first radiator 121 away from the feeding structure 11 , and the other end of the first radiator 121 close to the feeding structure 11 is electrically connected to the second radiator 122 .

[0090] A second grounding point 133 is disposed at one end of the third radiator 131 away from the feeding structure 11 , and the other end of the third radiator 131 close to the feeding structure 11 is electrically connected to the fourth radiator 132 .

[0091] The first radiating structure 12 is grounded by the first grounding point 123 arranged on the first radiator 121 ; the second radiating structure 13 is grounded by the second grounding point 133 arranged on the third radiator 131 .

[0092] In some possible implementations, the circuit board 2 includes a grounding circuit, and the first grounding point 123 and the second grounding point 133 of this embodiment are electrically connected to the grounding circuit respectively.

[0093] Combination Figure 4 As shown, in some embodiments, the first radiator 121 includes at least two first conductor parts 1211; the at least two first conductor parts 1211 are arranged at intervals along the first direction a, and each first conductor part 1211 extends along the second direction b; the ends of the at least two first conductor parts 1211 away from the feeding structure 11 are respectively provided with a first grounding point 123, and the other end of at least one first conductor part 1211 of the at least two first conductor parts 1211 close to the feeding structure 11 is electrically connected to the second radiator 122. Among them, the second direction b is a direction close to or away from the feeding structure 11, the first direction a is perpendicular to the second direction b, and the first direction a and the second direction b are respectively parallel to the surface of the circuit board 2.

[0094] By dividing the first radiator 121 into at least two parallel and spaced first conductor portions 1211 , and electrically connecting some of the first conductor portions 1211 to the second radiator 122 , the first radiator 121 is formed into a cross-digital shape, so that adjacent first conductor portions 1211 are coupled to each other, thereby increasing the bandwidth.

[0095] Among them, each first conductor portion 1211 extends along the second direction b respectively, and the second direction b is a direction close to or away from the feeding structure 11. It can be understood that one end of the first conductor portion 1211 is close to the feeding structure 11, and the other end of the first conductor portion 1211 is away from the feeding structure 11.

[0096] The first direction a is perpendicular to the second direction b, and the first direction a and the second direction b are respectively parallel to the surface of the circuit board 2 , so that a plane formed by the first direction a and the second direction b is parallel to the surface of the circuit board 2 , and the first conductor portion 1211 extends in the plane.

[0097] At least two first conductor portions 1211 are arranged at intervals along the first direction a, so that corresponding coupling gaps are provided between adjacent first conductor portions 1211 , and electromagnetic coupling can be generated, thereby achieving the purpose of increasing the bandwidth of the millimeter wave antenna.

[0098] It is understandable that the number of the first conductor portions 1211 in the first radiator 121 is, for example, two, three, four, etc. The first conductor portion 1211 electrically connected to the second radiator 122 may also be one, two, etc. of all the first conductor portions 1211 .

[0099] Combination Figure 4 As shown, in some embodiments, the third radiator 131 includes at least two second conductor portions 1311; the at least two second conductor portions 1311 are arranged at intervals along the first direction a, and each second conductor portion 1311 extends along the second direction b respectively; the at least two second conductor portions 1311 are respectively provided with a second grounding point 133 at one end away from the feeding structure 11, and at least one of the at least two second conductor portions 1311 is electrically connected to the fourth radiator 132 at the other end close to the feeding structure 11; wherein the second direction b is a direction close to or away from the feeding structure 11, the first direction a is perpendicular to the second direction b, and the first direction a and the second direction b are respectively parallel to the surface of the circuit board 2.

[0100] By dividing the third radiator 131 into at least two parallel and spaced second conductor portions 1311, and electrically connecting some of the second conductor portions 1311 to the fourth radiator 132, the third radiator 131 is formed into a cross-toe shape, so that adjacent second conductor portions 1311 are coupled to each other, thereby increasing the bandwidth.

[0101] Among them, each second conductor portion 1311 extends along the second direction b respectively, and the second direction b is a direction close to or away from the feeding structure 11. It can be understood that one end of the second conductor portion 1311 is close to the feeding structure 11, and the other end of the second conductor portion 1311 is away from the feeding structure 11.

[0102] The first direction a is perpendicular to the second direction b, and the first direction a and the second direction b are respectively parallel to the surface of the circuit board 2 , so that a plane formed by the first direction a and the second direction b is parallel to the surface of the circuit board 2 , and the second conductor portion 1311 extends in the plane.

[0103] At least two second conductor portions 1311 are arranged at intervals along the first direction a, so that there are corresponding coupling gaps between adjacent second conductor portions 1311, which can generate electromagnetic coupling, thereby achieving the purpose of increasing the bandwidth of the millimeter wave antenna.

[0104] It is understandable that the number of the second conductor parts 1311 in the first radiator 121 is, for example, two, three, four, etc. The second conductor parts 1311 electrically connected to the fourth radiator 132 may also be one, two, etc. of all the second conductor parts 1311 .

[0105] Combination Figure 4 As shown, in some embodiments, the number of the first conductor portions 1211 is three, and the first grounding points 123 are respectively provided at one end of the three first conductor portions 1211 away from the feeding structure 11; the three first conductor portions 1211 are arranged in sequence along the first direction at intervals, and the other ends of the two first conductor portions 1211 located on both sides close to the feeding structure 11 are respectively electrically connected to the second radiator 122.

[0106] The first radiator 121 is divided into three first conductor parts 1211, which are grounded respectively, and the two first conductor parts 1211 on both sides are electrically connected to the second radiator 122 to achieve electrical grounding of the second radiator 122. The middle first conductor part 1211 can increase the bandwidth by coupling with the two adjacent first conductor parts 1211.

[0107] Combination Figure 4 As shown, in some embodiments, the number of the second conductor portions 1311 is three, and the second grounding points 133 are respectively provided at one end of the three second conductor portions 1311 away from the feeding structure 11; the three second conductor portions 1311 are arranged in sequence along the first direction at intervals, and the other ends of the two second conductor portions 1311 located on both sides close to the feeding structure 11 are respectively electrically connected to the fourth radiator 132.

[0108] The third radiator 131 is divided into three first conductor parts 1211, which are grounded respectively, and the two first conductor parts 1211 on both sides are electrically connected to the second radiator 122 to achieve electrical grounding of the second radiator 122. The middle first conductor part 1211 can increase the bandwidth by coupling with the two adjacent first conductor parts 1211.

[0109] Combination Figure 1As shown, in some embodiments, the first radiating structure 12 also includes a first substrate body 124; the first substrate body 124 is located on the surface of the circuit board 2, the first radiator 121 is located on the surface of the first substrate body 124 parallel to the surface of the circuit board 2, and the second radiator 122 is located on the surface of the first substrate body 124 facing the feeding structure 11.

[0110] The first substrate 124 is used to support the first radiator 121 and the second radiator 122 of the first radiating structure 12 on the surface of the circuit board 2 , so that the first radiating structure 12 can radiate electromagnetic waves.

[0111] In some possible implementations, a first metallized hole 125 is provided in the first substrate body 124, the top of the first metallized hole 125 is electrically connected to the first grounding point 123, and the bottom of the first metallized hole 125 is electrically connected to the grounding circuit of the circuit board 2, thereby realizing the grounding connection of the first radiation structure 12.

[0112] In some other possible implementations, the first radiator 121 and the second radiator 122 are formed by metal coatings on the surface of the first substrate 124 .

[0113] Combination Figure 1 As shown, in some embodiments, the second radiating structure 13 also includes a second substrate body 134; the second substrate body 134 is located on the surface of the circuit board 2, the third radiator 131 is located on the surface of the second substrate body 134 parallel to the surface of the circuit board 2, and the fourth radiator 132 is located on the surface of the second substrate body 134 facing the feeding structure 11.

[0114] The third radiator 131 and the fourth radiator 132 of the second radiating structure 13 are supported on the surface of the circuit board 2 by the second substrate 134 , so that the second radiating structure 13 can radiate electromagnetic waves.

[0115] In some possible implementations, a second metallized hole 126 is provided in the second substrate body 134, the top of the second metallized hole 126 is electrically connected to the second grounding point 133, and the bottom of the second metallized hole 126 is electrically connected to the grounding circuit of the circuit board 2, thereby realizing the grounding connection of the second radiation structure 13.

[0116] Combination Figure 4 , 5 As shown, in some embodiments, the distance L1 between the first radiator 121 and the third radiator 131 and the circuit board 2 is in the range of 1.5 mm to 2.5 mm. When the distance between the first radiator 121 and the circuit board 2 and the distance between the third radiator 131 and the circuit board 2 meet the above range, the millimeter wave antenna of this embodiment has low profile and high broadband performance.

[0117] Exemplarily, the distance L1 between the first radiator 121 and the third radiator 131 and the circuit board 2 is, for example, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, 2.0 mm, 2.1 mm, 2.2 mm, 2.3 mm, 2.4 mm, 2.5 mm, etc. Optionally, the value of L1 is 2 mm.

[0118] The dimension L2 of the first radiator 121 and the third radiator 131 along the first direction a has a value range of 2-4 mm; when the dimension L2 of the first radiator 121 and the third radiator 131 along the first direction a satisfies the above value range, the millimeter wave antenna of this embodiment has low profile and high bandwidth performance.

[0119] Exemplarily, the dimension L2 of the first radiator 121 and the third radiator 131 along the first direction a is, for example, 2.0 mm, 2.2 mm, 2.4 mm, 2.5 mm, 2.6 mm, 2.8 mm, 3.0 mm, 3.2 mm, 3.4 mm, 3.5 mm, 3.6 mm, 3.8 mm, 4.0 mm, etc. Optionally, the value of L2 is 3 mm.

[0120] The size L3 of the first radiator 121 and the third radiator 131 along the second direction b ranges from 2 to 4 mm. When the size L3 of the first radiator and the third radiator 131 along the second direction b meets the above range, the millimeter wave antenna of this embodiment has low profile and high bandwidth performance.

[0121] Exemplarily, the dimension L3 of the first radiator 121 and the third radiator 131 along the second direction b is, for example, 2.0 mm, 2.2 mm, 2.4 mm, 2.5 mm, 2.6 mm, 2.8 mm, 3.0 mm, 3.2 mm, 3.4 mm, 3.5 mm, 3.6 mm, 3.8 mm, 4.0 mm, etc. Optionally, the value of L3 is 3 mm.

[0122] In some possible implementations, the width L4 of the first conductor portion 1211 and the second conductor portion 1311 along the first direction a ranges from 0.7 to 1.1 mm.

[0123] Exemplarily, the distance L1 between the first radiator 121 and the third radiator 131 and the circuit board 2 is, for example, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, 2.0 mm, 2.1 mm, 2.2 mm, 2.3 mm, 2.4 mm, 2.5 mm, etc. Optionally, the value of L1 is 2 mm.

[0124] Combination Figure 4 , 5As shown, in some embodiments, the height of the second radiator 122 is equal to the distance L1 between the first radiator 121 and the circuit board 2, and the width of the second radiator 122 is equal to the dimension L2 of the first radiator 121 along the first direction; the height of the fourth radiator 132 is equal to the distance L1 between the third radiator 131 and the circuit board 2, and the width of the fourth radiator 132 is equal to the dimension L2 of the third radiator 131 along the first direction.

[0125] Therefore, the millimeter wave antenna of this embodiment can achieve high broadband function while maintaining a low profile.

[0126] Combination Figure 4 , 5 As shown, in some embodiments, the feeding structure 11 is located between the second radiator 122 and the third radiator 131 , and at least a portion of the feeding structure 11 is arranged parallel to and spaced from the second radiator 122 and the third radiator 131 .

[0127] The feeding structure 11 located between the second radiator 122 and the third radiator 131 realizes the coupled feeding of the first radiating structure 12 and the second radiating structure 13 , so that the radiation pattern of the millimeter wave antenna is perpendicular to the surface of the circuit board 2 .

[0128] Combination Figure 4 , 5 As shown, in some embodiments, the height of the feed structure 11 is less than or equal to the height of the second radiator 122 or the fourth radiator 132; the width of the feed structure 11 is equal to the width of the second radiator 122 or the fourth radiator 132. This is conducive to reducing the profile height of the millimeter wave antenna and reducing the space occupied by the millimeter wave antenna.

[0129] In some possible implementations, the heights of the first radiation structure 12 , the second radiation structure 13 , and the feeding structure 11 are all smaller than the height of the shielding shell on the surface of the circuit board 2 , thereby avoiding position interference of the shielding shell.

[0130] Combination Figure 5 As shown, in some embodiments, the feeding structure 11 includes a third conductor portion 111 and a fourth conductor portion 112; the third conductor portion 111 is located on the circuit board 2 between the second radiator 122 and the third radiator 131, and extends toward the top of the circuit board 2, and the fourth conductor portion 112 is located at the top of the third conductor portion 111.

[0131] The third conductor portion 111 and the fourth conductor portion 112 can be used to generate an electric dipole and a magnetic dipole, so that the radiation pattern of the millimeter wave antenna is perpendicular to the surface of the circuit board 2 .

[0132] In some possible implementations, the connection structure between the fourth conductor portion 112 and the third conductor portion 111 includes but is not limited to an L-shape, a T-shape, and the like.

[0133] Combination Figure 1 , 5 As shown, in some embodiments, the surface of the circuit board 2 includes a first surface area 21 and a second surface area 22; the first surface area 21 is located in the edge area of ​​the circuit board 2, and the board layer thickness of the first surface area 21 is less than the board layer thickness of the second surface area 22; at least one unit array 1 is located in the first surface area 21.

[0134] The unit array 1 is centrally arranged on the first surface area 21 of the circuit board 2, so that the unit array 1 is integrated on a chip, reducing the space occupied by the antenna inside the electronic device. In addition, it is helpful to reduce the circuit design difficulty of the antenna, reduce the feeding distance, reduce the feeding loss, and improve the radiation effect of the antenna.

[0135] In some embodiments, since the first surface area 21 only needs to arrange the corresponding feeding circuit and the grounding circuit, the stacking structure is simple relative to the second surface area 22. The first surface area 21 is located at the edge area of ​​the circuit board 2, and the first surface area 21 is formed by a local groove of the circuit board 2 to reduce the board thickness of the first surface area 21, so that the thickness of the circuit board 2 after the integrated unit array 1 is reduced, which is beneficial to the stacking of the circuit board 2 in the electronic device.

[0136] This application simulates and designs a three-element array based on a millimeter wave antenna. Figure 6 As shown, it should be noted that the millimeter wave antenna of the present application is not limited to three unit arrays 1, and an array design of more than or less than three unit arrays 1 can be performed.

[0137] refer to Figure 6 The millimeter wave antenna consists of three groups of unit arrays 1, and its equivalent circuit is as follows Figure 7 , the feed source 01 is connected to the power divider 02, and then connected to the unit array 1; the three sets of parallel resistors R, inductors L, and capacitors C are the equivalent circuit of the unit array 1, C6 and C7 are the coupling capacitors between the arrays, and the power divider 02 plays the role of evenly distributing the power of the feed source 01.

[0138] Figure 8 The S11 (input reflection coefficient, i.e., input return loss) simulation result diagram when the millimeter wave antenna provided in the embodiment of the present application is configured with one unit array. It can be seen from the figure that its frequency band covers the mmWave BAND 256 / 257 / 260 millimeter wave bands, including all millimeter wave bands used by mobile phone antennas.

[0139] Fig. 9The S11 simulation result diagram of the millimeter wave antenna provided in the embodiment of the present application is configured with three unit arrays. It can be seen from the figure that its frequency band covers the mmWave BAND 256 / 257 / 260 millimeter wave band. Compared with the unit array, its S11 waveform is deeper and the performance is better.

[0140] Fig.10 This is a diagram of the simulation results of the radiation efficiency (SystemRad.Efficiency) and the total efficiency (SystemTot.Efficiency) of the millimeter wave antenna provided in an embodiment of the present application when three unit arrays are configured. It can be seen from the figure that the TOTAL efficiency of the antenna can reach up to -3.5dB.

[0141] The millimeter wave antenna of the present application utilizes the board end for antenna design, reduces the antenna footprint, and utilizes antenna integration to cover the mmWave BAND 256 / 257 / 260 millimeter wave frequency bands. It has ultra-wideband characteristics, and the antenna height is as low as 2mm, not exceeding the height of the board end shielding cover, which is conducive to board end design. Under whole machine simulation, the total efficiency can reach up to -3.5dB within the band, with better performance.

[0142] On the other hand, this embodiment provides an electronic device, which includes the millimeter wave antenna of this application. The electronic device of this embodiment adopts the millimeter wave antenna of this application and has all the technical effects of this application.

[0143] In some possible implementations, the electronic device may include a radio frequency (RF) circuit, a memory including one or more computer-readable storage media, an input unit, a display unit, a sensor, an audio circuit, a Wi-Fi module, a processor including one or more processing cores, and a power supply and other components.

[0144] Among them, the RF circuit can be used for receiving and sending signals during information transmission or calls. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors for processing; in addition, the uplink data is sent to the base station. Usually, the RF circuit includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc.

[0145] In addition, the RF circuit can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to Global System of Mobilecommunication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Messaging Service (SMS), etc.

[0146] It should be noted that the "several" and "at least one" mentioned in this article refer to one or more, and "multiple" and "at least two" refer to two or more. "And / or" describes the association relationship of the associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0147] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0148] In the description of this specification, the reference terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application.

[0149] The above description is only an embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A millimeter wave antenna, characterized in that: The millimeter wave antenna comprises: at least one unit array (1) and a circuit board (2); The unit array (1) is located on the surface of the circuit board (2); The unit array (1) comprises a feeding structure (11), a first radiating structure (12) and a second radiating structure (13); The first radiating structure (12) and the second radiating structure (13) are arranged at intervals, the feeding structure (11) is located between the first radiating structure (12) and the second radiating structure (13), the feeding structure (11) is coupled to the first radiating structure (12) and the second radiating structure (13), respectively, and the feeding structure (11) can couple and feed the first radiating structure (12) and the second radiating structure (13), respectively.

2. The millimeter wave antenna according to claim 1, characterized in that: The first radiating structure (12) and the second radiating structure (13) are capable of radiating energy in a direction perpendicular to the surface of the circuit board (2) under the excitation of the feeding structure (11).

3. The millimeter wave antenna according to claim 1 or 2, characterized in that: The first radiation structure (12) comprises a first radiator (121) and a second radiator (122), and the second radiation structure (13) comprises a third radiator (131) and a fourth radiator (132); The first radiator (121) and the third radiator (131) are respectively arranged in a direction parallel to the surface of the circuit board (2); the first radiator (121) and the third radiator (131) form a pair of electric dipoles parallel to the surface of the circuit board (2) under the excitation of the feeding structure (11); The second radiator (122) and the fourth radiator (132) are respectively arranged in a direction perpendicular to the surface of the circuit board (2); the second radiator (122) and the fourth radiator (132) form a pair of magnetic dipoles perpendicular to the surface of the circuit board (2) under the excitation of the feeding structure (11); The electric dipole and the magnetic dipole are combined to form a radiation pattern perpendicular to the surface of the circuit board (2).

4. The millimeter wave antenna according to claim 3, characterized in that: A first grounding point (123) is provided at one end of the first radiator (121) away from the feeding structure (11), and the other end of the first radiator (121) close to the feeding structure (11) is electrically connected to the second radiator (122); A second grounding point (133) is provided at one end of the third radiator (131) away from the feeding structure (11), and the other end of the third radiator (131) close to the feeding structure (11) is electrically connected to the fourth radiator (132).

5. The millimeter wave antenna according to claim 4, characterized in that: The first radiator (121) comprises at least two first conductor parts (1211); the at least two first conductor parts (1211) are arranged at intervals along a first direction, and each of the first conductor parts (1211) extends along a second direction respectively; The first grounding point (123) is respectively provided at one end of the at least two first conductor parts (1211) away from the feeding structure (11), and the other end of at least one of the at least two first conductor parts (1211) close to the feeding structure (11) is electrically connected to the second radiator (122); and / or, The third radiator (131) comprises at least two second conductor parts (1311); the at least two second conductor parts (1311) are arranged at intervals along the first direction, and each second conductor part (1311) extends along the second direction respectively; The at least two second conductor parts (1311) are respectively provided with the second grounding point (133) at one end away from the feeding structure (11), and the other end of at least one of the at least two second conductor parts (1311) close to the feeding structure (11) is electrically connected to the fourth radiator (132); The second direction is a direction approaching or moving away from the feeding structure (11), the first direction is perpendicular to the second direction, and the first direction and the second direction are respectively parallel to the surface of the circuit board (2).

6. The millimeter wave antenna according to claim 5, characterized in that: The number of the first conductor parts (1211) is three, and the first grounding points (123) are respectively provided at one end of the three first conductor parts (1211) away from the feeding structure (11); the three first conductor parts (1211) are arranged in sequence along the first direction at intervals, and the other ends of the two first conductor parts (1211) located on both sides close to the feeding structure (11) are respectively electrically connected to the second radiator (122).

7. The millimeter wave antenna according to claim 5, characterized in that: The number of the second conductor parts (1311) is three, and the second grounding points (133) are respectively provided at one end of the three second conductor parts (1311) away from the feeding structure (11); the three second conductor parts (1311) are arranged in sequence along the first direction at intervals, and the other ends of the two second conductor parts (1311) located on both sides close to the feeding structure (11) are respectively electrically connected to the fourth radiator (132).

8. The millimeter wave antenna according to claim 3, characterized in that: The first radiation structure (12) further comprises a first substrate body (124); The first substrate (124) is located on a surface of the circuit board (2), the first radiator (121) is located on a surface of the first substrate (124) parallel to the surface of the circuit board (2), and the second radiator (122) is located on a surface of the first substrate (124) facing the feeding structure (11); and / or, The second radiation structure (13) further comprises a second substrate body (134); The second substrate body (134) is located on the surface of the circuit board (2), the third radiator (131) is located on the surface of the second substrate body (134) parallel to the surface of the circuit board (2), and the fourth radiator (132) is located on the surface of the second substrate body (134) facing the feeding structure (11).

9. The millimeter wave antenna according to any one of claims 3 to 8, characterized in that: The value range of the distance L1 between the first radiator (121) and the third radiator (131) and the circuit board (2) is 1.5 mm-2.5 mm; The size L2 of the first radiator (121) and the third radiator (131) along the first direction is in the range of 2-4 mm; The value range of the dimension L3 of the first radiator (121) and the third radiator (131) along the second direction is 2-4 mm.

10. The millimeter wave antenna according to claim 9, characterized in that: The height of the second radiator (122) is equal to the distance L1 between the first radiator (121) and the circuit board (2), and the width of the second radiator (122) is equal to the dimension L2 of the first radiator (121) along the first direction; The height of the fourth radiator (132) is equal to the distance L1 between the third radiator (131) and the circuit board (2), and the width of the fourth radiator (132) is equal to the dimension L2 of the third radiator (131) along the first direction.

11. The millimeter wave antenna according to any one of claims 3 to 10, characterized in that: The feeding structure (11) is located between the second radiator (122) and the third radiator (131), and at least a portion of the feeding structure (11) is arranged in parallel and spaced apart from the second radiator (122) and the third radiator (131).

12. The millimeter wave antenna according to claim 11, characterized in that: The height of the feeding structure (11) is less than or equal to the height of the second radiator (122) or the fourth radiator (132); and the width of the feeding structure (11) is equal to the width of the second radiator (122) or the fourth radiator (132).

13. The millimeter wave antenna according to claim 11, characterized in that: The feeding structure (11) comprises a third conductor portion (111) and a fourth conductor portion (112); the third conductor portion (111) is located on the circuit board (2) between the second radiator (122) and the third radiator (131), and extends toward the top of the circuit board (2); the fourth conductor portion (112) is located at the top of the third conductor portion (111).

14. The millimeter wave antenna according to any one of claims 1 to 13, characterized in that: The surface of the circuit board (2) comprises a first surface area (21) and a second surface area (22); The first surface area (21) is located at an edge region of the circuit board (2), and the board layer thickness of the first surface area (21) is less than the board layer thickness of the second surface area (22); The at least one unit array (1) is located in the first surface area (21).

15. An electronic device, characterized in that: The electronic device includes the millimeter wave antenna according to any one of claims 1 to 14.

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