Simple method for etching integrated circuit in laboratory

Abstract

The invention relates to a simple method for etching an integrated circuit in a laboratory. The method comprises the following steps: manufacturing a developing cover plate for exposure; performing exposure operation on the copper-clad plate coated with the photosensitive material by using the developing cover plate; developing the exposed copper-clad plate by using an alkaline organic solvent as a developing agent; a wet etching liquid container and a clamp for clamping a sample are used for accurately etching the developed copper-clad plate by using an etching liquid through a metal replacement reaction; and demolding the etched copper-clad plate to obtain a primary integrated circuit board. According to the method, the exposure operation of the photosensitive copper-clad plate is realized by combining common equipment, and the drawing and exposure operation of integrated circuits with various different patterns can be realized due to the simple operation of the method.

Description

Technical Field

[0001] The invention belongs to the technical field of integrated circuit printing, in particular to a simple method for etching integrated circuits in a laboratory. Background Art

[0002] In recent years, with the continuous development of science and technology, integrated circuits have been widely used in life and industry due to their economic advantages, design advantages, and usage advantages. The design and production of integrated circuits have gradually become an important part of the work of various researchers and scholars.

[0003] Due to the development of technology, the integrated circuit manufacturing process is now very mature, and the cost of mass production of integrated circuits is very low, which has greatly promoted the miniaturization and intelligence of various electrical devices in life. However, due to the different requirements for the complexity of integrated circuits in various fields, the common commercial production methods only have great advantages when the demand for integrated circuits is large and the complexity is high. For work with small demand and high personalized requirements, such as the initial design experiments of microstrip resonators and RF antennas, the use of commercial plate making often results in a large waste of resources and high production costs.

[0004] The industrial production of integrated circuits mainly includes processes such as coating, pre-baking, exposure, development, etching, and de-bonding. In actual design work, the personalized needs of integrated circuits are mainly reflected in the etching patterns, and coating and pre-baking have high requirements on the production environment. Therefore, laboratory plate making generally exposes, develops, etches, and de-bonds copper-clad plates or silicon wafers coated with photosensitive materials to achieve the production of specified integrated circuit boards, and the operation is relatively cumbersome. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and to propose a simple method for etching integrated circuits in the laboratory. The exposure operation of the photosensitive copper-clad plate is realized by combining common equipment. Since the method is simple to operate, the drawing and exposure operations of integrated circuits with various patterns can be realized.

[0006] The present invention solves the technical problem by adopting the following technical solutions:

[0007] A simple method for etching integrated circuits in a laboratory comprises the following steps:

[0008] Step 1, making a developing cover plate for exposure;

[0009] Step 2, using a developing cover plate to expose the copper-clad plate coated with a photosensitive material;

[0010] Step 3, using an alkaline organic solvent as a developer to develop the exposed copper-clad board;

[0011] Step 4: Use a wet etching liquid container and a fixture for holding the sample to accurately etch the developed copper-clad board using an etching liquid through a metal replacement reaction;

[0012] Step 5, demoulding the etched copper-clad board to obtain a primary integrated circuit board;

[0013] Step 6: Cut the primary integrated circuit board and put it into use.

[0014] Furthermore, the step 2 comprises the following steps:

[0015] Step 2.1, design the pattern;

[0016] Step 2.2, printing high-resolution patterns on a transparent PET film;

[0017] Step 2.3, covering the film on the photosensitive copper-clad board;

[0018] Step 2.4, subjecting the photosensitive copper-clad laminate covered with the film to vacuum treatment;

[0019] Step 2.5, exposing the vacuum-treated photosensitive copper-clad laminate to ultraviolet light.

[0020] Moreover, in the step 3, the wet etching liquid container is a rectangular container, the container material is an acrylic plate, and the container interface is coated with glue for waterproofing measures. The container includes a developer container, an etching liquid container and a glue container. At the same time, a temperature control device is provided at the front end of the developer container, the etching liquid container and the glue container. A gas circulation pipe is provided at the rear end of the developer container, the etching liquid container and the glue container to ensure sufficient contact between the solution and the etching plate. A water outlet is provided at the bottom of the developer container, the etching liquid container and the glue container for solution replacement, and a rubber plug is provided at the water outlet to plug the water outlet tightly to prevent liquid leakage.

[0021] Moreover, the gas circulation pipe is composed of a rubber hose, and the bottom is a closed air pipe composed of a semicircular hose and a straight tube. Small holes are punched on the straight tube at certain intervals to ensure that sufficient gas passes through the copper-clad board sample during chemical etching, thereby achieving the effect of accelerating the reaction.

[0022] Moreover, the clamp for clamping the sample in step 4 includes a clamp handle, a fixed clamp column and a plastic clamp, wherein 5 through holes are punched on the clamp handle for adjusting the height of the clamped sample, and the fixed clamp column is composed of an acrylic plate. During the etching process, the fixed clamp column is used to cross the clamp for clamping the copper-clad board at the mouth of the reaction container to ensure that the sample is completely immersed in the solution and is in the optimal reaction position.

[0023] The advantages and positive effects of the present invention are:

[0024] The present invention manufactures a developing cover plate for exposure; uses the developing cover plate to expose a copper-clad plate coated with a photosensitive material; uses an alkaline organic solvent as a developer to develop the exposed copper-clad plate; uses a wet etching liquid container and a clamp for holding a sample, and uses an etching liquid to accurately etch the developed copper-clad plate through a metal replacement reaction; and performs a demolding process on the etched copper-clad plate to obtain a primary integrated circuit board. The present invention realizes the exposure operation of the photosensitive copper-clad plate by combining common equipment, and because the method is simple to operate, it can realize the drawing and exposure operations of integrated circuits of various patterns. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a flow chart of exposure of the photosensitive copper-clad plate of the present invention;

[0026] Figure 2 This is a schematic diagram of a liquid container for wet etching according to the present invention;

[0027] Figure 3 It is a schematic diagram of the gas circulation device of the present invention;

[0028] Figure 4 Schematic diagram of the sample fixture of the present invention. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below with reference to the accompanying drawings.

[0030] A simple method for etching integrated circuits in a laboratory comprises the following steps:

[0031] Step 1: Prepare a developing cover plate for exposure.

[0032] Step 2: Use a developing cover plate to expose the copper-clad board coated with a photosensitive material.

[0033] like Figure 1 As shown, this step includes the following steps:

[0034] Step 2.1, design the pattern.

[0035] Step 2.2: Print high-resolution patterns on transparent PET film.

[0036] Step 2.3: Cover the film on the photosensitive copper-clad board.

[0037] Step 2.4: vacuum-treat the photosensitive copper-clad laminate covered with the film.

[0038] Step 2.5, exposing the vacuum-treated photosensitive copper-clad laminate to ultraviolet light.

[0039] First, use drawing software to draw the integrated circuit pattern, distinguish the etched and retained parts by black and white, use a high-resolution printer to print the pattern on a transparent PET film, and in a weak light environment, cover the PET film with the integrated circuit pattern on the copper-clad board coated with photosensitive material, place it in a transparent vacuum bag, and use a vacuum machine to evacuate the bag to ensure that the film and the copper-clad board are in close contact. The prepared sample to be processed is placed in a UV light box for exposure treatment for 1-2 minutes.

[0040] Step 3: Use an alkaline organic solvent as a developer to develop the exposed copper-clad board.

[0041] Step 4: Use a wet etching liquid container and a fixture to hold the sample, and use the etching liquid to accurately etch the developed copper-clad board through a metal replacement reaction.

[0042] like Figure 2 The figure shows a wet etching liquid container. The overall size of the container is a rectangular container of 22cm×19cm×31cm, of which the internal size of the container is 20cm×5cm×30cm. The container material library can use acrylic board. The interface of the container should be coated with glue to take waterproof measures. Among them, container No. ① is a developer container, No. ② is an etching liquid container, and No. ③ is a degumming liquid container. In order to ensure the reaction efficiency, a temperature control device is added to the device to ensure that the reaction temperature is 50°C. A gas circulation pipe is designed to ensure full contact between the solution and the etching plate. A water outlet is designed at the bottom of the container to facilitate solution replacement. It should be noted that during normal etching, the water outlet should be tightly plugged with a rubber stopper to prevent liquid leakage.

[0043] like Figure 3 The figure shows a gas circulation device, which is composed of a rubber hose with a diameter of 1 cm and a height of 30 cm. The bottom is a closed air pipe composed of a semicircular hose and a straight tube. Small holes are punched on the straight tube at certain intervals to ensure that sufficient gas passes through the copper-clad board sample during the chemical etching process, thereby achieving the effect of accelerating the reaction.

[0044] like Figure 4 The figure shows a fixture for clamping samples, which is mainly composed of three parts: a fixture handle, a fixed clamp column, and a plastic clamp. Five through holes with a radius of 3mm are punched on the fixture handle to adjust the height of the clamped sample. The fixed clamp column is composed of an acrylic cylinder with a length of 11cm and a radius of 3mm and a 5mm×20mm×30mm acrylic plate. During the etching process, the fixed clamp column can be used to cross the clamp holding the copper-clad board at the mouth of the reaction vessel to ensure that the sample is completely immersed in the solution and is in the best reaction position.

[0045] It should be emphasized that the embodiments described in the present invention are illustrative rather than restrictive. Therefore, the present invention includes but is not limited to the embodiments described in the specific implementation manner. Any other implementation manners derived by those skilled in the art based on the technical solution of the present invention also fall within the scope of protection of the present invention.

Claims

1. A simple method for etching integrated circuits in a laboratory, characterized in that: The following steps are involved: Step 1, making a developing cover plate for exposure; Step 2, using a developing cover plate to expose the copper-clad plate coated with a photosensitive material; Step 3, using an alkaline organic solvent as a developer to develop the exposed copper-clad board; Step 4: Use a wet etching liquid container and a fixture for holding the sample to accurately etch the developed copper-clad board using an etching liquid through a metal replacement reaction; Step 5, demoulding the etched copper-clad board to obtain a primary integrated circuit board; Step 6: Cut the primary integrated circuit board and put it into use.

2. A simple method for etching integrated circuits in a laboratory according to claim 1, characterized in that: The step 2 comprises the following steps: Step 2.1, design the pattern; Step 2.2, printing high-resolution patterns on a transparent PET film; Step 2.3, covering the film on the photosensitive copper-clad board; Step 2.4, subjecting the photosensitive copper-clad laminate covered with the film to vacuum treatment; Step 2.5, exposing the vacuum-treated photosensitive copper-clad laminate to ultraviolet light.

3. A simple method for etching integrated circuits in a laboratory according to claim 1, characterized in that: In the step 3, the wet etching liquid container is a rectangular container, the container material is an acrylic plate, and the container interface is coated with glue for waterproofing. The container includes a developer container, an etching liquid container and a glue container. At the same time, a temperature control device is provided at the front end of the developer container, the etching liquid container and the glue container. A gas circulation pipe is provided at the rear end of the developer container, the etching liquid container and the glue container to ensure sufficient contact between the solution and the etching plate. A water outlet is provided at the bottom of the developer container, the etching liquid container and the glue container for solution replacement. A rubber plug is provided at the water outlet to plug the water outlet tightly to prevent liquid leakage.

4. A simple method for etching integrated circuits in a laboratory according to claim 3, characterized in that: The gas circulation tube is composed of a rubber hose, and the bottom is a closed air pipe composed of a semicircular hose and a straight tube. Small holes are punched on the straight tube at certain intervals to ensure that sufficient gas passes through the copper-clad board sample during the chemical etching process, thereby achieving the effect of accelerating the reaction.

5. A simple method for etching integrated circuits in a laboratory according to claim 1, characterized in that: The clamp for clamping the sample in step 4 includes a clamp handle, a fixed clamp column and a plastic clamp, wherein 5 through holes are punched on the clamp handle for adjusting the height of the clamped sample, and the fixed clamp column is composed of an acrylic plate. During the etching process, the clamp for clamping the copper-clad board is placed horizontally at the mouth of the reaction container using the fixed clamp column to ensure that the sample is completely immersed in the solution and is in the optimal reaction position.

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