Package structure and manufacturing method thereof
By introducing a barrier structure into the semiconductor packaging structure, the colloid is blocked from entering the photosensitive area, the problem of colloid pollution is solved and the yield and stability of the packaging structure are improved.
Patent Information
- Application Number
- CN202411587156.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-02-28
AI Technical Summary
In the existing semiconductor packaging structure, colloidal bonding can easily lead to contamination of chips and circuit components, affecting product yields.
A package structure is designed, including a package body, a chip, a light-transmitting cover plate and a barrier structure. The barrier structure is located between the chip and the light-transmitting cover plate, and is located outside the photosensitive area, and is used to block colloids from entering the photosensitive area.
Through the design of the barrier structure, the colloids can be effectively prevented from contaminating the photosensitive area, improve the manufacturing yield of the packaging structure, and increase the stability of the packaging structure.
Smart Images
Figure CN119545940A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the semiconductor field, and more particularly to a packaging structure and a method for manufacturing the same. Background Technology
[0002] In recent years, the semiconductor integrated circuit industry has experienced rapid development. Semiconductor packaged devices typically involve two processing steps: chip manufacturing and chip packaging. Therefore, the characteristics of the chip itself and the quality of the packaging technology directly determine the final performance of the semiconductor packaged device product.
[0003] In existing packaging structures, colloids are often used to bond and fix various components. However, the fluidity of colloids can easily contaminate components such as chips and circuits, thereby affecting product yield. Summary of the Invention
[0004] This disclosure provides a packaging structure and a method for manufacturing the same.
[0005] In a first aspect, this disclosure provides a packaging structure, including:
[0006] The package includes an upward-opening receiving cavity;
[0007] A chip is located in the receiving cavity; the surface of the chip has a photosensitive area;
[0008] A light-transmitting cover plate is located above the chip; the space between the light-transmitting cover plate and the inner wall of the receiving cavity forms a first groove; the first groove is used to accommodate the adhesive that bonds the light-transmitting cover plate and the package body.
[0009] A blocking structure is located between the chip and the light-transmitting cover plate and outside the photosensitive area; the top of the blocking structure contacts the light-transmitting cover plate; the blocking structure is used to prevent the colloid from entering the photosensitive area.
[0010] In some embodiments, the width of the top of the blocking structure is smaller than the width of the bottom of the blocking structure.
[0011] In some embodiments, the sidewall of the receiving cavity is provided with a protrusion; the width of the top of the protrusion is greater than the width of the bottom of the protrusion, and the top of the protrusion is lower than the top of the blocking structure; the projection of the light-transmitting cover plate and the protrusion in the vertical direction at least partially overlaps.
[0012] In some embodiments, the blocking structure has a first inclined surface facing the protrusion, and the protrusion has a second inclined surface facing the blocking structure; the space between the second inclined surface and the first inclined surface forms a second groove, and the second groove communicates with the first groove.
[0013] In some embodiments, the bottom of the protrusion is higher than the bottom surface of the receiving cavity; the protrusion is at least partially misaligned with the vertical projection of the chip;
[0014] The space between the bottom of the protrusion and the bottom surface of the receiving cavity forms a third groove, which communicates with the second groove.
[0015] In some embodiments, the package further includes:
[0016] An overflow hole is located on the outside of the receiving cavity; the overflow hole connects the third groove and the outside of the package.
[0017] Secondly, this disclosure provides a method for manufacturing a packaging structure, the method comprising:
[0018] A package is formed, the package including an upwardly opening receiving cavity;
[0019] A blocking structure is formed on the outer side of the photosensitive area on the surface of the chip;
[0020] The chip having the blocking structure is placed in the receiving cavity;
[0021] A light-transmitting cover plate is placed above the blocking structure, and the light-transmitting cover plate and the encapsulation body are bonded together with an adhesive; the top of the blocking structure is in contact with the light-transmitting cover plate; the space between the light-transmitting cover plate and the inner wall of the receiving cavity forms a first groove for accommodating the adhesive; the blocking structure is used to prevent the adhesive from entering the photosensitive area.
[0022] In some embodiments, forming a blocking structure outside the photosensitive area on the surface of the chip includes:
[0023] A mask layer is formed covering the photosensitive area;
[0024] An initial blocking structure is formed on the outer side of the photosensitive area on the surface of the chip;
[0025] The initial blocking structure is etched in a preset direction to form the blocking structure; wherein the angle between the preset direction and the surface of the chip is less than 90 degrees; the width of the top of the blocking structure is less than the width of the bottom of the blocking structure, and the blocking structure has a first slope on the side facing away from the photosensitive area.
[0026] In some embodiments, forming the package includes:
[0027] A first mold and a second mold are provided; the first mold includes a housing of the same size as the package body; the second mold includes a base and a plurality of columns connected to the base.
[0028] The housing of the first mold is filled with encapsulating material to form a first encapsulation layer; the first encapsulation layer has a predetermined area for forming a receiving cavity;
[0029] The second mold is placed on the surface of the first encapsulation layer outside the preset area;
[0030] Fill the first encapsulation layer, on which the second mold is placed, with encapsulation material to form a second encapsulation layer;
[0031] A portion of the second encapsulation layer and a portion of the first encapsulation layer are removed to form the receiving cavity; the sidewall of the receiving cavity is provided with a protrusion; the width of the top of the protrusion is greater than the width of the bottom of the protrusion; the protrusion has a second inclined surface opposite to the first inclined surface, and the protrusion is located above the base;
[0032] Remove the second mold to form an overflow hole corresponding to the column.
[0033] In some embodiments, placing the chip having the blocking structure into the receiving cavity includes:
[0034] The chip with the blocking structure is placed in the receiving cavity, and the space between the second inclined surface and the first inclined surface forms a second groove, which is connected to the first groove;
[0035] The projection of the protrusion in the vertical direction is at least partially misaligned with the projection of the chip; the space between the bottom of the protrusion and the bottom surface of the receiving cavity forms a third groove, which communicates with the second groove; the overflow hole communicates with the third groove and the outside of the package.
[0036] In this embodiment, the blocking structure is located between the chip and the light-transmitting cover plate and outside the photosensitive area, with the top of the blocking structure in contact with the light-transmitting cover plate. Thus, on the one hand, the blocking structure can support the light-transmitting cover plate, increasing the stability of the packaging structure; on the other hand, the blocking structure is used to prevent the colloid from entering the photosensitive area, reducing contamination of the photosensitive area by the colloid, thereby improving the manufacturing yield of the packaging structure. Attached Figure Description
[0037] Figure 1 This is a schematic diagram of a packaging structure provided in this disclosure;
[0038] Figure 2 This is a schematic diagram of another packaging structure provided in this disclosure;
[0039] Figure 3 This is a schematic diagram of another packaging structure provided in this disclosure;
[0040] Figure 4This is a schematic diagram of a barrier structure in another packaging structure provided in this disclosure;
[0041] Figure 5a and Figure 5b A schematic diagram of yet another packaging structure provided in this disclosure;
[0042] Figure 6 This is a flowchart of the steps involved in manufacturing a packaging structure provided in this disclosure;
[0043] Figures 7a to 7i This is a schematic diagram of a process for forming a packaging structure provided in this disclosure. Detailed Implementation
[0044] To facilitate understanding of this disclosure, exemplary embodiments of the disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the disclosure are shown in the drawings, it should be understood that the disclosure may be implemented in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the disclosure and to fully convey the scope of the disclosure to those skilled in the art.
[0045] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of this disclosure. However, it will be apparent to those skilled in the art that this disclosure may be practiced without one or more of these details. In some embodiments, to avoid confusion with this disclosure, certain technical features well-known in the art are not described; that is, not all features of the actual embodiments, nor well-known functions and structures, may be described herein.
[0046] Generally, terms can be understood at least in part from their use in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or it can be used to describe a combination of features, structures, or characteristics in a plural sense. Similarly, terms such as "a" or "described" can also be understood to convey either a singular or a plural usage, depending at least in part on the context. Additionally, the use of "based on" can be understood to not necessarily convey an exclusive set of factors, and can alternatively allow for the presence of additional factors that are not necessarily explicitly described, also depending at least in part on the context.
[0047] Unless otherwise defined, the terminology used herein is intended only to describe particular embodiments and is not intended to limit the scope of this disclosure. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprise” and / or “comprising,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.
[0048] To fully understand this disclosure, detailed steps and structures will be presented in the following description to illustrate the technical solutions of this disclosure. Preferred embodiments of this disclosure are described in detail below; however, other embodiments may also be implemented in addition to these detailed descriptions.
[0049] In some embodiments, such as Figure 1 As shown, the package structure 10 includes a substrate 11, a package body 110 located above the substrate 11, a chip 120, and a light-transmitting cover plate 130 located above the chip 120. The substrate 11 can be a package substrate, including but not limited to organic substrates, ceramic substrates, and silicon substrates. The substrate 11 can provide electrical connection, protection, support, heat dissipation, and integration for the chip to achieve multi-pin configuration, reduce the size of the packaged product, improve electrical performance and heat dissipation, and modularize multiple chips. The package body 110 can cover at least a portion of the chip 120, thereby isolating the chip 120 from the external environment. The package body 110 can be formed of any suitable material, such as a non-conductive polymer material. Exemplarily, the encapsulation 110 may be a molding compound layer, the material of which includes, but is not limited to, one or more of silicon oxide, epoxy resin, polyimide resin, benzocyclobutene resin, polybenzoxazole resin, polybutylene terephthalate, polycarbonate, polyethylene terephthalate, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyethersulfone, polyamide, polyurethane, ethylene-vinyl acetate copolymer, or polyvinyl alcohol. Preferably, the encapsulation 110 is an epoxy molding compound (EMC). The molding compound layer and the chip may have different coefficients of thermal expansion and thermal conductivity.
[0050] Chip 120 can be an image sensor chip, or other chips used for receiving or transmitting signals; this disclosure does not impose excessive limitations. The surface of chip 120 has a photosensitive area 121 for receiving external light signals. A light-transmitting cover 130 is located above and spaced apart from chip 120, thereby isolating the photosensitive area 121 from the external environment and allowing light to pass through the cover 130 and be received by the photosensitive area 121.
[0051] The space between the light-transmitting cover 130 and the package 110 forms a first groove 141, which is used to accommodate the adhesive bonding the light-transmitting cover 130 and the package 110. In the actual manufacturing process, the chip 120 can be fixed on the surface of the substrate 11 first, then the package 110 covering the chip 120 can be formed, then part of the package 110 can be removed to expose the photosensitive area 121, and a receiving cavity 111 for mounting the light-transmitting cover 130 can be formed. Finally, adhesive is applied at the step S of the receiving cavity 111, and the light-transmitting cover 130 is installed. However, because the gap between the package 110 and the light-transmitting cover 130 is small, if a large amount of adhesive is applied, the adhesive can easily overflow from the first groove 141 onto the photosensitive area 121, causing contamination. This leads to a decrease in the sensing performance of the chip 120 and affects the packaging quality and yield of the package structure 10.
[0052] In some embodiments, such as Figure 2 As shown, an overflow groove 142 can be formed at the edge of the step S of the package 110. The overflow groove 142 can be used to contain excess adhesive, thereby reducing the possibility of adhesive overflowing into the photosensitive area 121. However, despite the additional provision of the overflow groove 142, the first groove 141 is still in communication with the photosensitive area 121, and adhesive may still contaminate the photosensitive area 121 during the manufacturing process.
[0053] like Figure 3 As shown, this disclosure provides a packaging structure 20, including: a packaging body 210, including an upwardly opening receiving cavity 211;
[0054] Chip 220 is located in the receiving cavity 211; the surface of chip 220 has a photosensitive area 221;
[0055] A light-transmitting cover plate 230 is located above the chip 220; the space between the light-transmitting cover plate 230 and the inner wall of the receiving cavity 211 forms a first groove 241; the first groove 241 is used to accommodate the adhesive that bonds the light-transmitting cover plate 230 and the package 210.
[0056] A blocking structure 250 is located between the chip 220 and the light-transmitting cover plate 230 and outside the photosensitive area 221; the top of the blocking structure 250 contacts the light-transmitting cover plate 230; the blocking structure 250 is used to block the colloid from entering the photosensitive area 221.
[0057] In this embodiment, the package 210 may cover at least a portion of the sidewalls of the chip 220, thereby isolating the chip 220 from the external environment. The package 210 may be formed of any suitable material, such as a non-conductive polymer. Exemplarily, the package 210 may be a molding compound layer, the material of which includes, but is not limited to, one or more of silicon oxide, epoxy resin, polyimide resin, benzocyclobutene resin, polybenzoxazole resin, polybutylene terephthalate, polycarbonate, polyethylene terephthalate, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyethersulfone, polyamide, polyimide, ethylene vinyl acetate copolymer, or polyvinyl alcohol. Preferably, the package 210 is an epoxy resin molding compound. The molding compound layer and the chip may have different coefficients of thermal expansion and thermal conductivity.
[0058] Chip 220 can be an image sensor chip or other chips used for receiving or transmitting signals; this disclosure does not impose excessive limitations. The surface of chip 220 has a photosensitive area 221 for receiving external light signals. A light-transmitting cover 230 is located above and spaced apart from chip 220, thereby isolating the photosensitive area 221 from the external environment and allowing light to pass through the cover 230 and be received by the photosensitive area 221. The space between the light-transmitting cover 230 and the package 210 forms a first groove 241, which accommodates the adhesive bonding the cover 230 and the package 210.
[0059] A blocking structure 250 is also provided between the light-transmitting cover 230 and the chip 220, and the blocking structure 250 is located outside the photosensitive area 221. The top of the blocking structure 250 contacts the light-transmitting cover 230, and the bottom of the blocking structure 250 contacts the chip 220. That is, the blocking structure 250 completely isolates the first groove 241 from the photosensitive area 221, thereby preventing excess colloid in the first groove 241 from entering and contaminating the photosensitive area 221, thereby improving the manufacturing yield of the packaging structure 210. In addition, the blocking structure 250 can also be used to support the light-transmitting cover 230, thereby increasing the stability of the packaging structure 210.
[0060] In some embodiments, such as Figure 4 As shown, the width of the top of the blocking structure 250 is smaller than the width of the bottom of the blocking structure 250.
[0061] In this embodiment, the cross-section of the blocking structure 250 can be narrower at the top and wider at the bottom, such as a wedge, triangle, or trapezoid. Thus, the surface of the blocking structure 250 facing away from the photosensitive area 221 can be inclined, which facilitates the drainage of the colloid overflowing from the first groove 241. In some embodiments, the surface of the blocking structure 250 facing away from the photosensitive area 221 can also be arc-shaped or other irregularly shaped, as long as the width of the top of the blocking structure 250 is less than the width of the bottom of the blocking structure 250; this disclosure does not impose excessive limitations.
[0062] In some embodiments, such as Figure 5a As shown, the sidewall of the receiving cavity 211 is provided with a protrusion 212; the width of the top of the protrusion 212 is greater than the width of the bottom of the protrusion 212, and the top of the protrusion 212 is lower than the top of the blocking structure 250; the projection of the light-transmitting cover plate 230 and the protrusion 212 in the vertical direction at least partially overlaps.
[0063] In this embodiment of the disclosure, the sidewall of the receiving cavity 211 has a protrusion 212, which may be part of the package 210. Figure 5a and Figure 5b The protrusion 212 and the package 210 use different patterns for ease of understanding, but in the actual product they can be a single unit. The cross-section of the protrusion 212 can be wider at the top and narrower at the bottom, corresponding to the shape of the blocking structure 250, and there can be a gap between the protrusion 212 and the blocking structure 250.
[0064] The top of the protrusion 212 is lower than the top of the blocking structure 250. Since the blocking structure 250 is used to support the light-transmitting cover 230, there is a gap between the top of the protrusion 212 and the light-transmitting cover 230. It is understood that the space between the sidewall of the light-transmitting cover 230 and the sidewall of the receiving cavity 211, and the space between the bottom surface of the light-transmitting cover 230 and the top surface of the protrusion 212, together form the first groove 241, thus allowing the first groove 241 to have a larger space to accommodate the colloid. Furthermore, the projections of the light-transmitting cover 230 and the protrusion 212 in the vertical direction at least partially overlap, meaning that the protrusion 212 can also support the light-transmitting cover 230, improving the stability of the encapsulation structure 210.
[0065] In some embodiments, such as Figure 5a As shown, the blocking structure 250 has a first inclined surface P1 facing the protrusion 212, and the protrusion 212 has a second inclined surface P2 facing the blocking structure 250; the space between the second inclined surface P2 and the first inclined surface P1 forms a second groove 242, and the second groove 242 communicates with the first groove 241.
[0066] In this embodiment, the first inclined surface P1 of the blocking structure 250 faces the second inclined surface P2 of the protrusion 212, and the gap between the first inclined surface P1 and the second inclined surface P2 forms a second groove 242, which communicates with the first groove 241 above the protrusion 212. Thus, the second groove 242 can guide the colloid overflowing from the first groove 241, further preventing the colloid from contaminating the photosensitive area 221.
[0067] In some embodiments, such as Figure 5a As shown, the bottom of the protrusion 212 is higher than the bottom surface of the receiving cavity 211; the projection of the protrusion 212 and the chip 220 in the vertical direction is at least partially misaligned; the space between the bottom of the protrusion 212 and the bottom surface of the receiving cavity 211 forms a third groove 243, and the third groove 243 is connected to the second groove 242.
[0068] In this embodiment, a gap exists between the bottom of the protrusion 212 and the bottom surface of the receiving cavity 211, which can serve as a third groove 243 for accommodating the colloid. It is understood that the third groove 243 can have a large volume, allowing excess colloid to be guided through the first groove 241 and the second groove 242 into the third groove 243 for storage, further preventing the colloid from contaminating the photosensitive area 221.
[0069] In some embodiments, such as Figure 5a and Figure 5b As shown, the package 210 further includes an overflow hole 213, located outside the receiving cavity 211; the overflow hole 213 connects the third groove 243 and the outside of the package 210. Figure 5b A top view of package 210 is shown. Figure 5b (Chip 220 and blocking structure 250 are not shown).
[0070] In this embodiment, the encapsulation body 210 is further provided with an overflow hole 213 located outside the receiving cavity 211, and the overflow hole 213 communicates with the third groove 243. Thus, when the third groove 243 cannot completely contain excess adhesive, the overflow hole 213 can guide the adhesive in the third groove 243 to the outside of the encapsulation body 210. Furthermore, the overflow hole 213 can also serve as a vent to balance the pressure between the first groove 241, the second groove 242, and the third groove 243 and the external environment, thereby preventing the adhesive from being unable to flow within the grooves.
[0071] In some embodiments, the overflow hole 213 may extend vertically, thereby allowing the third groove 243 to communicate with the upper surface of the package 210. In other embodiments, the overflow hole 213 may also extend horizontally or at an angle to the horizontal to communicate with the outside of the package 210.
[0072] It should be noted that, Figure 5b The overflow hole 213 and the protrusion 212 are shown only by way of example at both ends of the package 210 in the longitudinal direction. In some embodiments, the overflow hole 213 may also be provided around the receiving cavity 211, and the receiving cavity 211 may have protrusions 212 on all sidewalls of the receiving cavity 211.
[0073] like Figure 6 As shown, this disclosure provides a method for manufacturing a packaging structure, the method comprising the following steps:
[0074] Step S10: Form a package, the package including an upwardly opening receiving cavity;
[0075] Step S20: Form a blocking structure on the outside of the photosensitive area on the surface of the chip;
[0076] Step S30: Place the chip having the blocking structure into the receiving cavity;
[0077] Step S40: Place a light-transmitting cover plate above the blocking structure and bond the light-transmitting cover plate and the encapsulation body with an adhesive; the top of the blocking structure contacts the light-transmitting cover plate; the space between the light-transmitting cover plate and the inner wall of the receiving cavity forms a first groove for accommodating the adhesive; the blocking structure is used to prevent the adhesive from entering the photosensitive area.
[0078] It should be understood that Figure 6 The steps shown are not exclusive, and other steps may be performed before, after, or between any of the steps shown. For example, the order of forming the encapsulation in step S10 and forming the barrier structure in step S20 can be interchanged. (See below for reference.) Figures 7a to 7i The manufacturing process diagram corresponding to the packaging structure shown is explained in detail.
[0079] In some embodiments, such as Figure 7a and Figure 7bAs shown, forming a blocking structure 250 outside the photosensitive area 221 on the surface of the chip 220 includes: forming a mask layer 222 covering the photosensitive area 221; forming an initial blocking structure 251 outside the photosensitive area 221 on the surface of the chip 220; etching the initial blocking structure 251 in a preset direction to form the blocking structure 250; wherein the angle between the preset direction and the surface of the chip 220 is less than 90 degrees; the width of the top of the blocking structure 250 is less than the width of the bottom of the blocking structure 250, and the side of the blocking structure 250 facing away from the photosensitive area 221 has a first inclined surface P1.
[0080] like Figure 7a As shown, a mask layer 222 can be formed on the photosensitive region 221 on the surface of chip 220 using processes such as deposition. The mask layer 222 can protect the photosensitive region 221 in subsequent processes. Then, an initial barrier structure 251 is formed on the outside of the photosensitive region 221 using a deposition process. The deposition processes in this disclosure include, but are not limited to: chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma enhanced chemical vapor deposition (PECVD), sputtering, metal-organic chemical vapor deposition (MOCVD), atomic layer deposition (ALD), and combinations thereof.
[0081] like Figure 7b As shown, an initial blocking structure is etched in a preset direction using an etching process to form a blocking structure 250. The angle between the preset direction and the surface of the chip 220 is less than 90 degrees, so that the cross-section of the blocking structure 250 has a shape that is narrower at the top and wider at the bottom. For example, the cross-section of the blocking structure 250 can be wedge-shaped, triangular, trapezoidal, etc. Thus, the blocking structure 250 has a first inclined surface P1 on the side facing away from the photosensitive area 221, which is beneficial for guiding the colloid overflowing from the first groove. In some embodiments, the surface of the blocking structure 250 on the side facing away from the photosensitive area 221 can also be arc-shaped or other irregular shapes, as long as the width of the top of the blocking structure 250 is less than the width of the bottom of the blocking structure 250. This disclosure does not impose too many limitations.
[0082] In some embodiments, such as Figures 7c to 7gAs shown, forming the package 210 includes: providing a first mold M1 and a second mold M2; the first mold M1 includes a shell of the same size as the package 210; the second mold M2 includes a base M21 and a plurality of pillars M22 connected to the base; filling the shell of the first mold M1 with encapsulating material to form a first encapsulation layer 214; the first encapsulation layer 214 has a predetermined region R for forming a receiving cavity; placing the second mold M2 on the surface of the first encapsulation layer 214 outside the predetermined region R; and placing the second mold M2 on the surface of the first encapsulation layer 214. Encapsulating material is filled onto the first encapsulation layer 214 to form a second encapsulation layer 215; a portion of the second encapsulation layer 215 and a portion of the first encapsulation layer 214 are removed to form the receiving cavity 211; a protrusion 212 is provided on the side wall of the receiving cavity 211; the width of the top of the protrusion 212 is greater than the width of the bottom of the protrusion 212; the protrusion 212 has a second inclined surface P2 opposite to the first inclined surface P1, and the protrusion 212 is located above the base M21; the second mold M2 is removed to form an overflow hole 213 corresponding to the column M22.
[0083] In this embodiment of the disclosure, the encapsulation body 210 can be formed by preforming with a mold, such as filling the mold with epoxy resin and then curing it to form the encapsulation body 210.
[0084] like Figure 7c As shown, encapsulating material can be filled into the housing of the first mold M1 and cured to form a first encapsulation layer 214, the thickness of which is less than the thickness of the package. The first encapsulation layer 214 includes a preset region R for forming a receiving cavity, a portion of which is removed in a subsequent process to form the bottom of the receiving cavity.
[0085] like Figure 7d As shown, the second mold M2 is placed on the surface of the first encapsulation layer 214 outside the preset area R. The second mold M2 is used to form the overflow hole and the third groove.
[0086] like Figure 7e As shown, encapsulating material is filled into the first encapsulation layer 214 on which the second mold M2 is placed and then cured to form the second encapsulation layer 215. The sum of the thicknesses of the second encapsulation layer 215 and the first encapsulation layer 214 is approximately equal to the thickness of the encapsulation body.
[0087] like Figure 7fAs shown, a portion of the second encapsulation layer 215 and a portion of the first encapsulation layer 214 are removed to form a receiving cavity 211. Specifically, a portion of the second encapsulation layer 215 can be removed first to form a partial receiving cavity 211 located above the protrusion; then, a portion of the second encapsulation layer 215 is removed along an inclined direction to form a protrusion 212. The width of the top of the protrusion 212 is greater than the width of the bottom of the protrusion 212. The protrusion 212 has a second inclined surface P2 opposite to the first inclined surface. The protrusion 212 is located above the base M21. Then, a portion of the first encapsulation layer 214 is removed downwards to form a complete receiving cavity 211. It can be understood that the protrusion 212 is a part of the remaining second encapsulation layer 215.
[0088] like Figure 7g As shown, the second mold is removed, forming an overflow hole 213 corresponding to the column. It is understood that there is a sidewall between the overflow hole 213 and the adjacent receiving cavity 211.
[0089] In some embodiments, such as Figure 7h As shown, placing the chip 220 with the blocking structure 250 in the receiving cavity 211 includes: placing the chip 220 with the blocking structure 250 in the receiving cavity 211; the space between the second inclined surface P2 and the first inclined surface P1 forms a second groove 242, which communicates with the first groove 241; the projection of the protrusion 212 and the chip 220 in the vertical direction is at least partially misaligned; the space between the bottom of the protrusion 212 and the bottom surface of the receiving cavity 211 forms a third groove 243, which communicates with the second groove 242; and the overflow hole 213 communicates with the third groove 243 and the outside of the package 210.
[0090] In this embodiment, after the package 210 is pre-formed, the chip 220 with the blocking structure 250 can be placed in the receiving cavity 211 of the package 210. Thus, the space between the second inclined surface P2 and the first inclined surface P1 forms a second groove 242, thereby allowing the third groove 243, the second groove 242, and the subsequently formed first groove to be sequentially connected. This facilitates the drainage of any colloid overflowing from the first groove, preventing the colloid from contaminating the photosensitive area 221.
[0091] like Figure 7i As shown, a light-transmitting cover plate 230 is placed above the blocking structure 250, and the light-transmitting cover plate 230 and the encapsulation body 210 are bonded together with an adhesive; the top of the blocking structure 250 is in contact with the light-transmitting cover plate 230; the space between the light-transmitting cover plate 230 and the inner wall of the receiving cavity 211 forms a first groove 241 for accommodating the adhesive; the blocking structure 250 is used to block the adhesive from entering the photosensitive area 221.
[0092] In this embodiment, the blocking structure is located between the chip and the light-transmitting cover plate and outside the photosensitive area, with the top of the blocking structure in contact with the light-transmitting cover plate. Thus, on the one hand, the blocking structure can support the light-transmitting cover plate, increasing the stability of the packaging structure; on the other hand, the blocking structure is used to prevent the colloid from entering the photosensitive area, reducing contamination of the photosensitive area by the colloid, thereby improving the manufacturing yield of the packaging structure.
[0093] This disclosure also provides an electronic device including the packaging structure described in any of the above embodiments.
[0094] The packaging structure disclosed herein can be used in various electronic devices. These electronic devices include, but are not limited to, mobile phones, desktop computers, laptop computers, tablet computers, vehicle computers, game consoles, printers, positioning devices, wearable electronic devices, smart sensors, virtual reality (VR) devices, augmented reality (AR) devices, and any other suitable electronic devices.
[0095] It should be understood that the phrase "an embodiment" or "one embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this disclosure. Therefore, "in one embodiment" or "one embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this disclosure, the sequence numbers of the above-described processes do not imply a sequential order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this disclosure. The sequence numbers of the above-described embodiments are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.
[0096] The above description is only a preferred embodiment of this disclosure and does not limit the patent scope of this disclosure. All equivalent structural transformations made under the concept of this disclosure using the contents of this specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this disclosure.
Claims
1. A packaging structure, characterized in that: include: The packaging body comprises a receiving cavity opening upward; A chip is located in the accommodating cavity; the surface of the chip has a photosensitive area; A light-transmitting cover plate, located above the chip; The space between the light-transmitting cover plate and the inner wall of the accommodating cavity forms a first groove; the first groove is used to accommodate the colloid that bonds the light-transmitting cover plate and the packaging body; A blocking structure is located between the chip and the light-transmitting cover plate and outside the photosensitive area; the top of the blocking structure is in contact with the light-transmitting cover plate; The blocking structure is used to block the colloid from entering the photosensitive area.
2. The packaging structure according to claim 1, characterized in that: A width of a top portion of the blocking structure is smaller than a width of a bottom portion of the blocking structure.
3. The packaging structure according to claim 2, characterized in that: The side wall of the accommodating cavity is provided with a protrusion; the width of the top of the protrusion is greater than the width of the bottom of the protrusion, and the top of the protrusion is lower than the top of the blocking structure; the projection of the light-transmitting cover plate and the protrusion in the vertical direction at least partially overlap.
4. The packaging structure according to claim 3, characterized in that: The blocking structure has a first inclined surface facing the protruding portion, and the protruding portion has a second inclined surface facing the blocking structure; the space between the second inclined surface and the first inclined surface forms a second groove, and the second groove is connected to the first groove.
5. The packaging structure according to claim 4, characterized in that: The bottom of the protrusion is higher than the bottom surface of the accommodating cavity; the projection of the protrusion and the chip in the vertical direction are at least partially misaligned; The space between the bottom of the protruding portion and the bottom surface of the accommodating cavity forms a third groove, and the third groove is communicated with the second groove.
6. The packaging structure according to claim 5, characterized in that: The package further comprises: The glue overflow hole is located outside the accommodating cavity; the glue overflow hole communicates with the third groove and the outside of the packaging body.
7. A method for manufacturing a packaging structure, characterized in that: The manufacturing method comprises: forming a packaging body, wherein the packaging body comprises a receiving cavity opening upward; forming a blocking structure outside the photosensitive area on the surface of the chip; placing the chip having the blocking structure in the receiving cavity; A light-transmitting cover plate is placed above the blocking structure, and the light-transmitting cover plate and the packaging body are bonded with colloid; the top of the blocking structure is in contact with the light-transmitting cover plate; the space between the light-transmitting cover plate and the inner wall of the accommodating cavity constitutes a first groove for accommodating the colloid; the blocking structure is used to prevent the colloid from entering the photosensitive area.
8. The manufacturing method according to claim 7, characterized in that: The forming of a blocking structure outside the photosensitive area on the surface of the chip includes: forming a mask layer covering the photosensitive area; forming an initial blocking structure outside the photosensitive area on the surface of the chip; The initial blocking structure is etched in a preset direction to form the blocking structure; wherein the angle between the preset direction and the surface of the chip is less than 90 degrees; the width of the top of the blocking structure is less than the width of the bottom of the blocking structure, and the blocking structure has a first slope on the side facing away from the photosensitive area.
9. The manufacturing method according to claim 8, characterized in that: The forming of the package body comprises: A first mold and a second mold are provided; the first mold comprises a shell having the same size as the package body; the second mold comprises a base and a plurality of columns connected to the base; Filling a packaging material into the shell of the first mold to form a first packaging layer; the first packaging layer has a preset area for forming a receiving cavity; placing the second mold on the surface of the first encapsulation layer outside the preset area; Filling a packaging material on the first packaging layer on which the second mold is placed to form a second packaging layer; A portion of the second encapsulation layer and a portion of the first encapsulation layer are removed to form the accommodating cavity; a protrusion is provided on a side wall of the accommodating cavity; a width of the top of the protrusion is greater than a width of the bottom of the protrusion; the protrusion has a second inclined surface opposite to the first inclined surface, and the protrusion is located above the base; The second mold is removed to form a glue overflow hole corresponding to the column.
10. The manufacturing method according to claim 9, characterized in that: Placing the chip having the blocking structure in the receiving cavity comprises: Placing the chip with the blocking structure in the accommodating cavity, wherein the space between the second inclined surface and the first inclined surface forms a second groove, and the second groove is connected to the first groove; The projection of the protrusion and the projection of the chip in the vertical direction are at least partially misaligned; the space between the bottom of the protrusion and the bottom surface of the accommodating cavity constitutes a third groove, and the third groove is connected to the second groove; the glue overflow hole connects the third groove and the outside of the packaging body.