Perovskite solar cell module and preparation method thereof

Abstract

The invention discloses a perovskite solar cell module and a preparation method thereof. The battery assembly includes: a first substrate; the battery chip comprises a top surface and a side surface connected with the top surface; the packaging layer comprises a first packaging layer located on the top surface and a second packaging layer located on the side surface, and the first packaging layer is connected with the second packaging layer; the bonding layer comprises a first bonding layer, and the first bonding layer is located on the side, away from the battery chip, of the first packaging layer; and the second substrate is located on the side, away from the first packaging layer, of the first bonding layer. By means of the structure, internal packaging of the battery chip is achieved, the packaging effect is more stable, and preparation conditions are more concise and mild.

Description

Technical Field

[0001] The present application belongs to the technical field of perovskite solar cells, and specifically relates to a perovskite solar cell module and a preparation method thereof. Background Art

[0002] There are many structures for preparing perovskite solar cells, such as formal structure, trans structure, planar structure and mesoporous structure. Regardless of the structural components, the packaging method used is to coat the top of the perovskite cell with a film and then use a sealant to seal the side of the cell. However, since the film and sealant need to be formed step by step in the preparation process, this sealing method is prone to cracking at the joints and unstable packaging.

[0003] Therefore, how to improve the packaging method of perovskite thin-film solar modules and produce a packaging layer that is more suitable for large-scale production and has better stability is a technical problem that needs to be solved at present. Summary of the invention

[0004] The present application provides a perovskite solar cell module and a preparation method thereof, aiming to solve the problems of complex packaging process and unstable packaging of the perovskite solar cell module.

[0005] In one aspect, the present application provides a perovskite solar cell module, comprising:

[0006] a first substrate;

[0007] A battery chip, the battery chip is located on one side of the first substrate, and the battery chip includes a top surface and a side surface connected to the top surface;

[0008] An encapsulation layer, comprising a first encapsulation layer located on the top surface and a second encapsulation layer located on the side surface, wherein the first encapsulation layer is connected to the second encapsulation layer;

[0009] The bonding layer comprises a first bonding layer, wherein the first bonding layer is located on a side of the first packaging layer away from the battery chip;

[0010] A second substrate is located on a side of the first bonding layer away from the first encapsulation layer.

[0011] In some embodiments, the adhesive layer further includes a second adhesive layer, which is located on a side of the second packaging layer away from the battery chip and is connected to the first adhesive layer.

[0012] In some embodiments, the material of the first encapsulation layer and / or the second encapsulation layer is selected from inorganic materials; or,

[0013] The materials of the first encapsulation layer and the second encapsulation layer are selected from a combination of inorganic materials and organic materials.

[0014] In some embodiments, the inorganic material includes one of metal oxide, metal sulfide, silicon dioxide or silicon nitride, wherein the metal oxide and metal sulfide may specifically be aluminum oxide, vanadium pentoxide, magnesium sulfide, nickel sulfide, etc.; and / or,

[0015] The organic material includes epoxy resin or phenolic resin.

[0016] In some embodiments, the material of the adhesive layer is selected from ethylene-vinyl acetate copolymer (EVA), polyurethane acrylate (PUE) or ethylene-octene copolymer (POE).

[0017] In some embodiments, the thickness of the first encapsulation layer is 50-300 nm; and / or

[0018] The thickness of the second encapsulation layer is 50-300 nm.

[0019] In some embodiments, the battery chip comprises:

[0020] An electrode layer, wherein the electrode layer is arranged on the first substrate at intervals;

[0021] A charge transport layer, wherein the charge transport layer comprises at least one group of a first charge transport layer and a second charge transport layer, wherein the first charge transport layer and the second charge transport layer are located on a side of the electrode layer away from the first substrate and are spaced apart from each other;

[0022] The perovskite absorption layer is located on a side of the charge transport layer away from the electrode layer.

[0023] In some embodiments, the battery chip further comprises:

[0024] A passivation layer, the passivation layer comprising a first passivation layer, a second passivation layer and a third passivation layer; the first passivation layer is located on a side of the charge transport layer away from the electrode, the second passivation layer is located between the first charge transport layer and the second charge transport layer, and the first passivation layer and the second passivation layer are connected;

[0025] A third passivation layer is located between the perovskite absorption layer and the first encapsulation layer.

[0026] On the other hand, the present application provides a method for preparing a perovskite solar cell module, comprising the following steps:

[0027] providing a first substrate;

[0028] Providing a battery chip, wherein the battery chip is located on one side of the first substrate, and the battery chip includes a top surface and a side surface connected to the top surface;

[0029] Providing an encapsulation layer, the encapsulation layer comprising a first encapsulation layer located on the top surface and a second encapsulation layer located on the side surface, the first encapsulation layer being connected to the second encapsulation layer;

[0030] Providing an adhesive layer, wherein the adhesive layer includes a first adhesive layer, and the first adhesive layer is located on a side of the first encapsulation layer away from the battery chip;

[0031] A second substrate is provided, where the second substrate is located on a side of the first adhesive layer away from the first encapsulation layer.

[0032] In some embodiments, the step of providing an encapsulation layer includes:

[0033] Depositing an inorganic material on the top surface to form a first encapsulation layer, and depositing an inorganic material on the side surface to form the second encapsulation layer; or,

[0034] The first encapsulation layer is formed by depositing an inorganic material on the top surface and coating an organic material on a side of the inorganic material away from the top surface, and the second encapsulation layer is formed by depositing an inorganic material on the side surface and coating an organic material on a side of the inorganic material away from the side surface.

[0035] In some embodiments, the method of depositing the inorganic material comprises plasma enhanced chemical vapor deposition or atomic layer deposition; and / or,

[0036] The method of coating the organic material includes a vacuum method or a solution method, and specifically can be any one of evaporation, blade coating, roller coating or spray coating.

[0037] The perovskite solar cell module provided in the present application includes a first substrate, a battery chip, an encapsulation layer, an adhesive layer, and a second substrate, wherein the encapsulation layer and the adhesive layer can fully cover the internal battery chip. The present application realizes internal encapsulation of the battery chip through the above structure, and the encapsulation effect is more stable. At the same time, the internal encapsulation structure can effectively protect the battery chip from corrosion by the adhesive, so that the material selection of the adhesive is wider and the preparation conditions are simpler and milder. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A schematic diagram of the structure of a perovskite solar cell module provided in Example 1 of the present application;

[0039] Figure 2 A schematic structural diagram of a perovskite solar cell module provided in Example 2 of the present application;

[0040] Figure 3This is a schematic structural diagram of a perovskite solar cell module provided in Example 3 of the present application.

[0041] Figure markings: 100-first substrate, 200-battery chip, 201-top surface, 202-side surface, 210-electrode layer, 220-charge transfer layer, 221-first charge transfer layer, 222-second charge transfer layer, 230-passivation layer, 231-first passivation layer, 232-second passivation layer, 233-third passivation layer, 240-perovskite absorption layer, 300-encapsulation layer, 310-first encapsulation layer, 320-second encapsulation layer, 400-bonding layer, 410-first bonding layer, 420-second bonding layer, 500-second substrate. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application are described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0043] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features.

[0044] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application.

[0045] First, an embodiment of the present application provides a perovskite solar cell module, comprising:

[0046] A first substrate 100;

[0047] A battery chip 200, the battery chip 200 is located on one side of the first substrate 100, and the battery chip 200 includes a top surface 201 and a side surface 202 connected to the top surface 201;

[0048] The encapsulation layer 300 includes a first encapsulation layer 310 located on the top surface 201 and a second encapsulation layer 320 located on the side surface 202 , wherein the first encapsulation layer 310 is connected to the second encapsulation layer 320 ;

[0049] The adhesive layer 400 includes a first adhesive layer 410 , and the first adhesive layer 410 is located on a side of the first encapsulation layer 310 away from the battery chip 200 ;

[0050] The second substrate 500 is located on a side of the first adhesive layer 410 away from the first encapsulation layer 310 .

[0051] In this embodiment, the first substrate 100 is a front plate, and the second substrate 500 is a back plate. The front plate and the back plate may include any rigid or flexible substrate such as glass, PET, stainless steel, etc.

[0052] Generally, the packaging structure of a perovskite solar cell group mainly includes a front plate, a POE film, a wide butyl adhesive, a back plate, etc. The film and the sealant need to be formed step by step, which easily affects the stability after packaging. The packaging structure of a perovskite solar cell group provided in the present application first uses a packaging film to fully cover the battery chip, and then uses an adhesive layer to combine the substrate and the packaging film to achieve internal packaging, a stable structure, and avoids or reduces the use of butyl adhesive, and the preparation process conditions are milder.

[0053] In some embodiments, the adhesive layer further includes a second adhesive layer 420 , which is located on a side of the second encapsulation layer 320 away from the battery chip 200 and connected to the first adhesive layer 410 .

[0054] In some embodiments, the material of the first encapsulation layer 310 is an inorganic material.

[0055] In some embodiments, the material of the first encapsulation layer 310 includes a combination of an inorganic material and an organic material.

[0056] Among them, the inorganic material can be one of metal oxides, metal sulfides, silicon dioxide or silicon nitride, among which the metal oxides and metal sulfides can specifically be aluminum oxide, vanadium pentoxide, magnesium sulfide, nickel sulfide, etc.; the organic material can be epoxy resin or phenolic resin.

[0057] The use of inorganic materials for packaging is not only lower in cost, but also can prevent direct contact with the adhesive film from affecting the stability of the perovskite, protect or passivate the laser scribing, and remove defects in the side film layer.

[0058] In some embodiments, the material of the second encapsulation layer 320 is selected from EVA, PUE or POE film.

[0059] In some embodiments, the thickness of the first encapsulation layer 310 is 50-300 nm. It is understood that the value unit of the thickness of the first encapsulation layer 310: nm can be any value of 50, 100, 150, 200, 250, 300 or a range between any two values. When the thickness of the first encapsulation layer 310 meets the above value range, the best encapsulation effect can be achieved.

[0060] In some embodiments, the width of the second encapsulation layer 320 is 50 to 300 nm. It is understood that the value unit of the width of the second encapsulation layer 320: nm can be any value of 50, 100, 150, 200, 250, 300 or a range between any two values. The width of the second encapsulation layer 320 and the thickness of the first encapsulation layer 310 can be equal or different.

[0061] In some embodiments, the battery chip 200 includes:

[0062] The electrode layer 210 is disposed on the first substrate 100 at intervals;

[0063] A charge transport layer 220, wherein the charge transport layer 220 includes at least one group of a first charge transport layer 221 and a second charge transport layer 222, wherein the first charge transport layer 221 and the second charge transport layer 222 are located on a side of the electrode layer 210 away from the first substrate 100 and are spaced apart;

[0064] The perovskite absorption layer 240 is located on a side of the charge transport layer 220 away from the electrode layer 210 .

[0065] In this example, the first charge transport layer 221 can be a hole transport layer, and the second charge transport layer 222 can be an electron transport layer. By preparing the first charge transport layer 221, the second charge transport layer 222, and the electrode layer 210 on the back side of the battery, that is, the non-light incident side, the light incident side of the battery can be free of dead zones, and 100% of the area can be involved in light absorption. At the same time, the incident light can directly reach the perovskite absorption layer 240, which can achieve a higher proportion of light absorption and improve the power of the perovskite solar cell.

[0066] In some embodiments, the battery chip 200 further includes:

[0067] A passivation layer 230, the passivation layer 230 comprising a first passivation layer 231, a second passivation layer 232 and a third passivation layer 233; the first passivation layer 231 is located on a side of the charge transport layer 220 away from the electrode, the second passivation layer 232 is located between the first charge transport layer 221 and the second charge transport layer 222, and the first passivation layer 231 and the second passivation layer 232 are connected;

[0068] The third passivation layer 233 is located on a side of the perovskite absorption layer 240 away from the first passivation layer 231 .

[0069] Secondly, the present application also provides a method for preparing a perovskite solar cell module, which is used to prepare the perovskite solar cell module in any of the above embodiments, comprising the following steps:

[0070] Providing a first substrate 100;

[0071] A battery chip 200 is provided. The battery chip 200 is located on one side of the first substrate 100. The battery chip 200 includes a top surface 201 and a side surface 202 connected to the top surface 201.

[0072] Forming a packaging layer 300, the packaging layer 300 includes a first packaging layer 310 located on the top surface 201 and a second packaging layer 320 located on the side surface 202, the first packaging layer 310 is connected to the second packaging layer 320;

[0073] forming an adhesive layer 400 , wherein the adhesive layer 400 includes a first adhesive layer 410 , and the first adhesive layer 410 is located on a side of the first encapsulation layer 310 away from the battery chip 200 ;

[0074] The second substrate 500 is attached to a side of the first adhesive layer 410 facing away from the first encapsulation layer 310 .

[0075] In some embodiments, forming the encapsulation layer 300 includes: depositing an inorganic material on the top surface 201 and the side surface 202 of the battery chip 200 to form the encapsulation layer 300 .

[0076] In some embodiments, forming the encapsulation layer 300 includes: depositing an inorganic material on the top surface 201 and the side surface 202 of the battery chip 200 , and coating an organic material on the surface of the inorganic material to form the encapsulation layer 300 .

[0077] Specifically, the preparation method provided in the above embodiment can be achieved by the following steps:

[0078] S1. Apply insulating tape, busbar tape, and conductive tape on the battery chip 200 in sequence for current drainage;

[0079] S2, after the lamination is completed, the battery chip 200 enters the deposition equipment, and the inorganic material is deposited to cover the top surface 201 and the side surface 202 to form the encapsulation layer 300;

[0080] S3, cutting and laying the film, the film is made of EVA or PUE, to form an adhesive layer 400 covering the encapsulation layer 300;

[0081] S4, grab the second substrate 500 and the packaged chip to combine them, after combining, plug the back holes to block water and oxygen, and then put them into a laminator for lamination to obtain a perovskite solar cell module.

[0082] In some embodiments, the method of depositing the inorganic material includes plasma enhanced chemical vapor deposition (PECVD) or atomic layer deposition (ALD).

[0083] In some embodiments, an organic material may be coated on the surface of the organic material, and the method of coating the organic material includes any one of evaporation, scraping, roller coating or spraying.

[0084] The following is a description of the perovskite solar cell module and its preparation method provided by the present application in conjunction with specific embodiments:

[0085] Example 1

[0086] This embodiment provides a perovskite solar cell module and a method for preparing the same.

[0087] like Figure 1 As shown, it includes a first substrate 100, a battery chip 200, an encapsulation layer 300, an adhesive layer 400, and a second substrate 500, wherein the first substrate 100 is a front plate glass, and the second substrate 500 is a back plate glass.

[0088] The battery chip 200 is located on one side of the first substrate 100 and has a top surface 201 and a side surface 202 connected to the top surface 201 . A drainage device is also provided on the surface of the battery chip 200 , including insulating tape, busbar tape, and conductive tape for drawing out the current in the battery chip 200 .

[0089] The encapsulation layer 300 includes a first encapsulation layer 310 located on the top surface 201 and a second encapsulation layer 320 located on the side surface 202. The first encapsulation layer 310 is connected to the second encapsulation layer 320. The material of the encapsulation layer is aluminum oxide. The thickness of the first encapsulation layer 310 is 100 nm, and the width of the second encapsulation layer 320 is 60 nm.

[0090] The adhesive layer 400 includes a first adhesive layer 410 and a second adhesive layer 420 connected to each other. The first adhesive layer 410 is located on the side of the first packaging layer 310 away from the battery chip 200, and the second adhesive layer 420 is located on the side of the second packaging layer 320 away from the battery chip 200. The material of the adhesive layer is EVA.

[0091] The perovskite solar cell module in this embodiment is specifically prepared by the following steps:

[0092] S1. Apply insulating tape, busbar tape, and conductive tape on the battery chip 200 in sequence for current drainage;

[0093] S2, after the lamination is completed, the battery chip 200 is placed in a PECVD device for PECVD deposition to obtain a 100nm aluminum oxide encapsulation layer 300, covering the top surface 201 and the side surface 202 of the battery chip 200;

[0094] S3, cutting and laying EVA film to form a bonding layer 400 covering the encapsulation layer 300;

[0095] S4, grab the back glass as the second substrate 500, and combine it with the chip. After combining, plug the back holes to block water and oxygen, and then enter the laminator for lamination. The lamination conditions are 130° C. for 15 minutes. Then, the junction box is installed, AB glue is poured and cured to obtain a perovskite solar cell module.

[0096] Example 2

[0097] This embodiment provides a perovskite solar cell module and a method for preparing the same.

[0098] like Figure 2 As shown, it includes a first substrate 100, a battery chip 200, an encapsulation layer 300, a first adhesive layer 410, and a second substrate 500, wherein the first substrate 100 is a front plate glass, and the second substrate 500 is a back plate glass.

[0099] The battery chip 200 is located on one side of the first substrate 100 and has a top surface 201 and a side surface 202 connected to the top surface 201 . A drainage device is also provided on the surface of the battery chip 200 , including insulating tape, busbar tape, and conductive tape for drawing out the current in the battery chip 200 .

[0100] The encapsulation layer 300 includes a first encapsulation layer 310 located on the top surface 201 and a second encapsulation layer 320 located on the side surface 202. The first encapsulation layer 310 is connected to the second encapsulation layer 320. The material of the encapsulation layer is aluminum oxide. The thickness of the first encapsulation layer 310 is 100 nm, and the width of the second encapsulation layer 320 is 280 nm. 。

[0101] The first adhesive layer 410 is located on a side of the first packaging layer 310 away from the battery chip 200 , and the material of the adhesive layer is EVA.

[0102] The perovskite solar cell module in this embodiment is specifically prepared by the following steps:

[0103] S1. Apply insulating tape, busbar tape, and conductive tape on the battery chip 200 in sequence for current drainage;

[0104] S2, after the lamination is completed, the battery chip 200 is placed in a PECVD device for PECVD deposition to obtain a 100nm aluminum oxide encapsulation layer 300, covering the top surface 201 and the side surface 202 of the battery chip 200;

[0105] S3, cutting and laying EVA film to form a bonding layer 400 covering the encapsulation layer 300;

[0106] S4, grab the back glass as the second substrate 500, and combine it with the chip. After combining, plug the back holes to block water and oxygen, and then enter the laminator for lamination. The lamination conditions are 130° C. for 15 minutes. Then, the junction box is installed, AB glue is poured and cured to obtain a perovskite solar cell module.

[0107] Example 3

[0108] This embodiment provides a perovskite solar cell module and a method for preparing the same.

[0109] like Figure 3 As shown, it includes a first substrate 100, a battery chip 200, an encapsulation layer 300, an adhesive layer 400, and a second substrate 500, wherein the first substrate 100 is a front plate glass, and the second substrate 500 is a back plate glass.

[0110] The battery chip 200 is located on one side of the first substrate 100. The battery chip 200 includes:

[0111] A plurality of electrode layers 210, wherein the electrode layers 210 are arranged on the first substrate 100 at intervals;

[0112] The charge transport layer 220 includes a plurality of first charge transport layers 221 and second charge transport layers 222, wherein the first charge transport layers 221 are hole transport layers and the second charge transport layers 222 are electron transport layers; the first charge transport layers 221 and the second charge transport layers 222 are arranged at intervals, and each charge transport layer 220 is independently arranged on one electrode layer 210;

[0113] A passivation layer 230, the passivation layer 230 includes a first passivation layer 231 and a second passivation layer 232, the first passivation layer 231 is located on a side of the charge transport layer 220 away from the electrode, the second passivation layer 232 is located between the first charge transport layer 221 and the second charge transport layer 222, and the first passivation layer 231 and the second passivation layer 232 are connected;

[0114] The perovskite absorption layer 240 is located on a side of the first passivation layer 231 away from the charge transport layer 220;

[0115] The third passivation layer 233 is located on a side of the perovskite absorption layer 240 away from the first passivation layer 231 .

[0116] The battery chip 200 has a top surface 201 and a side surface 202 connected to the top surface 201 . A current drainage device is also provided on the surface of the battery chip 200 , including an insulating tape, a busbar tape, and a conductive tape for drawing out the current in the battery chip 200 .

[0117] The encapsulation layer 300 includes a first encapsulation layer 310 located on the top surface 201 and a second encapsulation layer 320 located on the side surface 202. The first encapsulation layer 310 is connected to the second encapsulation layer 320. The encapsulation layer is made of silicon oxide and epoxy resin stacked in sequence, with a thickness of 200 nm.

[0118] The adhesive layer 400 includes a first adhesive layer 410 and a second adhesive layer 420 connected to each other. The first adhesive layer 410 is located on the side of the first packaging layer 310 away from the battery chip 200, and the second adhesive layer 420 is located on the side of the second packaging layer 320 away from the battery chip 200. The material of the adhesive layer is EVA.

[0119] The perovskite solar cell module in this embodiment is specifically prepared by the following steps:

[0120] S1. Apply insulating tape, busbar tape, and conductive tape on the battery chip 200 in sequence for current drainage;

[0121] S2, after the lamination is completed, the battery chip 200 is placed in a PECVD device for PECVD deposition to obtain a 100nm silicon oxide layer, covering the top surface 201 and the side surface 202 of the battery chip 200;

[0122] S3, coating the surface of the silicon oxide layer with epoxy resin by roller coating to obtain a 100 nm epoxy resin layer, so that the epoxy resin layer completely covers the silicon oxide layer, forming a packaging layer 300 with a total thickness of 200 nm;

[0123] S4, cutting and laying EVA film to form a bonding layer 400 covering the encapsulation layer 300;

[0124] S5. Grab the back glass as the second substrate 500 and combine it with the chip. After combining, plug the back holes to block water and oxygen, and then put it into the laminator for lamination. The lamination conditions are 130° C. for 15 minutes. Then, install the junction box, and perform AB glue encapsulation and curing to obtain a perovskite solar cell module.

[0125] Comparative Example 1

[0126] This comparative example provides a method for preparing a battery assembly, comprising the following steps:

[0127] S1, sequentially applying insulating tape, busbar tape, and conductive tape on the battery chip 200;

[0128] S2. After the lamination is completed, a POE film is coated on the surface of the battery chip 200;

[0129] S3, coating butyl rubber on the side of the battery chip 200;

[0130] S4, grab the second substrate 500 and the packaged chip to combine them, after combining, plug the back holes to block water and oxygen, and then put them into a laminator for lamination to obtain a battery assembly.

[0131] The battery assemblies prepared in Examples 1-2 and Comparative Example 1 were subjected to a battery IV test, and the battery assemblies prepared in Example 2 and Comparative Example 1 were placed in an environmental aging box for aging test analysis, and the test results are shown in Table 1.

[0132] Table 1

[0133]

[0134] From the test results in Table 1, it can be seen that the perovskite solar cell module prepared using the technical solution provided in the present application has a relatively ideal performance in terms of the reduction in the initial efficiency of the module and the TC50 aging efficiency, that is, the perovskite solar cell module provided in the present application has better stability.

[0135] The above is a detailed introduction to a perovskite solar cell module, a preparation method, and a display panel provided in the embodiments of the present application. Specific examples are used in the present application to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of ​​the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A perovskite solar cell module, characterized in that: include: A first substrate (100); A battery chip (200), the battery chip (200) being located on one side of the first substrate (100), the battery chip (200) comprising a top surface (201) and a side surface (202) connected to the top surface (201); A packaging layer (300), comprising a first packaging layer (310) located on the top surface (201) and a second packaging layer (320) located on the side surface (202), wherein the first packaging layer (310) is connected to the second packaging layer (320); The adhesive layer (400) comprises a first adhesive layer (410), wherein the first adhesive layer (410) is located on a side of the first encapsulation layer (310) facing away from the battery chip (200); The second substrate (500) is located on a side of the first adhesive layer (410) away from the first encapsulation layer (310).

2. A perovskite solar cell assembly according to claim 1, characterized in that: The adhesive layer further comprises a second adhesive layer (420), wherein the second adhesive layer (420) is located on a side of the second encapsulation layer (320) away from the battery chip (200) and is connected to the first adhesive layer (410).

3. A perovskite solar cell module according to claim 1, characterized in that: The material of the first encapsulation layer (310) and / or the second encapsulation layer (320) is selected from inorganic materials; or, The material of the first encapsulation layer (310) and / or the second encapsulation layer (320) is selected from a combination of inorganic materials and organic materials.

4. A perovskite solar cell assembly according to claim 3, characterized in that: The inorganic material includes one of metal oxide, metal sulfide, silicon dioxide or silicon nitride; and / or, The organic material includes epoxy resin or phenolic resin.

5. A perovskite solar cell module according to claim 1, characterized in that: The material of the adhesive layer (400) is selected from ethylene-vinyl acetate copolymer, polyurethane acrylate or ethylene-octene copolymer.

6. A perovskite solar cell module according to claim 1, characterized in that: The thickness of the first encapsulation layer (310) is 50-300 nm; and / or The width of the second encapsulation layer (320) is 50-300 nm.

7. A perovskite solar cell module according to claim 1, characterized in that: The battery chip (200) comprises: An electrode layer (210), the electrode layer (210) being arranged on the first substrate (100) at intervals; A charge transport layer (220), the charge transport layer (220) comprising at least one group of a first charge transport layer (221) and a second charge transport layer (222), the first charge transport layer (221) and the second charge transport layer (222) being located on a side of the electrode layer (210) away from the first substrate (100) and being arranged at intervals; The perovskite absorption layer (240) is located on a side of the charge transport layer (220) away from the electrode layer (210).

8. A perovskite solar cell assembly according to claim 7, characterized in that: The battery chip (200) further comprises a passivation layer (230), wherein the passivation layer (230) comprises a first passivation layer (231), a second passivation layer (232) and a third passivation layer (233); the first passivation layer (231) is located on a side of the charge transport layer (220) away from the electrode, the second passivation layer (232) is located between the first charge transport layer (221) and the second charge transport layer (222), and the first passivation layer (231) and the second passivation layer (232) are connected; The third passivation layer (233) is located between the perovskite absorption layer (240) and the first encapsulation layer (310).

9. A method for preparing a perovskite solar cell module, used for preparing a perovskite solar cell module according to any one of claims 1 to 8, characterized in that: The steps include: Providing a first substrate (100); Providing a battery chip (200), wherein the battery chip (200) is located on one side of the first substrate (100), and the battery chip (200) comprises a top surface (201) and a side surface (202) connected to the top surface (201); Providing a packaging layer (300), the packaging layer (300) comprising a first packaging layer (310) located on the top surface (201) and a second packaging layer (320) located on the side surface (202), the first packaging layer (310) being connected to the second packaging layer (320); Providing an adhesive layer (400), the adhesive layer (400) comprising a first adhesive layer (410), the first adhesive layer (410) being located on a side of the first encapsulation layer (310) facing away from the battery chip (200); A second substrate (500) is provided, and the second substrate (500) is located on a side of the first adhesive layer (410) facing away from the first encapsulation layer (310).

10. The method for preparing a perovskite solar cell module according to claim 9, characterized in that: The step of providing an encapsulation layer (300) comprises: Depositing an inorganic material on the top surface (201) to form a first encapsulation layer (310), and depositing an inorganic material on the side surface (202) to form the second encapsulation layer (320); or, An inorganic material is deposited on the top surface (201) and an organic material is coated on a side of the inorganic material facing away from the top surface (201) to form the first encapsulation layer (310), and an inorganic material is deposited on the side surface (202) and an organic material is coated on a side of the inorganic material facing away from the side surface (202) to form the second encapsulation layer (320).

11. The method for preparing a perovskite solar cell module according to claim 10, characterized in that: The method for depositing the inorganic material comprises plasma enhanced chemical vapor deposition or atomic layer deposition; and / or, The method of coating the organic material includes any one of a vacuum method and a solution method.

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