Preparation method of display panel, display panel and display device

Abstract

The invention provides a preparation method of a display panel, the display panel and a display device. The preparation method comprises the following steps: preparing a first metal layer, a second metal layer and a third metal layer in a hole region in sequence; a plurality of annular grooves which are sequentially connected in a sleeved mode are prepared in the adjacent side area, corresponding to the hole digging area, of the third metal layer, the grooves are etched to the bottom of the first metal layer so that a plurality of independent annular composite layer structures can be formed, and the bottoms of the annular composite layer structures are electrically connected with the conductive structure; and placing the display panel in an etching solution to form a primary battery structure so as to corrode the second metal of the annular composite layer and form a side-carved eave structure.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a method for preparing a display panel, a display panel and a display device. Background Art

[0002] The hole-punch screen technology is to dig out a camera channel (hole area) at the camera position of the screen for the front camera. This position is not used for display, so it is required to reduce the impact of the hole diameter on the screen display effect. The mainstream solution to achieve this technology is to form a special eaves structure by etching the metal or inorganic layer to effectively isolate the evaporation material, so that it cannot form a water and oxygen intrusion path, and prevent the occurrence of reliability corrosion. The existing technical solution uses an additional mask process to form the Ti / Al / Ti side engraved eaves structure in the hole area.

[0003] Since the existing technical solutions require an additional photomask process to form an eaves structure that effectively isolates the vapor-deposited material, there are problems of high production costs or failure of hole area packaging isolation. Summary of the invention

[0004] In view of this, the embodiments of the present invention are committed to providing a method for preparing a display panel, a display panel, a display panel and a display device, which can utilize the structural design film layer in other processes to complete the formation of the side-carved eaves structure, avoid designing a separate photomask to form the side-carved eaves structure, and save costs.

[0005] In one aspect, the present invention provides a method for manufacturing a display panel, wherein the display panel comprises a hole area and a display area, wherein the hole area and the display area are provided with a conductive structure, and the display area further comprises a sensor, wherein a conductive film layer of the sensor is electrically connected to the conductive structure, and the manufacturing method comprises:

[0006] Sequentially preparing a first metal layer, a second metal layer and a third metal layer in the hole region;

[0007] A plurality of annular grooves are sequentially formed on the third metal layer at positions corresponding to the hole regions, and the grooves are etched to the bottom of the first metal layer to form a plurality of independent annular composite layer structures, wherein the bottom of the annular composite layer structure is electrically connected to the conductive structure;

[0008] Placing the display panel in an etching solution to form a galvanic cell structure, so as to corrode the second metal of the annular composite layer to form a side-engraved eaves structure;

[0009] Among them, the conductive structure is the salt bridge of the galvanic cell structure, the annular composite layer is the negative electrode of the galvanic cell structure, and the conductive film layer is the positive electrode of the galvanic cell structure.

[0010] In one embodiment, the display panel further includes an interlayer dielectric, the interlayer dielectric is disposed between the conductive structure and the first metal layer, and before preparing the first metal layer, the second metal layer and the third metal layer, the display panel further includes:

[0011] Preparing a plurality of via holes exposing the conductive structure on the interlayer dielectric, wherein the positions of the plurality of via holes are opposite to the positions of the plurality of annular composite layer structures to be prepared;

[0012] Preferably, the interlayer dielectric is an inorganic layer;

[0013] Preferably, the interlayer dielectric is an insulating layer;

[0014] Preferably, the inorganic layer comprises silicon nitride or silicon oxide.

[0015] In one embodiment, the conductive structure is a portion that is not peeled off when other functional layers are prepared;

[0016] Preferably, the other functional layers include any one of the following: a capacitor plate layer, a scanning metal layer, and a driving switch layer.

[0017] In one embodiment, the first metal layer and the third metal layer do not react with the etching solution, and the surface metal of the second metal changes into ion state and enters the solution;

[0018] Preferably, the first metal layer and / or the third metal layer is Ti or Mo;

[0019] Preferably, the etching solution comprises an electrolyte solution containing chloride ions or an acidic etching solution;

[0020] Preferably, the etching solution is a sodium chloride solution.

[0021] In one embodiment, after forming the side carved eaves structure, the method further comprises:

[0022] Filling the groove with organic glue;

[0023] Preferably, before filling the organic glue in the groove, the method further comprises: washing with water to remove residual etching solution and precipitated silver;

[0024] Preferably, after filling the organic glue in the groove, the method further comprises: preparing an encapsulation layer;

[0025] Preferably, the organic glue comprises organic silica gel.

[0026] In one embodiment, the conductive structure is a single-layer structure or a multi-layer structure, wherein when the conductive structure is a multi-layer structure, the multi-layer structures are electrically connected by overlapping vias;

[0027] Preferably, the conductive structure is metal or conductive metal oxide.

[0028] In one embodiment, the method of preparing the annular groove on the third metal layer also includes:

[0029] A wire is prepared between the adjacent area of ​​the hole-digging area in the hole area and the area where the sensor is located, and two ends of the wire are respectively connected to the outermost annular composite layer structure and the conductive film layer;

[0030] Preferably, the wire is a linear structure formed by etching;

[0031] Preferably, the conductive wire is made of a first metal, or the conductive wire is made of a first metal and the second metal, or the conductive wire is made of a first metal, the second metal and the third metal.

[0032] Yet another aspect of the present invention provides a display panel, comprising a hole area and a display area, wherein the display area and the hole area are provided with a conductive structure, the display area comprises a sensor, the hole area comprises a composite ring structure, one end of the conductive structure is electrically connected to the conductive film layer of the sensor, and the other end is electrically connected to the composite ring structure.

[0033] In one embodiment, the display panel further includes:

[0034] An interlayer dielectric, disposed between the conductive structure and the composite annular structure;

[0035] Preferably, a via is provided on the interlayer dielectric to electrically connect the conductive structure and the composite annular structure;

[0036] Preferably, the interlayer dielectric is an insulating layer;

[0037] Preferably, the interlayer dielectric is an inorganic layer;

[0038] Preferably, the inorganic layer comprises silicon nitride or silicon oxide;

[0039] Preferably, the annular composite layer structure is a side-carved eaves structure;

[0040] Preferably, the annular composite layer structure comprises a first metal layer, a second metal layer and a third metal layer which are stacked;

[0041] Preferably, the first metal layer and / or the third metal layer is Ti or Mo;

[0042] Preferably, organic glue is filled between the side-carved eaves structures;

[0043] Preferably, the organic glue comprises organic silica gel;

[0044] Preferably, the conductive structure is the portion that is not peeled off when other functional layers are prepared;

[0045] Preferably, the other functional layers include any one of the following: a capacitor plate layer, a scanning metal layer, and a driving switch layer.

[0046] According to another aspect of the present invention, there is provided a display device, comprising the display panel according to the above embodiment.

[0047] According to the display panel preparation method, display panel, display panel and display device of the embodiments of the present invention, the isolation structure in the hole area is connected with the structure-designed film layer in other processes. In the etching solution, the isolation structure serves as the negative electrode and the structure-designed film layer in other processes serves as the positive electrode to form a galvanic cell structure. The metal side of the middle position of the isolation structure is corroded by the galvanic cell reaction mechanism, thereby forming a side-engraved eaves structure for preventing water and oxygen intrusion, thereby reducing the use of one layer of mask. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 The invention is a schematic diagram of a process for preparing a side-carved eave structure of a hole-punch area of ​​a hole-punch screen in the prior art.

[0049] Figure 2 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present invention.

[0050] Figure 3 1 is a top view of a display panel and an enlarged schematic diagram of a local structure according to an embodiment of the present invention.

[0051] Figure 4 is a cross-sectional view of a display panel according to an embodiment of the present invention.

[0052] Figure 5 It is a schematic diagram of the preparation method of an embodiment of the present invention.

[0053] Figure 6 It is a schematic diagram of a partial structure enlargement of a top view of another embodiment of the present invention.

[0054] Description of reference numerals:

[0055] 1- Display panel;

[0056] 2-interlayer dielectric;

[0057] 3- Conductive structure;

[0058] 4- Sensor;

[0059] 401-conductive film layer;

[0060] 5-Annular composite layer structure;

[0061] 501-first metal layer;

[0062] 502- second metal layer;

[0063] 503- third metal layer;

[0064] 6-Other functional layers. DETAILED DESCRIPTION

[0065] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the detailed description below, many specific details are proposed in order to provide a comprehensive understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention. In the drawings and the following description, at least part of the known structures and technologies are not shown in order to avoid unnecessary ambiguity of the present invention; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0066] In the description of the present invention, it should be noted that, unless otherwise specified, "plurality" means more than two; the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0067] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present invention. In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0068] Figure 1 The invention is a schematic diagram of a process for preparing a side-carved eave structure of a hole-punch area of ​​a hole-punch screen in the prior art.

[0069] In the prior art, in order to prevent water and oxygen from entering the display panel through the hole area and damaging the organic materials inside, it is necessary to prepare a multi-circle ring-shaped side-carved eaves structure around the hole area of ​​the hole-carved screen. Figure 1As shown, taking the Ti / Al / Ti side-engraved eaves structure as an example, an additional photolithography process is required to form the above eaves structure. Specifically, a photomask is added to the top metal layer with a trapezoidal cross-section, and the middle metal layer is etched sideways through an etching process to form the required Ti / Al / Ti side-engraved eaves structure.

[0070] In order to solve the problems existing in the prior art, optimize the production process and reduce production costs, the embodiments of the present invention provide a method for preparing a display panel, a display panel, a display panel and a display device, which can utilize the structural design film layer in other processes to complete the formation of the side-carved eaves structure, avoid designing a separate photomask for forming the side-carved eaves structure, and save costs.

[0071] In some related technologies, the display area of ​​the display panel is compatible with the sensor, and the corresponding display area (sensor area) needs to have a high optical transmittance; therefore, transparent film layers such as ITO / IZO are often used for routing. Based on this, the inventive concept of the present invention is that the Ti / Al / Ti package eaves structure around the camera hole can borrow the ITO / IZO and other mask designs to obtain the Ti / Al / Ti side-engraved eaves structure without adding a mask.

[0072] Figure 2 is a flow chart of a method for preparing a display panel according to an embodiment of the present invention; Figure 3 is a top view of a display panel and an enlarged schematic diagram of a local structure according to an embodiment of the present invention; Figure 4 is a cross-sectional view of a display panel according to an embodiment of the present invention.

[0073] In one aspect, the present invention provides a method for preparing a display panel, such as Figures 2 to 4 As shown, the display panel includes a hole area and a display area, the hole area and the display area are provided with a conductive structure 3, the display area also includes a sensor 4, the conductive film layer 401 of the sensor 4 is electrically connected to the conductive structure 3, and the preparation method of the display panel includes operations S101 to S103.

[0074] Operation S101 includes: sequentially preparing a first metal layer 501 , a second metal layer 502 , and a third metal layer 503 in the hole region.

[0075] Operation S102 includes: preparing a plurality of annular grooves which are sequentially connected at positions corresponding to the hole areas on the third metal layer 503, and etching the grooves to the bottom of the first metal layer 501 to form a plurality of independent annular composite layer structures 5, wherein the bottom of the annular composite layer structure 5 is electrically connected to the conductive structure 3.

[0076] Operation S103 includes placing the display panel in an etching solution to form a galvanic cell structure, so as to corrode the second metal of the annular composite layer to form a side-engraved eaves structure.

[0077] Among them, the conductive structure 3 is the salt bridge of the galvanic cell structure, the annular composite layer is the negative electrode of the galvanic cell structure, and the conductive film layer 401 is the positive electrode of the galvanic cell structure.

[0078] In this embodiment, the isolation structure in the hole-digging area is connected to the film layer designed in other processes. In the etching solution, the isolation structure serves as the negative electrode, and the film layer designed in other processes serves as the positive electrode to form a galvanic cell structure. The side of the metal layer in the middle of the isolation structure is corroded by the galvanic cell reaction mechanism, thereby forming a side-engraved eaves structure for preventing water and oxygen intrusion, thereby reducing the use of one layer of mask, improving production efficiency, and reducing production costs.

[0079] In one embodiment, the hole area of ​​the display panel includes a hole-digging area and a side area located around the hole-digging area, wherein the side-carved eaves structure is arranged in the side area.

[0080] In one embodiment, in operation S101 , the first metal layer 501 , the second metal layer 502 , and the third metal layer 503 are prepared by using physical vapor deposition (PVD), chemical vapor deposition (CVD), or electroplating techniques.

[0081] Optionally, the first metal layer 501 , the second metal layer 502 or the third metal layer 503 includes metals such as aluminum, copper, gold, platinum, titanium, etc.

[0082] Preferably, the second metal layer 502 is Al. In the formed galvanic cell structure, Al acts as a negative electrode to participate in the reaction, and the Al element on the side of the second metal layer 502 becomes free Al. 3+ After entering the etching solution, the first metal layer 501 and the third metal layer 503 do not participate in the reaction, thereby forming the required side-engraved eaves structure.

[0083] In one embodiment, the display panel also includes an interlayer dielectric 2, which is arranged between the conductive structure 3 and the first metal layer 501. Before preparing the first metal layer 501, the second metal layer 502 and the third metal layer 503, it also includes an operation of preparing vias on the interlayer dielectric 2 to expose the conductive structure 3. Preferably, the number of vias is multiple, and the positions of the multiple vias are one-to-one opposite to the positions of the multiple annular composite layer structures 5 to be prepared.

[0084] In this embodiment, before preparing the first metal layer 501, it is necessary to open a hole in the interlayer dielectric 2 and expose the conductive structure 3 below (inside) the interlayer dielectric 2, so as to achieve electrical connection with the conductive structure 3 when depositing the first metal layer 501. Further, after completing the preparation of multiple independent annular composite layer structures 5, each independent annular composite layer structure 5 is electrically connected to the conductive structure 3 below the interlayer dielectric 2, and then electrically connected to the positive electrode material (the conductive film layer 401 of the sensor 4), so as to form a galvanic cell structure in the etching solution.

[0085] Preferably, the interlayer dielectric 2 is an inorganic layer, which is used to isolate the upper and lower functional layers to prevent interaction or cross contamination between different layers. For example, it can prevent the organic material in the light-emitting layer from penetrating into the TFT layer below, thereby protecting the stability and performance of the TFT layer. Alternatively, the interlayer dielectric 2 is a flat layer, which is used to provide a flat and smooth surface to fill the unevenness generated by the previous process, so as to facilitate the deposition and patterning of subsequent film layers and ensure the uniformity and consistency of subsequent layers. Alternatively, the interlayer dielectric 2 is an insulating layer to achieve electrical isolation between adjacent functions.

[0086] More preferably, the inorganic layer includes silicon nitride or silicon oxide.

[0087] In one embodiment, the other end of the conductive structure 3 can be connected to the under-screen camera, and the wiring of the under-screen camera can be used as the positive electrode of the original battery structure.

[0088] In one embodiment, the conductive structure 3 is a portion that is not peeled off when other functional layers are prepared.

[0089] Preferably, the other functional layers include any one of the following: a capacitor plate layer, a scanning metal layer, and a driving switch layer.

[0090] In this embodiment, during the preparation of other functional layers, after development and patterning, the structures of the hole-digging area and the adjacent side areas are retained without etching and stripping, and then the interlayer dielectric 2 is prepared on the retained structure, and the retained structure is used as a salt bridge (conductor) connecting the positive and negative electrodes of the original battery structure. It is compatible with existing production lines and production processes, does not require major changes to the original production process, and has high production efficiency and low cost.

[0091] In one embodiment, the first metal layer 501 and the third metal layer 503 do not react with the etching solution, and the surface metal of the second metal becomes ionic and enters the solution; preferably, the first metal layer 501 and / or the third metal layer 503 is Ti or Mo; preferably, the second metal layer 502 is Al.

[0092] Preferably, the etching solution includes an electrolyte solution containing chloride ions or an acidic etching solution (eg, sulfuric acid, hydrochloric acid, nitric acid, phosphoric acid, etc.); optionally, the etching solution is a sodium chloride solution.

[0093] In this embodiment, after the preparation of multiple independent annular composite layer structures 5 is completed, the entire structure is placed in an etching solution, and the metal element on the side of the second metal layer 502 releases electrons to form an ion state and enters the solution. After a preset reaction time, multiple annular side-engraved eaves structures are formed.

[0094] In one embodiment, after forming the side-carved eaves structure, the method further comprises filling the groove with organic glue.

[0095] In this embodiment, two adjacent side-carved eaves structures are filled with organic glue, which, together with the encapsulation layer, can effectively isolate the invasion of water and oxygen and prevent water and oxygen from damaging the organic layer.

[0096] Preferably, before the organic glue is filled in the groove, the method further includes: washing with water to remove the residual etching solution and the precipitated metal element.

[0097] In this embodiment, the etching solution remaining in the groove and the nearby structure is cleaned by water washing, and the metal element precipitated on the positive electrode of the sensor 4 is washed away to prevent the etching solution and the metal element from affecting the subsequent process. Furthermore, after one or more water washings, a drying operation is also included to remove the water remaining on the surface of the structure.

[0098] Preferably, the organic glue includes organic silica gel, polyurethane (PU) glue, polyimide (PI) glue, epoxy heat-curing glue, UV curing glue, OCA glue and modified acrylic glue.

[0099] Preferably, after the organic glue is filled in the groove, the method further includes: preparing a packaging layer, which specifically includes coating the packaging glue, curing the packaging layer, etc., which will not be described in detail herein.

[0100] In one embodiment, the conductive structure 3 is a single-layer structure or a multi-layer structure. When the conductive structure 3 is a multi-layer structure, electrical conduction is achieved between the multi-layer structures by vias or overlaps.

[0101] In this embodiment, when the conductive structure 3 reserved in the uppermost functional layer of the interlayer dielectric 2 can connect all independent annular composite layer structures 5 and the conductive film layer 401 of the sensor 4, only one functional layer of the street structure is required.

[0102] When the conductive structure 3 reserved in the uppermost functional layer in the interlayer dielectric 2 cannot connect all the independent annular composite layer structures 5 and the conductive film layer 401 of the sensor 4, it is necessary to overlap (or connect vias) the retained structures of the multiple functional layers during the preparation of other functional layers to achieve connection, and to electrically connect all the annular composite layer structures 5 and the conductive film layer 401 of the sensor 4 through the reserved structures of the multiple functional layers.

[0103] Preferably, the conductive structure 3 is a metal or a conductive metal oxide, such as Al, Ag, Cu, ITO (indium tin oxide), tin oxide, cadmium oxide, etc.

[0104] In one embodiment, while preparing an annular groove on the third metal layer 503 , it also includes: preparing a wire between the adjacent area and the area where the sensor 4 is located, and the two ends of the wire are respectively connected to the annular composite layer structure 5 (at least connecting one or more outermost circles) and the conductive film layer 401.

[0105] In this embodiment, when the sensor 4 is located far away from the hole area or the conductive structure 3 reserved in other functional layers cannot be directly connected to the conductive film layer 401 of the sensor 4, it is necessary to prepare a wire to connect the conductive structure 3 and the conductive film layer 401.

[0106] Preferably, the wire is formed into a linear structure or a strip structure by etching. For example, while etching the annular groove, the metal layer in the area between the adjacent area and the sensor 4 is etched to form a linear structure or a strip structure.

[0107] Preferably, the conductive wire is made of a first metal, or the conductive wire is made of a first metal and a second metal, or the conductive wire is made of a first metal, a second metal and a third metal. The etching time and etching depth can be adjusted according to the requirements in specific situations.

[0108] Figure 3 is a top view of a display panel and an enlarged schematic diagram of a local structure according to an embodiment of the present invention, Figure 4 is a cross-sectional view of a display panel according to an embodiment of the present invention, Figure 5 is a schematic diagram of a preparation method according to an embodiment of the present invention, Figure 6 It is a schematic diagram of a partial structure enlargement of a top view of another embodiment of the present invention.

[0109] Combine the following Figures 3 to 6 The technical solution of the present invention is further explained with a specific embodiment. It should be understood that this specific implementation is only for those skilled in the art to better understand the present invention, and should not be regarded as an inappropriate limitation on the protection scope of the present invention.

[0110] Embodiment 1:

[0111] like Figure 3 As shown, the display panel 1 is divided into a display area AA and a hole area (non-display area), wherein the display area AA is normally displayed, and the hole area is dug out with a hole channel to facilitate the placement of the front camera, and this area is not used for display. A sensor 4 (for example, an optical sensor, an infrared sensor, a fingerprint sensor, a distance sensor, etc.) is arranged on the side area of ​​the hole area. Figure 3 The middle right side is an enlarged schematic diagram of the local structure of the hole excavation area, the adjacent side area, and the area where the sensor 4 is located.

[0112] A Ti / Al / Ti side-engraved eaves structure is prepared on the periphery of the hole-digging area to prevent water and oxygen intrusion at the cutting edge of the hole-digging area, thereby preventing damage to the organic layer in the screen.

[0113] like Figure 4 and Figure 6 As shown, the bottom layer is other functional layers, such as cathode layer, other interlayer dielectric 2, electron injection layer, electron transport layer, light emitting layer, etc.; above other functional layers is interlayer dielectric 2 (ILD). Optionally, the number of other functional layers is multiple. Figure 4 It is omitted in the figure, and only one layer is drawn for representation, but it is not limited to only one layer. A hole-digging area is provided on the interlayer dielectric 2, and the two sides of the hole-digging area (the two sides in the cross-sectional view, but actually the surrounding sides of the hole-digging area) are adjacent areas, and the two ends of the adjacent areas are adjacent to the display area and the sensor 4 respectively. In the display area, a flat layer PLN2 and a flat layer PLN3 are provided on the interlayer dielectric 2 to provide a flat and smooth surface.

[0114] A Ti metal layer, an Al metal layer, and a Ti metal layer are sequentially deposited in the adjacent area, and the three-layer composite metal layer is developed and patterned by a photolithography process to obtain a plurality of annular composite layer structures 5 (Ti / Al / Ti structures) surrounding the hole-digging area, wherein the plurality of Ti / Al / Ti structures (as the negative electrode of the primary battery) are electrically connected through the conductive structure 3 below, and the conductive structure 3 is connected to the conductive film layer 401 of the sensor 4 (as the positive electrode of the primary battery, ITO / IZO).

[0115] Figure 5 It is a schematic diagram of the preparation method of an embodiment of the present invention.

[0116] like Figure 4 and Figure 5As shown, the entire structure is immersed in an etching solution. The upper and lower Ti metal layers of the Ti / Al / Ti structure do not react with the etching solution, and both sides of the Al layer in the middle layer are directly in contact with the etching solution. The Al metal on the surface layer of the negative electrode of the primary battery loses electrons and becomes free Al ions that enter the etching solution. As the positive electrode of the primary battery, ITO, the Ag ions in the etching solution obtain electrons and precipitate on the ITO surface. After a period of reaction, the side of the Al layer of the Ti / Al / Ti structure is gradually etched inward, thereby forming the required Ti / Al / Ti side-engraved eaves structure.

[0117] The preparation method of the display panel provided by the present invention isolates the Ti / Al / Ti structure through a hole area and connects it with a newly added film layer ITO / IZO, etc. In an acidic / alkaline solution, the isolated metal Ti / Al / Ti is used as a negative electrode and ITO / IZO is used as a positive electrode to form a primary battery structure; the primary battery reaction mechanism is utilized to achieve the purpose of accelerating aluminum corrosion, thereby forming a Ti / Al / Ti side-carved eaves structure, reducing the use of a layer of Mask, and having the effect of reducing costs and increasing efficiency compared to the prior art.

[0118] Another aspect of the present invention provides a display panel, which is prepared by the preparation method of the above embodiment.

[0119] In one embodiment, the display panel includes a side-carved eaves structure provided in the aforementioned embodiment and arranged around the hole-digging area of ​​the display panel.

[0120] In one embodiment, the display panel further includes an interlayer dielectric, and the interlayer dielectric is disposed between the conductive structure and the composite annular structure.

[0121] In one embodiment, a via is provided on the interlayer dielectric to electrically connect the conductive structure and the composite ring structure. Preferably, the interlayer dielectric is an insulating layer or an inorganic layer. Further preferably, the inorganic layer includes silicon nitride or silicon oxide.

[0122] In one embodiment, the annular composite layer structure is a side-engraved eaves structure. Preferably, the annular composite layer structure comprises a first metal layer, a second metal layer and a third metal layer stacked in layers. Further preferably, the first metal layer and / or the third metal layer is Ti or Mo.

[0123] In one embodiment, organic glue is filled between the side-carved eaves structures. Preferably, the organic glue includes organic silica gel.

[0124] In one embodiment, the conductive structure is a portion that is not peeled off when other functional layers are prepared. Preferably, the other functional layers include any of the following: a capacitor plate layer, a scanning metal layer, and a driving switch layer.

[0125] In one embodiment, the display panel may be a flexible display panel or a rigid display panel. The light extraction mode of the display panel may be a bottom light extraction mode or a top light extraction mode.

[0126] In one embodiment, the display panel can be applied to any product or component with display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, an e-book reader, a player, a laptop computer, a car computer, a desktop computer or a set-top box.

[0127] According to another aspect of the present invention, there is provided a display device, comprising the display panel 1 according to the above embodiment.

[0128] It should be noted that the display device can be various electronic display products, specifically including but not limited to at least one of a mobile phone, a tablet computer, an e-book reader, a player, a digital camera, a laptop computer, a car computer, a desktop computer, a set-top box, a smart TV, and a wearable device.

[0129] In addition, according to actual needs, the display device may also include other structures such as a touch panel.

[0130] Since the display device of the embodiment of the present application includes the above Figures 3 to 6 All technical solutions of the illustrated embodiment can at least achieve all the above-mentioned technical effects, and will not be repeated here.

[0131] It should be noted that, for the sake of clarity, not all structures of the above-mentioned display panel and display device are described. To achieve the necessary functions of the display panel or display device, those skilled in the art may set other structures according to specific application scenarios.

[0132] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for preparing a display panel, characterized in that: The display panel includes a hole area and a display area, the hole area and the display area are provided with a conductive structure, the display area also includes a sensor, the conductive film layer of the sensor is electrically connected to the conductive structure, and the preparation method includes: Sequentially preparing a first metal layer, a second metal layer and a third metal layer in the hole region; A plurality of annular grooves are sequentially formed on the third metal layer at positions corresponding to the hole regions, and the grooves are etched to the bottom of the first metal layer to form a plurality of independent annular composite layer structures, wherein the bottom of the annular composite layer structure is electrically connected to the conductive structure; Placing the display panel in an etching solution to form a galvanic cell structure, so as to corrode the second metal of the annular composite layer to form a side-engraved eaves structure; Among them, the conductive structure is the salt bridge of the galvanic cell structure, the annular composite layer is the negative electrode of the galvanic cell structure, and the conductive film layer is the positive electrode of the galvanic cell structure.

2. The method for preparing a display panel according to claim 1, characterized in that: The display panel further includes an interlayer dielectric, which is disposed between the conductive structure and the first metal layer. Before preparing the first metal layer, the second metal layer, and the third metal layer, the display panel further includes: Preparing a plurality of via holes exposing the conductive structure on the interlayer dielectric, wherein the positions of the plurality of via holes are opposite to the positions of the plurality of annular composite layer structures to be prepared; Preferably, the interlayer dielectric is an insulating layer; Preferably, the interlayer dielectric is an inorganic layer; Preferably, the inorganic layer comprises silicon nitride or silicon oxide.

3. The method for preparing a display panel according to claim 1, characterized in that: The conductive structure is the portion that is not peeled off when other functional layers are prepared; Preferably, the other functional layers include any one of the following: a capacitor plate layer, a scanning metal layer, and a driving switch layer.

4. The method for preparing a display panel according to claim 1, characterized in that: The first metal layer and the third metal layer do not react with the etching solution, and the surface metal of the second metal changes into ion state and enters the solution; Preferably, the first metal layer and / or the third metal layer is Ti or Mo; Preferably, the etching solution comprises an electrolyte solution containing chloride ions or an acidic etching solution; Preferably, the etching solution is a sodium chloride solution.

5. The method for preparing a display panel according to claim 1, characterized in that: After forming the side carved eaves structure, it also includes: Filling the groove with organic glue; Preferably, before filling the organic glue in the groove, the method further comprises: washing with water to remove residual etching solution and precipitated silver; Preferably, after filling the organic glue in the groove, the method further comprises: preparing an encapsulation layer; Preferably, the organic glue comprises organic silica gel.

6. The method for preparing a display panel according to claim 1, characterized in that: The conductive structure is a single-layer structure or a multi-layer structure, wherein when the conductive structure is a multi-layer structure, the multi-layer structures are electrically connected by overlapping vias; Preferably, the conductive structure is metal or conductive metal oxide.

7. The method for preparing a display panel according to claim 1, characterized in that: The method further comprises: preparing the annular groove on the third metal layer; A wire is prepared between the adjacent area of ​​the hole-digging area in the hole area and the area where the sensor is located, and two ends of the wire are respectively connected to the outermost annular composite layer structure and the conductive film layer; Preferably, the wire is a linear structure formed by etching; Preferably, the conductive wire is made of a first metal, or the conductive wire is made of a first metal and the second metal, or the conductive wire is made of a first metal, the second metal and the third metal.

8. A display panel, characterized in that: The display panel includes a hole area and a display area, the display area and the hole area are provided with a conductive structure, the display area includes a sensor, the hole area includes a composite ring structure, one end of the conductive structure is electrically connected to the conductive film layer of the sensor, and the other end is electrically connected to the composite ring structure.

9. The display panel according to claim 8, characterized in that: The display panel further includes: An interlayer dielectric, disposed between the conductive structure and the composite annular structure; Preferably, a via is provided on the interlayer dielectric to electrically connect the conductive structure and the composite annular structure; Preferably, the interlayer dielectric is an insulating layer; Preferably, the interlayer dielectric is an inorganic layer; Preferably, the inorganic layer comprises silicon nitride or silicon oxide; Preferably, the annular composite layer structure is a side-carved eaves structure; Preferably, the annular composite layer structure comprises a first metal layer, a second metal layer and a third metal layer which are stacked; Preferably, the first metal layer and / or the third metal layer is Ti or Mo; Preferably, organic glue is filled between the side-carved eaves structures; Preferably, the organic glue comprises organic silica gel; Preferably, the conductive structure is the portion that is not peeled off when other functional layers are prepared; Preferably, the other functional layers include any one of the following: a capacitor plate layer, a scanning metal layer, and a driving switch layer.

10. A display device, characterized in that: Comprising the display panel as claimed in claim 8 or 9.

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